CN1849859A - Shield for circuit board and method of manufacturing same - Google Patents
Shield for circuit board and method of manufacturing same Download PDFInfo
- Publication number
- CN1849859A CN1849859A CN 200480026372 CN200480026372A CN1849859A CN 1849859 A CN1849859 A CN 1849859A CN 200480026372 CN200480026372 CN 200480026372 CN 200480026372 A CN200480026372 A CN 200480026372A CN 1849859 A CN1849859 A CN 1849859A
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- CN
- China
- Prior art keywords
- lid
- radome
- top cover
- circuit board
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention relates to a shield for circuit boards, and more particularly a shield, suitably manufactured from a one piece metal cover (1) and the corresponding manufacturing method. The shield comprises at least one shield portion (3) shaped from the cover (1) adapted to cover at least part of the circuit board. In a preferred embodiment, the cover has exterior walls (6) and a roof (5), wherein the shield portion comprises an interior shielding wall (3) shaped to depend from the roof (5). The shielding wall (3) may be shaped by cutting and bending material from the roof (5). The cover (1) may be made of metallized plastic or metal.
Description
Invention field
The present invention relates to a kind of radome that is used for circuit board, relate more particularly to a kind of radome of being made by bulk metal lid (1) of being suitable for, wherein masked segment is formed by the shaping wall that the top cover from lid is folded down.The invention still further relates to corresponding method of manufacture.
Background of invention
Some elements on the printed circuit board (PCB) (PCB) need or cover with certain metallic shield protection.Typically use the metal shell that is welded on the circuit board at present.These shells have the lid that fastens in order to keep in repair purpose.If the needs of element reprocessing are limited, can use the monolithic case that does not have lid.Also can use other technologies, as not have the metal plastic shell of packing ring, use that just All the time before.
A problem is that all screening cans all can take the space on the circuit board.When they during as the lid on the element top, increase extra thickness also can for whole PCB scheme.The welding shell that dismountable lid is particularly arranged, when it is wall and lid when forming by two parts, it becomes greatly highly easily, and described wall and lid overlap each other, thereby cause material thickness to double.
The screening can (whole shell) that does not have a lid is normally stretched by the depth of material of integral body and forms.Directly in metallic plate, form the internal shield wall then.(to the requirement of corner radius, stretching angle, less tolerance or the like) can the sizable PCB area of waste because manufacturing process.Whole shell also has a plurality of inwalls, and this inwall is made by independent material block, and combines by spot welding and shell.This method can be wasted less PCB area, its more complicated and costliness but then.
In most of the cases, need several independent radomes.When two radomes are installed each other side by side, consider a lot to the tolerance chain.Therefore, the weld mark on the PCB must be very wide, thereby cause low PCB area utilization.
For element reprocessing being required the limited minitype circuit board, for example bluetooth or RF module can for good and all be welded on shell on the PCB.This radome does not need dismountable lid, and simply mode (integral body) is made.
Summary of the invention
The present invention can address the above problem and other problems, and its mode is by with independent screening can alternative cover, and covering board forms radome, the arrangements of elements that this shielding is folded down and will shields relatively from the top cover that covers by forming shielding wall.
In first aspect, the invention provides a kind of radome that is used for circuit board, it comprises at least one by the masked segment that lid is shaped, this lid is suitable for covering partial circuit plate at least.
In a preferred embodiment, lid has outer wall and a top cover, and wherein masked segment comprises and being configured as from the sagging internal shield wall of top cover.
Can form the hole in top cover, the internal shield wall has dangled at this place, hole.
Suitably, the material by cutting and crooked top cover forms shielding wall.
Preferably, this lid is suitable for covering basically the entire circuit plate.
This lid is made by metallized plastics or metal.
In second aspect, the invention provides a kind of method that is formed for the radome of circuit board, this method may further comprise the steps: form at least one by the masked segment that lid is shaped, this lid is suitable for covering partial circuit plate at least.
In a preferred embodiment, this lid has outer wall and top cover, wherein by forming from the sagging internal shield wall of the top cover masked segment that is shaped.
Can form the hole in top cover, the internal shield wall has dangled at this place, hole.
Can form shielding wall by the material of cutting and crooked top cover.
This lid is made by metallized plastics or metal.
Lid can be welded on the circuit board.
The accompanying drawing summary
Describe the present invention in detail below with reference to the accompanying drawing of enclosing, wherein:
Fig. 1 be according to the present invention the radome on being installed in circuit board above the perspective view watched;
The perspective view that Fig. 2 watches below radome; And
Fig. 3 is the detailed view of some shielding walls among Fig. 2.
Describe in detail
An embodiment according to radome of the present invention has been shown among Fig. 1.This radome is made by the integral cap 1 on the printed circuit board (PCB) 2 that is installed in mobile phone for example or other electronic equipments.In the illustrated embodiment, lid 1 has covered entire circuit plate 2 basically.Because lid 1 wall 6 needs the space that is used to connect on circuit board, so this is the most effective spatial design scheme, described connection for example is by welding or gluing.This lid is the cover part circuit board only, and in this case, lid only covers some elements, and not conductively-closed or have other radomes of other elements on the circuit board.
Form radome by the masked segment 3 that is folded down from top cover 5, at lappet 3 shown in Fig. 2 and 3, it stands on top cover inside.The interval of calculating this lappet 3 is to obtain suitable shielding properties.This lappet can the relative arrangements of elements of discussing in correct position.By lappet is become a square around arrangements of elements, element can be fully besieged.
By top cover 5 being cut away several parts and various piece being bent downwardly the formation wall, can obtain internal shield wall 3.In the illustrated embodiment, this will stay some openings in top cover, as foursquare hole 4.These Kong Buhui produce any problem, but will allow air in lid 1 inner loop.
When using the lid of being made by one-piece metal sheet, this manufacture method is suitable especially.Yet, utilizing this method, other material also is fine, as long as these materials have suitable shielding and forming characteristic.This radome can be made with metal plastic, and promptly the lid by plastic shielding cover injection moulding is become to have intended shape makes the lid metallization then.
This lid can removably be connected with circuit board 2, perhaps by welding, fusion or gluing or the like carry out permanent fixing.
Compare with the single screening can of prior art, the present invention has several advantages.This radome can utilize the metal stamping technology of cheap and simple to make.Because layer of material is only arranged, so the height of radome reduces.This radome can provide the very efficient spatial design of inner shielding wall, thereby wastes the PCB area lessly.
Scope of the present invention is only limited by following claim.
Claims (14)
1. be used for the radome of circuit board (2), it is characterized in that
This radome comprises at least one by the masked segment (3) that lid (1) is shaped, and this lid is suitable for covering partial circuit plate (2) at least.
2. according to the radome of claim 1, it is characterized in that this lid (1) has outer wall (6) and top cover (5), wherein masked segment comprises and being configured as from the sagging internal shield wall (3) of top cover (5).
3. according to the radome of claim 2, it is characterized in that forming hole (4) in this top cover (5), internal shield wall (3) has dangled at this place, hole.
4. according to any one radome in the claim 1 to 3, it is characterized in that this lid (1) is suitable for covering basically entire circuit plate (2).
5. according to any one radome in the claim 2 to 4, it is characterized in that material forming shielding wall (3) by cutting and crooked top cover (5).
6. according to any one radome in the claim 1 to 4, it is characterized in that this lid (1) made by metallized plastics.
7. according to any one radome in the claim 1 to 5, it is characterized in that this lid (1) is made of metal.
8. method that is formed for the radome of circuit board (2) is characterized in that may further comprise the steps: form at least one by masked segment (3) that lid (1) is shaped, this lid is suitable for covering partial circuit plate (2) at least.
9. method according to Claim 8 is characterized in that this lid (1) has outer wall (6) and top cover (5), wherein by forming from the sagging internal shield wall (3) of top cover (5) masked segment that is shaped.
10. according to the method for claim 9, it is characterized in that forming hole (4) in top cover (5), internal shield wall (3) has dangled at this place, hole.
11., it is characterized in that material forming shielding wall (3) by cutting and crooked top cover (5) according to the method for claim 9 or 10.
12. the method for any one in 10 according to Claim 8 is characterized in that this lid (1) made by metallized plastics.
13. the method for any one in 11 is characterized in that this lid (1) is made of metal according to Claim 8.
14., it is characterized in that lid (1) is welded on the circuit board (2) according to the method for claim 13.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP03077870.8 | 2003-09-12 | ||
| EP03077870 | 2003-09-12 | ||
| EP04445001.3 | 2004-01-02 | ||
| US60/535,768 | 2004-01-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1849859A true CN1849859A (en) | 2006-10-18 |
Family
ID=37078472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200480026372 Pending CN1849859A (en) | 2003-09-12 | 2004-08-26 | Shield for circuit board and method of manufacturing same |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN1849859A (en) |
| AT (1) | ATE408328T1 (en) |
| DE (1) | DE602004016434D1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101729087A (en) * | 2008-10-21 | 2010-06-09 | 深圳富泰宏精密工业有限公司 | Wireless communication device |
| CN102333438A (en) * | 2010-07-12 | 2012-01-25 | 环鸿科技股份有限公司 | Metal shielding device and metal plate utilized for manufacturing metal shielding device |
-
2004
- 2004-01-02 AT AT04445001T patent/ATE408328T1/en not_active IP Right Cessation
- 2004-01-02 DE DE200460016434 patent/DE602004016434D1/en not_active Expired - Lifetime
- 2004-08-26 CN CN 200480026372 patent/CN1849859A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101729087A (en) * | 2008-10-21 | 2010-06-09 | 深圳富泰宏精密工业有限公司 | Wireless communication device |
| CN102333438A (en) * | 2010-07-12 | 2012-01-25 | 环鸿科技股份有限公司 | Metal shielding device and metal plate utilized for manufacturing metal shielding device |
| CN102333438B (en) * | 2010-07-12 | 2014-03-12 | 环鸿科技股份有限公司 | Metal shielding device and metal plate utilized for manufacturing metal shielding device |
Also Published As
| Publication number | Publication date |
|---|---|
| ATE408328T1 (en) | 2008-09-15 |
| DE602004016434D1 (en) | 2008-10-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Open date: 20061018 |