CN1865329A - Flame-proof agent and flame-proof resin composition comprising same, and its uses - Google Patents
Flame-proof agent and flame-proof resin composition comprising same, and its uses Download PDFInfo
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- CN1865329A CN1865329A CNA2005100721345A CN200510072134A CN1865329A CN 1865329 A CN1865329 A CN 1865329A CN A2005100721345 A CNA2005100721345 A CN A2005100721345A CN 200510072134 A CN200510072134 A CN 200510072134A CN 1865329 A CN1865329 A CN 1865329A
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Abstract
The invention relates to a combustion inhibitor comprising at least one metallic compound selected from (A) triazine-phenolic resins, and (B) nitrogen-containing compounds, the triazine-phenolic resins have the formula (I) disclosed in the specification, wherein m and n are integers of 1-10, R is OH, NH2, COOH, SO3H, C(O)H or CH3CONH. The invention also relates to flame-retardant resin compositions containing the combustion inhibitor and their use.
Description
Technical field
The present invention relates to a kind of fire retardant and contain flame-retardant resin composition of described fire retardant and uses thereof.
Background technology
Look about we around, with people live closely bound up household electrical appliances, office automated machine, electronic motor, material of construction, automotive material and daily living article etc., all is inflammable organic polymer material a lot.In order to improve the quality of living and to ensure life security, the characteristic of improving organic polymer material by means of fire retardant and flame-retarded technology is only arranged, reduce the feasibility of material combustion, reduce the generation of fire.
The organic polymer material flame retardant properties is generally relatively poor, is the emphasis of present technical development so make fire-retardantization of material, the exploitation of fire retardant and to utilize then be a link of most critical wherein.The used fire retardant kind of macromolecular material is a lot, according to whether halogen being arranged, generally can be divided into two big class, i.e. Halogen class and Halogen classes.At present the halogen containing flame-retardant that uses mainly is chlorine and two kinds of compounds of bromine, and halogen containing flame-retardant has a suitable effect to fire-retardant, and for example brominated bisphenol a type epoxy resin only need be done a spot of interpolation in macromolecular material, can reach flame retardant effect.Yet can producing, halogen containing flame-retardant has corrodibility and toxic hydrogen halide, and the amount of being fuming is big, and burning the time may produce the doubt of harmful carcinogenic poison gas such as halogenation dioxin or halogenation furans, so useless motor of European Union's legislation, electronics instruction (Directive on " Waste Electrical; among the Electronic Equipment (WEEE) "), the regulation motor, the restriction of objectionable impurities in the electronics (Restriction of Hazardous Substances (RoHS) in EEE) is understood to provide against and is used Polybrominated biphenyl (Polybrominated biphenyl (PBB)), Poly Brominated Diphenyl Ethers bromine-containing compounds such as (Polybrominated diphenyl ethers (PBDE)).
The definition of so-called environment-protective halogen-free material is meant, cl content that integral material comprises less than 900ppm and bromine content less than 900ppm, could be as the exploitation use of ep-type material.The Halogen material is is mainly researched and developed according to following four notions at present: (1) flame retardant resistance need meet the UL94-V0 standard; (2) do not contain halogen; (3) do not contain antimony element; (4) do not contain red phosphorus.Wherein, though antimony and red phosphorus are to replace the goodish selection of fire retardant that halogen becomes Resins, epoxy, antimony has carcinogenic danger.In addition, existing at present patent discloses the fire retardant of phosphorus-containing groups, as United States Patent (USP) the 6th, 291, and No. the 490474th, No. 627 and Republic of China's patent announcement etc.Yet,,, derive another environmental issue because of phosphorus can hydrolysis cause the excellent oxidation in rivers and creeks though phosphonium flame retardant can effectively replace halogen flame.Simultaneously, itself has ignition quality red phosphorus, easily causes danger.Therefore, at present antimony and two kinds of chemical substances of red phosphorus also become the chemical substance used avoided.For this reason, this case contriver proposes a kind of fire retardant of novelty, can avoid the problems referred to above effectively.
Summary of the invention
The invention provides a kind of fire retardant, it comprises (A) triazine-phenol resin, (B) nitrogenous compound and (C) at least a metallic compound.The present invention also provides a kind of flame-retardant resin composition, and it comprises above-mentioned fire retardant and Resins, epoxy, stiffening agent and inorganic filler.
Embodiment
Contained triazine in the fire retardant of the present invention-phenol system (triazine-phenol) resin has following formula (I) structure;
Wherein, m and n respectively are 1 to 10 integer, and R is OH, NH
2, COOH, SO
3H, C (O) H or CH
3CONH.
In a specific embodiment of the present invention, R is NH in formula (I) structure
2, m and n respectively are 1 to 5 integer,, are expressed as following formula (I that is
1)
According to a particular embodiment of the invention, in fire retardant of the present invention, the content of described triazine-phenol resin in described fire retardant gross weight, is 0.1 to 60 weight %, is preferably 20 to 50 weight %.In addition, the melt viscosity of described triazine-phenol resin is lower than 2000cps in the time of 175 ℃; And wherein the content of nitrogen in described triazine-phenol resin gross weight, is 15 to 24 weight %.
Can be used for nitrogenous compound of the present invention, there is no particular restriction, be preferably trimeric cyanamide (melamine) or melamine cyanurate (melamine cyanurate), the content of described nitrogenous compound, in described fire retardant gross weight, be 0.1 to 40 weight %, be preferably 5 to 30 weight %.
Fire retardant of the present invention comprises (C) at least a metallic compound, and the content of described metallic compound in described fire retardant gross weight, is 0.1 to 70 weight %, is preferably 10 to 60 weight %.Can be used for metallic compound of the present invention and be selected from zinc borate, zinc molybdate, metal hydroxides, complex metal hydroxide or its mixture.Generally speaking, preferred metal hydroxides is aluminium hydroxide or magnesium hydroxide.For complex metal hydroxide, it has constitutional chemistry formula M
a XM
b 1-X(OH)
2, M wherein
aBe selected from the group that magnesium, calcium, tin and titanium constitute, preferred L
aBe magnesium; M
bBe selected from the group that manganese, iron, cobalt, nickel, copper and zinc constitute, preferred L
bBe nickel or zinc, and X represents to satisfy the numerical value of inequality 0.01＜X0.5.
The present invention also provides a kind of flame-retardant resin composition, and it comprises above-mentioned fire retardant and Resins, epoxy, stiffening agent and inorganic filler.
Generally speaking, the thickness of mouldings can influence flame retardant resistance, therefore, does not use fire retardant sometimes, goes to survey the flame retardant resistance that the thick test piece of 3.2mm still can obtain the V-0 grade, goes to survey the thick test piece of 1.0mm, but is difficult to obtain the flame retardant resistance of V-1 grade.It is found that via interpolation triazine-phenol resin and nitrogenous compound, even only add on a small quantity that at the thick testing plate test of 1.0mm, can obtain the flame retardant resistance of V-0 grade, this gives the characteristic of thin mouldings with high flame retardant, is difficult to by other fire retardant replacement.Yet, triazine-phenol resin and nitrogenous compound are made an addition in the mouldings, its flowability is bad, thereby adds at least a metallic compound as flame retardant, because both effects that multiplies each other can improve its flowability.
Flame retardant agent content in the resin combination of the present invention is in the resin combination gross weight, between 0.1 to 15 weight %, preferably between 3 to 12 weight %.If flame retardant agent content can't reach the effect of improving flame retardant resistance less than 0.1 weight %; If surpass 15 weight %, will reduce hardening, thermotolerance and intensity, and the uptake rate that will moisturize.The Resins, epoxy that can be used for constituent of the present invention, be the Resins, epoxy that contains two or more functional groups, it is including (but not limited to) bisphenol epoxy, bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, phenol aldehyde type novolac epoxy, phenol aldehyde type alkyl phenolic Resins, epoxy, upgrading novolac epoxy, dicyclopentadiene Resins, epoxy or its mixture.
According to the present invention, described Resins, epoxy can use separately or two or more use with form of mixtures.The consumption of described Resins, epoxy with respect to the gross weight of constituent, is generally between 2 to 15 weight %, preferably between 3 to 12 weight %.
Employed stiffening agent in the resin combination of the present invention needs collocation Resins, epoxy to use, and this is that those skilled in the art are known in the technical field of the invention, such as but not limited to phenol resin.Can be used for phenol resin of the present invention and contain two or more hydroxyl-functional bases; It is including (but not limited to) novolac resin, cresols novolac resin, triphenol alkylphenol, aralkyl resin, naphthalene type resol, Cyclopeutadiene type resol or its mixture.
In the present invention, the content of used stiffening agent is with respect to the gross weight of resin combination, between 2 to 10 weight %, preferably between 3 to 6 weight %.
Can be used for inorganic filler in the resin combination of the present invention including (but not limited to) fusion silicon-dioxide, powdered quartz, talcum powder, aluminum oxide, silicon nitride or its mixture, be preferably fusion silicon-dioxide.Based on the balance of moldability and scolder resistance, add the amount of inorganic filler, in the constituent gross weight, between 70 to 95 weight %.If the content of inorganic filler is less than 70 weight %, because the increase of moisture absorption will reduce the scolder of resin combination; If its content is higher than 95 weight %, the flowability of molded middle resin combination reduces, and causes easily to fill to lose efficacy.
In addition, according to the present invention,, can optionally add hardening accelerator for phenol in the cycloalkyl groups of accelerating Resins, epoxy and the stiffening agent is sclerous reaction between the oh group.Can be used for hardening accelerator among the present invention including (but not limited to) tertiary amine, organic phosphine compound, imidazolium compounds or its mixture.Wherein, the example of tertiary amine includes, but is not limited to: triethylamine, xylidine, phenmethyl diformazan ammonia or N, N-dimethyl-aminomethyl phenol.The example of organic phosphine compound includes, but is not limited to: triphenylphosphine (triphenylphosphine), trimethyl-phosphine, three (p-methylphenyl) phosphine, triphenylphosphine triphenylborane (triphenylphosphine triphenylborane) or tetraphenyl squama tetraphenyl borate salts (tetraphenylphosphonium tetraphenylborate).The example of imidazolium compounds includes, but is not limited to: glyoxal ethyline, 2-methyl-4-methylimidazole, 2-heptadecyl imidazoles or 1-cyanoethyl-4-methylimidazole.Be preferably organic phosphine compound, particularly triphenylphosphine.
In constituent of the present invention, the consumption of described hardening accelerator in the resin combination gross weight, is 0.01 to 1 weight %.
In addition, resin combination of the present invention can optionally comprise the known various additives of those skilled in the art in the technical field of the invention, for example silane coupling agent, parting agent (as natural wax or synthetic wax) and tinting material (as carbon black).
The not halogen-containing or antimony compounds of fire retardant that resin combination of the present invention is contained, and the halogen atom of constituent and the content of antimony atoms (be derived to avoid in the resins process use catalyzer or additive), in gross weight, for being lower than 0.1 weight %, thereby can reach environmental requirement.
Flame-retardant resin composition of the present invention is applicable to the encapsulation of various electronic components, especially semiconductor element.Its sclerosis with molded can be by the shaping processing method that those skilled in the art all knew in this technical field, as pressing shaping, injection molding or vacuum forming etc., flame-retardant resin composition of the present invention is used for packaging semiconductor, and shows the excellent fire retardant effect.
Following examples are used for that the invention will be further described, but not in order to restriction protection scope of the present invention.Those skilled in the art in any this technical field, the correction that can reach easily and change are included within this case specification sheets institute disclosure.
Embodiment 1
Resins, epoxy 1:10.4 weight part
Phenol resin 1:3.6 weight part
Fusion silicon-dioxide: 72 weight parts
Triazine-phenol resin: 3 weight parts
Melamine cyanurate: 1 weight part
Zinc borate: 8 weight parts
Triphenylphosphine: 0.2 weight part
Silane: 0.9 weight part
Zong Beam-at-the-eaves wax: 0.6 weight part
Carbon black: 0.3 weight part
At room temperature use mixing tank that above-mentioned each composition of enumerating is mixed, temperature is controlled at 60～100 ℃, mediates with the biaxial rneader high-temperature fusion, obtains flame-retardant resin composition.Assess made flame-retardant resin composition by the following method, the results are shown in Table 3 for it.
Appraisal procedure
Helicoidal flow:
This measurement is according to EMMI-1-66, uses a mould to measure helicoidal flow, under 175 ℃ molding temperature, in injecting mold pressure under 6.9MPa, and setting time is under 120 seconds condition, measured length to helicoidal flow, and its unit represents with cm.
Flame retardant resistance:
Use low pressure to change into the molded testing plate of forming machine device (127mm * 12.7mm and three kinds of thickness 1.0mm, 2.0mm and 3.0mm are arranged), and molding temperature is at 175 ℃, under the injection pressure of 6.9MPa and setting time be 120 seconds, then did post-hardening 8 hours in 175 ℃.Measure ∑ F according to the vertical method of UL-94 afterwards, the time of Fma x, and judge its flame retardant resistance.
| The flame retardant resistance grade | Flame retardant resistance | |
| V vertical combustion (Vertical Burn) | V-0 V-1 V-2 | The highest low poor |
Embodiment 2～3 and comparative example 1～5
Adopt as in embodiment 1 same procedure make resin combination, according to as be showed in the prescription of table 1, and adopt as the same procedure in embodiment 1 is assessed the resin combination of this generation.It the results are shown in table 3.
Table 1
| The flame-retardant resin composition composition | Embodiment | Comparative example | ||||||
| 1 | 2 | 3 | 1 | 2 | 3 | 4 | 5 | |
| Resins, epoxy 1 | 10.4 | 10.4 | 10.4 | 10.3 | 11.8 | 10.8 | 11.2 | 8.6 |
| Phenol resin 1 | 3.6 | 3.6 | 3.6 | 5.5 | 6.1 | 5.7 | 3.7 | 4.3 |
| Fusion silicon-dioxide | 72 | 72 | 72 | 79 | 80 | 70 | 71 | 80 |
| Triazine-phenol resin | 3 | 3 | 3 | 3 | 3 | |||
| Melamine cyanurate | 1 | 1 | 1 | 1.5 | 2 | |||
| Zinc borate | 8 | 10 | 9 | |||||
| Aluminium hydroxide | 8 | |||||||
| Magnesium hydroxide | 8 | |||||||
| Brominated bisphenol a type epoxy resin | 2 | |||||||
| Antimonous oxide | 1 | |||||||
| Triphenylphosphine | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 |
| Silane | 0.9 | 0.9 | 0.9 | 0.9 | 1 | 0.9 | 1 | 0.9 |
| Palm fibre phase wax | 0.6 | 0.6 | 0.6 | 0.6 | 0.6 | 0.6 | 0.6 | 0.6 |
| Carbon black | 0.3 | 0.3 | 0.3 | 0.5 | 0.3 | 0.3 | 0.3 | 0.3 |
Embodiment 4～6 and comparative example 6～10
Adopt as same procedure in embodiment 1 and make resin combination, and will be changed to those materials listed, and adopt the resin combination of assessing this generation as the same procedure in embodiment 1 at Resins, epoxy among the embodiment 1 and phenol resin as table 2.It the results are shown in table 4.
Table 2
| The flame-retardant resin composition composition | Embodiment | Comparative example | ||||||
| 4 | 5 | 6 | 6 | 7 | 8 | 9 | 10 | |
| Resins, epoxy 1 | 3.2 | 3.2 | 3.2 | 1.9 | 4.2 | 3.7 | 3.7 | 2.9 |
| Resins, epoxy 2 | 3.3 | 3.3 | 3.3 | 5 | 4.2 | 3.7 | 3.7 | 2.9 |
| Phenol resin 2 | 2.8 | 2.8 | 2.8 | 3.1 | 3.9 | 2.9 | 2.9 | 2 |
| Fusion silicon-dioxide | 83.5 | 83.5 | 83.5 | 85 | 86 | 82.5 | 82.5 | 86 |
| Triazine-phenol resin | 2 | 2 | 2 | 2 | 3 | |||
| Melamine cyanurate | 1 | 1 | 1 | 2 | 1.5 | |||
| Zinc borate | 2.5 | 3.5 | 3.5 | |||||
| Aluminium hydroxide | 2.5 | |||||||
| Magnesium hydroxide | 2.5 | |||||||
| Brominated bisphenol a type epoxy resin | 2 | |||||||
| Antimonous oxide | 1 | |||||||
| Triphenylphosphine | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 |
| Silane | 0.8 | 0.8 | 0.8 | 0.9 | 0.8 | 0.8 | 0.8 | 0.8 |
| Polyethylene/alkene synthetic wax | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 |
| Carbon black | 0.3 | 0.3 | 0.3 | 0.5 | 0.3 | 0.3 | 0.3 | 0.3 |
Each composition data is as described below among the table 1-2:
Resins, epoxy 1:ESCN-195XL, softening temperature: 65 ℃, epoxy equivalent (weight): 200g/eq is available from Sumitomo Chemical.
Resins, epoxy 2:YX-4000H, softening temperature: 105 ℃, epoxy equivalent (weight): 193g/eq is available from Shell.
Phenol resin 1:HRJ-1583, softening temperature: 84 ℃, OH equivalent: 103g/eq is available from Schenectady.
Phenol resin 2:XLC-3L, softening temperature: 72 ℃, OH equivalent: 172g/eq is available from Mitsui Chemicals.
Silicon-dioxide: FB-74 is available from electrical equipment chemical company.
Triazine-phenol resin: KA-7052-L2 is available from DIC company.
Melamine cyanurate: MC-25 is available from CIBA company limited.
Zinc borate: FB-415 is available from BORAX company.
Aluminium hydroxide: available from SHOWA DENKO company.
Magnesium hydroxide: assist bright chemical company.
Brominated bisphenol a type epoxy resin: Bren-S is available from Japanese chemical drug company.
Antimonous oxide: PATOX-MZ is available from Japanese concentrate.
Triphenylphosphine: TPP is available from northern part of the country company.
Polyethylene/alkene synthetic wax: PED-191, softening temperature: 105 ℃, available from Clariant company.
Silane: KBM-403 is available from Shin-Etsu company.
Zong Beam-at-the-eaves wax: Carnauba No.1 changes into available from East Asia.
Carbon black: Raven 3500 is available from Columbia Co., Ltd.
Test result
Table 3 physical property measurement result
| Flame-retardant resin composition | Embodiment | Comparative example | ||||||||
| 1 | 2 | 3 | 1 | 2 | 3 | 4 | 5 | |||
| Helicoidal flow (cm) | 86 | 83 | 87 | 90 | 92 | 78 | 83 | 58 | ||
| Gel time (sec) | 30 | 29 | 31 | 30 | 30 | 21 | 31 | 21 | ||
| Flame retardant resistance | 1.0mm | V-0 | V-0 | V-0 | V-0 | Perfect combustion | V-2 | V-2 | V-1 | |
| 2.0mm | V-0 | V-0 | V-0 | V-0 | Perfect combustion | V-1 | V-1 | V-0 | ||
| 3.0mm | V-0 | V-0 | V-0 | V-0 | Perfect combustion | V-0 | V-0 | V-0 | ||
Table 4 physical property measurement result
| Flame-retardant resin composition | Embodiment | Comparative example | |||||||
| 4 | 5 | 6 | 6 | 7 | 8 | 9 | 10 | ||
| Helicoidal flow (cm) | 96 | 91 | 97 | 99 | 95 | 80 | 85 | 69 | |
| Gel time (s ec) | 31 | 29 | 30 | 30 | 30 | 30 | 30 | 30 | |
| Flame retardant resistance | 1.0mm | V-0 | V-0 | V-0 | V-0 | Perfect combustion | V-2 | V-2 | V-1 |
| 2.0mm | V-0 | V-0 | V-0 | V-0 | Perfect combustion | V-1 | V-1 | V-0 | |
| 3.0mm | V-0 | V-0 | V-0 | V-0 | Perfect combustion | V-0 | V-0 | V-0 | |
Find out that by table 1 and table 2 are clear according to the resulting resin combination of the present invention, not containing halogen is main fire retardant or stibnide.
Observe table 3 and table 4, embodiment 1 to 6 resin combination contains fire retardant of the present invention, and test result shows to have excellent flame-retardant performance.Though comparative example 1 and 6 also has excellent flame-retardant performance, described fire retardant contains bromine and antimony, does not meet environmental requirement.Comparative example 2 and 7 does not add fire retardant, does not have a flame retardant resistance.The fire retardant that comparative example 3,4,8,9 uses does not comprise triazine-phenol resin and nitrogenous compound simultaneously, thereby the performance that test result is presented on the flame retardant resistance is bad, comparative example 5 and 10 fire retardants that use lack metallic compound, and its helicoidal flow is less, therefore learn mobile bad.
Therefore, learn that resin combination of the present invention represents remarkable moldability from table 3 and table 4; Use the semiconductor device of resin combination of the present invention, have remarkable flame retardant resistance.
Though preferred specific embodiment of the present invention is disclosed hereinbefore; but it is not in order to limit the present invention; any one of ordinary skill in the art, attainable variation of institute and retouching all are covered by in protection scope of the present invention in not breaking away from spirit of the present invention and category.
Claims (28)
1. fire retardant, it comprises (A) triazine-phenol resin, (B) nitrogenous compound and (C) extremely
Few a kind of metallic compound, wherein said triazine-phenol resin has following formula (I):
Wherein, m and n respectively are 1 to 10 integer; And R is OH, NH
2, COOH, SO
3H, C (O) H or CH
3CONH.
2. fire retardant according to claim 1, wherein in described triazine-phenol resin weight, its nitrogenous content be 15 to 24 weight %.
3. fire retardant according to claim 1, wherein said triazine-phenol resin has following formula (I
1):
Wherein m and n respectively are 1 to 5 integer.
4. fire retardant according to claim 1, wherein said nitrogenous compound are trimeric cyanamide or melamine cyanurate.
5. fire retardant according to claim 1, wherein said metallic compound are to be selected from zinc borate, zinc molybdate, metal hydroxides, complex metal hydroxide or its mixture.
6. fire retardant according to claim 5, wherein said metal hydroxides are aluminium hydroxide or magnesium hydroxide.
7. flame-retardant resin composition, it comprises according to the described fire retardant of arbitrary claim and Resins, epoxy, stiffening agent and inorganic filler in the claim 1 to 6.
8. constituent according to claim 7, wherein in the gross weight of described constituent, the content of described fire retardant is 0.1 to 15 weight %.
9. constituent according to claim 8, wherein in the gross weight of described constituent, the content of described fire retardant is 3 to 12 weight %.
10. constituent according to claim 7, wherein in the gross weight of described constituent, the content of described Resins, epoxy is 2 to 15 weight %.
11. constituent according to claim 10, wherein in the gross weight of described constituent, the content of described Resins, epoxy is 3 to 12 weight %.
12. constituent according to claim 7, wherein said Resins, epoxy comprise bisphenol epoxy, bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, phenol aldehyde type novolac epoxy, phenol aldehyde type alkyl phenolic Resins, epoxy, upgrading novolac epoxy, dicyclopentadiene Resins, epoxy or its mixture.
13. constituent according to claim 7, wherein in the gross weight of described constituent, the content of described stiffening agent is 2 to 10 weight %.
14. constituent according to claim 13, wherein in the gross weight of described constituent, the content of described stiffening agent is 3 to 6 weight %.
15. constituent according to claim 7, wherein said stiffening agent are phenol resin.
16. constituent according to claim 15, wherein said phenol resin comprise novolac resin, cresols novolac resin, triphenol alkylphenol, aralkyl resin, naphthalene type resol, Cyclopeutadiene type resol or its mixture.
17. constituent according to claim 7, wherein in the gross weight of described constituent, the content of described inorganic filler is 70 to 95 weight %.
18. constituent according to claim 7, wherein said inorganic filler comprise fusion silicon-dioxide, powdered quartz, talcum powder, aluminum oxide, silicon nitride or its mixture.
19. constituent according to claim 18, wherein said inorganic filler are fusion silicon-dioxide.
20. constituent according to claim 7, it also comprises hardening accelerator.
21. constituent according to claim 20, wherein in the gross weight of described constituent, the content of described hardening accelerator is 0.01 to 1 weight %.
22. constituent according to claim 20, wherein said hardening accelerator are tertiary amine, organic phosphine compound, imidazolium compounds or its mixture.
23. constituent according to claim 22, wherein said tertiary amine comprise triethylamine, xylidine, phenmethyl diformazan ammonia or N, N-dimethyl-aminomethyl phenol; Described organic phosphoric compound comprises triphenylphosphine, trimethyl-phosphine, three (p-methylphenyl) phosphine, triphenylphosphine triphenylborane or tetraphenylphosphoniphenolate tetraphenyl borate salts; And described imidazolium compounds comprises glyoxal ethyline, 2-methyl-4-methylimidazole, 2-heptadecyl imidazoles or 1-cyanoethyl-4-methylimidazole.
24. constituent according to claim 7, wherein in the gross weight of described constituent, the content of bromine atoms and antimony atoms is lower than 0.1 weight %.
25. constituent according to claim 7, it is used for the encapsulation of electronic component.
26. constituent according to claim 25, wherein said electronic component are semiconductor element.
27. a use is according to the purposes of the described constituent of arbitrary claim in the claim 7 to 24 at the various electronic components of encapsulation.
28. purposes according to claim 27, wherein said electronic component are semiconductor element.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100721345A CN100398592C (en) | 2005-05-20 | 2005-05-20 | Flame-proof agent and flame-proof resin composition comprising same, and its uses |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100721345A CN100398592C (en) | 2005-05-20 | 2005-05-20 | Flame-proof agent and flame-proof resin composition comprising same, and its uses |
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| Publication Number | Publication Date |
|---|---|
| CN1865329A true CN1865329A (en) | 2006-11-22 |
| CN100398592C CN100398592C (en) | 2008-07-02 |
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ID=37424484
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|---|---|---|---|
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102617861A (en) * | 2012-04-13 | 2012-08-01 | 浙江华亿工程设计有限公司 | Melamine cyanurate flame retardant agent containing organic silicone and preparation process thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69803267T2 (en) * | 1997-07-02 | 2002-05-16 | Sumitomo Bakelite Co. Ltd., Tokio/Tokyo | EPOXY RESIN COMPOSITIONS FOR SEMICONDUCTOR SEALING AND SEMICONDUCTOR DEVICE |
| JP2001151995A (en) * | 1999-11-30 | 2001-06-05 | Hitachi Chem Co Ltd | Heat-curable resin composition and insulating resin sheet using same |
| JP2001226464A (en) * | 2000-02-15 | 2001-08-21 | Japan Epoxy Resin Kk | Curable resin composition |
| DE10123626A1 (en) * | 2001-05-15 | 2002-11-21 | Bosch Gmbh Robert | Voltage changer for electric machines e.g. for starter in vehicle, has phase windings in a machine connected to multiple bridge circuits each with multiple electrically controllable switches and buffer store operating as a capacitor. |
| EP1312638A1 (en) * | 2001-11-16 | 2003-05-21 | Resolution Research Nederland B.V. | Halogen-free phosphorous-and nitrogen-containing flame-resistant epoxy resin compositions, and prepregs derived from thereof |
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2005
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102617861A (en) * | 2012-04-13 | 2012-08-01 | 浙江华亿工程设计有限公司 | Melamine cyanurate flame retardant agent containing organic silicone and preparation process thereof |
| CN102617861B (en) * | 2012-04-13 | 2013-11-06 | 浙江华亿工程设计有限公司 | Melamine cyanurate flame retardant agent containing organic silicone and preparation process thereof |
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| CN100398592C (en) | 2008-07-02 |
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