CN1876509A - Method of installing ic tag in packaged commodity - Google Patents
Method of installing ic tag in packaged commodity Download PDFInfo
- Publication number
- CN1876509A CN1876509A CNA2006100916352A CN200610091635A CN1876509A CN 1876509 A CN1876509 A CN 1876509A CN A2006100916352 A CNA2006100916352 A CN A2006100916352A CN 200610091635 A CN200610091635 A CN 200610091635A CN 1876509 A CN1876509 A CN 1876509A
- Authority
- CN
- China
- Prior art keywords
- tag
- lining paper
- transparent resin
- mentioned
- commodity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
- B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
- B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
- B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
- B65D75/36—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed
- B65D75/366—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed and forming one compartment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D2203/00—Decoration means, markings, information elements, contents indicators
- B65D2203/10—Transponders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D2575/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes or webs of flexible sheet material, e.g. in folded wrappers
- B65D2575/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by association or interconnecting two or more sheets or blanks
- B65D2575/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
- B65D2575/36—One sheet or blank being recessed and the other formed or relatively stiff flat sheet material, e.g. blister packages
- B65D2575/361—Details
- B65D2575/362—Details with special means for gaining access to the contents
- B65D2575/367—Details with special means for gaining access to the contents through a preformed opening in the flat sheet, e.g. the opening being defined by weakened lines
Abstract
The invention provides a method of installing IC tag in packaged commodity. An IC tag is installed in a blister pack in which a commodity is stored in a cavity formed in a transparent resin sheet and the periphery of the transparent resin sheet is joined to a backing sheet. The antenna of the IC tag or the connection line in connection with its IC chip is provided at the joint location between the transparent resin sheet and the backing sheet. Once the connection between the transparent resin sheet and the backing sheet is broken and the commodity is taken out, the antenna or the connection line is broken, which disables the IC tag. Therefore, an unlawful item that cannot be identified from its appearance is detected by accessing the IC tag using a reader/writer.
Description
Technical field
The present invention relates to IC tag and be installed to method on the package goods, IC tag is installed on the packing container of package goods, be used for merchandise control, sales management etc.
Background technology
As the packaged configuration of the more small-sized commodity of packing ratio, be extensive use of blister package (blisterpack).Blister package is suitable for the suspention display, by displaying along hanging many commodity on the bar-shaped suspension hook of the depth direction setting of display rack, a plurality of kinds can be disposed three-dimensionally, effect and the effect that can enlarge commercial space can be obtained from transparency cover visuognosis commodity.
But blister package is taken out commodity owing to take packing easily apart, therefore counterfeit merchandise is packaged in the used blister package, similarly is that the example of packing and selling is a lot of like that for certified products.Because it is the same with certified products that the outward appearance of counterfeit merchandise is made into, be to judge that by the difference that is imprinted on lip-deep comment of packaging body or mark etc. it is a counterfeit merchandise mostly therefore, if but packaging body is a certified products, then extremely difficulty is distinguished mutually with counterfeit merchandise.Certainly the customer can sustain a loss because of counterfeit merchandise, but the quantity of counterfeit merchandise is many more, and the loss that the manufacturer of commodity is subjected to is also big more, and counterfeit merchandise is extremely serious problem concerning manufacturer.
Therefore, the be opened measure of this situation of the packing that is necessary to take to clearly illustrate that commodity, as a kind of means of identification that packing is opened, we have known that the part that keeps commodity or its packing is by the anti-tamper bonding mark (with reference to TOHKEMY 2003-084672 communique) from the vestige of preposition strip off.
And following scheme proposed: IC tag is installed to the structure that constitutes identification certified products and counterfeit merchandise on commodity and the packaging body thereof, if take off IC tag, its defunctionalization then.For example, we know when peelling off when sticking on the IC tag of being adorned on the thing, have just destroyed to constitute the IC chip of IC tag and be connected (with reference to the TOHKEMY 2001-167240 communique) of antenna.
Blister package is made of the lining paper made of paper or resinous and the transparency cover of recess that forms the volume of the commodity of can packing on the transparent resin thin slice, packs into commodity in the recess and the periphery of transparency cover is joined to and finish commodity packaging on the lining paper.Juncture between lining paper and the transparency cover can use embedded structure, bail (staple) is fixing, bonding or welding etc., but need make separating easily between lining paper and the transparency cover, so that the customer takes out commodity easily.This structure also becomes the blister package of taking out behind the commodity by one of reason of bad utilization.
This blister package be difficult to be suitable for the anti-tamper bonding mark that prior art relates to or to peel off the decomposition IC tag.Because the part of strip off transparency cover is taken out when making transparency cover get back to original position behind the commodity and can be fitted to like clockwork on the same position from lining paper, therefore be difficult to clearly represent the vestige of being stripped from anti-tamper bonding mark.And, peeling off under the situation of decomposing IC tag, decompose owing to produce during from paste position strip off IC tag, therefore be difficult to be applicable to that the structure that transparency cover engages with lining paper is blister package.
Summary of the invention
Therefore, the present invention is exactly in view of above-mentioned prior art problems, and purpose is to provide a kind of IC tag to be installed to method on the package goods, makes the function stop of IC tag when the transparency cover of blister package separates with lining paper, prevents imitation or counterfeit.
In order to achieve the above object, the 1st scheme of the present invention is that a kind of IC tag is installed to the method on the package goods, it will possess IC chip and the IC tag by the coupled antenna of connection lead, be installed to and accommodate on the transparent resin thin slice in the formed recess and the periphery of transparent resin thin slice is engaged in the blister package that forms with above-mentioned lining paper being configured in commodity on the lining paper, and the antenna or the connection lead of above-mentioned IC tag partly is configured on the faying face of above-mentioned transparent resin thin slice and above-mentioned lining paper.
If adopt above-mentioned installation method, because the antenna part or the connection lead of IC tag partly are configured on the face of joint of transparent resin thin slice and lining paper, therefore when peeling the transparent resin thin slice from lining paper, form the antenna or the connection lead fracture of film like, therefore the function stop of IC tag can judge by the action of confirming IC tag whether blister package was opened.
Perhaps, in order to achieve the above object, the 2nd scheme of the present invention is that a kind of IC tag is installed to the method on the package goods, the IC tag that it will possess the IC chip and pass through the coupled antenna of connection lead, being installed to the commodity that will be configured on the lining paper accommodates on the transparent resin thin slice in the formed recess and the periphery of transparent resin thin slice is engaged with above-mentioned lining paper and is formed for taking out in the blister package that the poroid wiring of commodity forms, across the antenna or the connection lead part that are formed on the above-mentioned IC tag of poroid wiring ground configuration on the above-mentioned lining paper with the corresponding position of above-mentioned recess at lining paper.
If adopt above-mentioned installation method, when a part of tearing lining paper from poroid wiring is taken out commodity, because across the antenna or the connection lead fracture of poroid wiring, therefore the function stop of IC tag just can judge by the action of confirming IC tag whether blister package was opened.
Perhaps, in order to achieve the above object, the 3rd scheme of the present invention is that a kind of IC tag is installed to the method on the package goods, the IC tag that it will possess the IC chip and pass through the coupled antenna of connection lead, being installed to the commodity that will be configured on the lining paper accommodates on the transparent resin thin slice in the formed recess and the periphery of transparent resin thin slice is engaged with above-mentioned lining paper and is formed for taking out in the blister package that the poroid wiring of commodity forms with the corresponding position of above-mentioned recess at lining paper, the part of above-mentioned antenna is configured on the face of joint of above-mentioned transparent resin thin slice and above-mentioned lining paper, and across disposing antenna or connection lead part with being formed on poroid wiring on the lining paper.
If adopt above-mentioned installation method, no matter be under the situation of tearing poroid wiring taking-up commodity or under the situation of the taking-up of strip off transparent resin thin slice from lining paper commodity, antenna or connection lead all rupture, and therefore the function with which kind of method taking-up commodity IC tag all stops.Therefore just can judge by the action of confirming IC tag whether blister package was opened.
And, in above-mentioned various installation methods, when lining paper forms with the material sheet material identical with the transparent resin thin slice, lining paper and transparent resin thin slice are when the blister package of chimeric bonding clam shell (flip) the formula structure of periphery, because transparent resin thin slice and lining paper are embedded structure or pass through welded joint, therefore when the strip off bonding part, form the antenna or the connection lead fracture of film or produce damage, shell makes the function stop of IC tag.
Address above-mentioned purpose or characteristic in addition on of the present invention, if should be able to be further understood with reference to following detailed description and accompanying drawing.
Description of drawings
Fig. 1 is the block diagram of structure of the blister package of expression the 1st example.
Fig. 2 is the birds-eye view of the structure example of expression IC tag.
Fig. 3 A～Fig. 3 B represents the structure of the blister package of the 2nd example, and Fig. 3 A is the birds-eye view of a positive side, and Fig. 3 B is the birds-eye view of the back side one side.
The specific embodiment
Below with reference to Fig. 1～Fig. 3 B example of the present invention is described.In addition, the example of the following stated does not limit technical scope of the present invention for specializing an example of the present invention.
Fig. 1 represents the blister package A of the 1st example of the present invention, be constituted as, commodity 10 are accommodated in the recess 2a that is formed on the transparent resin thin slice 2, the periphery of transparent resin thin slice 2 is engaged with lining paper 3, make the suspension eye 3a that forms on the lining paper 3 can pass the suspension hook of display rack and hang display.
Be pasted with on the above-mentioned lining paper 3 as the IC tag 1 that forms sheet as shown in Figure 2, record required information such as merchandise control, material requirements planning.Methods such as IC tag 1 usefulness screen printing or vacuum metallizing form coiling shape antenna 6 on transparent membrane, IC chip 7 is connected with the connection lead 8 that two ends from antenna 6 prolong formation.Because IC chip 7 constitutes memory device or control circuit etc. as integrated circuit, therefore constitute, by antenna 6 receive the electric wave of read write lines output and the effect of the small electric power that encouraged move down, will be recorded in the memory device information in response signal flow to the passive label of read write line from antenna 6.
The size of above-mentioned IC tag 1 both can be the be covered size of coating on surface of whole lining paper 3 of its transparent membrane part double as, also can be that image pattern shows like that and the roughly the same size of oad of transparent resin thin slice 2, but the connection lead 8 of antenna 6 or IC chip 7 and antenna 6 be configured in the position that transparent resin thin slice 2 is joined to the junction surface on the lining paper 3.
Because the commodity of packing with blister package A 10 can take out by strip off transparent resin thin slice from lining paper 32, therefore occurred much not damaging blister package A ground strip off transparent resin thin slice 2 on the market and taken out commodity, reinstalled counterfeit goods and make packed state return to the imitation of original state.But in this structure, if engaging of strip off transparent resin thin slice 2 and lining paper 3 then is positioned at the antenna 6 or connection lead 8 fractures of junction, so the function stop of IC tag 1, once be opened so can judge blister package A.
If the outward appearance of packaged commodity is identical, and packaging body is regular product, then only depends on visually can not judge it is illegal merchandises such as imitation.If as this structure, open the structure that bag makes the function stop of IC tag 1 by employing, then utilize read write line to read blister package A, even being regular commodity, outward appearance also can penetrate the actual illegal merchandises such as imitation that are.
Fig. 3 A is the birds-eye view of front one side of the blister package B of expression the 2nd example of the present invention, and in order to make taking-up commodity 10 easy, such dorsal part at lining paper 3 is provided with poroid wiring (ミ シ Application order) 9 shown in the image pattern 3B.Other structure is identical with before this blister package A, and it illustrates omission.
Under the situation of the blister package B that is provided with poroid wiring 9 like this, if being positioned at across the ground, position of poroid wiring 9, the position of antenna 6 or connection lead 8 pastes IC tag 1, when then tearing poroid wiring 9 in order to take out commodity 10 antenna 6 or connection lead 8 also with poroid wiring 9 by tear fracture, so function stop of IC tag 1.
Owing to find easily when tearing poroid wiring 9 to be opened bag, thereby when taking out commodity 10 in order to reach improper purpose, might there be engaging of the transparent resin thin slice 2 that to repair and lining paper 3 by the situation of strip off, therefore preferred except that poroid wiring 9, as the 1st example, make the part of antenna 6 be positioned at the structure of the junction of transparent resin thin slice 2 and lining paper 3 again.
As mentioned above, if adopt words of the present invention, then when the time from blister package taking-up commodity, because the function stop of the IC tag of installing, therefore even the commodity of the non-manufactured such as imitation of non-manufactured are accommodated in the blister package of taking out behind the regular commodity, IC tag is also inoperative, also can not confused by outward appearance even therefore be packaged as regular packing, can judge illegal merchandises such as imitated commodity, can take actv. to prevent the countermeasure of imitation.
The of the present invention concrete example purpose that more than illustrated is for technology contents of the present invention is understood, and non-limiting technical scope, can change enforcement in the scope of technical scheme narration variedly.
Claims (4)
1. an IC tag is installed to the method on the package goods, it is characterized in that,
To possess the IC chip and the IC tag by the coupled antenna of connection lead is installed in the blister package, this blister package is, accommodate on the transparent resin thin slice in the formed recess and the periphery of transparent resin thin slice is engaged with above-mentioned lining paper being configured in commodity on the lining paper
The antenna or the connection lead of above-mentioned IC tag partly are configured on the face of joint of above-mentioned transparent resin thin slice and above-mentioned lining paper.
2. an IC tag is installed to the method on the package goods, it is characterized in that,
To possess the IC chip and the IC tag by the coupled antenna of connection lead is installed in the blister package, this blister package is, accommodate on the transparent resin thin slice in the formed recess and the periphery of transparent resin thin slice is engaged and with above-mentioned lining paper being configured in commodity on the lining paper in the poroid wiring that is formed for taking out commodity with the corresponding position of above-mentioned recess of lining paper
Across the antenna or the connection lead part that dispose above-mentioned IC tag with being formed on poroid wiring on the above-mentioned lining paper.
3. an IC tag is installed to the method on the package goods, it is characterized in that,
To possess the IC chip and the IC tag by the coupled antenna of connection lead is installed in the blister package, this blister package is, accommodate on the transparent resin thin slice in the formed recess and the periphery of transparent resin thin slice is engaged and with above-mentioned lining paper being configured in commodity on the lining paper in the poroid wiring that is formed for taking out commodity with the corresponding position of above-mentioned recess of lining paper
The part of above-mentioned antenna is configured on the face of joint of above-mentioned transparent resin thin slice and above-mentioned lining paper, and across disposing antenna or connection lead part with being formed on poroid wiring on the lining paper.
4. IC tag as claimed in claim 1 or 2 is installed to the method on the package goods, it is characterized in that,
Lining paper is formed by the material sheet material identical with the transparent resin thin slice, and lining paper and transparent resin thin slice are in the chimeric bonding clamshell structure of periphery.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP167116/2005 | 2005-06-07 | ||
| JP2005167116A JP2006341858A (en) | 2005-06-07 | 2005-06-07 | Ic tag attaching method for packaged product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1876509A true CN1876509A (en) | 2006-12-13 |
Family
ID=37509113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006100916352A Pending CN1876509A (en) | 2005-06-07 | 2006-06-07 | Method of installing ic tag in packaged commodity |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20060283748A1 (en) |
| JP (1) | JP2006341858A (en) |
| CN (1) | CN1876509A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111148701A (en) * | 2017-10-04 | 2020-05-12 | 东丽株式会社 | Packaging material and method for producing same, reading device, content management system, breakage detection device, opening detection label, and opening detection system |
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| IL176712A0 (en) * | 2006-07-05 | 2007-10-31 | Michael Cohen Alloro | Medication dispenser |
| WO2008115722A1 (en) * | 2007-03-16 | 2008-09-25 | University Of Pittsburgh - Of The Commonwealth System Of Higher Education | Security for blister packs |
| JPWO2008117544A1 (en) * | 2007-03-28 | 2010-07-15 | 日本電気株式会社 | Inclusion Management Device, Inclusion Management Device Manufacturing Apparatus, Inclusion Management Device Manufacturing Method, and Inclusion Management Method |
| GB0723894D0 (en) * | 2007-12-06 | 2008-01-16 | Quantrelle Packaging Solutions | Display packaging |
| GB0916840D0 (en) * | 2009-09-24 | 2009-11-04 | Bromley Roger | Container and opening means |
| CN102502073A (en) * | 2011-10-09 | 2012-06-20 | 常熟市华海电子有限公司 | Chip packaging tray |
| CN107074420B (en) * | 2014-10-28 | 2020-04-07 | G·西莫内蒂 | Disposable container for valuable articles |
| ITUB20154184A1 (en) * | 2014-10-28 | 2017-04-01 | Gianluca Simonetti | DISPOSABLE CONTAINER FOR PRECIOUS |
| KR102424360B1 (en) * | 2015-06-19 | 2022-07-25 | 삼성전자주식회사 | Electronic apparatus for measuring information about a body of user and operating method thereof |
| JPWO2017057458A1 (en) * | 2015-09-30 | 2018-09-06 | サトーホールディングス株式会社 | Container and container opening state judgment method |
| US9950840B2 (en) | 2016-07-20 | 2018-04-24 | Duracell U.S. Operations, Inc. | Reclosable battery package |
| USD818816S1 (en) | 2016-10-28 | 2018-05-29 | Duracell U.S. Operations, Inc. | Packaging for batteries |
| USD822479S1 (en) | 2016-10-28 | 2018-07-10 | Duracell U.S. Operations, Inc. | Packaging for batteries |
| USD818817S1 (en) | 2016-10-28 | 2018-05-29 | Duracell U.S. Operations, Inc. | Packaging for batteries |
| USD819437S1 (en) | 2016-10-28 | 2018-06-05 | Duracell U.S. Operations, Inc. | Packaging for batteries |
| US11001430B2 (en) | 2017-10-13 | 2021-05-11 | Duracell U.S. Operations, Inc. | Battery package |
| USD880287S1 (en) | 2017-10-13 | 2020-04-07 | Duracell U.S. Operations, Inc. | Battery packaging |
| USD880288S1 (en) | 2017-10-13 | 2020-04-07 | Duracell U.S. Operations, Inc. | Battery packaging |
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| FR2612497B1 (en) * | 1987-03-17 | 1989-12-01 | Svem | PACKAGING FOR THE PACKAGING OF PRODUCTS UNDER A TRANSPARENT FILM, METHOD FOR PRODUCING THE SAME AND DEVICE FOR CARRYING OUT SAID METHOD |
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-
2005
- 2005-06-07 JP JP2005167116A patent/JP2006341858A/en active Pending
-
2006
- 2006-06-07 US US11/448,119 patent/US20060283748A1/en not_active Abandoned
- 2006-06-07 CN CNA2006100916352A patent/CN1876509A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111148701A (en) * | 2017-10-04 | 2020-05-12 | 东丽株式会社 | Packaging material and method for producing same, reading device, content management system, breakage detection device, opening detection label, and opening detection system |
| US11487981B2 (en) | 2017-10-04 | 2022-11-01 | Toray Industries, Inc. | Packing material, method for producing packing material, reading device, stored-article management system, disconnection detection device, unsealing detection label, and unsealing detection system |
Also Published As
| Publication number | Publication date |
|---|---|
| US20060283748A1 (en) | 2006-12-21 |
| JP2006341858A (en) | 2006-12-21 |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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