CN1860565A - Solid-state electrolytic capacitor and manufacturing method thereof - Google Patents
Solid-state electrolytic capacitor and manufacturing method thereof Download PDFInfo
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- CN1860565A CN1860565A CN 200580001032 CN200580001032A CN1860565A CN 1860565 A CN1860565 A CN 1860565A CN 200580001032 CN200580001032 CN 200580001032 CN 200580001032 A CN200580001032 A CN 200580001032A CN 1860565 A CN1860565 A CN 1860565A
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Abstract
A solid-state electrolytic capacitor includes: a planar anode terminal having a first plane connected to an anode of a capacitor element and a second plane arranged opposite to the first plane; a planar cathode terminal having a first plane connected to a cathode layer of the capacitor element and a second plane arranged opposite to the first plane and in the same plane of the second plane of the anode terminal; an insulating external package resin for covering the capacitor element, the anode terminal, and the cathode terminal while exposing the second plane of the anode terminal and the second plane of the cathode terminal. The anode terminal includes a first thick portion having a part of the first plane of the anode terminal and the second plane of the anode terminal and a first thin portion having a part of the first plane of the anode terminal, connected to the first thick portion, and thinner than the first thick portion. The cathode terminal includes a second thick portion having a part of the first plane of the cathode terminal and the second plane of the cathode terminal and a second thin portion having a part of the first plane of the cathode terminal, connected to the second thick portion, and thinner than the second thick portion. This solid-state electrolytic capacitor can reduce the equivalent series inductance and can be mounted stably on an object.
Description
Technical field
The present invention relates to be used for the solid electrolytic capacitor that comprises the solid electrolyte of making by conducting polymer of various electronic installations, and relate to the manufacture method of described capacitor.
Background technology
According to the high-frequency operation of electronic equipment, the capacitor that need be used for described equipment has excellent impedance operator under high frequency.In order to satisfy this requirement, comprise that the solid electrolytic capacitor of the solid electrolyte of being made by conducting polymer has great conductance.
Figure 22 is the perspective view that is disclosed in the conventional solid electrolytic capacitor 1100 in the disclosed open case of Japan Patent 2000-340463 number.Figure 23 is the perspective view of capacitor 1100.Figure 24 has the perspective view of otch for the part of the capacitor element 1030 of capacitor 1100.
As shown in figure 24; in capacitor element 1030; by the surface of the anode bodies of making such as the valve metal of aluminium foil 1031 through anodized forming dielectric oxide layer (dielectricoxide layer), and anode bodies 1031 is divided into cathode portion 1034 and anode part 1033 by diaphragm (Resist) 1032 with insulation characterisitic.Solid-state electrolyte layer 1035 is formed on the surface of cathode portion 1034.The cathode layer of being made by carbon (Carbon) and silver paste (Silver paste) 1036 is formed on the solid-state electrolyte layer 1035.
The anode part 1033 of capacitor element 1030 is placed on the connection surface of anode terminal 1037, and cathode layer 1034 is placed on the connection surface of cathode terminal 1038.The coupling part 1037A on the connection surface of folding anode terminal 1037 also is connected to anode part 1033 by resistance welded.Cathode layer 1034 is connected to the connection surface of cathode terminal 1038 by the conduction silver paste.Guider 1038A connects surperficial formation by the part of bending cathode terminal 1038.
Resin-encapsulated 1039 with insulation characterisitic holds capacitor element 1030, be connected to the anode terminal 1037 of described element and be connected to the cathode terminal 1038 of described element, is exposed to outside part separately to allow anode terminal 1037 and cathode terminal 1038 to have.The part that is exposed to the anode terminal 1037 of resin-encapsulated 1039 outsides and cathode terminal 1038 along edgewise bend separately to the bottom of resin-encapsulated 1039, thereby form outside terminal 1037B and 1038B respectively.
In conventional solid electrolytic capacitor 1100, anode terminal 1037 and cathode terminal 1038 have complicated structure, therefore are factors that increases cost.In addition, the anode terminal 1037 from the anode part 1033 of capacitor element 1030 and cathode portion 1034 to outside terminal 1037B and 1038B and the length of cathode terminal 1038 are quite long, and the solid electrolytic capacitor 1100 with big equivalent series inductance (ESL:Equivalent Series Inductance) and big equivalent series resistance (ESR:Equivalent Series Resistance) therefore is provided.Its capacitor is unfavorable for being used in around the CPU of personal computer, and described personal computer needs less ESL, big noise suppression performance and excellent transient response to handle high frequency.
Summary of the invention
Solid electrolytic capacitor comprises: planar-shaped anode terminal (flat-shaped anode terminal), its anode terminal have the anode part that is connected to capacitor element first surface and with described first surface opposing second surface; Planar-shaped cathode terminal, its cathode terminal have the first surface of the cathode layer that is connected to described capacitor element and with its first surface opposing second surface; With the resin-encapsulated of holding described capacitor element, described anode terminal and described cathode terminal with insulation characterisitic.The second surface of described cathode terminal and the second surface of described anode terminal are at grade.The second surface of described anode terminal and the second surface of described cathode terminal are exposed to the outside of resin-encapsulated.Anode terminal comprises first thickness portion and the thin first thin part than first thickness portion.Described first thickness portion has the part of the first surface of the second surface of anode terminal and anode terminal.Described first approaches the part of the first surface that partly has anode terminal and is connected to first thickness portion.Cathode terminal comprises second thickness portion and the thin second thin part than second thickness portion.Described second thickness portion has the part of the first surface of the second surface of cathode terminal and cathode terminal.The described second thin part has the part of first surface and is connected to second thickness portion.
This solid electrolytic capacitor has less equivalent series inductance, and can stably be installed to fixing body (mount body).
Description of drawings
Figure 1A is the plane graph according to the solid electrolytic capacitor of embodiments of the invention 1.
Figure 1B is the front view according to the solid electrolytic capacitor of embodiment 1.
Fig. 1 C is the upward view according to the solid electrolytic capacitor of embodiment 1.
Fig. 1 D is the end view according to the solid electrolytic capacitor of embodiment 1.
Fig. 1 E is the perspective view according to the solid electrolytic capacitor that is installed to described fixing body of embodiment 1.
Fig. 2 has the perspective view of otch for the part according to the capacitor element of the solid electrolytic capacitor of embodiment 1.
Fig. 3 A is the substrate plane figure that is used to make according to the solid electrolytic capacitor of embodiment 1.
Fig. 3 B is the cross-sectional view at the substrate at the line 3B-3B place shown in Fig. 3 A.
Fig. 4 A is the plane graph according to the solid electrolytic capacitor of embodiments of the invention 2.
Fig. 4 B is the front view according to the solid electrolytic capacitor of embodiment 2.
Fig. 4 C is the upward view according to the solid electrolytic capacitor of embodiment 2.
Fig. 4 D is the end view according to the solid electrolytic capacitor of embodiment 2.
Fig. 5 has the perspective view of otch for the part according to the capacitor element of the solid electrolytic capacitor of embodiment 2.
Fig. 6 A is the plane graph that is used to make according to the substrate of the solid electrolytic capacitor of embodiment 2.
Fig. 6 B is the cross-sectional view at the substrate at the line 6B-6B place shown in Fig. 6 A.
Fig. 7 A is the plane graph according to the solid electrolytic capacitor of embodiments of the invention 3.
Fig. 7 B is the front view according to the solid electrolytic capacitor of embodiment 3.
Fig. 7 C is the upward view according to the solid electrolytic capacitor of embodiment 3.
Fig. 7 D is the end view according to the solid electrolytic capacitor of embodiment 3.
Fig. 8 A is the plane graph according to the solid electrolytic capacitor of embodiments of the invention 4.
Fig. 8 B is the front view according to the solid electrolytic capacitor of embodiment 4.
Fig. 8 C is the upward view according to the solid electrolytic capacitor of embodiment 4.
Fig. 8 D is the end view according to the solid electrolytic capacitor of embodiment 4.
Fig. 9 A is the plane graph according to the solid electrolytic capacitor of embodiments of the invention 5.
Fig. 9 B is the front view according to the solid electrolytic capacitor of embodiment 5.
Fig. 9 C is the upward view according to the solid electrolytic capacitor of embodiment 5.
Fig. 9 D is the end view according to the solid electrolytic capacitor of embodiment 5.
Figure 10 A is the plane graph according to the solid electrolytic capacitor of embodiments of the invention 6.
Figure 10 B is the front view according to the solid electrolytic capacitor of embodiment 6.
Figure 10 C is the upward view according to the solid electrolytic capacitor of embodiment 6.
Figure 10 D is the end view according to the solid electrolytic capacitor of embodiment 6.
Figure 11 has the perspective view of otch for the part according to the capacitor element of the solid electrolytic capacitor of embodiment 6.
Figure 12 A is the substrate plane figure that is used to make according to the solid electrolytic capacitor of embodiment 6.
Figure 12 B is the cross-sectional view at the substrate at the line 12B-12B place shown in Figure 12 A.
Figure 13 A is the plane graph according to the solid electrolytic capacitor of embodiments of the invention 7.
Figure 13 B is the front view according to the solid electrolytic capacitor of embodiment 7.
Figure 13 C is the upward view according to the solid electrolytic capacitor of embodiment 7.
Figure 13 D is the end view according to the solid electrolytic capacitor of embodiment 7.
Figure 14 A is the plane graph according to the solid electrolytic capacitor of embodiments of the invention 8.
Figure 14 B is the front view according to the solid electrolytic capacitor of embodiment 8.
Figure 14 C is the upward view according to the solid electrolytic capacitor of embodiment 8.
Figure 14 D is the end view according to the solid electrolytic capacitor of embodiment 8.
Figure 15 A is the plane graph according to the solid electrolytic capacitor of embodiments of the invention 9.
Figure 15 B is the front view according to the solid electrolytic capacitor of embodiment 9.
Figure 15 C is the upward view according to the solid electrolytic capacitor of embodiment 9.
Figure 15 D is the end view according to the solid electrolytic capacitor of embodiment 9.
Figure 16 A is the plane graph according to the solid electrolytic capacitor of embodiments of the invention 10.
Figure 16 B is the front view according to the solid electrolytic capacitor of embodiment 10.
Figure 16 C is the upward view according to the solid electrolytic capacitor of embodiment 10.
Figure 16 D is the end view according to the solid electrolytic capacitor of embodiment 10.
Figure 17 A is the plane graph according to the solid electrolytic capacitor of embodiments of the invention 11.
Figure 17 B is the front view according to the solid electrolytic capacitor of embodiment 11.
Figure 17 C is the upward view according to the solid electrolytic capacitor of embodiment 11.
Figure 17 D is the end view according to the solid electrolytic capacitor of embodiment 11.
Figure 18 A is the plane graph according to the solid electrolytic capacitor of embodiments of the invention 12.
Figure 18 B is the front view according to the solid electrolytic capacitor of embodiment 12.
Figure 18 C is the upward view according to the solid electrolytic capacitor of embodiment 12.
Figure 18 D is the end view according to the solid electrolytic capacitor of embodiment 12.
Figure 18 E is the perspective view according to another solid electrolytic capacitor of embodiment 12.
Figure 19 A is the plane graph according to the solid electrolytic capacitor of embodiments of the invention 13.
Figure 19 B is the front view according to the solid electrolytic capacitor of embodiment 13.
Figure 19 C is the upward view according to the solid electrolytic capacitor of embodiment 13.
Figure 19 D is the end view according to the solid electrolytic capacitor of embodiment 13.
Figure 20 A is the plane graph according to the solid electrolytic capacitor of embodiments of the invention 14.
Figure 20 B is the front view according to the solid electrolytic capacitor of embodiment 14.
Figure 20 C is the upward view according to the solid electrolytic capacitor of embodiment 14.
Figure 20 D is the end view according to the solid electrolytic capacitor of embodiment 14.
Figure 21 A is the plane graph according to the solid electrolytic capacitor of embodiments of the invention 15.
Figure 21 B is the front view according to the solid electrolytic capacitor of embodiment 15.
Figure 21 C is the upward view according to the solid electrolytic capacitor of embodiment 15.
Figure 21 D is the end view according to the solid electrolytic capacitor of embodiment 15.
Figure 22 is the view of conventional solid electrolytic capacitor.
Figure 23 is the perspective view of conventional solid electrolytic capacitor.
Figure 24 has the perspective view of otch for the part of the capacitor element of conventional solid electrolytic capacitor.
Reference numeral
1 capacitor element
2 anode bodies
3 diaphragms
4 anode parts
5 cathode portion
6 solid-state electrolyte layer
7 cathode layers
8 anode lead frame
The 8A guider
The 8B tie point
9 cathode leg frames
9A, 9B guider
10 anode terminals
The thin part of 10A (the first thin part, the 3rd thin part)
The 10B tie point
10E thickness portion (first thickness portion)
11 cathode terminals
The thin part of 11A (the second thin part, the 3rd thin part)
The 11B tie point
11E thickness portion (second thickness portion)
12 resin-encapsulated
501 capacitor elements
502 anode bodies
503 diaphragms
504 anode parts
505 cathode portion
506 solid-state electrolyte layer
507 cathode layers
508 anode lead frame
The 508A guider
The 508B tie point
509 cathode leg frames
509A, 509B guider
510 anode terminals
The thin part of 510A (the first thin part, the 3rd thin part)
The 510B tie point
The 510C ledge
510E thickness portion (first thickness portion)
511 cathode terminals
The thin part of 511A (the second thin part, the 3rd thin part)
511E thickness portion (second thickness portion)
512 resin-encapsulated
514 cathode terminals
The thin part of 514A (the second thin part, the 3rd thin part)
514C seat part (seating portion)
The 514D ledge
514E thickness portion (second thickness portion)
515 anode terminals
The thin part of 515A (the first thin part, the 3rd thin part)
The 515B tie point
The 515C ledge
515E thickness portion (first thickness portion)
516 cathode terminals
The thin part of 516A (the second thin part, the 3rd thin part)
516C seat part
The 516D ledge
516E thickness portion (second thickness portion)
517 cathode terminals
The thin part of 517A (the second thin part, the 3rd thin part)
The 517C ledge
517E thickness portion (second thickness portion)
601 capacitor elements
602 anode bodies
603 diaphragms
604 anode parts
605 cathode portion
606 solid-state electrolyte layer
607 cathode layers
608 anode lead frame
The 608A guider
The 608B tie point
609 cathode leg frames
609A, 609B guider
610 anode terminals
The thin part of 610A (the first thin part, the 3rd thin part)
The 610B tie point
610E thickness portion (first thickness portion)
611 cathode terminals
The thin part of 611A (the second thin part, the 3rd thin part)
The 611B tie point
611E thickness portion (second thickness portion)
612 resin-encapsulated
The 612A resin-encapsulated
612B, 612C recess
614 cathode terminals
The thin part of 614A (the second thin part, the 3rd thin part)
614C seat part
614E thickness portion (second thickness portion)
615 cathode terminals
The thin part of 615A (the second thin part, the 3rd thin part)
615E thickness portion (second thickness portion)
616 anode terminals
The thin part of 616A (the first thin part, the 3rd thin part)
The 616C ledge
616E thickness portion (first thickness portion)
617 cathode terminals
The thin part of 617A (the second thin part, the 3rd thin part)
The 617C ledge
617E thickness portion (second thickness portion)
618 cathode terminals
The thin part of 618A (the second thin part, the 3rd thin part)
618C, 618D ledge
618E thickness portion (second thickness portion)
691 cathode terminals
The thin part of 619A (the second thin part, the 3rd thin part)
619C, 619D ledge
619E thickness portion (second thickness portion)
620 anode terminals
The thin part of 620A (the first thin part, the 3rd thin part)
The 620C ledge
620E thickness portion (first thickness portion)
621 cathode terminals
The thin part of 621A (the second thin part, the 3rd thin part)
The 621C ledge
621E thickness portion (second thickness portion)
622 cathode terminals
The thin part of 622A (the second thin part, the 3rd thin part)
622C, 622D ledge
622E thickness portion (second thickness portion)
623 cathode terminals
The thin part of 623A (the second thin part, the 3rd thin part)
623C, 623D ledge
623E thickness portion (second thickness portion)
624 cathode terminals
The thin part of 624A (the second thin part, the 3rd thin part)
624E thickness portion (second thickness portion)
701 fixing bodies
Embodiment
Figure 1A is to the solid electrolytic capacitor 101 of 1D displaying according to embodiments of the invention 1.Figure 1B is the front view of solid electrolytic capacitor 101.Figure 1A, 1C and 1D be respectively the solid electrolytic capacitor 101 shown in Figure 1B from the being seen plane graph of direction IA, from the being seen upward view of direction IC with from the being seen end view of direction ID.Fig. 2 has the perspective view of otch for the part of the capacitor element 1 of solid electrolytic capacitor 101.Fig. 1 E is the perspective view that is installed to the solid electrolytic capacitor 101 of fixing body 701.
As shown in Figure 2, capacitor element 1 has writing board shape substantially.Make by the rough surface of the anode bodies of making such as the valve metal (valve metal) of aluminium foil 2 and make it, on described surface, form dielectric oxide layer 2A through anodized.Diaphragm (Resist) 3 with insulation characterisitic is arranged on the dielectric oxide layer 2A, and the anode bodies 2 of the dielectric oxide layer 2A that will be formed from the teeth outwards is divided into cathode portion 5 and anode part 4.The solid-state electrolyte layer of being made by conducting polymer 6 is arranged on the dielectric oxide layer 2A of cathode portion 5, and the cathode layer of being made by carbon (Carbon) and silver paste (Silver paste) 7 is placed on the solid-state electrolyte layer 6.
According to embodiment 1, pile up five capacitor elements 1, make the anode part 4 of a capacitor element in the capacitor element 1 be placed on the anode lead frame 8.The guider 8A that is folded and is arranged at anode lead frame 8 two side ends places wraps up the anode part 4 of all five capacitor elements 1, and by laser welding its integral body is connected to anode part 4 at tie point 8B place.
The cathode portion 5 of five capacitor elements that pile up 1 is placed on the cathode leg frame 9 via electroconductive binder.Five capacitor elements 1 are positioned and by fixing and whole the connection with guider 9B at the far-end of cathode leg frame 9 at the guider 9A at two side ends place.Therefore, overall package plurality of capacitors element 1, anode lead frame 8 and cathode leg frame 9, thus constitute capacitor element unit 2101.
Resin-encapsulated 12 with insulation characterisitic is held capacitor element unit 2101, and makes the surperficial 10G and the 11G of anode terminal 10 and cathode terminal 11 be exposed to the outside.According to embodiment 1, resin-encapsulated 12 is made by epoxy resin.Capacitor 101 is installed to the fixing body 701 such as distributing board, shown in Fig. 1 E.In this case, surperficial 10G and 11G serve as installation surface.
Fig. 3 A is the plane graph of substrate 13 with the ring-type that is used to provide a plurality of anode terminals 10 and cathode terminal 11.Fig. 3 B is the cross-sectional view at the substrate 13 at the line 3B-3B place shown in Fig. 3 A.Substrate 13 is made by copper alloy, and have be formed at wherein be used for intermittently feed-in feed-in hole 13A.Anode terminal 10 and cathode terminal 11 are formed in the substrate 13 continuously with predetermined space.Plurality of capacitors cell 2101 is settled and is connected on anode terminal 10 and the cathode terminal 11 respectively and is contained in the resin-encapsulated 12 with insulation characterisitic.Then, anode terminal 10 and cathode terminal 11 are blocked from substrate 13, therefore a plurality of chip capacitors 101 are provided.
Have in the substrate 13 that wherein forms anode terminal 10 and cathode terminal 11 and form by etching metal plate.Described etching is removed unnecessary portions and is made anode terminal 10 and the both sides attenuation of cathode terminal 11, thereby forms thin part 10A and 11A simultaneously.Thickness difference 10J between definite thin part 10A and the thickness portion 10E and the thickness difference 11J between thin part 11A and the thickness portion 11E are not less than 80 μ m.The described size of thickness difference 10J and 11J is that the insulating resin encapsulation 12 of holding capacitor element unit 2101 can flow into recess 10H and the needed size of 11H fully.The size of thickness difference 10J and 11J rises to the degree that terminal 10A and 11A do not lose the function of splicing ear.
Solid electrolytic capacitor 101 according to embodiment 1, by anode terminal 10 and cathode terminal 11 with writing board shape, the anode part 4 and the cathode portion 5 of capacitor element 1 can reach the outside by short distance, have less equivalent series resistance (ESR) and less equivalent series inductance (ESL) whereby.The ESL of solid electrolytic capacitor 101 is 800pH, and it is about half of ESL of the 1500pH of the conventional solid electrolytic capacitor 1100 shown in Figure 22 to 24.
According to embodiment 1, the anode bodies of capacitor element 12 is made by aluminium foil, but is not limited to aluminium foil.Anode bodies can be by making such as other valve metal of the paper tinsel of tantalum or niobium or sintered body, its combination.
The thin part 10A and the 11A of anode terminal 10 and cathode terminal 11 form by etching, but are not limited thereto, and also can form by press forming.
According to embodiment 1, pile up plurality of capacitors element 1 and be connected to anode lead frame 8 and cathode leg frame 9 so that capacitor element unit 2101 to be provided, and then be connected to anode terminal 10 and cathode terminal 11.Yet described structure is not limited thereto the structure of embodiment.One or more capacitor element 1 can be directly connected to anode terminal 10 and cathode terminal 11.This can further reduce ESL.The number that constitutes the capacitor element 1 in the capacitor element unit 2101 needn't be restricted to five, can determine its number according to predetermined volumes.
Fig. 4 A is to the solid electrolytic capacitor 5101 of 4D displaying according to embodiments of the invention 2.Fig. 4 B is the front view of solid electrolytic capacitor 5101.Fig. 4 A, 4C, 4D be respectively the solid electrolytic capacitor 5101 shown in Fig. 4 B from the being seen plane graph of direction IVA, from the being seen upward view of direction IVC with from the being seen end view of direction IVD.Fig. 5 has the perspective view of otch for the part of the capacitor element 501 of solid electrolytic capacitor 5101.
As shown in Figure 5, capacitor element 501 has writing board shape substantially.Make by the rough surface of the anode bodies of making such as the valve metal of aluminium foil 502 and through anodized on described surface, to form dielectric oxide layer 502A.Diaphragm (Resist) 503 with insulation characterisitic is arranged at dielectric oxide layer 502A and goes up anode bodies 502 is divided into cathode portion 505 and anode part 504.Solid-state electrolyte layer 506 is arranged on the dielectric oxide layer 502A of cathode portion 505, and is placed on the solid-state electrolyte layer 506 by the cathode layer 507 that carbon and silver paste are made.
According to embodiment 2, pile up five capacitor elements 501 and make the anode part 504 of a capacitor element of capacitor element 501 be positioned on the anode lead frame 508.Be folded and be arranged at the anode part 504 of guider 508A to wrap up all five capacitor elements 501 at the two side ends place of anode lead frame 508, and integral body is connected to anode part 504 by laser welding at tie point 508B place.
The cathode portion 505 of five stacked capacitor elements 501 is placed on the cathode leg frame 509 via electroconductive binder.Five capacitor elements 501 are positioned and fixing and whole the connection by the guider 509A at two side ends place and the guider 509B of cathode leg frame 509 far-ends.The plurality of capacitors element 501 of overall package, anode lead frame 508 and cathode leg frame 509 constitute capacitor element unit 5101A in the above described manner.
With towards the surperficial 510G of the surperficial 511G of the relative cathode terminal 511 of the surperficial 511F of capacitor element 501 and anode terminal 510 at grade.The surperficial 510F configuration of the as close as possible anode terminal 510 of surperficial 511G of cathode terminal 511.Distance L 1 between the surperficial 511G of cathode terminal 511 and the surperficial 510G of anode terminal 510 is not shorter than 1mm, and is preferably 1mm.Distance less than 1mm may cause the electric current between the described surface to leak.Cathode terminal 511 has thickness portion 511E and the thin part 511A that contains surperficial 511G.Thin part 511A is thinner than thickness portion 511E, and extends on the direction relative with anode terminal 510.The surperficial 511F that comprises the cathode terminal 511 of thickness portion 511E and thin part 511A is smooth.Thin part 511A has the part of 511 surperficial 511F of cathode terminal, and thickness portion 511E has the part of surperficial 511F.The surperficial 511K of thin part 511A is covered by resin-encapsulated 512 and is not exposed to the outside, does not serve as the installation surface that is configured to be installed on the described fixing body.The cathode leg frame 509 of capacitor element unit 5101A is placed on the surperficial 511F of cathode terminal 511, and is connected to cathode terminal 511 at the tie point 511B place of thin part 511A inside by laser welding.
Have the resin-encapsulated 512 integrally contained capacitor element unit 5101A of insulation characterisitic and make ledge 510C and the surperficial 511G of the surperficial 510G of anode terminal 510 and cathode terminal 511 is exposed to the outside.According to embodiment 2, resin-encapsulated 512 is made by epoxy resin.
Fig. 6 A is the plane graph of substrate 513 with the ring-type that is used to provide a plurality of anode terminals 510 and cathode terminal 511.Fig. 6 B is the cross-sectional view at the substrate 513 at the line 6B-6B place shown in Fig. 6 A.Substrate 513 is made by copper alloy, and has to be formed at and wherein be used for the intermittently feed-in hole 513A of feed-in.Anode terminal 510 and cathode terminal 511 are formed in the substrate 513 continuously with predetermined space.Plurality of capacitors cell 5101A is placed on anode terminal 510 and the cathode terminal 511 respectively and is connected, and is covered respectively by a plurality of resin-encapsulated 512.Then, anode terminal 510 and cathode terminal 511 are blocked so that a plurality of chip capacitors 501 to be provided from substrate 513.
According to anode terminal 510 and the cathode terminal 511 of solid electrolytic capacitor 501 by having writing board shape of embodiment 2, the anode part 504 and the cathode portion 505 of capacitor element 501 can reach the outside by short distance.In addition, the surperficial 510G of the as close as possible anode terminal 510 of surperficial 511G of cathode terminal 511 is configured to the distance between anode terminal 510 and the cathode terminal 511 is tapered to the shortest, and less equivalent series resistance (ESR) and less equivalent series inductance (ESL) are provided whereby.The ESL of the solid electrolytic capacitor 5101 of embodiment 2 is 500pH, its be about the conventional solid electrolytic capacitor 1100 shown in Figure 22 to 24 1500pH ESL 1/3rd.
The surperficial 510G of anode terminal 510 has outward extending ledge 510C.This structure makes can observe fillet of solder (solder fillet) when the capacitor welded and installed to such as the fixing body of distributing board the time easily from the top, provide whereby to have the height reliability welded capacitor.
According to embodiment 2, the anode bodies of capacitor element 501 502 is made by aluminium foil, but is not limited to aluminium foil.Anode bodies can be made by other valve metal of the paper tinsel of tantalum or niobium or sintered body, its combination.
The thin part 510A of anode terminal 510 and cathode terminal 511 and 511A form by etching but are not limited to etching and form, and also can form by press forming.
According to embodiment 2, pile up plurality of capacitors element 501 and be connected to anode lead frame 508 and cathode leg frame 509 forming capacitor element unit 5101A, and be connected to anode terminal 510 and cathode terminal 511.Yet described structure is not limited thereto the structure of embodiment.One or more capacitor element 501 can be directly connected to anode terminal 510 and cathode terminal 511.This can further reduce ESL.The number that constitutes the capacitor element 501 among the capacitor element unit 5101A it be not necessary for five, but can determine the number of capacitor element 501 according to predetermined volumes.
Fig. 7 A is to the solid electrolytic capacitor 5102 of 7D displaying according to embodiments of the invention 3.Fig. 7 B is the front view of solid electrolytic capacitor 5102.Fig. 7 A, Fig. 7 C and Fig. 7 D be the solid electrolytic capacitor 5102 shown in Fig. 7 B from the being seen plane graph of direction VIIA, from the being seen upward view of direction VIIC with from the being seen end view of direction VIID.The assembly identical with the assembly of embodiment 2 will be represented by identical Reference numeral, and omit its detailed description.
The lower surface 514G of cathode terminal 514 be configured to the lower surface 510G of anode terminal 510 (installation surface when the fixing body that is installed to such as distributing board) at grade, and the lower surface 510G of as close as possible anode terminal 510.Distance L 2 between the surperficial 514G of cathode terminal 514 and the surperficial 510G of anode terminal 510 is not less than 1mm, and is preferably 1mm.Distance less than 1mm can cause the electric current between the described surface to leak.Cathode terminal 514 comprises thickness portion 514E and the thin part 514A with surperficial 514G.Thin part 514A is thinner than thickness portion 514E, and extends in the direction relative with anode terminal 510 from thickness portion 514E.Cover by resin-encapsulated 512 with surperficial 514K and be not exposed to the outside, do not serve as the installation surface that is configured to be installed to fixing body towards the surperficial relative thin part 514A of the thin part of capacitor element 501.Cathode terminal 514 is included in the mounting portion 514C of the end of the thin part 514A relative with anode terminal 510.Described mounting portion 514C has the lower surface 514L that serves as installation surface.Surface 514L and surperficial 510G and 511G are at grade.Mounting portion 514C stretches out, and cathode terminal 514 has the ledge 514D that gives prominence to from resin-encapsulated 512.
According to embodiment 3 solid electrolytic capacitors 5102, by the mounting portion 514C of cathode terminal 514, make cathode terminal 514 and anode terminal 510 all have installation surface, capacitor stably is installed on the fixing body.
The mounting portion 514C of cathode terminal 514 has outward extending ledge 514D.When capacitor is soldered when being installed to fixing body, this structure makes and can observe fillet of solder easily from the top, be similar to the ledge 510C of anode terminal 510, provides whereby to have the height reliability welded capacitor.
Be similar to the solid electrolytic capacitor 5101 of embodiment 2, have less equivalent series resistance (ESR) and less equivalent series inductance (ESL) according to the solid electrolytic capacitor 5102 of embodiment 3.The ESL of the solid electrolytic capacitor 5102 of embodiment 3 is 500pH, its be the conventional solid electrolytic capacitor 1100 shown in Figure 22 to 24 1500pH ESL 1/3rd.
Fig. 8 A is to the solid electrolytic capacitor 5103 of 8D displaying according to embodiments of the invention 4.Fig. 8 B is the front view of solid electrolytic capacitor 5103.Fig. 8 A, 8C and 8D be the solid electrolytic capacitor 5103 shown in Fig. 8 B from the being seen plane graph of direction VIIIA, from the being seen upward view of direction VIIIC with from the being seen end view of direction VIIID.The assembly identical with the assembly of embodiment 3 will be represented by identical Reference numeral, and will omit its detailed description.
The lower surface 516G of cathode terminal 516 and the lower surface 515G of anode terminal 515 dispose at grade, and the lower surface 515G of as close as possible anode terminal 515.Distance L 3 between the surperficial 516G of cathode terminal 516 and the surperficial 515G of anode terminal 515 is not less than 1mm, and is preferably 1mm.Distance less than 1mm can cause the electric current between the described surface to leak.The lower surface 516G of cathode terminal 516 serves as the installation surface on fixing body to be installed.Cathode terminal 516 comprises thickness portion 516E and the thin part 516A with surperficial 516G.Thin part 516A is thinner than thickness portion 516E, and extends in the direction relative with anode terminal 515 from thickness portion 516E.Cover by resin-encapsulated 512 with surperficial 516K and be not exposed to the outside, do not serve as the installation surface to described fixing body to be installed towards the surperficial relative thin part 516A of the thin part of capacitor element 501.
According to the solid electrolytic capacitor 5103 of embodiment 4, by the mounting portion 516C of cathode terminal 516, anode terminal 515 and cathode terminal 516 all have installation surface, thereby make capacitor stably be installed to fixing body.
Be similar to the solid electrolytic capacitor 5101 of embodiment 2, have less equivalent series resistance (ESR) and less equivalent series inductance (ESL) according to the solid electrolytic capacitor 5103 of embodiment 4.The ESL of the solid electrolytic capacitor 5103 of embodiment 4 is 500pH, its be the conventional solid electrolytic capacitor 1100 shown in Figure 22 to 24 1500pH ESL 1/3rd.
Fig. 9 A is to the solid electrolytic capacitor 5104 of 9D displaying according to embodiments of the invention 5.Fig. 9 B is the front view of solid electrolytic capacitor 5104.Fig. 9 A, Fig. 9 C and Fig. 9 D be the solid electrolytic capacitor 5104 shown in Fig. 9 B from the being seen plane graph of direction IXA, from the being seen upward view of direction IXC with from the being seen end view of direction IXD.The assembly identical with the assembly of embodiment 4 will be represented by identical Reference numeral, and will omit its detailed description.
With towards the lower surface 515G of the lower surface 517G of the relative cathode terminal 517 of the surperficial 517F of capacitor element 501 and anode terminal 515 at grade, and the lower surface 515G of as close as possible anode terminal 515.Distance L 4 between the surperficial 517G of cathode terminal 517 and the surperficial 515G of anode terminal 515 is not less than 1mm, and is preferably 1mm.Distance less than 1mm can cause the electric current between the described surface to leak.Cathode terminal 517 comprises thickness portion 517E and the thin part 517A with surperficial 517G.Thin part 517A is thinner than thickness portion 517E, and is connected to the both sides of thickness portion 517E.The surperficial 517K of the cathode terminal 517 relative with surperficial 517F is covered by resin-encapsulated 512 and is not exposed to the outside, does not serve as the installation surface to described fixing body to be installed.
Cathode terminal 517 is included in the ledge 517C of the end of the thin part 517A relative with anode terminal 515.The lower surface 517G of cathode terminal 517 extends to the end with anode terminal 515 facing surfaces.Thin part 517A is arranged at the both sides of cathode terminal 517 on the direction D502 perpendicular to 517 direction D501 of configuration anode terminal 515 and cathode terminal.That is, the thickness portion 517E of cathode terminal 517 is arranged between the thin part 517A, and thin part 517A and thickness portion 517E are arranged on the direction D502.
In anode terminal 515, thickness portion 515E is arranged between the thin part 515A, and thin part 515A and thickness portion 515E are arranged on the direction D502.
Except the technique effect of the solid electrolytic capacitor 5103 of embodiment 4, solid electrolytic capacitor 5104 has the cathode terminal 517 of easy formation, and can stably be installed on the fixing body.
Be similar to the solid electrolytic capacitor 5101 of embodiment 2, the solid electrolytic capacitor 5104 of embodiment 5 has less equivalent series resistance (ESR) and less equivalent series inductance (ESL).The ESL of the solid electrolytic capacitor 5104 of embodiment 5 is 500pH, its be the conventional solid electrolytic capacitor 1100 shown in Figure 22 to 24 1500pH ESL 1/3rd.
Figure 10 A is to the solid electrolytic capacitor 6101 of 10D displaying according to embodiments of the invention 6.Figure 10 B is the front view of solid electrolytic capacitor 6101.Figure 10 A, 10C and 10D be the solid electrolytic capacitor 6101 shown in Figure 10 B from the being seen plane graph of direction XA, from the being seen upward view of direction XC with from the being seen end view of direction XD.Figure 11 has the perspective view of otch for the part of the capacitor element 601 of solid electrolytic capacitor 6101.
As shown in figure 11, capacitor element 601 has writing board shape.Make by the rough surface of the anode bodies of making such as the valve metal of aluminium foil 602 and through anodized, thereby on described surface, form dielectric oxide layer 602A.Diaphragm (Resist) 603 with insulation characterisitic is arranged at dielectric oxide layer 602A and goes up anode bodies 602 is divided into cathode portion 605 and anode part 604.Solid-state electrolyte layer 606 is arranged on the dielectric oxide layer 602A of cathode portion 605, and then will be placed on the solid-state electrolyte layer 606 by the cathode layer 607 that carbon and silver paste are made.
According to embodiment 6, pile up five capacitor elements 601, make the anode part 604 of a capacitor element in the capacitor element 601 be positioned on the anode lead frame 608.The guider 608A that is folded and is arranged at the two side ends place of anode lead frame 608 wraps up the anode part 604 of all five capacitor elements 601, and is connected to anode part 604 at tie point 608B place by laser welding integral body.
The cathode portion 605 of five capacitor elements that pile up 601 is placed on the cathode leg frame 609 via electroconductive binder.Locate five capacitor elements 601 and by fixing with guider 609B and whole the connection at cathode leg frame 609 far-ends at the guider 609A at two side ends place.Capacitor element 601, anode lead frame 608 and the cathode leg frame 609 of organizing overall package in the above described manner constitute capacitor element unit 6101A.
With towards the surperficial 610G of the surperficial 611G of the relative cathode terminal 611 of the surperficial 611F of capacitor element 601 and anode terminal 610 at grade.The surperficial 610G configuration of the as close as possible anode terminal 610 of surperficial 611G of cathode terminal 611.Distance L 5 between the surperficial 611G of cathode terminal 611 and the surperficial 610G of anode terminal 610 is not less than 1mm, and is preferably 1mm.Distance less than 1mm can cause electric current leakage between the described surface.Cathode terminal 611 comprises thickness portion 611E and the thin part 611A with surperficial 611G.Thin part 611A is thinner than thickness portion 611E, and extends on the direction relative with anode terminal 610.The surperficial 611F that comprises the cathode terminal 611 of thickness portion 611E and thin part 611A is smooth.Thin part 611A has the part of 611 surperficial 611F of cathode terminal, and thickness portion 611E has the part of surperficial 611F.The surperficial 611K of the thin part 611A relative with surperficial 611F is covered by resin-encapsulated 612 and is not exposed to the outside, does not serve as the installation surface to described fixing body to be installed.The cathode leg frame 609 of capacitor element unit 6101A is placed on the surperficial 611F of cathode terminal 611, and is connected to cathode terminal 611 at the tie point 611B place of thin part 611A inside by laser welding.
Have the resin-encapsulated 612 integrally contained capacitor element unit 6101A of insulation characterisitic, make the surperficial 610G of anode terminal 610 and the surperficial 611G of cathode terminal 611 be exposed to the outside.According to embodiment 6, resin-encapsulated 612 is made by epoxy resin.
Figure 12 A is the plane graph of substrate 613 with the ring-type that is used to provide a plurality of anode terminals 610 and cathode terminal 611.Figure 12 B is the cross-sectional view at the substrate 613 at the line 12B-12B place shown in Figure 12 A.Substrate 613 is made by copper alloy, and has to be formed at and wherein be used for the intermittently feed-in hole 613A of feed-in.A plurality of anode terminals 610 and cathode terminal 611 are formed in the substrate 613 continuously with predetermined space.Plurality of capacitors cell 6101A is placed in going up and be connected to it and covered by resin-encapsulated 612 separately of a plurality of anode terminals 610 and cathode terminal 611 respectively.Then block anode terminal 610 and cathode terminal 611 so that a plurality of chip capacitors 601 to be provided from substrate 613.
Having a plurality of anode terminals 610 that are formed at wherein and the substrate 613 of cathode terminal 611 forms by etching metal plate.Described etching is by removing unnecessary portions and making anode terminal 610 and the both sides attenuation of cathode terminal 611 and form thin part 610A and 611A simultaneously.Thickness difference 610J between definite thin part 610A and the thickness portion 610E and the thickness difference 611J between thin part 611A and the thickness portion 611E are not less than 80 μ m.The described size of thickness difference 610J and 611J is that the permission resin-encapsulated 612 of holding capacitor element unit 6101A can fully flow among the recess 610H and the last needed size of surperficial 611K.
According to the solid electrolytic capacitor 601 of embodiment 6, by anode terminal 610 and the cathode terminal 611 with writing board shape, the anode part 604 and the cathode portion 605 of capacitor element 601 can reach the outside by short distance.In addition, the surperficial 610G of the as close as possible anode terminal 610 of surperficial 611G of cathode terminal 611 is configured to the distance between anode terminal 610 and the cathode terminal 611 is tapered to the shortest, and the capacitor of less equivalent series resistance (ESR) and less equivalent series inductance (ESL) is provided whereby.The ESL of the solid electrolytic capacitor 6101 of embodiment 6 is 800pH, and it is about half of ESL of conventional solid electrolytic capacitor 1100 1500pH shown in Figure 22 to 24.
According to embodiment 6, the anode bodies of capacitor element 601 602 is made by aluminium foil, but is not limited to aluminium foil.Anode bodies can be by making such as other valve metal of the paper tinsel of tantalum or niobium or sintered body, its combination.
The thin part 610A and the 611A of anode terminal 610 and cathode terminal 611 form by etching, form but be not limited to etching, also can form by press forming.
According to embodiment 6, pile up plurality of capacitors element 601 and be connected to anode lead frame 608 and cathode leg frame 609 constituting capacitor element unit 6101A, and then, be connected to anode terminal 610 and cathode terminal 611.Yet described structure is not limited thereto the structure of embodiment.One or more capacitor element 601 can be directly connected to anode terminal 610 and cathode terminal 611.This can further reduce ESL.The number that constitutes the capacitor element 601 among the capacitor element unit 6101A needn't be five, can determine the number of capacitor element 601 according to predetermined volumes.
Figure 13 A is to the solid electrolytic capacitor 6102 of 13D displaying according to embodiments of the invention 7.Figure 13 B is the front view of solid electrolytic capacitor 6102.Figure 13 A, 13C and 13D be the solid electrolytic capacitor 6102 shown in Figure 13 B from the being seen plane graph of direction XIIIA, from the being seen upward view of direction XIIIC with from the being seen end view of direction XIIID.The assembly identical with the assembly of embodiment 6 will be represented by identical Reference numeral, and will omit its detailed description.
The lower surface 614G of cathode terminal 614 be configured to anode terminal 610 at grade, and the lower surface 610G of as close as possible anode terminal 610 location.Surface 610G serves as the installation surface that arrives such as the fixing body of distributing board to be installed.Distance L 6 between the surperficial 614G of cathode terminal 614 and the surperficial 610G of anode terminal 610 is not less than 1mm, and is preferably 1mm.Distance less than 1mm can cause the electric current between the described surface to leak.Cathode terminal 614 comprises thickness portion 614E and the thin part 614A with surperficial 614G.Thin part 614A is thinner than thickness portion 614E, and extends in the direction relative with anode terminal 610 from thickness portion 614E.Cover by resin-encapsulated 612 with surperficial 614K and be not exposed to the outside, do not serve as the installation surface to fixing body to be installed towards the surperficial relative thin part 614A of capacitor element 601.Cathode terminal 614 is included in the mounting portion 614C of the end of the thin part 614A relative with anode terminal 610.When capacitor was installed, mounting portion 614C had the lower surface 614L that serves as installation surface.Surface 614L and surperficial 610G and 614G are at grade.
According to embodiment 7 solid electrolytic capacitors 6102, by the mounting portion 614C of cathode terminal 614, anode terminal 610 and cathode terminal 614 all have installation surface, allow capacitor stably to be installed on fixing body whereby.
Be similar to the solid electrolytic capacitor 6101 of embodiment 6, have less equivalent series resistance (ESR) and less equivalent series inductance (ESL) according to the solid electrolytic capacitor 6102 of embodiment 7.The ESL of the solid electrolytic capacitor 6102 of embodiment 7 is 500pH, its be the conventional solid electrolytic capacitor 1100 shown in Figure 22 to 24 1500pH ESL 1/3rd.
Figure 14 A is to the solid electrolytic capacitor 6103 of 14D displaying according to embodiments of the invention 8.Figure 14 B is the front view of solid electrolytic capacitor 6103.Figure 14 A, 14C and 14D be the solid electrolytic capacitor 6103 shown in Figure 14 B from the being seen plane graph of direction XIVA, from the being seen upward view of direction XIVC with from the being seen end view of direction XIVD.The assembly identical with the assembly of embodiment 6 will be represented by identical Reference numeral, and will omit its detailed description.
With lower surface 615G towards the relative cathode terminal 615 of the surperficial 615F of capacitor element 601 be configured to the lower surface 610G of anode terminal 610 at grade, and the lower surface 610G of as close as possible anode terminal 610 location.Distance L 7 between the surperficial 615G of cathode terminal 615 and the surperficial 610G of anode terminal 610 is not less than 1mm, and is preferably 1mm.Distance less than 1mm can cause the electric current between the described surface to leak.Cathode terminal 615 comprises thickness portion 615E and the thin part 615A with surperficial 615G.Thin part 615A is thinner than thickness portion 615E, and is connected to the both sides of thickness portion 615E.The surperficial 615K of the cathode terminal 615 relative with surperficial 615F is covered by resin-encapsulated 612 and is not exposed to the outside, does not serve as the installation surface to described fixing body to be installed.The lower surface 615G of cathode terminal 615 extends to its end relative with anode terminal 610, and thin part 615A is arranged at the place, both sides of cathode terminal 615 on the direction D602 perpendicular to the direction D601 of configuration anode terminal 610 and cathode terminal.Thickness portion 615E is arranged between the thin part 615A, makes that configuration approaches part 615A and thickness portion 615E on direction D602.The thickness portion 615E of cathode terminal 615 has towards the part 5615E of anode terminal 610 and has the part 6615E that extends to relative with anode terminal 610 direction from part 5615E.Part 6615E has the width narrower than the width of part 5615E.That is, thickness portion 615E disposes with "T"-shaped shape substantially with the surperficial 615G that serves as installation surface.
In anode terminal 610, thickness portion 610E is arranged between the thin part 610A, and thin part 610A and thickness portion 610E are configured on the direction D602.
Except the technique effect of the solid electrolytic capacitor 6102 of embodiment 7, solid electrolytic capacitor 6103 comprises the cathode terminal 615 that is easy to make, and can stably be installed to fixing body.
Be similar to the solid electrolytic capacitor 6101 of embodiment 6, the solid electrolytic capacitor 6103 of embodiment 8 has less equivalent series resistance (ESR) and less equivalent series inductance (ESL).The ESL of the solid electrolytic capacitor 6103 of embodiment 8 is 500pH, its be the conventional solid electrolytic capacitor 1100 shown in Figure 22 to 24 1500pH ESL 1/3rd.
Figure 15 A is to the solid electrolytic capacitor 6104 of 15D displaying according to embodiments of the invention 9.Figure 15 B is the front view of solid electrolytic capacitor 6104.Figure 15 A, 15C and 15D be the solid electrolytic capacitor 6104 shown in Figure 15 B from the being seen plane graph of direction XVA, from the being seen upward view of direction XVC with from the being seen end view of direction XVD.The assembly identical with the assembly of embodiment 6 will be represented by identical Reference numeral, and will omit its detailed description.
With surperficial 617G towards the relative cathode terminal 617 of the surperficial 617F of capacitor element 601 be configured to the surperficial 616G of anode terminal 616 at grade.The surperficial 616G location of the as close as possible anode terminal 616 of surperficial 617G of cathode terminal 617.Distance L 8 between the surperficial 617G of cathode terminal 617 and the surperficial 616G of anode terminal 616 is not less than 1mm, and is preferably 1mm.Distance less than 1mm can cause the electric current between the described surface to leak.Cathode terminal 617 comprises thickness portion 617E and the thin part 617A with surperficial 617G.617A is thinner than thickness portion 617E for this part, and extends in the direction relative with anode terminal 616 from thickness portion 617E.The surperficial 617F that comprises the cathode terminal 617 of thickness portion 617E and thin part 617A is smooth.Thin part 617A has the part of the surperficial 617F of cathode terminal 617, and thickness portion 617E has the part of surperficial 617F.The surperficial 617K of the thin part 617A of the cathode terminal 617 relative with the surperficial 617F of thin part 617A is covered by resin-encapsulated 612 and is not exposed to the outside, does not serve as the installation surface that is configured to be installed on the described fixing body.The cathode leg frame 609 of capacitor element unit 6101A is placed on the surperficial 617F of cathode terminal 617, and is connected to cathode terminal 617 at the tie point 617B place of thin part 617A inside by laser welding.The lower surface 617G that serves as the installation surface of cathode terminal 617 extends, and makes thickness portion 617E have the ledge 617C that gives prominence to from resin-encapsulated 612.That is, thickness portion 617E extends, and makes thickness portion give prominence to from resin-encapsulated 612 on perpendicular to the direction D604 of the direction D603 that disposes anode terminal 616 and cathode terminal 617.
The ledge 616C of anode terminal 616 and the ledge 617C of cathode terminal 617 allow can observe fillet of solder from the top easily when capacitor 6104 is soldered when being installed to fixing body, provide whereby to have the height reliability welded capacitor.
Figure 16 A is to the solid electrolytic capacitor 6105 of 16D displaying according to embodiments of the invention 10.Figure 16 B is the front view of solid electrolytic capacitor 6105.Figure 16 A, 16C and 16D be the solid electrolytic capacitor 6105 shown in Figure 16 B from the being seen plane graph of direction XVIA, from the being seen upward view of direction XVIC with from the being seen end view of direction XVID.The assembly identical with the assembly of embodiment 9 will be represented by identical Reference numeral, and will omit its detailed description.
The lower surface 618G of cathode terminal 618 be configured to the lower surface 616G of anode terminal 616 at grade, and 616 lower surface 616G location of as close as possible anode terminal.Distance L 9 between the surperficial 618G of cathode terminal 618 and the surperficial 616G of anode terminal 616 is not less than 1mm, and is preferably 1mm.Distance less than 1mm can cause the electric current between the described surface to leak.In the time of on capacitor is installed in such as the fixing body of distributing board, surperficial 616G serves as installation surface.Cathode terminal 618 comprises thickness portion 618E and the thin part 618A with surperficial 618G.Thin part 618A is thinner than thickness portion 618E, and extends in the direction relative with anode terminal 616 from thickness portion 618E.Cover by resin-encapsulated 612 with surperficial 618K and be not exposed to the outside, do not serve as the installation surface that is configured to be installed on the described fixing body towards the surperficial relative thin part 618A of capacitor element 601.Cathode terminal 618 is included in the ledge 618D of the end of the thin part 618A relative with anode terminal 616.Ledge 618D has serve as the lower surface 618L of installation surface when capacitor is installed.The 618L on surface and surperficial 616G and 618G are at grade.The surperficial 618G that serves as the installation surface of cathode terminal 618 stretches out, and makes cathode terminal 618 have the ledge 618C that gives prominence to from resin-encapsulated 612.Thickness portion 618E with surperficial 618G extends the ledge 618D that gives prominence to from resin-encapsulated 612 to form.
In the solid electrolytic capacitor 6105 of embodiment 10, the ledge 616C of anode terminal 616 and the ledge 618C of cathode terminal 618 and 618D allow can observe fillet of solder from the top easily when capacitor 6105 is soldered when being installed to fixing body, provide whereby to have height reliability and weld.
Figure 17 A is to the solid electrolytic capacitor 6106 of 17D displaying according to embodiments of the invention 11.Figure 17 B is the front view of solid electrolytic capacitor 6106.Figure 17 A, 17C and 17D be the solid electrolytic capacitor 6106 shown in Figure 17 B from the being seen plane graph of direction XVIIA, from the being seen upward view of direction XVIIC with from the being seen end view of direction XVIID.The assembly identical with the assembly of embodiment 8 will be represented by identical Reference numeral, and will omit its detailed description.
With lower surface 619G towards the relative cathode terminal 619 of the surperficial 619F of capacitor element 601 be configured to the lower surface 616G of anode terminal 616 at grade, and the lower surface 616G of as close as possible anode terminal 616 location.Distance L 10 between the surperficial 619G of cathode terminal 619 and the surperficial 616G of anode terminal 616 is not less than 1mm, and is preferably 1mm.Distance less than 1mm can cause the electric current between the described surface to leak.When capacitor was installed to fixing body such as distributing board, surperficial 616G served as installation surface.Cathode terminal 619 comprises thickness portion 619E and the thin part 619A with surperficial 619G.Thin part 619A is thinner than thickness portion 619E, and is connected to the both sides of thickness portion 619E.The surperficial 619K of the thin part 619A of the cathode terminal 619 relative with surperficial 619F is covered by resin-encapsulated 612 and is not exposed to the outside, does not serve as the installation surface that is configured to be installed to fixing body.The lower surface 619G of cathode terminal 619 extends to its end relative with anode terminal 616, and thin part 619A is arranged at the place, both sides of cathode terminal 619 on the direction D606 perpendicular to the direction D605 of configuration anode terminal 616 and cathode terminal 619.That is, the lower surface 619G of thickness portion 619E and the installation surface of serving as cathode terminal 619 is substantially with "T"-shaped shape configuration, shown in Figure 17 C.Thickness portion 619E with lower surface 619G of the installation surface of serving as cathode terminal 619 stretches out to form from resin-encapsulated 612 outstanding ledge 619C and 619D.That is, thickness portion 619E comprises ledge 619C and the 619D that extends respectively on direction D605 and the direction D606 perpendicular to the direction D605 that disposes anode terminal 616 and cathode terminal 619.
619 ledge 619C of the ledge 616C of anode terminal 616 and cathode terminal and 619D allow can observe fillet of solder from the top easily when capacitor 6106 is soldered when being installed to fixing body, provide whereby to have height reliability and weld.
Figure 18 A is to the solid electrolytic capacitor 6107 of 18D displaying according to embodiments of the invention 12.Figure 18 B is the front view of solid electrolytic capacitor 6107.Figure 18 A, 18C and 18D be the solid electrolytic capacitor 6107 shown in Figure 18 B from the being seen plane graph of direction XVIIIA, from the being seen upward view of direction XVIIIC with from the being seen end view of direction XVIIID.The assembly identical with the assembly of embodiment 9 will be represented by identical Reference numeral, and will omit its detailed description.
With surperficial 621G towards the relative cathode terminal 621 of the surperficial 621F of capacitor element 601 be configured to the surperficial 620G of anode terminal 620 at grade.Cathode terminal 621 comprises thickness portion 621E and the thin part 621A with surperficial 621G.Thin part 621A is thinner than thickness portion 621E, and extends in the direction relative with anode terminal 620 from thickness portion 621E.The surperficial 621F that comprises the cathode terminal 621 of thickness portion 621E and thin part 621A is smooth.Thin part 621A has the part of the surperficial 621F of cathode terminal 621, and thickness portion 621E has the part of surperficial 621F.The cathode leg frame 609 of capacitor element unit 6101A is placed on the surperficial 621F of cathode terminal 621, and is connected to cathode terminal 621 at the tie point 621B place of thin part 621A inside by laser welding.Thickness portion 621E with lower surface 621G of the installation surface of serving as cathode terminal 621 extends to the outside of resin-encapsulated 512 to form ledge 621C.Ledge 621C is bent upwards along the side surface (outer surface) of resin-encapsulated 612, to have along resin-encapsulated 612 outside shapes of extending.
The ledge 620C of anode terminal 620 and the ledge 621C of cathode terminal 621 allow can observe fillet of solder from the top easily when capacitor 6107 is soldered when being installed to fixing body, provide whereby to have the height reliability welded capacitor.
Figure 18 E is the perspective view according to another solid electrolytic capacitor 6207 of embodiment 12.Solid electrolytic capacitor 6207 comprises having the resin-encapsulated 612A that shape is different from the resin-encapsulated 612 of solid electrolytic capacitor 6107, and other assembly is identical with those assemblies of capacitor 6107.Resin-encapsulated 612A has recess 612B and 612C, and the ledge 620C of anode terminal 620 and the ledge 621C of cathode terminal 621 embed respectively among described recess 612B and the 612C.This structure allows solid electrolytic capacitor 6207 to have less size, can not increase its size.
Figure 19 A is to the solid electrolytic capacitor 6108 of 19D displaying according to embodiments of the invention 13.Figure 19 B is the front view of solid electrolytic capacitor 6108.Figure 19 A, 19C and 19D be the solid electrolytic capacitor 6108 shown in Figure 19 B from the being seen plane graph of direction XIXA, from the being seen upward view of direction XIXC with from the being seen end view of direction XIXD.The assembly identical with the assembly of embodiment 12 will be represented by identical Reference numeral, and will omit its detailed description.
With surperficial 622G towards the relative cathode terminal 622 of the surperficial 622F of capacitor element 601 be configured to the surperficial 620G of anode terminal 620 at grade.Cathode terminal 622 comprises thickness portion 622E and the thin part 622A with surperficial 622G.Thin part 622A is thinner than thickness portion 622E, and extends in the direction relative with anode terminal 620 from thickness portion 622E.The surperficial 622F that comprises the cathode terminal 622 of thickness portion 622E and thin part 622A is smooth.Thin part 622A has the part of the surperficial 622F of cathode terminal 622, and thickness portion 622E has the part of surperficial 622F.The cathode leg frame 609 of capacitor element unit 6101A is placed on the surperficial 622F of cathode terminal 622, and is connected to cathode terminal 622 at the tie point 622B place of thin part 622A inside by laser welding.Thickness portion 622E with lower surface 622G of the installation surface of serving as cathode terminal 622 extends to form ledge 622C in the outside of resin-encapsulated 612.Ledge 622C is bent upwards along the side surface (outer surface) of resin-encapsulated 612, to have along resin-encapsulated 612 outside shapes of extending.Cathode terminal 622 comprises having the ledge 622D that serves as the lower surface 622L of installation surface when capacitor is installed.Ledge 622D extends from resin-encapsulated 612 at the end of the thin part 622A relative with anode terminal 620.Surface 622L and surperficial 620G and 622G are at grade.Ledge 622D is bent upwards along the side surface (outer surface) of resin-encapsulated 612, to have along resin-encapsulated 612 outside shapes of extending.
In the solid electrolytic capacitor 6108 of embodiment 13, the ledge 620C of anode terminal 620 and the ledge 622C of cathode terminal 622 and 622D allow can observe fillet of solder from the top easily when capacitor 6108 is soldered when being installed to fixing body, provide whereby to have the height reliability welded capacitor.
Be similar to the solid electrolytic capacitor 6207 shown in Figure 18 E, resin-encapsulated 612 can have the recess that is provided in wherein, ledge 620C, the 622C and the 622D that extend from the outside of resin-encapsulated 612 embed the described recess, allow capacitor to have less size whereby.
Embodiment 14
Figure 20 A is to the solid electrolytic capacitor 6109 of 20D displaying according to embodiments of the invention 14.Figure 20 B is the front view of solid electrolytic capacitor 6109.Figure 20 A, 20C and 20D be the solid electrolytic capacitor 6109 shown in Figure 20 B from the being seen plane graph of direction XXA, from the being seen upward view of direction XXC with from the being seen end view of direction XXD.The assembly identical with the assembly of embodiment 13 will be represented by identical Reference numeral, and will omit its detailed description.
With lower surface 623G towards the relative cathode terminal 623 of the upper surface 623F of capacitor element 601 be configured to the lower surface 620G of anode terminal 620 at grade.Lower surface 620G serves as the installation surface that is configured to be installed to such as on the fixing body of distributing board.Cathode terminal 623 comprises thickness portion 623E and the thin part 623A with surperficial 623G.Thin part 623A is thinner than thickness portion 623E, and is connected to the both sides of thickness portion 623E.The surperficial 623F that comprises the cathode terminal 623 of thickness portion 623E and thin part 623A is smooth.Thin part 623A has the part of the surperficial 623F of cathode terminal 623, and thickness portion 623E has the part of surperficial 623F.The lower surface 623G of cathode terminal 623 extends to its end relative with anode terminal 620, and thin part 623A is arranged at 623 place, both sides of cathode terminal on the direction D608 perpendicular to the direction D607 of configuration anode terminal 620 and cathode terminal 623.That is, the lower surface 623G of thickness portion 623E and the installation surface of serving as cathode terminal 623 is substantially with "T"-shaped shape configuration, shown in Figure 20 C.Thickness portion 623E with lower surface 623G of the installation surface of serving as cathode terminal 623 stretches out to form from resin-encapsulated 612 outstanding ledge 623C and 623D.That is, thickness portion 623E comprises ledge 623C and the 623D that extends respectively on direction D607 and the direction D608 perpendicular to the direction D607 that disposes anode terminal 620 and cathode terminal 623.Ledge 623C and 623D are bent upwards along the side surface (outer surface) of resin-encapsulated 612, to have along resin-encapsulated 612 outside shapes of extending.
In the solid electrolytic capacitor 6109 of embodiment 14, the ledge 623C of anode terminal 620 ledge 620C and cathode terminal 623 and 623D allow can observe fillet of solder from the top easily when capacitor 6109 is soldered when being installed to fixing body, provide whereby to have the height reliability welded capacitor.
Be similar to the solid electrolytic capacitor 6207 shown in Figure 18 E, resin-encapsulated 612 can have the recess that is provided in wherein, ledge 620C, the 623C and the 623D that extend from resin-encapsulated 612 embed the described recess, allow capacitor to have less size whereby.
Embodiment 15
Figure 21 A is to the solid electrolytic capacitor 6110 of 21D displaying according to embodiments of the invention 15.Figure 21 B is the front view of solid electrolytic capacitor 6110.Figure 21 A, 21C and 21D be the solid electrolytic capacitor 6110 shown in Figure 21 B from the being seen plane graph of direction XXIA, from the being seen upward view of direction XXIC with from the being seen end view of direction XXID.The assembly identical with the assembly of embodiment 14 will be represented by identical Reference numeral, and will omit its detailed description.
With lower surface 624G towards the relative cathode terminal 624 of the upper surface 624F of capacitor element 601 be configured to the lower surface 620G of anode terminal 620 at grade.Lower surface 620G serves as the installation surface that is configured to be installed to such as on the fixing body of distributing board.Cathode terminal 624 comprises thickness portion 624E and the thin part 624A with surperficial 624G.Thin part 624A is thinner than thickness portion 624E, and is connected to the both sides of thickness portion 624E.The lower surface 624G of cathode terminal 624 extends to its end relative with anode terminal 620, and thin part 624A is arranged at 624 place, both sides of cathode terminal on the direction D610 perpendicular to the direction D609 of configuration anode terminal 620 and cathode terminal 624.The surperficial 624F that comprises the cathode terminal 624 of thickness portion 624E and thin part 624A is smooth.Thin part 624A has the part of the surperficial 624F of cathode terminal 624, and thickness portion 624E has the part of surperficial 624F.Thickness portion 624E with lower surface 624G of the installation surface of serving as cathode terminal 624 stretches out to form from the outstanding ledge 624C of resin-encapsulated 612.That is, thickness portion 624E is included in the direction D609 that disposes anode terminal 620 and cathode terminal 624 and goes up the ledge 624C that gives prominence to from resin-encapsulated 612.
Except the technique effect of the solid electrolytic capacitor 6109 of embodiment 14, the solid electrolytic capacitor 6110 of embodiment 15 comprises the cathode terminal 624 that is easy to make, and allows capacitor can stably be installed to fixing body.
Industrial usability
Solid electrolytic capacitor has littler equivalent series inductance, and can stably be installed to installation Body.
Claims (39)
1. solid electrolytic capacitor, it comprises:
Capacitor element, described capacitor element comprises the anode bodies with rough surface that is formed by valve metal, be arranged at the described lip-deep dielectric oxide layer of described anode bodies, be arranged at the diaphragm on the described dielectric oxide layer with insulation characterisitic, described diaphragm is divided into cathode portion and anode part with described anode bodies and described dielectric oxide layer, be arranged at the solid-state electrolyte layer that forms by conducting polymer on the described dielectric layer of described negative pole part office and be arranged at cathode layer on the described solid-state electrolyte layer;
The anode terminal of writing board shape, described anode terminal have first surface and with the described first surface opposing second surface of described anode terminal, the described first surface of described anode terminal is connected to described anode part;
The cathode terminal of writing board shape, described cathode terminal have first surface and with the described first surface opposing second surface of described cathode terminal, the described first surface of described cathode terminal is connected to described cathode layer, and the described second surface of described cathode terminal and the described second surface of described anode terminal are at grade; With
Hold resin-encapsulated described capacitor element, described anode terminal and described cathode terminal and that have insulation characterisitic, the described second surface of described anode terminal and the described second surface of described cathode terminal are exposed to the outside of described resin-encapsulated,
Wherein said anode terminal comprises first thickness portion and the first thin part thinner than described first thickness portion, described first thickness portion has the part of the described first surface of the described second surface of described anode terminal and described anode terminal, described first approaches the part of the described first surface that partly has described anode terminal and is connected to described first thickness portion, and
Wherein said cathode terminal comprises second thickness portion and the second thin part thinner than described second thickness portion, described second thickness portion has the part of the described first surface of the described second surface of described cathode terminal and described cathode terminal, and the described second thin part has the part of described first surface and is connected to described second thickness portion.
2. solid electrolytic capacitor according to claim 1, it further comprises:
Be stacked in another capacitor element on the described capacitor element, described another capacitor element comprises another anode part and another cathode layer;
Be used for the anode lead frame that the described anode part with described capacitor element is connected with described another anode part of described another capacitor element, described anode lead frame is connected to the described first surface of described anode terminal; With
Be used for the cathode leg frame that the described cathode layer with described capacitor element is connected with described another cathode layer of described another capacitor element, described cathode leg frame is connected to the described first surface of described cathode terminal.
3. solid electrolytic capacitor according to claim 2, wherein said anode lead frame is connected to described anode terminal at the described first thin part place.
4. solid electrolytic capacitor according to claim 2, wherein said cathode leg frame is connected to described cathode terminal at the described second thin part place.
5. solid electrolytic capacitor according to claim 2, wherein said cathode leg frame comprises the guider that is used to locate described capacitor element and described another capacitor element.
6. solid electrolytic capacitor according to claim 1, the difference of the thickness of the thickness of described first thickness portion of wherein said anode terminal and the described first thin part is not less than 80 μ m.
7. solid electrolytic capacitor according to claim 1, the difference of the thickness of the thickness of described second thickness portion of wherein said cathode terminal and the described second thin part is not less than 80 μ m.
8. solid electrolytic capacitor according to claim 1, wherein said anode terminal and described cathode terminal are formed by etched metallic plate.
9. solid electrolytic capacitor according to claim 1, wherein said valve metal are selected from by one in aluminium, tantalum, niobium and its group that forms.
10. solid electrolytic capacitor according to claim 1, the distance between wherein said cathode terminal and the described anode terminal is not less than 1mm.
11. solid electrolytic capacitor according to claim 10, the described distance between wherein said cathode terminal and the described anode terminal is 1mm.
12. solid electrolytic capacitor according to claim 1, the described second surface of wherein said cathode terminal and the described second surface of described anode terminal are configured to be installed on the fixing body.
13. solid electrolytic capacitor according to claim 1, wherein said anode terminal comprise from the outstanding ledge of described resin-encapsulated, and described ledge has the part of the described second surface of described anode terminal.
14. solid electrolytic capacitor according to claim 13, the described ledge of wherein said anode terminal extends along the outer surface of described resin-encapsulated.
15. solid electrolytic capacitor according to claim 1, wherein said cathode terminal comprise from the outstanding ledge of described resin-encapsulated, and described ledge has the part of the described second surface of described cathode terminal.
16. solid electrolytic capacitor according to claim 15, the described ledge of wherein said cathode terminal extends along the outer surface of described resin-encapsulated.
17. solid electrolytic capacitor according to claim 1,
Wherein said cathode terminal further comprises the three thin part thinner than described second thickness portion, and the described the 3rd approaches the part of the described first surface that partly has described cathode terminal and be connected to described second thickness portion,
Wherein said anode terminal and described cathode terminal are configured on the first direction, and
Wherein said second thickness portion is provided between the described second thin part and the described the 3rd thin part of described cathode terminal, makes the described second thin part, the described the 3rd thin part and described second thickness portion be configured on the second direction perpendicular to described first direction.
18. solid electrolytic capacitor according to claim 17, the difference of the thickness of the thickness of described second thickness portion of wherein said cathode terminal and the described the 3rd thin part is not less than 80 μ m.
19. solid electrolytic capacitor according to claim 1,
Wherein said anode terminal further comprises the three thin part thinner than described first thickness portion, and the described the 3rd approaches the part of the described first surface that partly has described anode terminal and be connected to described first thickness portion,
Wherein said anode terminal and described cathode terminal are configured on the first direction, and
Wherein said first thickness portion is provided between the described first thin part and the described the 3rd thin part of described anode terminal, makes the described first thin part, the described the 3rd thin part and described first thickness portion be configured on the second direction perpendicular to described first direction.
20. solid electrolytic capacitor according to claim 19, the difference of the thickness of the thickness of described first thickness portion of wherein said anode terminal and the described the 3rd thin part is not less than 80 μ m.
21. solid electrolytic capacitor according to claim 1,
Described second thickness portion of wherein said cathode terminal is towards described anode terminal, and
The described second thin part of wherein said cathode terminal is extended from described second thickness portion on the direction relative with described anode terminal.
22. solid electrolytic capacitor according to claim 1, wherein said cathode terminal further comprises the mounting portion of an end that is provided in the described second thin part relative with described second thickness portion, and described mounting portion has the described second surface surface at grade with described cathode terminal.
23. solid electrolytic capacitor according to claim 1,
Wherein said anode terminal and described cathode terminal are configured on the first direction, and
Described second thickness portion of wherein said cathode terminal has "T"-shaped shape substantially, and described second thickness portion comprises:
Towards the first of described anode terminal and
The second portion that extends from described first on the direction relative with described anode terminal, described second portion has the width narrower than the width of described first.
24. solid electrolytic capacitor according to claim 23,
Wherein said cathode terminal further comprises the three thin part thinner than described second thickness portion, and the described the 3rd approaches the part of the described first surface that partly has described cathode terminal and be connected to described second thickness portion, and
Described second thickness portion of wherein said cathode terminal is provided between the described second thin part and the described the 3rd thin part, makes the described second portion of the described second thin part, the described the 3rd thin part and described second thickness portion be configured on the second direction perpendicular to described first direction.
25. solid electrolytic capacitor according to claim 23, wherein said cathode terminal comprises that further described ledge has the part of the described second surface of described cathode terminal from the described first extension of described second thickness portion and from the outstanding ledge of described resin-encapsulated.
26. solid electrolytic capacitor according to claim 25, the described ledge of wherein said cathode terminal extends along the outer surface of described resin-encapsulated.
27. solid electrolytic capacitor according to claim 26 has recess in the wherein said resin-encapsulated, the described ledge of described cathode terminal embeds in the described recess.
28. solid electrolytic capacitor according to claim 23, wherein said cathode terminal comprises that further described ledge has the described second surface of described cathode terminal from the described second portion extension of described second thickness portion and from the outstanding ledge of described resin-encapsulated.
29. solid electrolytic capacitor according to claim 28, the described ledge of wherein said cathode terminal extends along the outer surface of described resin-encapsulated.
30. solid electrolytic capacitor according to claim 29 has recess in the wherein said resin-encapsulated, the described ledge of described cathode terminal embeds in the described recess.
31. make the method for solid electrolytic capacitor, it comprises:
The capacitor element step is provided, described capacitor element comprises: the anode bodies with rough surface that is formed by valve metal, be arranged at the described lip-deep dielectric oxide layer of described anode bodies, be arranged at the diaphragm on the described dielectric oxide layer with insulation characterisitic, described diaphragm is divided into cathode portion and anode part with described anode bodies and described dielectric oxide layer, be arranged at the solid-state electrolyte layer of making by conducting polymer on the described dielectric oxide layer of described negative pole part office and be arranged at cathode layer on the described solid-state electrolyte layer;
The described anode part of described capacitor element is connected to the step of anode lead frame;
The described cathode layer of described capacitor element is connected to the step of cathode leg frame;
The step of the anode terminal with writing board shape is provided, described anode terminal have first surface and with the described first surface opposing second surface of described anode terminal, described anode terminal comprises first thickness portion and the first thin part thinner than described first thickness portion, described first thickness portion has the part of the described first surface of the described second surface of described anode terminal and described anode terminal, and the described first thin part has the part of described first surface and is connected to described first thickness portion;
The step of the cathode terminal with writing board shape is provided, described cathode terminal have first surface and with the described first surface opposing second surface of described cathode terminal, the described second surface of described cathode terminal and the described second surface of described anode terminal are at grade, described cathode terminal comprises second thickness portion and the second thin part thinner than described second thickness portion, described second thickness portion has the part of the described first surface of the described second surface of described cathode terminal and described cathode terminal, and the described second thin part has the part of described first surface and is connected to described second thickness portion;
Described anode lead frame is connected to the step on the described first surface of described anode terminal;
Described cathode leg frame is connected to the step on the described first surface of described cathode terminal; With
Hold the step of described capacitor element, described anode terminal, described cathode terminal, described anode lead frame and described cathode leg frame in having the resin-encapsulated of insulation characterisitic, the described second surface of described anode terminal and the described second surface of described cathode terminal are exposed to the outside of described resin-encapsulated.
32. method according to claim 31, it further comprises:
The step of another capacitor element is provided, and described another capacitor element comprises another anode part and another cathode layer; With
Described another capacitor element is stacked to step on the described capacitor element;
The step that wherein said described anode part with described capacitor element is connected to described anode lead frame further comprises the step that described another anode part integral body of the described anode part of described capacitor element and described another capacitor element is connected to described anode lead frame, and
The step that wherein the described cathode layer of described capacitor element is connected to described cathode leg frame comprises that further described another cathode layer integral body with the described cathode layer of described capacitor element and described another capacitor element is connected to the step of described cathode leg frame.
33. method according to claim 31, it further comprises
Have the step of the substrate of described anode terminal and described cathode terminal by etching metal plate formation,
The wherein said step of described anode terminal that provides further comprises the step that described anode terminal is blocked from described substrate, and
The wherein said step of described cathode terminal that provides further comprises the step that described cathode terminal is blocked from described substrate.
34. according to the described method of claim 31, the step on the wherein said described first surface that described anode lead frame is connected to described anode terminal further comprises the step that described anode lead frame is connected to the described first thin part of described anode terminal.
35. method according to claim 31, the step on the wherein said described first surface that described cathode leg frame is connected to described cathode terminal further comprises the step that described cathode leg frame is connected to the described second thin part of described cathode terminal.
36. method according to claim 31, the wherein said step of holding described capacitor element, described anode terminal, described cathode terminal, described anode lead frame and described cathode leg frame in described resin-encapsulated further is included in to be held described capacitor element, described anode terminal, described cathode terminal, described anode lead frame and described cathode leg frame and has from the step of the outstanding ledge of described resin-encapsulated with described first thickness portion that allows described first anode terminal in the described resin-encapsulated, and
Step along the described ledge of the described anode terminal of outer surface bending of described resin-encapsulated.
37. method according to claim 36, it further comprises
The step of recess is provided in described resin-encapsulated,
Wherein said described ledge with described anode terminal further comprises along the step of the described outer surface bending of described resin-encapsulated, embeds the step of described ledge in the described recess of described resin-encapsulated.
38. method according to claim 31, the wherein said step of holding described capacitor element, described anode terminal, described cathode terminal, described anode lead frame and described cathode leg frame in described resin-encapsulated further is included in to be held described capacitor element, described anode terminal, described cathode terminal, described anode lead frame and described cathode leg frame and has from the step of the outstanding ledge of described resin-encapsulated with described second thickness portion that allows described cathode terminal in the described resin-encapsulated, and
Step along the described ledge of the described cathode terminal of outer surface bending of described resin-encapsulated.
39. according to the described method of claim 38, it further comprises
The step of recess is provided in described resin-encapsulated,
Wherein said described ledge with described cathode terminal further is included in the step that embeds described ledge in the described recess of described resin-encapsulated along the step of the described outer surface bending of described resin-encapsulated.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004129289A JP2005311216A (en) | 2004-04-26 | 2004-04-26 | Solid electrolytic capacitor and its manufacturing method |
| JP129289/2004 | 2004-04-26 | ||
| JP177861/2004 | 2004-06-16 | ||
| JP245573/2004 | 2004-08-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1860565A true CN1860565A (en) | 2006-11-08 |
| CN100590759C CN100590759C (en) | 2010-02-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200580001032A Active CN100590759C (en) | 2004-04-26 | 2005-04-11 | Solid-state electrolytic capacitor and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2005311216A (en) |
| CN (1) | CN100590759C (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101441940B (en) * | 2007-11-20 | 2012-09-12 | 三洋电机株式会社 | Solid electrolytic capacitor |
| CN103295786A (en) * | 2012-02-28 | 2013-09-11 | 松下电器产业株式会社 | Solid electrolytic capacitor |
| CN111261411A (en) * | 2018-11-30 | 2020-06-09 | 松下知识产权经营株式会社 | Electrolytic capacitor |
| CN111383844A (en) * | 2018-12-26 | 2020-07-07 | 株式会社村田制作所 | Electrolytic capacitor |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4863769B2 (en) * | 2006-05-26 | 2012-01-25 | ホリストン ポリテック株式会社 | Chip type solid electrolytic capacitor |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001085273A (en) * | 1999-09-10 | 2001-03-30 | Matsushita Electric Ind Co Ltd | Chip-type solid-state electrolytic capacitor |
| JP2002367862A (en) * | 2001-04-05 | 2002-12-20 | Rohm Co Ltd | Solid electrolytic capacitor and method for manufacturing the same |
-
2004
- 2004-04-26 JP JP2004129289A patent/JP2005311216A/en active Pending
-
2005
- 2005-04-11 CN CN200580001032A patent/CN100590759C/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101441940B (en) * | 2007-11-20 | 2012-09-12 | 三洋电机株式会社 | Solid electrolytic capacitor |
| CN103295786A (en) * | 2012-02-28 | 2013-09-11 | 松下电器产业株式会社 | Solid electrolytic capacitor |
| CN103295786B (en) * | 2012-02-28 | 2017-03-29 | 松下知识产权经营株式会社 | Solid electrolytic capacitor |
| CN111261411A (en) * | 2018-11-30 | 2020-06-09 | 松下知识产权经营株式会社 | Electrolytic capacitor |
| CN111383844A (en) * | 2018-12-26 | 2020-07-07 | 株式会社村田制作所 | Electrolytic capacitor |
| CN111383844B (en) * | 2018-12-26 | 2022-04-08 | 株式会社村田制作所 | Electrolytic capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100590759C (en) | 2010-02-17 |
| JP2005311216A (en) | 2005-11-04 |
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