CN1916193A - Method for reducing interface residual stress of steel, copper, graphite composite plate - Google Patents

Method for reducing interface residual stress of steel, copper, graphite composite plate Download PDF

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Publication number
CN1916193A
CN1916193A CNA2006101129119A CN200610112911A CN1916193A CN 1916193 A CN1916193 A CN 1916193A CN A2006101129119 A CNA2006101129119 A CN A2006101129119A CN 200610112911 A CN200610112911 A CN 200610112911A CN 1916193 A CN1916193 A CN 1916193A
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copper
steel
graphite
residual stress
composite board
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CNA2006101129119A
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CN100392117C (en
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张鹏
杜云慧
刘汉武
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Beijing Jiaotong University
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Beijing Jiaotong University
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/20Recycling

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  • Metal Rolling (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

This invention discloses a method for reducing the interfacial residual stress of steel/copper/graphite semi-solid composite board. The method performs rolling treatment with a rolling reduction rate of 0.6-1.4% on the steel/copper/graphite semi-solid composite board at room temperature, and utilizes the deformation difference between copper/graphite coating layer and the steel board to compensate the construction difference between them during the cooling process, thus can reducing the interfacial residual stress of the composite board and raising the shear strength of the composite board. The method can solve the problems of large energy consumption and graphite oxidation loss faced by diffusion annealing technique for reducing the interfacial residual stress of steel/copper/graphite semi-solid composite board.

Description

A kind of method that reduces interface residual stress of steel, copper, graphite composite plate
Technical field
The present invention relates to a kind of method that reduces steel, copper, graphite semisolid-state clad plate interface residual stress.
Background technology
Steel, copper, graphite composite plate is the composite sheet that is made of steel plate and copper graphite self-lubricating coating, it is the ideal material of the modern novel bearing shell of preparation, intensity height, the interface mechanical characteristic of its self-lubricating coating are good, especially service temperature can be up to more than 300 ℃, this is that the steel aluminium-base composite plate is incomparable, and this composite sheet extremely is fit to the development trend of " high-speed overload ".The steel, copper, graphite semisolid-state clad plate adopts solid-state steel plate and copper-graphite semi-solid slurry to carry out combined shaping, because the coefficient of expansion of copper graphite coating is greater than the coefficient of expansion of steel plate, therefore, solidifying in the process of cooling after the steel, copper, graphite semi-solid state is compound, the shrinkage of copper graphite coating is greater than the shrinkage of steel plate, but because the intensity of copper graphite coating is less than the intensity of steel plate, like this, at the compound interface place, steel plate has hindered the normal contraction of copper graphite coating, therefore produce bigger additional stress at the compound interface place, this stress remains in the compound interface place behind the semi-solid state combined shaping, form interface residual stress.This unrelieved stress can be superimposed with the stress that the subsequent technique process produces, aggravation is to the destruction of compound interface, so behind the semi-solid state combined shaping, need composition board is handled,, the composition board interface mechanical characteristic be improved to reduce interface residual stress.
Reducing the comparatively feasible method of interface residual stress of steel, copper, graphite composite plate at present is the diffusion annealing method, in high temperature (more than the 300 ℃) annealing process of long-time (more than 10 hours), the atom that is in the unrelieved stress district can obtain enough energy, move to the low energy equilibrium theory of tide by the high energy equilibrium theory of tide, thereby reduce interface residual stress, and then improve interface mechanical characteristic.But diffusion annealing for a long time, not only can cause product energy consumption increase, cost to improve, but also can cause the oxidation wastage of copper graphite coating top layer graphite, it is not ideal therefore to adopt the diffusion annealing method to reduce steel, copper, graphite semisolid-state clad plate interface residual stress.
Summary of the invention
Technical problem to be solved by this invention is, overcome the deficiency that diffusion annealing reduces steel, copper, graphite semisolid-state clad plate interface residual stress method " energy consumption is big, graphite oxidation runs off ", provide a kind of and can remedy shrinkage difference that copper graphite coating and steel plate solidifying after semi-solid state is compound produce in the process of cooling and then the method that reduces the compound interface unrelieved stress, further improve the interface shear strength of steel, copper, graphite semisolid-state clad plate.
The technical solution adopted for the present invention to solve the technical problems is: it is 0.6~1.4% rolling processing that the steel, copper, graphite semisolid-state clad plate is at room temperature carried out draft (draft is that the difference of composition board ingoing ga(u)ge and outgoing gauge is again divided by ingoing ga(u)ge).
The draft of rolling processing is most important, draft is too small, the copper graphite coating that then rolling processing produces and the difference of steel plate deformed amount can not remedy the difference of copper graphite coating and steel plate shrinkage in the composite solidification process of cooling fully, do not reach the purpose of reduction composition board interface residual stress; Draft is excessive, the copper graphite coating that then rolling processing produces and the difference of steel plate deformed amount, not only remedied the difference of copper graphite coating and steel plate shrinkage in the composite solidification process of cooling, but also the new copper graphite coating and the difference of steel plate deformed amount have been caused, form new unrelieved stress again at the compound interface place, directly caused the reduction of compound interface shearing resistance.The rolling processing draft scope that can remedy copper graphite coating and steel plate shrinkage difference in the composite solidification process of cooling, effectively improves interface shear strength is 0.6~1.4%.
The invention has the beneficial effects as follows: utilize the present invention, steel backing copper-graphite semi-solid composition board is carried out the rolling processing of room temperature, the compound interface shearing resistance is brought up to 132~136MPa by 127MPa, reach the peer-level of 132~136MPa that the diffusion annealing method obtains, reduced the effective of copper-graphite semi-solid composition board interface residual stress.
Embodiment
At room temperature, on finishing rolling mill, to the steel, copper, graphite semisolid-state clad plate, carry out draft and be 0.6~1.4% rolling processing, utilize the difference of copper graphite coating that rolling processing produces and steel plate deformed amount to remedy the difference of copper graphite coating and steel plate shrinkage in the composite solidification process of cooling, and then reduce the composition board interface residual stress, improve the composition board interface shear strength.
Embodiment one
To the composition board that constitutes by thick 08Al steel plate of 1.2mm and the thick titanium bronze 3.5-3.5 of 2.8mm graphite coating, at room temperature, on finishing rolling mill, carry out draft and be 0.6% rolling processing, the composition board interface shear strength is brought up to 133MPa by 127MPa.
Embodiment two
To the composition board that constitutes by thick 08Al steel plate of 1.2mm and the thick titanium bronze 3.5-4 of 2.8mm graphite coating, at room temperature, on finishing rolling mill, carry out draft and be 1.0% rolling processing, the composition board interface shear strength is brought up to 136MPa by 127MPa.
Embodiment three
To the composition board that constitutes by thick 08Al steel plate of 1.2mm and the thick titanium bronze 4.3-5 of 2.8mm graphite coating, at room temperature, on finishing rolling mill, carry out draft and be 1.4% rolling processing, the composition board interface shear strength is brought up to 132MPa by 127MPa.
Embodiment four
To the composition board that constitutes by thick 08Al steel plate of 1.2mm and the thick titanium bronze 3.5-5 of 2.8mm graphite coating, at room temperature, on finishing rolling mill, carry out draft and be 0.8% rolling processing, the composition board interface shear strength is brought up to 134MPa by 127MPa.

Claims (1)

1. a method that reduces interface residual stress of steel, copper, graphite composite plate is characterized in that, at room temperature, on finishing rolling mill, to the steel, copper, graphite semisolid-state clad plate, carries out draft and be 0.6~1.4% rolling processing.
CNB2006101129119A 2006-09-12 2006-09-12 Method for reducing interface residual stress of steel, copper, graphite composite plate Expired - Fee Related CN100392117C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB2006101129119A CN100392117C (en) 2006-09-12 2006-09-12 Method for reducing interface residual stress of steel, copper, graphite composite plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2006101129119A CN100392117C (en) 2006-09-12 2006-09-12 Method for reducing interface residual stress of steel, copper, graphite composite plate

Publications (2)

Publication Number Publication Date
CN1916193A true CN1916193A (en) 2007-02-21
CN100392117C CN100392117C (en) 2008-06-04

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102010946A (en) * 2010-12-30 2011-04-13 北京交通大学 Even post-treatment method for steel-aluminum 4-graphite semi-solid composite plate
CN102010949A (en) * 2010-12-30 2011-04-13 北京交通大学 Homogenization post processing method for steel aluminum 9 graphite semisolid composite board
CN102011070A (en) * 2010-12-30 2011-04-13 北京交通大学 Method for uniformly post-processing steel brass HSi80 semi-solid composite plate
CN102010953A (en) * 2010-12-30 2011-04-13 北京交通大学 Homogenization post-processing method of steel-red copper semisolid composite plate
CN102031468A (en) * 2010-12-30 2011-04-27 北京交通大学 Homogenization post-processing method for steel titanium bronze 3.5-3.5 graphite semisolid composite plate
CN115570470A (en) * 2022-09-30 2023-01-06 中钢新型材料股份有限公司 Treatment method for reducing residual stress on surface of graphite sample

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102010946A (en) * 2010-12-30 2011-04-13 北京交通大学 Even post-treatment method for steel-aluminum 4-graphite semi-solid composite plate
CN102010949A (en) * 2010-12-30 2011-04-13 北京交通大学 Homogenization post processing method for steel aluminum 9 graphite semisolid composite board
CN102011070A (en) * 2010-12-30 2011-04-13 北京交通大学 Method for uniformly post-processing steel brass HSi80 semi-solid composite plate
CN102010953A (en) * 2010-12-30 2011-04-13 北京交通大学 Homogenization post-processing method of steel-red copper semisolid composite plate
CN102031468A (en) * 2010-12-30 2011-04-27 北京交通大学 Homogenization post-processing method for steel titanium bronze 3.5-3.5 graphite semisolid composite plate
CN102010946B (en) * 2010-12-30 2012-07-11 北京交通大学 Even post-treatment method for steel-aluminum 4-graphite semi-solid composite plate
CN102011070B (en) * 2010-12-30 2012-07-11 北京交通大学 Method for uniformly post-processing steel brass HSi80 semi-solid composite plate
CN102010953B (en) * 2010-12-30 2012-09-05 北京交通大学 Homogenization post-processing method of steel-red copper semisolid composite plate
CN115570470A (en) * 2022-09-30 2023-01-06 中钢新型材料股份有限公司 Treatment method for reducing residual stress on surface of graphite sample
CN115570470B (en) * 2022-09-30 2023-08-15 赛迈科先进材料股份有限公司 Treatment method for reducing residual stress on surface of graphite sample

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Granted publication date: 20080604

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