CN1853842A - Method for cutting P/P board and its operating platform - Google Patents
Method for cutting P/P board and its operating platform Download PDFInfo
- Publication number
- CN1853842A CN1853842A CN 200510034315 CN200510034315A CN1853842A CN 1853842 A CN1853842 A CN 1853842A CN 200510034315 CN200510034315 CN 200510034315 CN 200510034315 A CN200510034315 A CN 200510034315A CN 1853842 A CN1853842 A CN 1853842A
- Authority
- CN
- China
- Prior art keywords
- plate
- cutting
- cutting head
- air compression
- compression plant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 85
- 238000000034 method Methods 0.000 title claims abstract description 19
- 230000006835 compression Effects 0.000 claims description 19
- 238000007906 compression Methods 0.000 claims description 19
- 238000001179 sorption measurement Methods 0.000 claims description 18
- 239000003463 adsorbent Substances 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 4
- 239000003365 glass fiber Substances 0.000 abstract description 6
- 238000007664 blowing Methods 0.000 abstract description 3
- 239000006229 carbon black Substances 0.000 abstract description 3
- 239000000779 smoke Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003500 flue dust Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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- Laser Beam Processing (AREA)
Abstract
A method and its bench for cutting p/p plate feature that a laser beam is used for cutting the p/p plate, an air compressor is used for using the high-pressure air to flush the slot for blowing away the bare glass fibers, and a negative-pressure sucker is arranged under the slot for sucking smoke and carbon black.
Description
Affiliated technical field
The present invention relates to wiring board manufacturing and production field, particularly a kind of method and equipment thereof that cuts the P/P plate.
Background technology
Wiring board is to be made of jointly the insulating carrier between multiple layer of copper tinsel cord and the Copper Foil line, and this carrier is exactly the P/P plate, in the process of making wiring board, generally need cut the P/P plate.
See also Fig. 1, the P/P plate is to be combined by the glass fiber 91 and the colloid 92 (epoxy resin) that weave.At present the cutting mode to the P/P plate is, the P/P plate of rolling is positioned on the proprietary equipment, with blade the P/P plate is cut into certain shape again.In cutting process, shedding (broken rubber powder) and running (glass fiber) phenomenon can appear in the incision of P/P plate, see also Fig. 2, and these sheddings and running are clipped in the wiring board, can cause the gap between pcb layer and the layer.
When making multilayer circuit board, connected mode between every layer of wiring board is that boring is in the circuit board electroplated last layer copper at hole wall then earlier, can realize the electric interconnection of the Copper Foil of levels tellite by the copper layer, the 2nd layer of Copper Foil 72 has been connected with the 3rd layer of Copper Foil 73 among the figure.Because the existence of gap, the copper layer of plating can't carry out electric interconnection with the 1st layer of Copper Foil 71 and the 2nd layer of Copper Foil 72 among the figure.
The method that solves shedding and running at present is the P/P plate that is stacked together with well cutting, blows clean with air pressure gun earlier, uses the infrared ray edge banding machine of a special use again, gives the heating edge sealing of cutting edge.Owing in the whole process of cutting, all can have powder and silk to come off, when cleaning with the air pressure gun blowing, the one, some more hidden place may blow less than, the 2nd, in the process of blowing, dust can spread in the air, what have may cause the secondary pollution to the P/P plate attached on the P/P plate.Before edge sealing, promptly use air pressure gun to blow clean, powder also all has the possibility that comes off at any time, in case in the interlayer of powder and silk entry-line plate, will certainly cause wiring board to scrap.When carrying out edge sealing stacking of wiring board had relatively high expectations, it is neat that want on the limit that stacks, otherwise the limit of stretching outside is burned, and inside the limit of contracting is roasting less than, the requirement that does not reach whole edge sealing.In addition, the P/P plate that stacks is easy to if separate by force, can cause the became uneven at edge to gluing between the layer of P/P plate and the layer when utilizing infrared ray to carry out edge sealing together.
This shows that the method that solves shedding and running has at present not only increased an equipment, causes the increase of production cost, and in actual mechanical process, also can the existing variety of issue in mountain.Along with improving constantly of the precision of wiring board, density, the number of plies, the problem that solves shedding and running seems more and more urgent.
Summary of the invention
The objective of the invention is to overcome the shortcoming of prior art, a kind of method of cutting P/P plate of the cut quality that can obviously improve the P/P plate is provided.
Another object of the present invention is to overcome the shortcoming of prior art, and a kind of workbench of cutting P/P plate of the cut quality that can obviously improve the P/P plate is provided.
For the method for cutting P/P plate, the technical solution adopted in the present invention is: the feature of the method for this cutting P/P plate comprises: a. adopts laser beam cutting P/P plate; B. adopt air compression plant, when laser beam cut, the high pressure draught that this device is produced rushed at the otch of P/P plate; C. when laser beam cuts, being provided with the negative pressure mouth in the below of the cutting position of P/P plate is the adsorption orifice of feature.
Workbench for cutting P/P plate, the technical solution adopted in the present invention is: this cutting P/P plate workbench, comprise laser instrument, cutting head, air compression plant and suction type adsorbent equipment, the laser that laser instrument produces is input to cutting head, the high pressure draught that air compression plant produces blows to the otch of P/P plate, and the negative-pressure suction attaching places the below of the cutting position of P/P plate to be provided with adsorption orifice.
The present invention with respect to the advantage that prior art had is: cut for the present invention in the method and workbench of P/P plate, adopt laser beam when the P/P plate is carried out cutting processing, because high temperature action makes P/P plate otch seal up the limit automatically, and thoroughly stops otch shedding and running.Adopt air compression plant, the air-flow that this device produces rushes at the otch of P/P plate, and this air-flow can make the exposed glass fiber of the incision of P/P plate come off.The negative pressure that adsorption orifice produces can be fixed in the P/P plate that is cut the position of adsorption orifice, and in addition, adsorption orifice can siphon away flue dust, the carbon black of otch, avoid polluting P the P plate, simultaneously, do not pollute the environment yet.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Fig. 1 is the structural representation of P/P plate.
Fig. 2 is in the method for existing cutting P/P plate related to the present invention, the schematic diagram of the defective that is easy to generate.
Fig. 3 is the schematic diagram that the present invention cuts P/P plate workbench.
Fig. 4 is the partial enlarged drawing of I part among Fig. 3.
Fig. 5 is the schematic diagram that the present invention cuts the another kind of embodiment of P/P plate workbench.
The specific embodiment
The method that the present invention cuts the P/P plate comprises following three key elements:
A. adopt laser beam cutting P/P plate; B. adopt air compression plant, when laser beam cut, the high pressure draught that this device is produced rushed at the otch of P/P plate; C. when laser beam cuts, being provided with the negative pressure mouth in the below of the cutting position of P/P plate is the adsorption orifice of feature.
Laser beam is a kind of very thin high-octane light energy bundle, when this beam energy bundle is radiated on the object, can be by the local absorption of object, and object is produced the purpose that destruction (separation) acted on, reached cutting processing, because high temperature action makes P/P plate otch seal up the limit automatically, saved the program of edge sealing, and thoroughly stopped otch shedding and running, to the influence of product.In addition, because laser beam is very thin, concentration of energy is destroyed very little to the place around the P/P plate otch.
Adopt air compression plant, when laser beam cut, the high pressure draught that this device produces rushed at the otch of P/P plate, this air-flow can make the otch of P/P plate in the moment of leaving laser beam, the cooling rapidly by high temperature, this process is quenched exposed glass fiber, becomes fragile.Then, the glass fiber fracture that utilizes the strength that is produced of air-flow to make to become fragile also comes off, and reaches the reinforcement centrifugation.In addition, air-flow blows the resin of incision hot melt off, prevents adhesion again after its cooling, and air-flow can also prevent that the P/P plate from burning in laser beam, otch is become greatly.
When laser beam cut, being provided with the negative pressure mouth in the below of the cutting position of P/P plate was the adsorption orifice of feature.The negative pressure that adsorption orifice produces can be fixed in the P/P plate that is cut the position of adsorption orifice, can guarantee that the position of P/P plate can not change when cutting, cuts thereby be convenient to the cutting position that focus with laser beam is fixed in the P/P plate.Because the energy per unit area maximum of laser beam foucing position, cutting effect is best, thereby has guaranteed the quality of cutting.In addition, adsorption orifice is air-breathing inwards, in cutting process, flue dust, the carbon black of otch can be siphoned away, avoid polluting P the P plate, simultaneously, do not pollute the environment yet.
As shown in Figure 3, cut the method for P/P plate according to the present invention, designed a kind of cutting P/P plate workbench, this cutting P/P plate workbench, comprise laser instrument, cutting head 1, air compression plant and suction type adsorbent equipment, the laser that laser instrument produces is input to cutting head 1, and cutting head 1 is connected with air compression plant, and the high pressure draught that air compression plant produces blows to the otch of P/P plate by cutting head 1.The negative-pressure suction attaching places the below of the cutting position of P/P plate to be provided with adsorption orifice, and is provided with sweep-up pipe 4 in a side of adsorption orifice 3, and this sweep-up pipe 4 can siphon away the dust of 3 inspirations of adsorption orifice.
As shown in Figure 4, cutting head 1 inside is provided with inner chamber 11, is provided with focus lamp 12 in the inner chamber 11, and the laser that laser instrument is input to cutting head 1 is through after the focusing of focus lamp 12, and the cutting position that the focus of laser beam is fixed in the P/P plate cuts.
Side in cutting head 1 inner chamber 11 is provided with gas blow pipe 13, and gas blow pipe 13 is between the laser beam outlet of focus lamp 12 and cutting head 1.This gas blow pipe 13 is connected with air compression plant, and the high pressure draught that air compression plant produces blows to the focus of the laser beam of cutting head 1, the just otch of P/P plate by gas blow pipe 13.In addition, also be provided with the size that barometric damper 14 is used for regulating air-flow on the gas blow pipe 13.
Because gas blow pipe 13 is between the laser beam outlet of focus lamp 12 and cutting head 1, after the high pressure draught that air compression plant produces is blown into the inner chamber 11 of cutting head 1 by gas blow pipe 13, can only flow to the position of the laser beam outlet of cutting head 1, because the high pressure effect of this air-flow, the dust that makes the incision of P/P plate produce can not enter the inner chamber 11 of cutting head 1 against the flow direction of high pressure draught, thereby has guaranteed that focus lamp 12 can be not contaminated.
As shown in Figure 5, with P P plate when cutting into rectangle, can according to P the raw-material width of P plate and required P the width of P plate, several cutting heads 1 are set.If the direction that the P/P plate time is advanced in cutting is for being defined as the Y direction, the transverse direction of P/P plate is defined as directions X.All cutting heads 1 are positioned on same the straight line parallel with directions X.The adsorption orifice 3 of suction type adsorbent equipment is a strip, and be positioned at all cutting heads 1 and P/P plate under.
In cutting process, at first, the spacing between the cutting head 1 is set, make spacing between the cutting head 1 and required P the width equal and opposite in direction of P plate, certainly, raw material P the marginal position of P plate cutting head need not be set.Then, allow P the P plate advance, all cutting heads 1 are worked together simultaneously, wait switch to required P stop during the length of P plate, finish to P the cutting of P plate Y direction.At last, P the stop motion of P plate, all cutting heads 1 or wherein several can be one of them also, move along directions X, finish to P the cutting of P plate directions X.
Because several cutting heads 1 are worked simultaneously, thereby have guaranteed to have higher efficient when cutting in a large number.
Claims (9)
1. method of cutting the P/P plate is characterized in that:
A. adopt laser beam cutting P/P plate;
B. adopt air compression plant, when laser beam cut, the high pressure draught that this device is produced rushed at the otch of P/P plate;
C. when laser beam cuts, being provided with the negative pressure mouth in the below of the cutting position of P/P plate is the adsorption orifice of feature.
2. the method for cutting P/P plate according to claim 1, it is characterized in that: cutting head is connected with air compression plant, and the high pressure draught that air compression plant produces blows to the otch of P/P plate by cutting head.
3. one kind is cut P/P plate workbench, it is characterized in that: it comprises laser instrument, cutting head, air compression plant and suction type adsorbent equipment, the laser that laser instrument produces is input to cutting head, the high pressure draught that air compression plant produces blows to the otch of P/P plate, and the negative-pressure suction attaching places the below of the cutting position of P/P plate to be provided with adsorption orifice.
4. cutting P/P plate workbench according to claim 3, it is characterized in that: cutting head is connected with air compression plant, and the high pressure draught that air compression plant produces blows to the otch of P/P plate by cutting head.
5. cutting P/P plate workbench according to claim 4, it is characterized in that: cutting head inside is provided with inner chamber, is provided with focus lamp in the inner chamber, is provided with gas blow pipe in a side of inner chamber, and gas blow pipe is between the laser beam outlet of focus lamp and cutting head.
6. cutting P/P plate workbench according to claim 5, it is characterized in that: the negative-pressure suction attaching places a side of adsorption orifice to be provided with sweep-up pipe.
7. cutting P/P plate workbench according to claim 6 is characterized in that: also be provided with barometric damper on the gas blow pipe.
8. cutting P/P plate workbench according to claim 4 is characterized in that: cutting head is several, and all cutting heads are positioned on same the straight line parallel with raw material P/P plate transverse direction.
9. cutting P/P plate workbench according to claim 8, it is characterized in that: the adsorption orifice of suction type adsorbent equipment is a strip, and be positioned at all cutting heads and raw material P/P plate under.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100343159A CN100443239C (en) | 2005-04-18 | 2005-04-18 | Method for cutting P/P board and its operating platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100343159A CN100443239C (en) | 2005-04-18 | 2005-04-18 | Method for cutting P/P board and its operating platform |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1853842A true CN1853842A (en) | 2006-11-01 |
| CN100443239C CN100443239C (en) | 2008-12-17 |
Family
ID=37194460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100343159A Active CN100443239C (en) | 2005-04-18 | 2005-04-18 | Method for cutting P/P board and its operating platform |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100443239C (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008144969A1 (en) * | 2007-06-01 | 2008-12-04 | Shenzhen Han's Laser Technology Co., Limited | A cutting device for a prepreg sheet and the method therefor |
| CN101462205B (en) * | 2009-01-13 | 2011-12-07 | 包头高源激光科技发展有限公司 | Laser cutting method of amorphous alloy strip steel rolled stock |
| CN101402158B (en) * | 2008-11-05 | 2012-03-14 | 深圳市大族激光科技股份有限公司 | Laser cutting method for PCB plate |
| CN103212872A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Large-breadth thin plate fixing device and fixing method |
| CN104325218A (en) * | 2014-10-24 | 2015-02-04 | 宝钛集团有限公司 | Precise titanium welding pipe laser cutting device and method |
| CN105479016A (en) * | 2015-12-30 | 2016-04-13 | 大族激光科技产业集团股份有限公司 | Laser cutting method for PCB containing copper layer |
| CN112846530A (en) * | 2020-12-29 | 2021-05-28 | 武汉华工激光工程有限责任公司 | Curved thick glass cutting and splitting method and system |
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| JPH02155588A (en) * | 1988-12-08 | 1990-06-14 | Toshiba Corp | Method and device for laser cutting |
| GB9119919D0 (en) * | 1991-09-18 | 1991-10-30 | Boc Group Plc | Improved apparatus for the thermic cutting of materials |
| CN2299700Y (en) * | 1997-09-24 | 1998-12-09 | 宜兴市鹏鹞环保有限公司 | Biological stuffing cutter |
| US20020006765A1 (en) * | 2000-05-11 | 2002-01-17 | Thomas Michel | System for cutting brittle materials |
| JP2001321975A (en) * | 2000-05-11 | 2001-11-20 | Koike Sanso Kogyo Co Ltd | Method of cutting with laser beam |
| JP3425425B2 (en) * | 2000-07-07 | 2003-07-14 | 日本車輌製造株式会社 | Laser cutting machine for ultra-thin metal plates |
| US6423928B1 (en) * | 2000-10-12 | 2002-07-23 | Ase Americas, Inc. | Gas assisted laser cutting of thin and fragile materials |
| CN1449884A (en) * | 2003-04-25 | 2003-10-22 | 徐建平 | Laser cutting method for printed circuit board and working equipment |
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2005
- 2005-04-18 CN CNB2005100343159A patent/CN100443239C/en active Active
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008144969A1 (en) * | 2007-06-01 | 2008-12-04 | Shenzhen Han's Laser Technology Co., Limited | A cutting device for a prepreg sheet and the method therefor |
| CN100574959C (en) * | 2007-06-01 | 2009-12-30 | 深圳市大族激光科技股份有限公司 | A kind of PP sheet cutting equipment and method thereof |
| CN101402158B (en) * | 2008-11-05 | 2012-03-14 | 深圳市大族激光科技股份有限公司 | Laser cutting method for PCB plate |
| CN101462205B (en) * | 2009-01-13 | 2011-12-07 | 包头高源激光科技发展有限公司 | Laser cutting method of amorphous alloy strip steel rolled stock |
| CN103212872A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Large-breadth thin plate fixing device and fixing method |
| CN103212872B (en) * | 2012-01-19 | 2016-07-06 | 昆山思拓机器有限公司 | Large format fixing device for thin sheet and fixing means |
| CN104325218A (en) * | 2014-10-24 | 2015-02-04 | 宝钛集团有限公司 | Precise titanium welding pipe laser cutting device and method |
| CN104325218B (en) * | 2014-10-24 | 2016-02-03 | 宝钛集团有限公司 | A kind of precise determination of titanium welded tube laser cutting device and method |
| CN105479016A (en) * | 2015-12-30 | 2016-04-13 | 大族激光科技产业集团股份有限公司 | Laser cutting method for PCB containing copper layer |
| CN105479016B (en) * | 2015-12-30 | 2017-06-27 | 大族激光科技产业集团股份有限公司 | The laser cutting method of the pcb board containing layers of copper |
| CN112846530A (en) * | 2020-12-29 | 2021-05-28 | 武汉华工激光工程有限责任公司 | Curved thick glass cutting and splitting method and system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100443239C (en) | 2008-12-17 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: Chongqing Fangzheng Gaomi Electronics Co., Ltd. Assignor: Dazu Laser Sci. & Tech. Co., Ltd., Shenzhen|Shenzhen Dazu Digital Control Science & Technology Co., Ltd. Contract record no.: 2010500000012 Date of cancellation: 20100408 |
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| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20061101 Assignee: Chongqing Fangzheng Gaomi Electronics Co., Ltd. Assignor: Dazu Laser Sci. & Tech. Co., Ltd., Shenzhen|Shenzhen Dazu Digital Control Science & Technology Co., Ltd. Contract record no.: 2010500000014 Denomination of invention: Method for cutting P/P plate and worktable thereof Granted publication date: 20081217 License type: Exclusive License Record date: 20100408 Application publication date: 20061101 Assignee: Chongqing Fangzheng Gaomi Electronics Co., Ltd. Assignor: Dazu Laser Sci. & Tech. Co., Ltd., Shenzhen|Shenzhen Dazu Digital Control Science & Technology Co., Ltd. Contract record no.: 2010500000012 Denomination of invention: Method for cutting P/P plate and worktable thereof Granted publication date: 20081217 License type: Exclusive License Record date: 20100408 |
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| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 518051 Dazu laser building, 9 new West Road, North Nanshan District high tech park, Shenzhen, Guangdong Co-patentee after: Shenzhen Dazu Digital Control Science & Technology Co., Ltd. Patentee after: HANS LASER TECHNOLOGY INDUSTRY GROUP CO., LTD. Address before: No. 5 road 518057 in Guangdong province Shenzhen city Nanshan District high tech park of Pine Hill Factory District No. 8 Co-patentee before: Shenzhen Dazu Digital Control Science & Technology Co., Ltd. Patentee before: Dazu Laser Sci. & Tech. Co., Ltd., Shenzhen |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200617 Address after: 518101 workshop 5 / F, 1 / 2 / F, 14 / F, 17 / F, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. Address before: 518051 Dazu Laser Building, No. 9 Xinxi Road, North District, Nanshan High-tech Park, Shenzhen City, Guangdong Province Co-patentee before: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518101 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Han's CNC Technology Co.,Ltd. Address before: 518101 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. |