CN1920577A - Modular high frequency detection card - Google Patents
Modular high frequency detection card Download PDFInfo
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- CN1920577A CN1920577A CN 200510093070 CN200510093070A CN1920577A CN 1920577 A CN1920577 A CN 1920577A CN 200510093070 CN200510093070 CN 200510093070 CN 200510093070 A CN200510093070 A CN 200510093070A CN 1920577 A CN1920577 A CN 1920577A
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- 238000001514 detection method Methods 0.000 title claims description 40
- 230000004308 accommodation Effects 0.000 claims description 16
- 238000012360 testing method Methods 0.000 claims description 12
- 229920001971 elastomer Polymers 0.000 claims description 8
- 239000000806 elastomer Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 abstract description 3
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- 238000010276 construction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
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- 238000004519 manufacturing process Methods 0.000 description 2
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- 230000008054 signal transmission Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
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- 239000002131 composite material Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
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- Measuring Leads Or Probes (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a modularized high-frequency detecting card, which comprises: one detecting panel, one circuit carrier plate, and one interface plate between them, wherein said detecting panel has dual contain holes at the back, while dual decouple elements are embedded into said holes to be bypass connected to the power/ground circuit of said detecting panel; the interface panel has dual connectors at the covering surface; the covering surface covers the back of detecting panel; part of said connectors are connected to the decouple element, to connect the ground layer of circuit carrier plate, to mount the decouple elements inside the card at low modularized cost, to filter the foreign information of internal wire of card; and the detecting panel can avoid internal capacitor, without increasing the cost.
Description
Technical field
The present invention relates to a kind of detecting card of integrated circuit testing equipment, particularly relate to a kind of modular high frequency detection card.
Background technology
Integrated circuit is towards high frequencyization and densification development, existing known integrated circuit testing equipment is to be equiped with a detecting card (probe card), existing knownly in an exploration operation, can only test an integrated circuit (IC) products, as the wafer in the wafer, wafer package part on winding or the substrate, in order to promote test speed, detecting card will be designed intensive complicated circuit more, in an exploration operation, can visit and touch a plurality of integrated circuit (IC) products, at test process, show responsive for Electromagnetic Interference day, can't learn the quality of integrated circuit (IC) products really, cause testing misalignment and testing efficiency is low.
United States Patent (USP) the 5th, 491, disclose for No. 426 a kind of detecting card composite construction is arranged, a plurality of cantalever type probes are fixedly arranged on the lower surface of a detecting card, one decoupling zero device (decoupling apparatus) is installed in the upper surface of a detecting card and is positioned in the hole of a support plate (load board), to eliminate noise by Electromagnetic Interference, but it can only filter by testing apparatus to connecting the noise that cable produces between the detecting card, the noise that produces because of the circuit of detecting card own can't be filtered by this decoupling zero device, and effect is limited and be only applicable to the detecting card of old type cantalever type probe.
No. the 586627th, original application people's TaiWan, China patent announcement " can eliminate the detecting head of noise ", its announcement has a kind of detecting head (probe head) that is incorporated into detecting card, the inner ground connection conductive layer that forms of this detecting head, be the dielectric layer that has appropriate intervals between the connection gasket below this ground connection conductive layer and a plurality of spy contravention, to constitute a built-in shunt capacitance (internal bypass capacitor), can filter noise near those modes of visiting contravention more, with as a kind of in-building type decoupling elements (decoupling component), it is right because existing known detecting head (or claiming spy to touch panel) is to be a kind of highdensity multilayer ceramic circuit board, need plant and connect various spy contravention, fine ratio of product is low and unit price is quite high, if need make the dielectric layer of a built-in shunt capacitance in this detecting head inside, because of its material and processing procedure all the circuit processing procedure of unusual ceramic substrate will be not easy to make and be shaped, and then increase the detecting head cost.
This shows that above-mentioned existing detecting card obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem that detecting card exists, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of modular high frequency detection card of new structure, just become the current industry utmost point to need improved target.
Because the defective that above-mentioned existing detecting card exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of modular high frequency detection card of new structure, can improve general existing detecting card, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, create the present invention who has practical value finally.
Summary of the invention
The objective of the invention is to, overcome the defective that existing detecting card exists, and a kind of modular high frequency detection card of new structure, technical matters to be solved are provided is to make it comprise that mainly one visits and touches panel, a circuit support plate and one and touch interface panel between panel and this circuit support plate in this spy.This spy is touched panel and is had a plurality of accommodation apertures at its back side, a plurality of decoupling elements (decouplingcomponent) are embedded in those accommodation apertures and bypass is connected to power supply/ground path that panel is touched in this spy, this interface panel has a plurality of guiding access in this cover surface, this cover surface covers the back side that panel is touched in this spy, and those guiding access of part are connected in those decoupling elements, to connect to the ground plane of this circuit support plate, with the condition that reaches at low module cost decoupling elements is formed in detecting card inside, noise in order to the transmission of filter probe card internal wiring, and panel is touched in this spy does not need built-in electric capacity, can not increase to visit and touch the required cost of panel (detecting head), thereby be suitable for practicality more.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to a kind of modular high frequency detection card that the present invention proposes, it comprises: panel is touched in a spy, and it has a front, a back side and a plurality of accommodation aperture at this back side; A plurality of spy contraventions, it is located at the front that panel is touched in this spy; A plurality of decoupling elements (decoupling component), those that are embedded in those accommodation apertures and are electrically connected to part are visited contraventions; One circuit support plate is in order to be engaged to the measuring head of a testing apparatus; An and interface panel, being located at this spy touches between panel and this circuit support plate, this interface panel has a cover surface and a plurality of first guiding access in this cover surface, and this cover surface covers the back side that panel is touched in this spy, and those first guiding access of part are to be connected in those decoupling elements.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid modular high frequency detection card, wherein said circuit support plate has a ground plane, is electrically connected to those decoupling elements by this interface panel.
Aforesaid modular high frequency detection card, wherein said interface panel have a plurality of second guiding access, and it is formed at this interface panel another surface corresponding to this cover surface, for the ground plane that connects to this circuit board.
Aforesaid modular high frequency detection card, wherein said interface panel maybe this spy to touch panel be to be a ceramic circuit board.
Aforesaid modular high frequency detection card, one of them that panel is selected from glass substrate, wafer and printed circuit board (PCB) touched in wherein said interface panel and this spy.
Aforesaid modular high frequency detection card, wherein those first guiding access are to be tie lines projection (studbump).
Aforesaid modular high frequency detection card, wherein those first guiding access comprise the dielectricity elastomer block, and those first guiding access comprise at least one metal level around those elastomer block in addition.
Aforesaid modular high frequency detection card, it comprises one in addition in conjunction with external member, for touching panel and this interface panel in conjunction with this spy in this circuit support plate.
Aforesaid modular high frequency detection card, wherein said spy is touched panel and is comprised a plurality of power supplys at this back side/ground connection connection pad, a plurality of by-pass line and a plurality of power supply/ground path, those power supply/ground paths connect those power supplys/ground connection connection pad and visit contravention with corresponding power supply/ground connection, and those by-pass line are that branch is connected to those corresponding power supply/ground paths.
Aforesaid modular high frequency detection card, wherein those by-pass line comprise via.
The present invention compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, modular high frequency detection card of the present invention has following advantage at least:
The present invention be utilize a plurality of decoupling zero assemblies be embedded in one visit touch panel its a plurality of in the accommodation aperture at its back side and bypass be connected to power supply/ground path that panel is touched in this spy, and an interface board covers the back side that panel is touched in this spy, and the guiding access of this interface board part is connected in those decoupling zero assemblies, can connect to the ground plane of a circuit support plate, the condition that reaches at low module cost is formed in the decoupling zero assembly detecting card inside and touches a plurality of spy contraventions in the front of panel near the position in this spy more, the effectively noise of filter probe card internal wiring transmission, and this spy touches panel does not need built-in electric capacity.
The present invention utilizes a ground plane that a circuit support plate has to be electrically connected to visit one by an interface board and touches a plurality of decoupling zero assemblies of its inside of panel, internal noise that can the cancellation module high frequency detection card.
In sum, the modular high frequency detection card of special construction of the present invention, it has above-mentioned many advantages and practical value, and in like product, do not see have similar structural design to publish or use and really genus innovation, no matter it all has bigger improvement on product structure or function, have large improvement technically, and produced handy and practical effect, and more existing detecting card has the multinomial effect of enhancement, thereby being suitable for practicality more, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of instructions, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is first specific embodiment of the present invention, a kind of element exploded cross-sectional synoptic diagram of modular high frequency detection card.
Fig. 2 is second specific embodiment of the present invention, a kind of element exploded cross-sectional synoptic diagram of modular high frequency detection card.
Fig. 3 is second specific embodiment of the present invention, the interface panel schematic cross-section of this modular high frequency detection card.
100: modular high frequency detection card 110: visit and touch panel
111: positive 112: the back side
113: accommodation aperture 114: power supply/ground path
115: by-pass line 116: signal transmits circuit
117: power supply/ground connection connection pad 118: signal connection pad
119: breach 120: visit contravention
130: 131: the first electrodes of decoupling elements
Electrode 140 in 132: the second: the circuit support plate
141: ground plane 142: interior connection gasket
143: circuit 144: outer connection gasket
150: interface panel 151: cover surface
152: 153: the first guiding access of composition surface
Guiding access 160 in 154: the second: in conjunction with external member
161: perforate 162: adjust bolt
170: position guide pin 200: modular high frequency detection card
210: visit and touch panel 211: the front
212: the back side 213: accommodation aperture
214: power supply/ground path 215: by-pass line
216: signal transmits circuit 217: power supply/ground connection connection pad
218: signal connection pad 220: visit contravention
230: 231: the first electrodes of decoupling elements
Electrode 240 in 232: the second: the circuit support plate
241: ground plane 242: interior connection gasket
243: circuit 244: outer connection gasket
250: interface panel 251: cover surface
252: 253: the first guiding access of composition surface
253a: elastomer block 253b: metal level
254: the second guiding access 254a: elastomer block
254b: metal level 255: via
260: in conjunction with external member 261: perforate
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its embodiment of modular high frequency detection card, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
See also shown in Figure 1, it is first specific embodiment of the present invention, this a kind of modular high frequency detection card 100 comprises that mainly one visits and to touch panel 110, a plurality of decoupling elements 130 (decouplingcomponent), an one circuit support plate 140 and an interface panel 150, it is first electrical transferring substrates of touching to-be-measured integrated circuit as spy that panel 110 is touched in this spy, in the present embodiment, it is the multilayer ceramic circuit boards that have dense wire for a kind of that panel 110 is touched in this spy, in other embodiments, this spy is touched panel 110 and be can be selected from glass substrate, one of them of wafer and printed circuit board (PCB), this spy is touched panel 110 and is had a front 111, one back side 112 and a plurality of accommodation aperture 113 at this back side 112, preferably, those accommodation apertures 113 are to be arranged, this spy is touched panel 110 and is comprised a plurality of power supply/ground paths 114, a plurality of by-pass line 115 and plurality of signals are transmitted circuit 116, the back side 112 of touching panel 110 in this spy is formed with a plurality of power supplys/ground connection connection pad 117 and plurality of signals connection pad 118 in addition, those power supply/ground paths 114 connect those power supplys/ground connection connection pad 117 and visit contravention 120 with corresponding power supply/ground connection, those by-pass line were connected to those corresponding power supply/ground paths 114 in 115 minutes, and those signals transmit circuit 116 and connect those signal connection pads 118 and corresponding signal spy contravention 120.Preferably, the length of those by-pass line 115 is less than the length of those power supply/ground paths 114 of correspondence, so that those power supplys of those decoupling elements 130 more approaching correspondences/ground connection is visited contravention 120.In the present embodiment, those by-pass line 115 comprise via, so that those decoupling elements 130 are vertically to visiting contravention 120 in alignment with those power supplys/ground connection.
A plurality of spy contraventions 120 are located at the front 111 that panel 110 is touched in this spy, in the present embodiment, those visit contravention 120 is to be elastic probe, electrode part for the contact measured integrated circuit, the for example connection gasket of the weld pad of wafer, projection or substrate or soldered ball, it is that power supply/ground connection is visited contravention and signal is visited contravention that those spy contraventions 120 can be distinguished, and touches the power supply/ground path 114 and signal transmission circuit 116 of panel 110 to be electrically connected to this spy respectively.Those decoupling elements 130 are embedded in those accommodation apertures 113, those decoupling elements 130 can be selected from shunt capacitance (bypass capacitor), one of them of decoupling capacitance (decouplingcapacitor) and ultrabroad band wave filter, those decoupling elements 130 are to can be any materials for independent component and composition, be built in this spy in not needing and touch panel 110, each decoupling elements 130 has one first electrode 131 and one second electrode 132, when those decoupling elements 130 are embedded in those accommodation apertures 113, its first electrode 131 is that those that be electrically connected to part via those by-pass line 115 or/and those power supply/ground paths 114 are visited contraventions 120 (being that power supply/ground connection is visited contravention), and its second electrode 132 exposes to the back side 112 that panel 110 is touched in this spy.
The measuring head (figure do not draw) of this circuit support plate 140 in order to be engaged to a testing apparatus, usually this circuit support plate 140 is to be a kind of discoid multilayer board, touch panel 110 and this interface panel 150 to carry this spy, this circuit support plate 140 has at least one ground plane 141, a plurality of interior connection gasket 142 at its lower surface, a plurality of outer connection gasket 144 on surface thereon, and with circuit 143 interior connection gasket 142 partly is connected to this ground plane 141.This interface panel 150 is located at this spy and is touched between panel 110 and this circuit support plate 140, in the present embodiment, this interface panel 150 is the ceramic circuit boards that have the conducting circuit for a kind of, in other embodiments, this interface panel 150 can be selected from glass substrate, one of them of wafer and printed circuit board (PCB), this interface panel 150 has the composition surface 152 of a cover surface 151 and a correspondence, the cover surface 151 of this interface panel 150 is aimed at and is touched panel 110 towards this spy, preferably, this interface panel 150 touches panel 110 with this spy and is same size, the precalculated position that the composition surface 152 of this interface panel 150 is aimed at towards this circuit support plate 140, for example a plurality of first guiding access 153 of tie lines projection (studbump) are the cover surface 151 that is formed at this interface panel 150, for example a plurality of second guiding access 154 of tie lines projection (stud bump) are formed at the composition surface 152 of this interface panel 150, after the modularity combination, the cover surface 151 of this interface panel 150 covers the back side 112 that panel 110 is touched in this spy, some of those first guiding access 153 are connected in second electrode 132 of those decoupling elements 130, other those first guiding access 153 is connected in this spy and touches those power supplys of panel 110/ground connection connection pad 117 and plurality of signals connection pad 118, those second guiding access 154 are connected in the interior connection gasket 142 of this circuit support plate 140, wherein part those first guiding access 154 of being electrically connected to those decoupling elements 130 are electrically connected to this ground plane 141 via the interior connection gasket 142 of this circuit support plate 140 with circuit 143, and other those second guiding access 154 that are electrically connected to those power supply/ground mats 117 and signal connection pad 118 pass this ground plane 141 and be electrically connected to the outer connection gasket 144 of this circuit support plate 140.
This modular high frequency detection card 100 comprises one in addition in conjunction with external member 160 and a plurality of position guide pin 170, this has a perforate 161 in conjunction with external member 160, its aligning also appears the front 111 that panel 110 is touched in this spy, this touches panel 110 and this interface panel 150 in this circuit support plate 140 in conjunction with external member 160 in conjunction with this spy, those these spies of position guide pin 170 break-through are touched panel 110 in the hole of corner and this interface panel 150 hole at corner, preferably, front 111 peripheries that panel 110 is touched in this spy are formed with a breach 119, in order to this chimeric contraposition in conjunction with external member 160, this can be provided with a plurality of adjustment bolts 162 in conjunction with external member 160, adjusts this spy with trace and touches the X-Y of panel 110 to the position.
Therefore; those decoupling elements 130 can be embedded in this spy by above-mentioned modular high frequency detection card 100 touches panel 110 and is hidden protection by this interface panel 150; and can be electrically connected to the ground plane 141 of this circuit support plate 140 by this interface panel 150; to eliminate the noise that these detecting card 100 internal wirings are produced; and do not need built-in electric capacity to touch panel 110 in spy, the manufacturing cost of touching panel with general spy reaches the modular effect of high-frequency.
See also shown in Figure 2, it is second specific embodiment of the present invention, this a kind of modular high frequency detection card 200 comprises that mainly one visits and to touch panel 210, a plurality of decoupling elements 230, an one circuit support plate 240 and an interface panel 250, this spy is touched panel 210 and is had a front 211, one back side 212 and a plurality of accommodation aperture 213 at this back side 212, this spy is touched panel 210 and is comprised a plurality of power supply/ground paths 214, a plurality of by-pass line 215 and plurality of signals are transmitted circuit 216, the back side 212 of touching panel 210 in this spy is formed with a plurality of power supplys/ground connection connection pad 217 and plurality of signals connection pad 218 in addition, those power supply/ground paths 214 connect those power supplys/ground connection connection pad 217 and visit contravention 220 with corresponding power supply/ground connection, those by-pass line were connected to those corresponding power supply/ground paths 214 in 215 minutes, and those signals transmit circuit 216 and connect those signal connection pads 218 and corresponding signal spy contravention 220.Preferably, the length of those by-pass line 215 is less than the length of those power supply/ground paths 214 of correspondence, so that those power supplys of those decoupling elements 230 more approaching correspondences/ground connection is visited contravention 220.
A plurality of spy contraventions 220 are located at the front 211 that panel 210 is touched in this spy, in the present embodiment, those visit contravention 220 is to be conductive projection, but those are visited contravention 220 and also can be mems probe, those visit contravention 220 is can distinguish to power supply/ground connection to visit contravention and signal spy contravention, touches the power supply/ground path 214 and signal transmission circuit 216 of panel 210 to be electrically connected to this spy respectively.Those decoupling elements 230 are embedded in those accommodation apertures 213, those decoupling elements 230 are to be independent component, be built in this spy in not needing and touch panel 210, each decoupling elements 230 has one first electrode 231 and one second electrode 232, when those decoupling elements 230 are embedded in those accommodation apertures 213, its first electrode 231 be electrically connected to part via those by-pass line 215 or with those power supply/ground paths 214 those visit contraventions 220 (being that power supply/ground connection is visited contravention), its second electrode 232 exposes to the back side 212 that panel 210 is touched in this spy.
See also shown in Figure 2, the measuring head (figure do not draw) of this circuit support plate 240 in order to be engaged to a testing apparatus, touch panel 210 and this interface panel 250 to carry this spy, this circuit support plate 240 has at least one ground plane 241, a plurality of interior connection gasket 242 at its lower surface, a plurality of outer connection gasket 244 on surface thereon, and with circuit 243 interior connection gasket 242 partly is connected to this ground plane 241.This interface panel 250 is located at this spy and is touched between panel 210 and this circuit support plate 240, see also shown in Figure 3, in the present embodiment, this interface panel 250 is the ceramic circuit boards that have via 255 for a kind of, this interface panel 250 has the composition surface 252 of a cover surface 251 and a correspondence, the cover surface 151 of this interface panel 150 is aimed at and is touched panel 210 towards this spy, the precalculated position that the composition surface 252 of this interface panel 250 is aimed at towards this circuit support plate 240, a plurality of first guiding access 253 are formed at the cover surface 251 of this interface panel 250, a plurality of second guiding access 254 are formed at the composition surface 252 of this interface panel 250, and with via 255 electric connections those first guiding access 253 and those second guiding access 254, in the present embodiment, each first guiding access 253 comprises a dielectric elastomer block 253a and at least one metal level 253b around this elastomer block 253a, and similarly, each second guiding access 254 comprises a dielectric elastomer block 254a and at least one metal level 254b around this elastomer block 254a, after the modularity combination, the cover surface 251 of this interface panel 250 covers the back side 212 that panel 210 is touched in this spy, some of those first guiding access 253 are connected in second electrode 232 of those decoupling elements 230, other those first guiding access 253 is connected in this spy and touches those power supplys of panel 210/ground connection connection pad 217 and plurality of signals connection pad 218, those second guiding access 254 are connected in the interior connection gasket 242 of this circuit support plate 240, wherein part those second guiding access 254 of being electrically connected to those decoupling elements 230 are that interior connection gasket 242 via this circuit support plate 240 is electrically connected to this ground plane 241 with circuit 243, and other those second guiding access 254 that are electrically connected to those power supply/ground mats 217 and signal connection pad 218 are to pass this ground plane 241 and the outer connection gasket 244 that is electrically connected to this circuit support plate 240.
In addition, this modular high frequency detection card 200 can comprise one in addition in conjunction with external member 260, this perforate 261 in conjunction with external member 260 is aimed at and is appeared the front 211 that panel 210 is touched in this spy, and this touches panel 210 and this interface panel 250 in this circuit support plate 240 in conjunction with external member 260 in conjunction with this spy.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (10)
1, a kind of modular high frequency detection card is characterized in that it comprises:
Panel is touched in one spy, and it has a front, a back side and a plurality of accommodation aperture at this back side;
A plurality of spy contraventions, it is located at the front that panel is touched in this spy;
A plurality of decoupling elements, those spy contraventions that it is embedded in those accommodation apertures and is electrically connected to part;
One circuit support plate is in order to be engaged to the measuring head of a testing apparatus; And
One interface panel, it is located at this spy and touches between panel and this circuit support plate, this interface panel has a cover surface and a plurality of first guiding access in this cover surface, and this cover surface covers the back side that panel is touched in this spy, and those first guiding access of part are connected in those decoupling elements.
2, modular high frequency detection card according to claim 1 is characterized in that wherein said circuit support plate has a ground plane, and it is electrically connected to those decoupling elements by this interface panel.
3, modular high frequency detection card according to claim 2 is characterized in that wherein said interface panel has a plurality of second guiding access, and it is formed at this interface panel another surface corresponding to this cover surface, for the ground plane that connects to this circuit board.
4, modular high frequency detection card according to claim 1 is characterized in that it is to be a ceramic circuit board that panel is touched in wherein said interface panel or spy.
5, modular high frequency detection card according to claim 1 is characterized in that wherein said interface panel touches one of them that panel is selected from glass substrate, wafer and printed circuit board (PCB) with visiting.
6, modular high frequency detection card according to claim 1 is characterized in that wherein those first guiding access are to be the tie lines projection.
7, modular high frequency detection card according to claim 1 it is characterized in that wherein those first guiding access comprise the dielectricity elastomer block, and those first guiding access comprises at least one metal level around those elastomer block in addition.
8, modular high frequency detection card according to claim 1 is characterized in that it comprises one in addition in conjunction with external member, for touching panel and this interface panel in conjunction with this spy in this circuit support plate.
9, modular high frequency detection card according to claim 1, it is characterized in that wherein said spy touches panel and comprise a plurality of power supplys at this back side/ground connection connection pad, a plurality of by-pass line and a plurality of power supply/ground path, those power supply/ground paths connect those power supplys/ground connection connection pad and visit contravention with corresponding power supply/ground connection, and those by-pass line branches are connected to those corresponding power supply/ground paths.
10, modular high frequency detection card according to claim 9 is characterized in that wherein those by-pass line comprise via.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100930707A CN100424512C (en) | 2005-08-25 | 2005-08-25 | Modular high frequency detection card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100930707A CN100424512C (en) | 2005-08-25 | 2005-08-25 | Modular high frequency detection card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1920577A true CN1920577A (en) | 2007-02-28 |
| CN100424512C CN100424512C (en) | 2008-10-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100930707A Expired - Fee Related CN100424512C (en) | 2005-08-25 | 2005-08-25 | Modular high frequency detection card |
Country Status (1)
| Country | Link |
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| CN (1) | CN100424512C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI468085B (en) * | 2013-03-22 | 2015-01-01 | Reinforcing plate disposed in the probing device and manufacturing method thereof and probing device | |
| CN104714055A (en) * | 2013-12-13 | 2015-06-17 | 旺矽科技股份有限公司 | Detection jig |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5148103A (en) * | 1990-10-31 | 1992-09-15 | Hughes Aircraft Company | Apparatus for testing integrated circuits |
| US5828226A (en) * | 1996-11-06 | 1998-10-27 | Cerprobe Corporation | Probe card assembly for high density integrated circuits |
| US6218910B1 (en) * | 1999-02-25 | 2001-04-17 | Formfactor, Inc. | High bandwidth passive integrated circuit tester probe card assembly |
| US7349223B2 (en) * | 2000-05-23 | 2008-03-25 | Nanonexus, Inc. | Enhanced compliant probe card systems having improved planarity |
| US6911835B2 (en) * | 2002-05-08 | 2005-06-28 | Formfactor, Inc. | High performance probe system |
| US6781392B1 (en) * | 2003-05-12 | 2004-08-24 | Chipmos Technologies Ltd. | Modularized probe card with compressible electrical connection device |
-
2005
- 2005-08-25 CN CNB2005100930707A patent/CN100424512C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI468085B (en) * | 2013-03-22 | 2015-01-01 | Reinforcing plate disposed in the probing device and manufacturing method thereof and probing device | |
| CN104714055A (en) * | 2013-12-13 | 2015-06-17 | 旺矽科技股份有限公司 | Detection jig |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100424512C (en) | 2008-10-08 |
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