CN1808244A - Backlight module - Google Patents
Backlight module Download PDFInfo
- Publication number
- CN1808244A CN1808244A CN 200610006766 CN200610006766A CN1808244A CN 1808244 A CN1808244 A CN 1808244A CN 200610006766 CN200610006766 CN 200610006766 CN 200610006766 A CN200610006766 A CN 200610006766A CN 1808244 A CN1808244 A CN 1808244A
- Authority
- CN
- China
- Prior art keywords
- light emitting
- emitting diode
- backboard
- backlight module
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 8
- 239000007769 metal material Substances 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Abstract
The invention discloses a back light module which comprises a back board, at least one light-emitting diode, a light conducting board, a non-rectangle thermal conducting block and a circuit board. The back board has at lease one edge, the light emitting diode is electronically connected on the circuit board, the light emitting diode has a light emitting axis and is placed on the back board edge with the light emitting axis non-parallel or non-vertical with the back board edge. The non-rectangle thermal conducting block is placed between the back board and the light emitting diode for transferring the thermal power generated by the light emitting diode to the back board.
Description
Technical field
The present invention relates to a kind of backlight module, particularly relate to a kind of backlight module that improves radiating effect.
Background technology
Backlight module (Back light module) is panel of LCD (Liquid crystal displaypanel, LCD panel) one of key part and component, because liquid crystal itself is not luminous, the function of backlight module promptly is well-off brightness and the light source that is evenly distributed, change into the area source of high brightness and homogeneous briliancy by succinct effectively optical mechanism, so that the panel of LCD back light to be provided.Panel of LCD now has been widely used in the electronic product that monitor, mobile computer, digital camera and projector etc. have the growth potentiality, especially with large scales such as mobile computer and LCD monitor panel demand maximum, also therefore grow up also strong day by day for the backlight module demand.
At present the employed light emitting source of backlight module is except the cold cathode fluorescent lamp pipe, during light emitting diode also is applied to gradually among large-sized LCD.See also Fig. 1, Fig. 1 is installed on the structural drawing of a backboard for the light emitting diode of the backlight module 10 of prior art.Traditionally, a plurality of light emitting diodes (light emitting diode) 12 are installed on the periphery of backboard 16, and in receive the driving circuit signal of (figure does not show) by pin 18 after, producing light (arrow A is represented the optical axis direction of light emitting diode 22), light emitting diode 12 can produce heat at the same time.High-power light emitting diode can produce the light of higher briliancy owing to heal, but also can produce higher heat energy, in order to dispel the heat real-time, light emitting diode 12 can be installed on the metallic circuit (metal core PCB) 14, when sending high heat in case light emitting diode 12 produces light, the heat change meeting that produces conducts on the backboard 16 fast via metallic circuit 14, and backboard 16 reaches the purpose of heat radiation via the mode with circulation of air.In order to allow metallic circuit 14 and backboard 16 that preferable radiating effect is arranged, metallic circuit 14 and backboard 16 aluminium commonly used etc. has the metal material of high heat-conduction coefficient and makes.
Yet, progress along with the light emitting diode manufacturing technology, the maximum briliancy of light that light emitting diode produces is also big more, if can reduce the usage quantity of light emitting diode, saving for cost is also benefited to some extent, and higher temperature can reduce the luminescence efficiency of light emitting diode and shorten the life-span of operating.So develop and a kind ofly can use the lesser amt light emitting diode, increase the backlight module that radiating effect reduces operating temperature simultaneously, will be the problem desiring to overcome of manufacturer.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of backlight module, light emitting diode is arranged at the corner of backboard, utilize a heat-conducting block to increase the heat-conducting area of light emitting diode simultaneously, to solve above-mentioned prior art problems.
The invention provides a kind of backlight module, it comprises a backboard, at least one light emitting diode, a light guide plate, a non-rectangle heat-conducting block and a circuit board.This backboard has at least one edge, this light emitting diode is electrically connected on this circuit board, this at least one light emitting diode has a luminous optical axis, and this at least one light emitting diode is that mode not parallel with this luminous optical axis or that be not orthogonal to this back plate edges is arranged at this back plate edges.This non-rectangle heat-conducting block is arranged between this backboard and this light emitting diode, is used for conducting the heat energy of this light emitting diode generation to this backboard.
Among the present invention, be arranged at the heat-conducting block between light emitting diode and the backboard, can increase the sectional area of heat conduction path between light emitting diode and backboard.Especially for the light emitting diode that is arranged at the backboard corner, owing to heat-conducting block directly contacts with the side and the bottom surface of backboard, so the temperature of light emitting diode also can increase because of the contact area of heat-conducting block and backboard and reduce.
Description of drawings
Fig. 1 is installed on the structural drawing of a backboard for the light emitting diode of prior art;
Fig. 2 is the structural drawing of backlight module of the present invention;
Fig. 3 is the local top view of backlight module of the present invention.
The main element symbol description
10 backlight modules, 12 light emitting diodes
14 circuit boards, 16 backboards
18 pins, 20 backlight modules
22 light emitting diodes, 24 circuit boards
26 backboards, 28 pins
32 bottom surfaces, 42,44 contact areas
A, B optical axis
Embodiment
See also Fig. 2 and Fig. 3, Fig. 2 is the structural drawing of backlight module 20 of the present invention, and Fig. 3 is the local top view of backlight module 20 of the present invention.Backlight module 20 comprises a backboard (bezel) 26, and the corner of backboard 26 is provided with light emitting diode (light emitting diode) 22.32 of the bottom surfaces of backboard 26 are used for being provided with the optical element that comprises light guide plate (Light guide plate), diffusion sheet (Diffusion sheet), prismatic lens (Brightness Enhancement Film) or the like, be simplicity of illustration, do not give showing those elements at this.In addition, light emitting diode 22 is arranged on the circuit board 24, and also is provided with a heat-conducting block 30 between circuit board 24 and the backboard 26.Heat-conducting block 30 makes (for example aluminium) with backboard 26 available metals or other material with high heat-conduction coefficient is made.
When the driving circuit (figure does not show) of light emitting diode 22 saw through pin 28 driven for emitting lights diodes 22 generation light, light emitting diode 22 also can produce heat energy simultaneously.The light that produces can be directed to display panels after by the convex-concave surface that has a patterning on the light guide plate, and the heat energy that produces passes circuit board 24 and can conduct to backboard 26 via heat-conducting block 30.The zone 42,44 that the contact area of backboard 26 and heat-conducting block 30 is indicated, also comprise the bottom surface 32 of backboard 26 and the contact area of heat-conducting block 30 on Fig. 3, so utilize heat-conducting block 30 will make light emitting diode 22 increase via the heat dissipation region of backboard 26.At last just can be with heat energy by backboard 26 dissipations via the convection current of air.
In preferred embodiment, circuit board 24 is a flexible circuit board (flexible print circuit board).Thus, flexible circuit board can be laid on it along with the shape of backboard 26.
Non-rectangle heat-conducting block 30 is preferably a solid heat-conducting block, and its material for example can use that the good material of heat transfer efficiency such as metal forms.In order to ensure radiating effect, non-rectangle heat-conducting block 30 is preferably and backboard 26 driving fits configuration, the gap of as far as possible reducing non-rectangle heat-conducting block 30 and backboard 26.Macromolecular material combination in addition that can a high thermal conductivity coefficient between heat-conducting block 30, circuit board 24 and the backboard 26 is used for eliminating the air layer of 26 of heat-conducting block 30, circuit board 24 and backboards, to keep preferable heat-conducting effect.
Backlight module of the present invention can be applicable to in the LCD of light emitting diode as light source.
Be compared to prior art, light-emitting diodes piping of the present invention is arranged at the edge of backboard, and its placing direction is not parallel or is not orthogonal to the edge of this backboard.In addition, a heat-conducting block is set between light emitting diode and backboard, so that increase the heat transfer area between light emitting diode and backboard.For the light emitting diode that is arranged at the backboard corner, because heat-conducting block directly contacts with the side and the bottom surface of backboard, so the radiating effect of light emitting diode also can and improve and then reduction operating temperature because of the contact area increase of heat-conducting block and backboard.
Though the present invention explains with several embodiment as above, its technology contents also can have different variation designs according to the actual design demand not as limit.Again.In the utilization of reality, the quantity of light emitting diode can be decided according to the actual design demand, and it can or a plurality ofly be arranged at not parallel or be not orthogonal to the light emitting diode of back plate edges for two.
Though the present invention explains with embodiment as above, its technology contents also can have different variation designs according to the actual design demand not as limit.For example, in the utilization of reality, the material of backboard and circuit board also can select for use other to have the material of high heat-conduction coefficient except metal material; On practice, change the material of these backboards and circuit board according to design requirement.
Though disclosed the present invention in conjunction with above preferred embodiment; yet it is not in order to limit the present invention; anyly be familiar with this operator; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention should be with appended being as the criterion that claim was defined.
Claims (8)
1. backlight module comprises:
One backboard has at least one edge;
One circuit board;
At least one light emitting diode is electrically connected on this circuit board, and this at least one light emitting diode has a luminous optical axis, and this at least one light emitting diode is that mode not parallel with this luminous optical axis or that be not orthogonal to this back plate edges is arranged at this back plate edges; And
One non-rectangle heat-conducting block is arranged between this backboard and this light emitting diode.
2. backlight module as claimed in claim 1, wherein this backboard is a metal material.
3. backlight module as claimed in claim 1, wherein this circuit board is a flexible circuit board (flexibleprint circuit board).
4. backlight module as claimed in claim 1, wherein this heat-conducting block is a metal material.
5. backlight module as claimed in claim 1 wherein is the macromolecular material combination in addition with a high thermal conductivity coefficient between this heat-conducting block, this circuit board and this backboard.
6. backlight module as claimed in claim 1, wherein this heat-conducting block driving fit is in this backboard.
7. backlight module as claimed in claim 1, wherein this backlight module is used for a LCD.
8. backlight module as claimed in claim 1, wherein this light guide plate has the convex-concave surface of a patterning at least.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100067666A CN100399161C (en) | 2006-02-08 | 2006-02-08 | Backlight module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100067666A CN100399161C (en) | 2006-02-08 | 2006-02-08 | Backlight module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1808244A true CN1808244A (en) | 2006-07-26 |
| CN100399161C CN100399161C (en) | 2008-07-02 |
Family
ID=36840219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100067666A Expired - Fee Related CN100399161C (en) | 2006-02-08 | 2006-02-08 | Backlight module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100399161C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101290429B (en) * | 2007-04-19 | 2011-12-28 | 奇美电子股份有限公司 | LCD device and its backlight module group |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101761834B (en) * | 2010-01-18 | 2011-08-03 | 友达光电（苏州）有限公司 | Backlight module and display device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10104594A (en) * | 1996-09-27 | 1998-04-24 | Hitachi Cable Ltd | Liquid crystal display panel |
| JP2004047294A (en) * | 2002-07-12 | 2004-02-12 | Canon Inc | Backlight device and display device |
| CN1254708C (en) * | 2002-11-13 | 2006-05-03 | 友达光电股份有限公司 | Liquid crystal display |
| US6966674B2 (en) * | 2004-02-17 | 2005-11-22 | Au Optronics Corp. | Backlight module and heat dissipation structure thereof |
| CN100352072C (en) * | 2005-03-02 | 2007-11-28 | 友达光电股份有限公司 | Light emitting diode light source module |
| CN100388079C (en) * | 2005-06-28 | 2008-05-14 | 友达光电股份有限公司 | Backlight module |
-
2006
- 2006-02-08 CN CNB2006100067666A patent/CN100399161C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101290429B (en) * | 2007-04-19 | 2011-12-28 | 奇美电子股份有限公司 | LCD device and its backlight module group |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100399161C (en) | 2008-07-02 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080702 |