CN102010953B - Homogenization post-processing method of steel-red copper semisolid composite plate - Google Patents
Homogenization post-processing method of steel-red copper semisolid composite plate Download PDFInfo
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- CN102010953B CN102010953B CN201010613871A CN201010613871A CN102010953B CN 102010953 B CN102010953 B CN 102010953B CN 201010613871 A CN201010613871 A CN 201010613871A CN 201010613871 A CN201010613871 A CN 201010613871A CN 102010953 B CN102010953 B CN 102010953B
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- red copper
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- clad plate
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Abstract
The invention discloses a homogenization post-processing method of a steel-red copper semisolid composite plate, belonging to the research field of interfacial shear strength room temperature rolling post-processing of the steel-red copper semisolid composite plate. The steel-red copper semisolid composite plate consisting of a 1.2mm of 08Al steel plate and a 1.5mm of red copper coating is subjected to the two-pass rolling treatment on a precision-rolling mill at room temperature, wherein the total reduction ratio is 1.8% and the reduction ratio of the first pass to the second pass is 1:3.5 to 1:1. As a result, the lateral interfacial shear strength difference of the composite plate can be reduced to less than 2.2Mpa.
Description
Technical field
The present invention relates to a kind of rolling post-treating method of interface shear strength room temperature of steel red copper semisolid-state clad plate.
Background technology
Publication number: CN101117696A, denomination of invention: on " a kind of post-treating method of steel-back aluminium-based semisolid-state clad plate ", set forth the rolling post-treating method of room temperature of steel-back aluminium-based semisolid-state clad plate; Promptly; At room temperature, on finishing rolling mill, to steel-back aluminium-based semisolid-state clad plate; Be rolled aftertreatment; Utilize the difference of aluminium base coating that rolling processing produces and steel backing deflection to remedy the difference of aluminium base coating and steel backing shrinkage in the composite solidification process of cooling, and then reduce composition board interface additional stress, the composition board interface shear strength is improved.This method technology is simple, composition board interface shear strength value improves bigger; But; Because this method is carrying out there is aluminium base coating deflection non-uniform phenomenon when one-pass roller is handled; Therefore cause the uneven distribution of composition board interface shear strength usually, can be in composition board interface shear strength difference transversely up to 2.6～3.2MPa.
Steel red copper semisolid-state clad plate is to adopt semisolid-state clad plate that solid-state steel plate and red copper semi solid slurry are composited, that be made up of thick 08Al steel plate of 1.2mm and the thick red copper coating of 1.5mm; When adopting the CN101117696A patented process to be rolled aftertreatment; At ideal draft comparatively is under 1.8% condition; Because the red copper coating is at composition board deflection skewness transversely, cause the difference between the composition board interface shear strength transversely can be up to 4.1MPa.
For steel red copper semisolid-state clad plate, the difference of transverse interface shearing resistance is more little, and work reliability is high more, and range of application is wide more, so the difference of steel red copper semisolid-state clad plate transverse interface shearing resistance is more little good more.
Summary of the invention
Technical problem to be solved by this invention is; Overcome the deficiency of the existing rolling post-treating method of steel red copper semisolid-state clad plate room temperature " transverse interface shearing resistance difference is big "; A kind of post-treating method that can improve steel red copper semisolid-state clad plate transverse interface shearing resistance distributing homogeneity is provided, further dwindles the difference of composition board transverse interface shearing resistance.
The technical solution adopted for the present invention to solve the technical problems is: to steel red copper semisolid-state clad plate; At room temperature; On finishing rolling mill, carry out total draft and be percentage pass reduction ratio 1.8%, first passage and second passage and be 1: 3.5～1: 1 the rolling processing of two passages.
The invention has the beneficial effects as follows: for the rolling processing of composition board room temperature; Because roller is jumped, the existence of the unequal factor of matrix; Transversely produce nonaffine deformation inevitably in composition board, cause the difference of composition board transverse interface shearing resistance, and draft is big more; Distortion transversely is inhomogeneous more, and the difference of composition board transverse interface shearing resistance is big more.If nonaffine deformation transversely with the rolling generation of single pass heavy reduction rate; Decompose in the middle of the little draft distortion of multi-pass; Then can one-pass roller be handled the big-difference of the transverse deformation amount that produces; Be decomposed into the little difference of the transverse deformation amount of multi-pass, and pass through the optimum combination of each percentage pass reduction, can also further coordinate the difference of transverse deformation amount.The present invention utilizes the optimum combination of the percentage pass reduction of first passage and second passage further to reduce and coordinated the difference of the transverse deformation amount of the rolling processing of room temperature, thereby has reached the purpose that reduces composition board transverse interface shearing resistance difference.Utilize the present invention; Steel red copper semisolid-state clad plate is carried out the rolling processing of room temperature; Can composition board transverse interface shearing resistance difference be reduced in the 2.2MPa, reduce by 46% at least than adopting the CN101117696A patented process to carry out the 4.1MPa that the rolling processing of room temperature obtains.
Embodiment
A kind of even post-treating method of steel red copper semisolid-state clad plate; At room temperature; On finishing rolling mill,, carry out two passages, total draft and be 1.8% rolling aftertreatment to the steel red copper semisolid-state clad plate that constitutes by thick 08Al steel plate of 1.2mm and the thick red copper coating of 1.5mm; The big-difference of the red copper coating transverse deformation amount that the rolling aftertreatment of single pass heavy reduction rate is produced; Decomposition and coordination are the little difference of the red copper coating transverse deformation amount of the rolling aftertreatment generation of the little draft of two passages, thereby have further reduced composition board transverse interface shearing resistance difference, have improved the distributing homogeneity of steel red copper semisolid-state clad plate interface shear strength.
Embodiment one, to steel red copper semisolid-state clad plate, the percentage pass reduction ratio of carrying out first passage and second passage is 1: 3.5 the rolling aftertreatment of two passage room temperatures, is 2.2MPa in composition board interface shear strength difference transversely.
Embodiment two, to steel red copper semisolid-state clad plate, the percentage pass reduction ratio of carrying out first passage and second passage is 1: 3 the rolling aftertreatment of two passage room temperatures, is 2.0MPa in composition board interface shear strength difference transversely.
Embodiment three, to steel red copper semisolid-state clad plate, the percentage pass reduction ratio of carrying out first passage and second passage is 1: 2.5 the rolling aftertreatment of two passage room temperatures, is 1.9MPa in composition board interface shear strength difference transversely.
Embodiment four, to steel red copper semisolid-state clad plate, the percentage pass reduction ratio of carrying out first passage and second passage is 1: 2 the rolling aftertreatment of two passage room temperatures, is 2.0MPa in composition board interface shear strength difference transversely.
Embodiment five, to steel red copper semisolid-state clad plate, the percentage pass reduction ratio of carrying out first passage and second passage is 1: 1 the rolling aftertreatment of two passage room temperatures, is 2.1MPa in composition board interface shear strength difference transversely.
It is thus clear that; To the steel red copper semisolid-state clad plate that constitutes by thick 08Al steel plate of 1.2mm and the thick red copper coating of 1.5mm; The percentage pass reduction ratio of carrying out total draft and be 1.8%, first passage and second passage is 1: 3.5～1: 1 the rolling aftertreatment of two passage room temperatures, and composition board interface shear strength difference transversely is reduced in the 2.2MPa.
Claims (1)
1. the even post-treating method of a steel red copper semisolid-state clad plate; At room temperature; On finishing rolling mill; Steel red copper semisolid-state clad plate to being made up of thick 08Al steel plate of 1.2mm and the thick red copper coating of 1.5mm is rolled aftertreatment, it is characterized in that, to steel red copper semisolid-state clad plate; Carrying out total draft and be percentage pass reduction ratio 1.8%, first passage and second passage is the rolling processing of two passages of 1:3.5～1:1, and composition board interface shear strength difference transversely is reduced in the 2.2MPa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010613871A CN102010953B (en) | 2010-12-30 | 2010-12-30 | Homogenization post-processing method of steel-red copper semisolid composite plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010613871A CN102010953B (en) | 2010-12-30 | 2010-12-30 | Homogenization post-processing method of steel-red copper semisolid composite plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102010953A CN102010953A (en) | 2011-04-13 |
| CN102010953B true CN102010953B (en) | 2012-09-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201010613871A Expired - Fee Related CN102010953B (en) | 2010-12-30 | 2010-12-30 | Homogenization post-processing method of steel-red copper semisolid composite plate |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1916193A (en) * | 2006-09-12 | 2007-02-21 | 北京交通大学 | Method for reducing interface residual stress of steel, copper, graphite composite plate |
| CN1915546A (en) * | 2006-09-01 | 2007-02-21 | 北京交通大学 | Composite method for casting and rolling composite plate of steel, cupper, and graphite |
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2010
- 2010-12-30 CN CN201010613871A patent/CN102010953B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1915546A (en) * | 2006-09-01 | 2007-02-21 | 北京交通大学 | Composite method for casting and rolling composite plate of steel, cupper, and graphite |
| CN1916193A (en) * | 2006-09-12 | 2007-02-21 | 北京交通大学 | Method for reducing interface residual stress of steel, copper, graphite composite plate |
Non-Patent Citations (2)
| Title |
|---|
| 付祖铸.8.5金属复合轧制.《有色金属板带材生产》.中南工业大学出版社,1992,第178-190页. * |
| 杜云慧等.钢-半固态铜-石墨压力复合的优化.《清华大学学报(自然科学版)》.2005,第45卷(第11期),1464-1467. * |
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| CN102010953A (en) | 2011-04-13 |
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Granted publication date: 20120905 Termination date: 20121230 |