CN1897242A - 用于半导体器件制造的测量工具的校准方法和系统 - Google Patents
用于半导体器件制造的测量工具的校准方法和系统 Download PDFInfo
- Publication number
- CN1897242A CN1897242A CN200510027816.4A CN200510027816A CN1897242A CN 1897242 A CN1897242 A CN 1897242A CN 200510027816 A CN200510027816 A CN 200510027816A CN 1897242 A CN1897242 A CN 1897242A
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- China
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- group
- calibration criterion
- calibration
- measured value
- measuring system
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Links
- 238000000034 method Methods 0.000 title claims abstract description 77
- 238000004519 manufacturing process Methods 0.000 title description 16
- 230000007246 mechanism Effects 0.000 claims description 31
- 235000012431 wafers Nutrition 0.000 claims description 20
- 238000005516 engineering process Methods 0.000 claims description 18
- 230000009021 linear effect Effects 0.000 claims description 7
- 238000005259 measurement Methods 0.000 abstract description 29
- 230000008569 process Effects 0.000 abstract description 6
- 239000004065 semiconductor Substances 0.000 description 15
- 230000008901 benefit Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000005555 metalworking Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003203 everyday effect Effects 0.000 description 2
- 239000003595 mist Substances 0.000 description 2
- 230000008520 organization Effects 0.000 description 2
- 238000007619 statistical method Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- SAVYTRKCUVDEFC-UHFFFAOYSA-N 2-[methyl-[methyl(propan-2-yloxy)phosphoryl]oxyphosphoryl]oxypropane Chemical compound CC(C)OP(C)(=O)OP(C)(=O)OC(C)C SAVYTRKCUVDEFC-UHFFFAOYSA-N 0.000 description 1
- 238000001134 F-test Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- 230000000737 periodic effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/401—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for measuring, e.g. calibration and initialisation, measuring workpiece for machining purposes
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37008—Calibration of measuring system, probe, sensor
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37224—Inspect wafer
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
Abstract
Description
总不确定性 | |
工具A | 0.002129 |
工具B | 0.003960 |
工具C | 0.002599 |
工具D | 0.002319 |
p-值 | df | |
工具Av.B | 0.0001 | 599 |
工具Av.C | 0.0001 | 599 |
工具Av.D | 0.0182 | 599 |
Claims (22)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100278164A CN100461361C (zh) | 2005-07-14 | 2005-07-14 | 用于半导体器件制造的测量工具的校准方法 |
US11/193,016 US8044668B2 (en) | 2005-07-14 | 2005-07-29 | Method and system for calibrating measurement tools for semiconductor device manufacturing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100278164A CN100461361C (zh) | 2005-07-14 | 2005-07-14 | 用于半导体器件制造的测量工具的校准方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1897242A true CN1897242A (zh) | 2007-01-17 |
CN100461361C CN100461361C (zh) | 2009-02-11 |
Family
ID=37609703
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100278164A Expired - Fee Related CN100461361C (zh) | 2005-07-14 | 2005-07-14 | 用于半导体器件制造的测量工具的校准方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8044668B2 (zh) |
CN (1) | CN100461361C (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103954927A (zh) * | 2014-05-21 | 2014-07-30 | 常州天合光能有限公司 | 体积电阻与方块电阻转换校准装置及其校准方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070046954A1 (en) * | 2005-08-24 | 2007-03-01 | Asml Netherlands B.V. | Method of verifying consistent measurement between a plurality of CD metrology tools |
US10725138B2 (en) * | 2015-12-11 | 2020-07-28 | Infineon Technologies Ag | Scattering parameter calibration to a semiconductor layer |
JP6566897B2 (ja) * | 2016-03-17 | 2019-08-28 | 東京エレクトロン株式会社 | 制御装置、基板処理システム、基板処理方法及びプログラム |
CN112054375B (zh) * | 2020-09-11 | 2021-11-09 | 山东大学 | 一种电子-声子耦合的高集成全固态激光波长调控方法及激光器 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5920067A (en) * | 1992-03-13 | 1999-07-06 | The United States Of America As Represented By The Secretary Of Commerce | Monocrystalline test and reference structures, and use for calibrating instruments |
US5557267A (en) * | 1993-04-23 | 1996-09-17 | Ade Corporation | Apparatus and methods for measurement system calibration |
US5539305A (en) * | 1994-10-03 | 1996-07-23 | Botka; Julius K. | Calibration board for an electronic circuit tester |
US6016684A (en) * | 1998-03-10 | 2000-01-25 | Vlsi Standards, Inc. | Certification of an atomic-level step-height standard and instrument calibration with such standards |
US6532428B1 (en) * | 1999-10-07 | 2003-03-11 | Advanced Micro Devices, Inc. | Method and apparatus for automatic calibration of critical dimension metrology tool |
US6815964B2 (en) * | 2000-12-29 | 2004-11-09 | Stmicroelectronics S.R.L. | Test board de-embedding method to improve RF measurements accuracy on an automatic testing equipment for IC wafers |
US6762418B2 (en) * | 2001-03-13 | 2004-07-13 | Advanced Cardiovascular Systems, Inc. | Calorimetry as a routine dosimeter at an electron beam processing facility |
US6654698B2 (en) * | 2001-06-12 | 2003-11-25 | Applied Materials, Inc. | Systems and methods for calibrating integrated inspection tools |
US7698012B2 (en) * | 2001-06-19 | 2010-04-13 | Applied Materials, Inc. | Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing |
US6762832B2 (en) * | 2001-07-18 | 2004-07-13 | Air Liquide America, L.P. | Methods and systems for controlling the concentration of a component in a composition with absorption spectroscopy |
US6890773B1 (en) * | 2002-04-19 | 2005-05-10 | Advanced Micro Devices, Inc. | Dynamic maintenance of manufacturing system components |
US7027146B1 (en) * | 2002-06-27 | 2006-04-11 | Kla-Tencor Technologies Corp. | Methods for forming a calibration standard and calibration standards for inspection systems |
US6674092B1 (en) * | 2002-07-12 | 2004-01-06 | Lsi Logic Corporation | Thin film CMOS calibration standard having protective cover layer |
US7262865B2 (en) * | 2004-02-26 | 2007-08-28 | Applied Materials, Inc. | Method and apparatus for controlling a calibration cycle or a metrology tool |
US6963209B1 (en) * | 2004-07-23 | 2005-11-08 | Teradyne, Inc. | Apparatus and method for calibrating equipment for high frequency measurements |
US7361941B1 (en) * | 2004-12-21 | 2008-04-22 | Kla-Tencor Technologies Corporation | Calibration standards and methods |
-
2005
- 2005-07-14 CN CNB2005100278164A patent/CN100461361C/zh not_active Expired - Fee Related
- 2005-07-29 US US11/193,016 patent/US8044668B2/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103954927A (zh) * | 2014-05-21 | 2014-07-30 | 常州天合光能有限公司 | 体积电阻与方块电阻转换校准装置及其校准方法 |
CN103954927B (zh) * | 2014-05-21 | 2016-03-23 | 常州天合光能有限公司 | 体积电阻与方块电阻转换校准装置及其校准方法 |
Also Published As
Publication number | Publication date |
---|---|
US20070013388A1 (en) | 2007-01-18 |
US8044668B2 (en) | 2011-10-25 |
CN100461361C (zh) | 2009-02-11 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20111129 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20111129 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Co-patentee after: Semiconductor Manufacturing International (Beijing) Corporation Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090211 Termination date: 20180714 |