CN1911815A - Method for producing cuprous chloride by using copper oxychloride - Google Patents
Method for producing cuprous chloride by using copper oxychloride Download PDFInfo
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- CN1911815A CN1911815A CN 200610040909 CN200610040909A CN1911815A CN 1911815 A CN1911815 A CN 1911815A CN 200610040909 CN200610040909 CN 200610040909 CN 200610040909 A CN200610040909 A CN 200610040909A CN 1911815 A CN1911815 A CN 1911815A
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- solution
- cuprous chloride
- copper oxychloride
- reductive agent
- liquid
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- 229910021591 Copper(I) chloride Inorganic materials 0.000 title claims abstract description 41
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 title claims abstract description 41
- 229940045803 cuprous chloride Drugs 0.000 title claims abstract description 41
- HKMOPYJWSFRURD-UHFFFAOYSA-N chloro hypochlorite;copper Chemical compound [Cu].ClOCl HKMOPYJWSFRURD-UHFFFAOYSA-N 0.000 title claims abstract description 26
- 239000005752 Copper oxychloride Substances 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title abstract description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims abstract description 31
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 26
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 15
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000001035 drying Methods 0.000 claims abstract description 10
- 238000005406 washing Methods 0.000 claims abstract description 9
- 238000003756 stirring Methods 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000002244 precipitate Substances 0.000 claims abstract description 5
- 238000001914 filtration Methods 0.000 claims abstract description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 34
- 239000007788 liquid Substances 0.000 claims description 34
- 230000002829 reductive effect Effects 0.000 claims description 34
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 24
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 claims description 12
- 229960003280 cupric chloride Drugs 0.000 claims description 12
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 9
- 235000011121 sodium hydroxide Nutrition 0.000 claims description 8
- 241000370738 Chlorion Species 0.000 claims description 7
- 239000002253 acid Substances 0.000 claims description 7
- DWAQJAXMDSEUJJ-UHFFFAOYSA-M Sodium bisulfite Chemical compound [Na+].OS([O-])=O DWAQJAXMDSEUJJ-UHFFFAOYSA-M 0.000 claims description 5
- 235000010267 sodium hydrogen sulphite Nutrition 0.000 claims description 5
- 238000002425 crystallisation Methods 0.000 claims description 4
- 230000008025 crystallization Effects 0.000 claims description 4
- 235000008733 Citrus aurantifolia Nutrition 0.000 claims description 3
- 235000011941 Tilia x europaea Nutrition 0.000 claims description 3
- 238000004821 distillation Methods 0.000 claims description 3
- 239000004571 lime Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000002351 wastewater Substances 0.000 abstract description 6
- 238000011084 recovery Methods 0.000 abstract description 3
- 229910001431 copper ion Inorganic materials 0.000 abstract description 2
- 239000003638 chemical reducing agent Substances 0.000 abstract 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 238000002156 mixing Methods 0.000 abstract 1
- 230000001376 precipitating effect Effects 0.000 abstract 1
- 239000002994 raw material Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000006722 reduction reaction Methods 0.000 description 6
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005352 clarification Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000005750 Copper hydroxide Substances 0.000 description 2
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 description 2
- DPDMMXDBJGCCQC-UHFFFAOYSA-N [Na].[Cl] Chemical compound [Na].[Cl] DPDMMXDBJGCCQC-UHFFFAOYSA-N 0.000 description 2
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- 239000012752 auxiliary agent Substances 0.000 description 2
- 229910001956 copper hydroxide Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000247 postprecipitation Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000006228 supernatant Substances 0.000 description 2
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
Abstract
A method for producing cuprous chloride by using copper oxychloride comprises the following steps: (1) mixing at least one of a copper chloride solution and a dilute hydrochloric acid solution with a copper oxychloride solution to prepare an A solution with the mass content ratio of copper ions to chloride ions being 63.5: 37.5-40; (2) heating the solution A to 50-80 ℃, adding a reducing agent into the solution A, and stopping adding the reducing agent when the solution A is changed from green to light brown to obtain solution B; (3) injecting pure water into the solution B, stirring and rinsing the solution B, and then precipitating the solution B to obtain solution C and a precipitate; (4) and washing the precipitate with dilute hydrochloric acid and ethanol in sequence, filtering and drying to obtain cuprous chloride. The method has the advantages of less waste water generated in the production process and high recovery rate.
Description
Technical field
The present invention relates to a kind of method of producing cuprous chloride with copper oxychloride.
Background technology
Existing method of producing cuprous chloride has four kinds usually:
First kind is that cuprous chloride is produced in casting with the logical chlorine of electrolytic copper;
Second kind is to use Cupric Chloride Solution (main component of circuit board etching liquid) to be raw material, is reductive agent with copper sponge, produces cuprous chloride;
The third is to be raw material with copper-bath, and salt is auxiliary agent, adds the reductive agent reduction reaction again and produces cuprous chloride;
The 4th kind is to be raw material with copper hydroxide, produces cuprous chloride with the S-WAT reduction reaction, and this method also is the main method of present processing circuitry plate etching waste liquor.
In above-mentioned four kinds of methods, first kind of electrolytic copper is main raw material, and the global shortage of electrolytic copper resource is a reductive agent with liquid chlorine, restores and needs 800 degrees centigrade high temperature in the reaction process, and this material to conversion unit requires very high, and poor stability; Second method is to be raw material with the Cupric Chloride Solution, and copper sponge is a reductive agent, though be that reductive agent is the best way with the copper raw material, but copper sponge needs a large amount of iron materials when making, form a large amount of iron waste waters that contains, it is big to handle these waste water difficulty, the processing cost height; The third be with copper-bath as raw material, make reductive agent with S-WAT, sulfur dioxide gas or sodium bisulfite, in addition processing industry salt be made auxiliary agent and just increases the material production cost before reaction, cupric ion proportion is little in this method copper-bath, production capacity is poor; The 4th kind of method is to be raw material with the hydroxide copper sludge, is reductive agent with the S-WAT, and containing ammonium chloride, sodium-chlor in the waste water that is produced when making copper hydroxide can't Separation and Recovery regeneration, and wherein ammonium chloride, sodium-chlor cause the difficulty and the cost of sewage disposal.
Summary of the invention
The object of the invention provides a kind of method of producing cuprous chloride with copper oxychloride, and the waste water that utilizes this method to produce in process of production is few, and rate of recovery height.
The present invention can be implemented by the following technical programs:
A kind of method of producing cuprous chloride with copper oxychloride, it comprises the steps:
(1), with the mixed mutually mass content ratio that is mixed with cupric ion and chlorion of Cupric Chloride Solution, dilute hydrochloric acid solution at least a solution among both and copper oxychloride solution is 63.5: 37.5～40 A solution;
(2), described A solution is heated to 50 ℃～80 ℃ after, in described A solution, add reductive agent, when described A solution becomes light brown by green, stop to add reductive agent, obtain B liquid;
(3), inject pure water, precipitate after stirring rinsing, obtain C liquid and throw out to described B liquid;
(4), wash described throw out successively, filter, promptly obtain cuprous chloride after the drying with dilute hydrochloric acid, ethanol.
Described reductive agent is one or more the mixture in sulfurous gas, S-WAT, the sodium bisulfite.
When described reductive agent is sulfurous gas, absorb the superfluous sulfur dioxide gas of reduction with liquid caustic soda, obtain the reductive agent S-WAT.
Described Cupric Chloride Solution is acid circuit board etching liquid, mainly contains cupric chloride and hydrochloric acid in the described acid circuit board etching liquid.
In step (2), the speed when adding reductive agent is near slowly, and the time of Jia Ruing is 0.8～1.2 hour altogether.
Described C liquid is neutralized with liquid caustic soda, again with hydrochloric acid reaction, generate cuprous chloride solution, filtration, crystallization, drying make cuprous chloride.
In the step (4), described throw out is washed, the washings that obtains after the washing makes ethanol by dry lime suction distillation.
In step (2), when described A solution becomes light brown by green, measure the pH value of A solution this moment, when the pH value of measuring is 1～2, enter step (3), when the pH value of measuring less than 1～2 the time, in described A solution, add copper oxychloride again, till the pH value of described light brown A solution is 1～2.
Compared with the prior art the present invention has following advantage:
1, the product structure that makes full use of copper oxychloride makes that the mass content can be mixed with cupric ion and chlorion is 63.5: 37.5～40 A solution, make it become cuprous ion with the cupric ion in the reductive agent reduction A solution, provide cuprous ion for generating cuprous chloride later on.
2, absorb superfluous sulfur dioxide gas with liquid caustic soda cleverly, promptly eliminated and polluted the reductive agent of having regenerated again.
3, it is cuprous to contain chlorination in the C of rinsing post precipitation solution, with the generation cuprous hydroxide, just obtains cuprous chloride again with behind the hydrochloric acid reaction in alkali, has saved reductive agent, and the waste water cupric ion all reclaims simultaneously, and is pollution-free.
4, the cuprous chloride of this technology production, more than or equal to 99%, copper chloride content is less than 0.8% through check cuprous chloride content, and iron level is less than 0.005%.
Embodiment
A kind of method of producing cuprous chloride with copper oxychloride, it comprises the steps:
(1), with the mixed mutually mass content ratio that is mixed with cupric ion and chlorion of Cupric Chloride Solution, dilute hydrochloric acid solution at least a solution among both and copper oxychloride solution is 63.5: 37.5～40 A solution;
(2), described A solution is heated to 50 ℃～80 ℃ after, near adding reductive agent slowly, the time of adding is 0.8～1.2 hour, when described A solution becomes light brown by green, stops to add reductive agent, obtains B liquid in described A solution;
(3), inject pure water, precipitate after stirring rinsing, obtain C liquid and throw out to described B liquid;
(4), wash described throw out successively, filter, promptly obtain cuprous chloride after the drying with dilute hydrochloric acid, ethanol.
Described reductive agent is one or more the mixture in sulfurous gas, S-WAT, the sodium bisulfite, wherein when described reductive agent is sulfurous gas, absorbs the superfluous sulfur dioxide gas of reduction with liquid caustic soda, obtains the reductive agent S-WAT.
Described Cupric Chloride Solution is acid circuit board etching liquid, mainly contains cupric chloride and hydrochloric acid in the described acid circuit board etching liquid.
In step (2), the speed when adding reductive agent is near slowly, and the time of Jia Ruing is 0.8～1.2 hour altogether.
Described C liquid is neutralized with liquid caustic soda, again with hydrochloric acid reaction, generate cuprous chloride solution, filtration, crystallization, drying make cuprous chloride.
In the step (4), described throw out is washed, the washings that obtains after the washing makes ethanol by dry lime suction distillation.
In step (2), when described A solution becomes light brown by green, measure the pH value of A solution this moment, when the pH value of mensuration less than 1～2 the time, in described A solution, add copper oxychloride again, till the pH value of described light brown A solution is 1～2.
In process of production, adding reductive agent when closing to an end, when promptly obtaining clarifying light brown solution, preferably will measuring, whether the pH value of solution is 1～2.
When the pH value of measuring is 1～2, enter step (3).
When measuring the pH value less than 1～2, for example the pH value is 0.5, and this moment, solution was clarifying light brown, but reaction is not fully, the efficient of the cuprous chloride that obtains in step (4) afterwards will reduce like this, the mass content ratio of cupric ion and chlorion is positioned between 63.5: 37.5 to 63.5: 40 in the A liquid of explanation this moment preparation in step (1), at this moment as again add an amount of copper oxychloride, make its can reach clarification during light brown and the pH value of A liquid be 1～2 o'clock, the efficient of the cuprous chloride that obtains after step (4) will be improved.
Also can run in process of production, reductive agent is excessive when adding, A solution still fails to reach the clarification light brown, this mass content that shows cupric ion and chlorion in the A liquid is not than in 63.5: 37.5～40 these scopes the time, must add an amount of Cupric Chloride Solution or dilute hydrochloric acid this moment makes its mass content that satisfies cupric ion and chlorion in the step 1 compare this condition smaller or equal to 63.5: 37.5, and continue to add reductive agent, till reaching the clarification light brown solution, the pH value that measure A liquid this moment again is 1～2 o'clock up to satisfying the pH value, stops to add reductive agent.
Embodiment 1:
With copper ion concentration is that 13.5g/L, concentration of hydrochloric acid are that the acid circuit board etching liquid of 220g/L joins in the reactor for 1600 liters, heat up and add 825 kilograms of copper oxychlorides, stir mixed, stop to heat up when temperature reaches 60 degrees centigrade, begin to add reductive agent (sulfur dioxide gas, S-WAT, sodium bisulfite) and all can.Reductive agent feeds intake Shi Yaocong near slowly, continue 1 hour, make solution become light brown from green, the pH value of solution value is 1～2, restart to be warming up to 80～90 degrees centigrade, kept 20 minutes, the reduction reaction step finishes, in the pure water with 2～3 times of cuprous chloride inputs, expanding body under the condition of pure water temperature more than 60 degrees centigrade stirs, rinsing 20 minutes stops to stir, and begins to precipitate 30 minutes, extract supernatant liquid, use supernatant liquid in the liquid caustic soda and the generation cuprous hydroxide, the cuprous chloride of post precipitation reclaims the cuprous chloride drying with dilute hydrochloric acid and washing with alcohol, washings, again with cuprous hydroxide and hydrochloric acid reaction, generate cuprous chloride solution, filter, crystallization, drying makes cuprous chloride, 80～120 degrees centigrade of drying temperatures.
Embodiment 2:
With concentration of hydrochloric acid is that the dilute hydrochloric acid of 200g/L is put in the reactor for 1600 liters, begins to heat up and add 873 kilograms of copper oxychlorides, stirs mixedly, when temperature reaches 60 degrees centigrade, stops to heat up, and as follows embodiment 1 method continues.
Claims (8)
1, a kind of method of producing cuprous chloride with copper oxychloride, it is characterized in that: it comprises the steps:
(1), with the mixed mutually mass content ratio that is mixed with cupric ion and chlorion of Cupric Chloride Solution, dilute hydrochloric acid solution at least a solution among both and copper oxychloride solution is 63.5: 37.5～40 A solution;
(2), described A solution is heated to 50 ℃～80 ℃ after, in described A solution, add reductive agent, when described A solution becomes light brown by green, stop to add reductive agent, obtain B liquid;
(3), inject pure water, precipitate after stirring rinsing, obtain C liquid and throw out to described B liquid;
(4), wash described throw out successively, filter, promptly obtain cuprous chloride after the drying with dilute hydrochloric acid, ethanol.
2, method of producing cuprous chloride with copper oxychloride according to claim 1 is characterized in that: described reductive agent is one or more the mixture in sulfurous gas, S-WAT, the sodium bisulfite.
3, method of producing cuprous chloride with copper oxychloride according to claim 2 is characterized in that: when described reductive agent is sulfurous gas, absorb the superfluous sulfur dioxide gas of reduction with liquid caustic soda, obtain the reductive agent S-WAT.
4, method of producing cuprous chloride with copper oxychloride according to claim 1, it is characterized in that: described Cupric Chloride Solution is acid circuit board etching liquid, mainly contains cupric chloride and hydrochloric acid in the described acid circuit board etching liquid.
5, method of producing cuprous chloride with copper oxychloride according to claim 1 is characterized in that: in step (2), the speed when adding reductive agent is near slowly, and the time of Jia Ruing is 0.8～1.2 hour altogether.
6, method of producing cuprous chloride with copper oxychloride according to claim 1 is characterized in that: described C liquid is neutralized with liquid caustic soda, again with hydrochloric acid reaction, generate cuprous chloride solution, filtration, crystallization, drying make cuprous chloride.
7, method of producing cuprous chloride with copper oxychloride according to claim 1 is characterized in that: in the step (4), described throw out is washed, the washings that obtains after the washing makes ethanol by dry lime suction distillation.
8, method of producing cuprous chloride with copper oxychloride according to claim 1, it is characterized in that: in step (2), when described A solution becomes light brown by green, measure the pH value of A solution this moment, when measuring pH value and be 1～2, enter step (3), when mensuration pH value less than 1～2 the time, in described A solution, add copper oxychloride again, till the pH value of described light brown A solution is 1～2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100409095A CN100415650C (en) | 2006-08-07 | 2006-08-07 | Method for producing cuprous chloride by using copper oxychloride |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100409095A CN100415650C (en) | 2006-08-07 | 2006-08-07 | Method for producing cuprous chloride by using copper oxychloride |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1911815A true CN1911815A (en) | 2007-02-14 |
| CN100415650C CN100415650C (en) | 2008-09-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100409095A Active CN100415650C (en) | 2006-08-07 | 2006-08-07 | Method for producing cuprous chloride by using copper oxychloride |
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| Country | Link |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105016373A (en) * | 2015-08-03 | 2015-11-04 | 沈国强 | Method for producing copper chloride through waste etching liquid containing copper |
| CN105819489A (en) * | 2016-03-13 | 2016-08-03 | 河南师范大学 | Green synthesis method of cuprous chloride |
| CN111392944A (en) * | 2020-03-24 | 2020-07-10 | 宁波神化特种化学品集成有限公司 | Treatment method of cuprous cyanide production wastewater |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3130810A1 (en) * | 1981-08-04 | 1983-02-24 | Chemische Werke Hüls AG, 4370 Marl | METHOD FOR PRODUCING COPPER (II) -CHLORIDE FROM COPPER (II) -OXICHLORIDE WITH TERTIAL AMINE HYDROCHLORIDES |
| CN1307107C (en) * | 2005-04-21 | 2007-03-28 | 吴江市阮氏化工有限公司 | Method for producing cuprous chloride by using waste copper chloride etching plate liquid |
-
2006
- 2006-08-07 CN CNB2006100409095A patent/CN100415650C/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105016373A (en) * | 2015-08-03 | 2015-11-04 | 沈国强 | Method for producing copper chloride through waste etching liquid containing copper |
| CN105819489A (en) * | 2016-03-13 | 2016-08-03 | 河南师范大学 | Green synthesis method of cuprous chloride |
| CN111392944A (en) * | 2020-03-24 | 2020-07-10 | 宁波神化特种化学品集成有限公司 | Treatment method of cuprous cyanide production wastewater |
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| Publication number | Publication date |
|---|---|
| CN100415650C (en) | 2008-09-03 |
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