CN1909029A - LED pixel module set casing with heat dissipating function - Google Patents
LED pixel module set casing with heat dissipating function Download PDFInfo
- Publication number
- CN1909029A CN1909029A CN 200610047469 CN200610047469A CN1909029A CN 1909029 A CN1909029 A CN 1909029A CN 200610047469 CN200610047469 CN 200610047469 CN 200610047469 A CN200610047469 A CN 200610047469A CN 1909029 A CN1909029 A CN 1909029A
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- CN
- China
- Prior art keywords
- set casing
- led pixel
- pixel module
- module set
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The disclosed flexible LED pixel module shell with heat dissipation function comprises: an outside shell (1) compression cast by metal, the built-in metal cylinder (2), and a PCB plate (3) with drive circuit and LED (4) to connect with cylinder (2). This invention is convenient to assembly and maintenance, can balance PCB plate temperature and the external environment, and then improves LED lifetime.
Description
Technical field
The present invention relates to a kind of flexible display screen parts, particularly a kind of LED pixel module set casing with heat sinking function.
Background technology
Existing LED pixel module set casing mostly is made of plastics, it is divided into type in following two: a kind of is that light emitting diode and design of drive circuit are on a pcb board, make water-proofing treatment above the pcb board, this kind structure is light emitting diode and driving circuit integral structure, simple in structure, installation and maintenance convenience, but the LED pixel module set casing radiating effect of this kind structure is poor, causes the light emitting diode temperature rise too high, cause diode initial failure, influence serviceable life; Also having a kind of is that light emitting diode and drive circuit board are arranged on the two boards, though this kind structure good heat dissipation effect has caused the circuit structure complexity, makes installation and maintenance inconvenience, and there is defective in technology, poor stability.
Summary of the invention
Technical matters to be solved by this invention provides a kind of simple in structure, good heat dissipation effect, and installation and maintenance has the LED pixel module set casing of heat sinking function easily.
The present invention is achieved in that the LED pixel module set casing with heat sinking function to achieve these goals, it is that the metal cartridge that is provided with in the shell that is cast into by metal material, the shell constitutes, and the pcb board that driving circuit and light emitting diode are installed contacts with metal cartridge.
Described metal is any one in aluminium, magnesium, copper, the zinc.
Described metal cartridge and shell form for one die casting.
The upper end surface of each metal cartridge is in same surface level.
Advantage of the present invention and effect are as follows:
The present invention compared with prior art, it is simple in structure, installation and maintenance is convenient, because shell adopts the metal shell of good heat dissipation effect, and metal cartridge is set in metal shell, metal cartridge contacts with pcb board, is dispersed in the air after the heat that pcb board is produced imports surface of shell by metal cartridge, finish the heat radiation process, the pcb board temperature is reduced to air themperature by 70 ℃ keep balance, improved the working environment of light emitting diode, the serviceable life of having improved light emitting diode.
Description of drawings
Fig. 1 is the structural representation that the present invention has the LED pixel module set casing of heat sinking function.
Among the figure 1, shell; 2, metal cartridge; 3, pcb board; 4, light emitting diode.
Embodiment
Embodiments of the invention are described in detail in conjunction with the accompanying drawings, but protection scope of the present invention is not limit by embodiment.
The present invention has the LED pixel module set casing of heat sinking function, it is the box-shaped shell 1 that is cast into by metal material, being provided with a plurality of metal cartridges 2 in the shell 1 constitutes, metal cartridge 2 forms for one die casting with shell 1, the upper end surface of each metal cartridge 2 is in same surface level, and the pcb board 3 that driving circuit and light emitting diode 4 are installed contacts with metal cartridge 2.Wherein metal material is any one in aluminium, magnesium, copper, the zinc.
Claims (4)
1, the LED pixel module set casing that has heat sinking function, it is characterized in that it is to be made of the interior metal cartridge (2) that is provided with of shell (1), shell (1) that metal material is cast into, the pcb board (3) that driving circuit and light emitting diode (4) are installed contacts with metal cartridge (2).
2, the LED pixel module set casing with heat sinking function according to claim 1 is characterized in that described metal is any one in aluminium, magnesium, copper, the zinc.
3, the LED pixel module set casing with heat sinking function according to claim 1 is characterized in that described metal cartridge (2) and shell (1) form for one die casting.
4, the LED pixel module set casing with heat sinking function according to claim 1, the upper end surface that it is characterized in that each metal cartridge (2) is in same surface level.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100474696A CN100461387C (en) | 2006-08-17 | 2006-08-17 | LED pixel module set casing with heat dissipating function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100474696A CN100461387C (en) | 2006-08-17 | 2006-08-17 | LED pixel module set casing with heat dissipating function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1909029A true CN1909029A (en) | 2007-02-07 |
| CN100461387C CN100461387C (en) | 2009-02-11 |
Family
ID=37700130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100474696A Expired - Fee Related CN100461387C (en) | 2006-08-17 | 2006-08-17 | LED pixel module set casing with heat dissipating function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100461387C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101394205B1 (en) * | 2010-06-09 | 2014-05-14 | 에스케이하이닉스 주식회사 | Semiconductor packag |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5857767A (en) * | 1996-09-23 | 1999-01-12 | Relume Corporation | Thermal management system for L.E.D. arrays |
| JP3830429B2 (en) * | 2002-07-08 | 2006-10-04 | 京セラ株式会社 | Package for storing semiconductor elements |
| CN2689457Y (en) * | 2004-02-25 | 2005-03-30 | 周珑 | LED luminescent device for signal light |
| CN1705142A (en) * | 2004-06-02 | 2005-12-07 | 百容电子股份有限公司 | Light emitting diode device with highly effective heat radiation effect |
| CN2756953Y (en) * | 2004-12-03 | 2006-02-08 | 江珏 | LED lamp body |
-
2006
- 2006-08-17 CN CNB2006100474696A patent/CN100461387C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN100461387C (en) | 2009-02-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090211 Termination date: 20140817 |
|
| EXPY | Termination of patent right or utility model |