CN1896295A - LCP substrate sputtering coating treatment against EMI coating - Google Patents
LCP substrate sputtering coating treatment against EMI coating Download PDFInfo
- Publication number
- CN1896295A CN1896295A CN 200510035830 CN200510035830A CN1896295A CN 1896295 A CN1896295 A CN 1896295A CN 200510035830 CN200510035830 CN 200510035830 CN 200510035830 A CN200510035830 A CN 200510035830A CN 1896295 A CN1896295 A CN 1896295A
- Authority
- CN
- China
- Prior art keywords
- plated film
- sand
- lcp
- primary coat
- lcp substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
A pretreatment method of LCP substrate before sputtering the EMI resistance coat EMI includes the following steps: sandblasting the surface with emery of 180# at the pressure of 0.02 to 0.05MP, cleaning the sandblasted surface with ultrasonic, coating the cleaned surface with a bright or non-bright basecoat of 5-20 mum and curing by UV. In this pretreatment process, a microcosmic rough surface is formed on the LCP substrate surface via sandblasting, which rivets the film to the substrate mechanically, increases the adhesive force and solves the adhesion and application problem of vacuum sputtering on LCP substrate. The basecoat not only increases the adhesion of the film, but also assures the homogeneity, decreases the unit impedance and increases the EMI resistance.
Description
Technical field
The present invention relates to a kind of solution and coating method, particularly relate to the plated film pre-treating process in the jet-plating method with vacuum sputtering.
Background technology
Electromagnetic compatibility (Electromagnetic Compatibility), abbreviation EMC just is meant that certain electronics neither disturbs miscellaneous equipment, also is not subjected to the influence of miscellaneous equipment simultaneously.Electromagnetic compatibility is the same with the security that we are familiar with, and is one of most important index of quality product.Security relates to the person and property, and electromagnetic compatibility then relates to the person and environment protection.Hertzian wave can with the electronic component effect, produce interference phenomenon, be called electromagnetic interference (Electromagnetic Interference), be called for short EMI.
The miniaturization of equipment makes source and sensor lean on very closely.This shortens travel path, has increased the interferential chance.Miniaturization of devices has increased them to the interferential susceptibility.Because equipment is more and more littler and be easy to carry, and is available everywhere as equipment such as mobile telephone, notebook computers, and not necessarily be confined to the such controlled environment of office.This has also brought the protection question of electromagnetic interference.For example, many automobiles are equipped with a large amount of electronic circuit that comprises slip control system, if the mobile telephone of automobile inside and the mutual interference mutually of this Controlling System then can cause flase operation; In addition, notebook computer, products such as ADSL and mobile telephone all can influence communication quality because of the high-frequency electromagnetic wave excitation produces noise.
Traditionally, electronic circuit is contained in the can, and this can provide shielding effect by the path that disseminates that cuts off electromagnetic energy.Now, for weight reduction, reduce cost, adopt plastic material to make member more and more, as case member etc.The plastic cement member is transparent to electromagnetic interference, so susceptible device susceptor is in unshielded state, and modal terms of settlement is at component surface plating one deck EMI protective film.
It is low that the chemical preparation process of protective film has price, processing ease, and the rete tack is advantage preferably, but because a large amount of harmful waste water dischargings is arranged in process of production, very big to the pollution of environment.
Vacuum coating technology, be called physical coating or physical vapor deposition (Physical VaporDeposition again, be called for short PVD) technology, be meant that under vacuum condition the method with physics is vaporized into material atom, molecule or makes it be ionized into ion, and pass through gas phase process, having the technology of the film of some property at material or workpiece surface deposition one deck, is a kind of more advanced film coating method now, as sputter, evaporation, ion plating etc.
Vacuum sputtering coating abbreviates sputter as, is a kind of physical coating technology very commonly used.Compare with traditional electroplating technology, but have pollution-free, low-cost, technology simple, can plate advantages such as the many metal cladding kinds of plastics kind are wide.The character of sputtering thin film, uniformity coefficient all than evaporated film come good.
The present invention mainly is the improvement to pre-treating process in the physically splash plating method of engineering plastics base material, and particularly for the LCP material, the full name of LCP is liquid crystalline polymers (Liquid Crystal Polyester).Because the singularity of LCP material in the plated film pre-treatment, sandblasts if directly the LCP base material is adopted, roughened surface can make rete and base material form mechanical riveted in plated film, but because the path of impulse of current is long, the EMI suppression effect is poor; In addition, the LCP base material usually can be mixed with fiber in moulding process, and in the plated film pre-treatment, the single processing of sandblasting makes the fiber of substrate surface expose on the contrary, has reduced the tack of base material and rete.
Summary of the invention
The purpose of this invention is to provide a kind of physical coating method that is used for the vacuum sputtering of plastic basis material, thereby improve the physical coating pre-treating process of processing parameter and equipment raising rete tack.
To achieve the above object, technical scheme of the present invention is as follows:
A kind of pre-treating process of LCP substrate sputtering EMI suppression plated film comprises the steps:
The treatment step that sandblasts, under 0.02 to 0.05MPa air pressure, with the corundum sand of 180# to the substrate surface processing of sandblasting;
Cleaning step, the substrate surface that has sandblasted and handled with ultrasonic cleaning;
The primary coat step, the substrate surface last layer primary coat after cleaning, primary coat can be bright or cloudy surface, and gauge control is solidified through UV at 5 to 20 μ m again.
The pre-treating process of described LCP substrate sputtering EMI suppression plated film, wherein, in the described treatment step that sandblasts, the corundum of employing sand is the brown corundum grains of sand.
The pre-treating process of described LCP substrate sputtering EMI suppression plated film, wherein, in the described treatment step that sandblasts, the corundum of employing sand is the white fused alumina grains of sand.
The pre-treating process of described LCP substrate sputtering EMI suppression plated film, wherein, in the described treatment step that sandblasts, the high speed palm fibre corundum grains of sand that adopt the air pressure of 0.025MPa and 180# are to the substrate surface processing of sandblasting.
The pre-treating process of described LCP substrate sputtering EMI suppression plated film, wherein, spraying method is adopted in described primary coat.
The pre-treating process of described LCP substrate sputtering EMI suppression plated film, wherein, described primary coat is adopted and is soaked the method for crossing.
Adopt physical coating method of the present invention, in pre-treatment, carrying out texturing by sandblasting at the LCP substrate surface handles, thereby form a micro-rough surface, in vacuum sputtering coating technology, make to form mechanical riveted between rete and the base material, help strengthening the sticking power between rete and the base material, for realizing that on the LCP base material vacuum splashing and plating has solved the tack problem, guarantee the application of sputtering process on the LCP base material; Primary coat has not only strengthened the tack between rete and the base material, and behind the plated film, guarantees even film layer, has reduced the unit impedance of rete, strengthens the EMI suppression effect of rete; And adopt thickness is the primary coat of 5 to 20 μ m, is because of the too thin poor effect of primary coat, the too thick cost that then increases.
Description of drawings
Below in conjunction with accompanying drawing,, will make technical scheme of the present invention and other beneficial effects apparent by the specific embodiment of the present invention is described in detail.
Fig. 1 is the profile of plastic basis material plated film finished product of the present invention.
Embodiment
For further understanding feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet appended graphic only provide with reference to and the explanation usefulness, be not to be used for the present invention is limited.
Referring to Fig. 1, film coating method of the present invention comprises the steps:
Pre-treatment, carrying out fine and clean texturing by sandblasting on the surface of LCP base material 1 handles, thereby form a micro-rough surface 11, in vacuum sputtering coating technology, make rete 3 by forming mechanical riveted between undercoat 2 and the base material 1, help strengthening the sticking power between rete 3 and the base material 1, avoid undercoat 2 shortcomings such as pit, poor adhesive force to occur; Thereby, for realizing that on the LCP base material vacuum splashing and plating has solved the tack problem, guaranteeing the application of sputtering process on the LCP base material, pre-treatment is also bigger to the influence of paint adhesion;
Clean, the grains of sand of the substrate surface that washing sandblasts handles, commonly used is to use ultrasonic cleaning;
Primary coat, at base material 1 top layer last layer undercoat 2, primary coat can be bright or cloudy surface, gauge control is at 5-20 μ m, during the primary coat construction, can adopt spraying (spray), also can adopt immersion plating (or to claim dip-coating, Dipping), specifically should look the base material size, shape, particular case such as structure and user equipment and client's specification of quality and deciding carries out UV again and solidifies, and UV is the abbreviation of English Ultraviolet Rays, it is ultraviolet light, the UV ray is handled has the ability that changes many polymer surfaces physicochemical characteristics, and undercoat produces living radical or radical ion through after absorbing the high-intensity ultraviolet light in ultraviolet ray (UV) uv equipment, thereby initiated polymerization, crosslinked and graft reaction is converted into solid-state at short notice by liquid state;
Plated film adopts vacuum sputtering physical coating method to plate the copper film 3 that thickness is approximately 0.5 μ m again on the surface, is used for EMI suppression.
[embodiment 1]
A kind of film coating method of LCP base material comprises the steps:
The treatment step that sandblasts, under the air pressure of 0.02MPa, with the white fused alumina grains of sand of 180# to the substrate surface processing of sandblasting;
Cleaning step with the substrate surface that ultrasonic cleaning has sandblasted and handled, is washed the substrate surface grains of sand off;
Primary coat step, the substrate surface after cleaning are with the primary coat of spraying method last layer, and primary coat can be bright or cloudy surface, and gauge control is solidified through UV at 5 μ m again;
Plated film adopts vacuum sputtering physical coating method to plate the copper film that thickness is approximately 0.5 μ m again on the surface.
[embodiment 2]
A kind of film coating method of LCP base material comprises the steps:
The treatment step that sandblasts, under the air pressure of 0.05MPa, with the brown corundum grains of sand of 180# to the substrate surface processing of sandblasting;
Cleaning step with the substrate surface that ultrasonic cleaning has sandblasted and handled, is washed the substrate surface grains of sand off;
The primary coat step, the substrate surface after cleaning is with the primary coat of dip-coating mode last layer, and primary coat can be bright or cloudy surface, and gauge control is solidified through UV at 20 μ m again;
Plated film adopts vacuum sputtering physical coating method to plate the copper film that thickness is approximately 0.5 μ m again on the surface.
[most preferred embodiment]
A kind of film coating method of LCP base material comprises the steps:
The treatment step that sandblasts, under the air pressure of 0.025MPa, with the high speed palm fibre corundum grains of sand of 180# to the substrate surface processing of sandblasting;
Cleaning step with the substrate surface that ultrasonic cleaning has sandblasted and handled, is washed the substrate surface grains of sand off;
Primary coat step, the substrate surface after cleaning are with the primary coat of spraying method last layer, and primary coat can be bright or cloudy surface, and gauge control is solidified through UV at 5 μ m again;
Plated film adopts vacuum sputtering physical coating method to plate the copper film that thickness is 0.5 μ m again on the surface.
As known by the technical knowledge, the present invention can realize by other the embodiment that does not break away from its spirit or essential feature.Therefore, above-mentioned disclosed embodiment with regard to each side, all just illustrates, and is not only.All within the scope of the present invention or the change in being equal to scope of the present invention all be included in the invention.
Claims (6)
1, a kind of pre-treating process of LCP substrate sputtering EMI suppression plated film comprises the steps:
The treatment step that sandblasts, under 0.02 to 0.05MPa air pressure, with the corundum sand of 180# to the substrate surface processing of sandblasting;
Cleaning step, the substrate surface that has sandblasted and handled with ultrasonic cleaning;
The primary coat step, the substrate surface last layer primary coat after cleaning, primary coat can be bright or cloudy surface, and gauge control is solidified through UV at 5 to 20 μ m again.
2, the pre-treating process of LCP substrate sputtering EMI suppression plated film according to claim 1 is characterized in that, in the described treatment step that sandblasts, the corundum of employing sand is the brown corundum grains of sand.
3, the pre-treating process of LCP substrate sputtering EMI suppression plated film according to claim 1 is characterized in that, in the described treatment step that sandblasts, the corundum of employing sand is the white fused alumina grains of sand.
4, the pre-treating process of LCP substrate sputtering EMI suppression plated film according to claim 1 is characterized in that, in the described treatment step that sandblasts, under the air pressure of 0.025MPa, with the high speed of the 180# palm fibre corundum grains of sand to the substrate surface processing of sandblasting.
5, the pre-treating process of LCP substrate sputtering EMI suppression plated film according to claim 1 is characterized in that, spraying method is adopted in described primary coat.
6, the pre-treating process of LCP substrate sputtering EMI suppression plated film according to claim 1 is characterized in that, described primary coat is adopted and soaked the method for crossing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510035830 CN1896295A (en) | 2005-07-11 | 2005-07-11 | LCP substrate sputtering coating treatment against EMI coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510035830 CN1896295A (en) | 2005-07-11 | 2005-07-11 | LCP substrate sputtering coating treatment against EMI coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1896295A true CN1896295A (en) | 2007-01-17 |
Family
ID=37608940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510035830 Pending CN1896295A (en) | 2005-07-11 | 2005-07-11 | LCP substrate sputtering coating treatment against EMI coating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1896295A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110049902A (en) * | 2016-12-08 | 2019-07-23 | 欧拓管理公司 | Surface applicator for external decorating member |
-
2005
- 2005-07-11 CN CN 200510035830 patent/CN1896295A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110049902A (en) * | 2016-12-08 | 2019-07-23 | 欧拓管理公司 | Surface applicator for external decorating member |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2018214452A1 (en) | Substrate-moving type apparatus and method for preparing nano coating by means of plasma discharge | |
| EP3674438B1 (en) | Preparation method for high insulation nano-protective coating having modulation structure | |
| CN107587119B (en) | A kind of preparation method of the high insulating rigid nano protecting coating of composite construction | |
| CN107142465B (en) | A method of cycle small-power continuous discharge prepares multi-functional nano protecting coating | |
| WO2019037442A1 (en) | Preparation method for organosilicon nano-protective coating | |
| CN107142466B (en) | A kind of method that small-power continuous discharge prepares multi-functional nano protecting coating | |
| US20110123740A1 (en) | Method for making device housing, and device housing | |
| WO2019037443A1 (en) | Preparation method for organosilicon hard nano-protective coating | |
| CN1481448A (en) | Plating method of metal film on surface of polymer | |
| US10934617B2 (en) | Metal coating of objects using plasma polymerisation pretreatment | |
| US20120045614A1 (en) | Coating, article coated with coating, and method for manufacturing article | |
| Lee et al. | Investigation of brittle failure in transparent conductive oxide and permeation barrier oxide multilayers on flexible polymers | |
| WO2018214449A1 (en) | Method for preparing multi-functional protective nano coating by means of cyclical large-duty-ratio pulse discharge | |
| EP3186416B1 (en) | Treatment for electroplating racks to avoid rack metallization | |
| CN1939756A (en) | Plastic surface treatment with metal character and three-dimensional pattern effect | |
| CN1940121A (en) | Physical coating pretreatment for coating metal-film on plastic matrix | |
| CN1896295A (en) | LCP substrate sputtering coating treatment against EMI coating | |
| KR101563553B1 (en) | The exterior surface of the protective film layer is also high hardness and a manufacturing method | |
| US11185883B2 (en) | Methods for preparing nano-protective coating | |
| CN1940126A (en) | Sputtering coating method for high-shielding thin-film against electromagnetic interference on plastic matrix | |
| CN111826615A (en) | Method for coating brass or zinc alloy substrate | |
| CN1896294A (en) | Pretreatment of physical coating on PC/ABS plastic substrate | |
| US20120118627A1 (en) | Electromagnetic shielding article and method for manufacturing same | |
| CN101784692B (en) | Process for manufacturing multi-layered thin film by dry vacuum vapor deposition | |
| CN106048610B (en) | A method of nano ceramic coat interface is prepared in ABS product surface |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |