CN1819758A - 电磁双重屏蔽膜 - Google Patents
电磁双重屏蔽膜 Download PDFInfo
- Publication number
- CN1819758A CN1819758A CN 200610049911 CN200610049911A CN1819758A CN 1819758 A CN1819758 A CN 1819758A CN 200610049911 CN200610049911 CN 200610049911 CN 200610049911 A CN200610049911 A CN 200610049911A CN 1819758 A CN1819758 A CN 1819758A
- Authority
- CN
- China
- Prior art keywords
- equivalent
- nickel
- electromagnetic shielding
- chromium
- stainless steel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012528 membrane Substances 0.000 title claims description 20
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 59
- 239000011651 chromium Substances 0.000 claims abstract description 30
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 28
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 22
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 17
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 14
- 238000007747 plating Methods 0.000 claims abstract description 14
- 239000010935 stainless steel Substances 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 11
- 239000010936 titanium Substances 0.000 claims abstract description 9
- 238000005477 sputtering target Methods 0.000 claims abstract description 8
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 8
- 229910052742 iron Inorganic materials 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims description 10
- 239000004615 ingredient Substances 0.000 claims description 7
- 238000001465 metallisation Methods 0.000 claims description 7
- 229910018487 Ni—Cr Inorganic materials 0.000 claims description 5
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 230000005291 magnetic effect Effects 0.000 abstract description 13
- 229910001566 austenite Inorganic materials 0.000 abstract description 11
- 229910000859 α-Fe Inorganic materials 0.000 abstract description 10
- 238000004544 sputter deposition Methods 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 abstract description 4
- 230000009977 dual effect Effects 0.000 abstract description 2
- 230000005298 paramagnetic effect Effects 0.000 abstract description 2
- 239000013077 target material Substances 0.000 abstract description 2
- 150000002739 metals Chemical class 0.000 abstract 3
- 239000010941 cobalt Substances 0.000 abstract 1
- 229910017052 cobalt Inorganic materials 0.000 abstract 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 abstract 1
- 230000005307 ferromagnetism Effects 0.000 abstract 1
- MECMQNITHCOSAF-UHFFFAOYSA-N manganese titanium Chemical compound [Ti].[Mn] MECMQNITHCOSAF-UHFFFAOYSA-N 0.000 abstract 1
- 229910001120 nichrome Inorganic materials 0.000 abstract 1
- 239000010408 film Substances 0.000 description 16
- 229920003023 plastic Polymers 0.000 description 11
- 239000004033 plastic Substances 0.000 description 11
- 239000000047 product Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000001755 magnetron sputter deposition Methods 0.000 description 5
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000035699 permeability Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000004913 activation Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000005294 ferromagnetic effect Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005204 segregation Methods 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 229920006491 ABS+PC Polymers 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910000963 austenitic stainless steel Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011104 metalized film Substances 0.000 description 1
- 238000005088 metallography Methods 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Physical Vapour Deposition (AREA)
Abstract
本发明属于新型抗电磁干扰(EMI)屏蔽技术领域,特别是涉及一种电磁双重屏蔽膜,包括铁、铬、镍、钛锰、钴,其特征在于所述金属成分的百分含量为:Fe:30%~85%,Cr:5%~50%,Ni:1%~20%,Ti:1~10%;所述金属成分按照铬当量([Cr]=Cr+Mo+0.015Si+0.005Ti)和镍当量([Ni]=Ni+0.3C+0.005Mn)成分配比,计算的镍当量[Ni]小于24,铬当量大于16;由于本发明是采用奥氏体的镍铬类不锈钢作为溅射靶材,鉴于奥氏体是顺磁体,它具有较高的溅射成膜速率,通过溅射可以快速获得铁磁性的铁素体不锈钢薄膜,该薄膜具有磁屏蔽和电屏蔽效果,并且具有不锈钢材料良好的耐候性,它是一种镀覆于电子产品塑料外壳表面的理想金属膜之一。
Description
技术领域
本发明属于新型抗电磁干扰(EMI)屏蔽技术领域,特别是涉及一种电磁双重屏蔽膜。
背景技术
随着电子系统向轻薄化、微型化发展,现在多数电子系统的机盒都采用了塑料机盒。塑料具有可塑性好、可短期内批量生产、绝缘等优点,但是,塑料抗EMI效果较差,需要在成型后的塑料表面一定区域镀覆一层导电率或导磁率较高的材料,达到电磁屏蔽的效果,例如数字产品手机、PDA、笔记本电脑、机顶盒等,都要在塑料机盒内表面镀覆抗EMI膜材料,也就是进行塑料金属化,它是高频电子产品塑料外壳表面的重要结构。目前主要采用电镀、化学镀、导电导磁涂料、真空蒸发和磁控溅射方法,对电子产品塑料外壳表面镀覆抗EMI金属膜;其中,磁控溅射的抗EMI金属膜的性能最好,因而在高端产品中普遍使用,如手机、PDA、笔记本电脑的围框和外壳。但是磁控溅射沉积磁屏蔽膜效率很低,不适合磁屏蔽膜工业化生产。因此,研制一种具有可以快速磁控溅射制备的导电率好、导磁率高的电磁双重屏蔽膜已成为电子产品生产企业急需解决的问题之一。
在现有技术中,电磁屏蔽膜材料主要有两类:(1)电屏蔽材料,要求具有高的电导率,特别是高频电子产品表面肌肤效应明显,高的电导率才可以起到有效电屏蔽的作用;(2)磁屏蔽材料,要求具有较高磁导率的磁性材料。电磁屏蔽膜材料主要是铜或镍,铜的良好电导率可起到电屏蔽作用,但铜易氧化、耐候性差;而对于抗EMI要求较高的场合要求电和磁的双重屏蔽,镍具有较高磁导率和较低电阻率可以起到电磁屏蔽双重作用,并且具有良好的耐候性,但是由于镍是铁磁性材料,镍靶会屏蔽靶表面磁场,导致其成膜效率很低,不适合磁控溅射工业化生产,这严重阻碍了磁控溅射在塑料金属化中的应用。
发明内容
本发明目的是提供一种既有较好导电率、又有较高导磁率,且生产工艺简单、成本低廉的电磁双重屏蔽膜。
本发明的目的是采用这样的技术方案实现的:它包括铁、铬、镍、钛,其特征在于所述金属成分的百分含量为:Fe:30%~85%,Cr:5%~50%,Ni:1%~20%,Ti:1~10%;
所述金属成分按照铬当量([Cr]=Cr+Mo+0.015Si+0.005Ti)和镍当量([Ni]=Ni+0.3C+0.005Mn)成分配比,计算的镍当量[Ni]小于24,铬当量大于16。
本发明的解决方案是基于镍铬类双相不锈钢的金相组织有奥氏体和铁素体两种相结构特性,奥氏体是顺磁性的,铁素体是磁性的;在金属学中,将促进形成铁素体的元素折算成铬当量为([Cr]=Cr+Mo+0.015Si+0.005Ti),将促进形成奥氏体的元素折算成镍当量([Ni]=Ni+0.3C+0.005Mn),根据铬当量和镍当量从谢夫尔图表中可查出该成分不锈钢的铁素体和奥氏体含量。
根据上述原理,本发明设计靶材成分时,通过大量的实践探索,确定选择组织在奥氏体区,而其铬和镍当量位置很接近铁素体区,并增加形成铁素体并溅射产额大的元素,减少形成奥氏体并溅射产额小的元素,这样溅射后,就可以获得铁素体的不锈钢金属薄膜,本发明方法所形成的铁素体元素如Cr等的溅射产额都大于形成奥氏体元素Ni、Mn的溅射产额;对于镍铬类双相不锈钢,其成分就处于奥氏体和铁素体相互转化的临界区域,很容易发生相结构的变化,众所周知:奥氏体不锈钢焊接时,焊接组织中常常因为成分偏析导致出现铁素体的焊缝组织。
由于本发明是采奥氏体的镍铬类不锈钢作为溅射靶材,鉴于奥氏体是顺磁体,它具有较高的溅射成膜速率,通过溅射可以快速获得铁磁性的铁素体不锈钢薄膜,该薄膜具有磁屏蔽和电屏蔽效果,并且具有不锈钢材料良好的耐候性,它是一种镀覆于电子产品塑料外壳表面的理想金属膜之一。
具体实施方式
本发明电磁双重屏蔽膜,包括铁、铬、镍、钛,所述金属成分的百分含量为:Fe:63%,Cr:30%,Ni:6%,Ti:1%。
本发明所述电磁双重屏蔽膜采用的法制备方法是:塑料表面清洗-塑料表面活化-金属化溅射镀;所述金属化溅射镀采用的溅射靶为奥氏体的镍铬类双相不锈钢靶材。
下面结合具体实施例对工艺步骤作进一步说明:
(1)塑料表面清洗:将被镀塑料件放在清洗液中,超声清洗20分钟后,取出烘干;所述塑料件是ABS、ABS+PC、PC或PC+玻璃纤维中的一种材料制成;
(2)塑料表面活化:将覆盖一定掩模的塑料放入真空镀膜装置行星片架上,抽真空至本底真空度5×10-3Pa后,充入氩气至真空度0.5Pa,并稳定在该真空度,打开射频电源,通过真空腔体内的射频线圈放电产生等离子体,对塑料表面进行活化处理,提高后面金属化膜的结合力,10分钟后关闭射频电源,等离子表面活化结束;
(3)金属化溅射镀:打开溅射靶电源,馈入功率密度20W/cm2,行星片架转动,稳定后打开挡板开始直流溅射,溅射靶为直径为60毫米的1Cr18Ni9Ti不锈钢材料,十分钟后在磁体表面镀覆一层厚度一微米的不锈钢膜后,在真空中保留10分钟,再放入大气打开真空腔体,取出镀覆好电磁双重屏蔽膜的塑料件,这时塑料表面的薄膜具有较高的电导率和磁导率,可以作为电磁屏蔽膜使用;
所述电磁双重屏蔽膜的金属成分包括:Fe:30%~85%,Cr:5%~50%,Ni:1%~20%,Ti:1~10%;各金属成分配比按照铬当量([Cr]=Cr+Mo+0.015Si+0.005Ti)和镍当量([Ni]=Ni+0.3C+0.005Mn)计算,计算的镍当量[Ni]小于24,铬当量[Cr]大于16。屏蔽膜厚度在0.1~1000微米范围内。
所述溅射靶为不锈钢1Cr18Ni9Ti,其铬和镍当量为(18,7),其标准金相组织是奥氏体,其当成分偏析时(如焊接组织)就会出现铁素体;Cr溅射产额为0.67、Ni为0.66、Ti为0.22、Fe为0.53,由于铁磁性的Ni、Fe实际溅射产额较低,溅射后的成分约在Cr30Ni6Ti,铬和镍当量为(35,6),已经落入铁素体区域了,所以在溅射不锈钢时,获得的薄膜属于铁素体组织,从而达到采用顺磁体为靶材,溅射获得铁磁体金属薄膜的作用。
按照国家标准测试:
(1)经过10%氯化钠的常温耐候性盐雾试验,48小时后未见锈蚀;
(2)25℃和70℃反复热冲击实验20次,未见起皮脱落;
(3)常温溶液湿润法(10%氯化钠+2%明胶溶液)测量,膜层未见蓝色斑痕和孔蚀现象,说明膜层致密;
(4)标准拉力计测试膜层结合力大于7MPa;
(5)用磁铁粉测试具有一定的磁性吸力,方块电阻低于8;
(5)对其金相组织分析鉴定:靶材是奥氏体组织,溅射后薄膜是铁素体组织;
实验结果表明:膜层完全可以作为电磁双重屏蔽膜使用,而且膜层具有良好的结合力和耐候性。
Claims (5)
1、电磁双重屏蔽膜,包括铁、铬、镍、钛,其特征在于所述金属成分的百分含量为:Fe:30%~85%,Cr:5%~50%,Ni:1%~20%,Ti:1~10%。
2、根据权利要求1所述的电磁双重屏蔽膜,其特征在于所述金属成分按照铬当量([Cr]=Cr+Mo+0.015Si+0.005Ti)和镍当量([Ni]=Ni+0.3C+0.005Mn)成分配比,计算的镍当量[Ni]小于24,铬当量大于16。
3、根据权利要求1所述电磁双重屏蔽膜,其特征在于所述电磁双重屏蔽膜厚度在0.1~1000微米范围内。
4、根据权利要求1所述电磁双重屏蔽膜的制备方法是:塑料表面清洗—塑料表面活化—金属化溅射镀;所述金属化溅射镀采用的溅射靶为奥氏体的镍铬类双相不锈钢靶材。
5、根据权利要求4所述电磁双重屏蔽膜的制备方法,其特征在于溅射靶为直径为60毫米的1Cr18Ni9Ti不锈钢材料。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200610049911 CN1819758A (zh) | 2006-03-20 | 2006-03-20 | 电磁双重屏蔽膜 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200610049911 CN1819758A (zh) | 2006-03-20 | 2006-03-20 | 电磁双重屏蔽膜 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1819758A true CN1819758A (zh) | 2006-08-16 |
Family
ID=36919372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200610049911 Pending CN1819758A (zh) | 2006-03-20 | 2006-03-20 | 电磁双重屏蔽膜 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1819758A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101760696A (zh) * | 2009-06-07 | 2010-06-30 | 王铁运 | 防辐射合金材料 |
-
2006
- 2006-03-20 CN CN 200610049911 patent/CN1819758A/zh active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101760696A (zh) * | 2009-06-07 | 2010-06-30 | 王铁运 | 防辐射合金材料 |
CN101760696B (zh) * | 2009-06-07 | 2013-03-20 | 王铁运 | 防辐射合金材料 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Yang et al. | Microwave absorption property of Ni–Co–Fe–P-coated flake graphite prepared by electroless plating | |
Jiang et al. | Electromagnetic shielding and corrosion resistance of electroless Ni–P/Cu–Ni multilayer plated polyester fabric | |
CN101175394A (zh) | 一种防电磁干扰的多层复合材料及其制备方法 | |
Bi et al. | Comparative study of electroless Co-Ni-P plating on Tencel fabric by Co0-based and Ni0-based activation for electromagnetic interference shielding | |
CN106057287B (zh) | 宽频屏蔽透明导电材料 | |
CN101704312A (zh) | 复合电磁屏蔽材料及其制造方法 | |
Kim et al. | A study on EMI shielding enhancement behaviors of Ni-plated CFs-reinforced polymer matrix composites by post heat treatment | |
Xu et al. | Silver-coated glass fibers prepared by a simple electroless plating technique | |
González-Gutiérrez et al. | Studies on the physical and electrochemical properties of Ni-P coating on commercial aluminum as bipolar plate in PEMFC | |
Cao et al. | Investigation into conductivity of silver-coated cenosphere composites prepared by a modified electroless process | |
CN100494478C (zh) | 电磁双重屏蔽膜的溅射制备方法 | |
Xu et al. | An ultra-light and high electromagnetic shielding effectiveness material based on melamine foam with its skeleton metallized | |
Guan et al. | Absorption-dominant radio-wave attenuation loss of metals and graphite | |
Li et al. | Facilitating complex thin film deposition by using magnetron sputtering: a review | |
CN109413980A (zh) | 一种不含化学电镀工艺及不含导电颗粒的超高频电磁波屏蔽膜及含该膜的线路板的制作方法 | |
Jung et al. | Effect of Surface Pretreatment and Plating Time on Electromagnetic Shielding Reliability of Electroless Plated Copper Layer Conductors | |
Zhou et al. | Effects of passivation on the properties of Ni-P alloy coating deposited on CFs reinforced PEEK | |
CN1819758A (zh) | 电磁双重屏蔽膜 | |
Liu et al. | Synthesis, characterization, and infrared-emissivity study of Ni–P–CB nanocomposite coatings by electroless process | |
Xiang et al. | Effects of heat treatment on magnetic properties of Co–Fe-plated hollow ceramic microspheres | |
CN114574859A (zh) | 一种对连续非金属带材导电化和黑化处理的方法 | |
Hui et al. | Preparation of EMI shielding and corrosion-resistant composite based on electroless Ni-Cu-P coated wood | |
CN110230011B (zh) | 一种用于恶劣腐蚀环境的铁基非晶/MXenes复合电磁屏蔽材料及应用 | |
Ali et al. | Multilayer ceramic coating for impeding corrosion of sintered NdFeB magnets | |
CN106906647B (zh) | 一种具有电磁屏蔽功能的复合涂层纤维及其制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |