CN1869095A - Epoxy resin solidification agent and its preparation method - Google Patents
Epoxy resin solidification agent and its preparation method Download PDFInfo
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- CN1869095A CN1869095A CN 200610036138 CN200610036138A CN1869095A CN 1869095 A CN1869095 A CN 1869095A CN 200610036138 CN200610036138 CN 200610036138 CN 200610036138 A CN200610036138 A CN 200610036138A CN 1869095 A CN1869095 A CN 1869095A
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- polyamide
- epoxy curing
- curing agent
- polymeric amide
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Abstract
A solidifying agent of epoxy resin for improving toughness, adhesion, weatherability and the resistance to water, acid and alkali, and decreasing shrinkage is proportionally prepared from polyamide '650' or '651', coupling agent KH-550, and promoter X-651 or DMP-30 or T31.
Description
Technical field
The present invention relates to a kind of epoxy curing agent and process for making thereof.
Background technology
With Resins, epoxy is that the tackiness agent that base-material prepares has the incomparable unique adhesion property of other caking agent: higher physical strength, less shrinkability, resistant to chemical media etc., it is a kind of adhesives of every high comprehensive performance, in various industrial circles, be with a wide range of applications, be national defense industry, the indispensable industrial chemicals of every field such as industrial or agricultural.Resins, epoxy must be mixed good its particular performances of solidifying agent competence exertion when in use.At present, the epoxy curing agent kind is a lot, and amine, anhydrides and Versamid class etc. are arranged.Wherein to have amount ranges wide for Versamid class solidifying agent, and working life is long, and is easy to operate, and manufacture craft is simple, and volatility is little, and toxicity is low, has performances such as increasing tougheness simultaneously, is most widely used.Yet polyamide-based solidifying agent only depends on the increasing tougheness of the cured article after flexible lipid acid and active amine and cross linking of epoxy resin solidify in the polymeric amide, shrinkability, acid and alkali-resistance, weathering resistance, physical mechanicals such as water tolerance and chemical property all have much room for improvement, and the shearing resistance of its cured article generally has only about 8Mpa.
Summary of the invention
The purpose of this invention is to provide a kind ofly have that increasing tougheness is good, shrinkability is little, water-fast, resistance to acids and bases good, the simple modified polyamide based epoxy resin curing agent of manufacture craft and process for making thereof.
Epoxy curing agent of the present invention is achieved in that epoxy curing agent, by polymeric amide, and coupling agent, promotor is formed.In order to make epoxy curing agent of the present invention reach best performance, polymeric amide selects for use polymeric amide to select for use polyamide 6 50 to account for the 90-96 parts by weight, and coupling agent selects for use KH-550 to account for the 0.05-0.5 parts by weight, and promotor is selected X-651 for use, DMP-30, T31 a kind of or several account for the 1-10 parts by weight altogether.
Described polymeric amide can be selected polyamide 6 51 for use.
Epoxy curing agent process for making of the present invention is achieved in that polyamide 6 50 or the heating of polyamide 6 51 90-96 parts by weight, temperature is 65-75 ℃, time is 7-9 hour, the charging jacket pipe leads to steam preheating, with pump polymeric amide is squeezed in the reactor then, the logical steam heating of chuck in the still, temperature is controlled at below 95 ℃, then in reactor, add coupling agent KH-550 0.05-0.5 parts by weight and promotor X-651, DMP-30, T31 a kind of or several account for the 1-10 parts by weight altogether, stir promptly to get product after full and uniform in 1-1.5 hour.
Epoxy curing agent of the present invention is based on the basis of polymeric amide and adds coupling agent, and promotor is carried out modification and obtained.Coupling agent is KH-550, and the common and epoxy resin glue connection of KH-550 and polymeric amide solidifies toughness that can obviously strengthen cured article and the shrinkability that reduces cured article.X-651, T31, DMP-30 are promotor, and they have hydroxyl, secondary amine and tertiary amine groups, and phenolic aldehyde skeleton structure isoreactivity structure can remedy the deficiency of polymeric amide active structure, can obviously strengthen the over-all properties of epoxy curing agent of the present invention.
Resulting cured article toughness is obviously improved behind epoxy curing agent of the present invention and the cross linking of epoxy resin, and shearing resistance can be greater than 11Mpa, and shrinkability is littler, bonding force strengthens, water-tolerant, acid and alkali-resistance and good weatherability, firmer wear-resisting, the working hour suits simultaneously, solidifies the back nontoxicity.Epoxy curing agent manufacture craft of the present invention is simple, and the generation of the no three wastes can not have any impact to environment.
Embodiment
Following raw material all is parts by weight.
Embodiment 1
Polyamide 6 50 90.0, KH-550 0.05, and X-651 9.95.
Embodiment 2
Polyamide 6 50 96.0, KH-550 0.5, and X-651 3.5.
Embodiment 3
Polyamide 6 50 94.8, KH-550 0.2, and x-651 5.0.
Embodiment 4
Polyamide 6 50 95.0, KH-550 0.5, and DMP-30 4.5.
Embodiment 5
Polyamide 6 50 94.0, KH-550 0.05, and T31 5.95.
Embodiment 6
Polyamide 6 50 93.0, KH-550 0.5, and x-651 3.0, and DMP-30 3.5.
Embodiment 7
Polyamide 6 50 92.0, KH-550 0.3, and x-651 4.0, and T31 3.7.
Embodiment 8
Polyamide 6 50 90, KH-550 0.05, and DMP-30 4, and T31 5.95.
Embodiment 9
Polyamide 6 50 90.0, KH-550 0.1, and x-651 5.3, and T31 1.0, and DMP-30 4.6.
Embodiment 10
Polyamide 6 50 93.0, KH-550 0.4, and x-651 1.3, and T31 4.0, and DMP-30 1.3.
Embodiment 11
Polyamide 6 50 91.0, KH-550 0.3, and x-651 3.0, and T31 3.7, and DMP-30 2.0.
Polyamide 6 50 also can be a polyamide 6 51 among the wherein said embodiment.
Wherein, KH-550 is silane coupling agent commonly used; DMP-30 is the epoxy resin cure promotor that phenolic compound adds the amine modification; T31 is the epoxy curing agent that contains phenolic hydroxyl group, primary amine groups, reaches secondary amine; X-651 is liquid phenolic aldehyde amine epoxy curing agent.Above raw material is Resins, epoxy industry product commonly used, is easy on the market obtain.
Epoxy curing agent process for making of the present invention is achieved in that polymeric amide is heated, temperature is 65-75 ℃, time is 7-9 hour, make polymeric amide that good flowability be arranged, the charging jacket pipe leads to steam preheating, with pump polymeric amide is squeezed in the reactor then, the logical steam heating of chuck in the still, temperature is controlled at below 95 ℃, then adds coupling agent and promotor in reactor, stirs and promptly gets product in 1-1.5 hour.The polymeric amide heating can place the sea water bath heating in water bath, also can place drying room heating or alternate manner heating.
The best process for making of epoxy curing agent of the present invention is: place drying room with 70 ℃ of heating 8 hours polymeric amide, charging jacket pipe steam preheating, with pump polymeric amide is squeezed into reactor then, the logical steam heating of chuck in the still, temperature is controlled at 85 ℃, then in reactor, add coupling agent and promotor, stirred 1.5 hours.
The product appearance of gained of the present invention is yellowish or brown viscous liquid, and viscosity is greater than 18PaS, and the amine value is greater than 180mgKOH/g.
Claims (10)
1, a kind of epoxy curing agent is by polymeric amide, coupling agent, and promotor is formed, it is characterized in that: polymeric amide accounts for the 90-96 parts by weight, and coupling agent is that KH-550 accounts for the 0.05-0.5 parts by weight, and promotor is X-651, DMP-30, T31 a kind of or several account for the 1-10 parts by weight altogether.
2, epoxy curing agent as claimed in claim 1 is characterized in that: polymeric amide is a polyamide 6 50.
3, epoxy curing agent as claimed in claim 2 is characterized in that: polyamide 6 5094.8, and KH-550 0.2, and x-651 5.0.
4, epoxy curing agent as claimed in claim 2 is characterized in that: polyamide 6 5095.0, and KH-550 0.5, and DMP-30 4.5.
5, epoxy curing agent as claimed in claim 2 is characterized in that: polyamide 6 5094.0, and KH-550 0.05, and T31 5.95.
6, epoxy curing agent as claimed in claim 2 is characterized in that: polyamide 6 5092.0, and KH-550 0.3, and x-651 4.0, and T31 3.7.
7, epoxy curing agent as claimed in claim 2 is characterized in that: polyamide 6 5091.0, and KH-550 0.3, and x-651 3.0, and T31 3.7, and DMP-30 2.0.
8,, it is characterized in that polymeric amide is a polyamide 6 51 as claim 1,3,4,5,6 or 7 described epoxy curing agents.
9, a kind of process for making of epoxy curing agent, it is characterized in that: with polymeric amide parts by weight 90-96 heating, temperature 65-75 ℃, the time is 7-9 hour, the charging jacket pipe leads to steam preheating, squeeze in the reactor with pump then, the logical steam heating of chuck in the still, temperature is no more than 95 ℃, then in reactor, add coupling agent KH-550 parts by weight 0.05-0.5 and promotor X-651, DMP-30, T31 a kind of or several account for parts by weight 1-10 altogether, stir 1-1.5 hour.
10, the process for making of epoxy curing agent as claimed in claim 9 is characterized in that: polymeric amide places the drying room heating, 80 ℃ of temperature, and the time is 8 hours, the logical steam-heated temperature of chuck is 85 ℃ in the still.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100361382A CN100391996C (en) | 2006-06-29 | 2006-06-29 | Epoxy resin solidification agent and its preparation method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100361382A CN100391996C (en) | 2006-06-29 | 2006-06-29 | Epoxy resin solidification agent and its preparation method |
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| Publication Number | Publication Date |
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| CN1869095A true CN1869095A (en) | 2006-11-29 |
| CN100391996C CN100391996C (en) | 2008-06-04 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112390935A (en) * | 2020-04-22 | 2021-02-23 | 普氢(上海)新材料科技有限公司 | Amido amine epoxy resin curing agent and preparation method thereof |
| CN114426411A (en) * | 2020-10-29 | 2022-05-03 | 中国石油化工股份有限公司 | Pavement patching material and preparation method and application thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1282771A (en) * | 2000-06-23 | 2001-02-07 | 杭州之江有机硅化工有限公司 | Dual-component structural adhesive of epoxy resin for buildings |
| US6645341B1 (en) * | 2002-08-06 | 2003-11-11 | National Starch And Chemical Investment Holding Corporation | Two part epoxide adhesive with improved strength |
| CN1216114C (en) * | 2002-12-13 | 2005-08-24 | 湖南省第六工程公司 | Structural glue containing nano material |
| CN1690154A (en) * | 2004-04-28 | 2005-11-02 | 陈惠� | Double component adhesive for double-ply board |
-
2006
- 2006-06-29 CN CNB2006100361382A patent/CN100391996C/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112390935A (en) * | 2020-04-22 | 2021-02-23 | 普氢(上海)新材料科技有限公司 | Amido amine epoxy resin curing agent and preparation method thereof |
| CN112390935B (en) * | 2020-04-22 | 2022-05-17 | 普氢(上海)新材料科技有限公司 | Amido amine epoxy resin curing agent and preparation method thereof |
| CN114426411A (en) * | 2020-10-29 | 2022-05-03 | 中国石油化工股份有限公司 | Pavement patching material and preparation method and application thereof |
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| CN100391996C (en) | 2008-06-04 |
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Owner name: GUANGZHOU PEARL RIVER CHEMICAL GROUP LTD. Free format text: FORMER OWNER: GUANGZHOU DONGFENG CHEMICAL INDUSTRIAL CO., LTD. Effective date: 20141215 |
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Effective date of registration: 20141215 Address after: 510730 No. 123, Liwan Road, Guangzhou, Guangdong, Liwan District Patentee after: Guangzhou Pearl River Chemical Group Ltd. Address before: 510730 No. 2019 East Whampoa Road, Whampoa District, Guangdong, Guangzhou Patentee before: Guangzhou Dongfeng Chemical Industrial Co., Ltd. |
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Effective date of registration: 20160331 Address after: 519050 Guangdong province Zhuhai Gaolan Gaolan Port Economic Zone petrochemical petrochemical zone six road No. 3001 Patentee after: Guangdong Zhujiang chemical coating Co., Ltd. Address before: 510730 No. 123, Liwan Road, Guangzhou, Guangdong, Liwan District Patentee before: Guangzhou Pearl River Chemical Group Ltd. |