CN1866514A - Pluggable module and cage - Google Patents
Pluggable module and cage Download PDFInfo
- Publication number
- CN1866514A CN1866514A CN 200610082428 CN200610082428A CN1866514A CN 1866514 A CN1866514 A CN 1866514A CN 200610082428 CN200610082428 CN 200610082428 CN 200610082428 A CN200610082428 A CN 200610082428A CN 1866514 A CN1866514 A CN 1866514A
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- cover
- leaf spring
- pluggable module
- transceiver module
- wiping
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Abstract
Nonconductive material sheets are mounted on both side faces of a case of an optical transceiver module. Alternatively, both the side faces of the case of the optical transceiver module are finished to have surface roughness of 2.4 a or less. Alternatively, at least sliding surfaces of a pair of flat springs for grasping a pluggable module in a cage is formed of a nonconductive material.
Description
Technical field
The invention relates to pluggable module and cover, in particular about the pluggable module and the cover of the generation of the metal powder that suppressed to produce by the plug of pluggable module.
Background technology
A lot of distributors of optical transceiver module, the combination multi-source is reached an agreement on (MSA:Multi-SourceAgreement), manufactures and designs the optical module of same size.10Gbit puts down in writing in " the small-sized key element pluggable module of 10 Gigabit Small Form FactorPluggable Module/10 gigabits " of the SFF committee to some extent with the specification of optical transceiver module (the small-sized key element of XFP:10 Gigabit Small Form Factor Pluggable/10 gigabit can plug).Utilize Fig. 1, the structure of XFP is described simply.Forming on the printed circuit board (PCB) 2 of electronic circuit, the cover 1 of the box-shaped of peristome with slit-shaped and upper opening portion is being installed.Cover 1 is made by panel beating, and the surface is carried out zinc-plated.Cover 1 inside has electric contact 1b, and is electrically connected from the optical transceiver module 3 that peristome inserted.
In the side of cover 1, welding has leaf spring 1a.This leaf spring in cover 1 and optical transceiver module 3 be electrically connected, aligns with the not shown cave portion of the side of optical transceiver module 3.As a result, leaf spring 1a breech lock optical transceiver module 3.When pulling out optical transceiver module 3,, extract from covering 1 again to cover after the 1 not shown clear-latch mechanism that has makes the leaf spring reposition.And cover 1 between plug during optical transceiver module 3, leaf spring 1a wipes moving in the side of optical transceiver module 3.
In addition, as shown in Figure 2, Aluminium Radiator 9 is installed in the upper opening portion of covering 1.Radiator 9 is used for the heat radiation of optical transceiver module 3, is necessary to make the two to combine closely in order to reduce thermal resistance.That is, when the cover 1 with the state that radiator 9 is installed carried out the plug of optical transceiver module 3, radiator 9 wiping on optical transceiver module 3 was moving.
In addition, though cover and radiator and optical transceiver module are to use integratedly, the user of optical transceiver module is to buy theirs from different distributors.And, insert the optical transceiver module that is not limited to that covers, also can be the transceiver module of electrical interface.This module is called pluggable module.
When cover plugs the optical transceiver module of metal-back, since the mutual friction mutually of metal and metal, the some generation metal fillingss in leaf spring, radiator, the metal-back.
When so the metal fillings that produces is big, can become the electronic unit that is installed on the printed circuit board (PCB) 2, the reason of the short circuit between wiring.When as its countermeasure the shell of optical transceiver module being made the such electrical insulator of plastics, radiating effect will reduce.
Summary of the invention
Wipe moving part with dielectric, softer material formation with cover than the material hardness of cover.Perhaps, order and cover or radiator are wiped the surface roughness of moving part smaller or equal to 2.4a.
As other mode, by non-conducting material form the pluggable module that keeps having metal-back, the sliding surface at least of a pair of leaf spring of controlling pluggable module of the cover that is installed on printed circuit board (PCB).
In addition, keep having the pluggable module of metallic shell, contact-making surface cover and pluggable module that is installed on printed circuit board (PCB) adopts non-conductive material, covers at least 3 of non-conductive material with metal-back.
Description of drawings
Fig. 1 is the stereogram of the relation of explanation XFP and cover.
Fig. 2 is the perspective side figure of the relation of explanation radiator and XFP.
Fig. 3 is the stereogram of explanation optical transceiver module to the insertion state of cover.
Fig. 4 is the front view of optical transceiver module.
Fig. 5 is the front view of the optical transceiver module of distortion example.
Fig. 6 is explanation owing to move the chart of relation of the surface roughness of the quality of the metal fillings that produces and shell with the wiping of leaf spring.
Fig. 7 is explanation owing to move the figure of relation of the surface roughness of the maximum length of the metal fillings that produces and shell with the wiping of leaf spring.
Fig. 8 is the stereogram of cover.
Fig. 9 is the stereogram of cover.
Embodiment
Below, for embodiments of the present invention, utilize embodiment, describe with reference to accompanying drawing.In addition, the following examples describe with optical transceiver module, but also go in the pluggable modules such as electric transceiver module, optical transmission module, Optical Receivers.
[embodiment 1]
Utilize Fig. 3 to Fig. 5 that embodiment 1 is described.At this, Fig. 3 is the stereogram of explanation optical transceiver module to the insertion state of cover.Fig. 4 and Fig. 5 are the front views of optical transceiver module.
In Fig. 3, the optical transceiver module 3 that two sides are pasted with acrylic sheet 3a is inserted in the cover 1 that is installed on the printed circuit board (PCB) 2.As shown in Figure 4, acrylic sheet is contained on the side and the whole zone of length direction that leaf spring 1a wipes mutually of optical transceiver module.The thickness of acrylic acid (methyl methacrylate) sheet is 0.1mm, and the thickness of the adhesive linkage when bonding is 0.05, utilizes the shell width of the optical transceiver module 3 that cast makes to be 18.05mm, and the profile of the optical transceiver module after then bonding is the 18.35mm of MSA defined.
In the present embodiment, owing to wipe between the acrylic acid of the leaf spring 1a of metal and plastics, softer acrylic acid is worn away so yes.But,,, can not be short-circuited because of the former of its chip thereby at the printed circuit board even if produce chip because acrylic acid is electrical insulator yet.
In the present embodiment, used acrylic sheet, but be not limited to this, preferably used near the hardness of leaf spring and the material softer than the hardness of leaf spring as dielectric material as dielectric plastics.Also can be that 4 ethylene fluorides are wiped the moving outstanding resin of property like this.
According to present embodiment, still adopt at shell material under the situation of the high metal of thermal diffusivity, can not produce metal fillings yet.
At this, utilize Fig. 5 that the distortion example of embodiment 1 is described.In Fig. 5, the two sides of the shell of optical transceiver module 3 are processed with the ditch of wide 4.5mm, dark 0.15mm in the central authorities of its short transverse, attach the acrylic sheet 3b of wide 4.0mm, thick 0.1mm.At this, the width of acrylic sheet 3b is that leaf spring by this direction is of a size of 3.0mm and determines.Therefore, the minimum dimension of the width of acrylic sheet 3b is 3.0mm, but 4.0mm more preferably.
According to this distortion example, can under adopting the situation of the high metal of thermal diffusivity, shell material not produce metal fillings yet.
[embodiment 2]
Utilize Fig. 6 and Fig. 7 that embodiment 2 is described.At this, Fig. 6 is explanation owing to move the chart of relation of the surface roughness of the quality of the metal fillings that produces and shell with the wiping of leaf spring.Fig. 7 is explanation owing to move the figure of relation of the surface roughness of the maximum length of the metal fillings that produces and shell with the wiping of leaf spring.
In the explanation of Fig. 2, illustrated that radiator 9 wiping on optical transceiver module 3 is moving when the cover 1 of the state that radiator 9 is installed plugs optical transceiver module 3.But radiator is to contact with face with optical transceiver module 3, thus with the optical transceiver module plug of the cover of the state that radiator is installed, need bigger power.
Even if considering owing to moving with the wiping of radiator, inventor etc. produced metal fillings, if but the shell surface roughness of light R-T unit is less, and the amount of metal fillings can reduce, maximum length can shorten, and has carried out experiment as follows.In its experiment, adopt the surface roughness of the shell-side face after the cast to be 3.2a (according to Ra), become 3 kinds of samples of 2.4a, 1.6a by the surface grinding of shell-side face.This experiment with the structure of Fig. 1, is carried out 50 plugs with cover, and leaf spring and shell two sides are wiped, collects the metal fillings of generation, measures its quality and maximum length.
In Fig. 6, metal fillings was 45mg when surface roughness was 3.6a, and was 15mg during 1.6a, be its 1/3.On the other hand, in Fig. 7, the maximum length of metal fillings was 170 μ m when surface roughness was 3.6a, and was 90 μ m during 1.6a, be its 1/2.
In fact, owing to can not carry out 50 times plug, known to the inventor, the generation of metal fillings if the surface roughness of shell-side face is machined to about 2.4a (the about 5 μ m of peak-to-peak value), just can be applicable to XFP.In addition, more preferably about 1.6a (the about 3 μ m of peak-to-peak value).
In addition, if similarly the top surface roughness of shell is machined to about 2.4a (the about 5 μ m of peak-to-peak value), just can be applicable to optical transceiver module.In addition, more preferably be about 1.6a (the about 3 μ m of peak-to-peak value).By this Surface Machining,, also can realize the improvement of dispelling the heat as the air layer attenuation of the thermal insulation layer between optical transceiver module and the radiator.
In addition, Surface Machining also just like the surface-treated chemical method, is not limited to this outside as the mechanical means of surface grinding.
According to present embodiment, can adopt the high metal of thermal diffusivity to reduce metal fillings significantly under as the situation of shell material.In addition, can improve heat radiation.
[embodiment 3]
Utilize Fig. 8 and Fig. 9 that embodiment 3 is described.At this, Fig. 8 and Fig. 9 are the stereograms of cover.Cover 1 shown in Figure 8 is installed on the printed circuit board (PCB) 2.Cover 1 leaf spring 1b, have with the sliding surface of the optical transceiver module of leaf spring on cover 4 thick ethylene fluorides of 0.5mm, be welded to structure on the cover 1 in non-covering part.In addition, on the printed circuit board (PCB) 2 not shown surface wiring and electronic unit are installed.Leaf spring 1b forms 1 pair, controls optical transceiver module in cover 1.
4 ethylene fluorides are the engineering plastics with outstanding sliding, and by covering on the leaf spring, leaf spring 1b can possess springiness and sliding simultaneously.
In Fig. 9, cover 10 is installed on the printed circuit board (PCB) 2.In addition, around the cover 10, aluminum metal-back 11 is installed on the printed circuit board (PCB) 2.Cover 10 makes by the processing polybutylene terephthalate resin (PBT:PolyButylene Terephthalate) that is shaped and makes.In addition, on the printed circuit board (PCB) 2 not shown surface wiring and electronic unit are installed.
PBT has the outstanding springiness and the engineering plastics of abrasion performance.Therefore, leaf spring 10b, when wiping mutually with optical transceiver module, almost not abrasion are even if there are abrasion also only can produce non-conductive bits.At this, metal-back 11 is by printed circuit board (PCB) 2 ground connection, and at least 3 of cover 10 are shielded by EMI.In addition, printed circuit board (PCB) 2 contact sites of cover 10 are printed circuit board 2 shieldings.At this, also there is the situation that contains metal-back in cover.
According to present embodiment, be non-conductive with the moving portion of the wiping of optical transceiver module at least owing to what cover, so can suppress the generation of metal fillings.
According to the present invention, can make because the metal fillings that the wiping movable property of cover or radiator is given birth to reduces.
Claims (9)
1. pluggable module with one face and have breech lock and plug with wiping moving mode between the described leaf spring of the cover of leaf spring, is characterized in that,
The described leaf spring of a described face is wiped moving portion, is by non-conductive and make than the soft material of described leaf spring hardness.
2. pluggable module according to claim 1, wherein, described material is methyl methacrylate or 4 ethylene fluorides.
3. pluggable module with one face and have breech lock and plug with wiping moving mode between the described leaf spring of the cover of leaf spring, is characterized in that,
Portion is moved in the wiping of a described face, is become surface roughness smaller or equal to 2.4a by Surface Machining.
4. pluggable module with one face and be equipped with and wipe moving mode between the described radiator of cover of radiator and plug, is characterized in that,
Portion is moved in the wiping of a described face, is become surface roughness smaller or equal to 2.4a by Surface Machining.。
5. according to claim 3 or 4 described pluggable modules, wherein, portion is moved in the wiping of a described face, and its surface roughness is become smaller or equal to 1.6a by Surface Machining.
6. cover, its maintenance has the pluggable module of metallic shell, and is installed on the printed circuit board (PCB), it is characterized in that,
At least the sliding surface of controlling a pair of leaf spring of described pluggable module is formed by non-conducting material.
7. cover according to claim 6, wherein,
Described non-conducting material is 4 ethylene fluorides or polybutylene terephthalate.
8. cover, its maintenance has the pluggable module of metallic shell, and is installed on the printed circuit board (PCB), it is characterized in that,
Adopt dielectric material with the contact-making surface of described pluggable module, covered at least 3 faces of described dielectric material with metal-back.
9. cover according to claim 8, wherein,
Described non-conductive material is a polybutylene terephthalate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005146328 | 2005-05-19 | ||
| JP2005146328 | 2005-05-19 | ||
| JP2006012094 | 2006-01-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1866514A true CN1866514A (en) | 2006-11-22 |
| CN100470795C CN100470795C (en) | 2009-03-18 |
Family
ID=37425482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100824280A Active CN100470795C (en) | 2005-05-19 | 2006-05-16 | Pluggable module and cage |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100470795C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107611213A (en) * | 2017-09-12 | 2018-01-19 | 天津莱尔德电子材料有限公司 | Photoelectric conversion device |
| CN107881877A (en) * | 2017-08-10 | 2018-04-06 | 西安健坤游乐设施有限公司 | A kind of dry skiing floor tile and manufacture method |
| CN111338032A (en) * | 2018-12-18 | 2020-06-26 | 中兴通讯股份有限公司 | Optical module communication assembly |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2239666Y (en) * | 1995-10-19 | 1996-11-06 | 鸿海精密工业股份有限公司 | Electrical connector screening device |
| US5992957A (en) * | 1998-04-21 | 1999-11-30 | International Business Machines Corporation | Abrasion control on sliding assemblies |
| US6808410B1 (en) * | 2003-08-28 | 2004-10-26 | Hon Hai Precision Ind. Co., Ltd. | Cable connector assembly having pulling mechanism |
-
2006
- 2006-05-16 CN CNB2006100824280A patent/CN100470795C/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107881877A (en) * | 2017-08-10 | 2018-04-06 | 西安健坤游乐设施有限公司 | A kind of dry skiing floor tile and manufacture method |
| CN107881877B (en) * | 2017-08-10 | 2024-04-16 | 重庆市巫山城市建设(集团)有限公司 | Dry land sliding snow floor tile and manufacturing method thereof |
| CN107611213A (en) * | 2017-09-12 | 2018-01-19 | 天津莱尔德电子材料有限公司 | Photoelectric conversion device |
| CN107611213B (en) * | 2017-09-12 | 2024-02-23 | 天津莱尔德电子材料有限公司 | Photoelectric conversion device |
| CN111338032A (en) * | 2018-12-18 | 2020-06-26 | 中兴通讯股份有限公司 | Optical module communication assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100470795C (en) | 2009-03-18 |
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Owner name: OCLARO INC. Free format text: FORMER NAME: JAPAN KOSHIN CO. LTD. |
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| CP01 | Change in the name or title of a patent holder |
Address after: Kanagawa Patentee after: Oclaro Japan Inc. Address before: Kanagawa Patentee before: Japan Koshin Co., Ltd. |
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Address after: Kanagawa Patentee after: Lang Mei Tong Co., Ltd. of Japan Address before: Kanagawa Patentee before: Oclaro Japan Inc. |
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