CN1796127A - Fluid jet device possessing sensor and menufacturing method - Google Patents
Fluid jet device possessing sensor and menufacturing method Download PDFInfo
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- CN1796127A CN1796127A CN 200410081965 CN200410081965A CN1796127A CN 1796127 A CN1796127 A CN 1796127A CN 200410081965 CN200410081965 CN 200410081965 CN 200410081965 A CN200410081965 A CN 200410081965A CN 1796127 A CN1796127 A CN 1796127A
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Abstract
The present invention provides a fluid jetting equipment with sensor and its manufacture method. Said fluid jetting equipment includes a base; a structure layer placed on said base, between said structure layer and said base a fluid cavity is formed; at least a bubble generation device placed on the opposite side of said fluid cavity on the structure layer; at least a linear resistance sensor connected with the above-mentioned fluid cavity; a protective layer for covering said bubble generation device and said linear resistance sensor; and a jet orifice which is close to said bubble generation device, and its passed through said protecting layer and said structure layer and communicated with said fluid cavity.
Description
Technical field
The present invention relates to a kind of fluid ejection apparatus and manufacture method thereof, particularly a kind of fluid ejection apparatus and manufacture method thereof with sensor (sensor) by sensor, makes in manufacture process the formation of monitoring flow body cavity in real time.
Background technology
Micro-fluid ejecting device applies to information industry recently widely, for example in ink-jet printer or the similar devices.Progressively exploitation along with micro-system engineering (micro system engineering), this kind fluid ejection apparatus is used and other various fields gradually, for example fuel injection system (fuel injectionsystem), cell screening (cell sorting), drug delivery system (drug delivery system), spray printing photoetching technique (print lithography) and micro-injection propulsion system (micro jet propulsion system) etc.In aforementioned each application, comparatively successful a kind of design uses heat to drive bubble (thermaldriven bubble) mode to spray little drop.Because its simplicity of design and with low cost is therefore also general in the use.
Fig. 1 shows the fluid ejection apparatus 1 of only petrochemical industry of No. the 6th, 102,530, a kind of United States Patent (USP) of the prior art, its with a silicon base 10 as body, and on silicon base l0, form a structure sheaf 12, and between silicon base 10 and structure sheaf 12, form a fluid cavity 14, in order to hold fluid 26; And on structure sheaf 12, be provided with a primary heater 20 and a secondary heater 22, primary heater 20 is in order to produce one first bubble 30 in fluid cavity 14, secondary heater 22 is in order to produce one second bubble 32, so that the fluid in the fluid cavity 14 26 is penetrated in fluid cavity 14.
Because solely the fluid ejection apparatus 1 of petrochemical industry has the design of virtual air valve (virtual valve), and have a characteristic of high arranging density, low interactive interference, loss low in calories, and need not utilize assembling mode to engage spray nozzle sheet in addition, therefore can reduce production costs.
Yet in the fluid ejection apparatus 1 of only petrochemical industry of prior art, structure sheaf 12 mainly is made up of the silicon nitride of low stress.In manufacture process, its thickness has direct influence for the life-span of fluid ejection apparatus.In addition, the designer of fluid ejection device, the fluid jeting effect that fluid ejection apparatus showed and is all the emphasis that it is paid close attention to service life.Therefore, can the etching process when forming fluid cavity accurately be controlled will crucially influence the accurate of fluid cavity size, and also the performance of convection cell injection character has very big influence.
In addition, if the device that sprays at the thermal drive fluid the fluid lack of fill in the fluid cavity, except that microfluid drop size that influence spray inhomogeneity, also may cause " the sky burning effect " of heater and causes heater to damage too early.
Traditionally, for the control of etching process, prior art is utilized control sheet (control wafer) monitoring etching result more, as the benchmark of etching progress rate.This kind method must be in etching process parameters, for example: etchant concentration, temperature ... wait all to be under the accurate control, can effectively compare.Except that formality needed is complicated, also need increases cost and pay (for example controlling the sheet cost), and can't predict its result in real time.On the other hand, the detection mode that convection cell is filled, then variations that utilize fluid ejection apparatus internal heater resistance value as foundation more, but the method can cause directly influence to heater in testing process, so accuracy also falls under suspicion.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of fluid ejection apparatus, by sensor element, make in manufacture process the formation of monitoring flow body cavity in real time, and accurately control the fluid cavity size with sensor.
Another object of the present invention is to provide a kind of fluid ejection apparatus, by sensor element, make and to monitor in real time the height that liquid is filled in the spray orifice, to improve the accuracy of liquid droplets with sensor.
A further object of the present invention is to provide a kind of manufacture method of fluid ejection apparatus, and by sensor element, making can the formation of monitoring flow body cavity in real time in manufacture process, and accurately controls the fluid cavity size.
According to above-mentioned purpose, the invention provides a kind of fluid ejection apparatus with sensor, comprising: a substrate; One structure sheaf is arranged in the substrate, and and substrate between form a fluid cavity; At least one air Bubble generating apparatus is arranged at the respective side of fluid cavity on the structure sheaf; At least one wire electric resistance sensor is connected with fluid cavity; One protective layer covers air Bubble generating apparatus and wire electric resistance sensor; And a spray orifice, contiguous bubble generator and pierce through the protection layer and structure sheaf, and be communicated with fluid cavity.
According to above-mentioned purpose, the present invention also provides a kind of fluid ejection apparatus with sensor, comprising: a substrate; One structure sheaf is arranged in the substrate, and and substrate between form a fluid cavity; At least one air Bubble generating apparatus is arranged at the respective side of fluid cavity on the structure sheaf; One protective layer covers air Bubble generating apparatus; And a spray orifice, contiguous bubble generator and pierce through the protection layer and structure sheaf, and be communicated with fluid cavity; And a shell capacitance sensor, be located on the structure sheaf, be embedded in the protective layer and around spray orifice.
According to above-mentioned purpose, the present invention provides a kind of preparation method of fluid ejection apparatus again, comprises the following steps: to provide a substrate; Form a sacrificial patterned in substrate; Form a resistor on sacrifice layer, have one first end and one second end; Form a pattern structure layer in substrate, and overlay pattern sacrifice layer and resistor, expose first end and one second end of resistor; And form a fluid passage in the bottom of substrate, to expose sacrifice layer; And remove sacrifice layer to form a fluid cavity.
Description of drawings
Following conjunction with figs. and preferred embodiment are to illustrate in greater detail the present invention.
Fig. 1 is the generalized section of fluid ejection apparatus that shows a kind of only petrochemical industry of prior art;
Fig. 2 A and Fig. 2 B are the generalized section of demonstration according to the manufacturing process of the fluid ejection apparatus with sensor of first embodiment of the invention;
Fig. 2 C is the generalized section of the fluid ejection apparatus with sensor behind filling ink that shows first embodiment of the invention;
Fig. 3 A and Fig. 3 B are the generalized section of demonstration according to the manufacturing process of the fluid ejection apparatus with sensor of second embodiment of the invention;
Fig. 3 C is the generalized section of the fluid ejection apparatus with sensor behind filling ink that shows second embodiment of the invention;
Fig. 4 A shows that the sensor circuit according to the embodiment of the invention is a fill fluid (length L), with the equivalent circuit diagram of wire resistor in series;
Fig. 4 B shows that the sensor circuit of second embodiment of the invention is designed to the circuit diagram of Wheatstone bridge (Wheatstone bridge);
Fig. 5 is the top view that shows the fluid ejection apparatus with sensor of third embodiment of the invention;
Fig. 6 A and Fig. 6 B show according to the fluid ejection apparatus with sensor of the third embodiment of the invention manufacturing process generalized section along arrow I-I ' direction among Fig. 5;
Fig. 6 C is the generalized section of the fluid ejection apparatus with sensor behind filling ink that shows third embodiment of the invention;
Fig. 7 A is the structural representation that shows the shell capacitance sensor of third embodiment of the invention;
Fig. 7 B shows that the electrode of the shell capacitance sensor of third embodiment of the invention is a sandwich construction, by the resistance material of heater, metal level, constituted with identical materials such as contact hole; And
Fig. 8 is the C that comprises that shows third embodiment of the invention
1, C
2The sensing circuit figure of electric capacity and arithmetic unit.
Description of reference numerals
Prior art part (Fig. 1)
1～solely fluid ejection apparatus of petrochemical industry; 10～silicon base; 12～structure sheaf; 14～fluid cavity; 20～primary heater; 22～secondary heater; 26～fluid passage; 30～the first bubbles; 32～the second bubbles.
The present invention's part (Fig. 2 A～Fig. 8)
100,200,500～fluid ejection apparatus; 101,201,501～substrate; 110,210～sacrifice layer; 120,120a, 120b, 205,205a, 205b, 220～wire resistance; 130,230～structure sheaf; 135,235～opening; 140,240～ammeter; 145,245～protective layer; 150,250～fluid passage; 160,260～fluid cavity; 170,270～air Bubble generating apparatus; 171,271～primary heater; 172,272～secondary heater; 180,280～spray orifice; L～fill fluid length; R
1, R
2, R
3, R
4～resistance; 510～parallel resistance sensor; 512～sacrifice layer; 514～structure sheaf; 516～protective layer; 520～fluid passage; 530～fluid cavity; 540～spray orifice; 550～shell capacitance sensor; The multi-level conductive structure of 551-555～shell capacitance sensor electrodes; 560a, 560b and 560c～resistance; 562,564～lead; C
1, C
2～electric capacity.
The specific embodiment
The invention provides a kind of manufacture method with fluid ejection apparatus and fluid ejection apparatus of sensor.That is provide one with the fluid ejection apparatus of sensor, this sensor is by default configuration, can be in the front and back of fluid ejection apparatus etching process, under the state of whether filling with fluid, show different output electronic signal (for example electric current or resistance), and control system can judge whereby whether its etching is finished, and perhaps whether reaches suitable fluid drive condition.The present invention removes and reaches multiple function by the single-sensor element, but the formation and the test fluid intracavity liquid position of while monitoring flow body cavity.And, by sensor, can avoid the variation of direct HEATER FOR MEASURING resistance value, in testing process, can directly not influence the heater original structure.
First embodiment
The first embodiment of the present invention provides one to have the fluid ejection apparatus and the manufacture method thereof of single wire resistor.Fig. 2 A and Fig. 2 B are the generalized section of demonstration according to the manufacturing process of the fluid ejection apparatus with sensor of first embodiment of the invention.Fig. 2 C is the generalized section of the fluid ejection apparatus with sensor behind filling ink that shows first embodiment of the invention.
See also Fig. 2 A, a substrate 101 is provided, monocrystal silicon substrate for example, and in substrate 101, form a sacrificial patterned 110.The borosilicic acid phosphorus glass (BPSG) that sacrifice layer 110 is deposited by the chemical vapor deposition (CVD) method, silicic acid phosphorus glass (PSG) or other silica material.Form a wire resistor 120 in substrate 101, conformably be coated on the sacrifice layer 110.The material of wire resistor 120 comprises doped polycrystalline silicon layer or other conductive material.Then, conformably form a pattern structure layer 130 in substrate 101, and overlay pattern sacrifice layer 110.Structure sheaf 130 can be made of the formed low stress nitride silicon layer of chemical vapour deposition technique (CVD), and its stress is between 100～20,000 ten thousand handkerchiefs (MPa).Structure sheaf 130 comprises two openings 135, the two ends of exposing wire resistor 120.Apply the two ends that a voltage is worse than wire resistance 120, and utilize an ammeter 140, galvanometer is for example directly measured the resistance value of wire resistor 120 or the electric current by this circuit.
Then, form an air Bubble generating apparatus 170 on structure sheaf 130.Air Bubble generating apparatus 170 is preferably the heater that is made of a resistive layer, and wherein resistive layer is by physical vaporous deposition (PVD), for example evaporation, sputtering method or reactive sputtering method, formation as HfB
2, TaAl, TaN or other resistance material.Then, on structure sheaf 130, form a protective layer 145, cover air Bubble generating apparatus 170.The material of protective layer 145 can be the formed silica of chemical vapour deposition technique.
In the present embodiment, air Bubble generating apparatus 170 comprises a primary heater 171 and a secondary heater 172, and secondary heater 172 and primary heater 171 lay respectively at the opposite side of spray orifice position.
See also Fig. 2 B, form a fluid passage 150 with the back side of wet etch method etching substrate 101, and expose sacrifice layer 110.Then, remove sacrifice layer 110 to form a fluid cavity 160 and to enlarge it with etching method again, become the fluid cavity 160 of expansion.According to embodiments of the invention, in the process that forms fluid cavity 160, apply the two ends that a voltage is worse than wire resistance 120, and utilize an ammeter 140, galvanometer is for example measured the resistance value of this wire resistance 120 or the electric current by this circuit.When measured current value is contributed by wire resistor 120, then proceed etching.When measured current value is contributed by etching solution, or the measured current value that obtains is when being zero, and the step that then stops etching is proceeded follow-up manufacturing process step.
In Fig. 2 A, the material of wire resistance 120 is made of polysilicon (Poly-Silicon) or similar conductive material.Wire resistor 120 is between sacrifice layer 110 and structure sheaf 130.If this circuit is by an electric current I, the voltage signal that then can obtain at the sensor two ends is V.After sacrifice layer removes, when with KOH solution etching silicon substrate 101 being enlarged fluid cavity 160 etchings again, can find out that by Fig. 2 B wire resistor 120 can be removed in the lump with the silicon material, and form an open circuit 120a and a 120b, this moment, the two ends current signal approached 0.So can utilize the variation of circuit output signal to grasp etching progress rate.
Fig. 2 C is the generalized section of the fluid ejection apparatus with sensor 100 behind filling ink that shows first embodiment of the invention.The fluid ejection apparatus 100 of present embodiment comprises a substrate 101, a structure sheaf 130, a fluid cavity 160 and a runner 150, wherein, structure sheaf 130 is arranged in the substrate 101, and fluid cavity 160 is formed between structure sheaf 130 and the substrate 101, and passage 150 is connected with fluid cavity 160.At least one air Bubble generating apparatus 170 is arranged on the structure sheaf 130, and is corresponding with fluid cavity 160.One protective layer 145 is formed on this structure sheaf 130 and covers air Bubble generating apparatus 170.One spray orifice, 180 contiguous these air Bubble generating apparatus 130 and pierce through the protection layer 145 are communicated with fluid cavity 160 with structure sheaf 130.
After aforesaid etching step was finished, structure had formed a complete fluid ejection apparatus 100.This moment via manifold, runner 150 and the fluid (seeing also Fig. 2 C) in incoming fluid chamber 160 and the spray orifice 180 also the while contacts with primary circuit 120a, 120b.Can be considered as sensor circuit one fill fluid (length L), the resistance system of connecting with wire resistor 140A, 140b this moment.The equivalent resistance (equivalent resistor) of supposing fluid is Rliq, at this moment the voltage V at sensor two ends
fFor: V
f=I (R
1+ R
Liq+ R
2).R in the formula
1With R
2Be respectively the resistance value of circuit 120a and 120b.
In actual applications, the Sensor Design among the present invention is not limited to above-mentioned resistance circuit, also can be condenser network, or the resistance-capacitance hybrid circuit.And set position, also can be at zones different in the fluid ejection apparatus, do single or organize the sensing monitoring element more.Yet,, be noted that the electrical conductivity scope of fluid for the design of sensor application.In addition, when carrying out the etching monitoring,, more can directly control the operation of Etaching device if sensor output signal can be cooperated the proper signal treatment system.To the speech of the device after finishing, sensor also can be given drive system with measured fluid position feedback, causes the fluid ejection apparatus damage to avoid " the empty effect of burning " takes place.
Second embodiment
The second embodiment of the present invention provides one to have the fluid ejection apparatus and the manufacture method thereof of two wire resistor parallel connections.Fig. 3 A-Fig. 3 B shows the generalized section according to the manufacturing process of the fluid ejection apparatus with sensor of second embodiment of the invention.Fig. 3 C is the generalized section of the fluid ejection apparatus with sensor behind filling ink that shows second embodiment of the invention.
The fluid ejection apparatus 200 of second embodiment of the invention is that the fluid ejection apparatus 100 of foundation first embodiment designs, and identical this omission that is in is narrated.It is different that to be in the designed sensor 200 of second embodiment be multiple resistance design architecture in parallel.In the fluid ejection apparatus 200 of Fig. 3 A; comprise two groups of wire electric resistance sensors altogether: first group of wire resistor 205 is arranged between substrate 201 and the sacrifice layer 210; and second group of wire resistor 220 is arranged between sacrifice layer 210 and the structure sheaf 230, and protective layer 245 is coated in the superiors.Two sensors is designed to parallel connection, also can be designed to separate lines.When electric current I by the time can obtain voltage V
0, contributed by first group of wire resistor 205 and second group of wire resistor 220.When the substrate 201 (silicon single crystal wafer) of fluid injection structure, when being removed by the KOH etching solution (shown in Fig. 3 B), the circuit of wire electric resistance sensor 205 is also partly removed thereupon, stays wire resistor 205a and 205b, thereby forms open circuit.This moment, electric current I will be only by the circuit of second group of wire resistor 220, and the measured voltage that obtains also becomes V
1After sacrifice layer removes, when carrying out etching with KOH once more, second group of wire resistor 220 also will form open circuit (shown in Fig. 3 C) thereupon being removed, and the output of the voltage of integrated circuit promptly becomes 0.In like manner, when fluid is packed into regional that etching finishes, the position that the output voltage of sensor also can be inserted with fluid and changing once more.Can be considered as sensor circuit one fill fluid (length L), the resistance system of connecting with wire resistor 205a, 205b this moment.The equivalent resistance (equivalent resistor) of supposing fluid is R
Liq, this moment sensor two ends voltage V
fFor: V
f=I (R
1+ R
Liq+ R
2).R in the formula
1With R
2Be respectively the resistance value of circuit 205a and 205b.Fig. 4 A shows that the sensor circuit according to the embodiment of the invention is a fill fluid L, the equivalent circuit diagram of connecting with wire resistor 140A, 140b.The equivalent resistance (equivalent resistor) of supposing fluid is R
Liq, this moment sensor two ends voltage V
fFor: V
f=I (R
1+ R
Liq+ R
2).Also sensor circuit designs can be become the configuration of Wheatstone bridge (Wheatstonebridge) in addition, shown in Fig. 4 B.V in Fig. 4 B
aWith V
bVoltage pressure reduction can be expressed as: V
b-V
a=V
i(R
1R
4-R
2R
3)/((R
1+ R
2) (R
3+ R
4)).If make R
i=R
2, then preceding formula can be rewritten as: V
b-V
a=0.5V
i(R
4-R
3)/(R
3+ R
4).If with R
3When being designed to the close numerical value of the fluid equivalent resistance preparing to measure,, can obtain V when the circuit of sensor forms (infinity of R4 convergence) when opening circuit
aWith V
bPressure reduction be about an input voltage of two minutes; (R when fluid is filled between circuit again
3=R
4), V
aWith V
bPressure reduction be about 0.So can utilize the variation of input voltage and output voltage, the position measurement after directly obtaining the control of the progress of etching process and fluid filled.For instance, at normal temperatures, the equivalent resistance of ink is about more than ten thousand to 100,000 times of equivalent resistance of potassium hydroxide (KOH) solution of identical physical dimension, 60 ℃ of temperature, weight concentration 33%.Therefore can make suitable corresponding Wheatstone bridge by the coupling design of different circuit, to be used to carry out the monitoring of etching progress rate or ink filling.
The 3rd embodiment
The designed sensor of third embodiment of the invention is a multiple resistance parallel connection and the structure that comprises capacitor design simultaneously.Fig. 5 is the top view of the fluid ejection apparatus with sensor 500 of third embodiment of the invention.First group of sensor 550 is a shell capacitance sensor 550, and its direction is parallel with the direction of following spray orifice 540.Second group of sensor 510 is then similar with first and second embodiment, but that the set position of wire resistor is different from previous embodiment is described, and changes into the edge (as shown in Figure 6A) of sacrifice layer 512.
Fig. 6 A and Fig. 6 B show according to the fluid ejection apparatus with sensor 500 of the third embodiment of the invention generalized section along arrow I-I ' direction among Fig. 5.Fig. 6 C is the generalized section of the fluid ejection apparatus with sensor 500 behind filling ink that shows third embodiment of the invention.
The fluid ejection apparatus 500 of third embodiment of the invention is the design according to the fluid ejection apparatus 200 of second embodiment, and something in common is omitted narration at this.Difference is that the designed sensor of the 3rd embodiment comprises the hybrid circuit of shell capacitance sensor 550 and parallel resistance sensor 510.The structure of shell capacitance sensor 550 is shown in Fig. 7 A, its electrode is made of multi-level conductive structure (551～555), comprise heater resistance material (TaAl, TiN, TiW or Pt etc.), metal level (Al-Si-Cu and Al-Cu), with contact hole (TiW or TiN).Therefore, on manufacture method can with traditional semiconductor technology compatibility.Shell capacitance sensor 550 is embedded in the protective layer 516, and its center is the spray orifice 540 of fluid ejection apparatus 500.Parallel resistance sensor 510 is in parallel and be connected its end points by lead 562 and 564 and constitute by resistor 560a, 560b and 560c, resistor 560a is arranged at the corner of 514 of sacrifice layer 512 and structure sheafs, and part is coated in sacrifice layer top, and resistor 560b and 560c are arranged at the corner of 501 of sacrifice layer 512, structure sheaf 514 and substrates.
According to the embodiment of the invention, can be used to monitor the Position Control of spray orifice manufacturing process and fluid filling, shown in Fig. 7 A by the capacitance variations (dielectric constant change) of measuring transducer 550 circuit.As described in previous embodiment, parallel resistance sensor 510 can be used for the occupied state (seeing also Fig. 6 C) of the etching state and the fluid cavity inner fluid of monitoring stream body cavity.
Fig. 8 one comprises C
1, C
2The sensing circuit of electric capacity and operational amplifier can get after cooperating non-superimposed circuit (non-overlapping circuit) (among the figure indicate) again
C wherein
1Be a radius r, the shell capacitor (shown in Fig. 7 A) of height L, this capacitor utilize former heater resistance material (TaAl, TiN, TiW or Pt etc.), metal level (Al-Si-Cu and Al-Cu), with formation such as contact hole (TiW or the TiN) material of etc.ing (shown in Fig. 7 B).Suppose that the shared height of air and fluid is respectively a and L-a, then the electric capacity of shell capacitor can be expressed as formula 1:
ε in the formula 1
0With ε
fThe dielectric constant of representing air and fluid respectively.By output/input voltage ratio and known C
2Design load, can calculate C
1And the DIELECTRIC CONSTANTS of fluid and air
fWith ε
0, with the height L of shell electric capacity 550 be all known, so can be via C
1Solve air height a, with fluid level L-a.These data can feed back to fluid injection system and carry out interpretation, and drive time of calandria according to the Height Adjustment of this fluid in this spray orifice, or, so can avoid heater " the empty effect of burning ", thereby effectively ensure the life-span of fluid ejection apparatus as whether carrying out subsequent action such as heating.
Mode disclosed according to the present invention, each micro-fluid ejecting device can cooperate Design of Sensor, to single hop, the multistage manufacturing process of carrying out in the future, monitors with fluid filling situation.This result more can as the test condition that drive fluid is sprayed, reach the purpose of avoiding " the empty effect of burning " in order to system to be provided except that the size that can improve fluid ejection apparatus is made precision, and then the purpose that increases the service life.And this two project utilize same Design of Sensor circuit, also can reach the effect that reduces cost of manufacture.
Feature of the present invention and effect are to form a fluid ejection apparatus with sensor.This sensor is by the variation of output electronic signal, in can be used as injector head manufacturing process the progress of the etch process monitoring, and the fluid position measurement after also can be used for overall structure and finishing.The former can control the progress of etch process, replaces afterwards optics or other destructive detection; And the fluid position that the latter provided, the reference frame when can be used as the fluid injection.Apparatus of the present invention can be effectively applied to data print processing, the fuel injection system of literal or image and give birth to the relevant or similar systems such as drug injection of medical courses in general skill.
Though the present invention with preferred embodiment openly as above; yet; it is not in order to limit the present invention; those skilled in the art; under the premise without departing from the spirit and scope of the present invention; certainly can do to change and retouching, so protection scope of the present invention should be as the criterion with the scope that appending claims was defined.
Claims (21)
1. fluid ejection apparatus with sensor comprises:
One substrate;
One structure sheaf is arranged in the described substrate, and and described substrate between form a fluid cavity;
At least one air Bubble generating apparatus is arranged at the respective side of described the above fluid cavity of structure sheaf;
At least one wire electric resistance sensor is connected with described fluid cavity;
One protective layer covers described air Bubble generating apparatus and described wire electric resistance sensor; And
One spray orifice is close to described bubble generator and penetrates described protective layer and described structure sheaf, and is communicated with described fluid cavity.
2. the fluid ejection apparatus with sensor as claimed in claim 1, wherein said air Bubble generating apparatus comprises:
One primary heater is arranged on the surface of described protective layer to be positioned at the outer mode of described fluid cavity, in order to produce one first bubble in described fluid cavity; And
One secondary heater; be arranged on the surface of described protective layer to be positioned at the outer mode of described fluid cavity; and lay respectively at the opposite side of described spray orifice with described primary heater, in order in described fluid cavity, to produce one second bubble so that the fluid in the described fluid cavity is penetrated.
3. the fluid ejection apparatus with sensor as claimed in claim 1, wherein said structure sheaf are a low stress nitride silicon.
4. the fluid ejection apparatus with sensor as claimed in claim 1, wherein said wire electric resistance sensor comprises a plurality of parallel resistance groups.
5. the fluid ejection apparatus with sensor as claimed in claim 1, wherein when described fluid cavity formed, wherein said wire electric resistance sensor is the formation of the described fluid cavity of monitoring in real time, and is etched excessively to avoid described structure sheaf.
6. the fluid ejection apparatus with sensor as claimed in claim 1, wherein when described fluid cavity was filled a fluid, described wire electric resistance sensor became a series connection resistor group with described fluid.
7. fluid ejection apparatus with sensor comprises:
One substrate;
One structure sheaf is arranged in the described substrate, and and described substrate between form a fluid cavity; At least one air Bubble generating apparatus is arranged at the respective side of described the above fluid cavity of structure sheaf;
One protective layer covers described air Bubble generating apparatus; And
One spray orifice is close to described bubble generator and penetrates described protective layer and described structure sheaf, and is communicated with described fluid cavity; And
One shell capacitance sensor is located on the described structure sheaf, is embedded in the described protective layer and around described spray orifice.
8. the fluid ejection apparatus with sensor as claimed in claim 7, wherein said shell capacitance sensor has a pair of arc-shaped electrode.
9. the fluid ejection apparatus with sensor as claimed in claim 8, wherein said arc-shaped electrode are a multi-layer conductive electrode.
10. the fluid ejection apparatus with sensor as claimed in claim 9, the material of wherein said multi-layer conductive electrode comprise TaAl, TiN, TiW, Pt, Al-Si-Cu alloy or Al-Cu alloy.
11. the fluid ejection apparatus with sensor as claimed in claim 7, wherein when described fluid cavity is filled a fluid, described fluid borrows capillarity to be filled in the described spray orifice, described shell capacitance sensor is measured the height of described fluid in described spray orifice, and drives the time of calandria according to the Height Adjustment of described fluid in described spray orifice.
12. the fluid ejection apparatus with sensor as claimed in claim 7 wherein also comprises at least one wire electric resistance sensor, is connected with described fluid cavity.
13. the preparation method of a fluid ejection apparatus comprises the following steps:
One substrate is provided;
Form a sacrificial patterned in described substrate;
Form a wire electric resistance sensor on described sacrifice layer, have one first end and one second end;
Form a pattern structure layer in described substrate, and cover described sacrificial patterned and described wire electric resistance sensor, expose described first end and described second end of described wire electric resistance sensor;
Form a fluid passage in the bottom of described substrate, to expose described sacrifice layer; And
Remove described sacrifice layer to form a fluid cavity.
14. the preparation method of fluid ejection apparatus as claimed in claim 13, the material of wherein said wire electric resistance sensor comprises polysilicon or conductive material.
15. the preparation method of fluid ejection apparatus as claimed in claim 13, the step that wherein removes described sacrifice layer are with the described sacrifice layer of an etching solution etching.
16. the preparation method of fluid ejection apparatus as claimed in claim 15, the step that wherein removes described sacrifice layer comprise, apply described first end and described second end that a voltage is worse than described wire electric resistance sensor, to measure a current value therebetween.
17. the preparation method of fluid ejection apparatus as claimed in claim 16 wherein when measured current value is entirely described wire electric resistance sensor and contributes, then continues etching step and forms described fluid cavity.
18. the preparation method of fluid ejection apparatus as claimed in claim 16, wherein when measured current value was contributed by described wire electric resistance sensor and described etching solution, the step that then stops etching was finished described fluid cavity.
19. the preparation method of fluid ejection apparatus as claimed in claim 13, wherein said wire electric resistance sensor comprises a plurality of parallel resistance groups.
20. the preparation method of fluid ejection apparatus as claimed in claim 19, wherein said a plurality of parallel resistance group comprises one first resistor at the interface that is positioned at described sacrifice layer and described structure sheaf and one second resistor at the interface that is positioned at described structure sheaf and described substrate.
21. the preparation method of fluid ejection apparatus as claimed in claim 20, the step that wherein removes described sacrifice layer comprises, apply one first end and one second end that a voltage is worse than described parallel resistance group, to measure a current value therebetween, wherein when measured current value is contributed by described first and second resistor, then continue the described sacrifice layer of etching, wherein when measured current value was contributed by described second resistor, described sacrifice layer then stopped etching.
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|---|---|---|---|
| CN 200410081965 CN1796127A (en) | 2004-12-30 | 2004-12-30 | Fluid jet device possessing sensor and menufacturing method |
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|---|---|---|---|
| CN 200410081965 CN1796127A (en) | 2004-12-30 | 2004-12-30 | Fluid jet device possessing sensor and menufacturing method |
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| CN1796127A true CN1796127A (en) | 2006-07-05 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106158681A (en) * | 2015-04-10 | 2016-11-23 | 中国科学院微电子研究所 | Corrosion monitoring method for manufacturing air bridge of Schottky diode |
| WO2021062890A1 (en) * | 2019-09-30 | 2021-04-08 | 上海傲睿科技有限公司 | Single-cell screening device, screening assembly, screening method, and use |
-
2004
- 2004-12-30 CN CN 200410081965 patent/CN1796127A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106158681A (en) * | 2015-04-10 | 2016-11-23 | 中国科学院微电子研究所 | Corrosion monitoring method for manufacturing air bridge of Schottky diode |
| WO2021062890A1 (en) * | 2019-09-30 | 2021-04-08 | 上海傲睿科技有限公司 | Single-cell screening device, screening assembly, screening method, and use |
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