CN1796130A - Fluid jet device and manufacturing method - Google Patents
Fluid jet device and manufacturing method Download PDFInfo
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- CN1796130A CN1796130A CN 200410081981 CN200410081981A CN1796130A CN 1796130 A CN1796130 A CN 1796130A CN 200410081981 CN200410081981 CN 200410081981 CN 200410081981 A CN200410081981 A CN 200410081981A CN 1796130 A CN1796130 A CN 1796130A
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- ejection apparatus
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Abstract
The present invention provides a fluid jetting equipment, including; a base; a fluid cavity formed in said base; a structure layer for covering said base and said fluid cavity; at least a jet orifice which is passed through said structure layer and communicated with said fluid cavity; an opening which is passed through said structure layer and communicated with tail end of said fluid cavity, and a pressure-releasing hole formed in the communicated placed of said structure layer and said fluid cavity. Besides, said invention also provides a method for making said fluid jetting equipment.
Description
Technical field
The present invention relates to a kind of fluid ejection apparatus, the fluid ejection apparatus and the manufacture method thereof of remaining bubble in particularly a kind of removable fluid cavity.
Background technology
In the application of various inkjet printings, the raising of print quality is the common target of pursuing of all users and producer always, and it is a lot of influence the factor of print quality, and wherein the stability with the injection ink droplet is a considerable ring.
With hot ink-jet printer is example, the bubble squeezeout ink that mainly utilizes stratie and produced, ink is ejected on the programmed recording medium from spray orifice, to finish the ink-jet program, so accumulation whether remaining bubble is arranged in bubble size that is produced in the process and the fluid cavity etc. just becomes the key factor that influences the ink-jet stability.
The basic structure and the ink-jet program thereof of relevant heated type fluid ejection apparatus are as described below in the prior art, with United States Patent (USP) the 6th, 102, see also Fig. 1 for example explains No. 530, and fluid ejection apparatus 10 comprises a substrate 12; One manifold 14, it is formed in the substrate 12 by interior etching, as the usefulness of supply ink; One fluid cavity 16, it is formed in the substrate 12 with anisotropic etching after removing sacrifice layer and is communicated with space as storage ink with manifold 14; One structure sheaf 18, it is covered in fluid cavity 16 and the substrate 12; Heating element heater 20, it is arranged on the structure sheaf 18, sprays with drive fluid; One protective layer 22, it is covered on heating element heater 20 and the structure sheaf 18; And a spray orifice 24, it passes protective layer 22 and structure sheaf 18 and is communicated with fluid cavity 16, to spray fluid.
The ink jet process of subsequent explanation device 10, as shown in Figure 2, at first, produce high heat by heating element heater 20 received signals that are positioned at fluid cavity 16 tops, make the ink instant vaporization form two bubbles 26 and 28, afterwards, because of generating the volume prolonged expansion of bubble 26 and 28, so squeezeout ink makes ink via spray orifice 24 ejection and form ink droplet 30, under a perfect condition, two bubbles 26 are all identical with 28 generating rate and size, squeeze force to ink is also consistent, so after ink droplet 30 leaves spray orifice 24, can or not cause the crooked phenomenon of ink droplet to be vertical angle ejaculation with chip surface.
Yet, actual operational scenario also can't be as perfect condition, see also the explanation of Fig. 3 A and Fig. 3 B, as shown in Figure 3A, because the geometrical configuration that fluid cavity terminal 34 is special, make ink in the process of filling fluid cavity 32, can't be filled up to fluid cavity end 34 smoothly, and produce so-called remaining bubble 36, this remaining bubble 36 is not if is got rid of the generation that will have a strong impact on two bubbles, causes generation shape two bubbles 38 inequality and 40, and then ink is bestowed in various degree squeeze force, cause ink droplet 42 at last with non-directional orientation ejection spray orifice 44, shown in Fig. 3 B.
Because print quality is whether good, the accuracy that depends on ink droplet drop point on paper, if ink droplet leaves the speed and the direction of injection apparatus 3 and can't fix, then ink droplet is in flight course, will be owing to the difference of initial velocity and ejection angle [alpha], the flying distance of every ink droplet is not quite similar (as 1 or 1 '), produce the indefinite side-play amount d of a distance when arriving at paper 2 and cause, have a strong impact on print quality, as shown in Figure 4, and above-mentioned to cause the biggest factor of ink-jet skew promptly be the remaining bubble of accumulation in the fluid cavity.
Therefore, develop and a kind ofly eliminate remaining bubble to stablize the ink-jet method for quality be necessary to reach.
Summary of the invention
Therefore, the purpose of this invention is to provide a kind of fluid ejection apparatus, expectation reaches the purpose of eliminating remaining bubble by the design of fluid cavity relief hole and honeycomb duct, stablizes the ink-jet quality.
In order to achieve the above object, the invention provides a kind of fluid ejection apparatus, comprising: a substrate; One fluid cavity is formed in this substrate; One structure sheaf is covered on this substrate and this fluid cavity; At least one spray orifice passes this structure sheaf and is communicated with this fluid cavity; With an opening, pass this structure sheaf and be communicated with, and both connections place constitute a relief hole with this fluid cavity is terminal.
According to an example of the present invention, at fluid cavity tip designs one relief hole, make that when the time though can produce remaining bubble in the process, these remaining bubbles are able to discharge from the relief hole that is arranged on the fluid cavity end immediately at the filling fluid, the possibility of having avoided follow-up pair of bubble of remaining aeration to generate, and because relief hole less than spray orifice, causes the flow resistance at this place bigger, in ink jet process, ink droplet will can not spray from relief hole, stay unnecessary assorted point on paper.
The present invention also provides a kind of fluid ejection apparatus, comprising: a substrate; One fluid cavity is formed in this substrate, and at least one side in this fluid cavity is formed with a honeycomb duct; And a structure sheaf, be covered on this substrate and this fluid cavity, and have a water conservancy diversion projection and stretch in this fluid cavity, to separate this honeycomb duct and this fluid cavity.
According to another example of the present invention, make honeycomb duct in fluid cavity, these honeycomb ducts can quicken the speed of ink incoming fluid chamber end, make the not stub area of simple filler of the interior script of part ink elder generation filling fluid cavity, reduce the purpose that remaining bubble generates to reach, improve print quality.
The present invention also provides a kind of manufacture method of fluid ejection apparatus, comprises the following steps: to provide a substrate; Form a sacrificial patterned in this substrate, this sacrificial patterned is as a predetermined zone that forms first-class body cavity; Form a pattern structure layer in this substrate and cover this sacrificial patterned; Form a manifold and pass this substrate, and expose this sacrificial patterned; Remove this sacrifice layer, to finish the making of this fluid cavity; And this structure sheaf of etching, to form an at least one spray orifice that is communicated with this fluid cavity and an opening, wherein this opening passes this structure sheaf and is communicated with this fluid cavity is terminal, and both connections place constitute a relief hole.
The present invention also provides a kind of manufacture method of fluid ejection apparatus, comprises the following steps: to provide a substrate; Form a sacrificial patterned in this substrate, this sacrificial patterned is as a predetermined zone that forms first-class body cavity, and wherein a side of this sacrificial patterned comprises a groove at least; Form a pattern structure layer on this sacrificial patterned and insert above-mentioned groove and form a water conservancy diversion projection; Form a manifold and pass this substrate, and expose this sacrificial patterned; Remove this sacrifice layer,, wherein constitute a honeycomb duct between the sidewall of this water conservancy diversion projection and this fluid cavity to form a fluid cavity with this water conservancy diversion projection; And this structure sheaf of etching, to form at least one spray orifice that is communicated with this fluid cavity.
Description of drawings
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. are described in detail below:
Fig. 1 is the generalized section of prior art fluid ejection apparatus.
Fig. 2 is the ink-jet schematic diagram of fluid ejection apparatus under the perfect condition.
Schematic diagram when Fig. 3 A is fluid ejection apparatus filling fluid.
Fig. 3 B is fluid ejection apparatus sprays fluid when remaining bubble exists a schematic diagram.
Fig. 4 is the comparison diagram of different drop drop points.
Fig. 5 A is the top view according to the fluid ejection apparatus of the first embodiment of the present invention.
Fig. 5 B is the generalized section according to the manufacturing process of fluid ejection apparatus before not forming fluid cavity of the first embodiment of the present invention.
Fig. 5 C is the generalized section of the manufacturing process of fluid ejection apparatus before not forming relief hole and opening of the first embodiment of the present invention.
Fig. 5 D is along the generalized section of 5D-5D intercepting among Fig. 5 A and the generalized section of the manufacturing process after forming relief hole and opening according to the fluid ejection apparatus of the first embodiment of the present invention.
Fig. 6 is the top view of the fluid ejection apparatus of the second embodiment of the present invention.
The top view of the fluid ejection apparatus of Fig. 7 A a third embodiment in accordance with the invention.
Fig. 7 B is the generalized section of the manufacturing process of fluid ejection apparatus before not forming honeycomb duct and fluid cavity of a third embodiment in accordance with the invention.
Fig. 7 C is the generalized section of the manufacturing process of fluid ejection apparatus before not forming spray orifice of a third embodiment in accordance with the invention.
The fluid ejection apparatus of Fig. 7 D a third embodiment in accordance with the invention is along the generalized section of 7D-7D intercepting among Fig. 7 A and the generalized section of the manufacturing process behind formation honeycomb duct, fluid cavity and the spray orifice.
Description of reference numerals
The prior art part (Fig. 1～Fig. 4)
1,1 '～flying distance;
2～paper;
3～injection apparatus;
10～fluid ejection apparatus;
12～substrate;
14～manifold;
16,32～fluid cavity;
18～structure sheaf;
20～stratie;
22～protective layer;
24,44～spray orifice;
26,28,38,40～bubble;
30,42～drop;
34～fluid cavity end;
36～remaining bubble;
α～spray angle;
D～drop side-play amount.
Embodiment of the invention part (Fig. 5 A～Fig. 5 D, Fig. 6 and Fig. 7 A～7D)
50,80～substrate;
52～manifold;
55～sacrifice layer;
54,82～fluid cavity;
56,86,86 '～structure sheaf;
58～stratie;
60,88～protective layer;
62,90～spray orifice;
64～relief hole;
66～opening;
68～fluid cavity end;
81～sacrifice layer;
81 '～groove;
84～honeycomb duct.
The specific embodiment
See also Fig. 5 A and Fig. 5 D, the architectural feature of present embodiment fluid ejection apparatus is described.Wherein Fig. 5 D is the profile of Fig. 5 A figure along the 5D-5D intercepting.Shown in Fig. 5 D, this fluid ejection apparatus is formed with an opening 66 in the end 68 of fluid cavity 54, and opening 66 passes structure sheaf 56 and is communicated with fluid cavity end 68 by relief hole 64, and wherein the equivalent redius of relief hole 64 is less than spray orifice 62.Subsequent shown in Fig. 5 A, in the present embodiment, because the silicon substrate (the present invention be not limited to this) of lattice arrangement direction for [110] selected in substrate for use, so the fluid cavity end after the etching presents a pyramid, opening 66 is a rectangle, and relief hole 64 is a triangle.
Subsequent Fig. 5 D that sees also; the detailed formation of present embodiment fluid ejection apparatus is described, this fluid ejection apparatus comprises a substrate 50, a manifold 52, a fluid cavity 54, a structure sheaf 56, a stratie 58, a protective layer 60, a spray orifice 62, a relief hole 64 and an opening 66.
The present invention utilizes pressure balance principle, other wards off an air and gets rid of the path, promptly 68 create the relief hole 64 be connected with ambient atmosphere in the fluid cavity end, to get rid of the remaining bubble in the fluid cavity 54, on the other hand, the equivalent redius of relief hole 64 must be less than spray orifice 62, make ink in the flow resistance of relief hole 64 greater than spray orifice 62, so could limit ink droplet is to be sprayed by spray orifice 62, and can not spray from relief hole 64, to avoid the assorted point unnecessary in the print procedure or the situation of ink leak.
Below with equation (1) relation of flow resistance and relief hole is described.Δ P wherein, for the pressure of ink falls, μ is the coefficient of viscosity of ink, and r is the radius of relief hole, and L is the length of relief hole, and Q is the volume flow rate of ink, R
Flow, be flow resistance.
ΔP＝(8μL/πr
4)Q＝R
flowQ (1)
By aforesaid equation as can be known, down fixing in volume flow rate (Q), (r) is littler for the radius of relief hole, the flow resistance (R that is then produced
Flow) bigger, therefore, relief hole 64 of the present invention is little design than spray orifice 62, promptly is for limit ink flows toward relief hole 64 directions, prevents that ink droplet is by relief hole 64 ejections.
The subsequent Fig. 5 B～Fig. 5 D that sees also, the making of present embodiment fluid ejection apparatus is described, shown in Fig. 5 B, at first, one substrate 50 is provided, for example a lattice arrangement direction is the silicon base of [110], the thickness of substrate 50 is substantially between 625～675 microns, then, form a sacrificial patterned 55 in substrate 50, as a predetermined zone that forms first-class body cavity, sacrifice layer for example is made of boron-phosphorosilicate glass (BPSG), phosphorosilicate glass (PSG) or silica material, wherein be preferred the selection with the phosphorosilicate glass, the thickness of sacrifice layer is substantially between 1～2 micron.
Subsequent formation one pattern structure layer 56 is in substrate 50 and the overlay pattern sacrifice layer, structure sheaf 56 can be for by the formed silicon oxynitride layer of chemical vapour deposition technique (CVD), the thickness of structure sheaf 56 is approximately 1.5～2 microns, then, form one as the stratie 58 of drive fluid on structure sheaf 56 and be located at the both sides that form the spray orifice position in the future, stratie 58 is for example by HfB
2, TaAl, TaN or TiN constitute, and wherein with TaAl is preferred the selection, and be last, forms a protective layer 60 on structure sheaf 56.
Next, see also Fig. 5 C, begin to carry out a series of etching process, to form final fluid ejection apparatus, at first, with etching solution for example is the back side of the anisotropy wet etch method etching substrate 50 of potassium hydroxide (KOH) solution, to form a manifold 52, and expose sacrificial patterned, and the narrow opening width of manifold 52 is approximately 160～200 microns, and wide A/F is approximately 1100～1200 microns, its inwall and horizontal line angle are approximately 54.74 degree, so the manifold 52 after the etching is a low wide and up narrow shape and structure, in addition, manifold 52 is interconnected with a fluid accumulator tank downwards.
Subsequent wet etch method etched pattern sacrifice layer with hydrofluoric acid containing (HF) solution; afterwards; for example be the wet etch method etching substrate 50 of potassium hydroxide (KOH) solution once again with etching solution; to enlarge the zone that sacrificial patterned is emptied; and formation fluid cavity 54; the silicon substrate of lattice arrangement direction for [110] selected in the substrate 50 of present embodiment for use; fluid cavity end after the etching can present a pyramid; at last; see also Fig. 5 D; etch protection layer 60 and structure sheaf 56 in regular turn are to form at least one spray orifice 62 that is communicated with fluid cavity 54.
And committed step of the present invention, promptly be when etching forms spray orifice 62 also the structure sheaf 56 above convection current body cavity 54 ends 68 carry out etching, be positioned at a relief hole 64 and an opening 66 that passes structure sheaf 56 of fluid cavity end 68 with formation, form a path of getting rid of remaining bubble in the fluid cavity, shown in Fig. 5 D, the triangle of the shape of relief hole 64 shown in Fig. 5 A, the equivalent redius of relief hole 64 is less than spray orifice 62, be approximately 2～30 microns, be preferably 4～15 microns, etching process can utilize plasma etching, the chemical gas etching, reactive ion etching or laser-induced thermal etching method, select and be preferred with the reactive ion etching, so far, promptly finish the making of a fluid injection apparatus.
See also the architectural feature of Fig. 6 and Fig. 5 D explanation present embodiment fluid ejection apparatus, wherein Fig. 5 D is the profile of Fig. 6 along the 5D-5D intercepting, shown in Fig. 5 D, this fluid ejection apparatus is formed with an opening 66 in the end 68 of fluid cavity 54, opening 66 passes structure sheaf 56 and is communicated with fluid cavity end 68 by relief hole 64, wherein the equivalent redius of relief hole 64 is less than spray orifice 62, as shown in Figure 6 subsequent, because the silicon substrate of lattice arrangement direction for [100] selected in the substrate 50 of present embodiment for use, so the fluid cavity end after the etching presents a rectangle, opening 66 is a pyramid, and relief hole 64 is a triangle, the difference of present embodiment and embodiment 1 is that embodiment 1 selects the silicon base of lattice arrangement direction for [110] for use, and present embodiment then is to select the silicon base of lattice arrangement direction for [100] for use.
The structural design of present embodiment fluid ejection apparatus and manufacturing step are identical substantially with embodiment 1, only can cause the shape of etching fluid cavity end different because of the silicon base (for example [110] or [100]) of selecting for use different crystalline lattice to arrange, embodiment 1 presents pyramid, and present embodiment forms rectangle.
See also the architectural feature of Fig. 7 A and Fig. 7 D explanation present embodiment fluid ejection apparatus, wherein Fig. 7 D is the profile of Fig. 7 A along the 7D-7D intercepting, shown in Fig. 7 D, at least one side of this fluid ejection apparatus in fluid cavity 82 spaces is formed with a honeycomb duct 84, honeycomb duct 84 separates formation by water conservancy diversion projections 86 ' that stretch in the fluid cavity 82 with fluid cavitys 82, and wherein the width of honeycomb duct 84 is less than half of fluid cavity 82 width.
Subsequent Fig. 7 D that sees also illustrates the detailed formation of present embodiment fluid ejection apparatus, and this fluid ejection apparatus comprises a substrate 80, a fluid cavity 82, honeycomb duct 84, a structure sheaf 86, water conservancy diversion projection 86 ', a protective layer 88 and a spray orifice 90.
The present invention is produced on honeycomb duct 84 in the fluid cavity 82 according to capillary (capillary) principle, honeycomb duct 84 can quicken the speed of ink incoming fluid chamber end, make the not stub area of simple filler of part ink elder generation filling fluid cavity 82 interior scripts, reduce the purpose that remaining bubble generates to reach, improve print quality.
Above-mentioned capillary principle can explain by equation (2), and wherein Δ P is the driving pressure of ink, and σ is the surface tension of liquid, and r is the equivalent redius of runner, and α is the angle between fluid cavity and ink.
ΔP＝(2σ/r)cos(α) (2)
By aforesaid equation as can be known, the equivalent redius (r) of honeycomb duct 84 must be less than half of fluid cavity 82 width in the fluid cavity, make ink in the driving force (σ) of honeycomb duct 84 greater than fluid cavity 82, so, ink could be inserted the end of fluid cavity 82 via honeycomb duct 84 in advance, reduces the generation of remaining bubble.
The subsequent Fig. 7 B～Fig. 7 D that sees also, the making of present embodiment fluid ejection apparatus is described, shown in Fig. 7 B, provide a substrate 80, for example a silicon base, the thickness of substrate 80 is approximately 625～675 microns, then, the sacrificial patterned 81 that formation comprises a pair of groove 81 ' is in this substrate 80, and sacrifice layer can be made of boron-phosphorosilicate glass (BPSG), phosphorosilicate glass (PSG) or silica material, wherein be preferred the selection with the phosphorosilicate glass, the thickness of sacrifice layer is approximately 1～2 micron.
Subsequent formation one pattern structure layer 86 is on sacrificial patterned 81 and insert groove 81 ' and form a pair of water conservancy diversion projection 86 '; structure sheaf 86 can be for by the formed silicon oxynitride layer of chemical vapour deposition technique (CVD); the thickness of structure sheaf 86 is approximately 1.5～2 microns; at last, form a protective layer 88 on structure sheaf 86.
Next; see also Fig. 7 C; wet etch method etched pattern sacrifice layer 81 with hydrofluoric acid containing (HF) solution; afterwards; for example be the wet etch method etching substrate 80 of potassium hydroxide (KOH) solution once again with etching solution; to enlarge the zone that sacrificial patterned 81 is emptied; and form a fluid cavity 82 with water conservancy diversion projection 86 '; wherein constitute honeycomb duct 84 between the sidewall of water conservancy diversion projection 86 ' and fluid cavity 82; present embodiment forms honeycomb duct 84 respectively at the both sides of fluid cavity 82; but the present invention is not limited to this; can make the part ink be fills up to the stub area of fluid cavity earlier equally as long as form a honeycomb duct at least one side of fluid cavity; reach and reduce the effect that remaining bubble generates; the shape of water conservancy diversion projection 86 ' comprises rectangle or zigzag; width is approximately 1～3 micron; and the width of honeycomb duct 84 is less than half of the width of fluid cavity; its equivalent redius is approximately 2～35 microns; at last; see also Fig. 7 D; etch protection layer 88 and structure sheaf 86 in regular turn; to form a spray orifice 90 that is communicated with fluid cavity 82 at least; etching process can utilize plasma etching; the chemical gas etching; reactive ion etching or laser-induced thermal etching method; select and be preferred with the reactive ion etching; so far, promptly finish the making of a fluid injection apparatus.
The present invention already with preferred embodiment openly as above; yet; it is not in order to limit the present invention; those skilled in the art; under the premise without departing from the spirit and scope of the present invention; certainly can do to change and retouching, so protection scope of the present invention should be as the criterion with the scope that appending claims was defined.
Claims (21)
1. fluid ejection apparatus comprises:
One substrate;
One fluid cavity is formed in the described substrate;
One structure sheaf is covered on described substrate and the described fluid cavity;
At least one spray orifice passes described structure sheaf and is communicated with described fluid cavity; And
One opening passes described structure sheaf and is communicated with described fluid cavity is terminal, and both connections place constitute a relief hole.
2. fluid ejection apparatus as claimed in claim 1, the terminal shape with described opening of wherein said fluid cavity comprises pyramid and rectangle, and the shape of described relief hole comprises triangle.
3. fluid ejection apparatus as claimed in claim 1, the equivalent redius of wherein said relief hole is less than described spray orifice.
4. fluid ejection apparatus as claimed in claim 1, the equivalent redius of wherein said relief hole are approximately 2～30 microns.
5. fluid ejection apparatus comprises:
One substrate;
One fluid cavity is formed in the described substrate, and at least one side in the described fluid cavity is formed with a honeycomb duct; And
One structure sheaf is covered on described substrate and the described fluid cavity, and has a water conservancy diversion projection and stretch in the described fluid cavity, to separate described honeycomb duct and described fluid cavity.
6. fluid ejection apparatus as claimed in claim 5, the both sides that wherein also are included in the described fluid cavity are formed with honeycomb duct.
7. fluid ejection apparatus as claimed in claim 5, the shape of wherein said water conservancy diversion projection comprises rectangle or zigzag.
8. fluid ejection apparatus as claimed in claim 5, the width of wherein said water conservancy diversion projection are approximately 1～3 micron.
9. fluid ejection apparatus as claimed in claim 5, the width of wherein said honeycomb duct is less than half of the width of described fluid cavity.
10. fluid ejection apparatus as claimed in claim 5, the equivalent redius of wherein said honeycomb duct are approximately 2～35 microns.
11. the manufacture method of a fluid ejection apparatus comprises the following steps:
One substrate is provided;
Form a sacrificial patterned in described substrate, described sacrificial patterned is as a predetermined zone that forms first-class body cavity;
Form a pattern structure layer in described substrate and cover described sacrificial patterned;
Form a manifold and pass described substrate, and expose described sacrificial patterned;
Remove described sacrifice layer, to finish the making of described fluid cavity; And
The described structure sheaf of etching, to form a spray orifice and the opening that at least one and described fluid cavity is communicated with, wherein said opening passes described structure sheaf and is communicated with described fluid cavity is terminal, and both connections place constitute a relief hole.
12. the manufacture method of fluid ejection apparatus as claimed in claim 11, the terminal shape with this described opening of wherein said fluid cavity comprises pyramid or rectangle, and the shape of described relief hole comprises triangle.
13. the manufacture method of fluid ejection apparatus as claimed in claim 11, wherein said structure sheaf comprise silica, silicon nitride or its combination.
14. the manufacture method of fluid ejection apparatus as claimed in claim 11, the equivalent redius of wherein said relief hole is less than described spray orifice.
15. the manufacture method of fluid ejection apparatus as claimed in claim 11, the equivalent redius of wherein said relief hole are approximately 2～30 microns.
16. the manufacture method of a fluid ejection apparatus comprises the following steps:
One substrate is provided;
Form a sacrificial patterned in described substrate, described sacrificial patterned is as a predetermined zone that forms first-class body cavity, and a side of wherein said sacrificial patterned comprises a groove at least;
Form a pattern structure layer on described sacrificial patterned and insert described groove and form a water conservancy diversion projection;
Form a manifold and pass described substrate, and expose described sacrificial patterned;
Remove described sacrifice layer, have a fluid cavity of described water conservancy diversion projection, constitute a honeycomb duct between the sidewall of wherein said water conservancy diversion projection and described fluid cavity with formation; And
The described structure sheaf of etching is to form the spray orifice that at least one and described fluid cavity is communicated with.
17. the manufacture method of fluid ejection apparatus as claimed in claim 16, wherein said sacrificial patterned comprises a pair of groove, and described structure sheaf is inserted described this groove is formed a pair of water conservancy diversion projection in described fluid cavity both sides.
18. the manufacture method of fluid ejection apparatus as claimed in claim 16, the shape of wherein said water conservancy diversion projection comprises rectangle or zigzag.
19. the manufacture method of fluid ejection apparatus as claimed in claim 16, the width of wherein said water conservancy diversion projection are approximately 1～3 micron.
20. the manufacture method of fluid ejection apparatus as claimed in claim 16, the width of wherein said honeycomb duct is less than half of the width of described fluid cavity.
21. the manufacture method of fluid ejection apparatus as claimed in claim 16, the equivalent redius of wherein said honeycomb duct are approximately 2～35 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410081981 CN1796130A (en) | 2004-12-29 | 2004-12-29 | Fluid jet device and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410081981 CN1796130A (en) | 2004-12-29 | 2004-12-29 | Fluid jet device and manufacturing method |
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| CN1796130A true CN1796130A (en) | 2006-07-05 |
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|---|---|---|---|
| CN 200410081981 Pending CN1796130A (en) | 2004-12-29 | 2004-12-29 | Fluid jet device and manufacturing method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104126152A (en) * | 2011-12-22 | 2014-10-29 | 斯沃奇集团研究和开发有限公司 | Method for producing component |
| CN105408117A (en) * | 2013-06-28 | 2016-03-16 | 惠普发展公司，有限责任合伙企业 | Printhead structure |
| CN112009101A (en) * | 2020-08-05 | 2020-12-01 | Tcl华星光电技术有限公司 | Print head and ink jet printing apparatus |
-
2004
- 2004-12-29 CN CN 200410081981 patent/CN1796130A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104126152A (en) * | 2011-12-22 | 2014-10-29 | 斯沃奇集团研究和开发有限公司 | Method for producing component |
| CN105408117A (en) * | 2013-06-28 | 2016-03-16 | 惠普发展公司，有限责任合伙企业 | Printhead structure |
| CN112009101A (en) * | 2020-08-05 | 2020-12-01 | Tcl华星光电技术有限公司 | Print head and ink jet printing apparatus |
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