CN1817075A - Gluing method and device - Google Patents

Abstract

For gluing a circuit component (51) onto a circuit board (6), the circuit component (51) having a bottom area for bringing into contact with the circuit board with at least one edge (52, 53), the distance (d)) between the edge and a first line (56, 57) parallel to said edge and an amount of adhesive to be applied per length unit along said line (56, 57) are determined such that when placing the circuit component (51) on the circuit board (6) the adhesive advances to said edge (52, 53) but not to a second circuit component (54, 55) adjacent to said edge; the adhesive is applied ill the selected quantity along said first line (56, 57) and along further lilies (58) which are parallel to said first line and further away from said edge (52, 53); then the circuit component (51) is placed on the circuit board (6).

Description

Method of attaching and device

The present invention relates to a kind of being used for pastes method and a kind of device that is used to implement this method on the circuit board with circuit element, is applicable to the automated manufacturing of electronics, optics or hybrid circuit at circuit board described in the context.

In the scope that automated circuit is made, by silk screen printing with adhesive patch be coated onto will the circuit board of installation elements on, and circuit element to be placed on these sticking patch then be known.Because all adhesive patches that need on the circuit board are produced by single operation, so this method is fast with efficiently.Because for every type that will make circuit, the distribution of the adhesive patch on the circuit board is normally specific, so need carry out specific printing screen for each such model.When from a kind of circuit conversion to the another kind of circuit of manufacturing, it is made and the exchange of silk screen is time-consuming, so this method is only just economical when a large amount of production.

The further problem of this conventional method is, is difficult to accurately to measure the amount of the binding agent of coating.On the one hand, the amount of binding agent is must be enough big, feasible when its at circuit board with lay when being compressed between thereon the circuit element, the bottom of circuit element can fully be bedewed.On the other hand, the amount of binding agent can not be too many, otherwise the binding agent of quite big quantity can be extruded the edge that is exposed to circuit element.Especially in the RF circuit, the ifs circuit element has to be provided with little lead pin pitch, and this lead pin pitch is strictly pre-determined by the requirement of the coupling of the high frequency between the element, then can produce serious problem.If a large amount of binding agents enters the gap between the circuit element of two tight adjacency, and rise therein, that is to say between the circuit element opposite flank capillary effect take place that then it will change the ratio conductivity of the conductor of crossing over the gap and change high frequency coupling between the adjacent element thus.

Also have a problem to be by the printing technology adhesive stripe-coating, it is absolute flat necessarily requiring circuit board.Ifs circuit comprises hybrid element, wherein substrate is installed on the circuit board and other circuit element is installed in the substrate, then can not accomplish: at first by pasting substrate, adhesive stripe-coating then is placed in more circuit element after again and is arranged on these hybrid elements on the circuit board continuously in the substrate; But replace, such hybrid element must be fully by pre-assembled, and must be placed on the circuit board with the unit of sealed knot.

The objective of the invention is to provide a kind of circuit element is pasted method on the circuit board, and a kind of device that is suitable for implementing this method, it allows high flexible ground to carry out small-scale manufacturing, and reduce change-over time under the situation that can change, and can continuously hybrid element be arranged on the circuit board in the circuit kind of manufacturing.

Can realize above-mentioned purpose by method with the described feature of claim 1 and device with the described feature of claim 17.

By the distance between first line and the circuit element edge that will lay is carried out match selection with the amount that is coated in the binding agent on the described line, can prevent reliably that binding agent from undesirable undue exposure taking place along described edge, even the amount of the binding agent that is measured seldom.By the more multi-thread position on the basal area is suitably selected, can realize large-area surface bonding.

If the circuit element of pasting has two parallel edges, it is suitable for distance between selected and each edge and binder amount, carries out adhesive stripe-coating in two edges along first line parallel so.Zone between the first parallel then line is suitably filled by parallel and equidistant adhesive line.When circuit element is placed to and by when circuit board is exerted pressure, the air that is present between circuit board, circuit element and two adhesive line can be overflowed along the space between the described line.

The number of equal space line preferably is chosen as, and makes that the distance between the line approximately doubles selected distance in the step a).Like this,, can on the entire area of circuit element, form continuous or subcontinuous adhesive-layer, and can not cause that a large amount of binding agents extrudes from the circuit element bottom by circuit element is exerted pressure.

According to first embodiment of this method, along every line adhesive stripe-coating continuously.This embodiment is to use hollow needle, by pump to its delivery of glue, when pin pump when line moves is operated continuously.This step is preferred for pasting the circuit element with several millimeters or longer edge.

If online end binding agent is supplied with interrupt, the glue that then can form binding agent drips, and when circuit element was exerted pressure, the glue of binding agent dripped and can expose at its edge.In order to prevent to form such adhesive drops, preferably the preset distance place before the end points that arrives every line stops the operation of binding agent measuring pump, perhaps another kind of optional mode is, makes the feed direction of pump reverse, makes the binding agent that also not have to apply regain towards pump.Another kind prevents that the possibility that the glue of binding agent drips formation from being that each online end makes the direction of motion of pin reverse, stops the work of pump simultaneously, makes binding agent distribute along the line.

According to second embodiment of this method, it is preferred for the circuit element pasting little circuit element or have predetermined low thickness adhesive-layer, and binding agent applies with the equidistant points form along every line.

Distance between the point in every line preferably approximately doubles the distance of selecting in the step a), makes the point of binding agent form square net.

For circuit element being bonded in their whole bottom section, comprise the turning, additional adhesive dot should be set at each turning in described zone, preferably along this turning to separated time.The distance of these annex points and neighboring edge should be less than selected distance in the step a).

For adhesive dot is set, can use the tip of supplying with binding agent continuously, for example above-mentioned pin by the supply of binding agent pump.Then, the amount of the binding agent on each point is controlled by the flow of pump and the frequency ratio between the two of set-point.In order to form especially little adhesive dot, especially be suitable for discontinuous step, wherein binding agent is coated onto on the tip in the mode that replaces, and the tip is contacted with circuit board.Especially, some binding agents in the most advanced and sophisticated contacting container can be finished coating.The amount of the binding agent that is comprised in the point, the surf zone by the tip in other factor determined, this tip contacts with binding agent and circuit board in the container, and can reach 0.2nl and amount still less.

In order as far as possible accurately to measure binding agent, and no matter viscosity or other character of binding agent and being used for applies the contingent variation of its pump, preferably at implementation step b) adhesive stripe-coating p-wire before, and judge the amount that is included in bonding agent wherein by non-contacting measurement.Each stage in this method can be carried out such judgement.If judged before step a), then the decision content of binding agent may be selected the amount of the binding agent that measures in the step a), and the speed at the distance between the line and/or the tip of adhesive stripe-coating is mated in view of the above.Can also be at step a) and b) between judge, in this case,, accurately realize the amount of the previous bonding agent of determining that will apply by controlling the most advanced and sophisticated speed or the delivery rate of pump.

If adhesive line is formed by independent point, can carry out such judgement to the amount of binding agent according to test point; And according to the result who judges, in the distance of line and/or the line distance of point and/or under the situation of pump continued operation in the some amount of binding agent can be determined.

With reference to the accompanying drawings, and read follow-up explanation to embodiment, the more feature and advantage of the present invention will be apparent.

Fig. 1 is the schematic top plan view of place machine, and this place machine is the embodiment that the present invention is used for binding agent is coated onto the device on the circuit board;

Fig. 2 is the schematic side view of binding agent dispensing head;

Fig. 3 A is the generalized section of binding agent dispensing head when being in primary importance;

Fig. 3 B is the generalized section of binding agent dispensing head when being in the second place;

Fig. 4 is the flow chart of place machine method of operation of the present invention;

Fig. 5 is the vertical view that the method according to this invention is coated onto binding agent the circuit board on it.

Place machine shown in Figure 1 comprises two band conveying equipments 2,3 that are installed on vibration-vibration damping table top 1, be used to supply with by claw 5 circuit board 6 is assembled into circuit carriers 4 on it, the magazine loader 7 that is not shown specifically from figure is supplied to riding position 8, and when laying when finishing from place machine, to come out to be used to be further processed. Band conveying equipment 2,3 all has elongated level board 9, the driving-belt 10 that it has around the edge, circuit carriers 4 transfixions that transmit on level board.Circuit carriers 4 is directed, and has little gap between flank 11.

Riding position 8 is formed by the workbench that can vertically change, workbench is inserted in the plate 9 of belt conveying equipment 3, and for circuit carriers 4 from being with 10 to mention, and take to it exactly determined and can reproduce the height of setting, workbench leans on leaning on to raise realizes installation course.

Adhesive dispenser 13 and anchor clamps 14 are installed on the track 15, are with the throughput direction of conveying equipment 2,3 removable so that be parallel to, and are installed on the track 16,17, so that laterally removable with respect to throughput direction.In addition, the height of distributor 13 and anchor clamps 14 is controllable.According to the structured data that will be installed in the circuit on the circuit board 6, the moving of control circuit 18 control dispensers 13 and anchor clamps 14.In order to receive these structured datas, control circuit 18 is equipped with digital interface and/or the reading plotter that is used for the portable data medium (not shown).

Fig. 2 is the end view of distributor 13 lower areas.Two dispenser heads 20,21 are along can the phase double replacement between the two positions of track 19, and track shows to have semicircular structure here.At the opposite side of track 19, be provided with laser diode 32 and optical pickocff 33 regularly and (be hidden among Fig. 2, referring to Fig. 3 A, 3B).

Laser diode 32 and transducer 33 face the needle point orientation that is arranged on the dispenser head between them, promptly in the structure of the dispenser head shown in Fig. 2 21, and be formed for measuring the non-contact measuring device of the distance between the surface under distributor and the corresponding dispenser head.

Fig. 3 A shows the generalized section of dispenser head 20 lower areas.The upper area of the dispenser head 20 that does not illustrate fully comprises adhesive of groove 25, and pipe 26 leads to the pump that is formed by chamber 27 here from groove, accommodates in the chamber 27 by motor 28 and drives the worm screw 29 of rotating.On the bottom sides of dispenser head 20, hollow needle 30 protrudes downwards.The exit passageway 31 that is connected to chamber 27 extends through pin 30.

Dispenser head 20 is used for the form coating adhesive with continuous lines or independent point.In order to form continuous adhesive line 36 on circuit board surface, control circuit 18 control dispensers 13 along the line 36 is mobile on the one hand, and the amount of the binding agent of worm screw 29 conveyings makes adhesive line 36 formation have required cross section on the other hand.Moving of the high more and distributor 13 of delivery rate is slow more, and then cross section is just big more; Distributor move fast more and delivery rate more little, then cross section is just more little.

For the coating adhesive point, worm screw 29 is activated off and on, carries a certain amount of binding agent when making every some coating, and perhaps worm screw 29 is rotated continuously, and pin 30 dips in the surface of wanting adhesive stripe-coating with predetermined constant frequency point.

When adhesive stripe-coating continuously or off and on, use laser diode 32 and transducer 33 to control the height of pin 30 above circuit board continuously.This just allows when on circuit board continuously during adhesive stripe-coating, very little distance is moved from circuit board surface in the top of pin 30, make binding agent form from the teeth outwards with very trickle structure plan, and/or when point dips in pin 30, stop at identical distance when allowing pin 30 at every turn before fast contact surface, make to form to have the shape that accurately to reproduce and the adhesive dot of equal volume.

Dispenser head 21 shown in Fig. 3 B is solid.Its pin 37 has the planar end surface 38 that diameter is approximately 75mm.

The tip 38 of dispenser head 21 alternately is impregnated in the binding agent dish, dips in then on the surface that forms adhesive dot.In schematic top plan view shown in Figure 1, binding agent dish 22 steppings of plane dish ground rotation, and it is concentric with rotating shaft wherein to hold the groove 23 of binding agent.Scraping blade 24 immerses in the grooves 23, and equating because pin 37 flood wherein causes the adhesive surface of being out of shape when rotating at every turn.Like this, when pin 37 immersion dishes, it contacts with fresh adhesive surface at CL, makes each amount that immerses the binding agent that is brought keep constant.Use laser diode 32 and transducer 33, pin 37 in adhesive of groove 23 immersion depth and remain unchanged when putting the distance that is positioned at when dipping on circuit board above the circuit board.

Anchor clamps 14 have two jaws that can move in opposite directions, are used to be supported on the table top 1 and clamp circuit element, and before circuit board scribbles adhesive line or viscose glue point, these elements are pressed on the circuit region of circuit board.Pressing time and pressure are controlled by control circuit 18.

Below, the operation to the control circuit 18 that is used for coating adhesive on circuit board is described according to the flow chart among Fig. 4.In first step S1, control circuit receives cad data, and this cad data comprises circuit board and will be installed to the geometric parameter of the circuit element on the circuit board.By digital interface or reading plotter, data are transfused in the control circuit 18.The circuit element that illustrates in the cad data will be directly installed on the circuit board, perhaps be installed in another and be arranged in the circuit element on the circuit board, for example ceramic bases.

In step S2, control circuit determines the element that each is determined in cad data, if pointwise or apply by line ground and to be used for pasting its binding agent.The stickup of predefined type can be included in the cad data; If situation is not such, then control circuit 18 is according to the type of the size decision stickup of circuit element.If edge length less than two millimeters, if especially relate to electronic component, just selects pointwise ground to paste.Under the situation of large-scale element, for example substrate, shielding element or the like are then selected to paste by line.

Before beginning to be coated onto binding agent on the circuit board that will assemble, distributor 13 is calibrated.This helps guaranteeing the reproducible metering of binding agent, and let it be can time dependent viscosity how.When one jar of traditional binding agent during by opening, it has the restriction of " jar useful life ", and producer is used for guaranteeing the validity of binding agent.Yet it does not have to get rid of the situation that the viscosity of binding agent changes under disadvantageous weather conditions, makes before the useful life of bottle expires, and no longer may use the binding agent of appropriate metering, perhaps even cause pump to be damaged.Calibration procedure is used for detecting this situation exactly, and will change binding agent in case of necessity.In addition, it also is used for determining under advantage, crossed useful life after, whether binding agent still available and still can apply.

Use 20 calibrations of carrying out pointwise, use 21 calibrations of carrying out pointwise, the calibration of perhaps pursue line is perhaps only carried out in these alternatives one or two, if another scheme does not have use in present assembly technology.

When by the line calibration, control circuit 18 drives dispenser head 20 and passes test board with certain speed, and the delivery rate of worm screw 21 delivery rate that afterwards binding agent was coated onto on the circuit board of making peace greatly is identical, and applies adhesive line (step S3) on test board.Then, distributor 13 laterally moves through the adhesive line of coating, use laser diode 32 and light-sensitive element 33 to detect the distance of dispenser head 20 on the working face of test board continuously, so that detect the cross section of adhesive line, and the amount of the binding agent that on every long measure, applies.If find that in step S4 the amount and the demand of detected binding agent are inequality, then the translational speed of delivery rate of worm screw 29 and/or dispenser head 20 will and demand and detected binder amount between relative different (step S5) proportional.This step can repeat, and is enough consistent up to the binder amount with coating of the demand of realization.

Under the situation of using dispenser head 20 pointwises coating, under for the situation of laying operation (S6) design subsequently, on test board, form one or more test points, and volume is than predetermined value (S7).By changing delivery rate and/or the frequency of worm screw 29, the quantity of this quantity and the point that dips in of putting adapt (S8).

Under the situation of using dispenser head 21 point of application, test point also is set, and measures their volume (S9).Enter immersion depth within the binding agent jar 22 by the needle tip 38 that changes dispenser head 21, and the amount (S11) that at every turn immerses the binding agent of being taken out of in the container 22, volume that can point is set to desirable value.

If use laser diode 32 and light-sensitive element 33 to be not enough to measure the line of coating or the volume of point, for the amount of binding agent that will coating is set to desirable value, outside manufacturing installation of the present invention, measure these, and the value that will obtain is input in the control circuit 18 and can realizes.

In step 12, control circuit is selected the circuit element of an explanation in the cad data, and adhesive pattern is applied on the circuit board that will install.

At first, suppose that the mode that is coated on this circuit element is to use the mode of dispenser head 20 coating viscosity glue lines.In this case, in step S13, control circuit 18 is determined those edges that passed by the RP holding wire of circuit element from cad data.If the circuit element of selecting for example is the substrate 51 among Fig. 5, there are two parallel edges 52,53 so, RF holding wire (not shown) passes wherein and extends to respectively in the adjacent substrate 54,55.Because all substrates that will be installed on the circuit board 6 depend on substrate 51 and below circuit board 6 between the required thickness of adhesive-layer and the amount of every long measure binding agent of previous calibration, so necessarily be present in being defined between edge 52,53 and the most contiguous viscose glue 56,57 apart from d1.In the drawings, substrate 51,54,55 is the same apart from d1.If the required adhesive-layer variable thickness of substrate miscellaneous sample can be selected different from d1 so.In step S14, control circuit calculates adhesive line 56,57 with respect to the coordinate of the position at edge 52,53 with apart from d1.

In step S15, calculate the coordinate of equal space line 58, the spacing between the line 56,57 is filled.Control circuit 18 is selected the number of this insertion line 58, makes similar as far as possible apart from d2 and 2 * d1 between the adjacent line 56,57,58.Like this, soak basically fully the just feasible bottom of having the substrate 51 of binding agent, and can not cause when substrate 21 is exerted pressure the risk that edge 52,53 following binding agents will be extruded.

In step S16, adhesive line 56,58,57 is coated on the circuit board 6 according to the coordinate that calculates.

In the RF circuit, substrate is substrate 57, and it has the RF signal transition at non-parallel side.For example, substrate 55 direction towards substrate 51 and circuit element 61 on its edge 59,60 has the RF signal transition respectively.In this case, control circuit 18 jumps to step S17 from step S13, will carry out the basal region of substrate 55 is divided into some element areas again in this step, and each zone all only has signal transition on one side or parallel edges.In these sub-regions, in succession above-mentioned step S14-S16 is carried out in substrate 51.Thus, two groups of adhesive line parallel to each other 62,63 are set in the substrate 54, wherein in every group farthest line and edge 59 or 60 between apart from d1, respectively with edge 52 and line 57 between distance identical, and between the line wherein apart from d2 ', d2 " determine apart from the identical method of d2 by above-mentioned being used for, but can be different from d2 and mutually between also inequality.

Similarly, control circuit 18 also produces the pattern of the parallel adhesive lines of the circuit element that is used for not transmitting the RF signal, and this circuit element is waveguide lid 62 for example, and the free end with substrate 55 of antenna conductor (not shown) puts in wherein.

If the edge length of the circuit element of pasting is very little, be about 5 to 6 times apart from d1, be difficult to make the contact-making surface between circuit element and its support to realize enough soaking by above-mentioned by line binding agent mounting method.Since miniaturized component usually is the activeleg that causes power loss, it is crucial realizing contacting with the region-wide heat conduction of support by the adhesive-layer of predetermined low thickness so.Especially be applicable to the circuit element 61 among Fig. 5.Here, the control unit among the step S12 18 is selected the adhesive pattern that formed by a single point.Use in two dispenser heads 20,21 any one can form this pattern.The size of ifs circuit element 61 is very little, and control circuit selects 20 among the step S18 so, perhaps other 21.The situation that will realize when the calculation level pattern is similar to those situations that produces line: the amount of every some stickup pre-determines by calibration, and by pre-determine form must have count from the edge fixing apart from d1 ', this edge is passed by the RF signal, so that guarantee when circuit element is exerted pressure, binding agent will spread to its edge, on the other hand, prevent that binding agent is extruded from this edge when exerting pressure.When circuit element was pressed, for the point that guarantees to form in the line merges, mutual distance will should be greater than 2d1 ' between them; Suitable equally for the distance that dotted line is mutual.According to these situations, control circuit 18 calculates adhesive dots near the coordinate (S19) on two lines of circuit element two edges, and the coordinate (S20) of adhesive dot on the line that is equally spaced between described two lines subsequently.

In amplifying Figure 70, can be clear that, in the corner of circuit element 61, the second mobile adhesive dot 72 be positioned on the adhesive dot 71 that became line last time (S21, S22).The adhesive dot 72 that moves is than the edge of adhesive dot 71 more close circuit elements 61, and is positioned on the bisecting line at turning, and therefore when circuit element 61 was crushed on the circuit board 6, its binding agent that comprises virtually completely was full of the turning of circuit element.Like this, binding agent almost can 100% ground soaks the bottom of circuit element 1.

In Fig. 5, amplify and show that under the situation of miniature circuit element, the control circuit 18 special improved binding agent distributions of selecting are illustrated by circuit element 73.In order to paste this element, two lines of point 74 that are parallel to the longitudinal edge of circuit element 73 are calculated (S19), and are placed on the circuit board 6.Situation as circuit element 61, point 74 is selected apart from d1 ' from longitudinal edge, make that the point 74 of all lines of one-tenth is merged into continuous lines, and is not extruded along the longitudinal edge binding agent of circuit element 73 when circuit element 73 is pressed.Since two the mutual distance of line is greater than 2d1 ' but less than 4d1 ', just there is the risk of point 74 nonjoinders of two lines when exert pressure, on the contrary the space with regard to not being used for placing more dotted line.Therefore, between two dotted lines, the extra high place of power loss that individual other adhesive dot 75 is arranged on circuit element 73 selectively, though make the bottom of circuit element 73 behind pressurized not fully bonded dose get wet, also can guarantee from the circuit element to the circuit board 6 efficiently radiates heat.

In the embodiment that the present invention simplifies, 20 of distributor 13 can not exist, and makes that only use 21 just can the set-point, perhaps simplified control circuit 18 can be set, and its support only comes the set-point by 20 rather than 21.

Claims (17)

1. one kind is used for circuit element (51,54,55,61,73) is pasted method on the circuit board (6), this circuit element (51,54,55,61,73) has and comprises that at least one is used for the edge (52 that contacts with circuit board, 53,59,60) bottom section, described method comprises following step:

A) select to be positioned at edge (52,53,59,60) and be parallel to article one line (56,57,62 at described edge, 63) distance between (d1), and along the binder amount of every long measure of described line (56,57) coating, when making that circuit element (51,55) ought be placed in circuit board (6) goes up, binding agent will advance to edge (52,53,59,60), but do not arrive the second circuit element (54,55,61) at contiguous described edge;

B) along binding agent (S14, the S16 of first line (56,57,62,63) coating selected amount; S19, S22);

C) apply more binding agent (S15, S16 along being parallel to described first-line more line (58,62,63); S20, S22), it is more farther than the first linear distance edge (52,53,59,60); And

D) circuit element (51,54,55,61) is placed on the circuit board (6).

2. method according to claim 1, wherein bottom section has at least two parallel edges (52,53), it is characterized in that, first line (56,57) that is parallel to two edges is carried out step b) (S14, S16; S19, S22), and at step c) (S15, S16; S20, S22) in, binding agent is coated with the equidistant parallel line (58) that is positioned between described two first lines (56,57).

3. method according to claim 2 is characterized in that, for all lines (56,57,62,63) select the binder amount of equal every long measure, and select the number (S15) of equal space line to make their distance (d2) double the distance of selecting in the step a) (d1) basically.

4. according to each described method in the aforementioned claim, it is characterized in that, by along every line movably most advanced and sophisticated (30) adhesive stripe-coating (S16) continuously.

5. method according to claim 4 is characterized in that, in the end of every line, the feedstock direction of binding agent feed pump (28,29) is reversed.

6. method according to claim 4 is characterized in that, when receiving track (56,57,58 ...) the end time, the direction of motion of most advanced and sophisticated (30) is reversed.

7. according to each described method among the claim 1-3, it is characterized in that, along every line adhesive stripe-coating (S22) of equidistant points (71,74) formation.

8. method according to claim 7 is characterized in that, the distance between the point (71,74) of every line is the twice of selected distance in the step a) (d1 ') basically.

9. according to claim 7 or 8 described methods, it is characterized in that, be provided with at the turning of bottom section additional point (72) (S21, S22).

10. method according to claim 9 is characterized in that, additional point (72) is positioned on the bisecting line at turning.

11. according to claim 9 or 10 described methods, it is characterized in that, select annex point (72) from the distance of neighboring edge less than step a) in selected distance (d1 ').

12. according to claim 7 or 11 described methods, it is characterized in that, filling point (75) is set (S23) between two line.

13. according to each described method among the claim 7-12, it is characterized in that, use the tip (30) of supplying with binding agent continuously to come set-point (71,72,74,75).

14. according to each described method among the claim 7-12, it is characterized in that, by alternately to most advanced and sophisticated (37) coating adhesive and make tip (37) and circuit board contact set-point (71,72,74,75) (S22).

15. according to claim 4,5 or 13 described methods, it is characterized in that, coating at least one binding agent p-wire (S3) before step b), the binder amount that is included in this p-wire is judged (S4) by the noncontacting measurement to this p-wire, and pump (28,29) flow and/or when adhesive stripe-coating tip (30, the speed 37) and/or the distance of line (d1, d2 ...) determine (S5) according to the result who judges.

16. according to claim 13 or 14 described methods, it is characterized in that, test point (the S6 of at least one binding agent of coating before step b), S9), the amount that is included in the binding agent in this test point is by (S7, noncontacting measurement S10) judge, and point (71 in the distance of line and/or the line to this test point, 74) distance according to the result who judges determine (S8, S11).

17. an enforcement is according to the device of each described method adhesive stripe-coating on circuit board in the aforementioned claim, comprise manipulator, remain on the free-ended coating of manipulator most advanced and sophisticated (30,37), and be used for control circuit (18) that control coating most advanced and sophisticated (30,37) is moved, this circuit is fit to receive the relevant circuit element (51 that will adhere on the circuit board (6), 54,55,61,73) the position and the data of shape, these data have been determined the edge at least (52,53,59 of circuit element, 60) position, data are received by digital interface, and determine article one line (56,57 according to these data, 62,63) position, and control coating most advanced and sophisticated (30,37) moving along described article one line.

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