CN1851874A - Polycrystalline silicon gate grid etching process for reducing particle generation - Google Patents
Polycrystalline silicon gate grid etching process for reducing particle generation Download PDFInfo
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Abstract
This invention provides a polysilicon grid etching technology capable of reducing the generation of particles in the etching technology including the following steps: a first stabilizing step before the BT step, step BT, a second stabilizing step before a main step, main steps 1 and 2, over-etching steps 1 and 2, which gives attention to two parts of etching result and particle control to cut or maintain plasmas according to different situations, in which, the plasmas can be cut in the transition from the BT to the main etching step and stable starting up of the plasmas is needed in the transition from the main step to the over etching and the finish of the over etching.
Description
Technical field
The present invention relates to a kind of polycrystalline silicon gate grid etching process, specifically, relate to a kind of polycrystalline silicon gate grid etching process that can reduce particle generation in the etching technics.
Background technology
Along with further reducing of semiconductor components and devices characteristic size, the deep-submicron dry etch process is faced with increasing challenge.In the process that forms semiconductor device, the cleaning on the silicon chip is vital, because micron-sized small particles of pollution will cause the obstruction even the disabler of circuit, scraps entire chip.So in the front-end process processing procedure, the control of particle is a vital ring.
In existing polycrystalline silicon gate grid etching process process, successively silicon chip is carried out etching by several different processing steps often, after photoetching development, hard mask are opened, removed photoresist, generally need to open (BT), polysilicon main etching (ME), over etching several processing steps such as (OE) through the nature silicon dioxide layer successively.Because the used etching agent difference of several processing steps, environmental condition are also different, therefore often will add stabilizing step (stable step) when switching processing step, and be as follows, be a typical technological process that adds stabilizing step:
Stabilizing step 1: pressure 7mt, radio frequency source power is 0w, etching gas CF up and down
450sccm, time are 5s.
The BT step: pressure 7mt, last radio frequency source power 350w, following radio-frequency power 40w, etching gas CF
450sccm, time are 5s.
Stabilizing step 2: pressure 10mt, radio frequency source power is 0w up and down, etching gas is Cl
230sccm, HBr170sccm, 10sccm HeO
2Mist, time be 5s
The main quarter step: pressure 10mt, last radio frequency source power is 300w, and following radio-frequency power is 40w, and etching gas is Cl
2, HBr, He, O
2Mist, Cl wherein
2Flow is 30sccm, and the HBr flow is 170sccm, HeO
2(the two volume ratio is that state is 7: 3, down together) flow is 10sccm, utilizes the end point determination instrument to control the end of this step.
Stabilizing step 3: pressure 60mt, radio frequency source power is 0w up and down, etching gas is HBr200sccm, He140sccm, 15sccm HeO
2Mist, time be 5s
Cross and carve the step: pressure 60mt, last radio frequency source power 350w, following radio-frequency power 40w, etching gas are HBr200sccm, He140sccm, 15sccm HeO
2Mist, the time is 60s.
Can see,, adopt the method for cutting off radio frequency source power (source power) and following radio frequency source power (bias power) in the transition stage of two processing steps.The benefit of doing like this is exactly to get rid of the influence of each step process to next step technology, because the etch rate difference to the different medium layer of etching agent, the rapid residual gas of previous step is under the situation that plasma exists, can cause bad influence to next step, so need stop to go up radio frequency source power and following radio frequency source power, add and play the stabilizing step that purges previous step residual gas and steady pressure effect, just can reach good process results.
But, because the deep-submicron dry etching technology comes down to plasma etching technology, and plasma is to act on the whole electric neutrality air mass that forms on one or more gases under the hypobaric by the high-frequency radio frequency power voltage, comprises a large amount of cations, anion, neutral particle and the small suspended particulate because of exciting or generating in the air mass.(as shown in Figure 1)
In etching process, can produce a lot of accessory substances inevitably, some accessory substances can be taken away by molecular pump along with constantly flowing of gas, but some not volatile materials, form solid particle easily as main etching and a large amount of Si-Br-O compounds that generate of over etching stage, be suspended in the plasma air mass.If plasma extinguishes suddenly, these particles suspended will deposit so, fall on the silicon chip polluting.
Employing adds the process of stabilizing step between per step, though effectively overcome the influence between each processing step, but extinguished plasma in the process, meaned to have produced the particle that more causes chip yield to descend, so need be optimized adjustment to traditional technology mode.
Summary of the invention
(1) technical problem that will solve
Purpose of the present invention aims to provide a kind of new polycrystalline silicon gate grid etching process, makes its generation that can reduce particle in etching technics to improve the rate of finished products of chip.
(2) technical scheme
For achieving the above object, the present invention improves existing polycrystalline silicon gate grid etching process, and processing step of the present invention comprises: BT stabilizing step 1 before the step, BT step, mainly carve stabilizing step 2 before the step, mainly carve the step 1, mainly carve the step 2, cross and carve the step 1 and cross and carve the step 2.
Wherein said main process conditions of carving the step 1 are: pressure 8-15mt, and last radio frequency source power is 300-400w, and following radio-frequency power is 40-60w, and gas is Cl
20-30sccm, HBr150-200sccm, He3.5-10.5sccm, O
21.5-4.5sccm mist, utilize the end point determination instrument to control the end of this step.Preferred processing condition is: pressure 10mt, and last radio frequency source power is 300w, and following radio-frequency power is 40w, and gas is Cl
230sccm, HBr170sccm, He7sccm, O
2The mist of 3sccm.
Wherein said main process conditions of carving the step 2 are: pressure 40-80mt, and last radio frequency source power is 300-400w, and following radio-frequency power is 40-80w, and etching gas is HBr150-200sccm, He107-214sccm, O
2The mist of 3-6sccm, the time is 3-8s.Preferred processing condition is: pressure 40mt, and last radio frequency source power is 300w, and following radio-frequency power is 0w, and etching gas is HBr200sccm, He150.5sccm, O
24.5sccm mist, the time is 5s.
Wherein said process conditions of cross carving the step 1 are: pressure 40-80mt, go up radio frequency source power 300-400w, radio-frequency power 40-80w, etching gas are HBr150-200sccm, He107-214sccm, O down
2The mist of 3-6sccm, the time is 40-80s.Preferred processing condition is: pressure 60mt, last radio frequency source power 300w, following radio-frequency power 40w, etching gas are HBr200sccm, He150.5sccm, O
24.5sccm mist, the time is 60s.
The wherein said process conditions of carving the step 2 of crossing are: pressure 0-60mt, and last radio frequency source power is 300-400w, and following radio-frequency power is 0w, and etching gas is Ar200-300sccm, and the time is 3-8s.Preferred processing condition is: pressure 60mt, and last radio frequency source power is 300w, and following radio-frequency power is 0w, and etching gas is Ar200sccm, and the time is 5s.
The same prior art of other step conditions that technology of the present invention relates to, that is:
The process conditions of wherein said stabilizing step 1 are: pressure 7mt, radio frequency source power is 0w up and down, etching gas is CF
450sccm, time are 5s.
The process conditions in wherein said BT step are: pressure 7mt, last radio frequency source power 350w, following radio-frequency power 40w, etching gas are CF
450sccm, time are 5s.
The process conditions of wherein said stabilizing step 2 are: pressure 10mt, radio frequency source power is 0w up and down, etching gas is Cl
230sccm, HBr170sccm, HeO
2The mist of 10sccm, time are 5s.
Can see, when the processing step before the main etching step switches, still adopt the stabilizing step of cutting off plasma to guarantee not have the influence of previous step technology residual gas, keep particle simultaneously and be created in reduced levels.On the other hand, main etching is decomposed into two stages, with second stage of main etching " soft landing " process as stabilizing step before replacing, in this stage, because last radio frequency source power is in opening all the time, plasma is still kept stable, and closing of radio frequency source power also reduced the influence of previous step residual gas to next step technology down.Stabilizing step before the over etching step is saved, also it is decomposed into simultaneously two stages, the main purpose in first stage is an etching, second stage is to utilize inert gas to take residual gas and remaining by product away, and Ar can not produce the particle by product with silicon chip, has so not only guaranteed etching effect but also has made particle obtain effective control.
Technology provided by the invention is based on following principle: according to the analysis to each step in the technology, open in the step process at natural silicon dioxide layer, primary product is the Si-F compound, and this compounds is volatile, is difficult for being deposited as solids; And in main etching and over etching stage, primary product is the Si-Br-O compound, and this compounds deposition capability is stronger, be difficult for being taken away by molecular pump, and be main pollutant sources.Therefore, when guaranteeing technology stability, need optimize traditional technological process as far as possible.
Because natural silicon dioxide layer is opened the employed etching agent of step for containing F gas, the etching agent that contains Cl and HBr that etching polysilicon speed is used faster than the main etching stage far away is so two stabilizing step between going on foot need.And the by product Si-F compound that generates can not cause a large amount of particle depositions.Shown in Fig. 3 and 4, only with the technology of BT step in etching on the long diaphragm of polysilicon and the particle production after cutting off plasma, can find of reduced contamination.
And adopt the stabilizing step of cutting off plasma between main etching and the over etching, then produced a large amount of particles, as illustrated in Figures 5 and 6.Therefore, in the process of over etching transition, plasma can not stop at main etching, but owing to main etching step residual gas cognition in the etching agent handoff procedure impacts over etching, the technology that needs the appropriate change transition step, thus realize " soft landing " that technology is switched.Etching effect is seen Fig. 7 and 8.
Polycrystalline silicon gate grid etching process of the present invention has been taken into account in polycrystalline silicon gate grid etching process aspect two of etching effect and the particle controls, cuts off or keep plasma according to different situations.Can cut off plasma in BT step to main transition of carving the step, and carve the step to crossing the transition of carving the step and crossing the stable build-up of luminance that the end of carving the step need be kept plasma main.
(3) beneficial effect
Polycrystalline silicon gate grid etching process of the present invention can be controlled the pollution of the particle of reaction generation to silicon chip effectively, thereby raising chip yield, and technology is simple, need not the hardware system of equipment is optimized design, and different shape, types of devices are all had good adaptability.
Description of drawings
Fig. 1 is a plasma generation schematic diagram
Fig. 2 is existing etching technics gained lines micrograph
Fig. 3 is the particle situation of nature silicon dioxide layer
Fig. 4 is the particle production after the nature silicon dioxide layer BT etching
Fig. 5 is the preceding particle situation of existing etching technics etching
Fig. 6 is the particle production after the existing etching technics etching
Fig. 7 is an etching technics gained etching section micrograph of the present invention
Fig. 8 is an etching technics gained lines micrograph of the present invention
Fig. 9 is particle situation before the example 2 etching technics etchings of the present invention
Figure 10 is particle production after the example 2 etching technics etchings of the present invention
Figure 11 is particle situation before the example 3 etching technics etchings of the present invention
Figure 12 is particle production after the example 3 etching technics etchings of the present invention
Figure 13 is particle situation before the example 4 etching technics etchings of the present invention
Figure 14 is particle production after the example 4 etching technics etchings of the present invention
Wherein observe Fig. 3-6, the 9-14 device therefor is a KLA Suf6420 particle detector, observing Fig. 7 device therefor is the HitachiS-4700 field emission scanning electron microscope, multiplication factor is 150,000 times, observing Fig. 2 and 8 device therefors is HitachiS-8820 characteristic size scanning electron microscopy, 110,000 times of multiplication factors.
Embodiment
Below in conjunction with specific embodiment, further set forth the present invention.Should be understood that these embodiment only to be used to the present invention is described and be not used in and limit the scope of the invention.
Embodiment 1
Technology (etching) equipment is induction coupled plasma etching machine
Processing step:
Stabilizing step 1: pressure 7mt, radio frequency source power is 0w up and down, etching gas is CF
450sccm, time are 5s.
The BT step: pressure 7mt, last radio frequency source power 350w, following radio-frequency power 40w, etching gas are CF
450sccm, time are 5s.
Stabilizing step 2: pressure 10mt, radio frequency source power is 0w up and down, etching gas is Cl
230sccm, HBr170sccm, HeO
2Mist, the time of (volume ratio of the two is 7: 3, down together) 10sccm are 5s
The main quarter step: pressure 10mt, last radio frequency source power is 300w, and following radio-frequency power is 40w, and etching gas is Cl
230sccm, HBr170sccm, HeO
2The mist of 10sccm utilizes the end point determination instrument to control the end of this step.
Stabilizing step 3: pressure 60mt, radio frequency source power is 0w up and down, etching gas is HBr200sccm, He140sccm, the mist of 15sccm HeO2,5s
Cross and carve the step: pressure 60mt, last radio frequency source power 350w, following radio-frequency power 40w, etching gas are HBr200sccm, He140sccm, HeO
2The mist of 15scc, etch period are 60s.
Gained silicon chip after the observation etching has produced a large amount of particles in the visible etching process.(seeing Fig. 2,5 and 6)
Embodiment 2
With the method for embodiment 1, its difference is: main etching is divided into two stages, and over etching also is divided into two stages, has omitted stabilizing step 3, wherein,
The main quarter step 1: pressure 15mt, last radio frequency source power is 400w, and following radio-frequency power is 40w, and etching gas is HBr200sccm, He10.5sccm, O
24.5sccm mist, utilize the end point determination instrument to control the end of this step.
The main quarter step 2: pressure 40mt, last radio frequency source power is 400w, and following radio-frequency power is 0w, and etching gas is that mist, the time of HBr150sccm, He207sccm, O23sccm is 5s.
Cross and carve the step 1: pressure 40mt, last radio frequency source power are 400w, and following radio-frequency power is 80w, and etching gas is HBr150sccm, He107sccm, O
2The mist of 3sccm, the time is 60s.
Cross and carve the step 2: pressure 0mt, last radio frequency source power is 400w, and following radio-frequency power is 0w, and etching gas is that Ar300sccm, time are 5s.
Gained silicon chip after the observation etching, the generation of visible particle is less.(seeing Fig. 9 and 10)
Embodiment 3
With the method for embodiment 2, its difference is:
The main quarter step 1: pressure 8mt, last radio frequency source power is 300w, and following radio-frequency power is 60w, and etching gas is Cl
215sccm, HBr 150sccm, He3.5sccm, O
21.5sccm, utilize the end point determination instrument to control the end of this step.
The main quarter step 2: pressure 80mt, last radio frequency source power is 350w, and following radio-frequency power is 0w, and etching gas is that mist, the time of HBr175sccm, He200sccm, 20sccm HeO2 is 5s.
Cross and carve the step 1: pressure 80mt, last radio frequency source power is 350w, and following radio-frequency power is 80w, and etching gas is HBr175sccm, He200sccm, 20sccm He14sccm, O
2The mist of 6sccm, etch period are 40s.
Cross and carve the step 2: pressure 0mt, last radio frequency source power is 350w, and following radio-frequency power is 0w, and etching gas is Ar275sccm, 8s.
Gained silicon chip after the observation etching, the generation of visible particle is less.(seeing Figure 11 and 12)
Embodiment 4
With the method for embodiment 2, its difference is:
The main quarter step 1: pressure 10mt, last radio frequency source power is 380w, following radio-frequency power is 50w, etching gas is the mist of Cl2, HBr, He, O2, and wherein the Cl2 flow is 20sccm, and the HBr flow is 200sccm, the HeO2 flow is 15sccm, utilizes the end point determination instrument to control the end of this step.
The main quarter step 2: pressure 50mt, last radio frequency source power is 300w, and following radio-frequency power is 0w, and etching gas is that mist, the time of HBr200sccm, He100sccm, 10sccm HeO2 is 5s.
Cross and carve the step 1: pressure 40mt, last radio frequency source power is 300w, and following radio-frequency power is 60w, and etching gas is HBr200sccm, He100sccm, He7sccm, O
2The mist of 3sccm, the time is 80s.
Cross and carve the step 2: pressure 50mt, last radio frequency source power is 300w, and following radio-frequency power is 0w, and etching gas is Ar300sccm, 3s.
Gained silicon chip after the observation etching, the generation of visible particle is less.(seeing Figure 13 and 14).
Claims (5)
1, a kind of polycrystalline silicon gate grid etching process that can reduce the particle generation, may further comprise the steps: stabilizing step 1, BT go on foot BT before the step, stabilizing step 2, master carve to go on foot and cross to carve and go on foot before the main step at quarter, it is characterized in that describedly main carve the step and being carved the step 1 and mainly carved the step 2 and forms by main, the described mistake carved the step and gone on foot 2 and form by crossing to carve the step 1 and cross to carve.
2, polycrystalline silicon gate grid etching process as claimed in claim 1 is characterized in that described main process conditions of carving the step 1 are: pressure 8-15mt, and last radio frequency source power is 300-400w, and following radio-frequency power is 40-60w, and gas is Cl
20-30sccm, HBr150-200sccm, He3.5-10.5sccm, O
21.5-4.5sccm mist, utilize the end point determination instrument to control the end of this step; Described main process conditions of carving the step 2 are: pressure 40-80mt, and last radio frequency source power is 300-400w, and following radio-frequency power is 0w, and etching gas is HBr150-200sccm, He107-214sccm, O
2The mist of 3-6sccm, the time is 3-8s.
3, polycrystalline silicon gate grid etching process as claimed in claim 1 is characterized in that described process conditions of cross carving the step 1 are: pressure 40-80mt, go up radio frequency source power 300-400w, radio-frequency power 40-80w, etching gas are HBr150-200sccm, He107-214sccm, O down
2The mist of 3-6sccm, the time is 40-80s; The described process conditions of carving the step 2 of crossing are: pressure 0-60mt, and last radio frequency source power is 300-400w, and following radio-frequency power is 0w, and etching gas is Ar200-300sccm, and the time is 3-8s.
4, polycrystalline silicon gate grid etching process as claimed in claim 2 is characterized in that described main process conditions of carving the step 1 are: pressure 10mt, and last radio frequency source power is 300w, and following radio-frequency power is 40w, and gas is Cl
230sccm, HBr170sccm, He7sccm, O
2The mist of 3sccm; Described main process conditions of carving the step 2 are: pressure 40mt, and last radio frequency source power is 300w, and following radio-frequency power is 0w, and etching gas is HBr200sccm, He150.5sccm, O
24.5sccm mist, the time is 5s.
5, polycrystalline silicon gate grid etching process as claimed in claim 3 is characterized in that described process conditions of cross carving the step 1 are: pressure 60mt, go up radio frequency source power 300w, radio-frequency power 40w, etching gas are HBr200sccm, He150.5sccm, O down
24.5sccm mist, the time is 60s; The described process conditions of carving the step 2 of crossing are: pressure 60mt, and last radio frequency source power is 300w, and following radio-frequency power is 0w, and etching gas is Ar200sccm, and the time is 5s.
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| CNB2005101263819A CN100383931C (en) | 2005-12-08 | 2005-12-08 | Polycrystalline silicon gate grid etching process for reducing particle generation |
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| CNB2005101263819A CN100383931C (en) | 2005-12-08 | 2005-12-08 | Polycrystalline silicon gate grid etching process for reducing particle generation |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102376553A (en) * | 2010-08-05 | 2012-03-14 | 中芯国际集成电路制造(上海)有限公司 | Grid etching method |
| CN102044429B (en) * | 2009-10-23 | 2012-10-31 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method for etching silicon wafer |
| CN104425237A (en) * | 2013-08-20 | 2015-03-18 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Substrate etching method |
| CN104779152A (en) * | 2015-04-17 | 2015-07-15 | 上海华虹宏力半导体制造有限公司 | Polysilicon etching method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100559621B1 (en) * | 2003-02-04 | 2006-03-10 | 동부아남반도체 주식회사 | Etch method for dry etcher with unipolar electrostatic chuck |
| US6943119B2 (en) * | 2003-12-01 | 2005-09-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Flash process for stacking poly etching |
| CN100334688C (en) * | 2003-12-27 | 2007-08-29 | 上海华虹（集团）有限公司 | Method for eliminating grid etching lateral notch |
| CN100334693C (en) * | 2004-05-21 | 2007-08-29 | 中国科学院微电子研究所 | Method for etching 15-50 nanowire wide polycrystalline silicon gate |
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2005
- 2005-12-08 CN CNB2005101263819A patent/CN100383931C/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102044429B (en) * | 2009-10-23 | 2012-10-31 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method for etching silicon wafer |
| CN102376553A (en) * | 2010-08-05 | 2012-03-14 | 中芯国际集成电路制造(上海)有限公司 | Grid etching method |
| CN102376553B (en) * | 2010-08-05 | 2013-06-12 | 中芯国际集成电路制造(上海)有限公司 | Grid etching method |
| CN104425237A (en) * | 2013-08-20 | 2015-03-18 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Substrate etching method |
| CN104779152A (en) * | 2015-04-17 | 2015-07-15 | 上海华虹宏力半导体制造有限公司 | Polysilicon etching method |
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Address after: 100176 8 Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing Patentee after: Beijing North China microelectronics equipment Co Ltd Address before: 100016 Jiuxianqiao East Road, Chaoyang District, Chaoyang District, Beijing Patentee before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |