CN1874878A - 用于陶瓷挤出物的微波硬化系统 - Google Patents
用于陶瓷挤出物的微波硬化系统 Download PDFInfo
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Abstract
一种用来对新形成的陶瓷挤出结构施加微波使其硬化,从而使其在干燥和烧制之前的加工性质获得改进的设备和方法。所述陶瓷体由包含无机原料和具有热胶凝点的粘合剂之类的有机物的塑性可形变材料制成。当所述陶瓷体原材离开挤出机模时,使其通过微波能量场,从而加热至高于有机粘合剂胶凝点的温度。然后使陶瓷体硬化,可以很简便地加工而不发生变形。
Description
发明背景
本发明涉及使用微波能量硬化挤出体(extruded body),从而改进加工,减少在干燥和烧制操作之前与加工相关的变形缺陷的加工系统和方法。更具体来说,本发明使得在湿陶瓷挤出物形成蜂窝型制品时对其进行连续的微波加热更加简便。
将增塑材料混合物挤出成多孔体(即蜂窝体)的过程包括柔软性/变形性(用于成形模塑)和结构完整性(用于保持形状)的精细平衡。这些混合物包含无机陶瓷粉末、粘合剂体系和和液体组分,对这些物质的量进行严密控制,从而在挤出过程中保持低压力/扭矩/温度,同时制得能够在形成时进行处理的自支承体(self-supporting body)。
通常当塑性可形变材料的粘性降低时,湿的成形结构或制品会由于自支承不足而发生崩塌。相反的,当塑性可形变材料的粘性增大以提供自支承时,该材料的成形需要明显更高的成形压力,这意味着需要使用更重的设备,更坚固的成形元件和耐磨部件。
所述种类的塑性可形变材料通常还包含具有热胶凝点的有机粘合剂组分。当温度向着胶凝点升高时,这些材料的粘度减小,但是当达到胶凝点时,粘度会随着温度升高而很快地增大。因此,这种塑性可形变材料倾向于在刚好低于该有机粘合剂的胶凝点的温度下使用和成形。
美国专利第5,223,188号提出了利用这种胶凝反应,在此专利中使用RF或辐射(radio)能量对增塑材料形成的结构体进行加热,以提供改进的湿强度,从而使其具有更好的加工和处理性能。然而,在对挤出结构体均匀施加RF能,防止形成挤出体表面缺陷和控制辐射泄漏方面还具有问题。因此,需要有改进的系统和方法用来对连续移动的湿陶瓷挤出物进行均匀加热,以改进在干燥和烧制之前的加工。
发明简述
本文提供一种用来对新形成的陶瓷挤出结构体施加微波使其硬化,从而使其在干燥和烧制之前的湿强度和加工性质获得充分改进的设备和方法。所述设备包括用来提供频率为100MHz至30GHz的能量的微波源;微波加热器(microwaveapplicator),该微波加热器包括具有流动轴、进口、出口和用来将挤出的陶瓷体沿流动轴输送的支架的室。该微波加热器通过单波导管馈源(single waveguide feed)从微波源接受微波。在挤出机模头末端相邻的位置提供本发明的设备,对湿陶瓷体提供比标准方法更为连续更为均匀的周围空间加热。
本发明可用于任何能够通过挤出来模塑和成形的塑性可形变材料。这些材料的包含无机粉末(即陶瓷原料)和有机成形化合物(即粘合剂、表面活性剂、增塑剂、润滑剂等)的混合物。至少一种有机化合物具有热胶凝点,该化合物通常是粘合剂组分。特别合适的塑性材料是能够形成陶瓷制品的包含堇青石和/或富铝红柱石的混合物。这些混合物的例子是2-60重量%富铝红柱石,30-97%堇青石,还可包含通常最高达10重量%的其他相。在美国专利第3,885,977号中描述了一些用来形成堇青石的陶瓷批料组合物。适合用来形成堇青石配方的具有热胶凝点的粘合剂是纤维素醚粘合剂,例如甲基纤维素和/或甲基纤维素衍生物。
所述陶瓷原料、粘合剂和余下的有机组分与液体载体(通常是水)混合形成增塑的批料。然后将该批料挤压通过模头。挤出机是本领域众所周知的,可包括用来将所述材料压过模头的活塞或螺杆进样器。当陶瓷材料离开挤出机模头时,该材料是长的管状体的形式,其称为“原材”,然后将其切割成形。本发明特别适于挤出陶瓷基材的过程。在现有技术中,这样挤出的原材通常具有低的湿强度,由于孔壁很薄,通常无法牢固地自支承。这使得在随后对原材的加工步骤(即湿加工、剪切和干燥)中难以不由于例如变形造成破坏。
根据本发明,所述陶瓷原材在离开挤出模头之后进入微波能量场中。该原材在暴露于微波的同时以足够的速率移动,使其加热至高于粘合剂胶凝点。这硬化了湿陶瓷体,从而防止其发生松垂或加工变形,这种松垂或加工变形在成形体具有低的湿强度,因此无法完全自支承时是很容易发生的。在本领域中已知有机粘合剂的胶凝是由于聚合物的交联造成的。然而,在本发明硬化的陶瓷体中基本不发生蒸发或失水。这是本发明的一个重要优点,因为因此避免了伴随收缩而产生的缺陷。通过本发明还可获得更高效、更低成本的陶瓷基材形成法。
附图简述
参照以下附图可进一步理解本发明,在图中:
图1是一般地显示根据本发明的微波硬化系统的示意图;
图2是具有由改良的矩形波导组成的室的微波加热器的实施方式的透视图;
图3是沿图2的实施方式的3-3直线的截面图;
图4是沿图2的实施方式中直线5-5的截面图;
图5是显示衰减装置的图2的微波加热器出口端的俯视图;
图6是显示对孔(cell)密度为600孔/英寸,孔壁厚为0.004英寸的堇青石蜂窝状结构的微波加热效果的柱状图;
图7是具有室的微波加热器另一实施方式的透视图,该室由以径向分级结构排列的第一和第二圆柱形部分组成;
图8是沿图7的实施方式的直线8-8的截面图;
图9是沿图7实施方式的直线9-9的截面图。
发明详述
图1以微波硬化系统10的示意图显示了本发明的主要特征。陶瓷原材12离开成形元件或挤出机14,被输送通过微波加热器16。因此,所述微波加热器16位于挤出机14的出口处或模头端,通过该模头元件形成陶瓷原材12之后,该陶瓷原材12立刻暴露于微波能量场。
微波加热器16包括室20和单波导管馈源28。室20具有与用来支承原材12的支架18相结合的进口端22和出口端24。支架18涉及本领域中用来使材料体连续移动的任何装置,优选包括空气轴承(bearing)系统,如美国专利第5,205,991号所述,所述空气轴承系统包括一系列空气轴承支承室,通过与共用的空气输送管道相连的各个导管向这些室提供空气,该专利全文通过参考结合入本文中。
提供与微波源32相连的单波导馈源28,用来接收微波进入微波加热器16。出于设计简化和节约成本的原因,本发明的设备宜使用单波导馈源。
当需要减少在进口端22和出口端24处的微波辐射泄漏时,通常提供衰减装置26。用来减少微波辐射的装置是本领域众所周知的,可包括微波衰减器和扼波器(choke)。通常还在微波源32和波导馈源28之间提供阻抗匹配装置30,用以阻止微波能在相反方向的反射。这些合适的装置包括本领域已知的循环器和短线调谐器(stub tuner)。
微波源32发射频率为100MHz至30GHz的微波。所述微波源32可包括任何合适的微波源,例如磁控管、速调管、行波管、振荡管等。该系统还可装有电源和控制器34用来控制和调节输送到微波加热器16的微波辐射。微波能量以连续的TExy和/或TMxy波导模式(waveguide mode)提供,其中x为0-8,y为1-3。
图2显示适用于本发明微波硬化系统的微波加热器40的实施方式。图3和图4分别显示沿直线3-3和5-5的截面图。微波加热器40包括由矩形波导52组成的室42,该矩形波导52沿其长度弯曲成两个90°的角度,例如形成U形结构。还预期具有正方形波导馈源的正方形波导也适于本发明。
在操作中,大部分的微波能量在两个90°的拐点提供到陶瓷原材12。在第一个拐点,微波能量通过微波提供器(microwave feed)48进入室内,来回穿过陶瓷原材12,然后被54处的短路(short)反射。短路54将能量反射回90°拐点,使其第二次通过陶瓷原材12。微波能量以TE11波导模式在陶瓷原材进口和出口提供。
陶瓷原材12通过圆柱形进口端44和出口端46经过室42。图中显示,陶瓷原材12通过上文讨论的空气轴承支架50输送。优选的是如图5所示在进口端44和出口端46安装衰减装置56(图中仅显示了出口端46)。衰减装置56包括三排平行的螺丝钉(screw),这些在出口端46的空腔46a内围绕着陶瓷原材12,陶瓷原材12通过它们离开。已经发现这种简单的结构是能够有效减少本发明微波辐射的方法。在48提供微波输入口。
制造了具有以下尺寸的实验室规模的微波硬化设备,并使用挤出的堇青石形成材料进行测试。在图4中,A=0.257米,B=0.257米,C=0.096米,D=0.610米,E=0.102米,F=0.154米。微波源是频率为2.45GHz的磁控管和1.8千瓦的电源,例如购自ASTeX的的模型。将堇青石形成材料挤压通过蜂窝状成形模头,形成横截面基本为圆形的管状原材,该横截面的短轴和长轴约为1.5英寸,孔密度为600孔/英寸,孔壁厚度为0.004英寸。出于试验的目的,当陶瓷原材离开挤出机模头时,使该原材以40Ibs/小时的进料速率通过微波加热器。电源在约0瓦(无微波硬化)至600瓦的范围内变化。使用落球弹性试验测量陶瓷原材的硬度。该试验包括使圆形砝码(weight)落在支承的湿蜂窝状结构上。测量该砝码陷入该结构体中的深度。读数高说明结构体软,读数低说明结构体硬。
现在参见图6,图中显示了以毫米为单位的落球弹性试验的结果与以瓦特为单位的功率之间的变化关系。随着微波加热器的功率的增大,落球弹性试验的测量值减小,说明材料在变硬。在大约600瓦时,落球弹性试验结果减少了35%,则说明该陶瓷基础原材的硬度有显著的增大。
使用基于电磁模拟算法的有限差分时域(FDTD)法和Tecplot之类的形象化软件(visualization software),可根据陶瓷挤出材料的介电性质、微波加热器(图4的)和使用915MHz的频率完全地设计出微波硬化系统。因此,图7-9显示了根据本发明的另一实施方式。
微波加热器60包括室62,该室62将微波能量从微波源传送到圆柱形波导模(mode)。如图所示,室62由内部圆柱形部分64和更大直径的外部圆柱形部分66组成。该外部圆柱形部分66围绕着内部圆柱形部分64,形成了径向分级结构。内部圆柱形部分64在进口端68接收陶瓷原材12,并使原材12在出口70离开。
外部圆柱形部分66包括用来接收微波进入室62的波导馈源72。如图8所示,沿部分的内部圆柱形部分64的外围进行切割,形成一对相邻的曲面段74。第一切除部分76与波导馈源72相邻,并且与波导馈源72相对应。第二切除部分78在曲面段74之间延伸。从所述第一切除部分76的中心测量,所述曲面段74的长度足以屏蔽陶瓷原材12的半波长区域。
所述曲面段74的功能是使进入圆柱形波导62的微波能量均匀分布,从而为陶瓷原材12提供均匀的周围加热。具体来说,当微波通过微波进口72输送时,一部分的微波进入第一切除部分76,余下的微波被曲面段74反射而进入第二切除部分78,从而进行均匀的周围加热。模拟显示微波能量以连续的TEx1波导模式提供(其中x为3-4),使得陶瓷原材中微波能量的分布浓度更均匀。为激发这种更高级的波导模式,外部圆柱形部分66的直径与波导的厚度成比例。
本领域普通技术人员将会基于上述实施方式理解到本发明的其他特征和优点。因此,除非附加的权利要求书中说明,本发明并不限于具体显示和描述的内容。
Claims (12)
1.一种用来使湿陶瓷体硬化的微波系统,该系统包括:
用来提供频率为100MHz至30GHz的能量的微波源;
微波加热器,该微波加热器包括:
具有流动轴、进口、出口和用来将挤出的陶瓷体沿流动轴输送的支架的室,
用来从微波源接受微波的单波导管馈源,
该微波系统安装在与形成陶瓷体的挤出机的模头端相邻的位置,使得湿陶瓷体在离开挤出机后立刻进入微波场。
2.如权利要求1所述的微波系统,该系统还包括位于微波加热器的室的进口或出口或同时位于这两个位置的微波衰减装置。
3.如权利要求2所述的微波系统,该系统还包括位于所述单波导馈源和微波源之间的阻抗匹配装置。
4.如权利要求3所述的微波系统,其特征在于,所述阻抗匹配装置包括循环器和短线调谐器。
5.如权利要求1所述的微波系统,其特征在于,所提供的微波能量为连续的TExy和/或TMxy波导模式,其中x为0-8,y为1-3。
6.如权利要求1所述的微波系统,其特征在于,所述室由矩形或正方形波导组成,所述矩形或正方形波导沿其长度弯曲成两个90°角,形成″U ″形结构。
7.如权利要求6所述的微波系统,其特征在于,所述室的进口端和出口端是圆柱形的。
8.如权利要求4所述的微波系统,其特征在于,所述微波加热器以TE11波导模式操作。
9.如权利要求1所述的微波系统,其特征在于,所述室由以下部分组成:内部圆柱形部分,以及更大直径的外部圆柱形部分,所述外部圆柱形部分以径向分级结构围绕所述内部圆柱形部分;
所述外部圆柱形部分包括单波导馈源;
部分的内部圆柱形部分被切除,形成一对相邻的曲面段,使得第一切除部分与外部圆柱形部分的波导馈源相邻,第二切除部分在曲面段之间延伸。
10.如权利要求9所述的微波系统,其特征在于,所述微波加热器以连续的TEx1波导模式操作,其中x为3-4。
11.一种用来硬化湿陶瓷体的方法,该方法包括:
提供包含具有热胶凝点的有机粘合剂的塑性可形变材料;
使塑性可形变材料通过挤出模头成形,形成湿陶瓷体;
使所述湿陶瓷体通过频率为100MHz至30GHz的能量场;
对湿陶瓷体进行加热,使有机粘合剂凝胶。
12.如权利要求11所述的方法,其特征在于,所述塑性可形变材料包括堇青石形成材料。
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DE4313806A1 (de) * | 1993-04-27 | 1994-11-03 | Rene Salina | Vorrichtung zum Erhitzen von Materialien in einer mit Mikrowellen bestrahlbaren Heizkammer und Verfahren zum Herstellen von keramischem Gut, bei dem das Rohgut mittels Mikrowellen getrocknet wird |
US5534278A (en) * | 1994-01-06 | 1996-07-09 | De Ruyter; Peter W. | Process and apparatus for making meat analogs |
US6063323A (en) * | 1996-05-17 | 2000-05-16 | Implico B.V. | Process and installation for making extruded sintered ceramic artifact |
US5770143A (en) * | 1996-07-03 | 1998-06-23 | Board Of Trustees Operating Michigan State University | Method for liquid thermosetting resin molding using radiofrequency wave heating |
US6246037B1 (en) * | 1999-08-11 | 2001-06-12 | Industrial Microwave Systems, Inc. | Method and apparatus for electromagnetic exposure of planar or other materials |
JP3581956B2 (ja) * | 2000-07-28 | 2004-10-27 | 政一 松尾 | 瞬間湯沸し器 |
ATE381876T1 (de) * | 2001-06-01 | 2008-01-15 | Comm And Power Ind Inc | Mikrowellenapplikator zur erwärmung einer strömenden flüssigkeit |
DE10128038C1 (de) * | 2001-06-08 | 2002-11-21 | Karlsruhe Forschzent | Mikrowellentechnischer Durchlauferhitzer |
US6960747B2 (en) * | 2001-11-09 | 2005-11-01 | Personal Chemistry I Uppsala Ab | Microwave applicator system |
-
2003
- 2003-10-31 US US10/699,008 patent/US20050093209A1/en not_active Abandoned
-
2004
- 2004-10-22 WO PCT/US2004/035130 patent/WO2005044530A2/en active Application Filing
- 2004-10-22 EP EP04796176A patent/EP1684962A4/en not_active Withdrawn
- 2004-10-22 CN CN200480032065A patent/CN100581772C/zh not_active Expired - Fee Related
-
2006
- 2006-03-16 US US11/378,073 patent/US20060159795A1/en not_active Abandoned
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102859305A (zh) * | 2010-02-25 | 2013-01-02 | 康宁股份有限公司 | 用于生产陶瓷制品的托盘组件和方法 |
CN102859305B (zh) * | 2010-02-25 | 2014-12-10 | 康宁股份有限公司 | 用于生产陶瓷制品的托盘组件和方法 |
US9440373B2 (en) | 2010-02-25 | 2016-09-13 | Corning Incorporated | Tray assemblies and methods for manufacturing ceramic articles |
CN114514102A (zh) * | 2019-08-14 | 2022-05-17 | 康宁股份有限公司 | 通过周向辐照使湿挤出物硬化的系统和方法 |
CN114514102B (zh) * | 2019-08-14 | 2023-10-31 | 康宁股份有限公司 | 通过周向辐照使湿挤出物硬化的系统和方法 |
US11999074B2 (en) | 2019-08-14 | 2024-06-04 | Corning Incorporated | Systems and methods for stiffening wet extrudate by circumferential irradiation |
CN111842422A (zh) * | 2020-07-15 | 2020-10-30 | 成都劢可为科技有限公司 | 一种可连续裂解固体废物的微波处理装置 |
Also Published As
Publication number | Publication date |
---|---|
EP1684962A2 (en) | 2006-08-02 |
US20060159795A1 (en) | 2006-07-20 |
US20050093209A1 (en) | 2005-05-05 |
WO2005044530A2 (en) | 2005-05-19 |
WO2005044530A3 (en) | 2005-08-04 |
EP1684962A4 (en) | 2011-01-12 |
CN100581772C (zh) | 2010-01-20 |
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