CN1784112A - Electronic circuit structure, power supply apparatus, power supply system, and electronic apparatus - Google Patents

Abstract

An electronic circuit mounting structure capable of preventing a decrease in the efficiency of a power supply device caused by a semiconductor power supply voltage drop, preventing an increase in wasted power, and preventing malfunctions caused by a voltage drop in power supply wiring, etc. An electronic circuit mounting structure having a plurality of bus bars as current paths on a printed wiring board, characterized in that the plurality of bus bars have portions arranged approximately in parallel at predetermined intervals, and the plurality of bus bars The width of the parallel part of the bars is greater than the above-mentioned predetermined interval; at the part where the plurality of bus bars are parallel, the plurality of bus bars are connected with a wiring pattern. In addition, among switching power supply devices manufactured on printed circuit boards so as to output voltage 2V or less and output current 100A or more, there is a device that achieves a power utilization factor of 70% or more.

Description

The mounting structure of electronic circuit, supply unit, power-supply system and electronic installation

Technical field

The present invention relates to mounting structure, supply unit, power-supply system and the electronic installation of electronic circuit.

Background technology

In supply unit and power-supply system, power efficiency is extremely important performance.

Power efficiency is the input electric power of supply unit or power-supply system and the ratio of output power, and the electric power of no show output main form with heat in power supply loses.So, if power efficiency is low, then the caloric value of power supply is big, so, in electronic circuit etc., can not use valuably as load, then the electric power of waste loss is many, need the structure and the mechanism of cooling off in supply unit and power-supply system, price improves, and volume increases, and consume the electric power of cooling usefulness such as blower fan, comprise that the power efficiency of the power-supply system of blower fan etc. further reduces.If the power efficiency height then becomes low heating, low cost, the good electric source apparatus of small size, power-supply system.And then also help to save the energy, prevent global warming.

On the other hand, the supply unit of supply capability or power-supply system in semiconductor circuit, output voltage descends year by year, so power efficiency reduces.Semiconductor circuit is owing to the miniaturization of the process technology of high performance and high integrated usefulness, so the withstand voltage reduction of power supply.Therefore, the supply voltage of semiconductor circuit reduces.But because highly integrated or high speed motionization, so the trend of increase appears in current sinking, its result, similar semiconductor circuit consumed power is roughly certain, and supply voltage reduces, and increase tendency appears in current sinking.Because semi-conductive this development trend is so the supply unit that semiconductor circuit is used or the output voltage of power-supply system reduce.Supply unit one highest wisdom keeps necessarily output current, and output voltage is reduced, and output power is reduced, but owing to caloric value changes not quite, so power efficiency reduces.Like this, the power efficiency of supply unit that uses in the semiconductor circuit or power-supply system descends year by year.

In the past,, perhaps, various technology have been developed in order to stop the reduction of power efficiency in order to improve the power efficiency of supply unit and power-supply system.Arbitrary technology also all is to reduce the technology of the loss of power or heating.

The technology of switching power unit was compared with former technology pressure drop type supply unit, and power efficiency is increased substantially.This switching power unit technology has been published many books, is extensively understood by people.Nowadays the power supply major part towards semiconductor circuit all is a switching power unit.

Developed technology such as zero voltage switch, be used for preventing to produce switching loss at switching power unit.Switching loss is owing to semiconductor electrostatic capacitor charge and discharge etc. produces.But if energy is stored in the coil, according to suitable order with regularly carry out switch, then can under institute's making alive on the switch element is zero state, carry out switch, can eliminate switching loss.This is a zero voltage switching technology.In addition, also developed the Zero Current Switch technology.

And,, developed the circuit of synchronous rectification technology for the rectification circuit loss partly that reduces switching power unit.In the past, switching power unit exchanges in making and carries out in the circuit of rectification, mostly adopts semiconductor diode in rectifying part.Though semiconductor diode is by electric current, forward drop is that 0.5V is to 1V, so in the supply unit of big electric current output, its heating sometimes becomes problem.This rectifier cell being replaced as field-effect transistor (Field Effect Transistor is hereinafter referred to as FET) etc., synchronously carrying out the rectification action with alternating electromotive force, is the circuit of synchronous rectification technology.Its result, the voltage drop that produces between the electrode of rectifier cell for example is 0.1V, compares with the diode in past, caloric value reduces significantly.And this voltage drop is by the decision of the conducting resistance of FET, thus be directly proportional by electric current, therefore, when the output current hour caloric value of power supply little; Caloric value is big when output current is big, realizes being adapted to the character of power supply.Its result, if combine with above-mentioned zero voltage switching technology etc., the major part of the loss of Switching Power Supply then is except the little power for operation of control circuit, be ohmic loss, i.e. the coil resistance of the conducting resistance of switch element, transformer etc., the loss that cloth line resistance constant resistance composition causes.

In order to reduce resistance components, a kind of technology of using the wiring material of metallic plate uniform thickness is arranged.As described in patent gazette 2002-345245, this technology is to use metallic plate or busbar in the routing path of big electric current or the primary current path.Because switching power unit is an electronic circuit, so, mostly be to adopt the structure that arrangement of parts is connected on printed substrate.The wiring material part that constitutes printed substrate is made of thin Copper Foil usually, so resistance is big, when flowing through big electric current, caloric value is big.Therefore,, reduce resistance like this, reduce caloric value, improve the power efficiency of supply unit or power-supply system flowing through thick wiring material metallic plate or the busbar of employing on the primary current path of big electric current.According to prior art patent gazette 2002-345245, by at transformer with install between the part top and connect, thereby reduced resistance with thick metallic plate, improved power efficiency.

Prior art is described with Fig. 3.Transformer 11 and semiconductor device 15 are installed on the printed substrate 18.The coil lead division 12 of transformer 11 is connected on the electrod assembly 13 of metal shape, and the electrode device 13 of this metal shape is connected on the terminal 14 of semiconductor device 15.Other terminals of semiconductor device 15 are connected on the wiring figure 16 on the printed substrate 18, are connected on the lead-out terminal 17.That is to say that the wiring that connects between transformer 11 and semiconductor device 15 utilizes the electrod assembly 13 of metal shape to realize, the wiring that connects between semiconductor device 15 and lead-out terminal 17 utilizes wiring figure 16 to realize.

In this example, wiring figure 16 is made of copper, is of a size of thick 35 μ m, wide 10mm, and long 50mm, when this printed substrate adopted common size, its cloth line resistance was about 2.5m Ω.On the other hand, the electrod assembly 13 of metal plate-like, when thick 1mm, width 10mm, length 50mm, resistance is about 0.m Ω.So the aggregate value of wiring is about 2.6m Ω.Now be the situation of the wiring figure on the printed substrate if consider all wirings, then the wiring that transformer 11 is connected with semiconductor device 15 also is the wiring figure on the printed substrate, so exist 2 resistance to be about the wiring figure of 2.5m Ω, add up to be about 5m Ω.So, one side prior art is the electrod assembly that is replaced as metal plate-like wiring figure, adding up to resistance to be reduced to 2.6 Ω m, that is to say like this, make to add up to resistance to reduce half.Generally, flowing through under the situation of same current, caloric value is directly proportional with resistance value.If flow through the 50A electric current, then the caloric value of the wiring of 5m Ω is about 12W.2.6m the caloric value of the wiring of Ω is about 6.5W, roughly reduces half.

Like this, the effect of the prior art is that resistance and the caloric value relevant with wiring reduces half.

And, in this structure, the terminal 14 of semiconductor device 15 be not being connected of metal plate-like electrod assembly 13 on printed substrate 18, but outside, so can not assemble with the manufacturing process of common printed substrate, but, if operation is welded etc. by hand, so, compare cost with automatic assembling and improve, but, implement easily technically.

As previously discussed, the past is carrying on technical development for the power efficiency that improves supply unit and power-supply system always.

In power-supply system and electronic circuit, especially under low-voltage, carry out wishing further to improve power efficiency sometimes in the electronic circuit of big electric current output.If output current is big, then caloric value is big, and, if output voltage is low, even then identical electric current also is that output power is little, comparatively speaking, heating loss and waste the electric power of losing and increase, so, power efficiency is low, for anti-phenomenon here etc., requires further to improve power efficiency sometimes.In recent years owing to the semiconductor operating voltage reduces, so this requirement is very urgent.

Because the exploitation of prior art is so the loss major part of supply unit or power-supply system is that resistance components causes.This resistance components mainly contains: the conducting resistance of switch element, the coil resistance of transformer etc., cloth line resistance etc.Wherein, wish to reduce cloth line resistance constant resistance composition sometimes.

Especially, in recent years, the performance that constitutes the electronic device of supply unit improved year by year, and resistance components reduces, and the shared ratio of cloth line resistance increases, and reaches about 1/3 of resistance components sometimes, so it is very important to reduce the cloth line resistance.

And because semi-conductive operating voltage reduces, so the change of supply unit and the permissible value of error reduce, the requirement of the voltage drop that is produced when flowing through electric current in reducing to connect up is also urgent day by day.

Moreover, in order to reduce cost etc., adopt the little mounting structure of cloth line resistance, utilize common printed substrate manufacturing process to assemble for requirement such as reduce cost sometimes.That is to say, need not rely on the automatic assembled construction of energy of manual operations etc. sometimes.

Summary of the invention

The mounting structure of electronic circuit of the present invention, on printed substrate, have a plurality of busbars, it is characterized in that these a plurality of busbars have the part that becomes almost parallel by arranged at predetermined intervals as current path, and the width of these a plurality of busbar parallel sections is greater than above-mentioned predetermined space; In the parallel part of these a plurality of busbars, these a plurality of busbars connect with wiring figure.

And switching power unit of the present invention is characterised in that, is produced in the switching power unit on the printed substrate in the mode below the output voltage 2V, more than the output current 100A, has to make power efficiency reach device more than 70%.

According to the present invention, the mounting structure of electronic circuit, supply unit, electronic circuit board or power-supply system have the total resistance that reduces wiring portion, also reduce the effect of caloric value.And supply unit or power-supply system have power efficiency are brought up to effect more than 70%.And power-supply system can reduce, alleviates or cancel cooling blower, perhaps makes blower fan reduce noise or reduction price.And electronic installation has the effect that reduces power consumption.

Description of drawings

Fig. 1 is the figure of the 1st embodiment.

Fig. 2 is the figure of the 2nd embodiment.

Fig. 3 is the key diagram of prior art.

Fig. 4 is a concept map of the present invention.

Fig. 5 is a concept map of the present invention.

Fig. 6 is the figure of the 3rd embodiment.

Fig. 7 is the figure of the 4th embodiment.

Fig. 8 is the figure of the 5th embodiment.

Fig. 9 is the figure of an example of the concrete mounting structure of presentation graphs 4.

Figure 10 is the figure of an example of the concrete mounting structure of presentation graphs 4.

Figure 11 is the curve chart of caloric value.

Figure 12 is the curve chart of power efficiency.

Figure 13 is the curve chart of the power efficiency when changing output voltage.

Figure 14 is the curve chart of the power efficiency when changing semiconductor parallel connection number.

Figure 15 is an example that is suitable for the circuit diagram of switching power unit of the present invention.

Embodiment

Below utilize embodiment, describe the present invention in detail.

1, the 1st embodiment

Fig. 1 is the 1st embodiment of the present invention, is the mounting structure of electronic circuit, the mounting structure of the power circuit of saying so in more detail.

Transformer 21, busbar 26,27,33, semiconductor device 31,32 etc. are installed on printed substrate 36, the coil lead division 22 of transformer 21 has a plurality of pin terminal shapes, by reach through hole 23, wiring figure 24, a plurality of reach through hole 25, be connected with busbar 26.Busbar 26 has a plurality of pin terminal shapes, and the wiring figure by reach through hole 28, wiring figure 29, reach through hole 30, semiconductor device 31, printed wire inner cord (not having diagram) is connected with busbar 33.Busbar 33 is connected with lead-out terminal 35 through wiring figure 34.

From transformer 21 to busbar 27, the path of semiconductor device 32, busbar 33 also is same structure.

Busbar is meant the structure that is not printed substrate, its objective is the part that utilizes metallic plate independently that electric current is passed through.

In this structure, the thickness of busbar 26,27,33 is 2mm, and width is 10mm, and length is 100mm, and resistance is about 0.1m Ω.Busbar 26 and busbar 33 are arranged to parallel shape, and L is 10mm at interval, and the width W of parallel portion is 50mm.Wiring figure between busbar 26 and busbar 33 has the planar dimension of the long L of big broadening W, more specifically say so thickness 35 μ m, wide 50mm, long 10mm, and resistance is according to being calculated as 0.1m Ω.But in fact in order to be connected with semiconductor device 31, wiring figure has complicated shape, so resistance is about 0.2m Ω.Therefore, busbar 26, busbar 33 and the total resistance that is positioned at the wiring in the middle of it are about 0.4m Ω.

And the coil lead division 22 of transformer 21 is tabular, utilizes a plurality of reach through holes or terminal to be connected with printed substrate.So be bus-bar structure.This coil lead division 22 and busbar 26 are arranged to parallel shape, are spaced apart 5mm, and the length of parallel portion is 25mm.Wiring figure between coil lead division 22 and busbar 26 has the planar dimension of big broadening 5mm, long 25mm, the thickness 35 μ m that more specifically say so, and width 25mm, length 5mm, resistance are roughly 0.1m Ω.So the total resistance from the coil lead division 22 of transformer 21 to the wiring of busbar 33 is about 0.5m Ω.

On this wiring portion, promptly adding up to resistance is on the wiring portion of 0.4～0.5m Ω, and the caloric value when flowing through the 50A electric current is 0.75W～1W.

According to prior art, the total of cloth line resistance is about 2.6m Ω, so in the present embodiment, the resistance of wiring adds up to and is about 0.4m Ω～0.5m Ω, has been reduced to 1/6～1/5.Caloric value has reduced too.

And the coil lead division 22 of busbar 26,27,33 and transformer 21 etc. has the pin terminal structure, is connected with printed substrate with the form that is inserted in the reach through hole, and shape is identical with common insert type electronic device with method of attachment.So, can utilize the manufacturing process of common printed substrate to assemble, can assemble automatically, therefore, low cost of manufacture.Usually, automatically assembling is assembled with manual operations and is compared, and cost is about 1/10, so, compared with prior art,, can be reduced to about 1/10 with the assembly cost of present embodiment about the assembled portion of the electrod assembly of this busbar or metal plate-like.

Certainly, the structure of splicing ear is changed the shape that becomes corresponding terminal respectively from the pin shape, like this, also be easy to adopt structures such as Plane Installation, plane connection, and do not adopt the form that is inserted in the reach through hole.And, from a plurality of terminal shapes, select for use continuous, promptly compare with the thickness of busbar or metallic plate, the shape of the splicing ear that length or width are bigger also can realize reducing connecting portion resistance, suppress the initial stage purpose that the cloth line resistance makes its reduction.

In the present embodiment, the parallel portion shape of busbar and the shape of wiring figure are consistent haply, still, there is not this necessity, importantly: wiring figure is less, and for example width is narrow, perhaps increases, manyfold is for example arranged, also can make the i.e. part of the parallel portion of busbar on wiring figure of part that flows through electric current, width is bigger with respect to flowing through sense of current, and is shorter, so, can reach the purpose that the cloth line resistance is little, caloric value is little.

In the present embodiment, embodiment to supply unit has been proposed.Certainly, can in all electronic circuits, implement.Owing to have the effect that reduces resistance.So implementing is effectively, therefore,, can bring into play effect in the enforcement that grades of power-supply wiring part, power pack, power receiving section branch, the dispenser of electronic circuit in handling the part of big electric current.

2, the 2nd embodiment

Fig. 2 is the 2nd embodiment of the present invention, is the mounting structure of electronic circuit, the mounting structure of the power circuit of saying so in more detail.

The 2nd embodiment has the identical structure with above-mentioned the 1st embodiment, but difference is also arranged.Below narrate difference.

The secondary coil of transformer 51 is 1 circles, has tabular secondary coil, and secondary wire and lead division form one.This lead division has a plurality of pin shape terminals, so have bus-bar structure, these terminals insert and are welded in the reach through hole 53, is connected with wiring figure 54 on the printed substrate 71.Busbar 56 is installed magnetic core 61 halfway, and this part becomes inductance, forms the inductor that the required smoothing filter of switching power unit is used.Busbar 57 also is same shape.

In the 2nd embodiment, big path of current is: the 1st group of path that arrives the path on the lead-out terminal 66 through busbar 56 and arrive lead-out terminal 70 from transformer 51 through busbar 57 from transformer 51.The 2nd group is: arrive the path on the lead-out terminal 68 through busbars 56, semiconductor device 59, busbar 64 and arrive path on the lead-out terminal 68 through busbars 57, semiconductor device 60, busbar 64 from transformer 51 from transformer 51.

In the 1st group of wiring, the coil lead division of transformer 51 is tabular, and it is connected on the printed substrate by means of a plurality of reach through holes or terminal, so, be bus-bar structure.This coil lead division and busbar 56 are arranged to parastate, are spaced apart 5mm, and the length of parallel portion is 25mm.Wiring figure between this coil lead division and busbar 56 has the planar dimension of about wide 5mm, long 25mm, and more specifically say so thick 35 μ m, wide 25mm, long 5mm are so resistance is approximately 0.1m Ω.And busbar itself is thickness 2mm in inductor portion portions is also included within, wide 10mm, long 150mm, and resistance is about 0.15m Ω.The structure of current path that comprises busbar 57 is also identical.So the 1st group wiring adds up to resistance to be about 0.25m Ω respectively.

In the 2nd group of wiring,, as narrating, be approximately 0.1m Ω at the coil lead division of transformer 51 and the resistance of the wiring figure 54 between the busbar 56.Busbar itself does not comprise inductor portion portions, is of a size of thick 2mm, wide 10mm, long 100mm, and resistance is about 0.1m Ω.Wiring figure 58 grades, busbar 56 and busbar 64 are arranged to parastate, and L is 10mm at interval, and the width W of parallel portion is 50mm.Wiring figure between this coil lead division and busbar 56 has the area of plane that is roughly the long L of wide W, more particularly, is thick 35 μ m, wide 50mm, long 10mm, since complex-shaped, so resistance is 0.2m Ω.And busbar 64 is thick 2mm, wide 10mm, long 100mm, and resistance is about 0.1m Ω.The structure of current path that comprises busbar 57 is also identical.So the total resistance of the 2nd group of wiring is about 0.5m Ω.

Like this, in the 2nd embodiment, the total resistance of big current path wiring is 0.25m Ω～0.5m Ω.When using prior art, the total of cloth line resistance is about 2.6m Ω, so in the present embodiment, compared with prior art, adds up to resistance to be reduced to 1/10～1/5.

In the mounting structure of above power circuit, the reason that can reduce the cloth line resistance is: wiring adopted the wiring Copper Foil than printed wiring board thick the busbar of Duoing, be 2mm as thickness; The wiring figure of the printed substrate that a plurality of busbars are connected, its shape is that width is greater than length.The concept map of its apperance is Fig. 4 and Fig. 5.

In Fig. 4 and Fig. 5, busbar 80 and 81 is arranged to parastate, and parallel portion is to be spaced apart L, and width is W, utilizes the wiring figure 82 on the printed substrate to connect.Wiring figure 82 also roughly is width W, length L.Arrow is represented the flow direction of electric current.Busbar adopts thicker relatively metallic plate etc., is designed to low resistance.Wiring figure 82 is positioned on the printed substrate.So form with thin Copper Foil.It is bigger to be designed to width, and length is shorter, can reduce resistance.At this,, so, both are connected if utilize busbar and wiring figure to make the flow direction of electric current form the right angle haply.

Like this, technology of the present invention is characterized in that: basic conception is to make the wiring figure that connects a plurality of busbars have the structure of width greater than length.

Because above-mentioned situation is a basic conception, so wiring figure can not be a rectangle also, but trapezoidal and other shapes, busbar also needn't be strict parallel, can not be straight line also, if wiring figure width on direction of current flow can achieve the goal so greater than length.

And as described in the 1st and the 2nd embodiment, this wiring figure also can be used for connecting semiconductor device, so, also can cut apart.That is to say, the busbar that is arranged in parallel haply, the width of parallel part is greater than the interval, the part that this is parallel, if utilize wiring figure to connect two busbars, so no matter the trickle shape of wiring figure how, and have or not and cut apart, all can achieve the goal.

Fig. 9 and Figure 10 are concrete mounting structure examples.In two figure, busbar 80 and busbar 81 are arranged to parastate, and the width dimensions of parallel portion is greater than the size of space.On this parallel portion, arrange the wiring figure 83 and 84 of printed substrate, be connected with each busbar.On wiring figure 83 and 84, be connected semiconductor device 86.

3 terminals of semiconductor device 86 usefulness of Fig. 9 have inserted 2 diodes.The anode terminal of diode is connected on the electrode A on the wiring figure 83; The cathode terminal of diode is connected on the electrode K on the wiring figure 84.See that on the whole path of current is: flow into wiring figure 83 from busbar 80, arrive on the busbar 81 from wiring figure 84 by semiconductor device 86.At this, wiring figure 83 and 84, its size is greater than the interval.And its structure is: be connected semiconductor device 86 on wiring figure 83 and 84, when a plurality of semiconductor device are connected in parallel, if semiconductor device is arranged on the Width of wiring figure 83 and 84, so, current path can be not random, increases number in parallel easily.

The semiconductor device 86 of Figure 10 is that (field-effect transistor: Field EffectTransistor), the drain electrode of FET is connected on the electrode D FET, and source electrode is connected on the electrode S, and grid is connected on the electrode G.Utilization makes FET carry out switch to the signal of grid.Signal code to grid is little, so wiring figure 85 is thin.Big path of current is to flow through wiring figure 83 from busbar 80, by semiconductor device 86, arrives on the busbar 81 from wiring figure 84.This point is identical with Fig. 9.

3, the 3rd embodiment

The 3rd embodiment of the present invention is diagram not, this is the power circuit substrate, be made of busbar, wiring figure and electronic device, the wiring portion that electric current supply is used to the electronic device is made of busbar and wiring figure, and its structure is identical with the of the present invention the 1st or the 2nd embodiment.

The part of supplying electric current has and the of the present invention the 1st or the 2nd identical structure of embodiment.So the total resistance of wiring is from the 2.6m Ω in past, utilize the present invention and be reduced to 0.4m Ω, be reduced to 1/6.5.So the heating of wiring also is reduced to 1/6.5.

And, if electric current flow in the wiring with resistance, then produce voltage drop, under the situation that flows through the 50A electric current, produce the voltage drop of 130mv in the wiring of 2.6m Ω in the past.But in the wiring of 0.4m Ω of the present invention, produce the voltage drop of 40mv, be reduced to 1/6.5.In the present embodiment, the wiring portion of supplying with this electric current is used for the power supply power supply of semiconductor device, supplies with the supply voltage of 3.3V, so, in the past, different places is owing to the voltage drop of 130mv, so the part that has produces 3.9% voltage drop, produce misoperation once in a while, utilize when of the present invention, the maximum 40mv of voltage drop is reduced to 1.2%, so, do not have misoperation.Like this, effect of the present invention has: realize the operating stably of electronic circuit, perhaps improve the reliability of electronic installation.

And, as back panel,,, also can realize reducing the cloth line resistance by adopting technology of the present invention even the power supply circuit board of electronic device is not installed in order between printed substrate, to be electrically connected specially, reduce heating, reduce effects such as voltage drop.

And certainly, the portioned product of supply unit and semi-finished product or uncanned supply unit and power supply module etc. also can be realized same effect.

4, the 4th embodiment

Fig. 6 is the 4th embodiment of the present invention, is supply unit.

In Fig. 6, supply unit 90 has: power circuit 91, control circuit 92 and interface circuit 93.Power circuit 91 is power circuits of mounting structure of the 3rd embodiment of the technology of the present invention, receives direct current powers from input terminal 93, to lead-out terminal 94 outputs.Control circuit 92 is connected on the lead-out terminal 94, and the voltage of this point is monitored, makes it reach required value, controls power circuit 91 for this reason.Interface circuit 93 is connected on the control circuit 92, as required, carries out the switching control of supply unit and normal, unusual report etc. by terminal 95.

Figure 15 is an example of the power circuit diagram of the supply unit that is made of power circuit 91 and control circuit 92.

Utilize converter (イ Application バ one ) (constituting) by MOSFET A～D, come dc voltage is carried out switch with high frequency, after being transformed into AC, insulate and transformation with transformer, after carrying out rectification with rectification MOSFET (A～B '), carry out smoothly output dc voltage with DCL (smoothly using coil L1, L2) and capacitor.At this moment, output voltage and normal voltage are compared, come control change device and rectification MOSFET, to obtain required output voltage with pwm control circuit with voltage comparator.

This supply unit is because use the mounting structure of the 1st embodiment in power circuit, so the total resistance of wiring portion compared with prior art is reduced to 1/6～1/5, the caloric value of wiring portion also reduces to 1/6～1/5.Therefore, the gross calorific power of this supply unit reduces half.Power efficiency is brought up to more than 70%.Here, power efficiency is the input electric power of supply unit 90 and the ratio of output power.

Below utilize Figure 11～Figure 14, describe the caloric value and the power efficiency that relate to supply unit of the present invention in detail.

Figure 11 represents the curve chart of caloric value.Abscissa is the output current of power supply, and ordinate is a caloric value.Article 2, curve, " ● " mark is the characteristic curve of power supply of the present invention; " ▲ " mark is a power supply characteristic curve in the past.Output voltage is 1.2V, is general to both.In the gamut of curve chart, power supply caloric value of the present invention only is below half less than the power supply in past.Like this, power supply caloric value of the present invention is little.

Figure 12 represents the curve chart of power efficiency.Abscissa is the output current of power supply; Ordinate is a power efficiency, i.e. the ratio of output power and input electric power.The power efficiency of power supply of the present invention is 80%～90% in the scope of output current from 10A to 100A.The power supply in past is 50%～70% in identical current range.Like this, the power efficiency of power supply of the present invention is higher than power supply in the past.

And, in Figure 12, from output current 20A to 60A, the efficient height, the efficient more than this begins to descend, and when reaching the 100A left and right sides, becomes the characteristic of bottom right.Like this, during big electric current more than reaching about 100A, power efficiency descends, so the present invention helps to improve power efficiency.This trend especially at the insulated type power supply, be that power supply input side and outlet side are more remarkable in by transformer insulated power supply.

The curve chart of the power efficiency when Figure 13 relates to power supply of the present invention and changes output voltage.Article 3, characteristic curve is followed successively by from beginning: output voltage 2V, 1.2V, 1.0V.Like this, when output voltage reduces, decrease in efficiency.This also all is general universal feature concerning any power source.Relate to technology of the present invention, if below output voltage reached about 2V, then the effect of power efficiency was remarkable.This is because as this curve chart, is power efficiency height when above about 2V at output voltage, so, there is not too big difference.Like this, relate to technology of the present invention output voltage be about 2V when following effect remarkable.

Figure 14 is the curve chart that changes the semi-conductive power efficiency when several that is connected in parallel in technology of the present invention.Characteristic curve is, be followed successively by from beginning: (" △ " mark), the 2nd embodiment (" zero " mark), semiconductor number in parallel were about a half (" " mark) when semiconductor number in parallel was about 3 times.In the 2nd embodiment, power efficiency is 80%～90% in the scope of output current 20A～100A; Be about 3 times at semiconductor number in parallel, all-in resistance composition R reduces a half, is 88%～93% at identical current range internal power usage factor; Being about a half at semiconductor number in parallel, is 70%～83% at same current scope internal power usage factor.The method that changes semiconductor number in parallel has: change the length of busbar part in parallel, perhaps increase and decrease the quantity of busbar etc.According to the needs of size, shape, expense etc., and according to as output current of target etc., can be designed into power efficiency arbitrarily from 70% to more than 90%, can be on the principle near 100%.The power supply that can design such high power usage factor relates to technique effect of the present invention.

And assembly technology needs manual operations in the past, and still, this supply unit can full automation.Its result, installation time reduces half, and assembly fee reduces 30%.

And power circuit part adopts the mounting structure of the 2nd embodiment, also can obtain same effect.

And, past, for the resistance that makes wiring figure can descend to some extent, increase thickness in order to make the copper figure, printed substrate adopts 14 layers, but adopt result of the present invention, 6 layers plate can be adopted, like this, the number of plies of printed substrate can be reduced, can make the price of printed substrate be reduced to 1/2, make the price of supply unit reduce by 10%.

Supply unit has various forms, for example have control circuit, that do not have control circuit, that have complicated control circuit, that have cooling body, that do not have cooling body, that have rectification circuit, have the AC/DC transducer, that have the high frequency controlled function and other.No matter be which kind of form, all can obtain same effect.

5, the 5th embodiment

Fig. 7 is the 5th embodiment of the present invention, is power-supply system.

In Fig. 7, power-supply system 100 has: supply unit 101 and 102 and control circuit 103.In the supply unit 101 and 102 at least one is the supply unit of the present invention the 4th embodiment, and control device 103 carries out power supply switching or supervision etc.

This power-supply system adopts and relates to supply unit of the present invention, so the total resistance of wiring portion compared with prior art is reduced to 1/10～1/5, the caloric value of wiring portion also is reduced to 1/10～1/5.Therefore, the gross calorific power of this power-supply system reduces half, and power efficiency is brought up to more than 70%.Its result, cooling adopts free convection just enough, can cancel the cooling blower that needs in the past, can realize miniaturization and low price.

And assembly technology needs manual operations in the past, but this power-supply system can be full-automatic.Its result, installation time can reduce half, and assembly fee can reduce 30%.

Generally, the formation of power-supply system is to use more, as present embodiment, have various ways, for example have a plurality of supply units, that have more supply units, have one or that have control circuit, that do not have control circuit, that have complicated control circuit, that have cooling body, that do not have cooling body and other forms of.If use technology of the present invention, then can obtain same effect.

6, the 6th embodiment

Fig. 8 is the 6th embodiment of the present invention, is electronic installation.

In Fig. 8, electronic installation 110 is made of power-supply system 112 and electronic circuit 111.Power-supply system 112 is power-supply systems of the 5th embodiment of the present invention, and it is to electronic circuit 111 power supplies.At the electronic circuit 111 local electronic circuit substrates that use the 3rd embodiment of the present invention.

This electronic installation adopts and relates to power-supply system of the present invention, so can make the consumed power of this electronic installation reduce by 15%.Like this, when reducing the power consumption of electronic installation, also can reduce burden or minimizing equipment, also can cut down the cooling device of electronic installation to the power receiving equipment of electronic installation power supply etc.And power consumption is little, so save the energy, helps to save resources such as oil, also helps to reduce the discharge rate of carbon dioxide isothermal chamber (warmization) gas.

And this electronic installation can make the assembly automation of power-supply system part, so also help to reduce the assembly cost of electronic installation.

Moreover in general user's electronic installation, source power supply mostly has the restriction of 15A with feed cable, but owing to improved the power efficiency of power-supply system, so utilize identical feed cable, electronic circuit that can more than enough installation 15% can improve the performance of electronic installation.

And, the electronic circuit board of employing the 3rd embodiment of the present invention in electronic circuit 111.So the job stability of electronic circuit improves, the reliability of line work improves 10 times.

Claims (19)

1, a kind of mounting structure of electronic circuit on printed substrate, has a plurality of busbars as current path, it is characterized in that, these a plurality of busbars have the part that becomes almost parallel by arranged at predetermined intervals, and the width of these a plurality of busbar parallel sections is greater than above-mentioned predetermined space; In the parallel part of these a plurality of busbars, these a plurality of busbars connect with wiring figure.

2, the mounting structure of electronic circuit as claimed in claim 1 is characterized in that: in above-mentioned wiring figure part, the part that the 1st wiring figure, semiconductor device and the 2nd wiring figure are connected in series is arranged.

3, a kind of supply unit is characterized in that having the described mounting structure of claim 1.

4, a kind of power-supply system is characterized in that having the described mounting structure of claim 1.

5, a kind of electronic circuit board is characterized in that having the described mounting structure of claim 1.

6, a kind of electronic installation is characterized in that having the described mounting structure of claim 1.

7, a kind of power-supply system is characterized in that having the described supply unit of claim 3.

8, a kind of electronic installation is characterized in that having the described supply unit of claim 3.

9, a kind of electronic installation is characterized in that having the described power-supply system of claim 4.

10, a kind of electronic installation is characterized in that having the described power-supply system of claim 7.

11, a kind of electronic installation is characterized in that having the described electronic circuit board of claim 5.

12, a kind of switching power unit is characterized in that: be produced in the switching power unit on the printed substrate in the mode below the output voltage 2V, more than the output current 100A, have and make power efficiency reach device more than 70%.

13, switching power unit as claimed in claim 12, it is characterized in that:, power efficiency is reached more than 70% using a plurality of busbars and the combination that is connected the wiring figure between these a plurality of busbars on the primary current path that above-mentioned output current flows through.

14, switching power unit as claimed in claim 13 is characterized in that: the above-mentioned wiring figure that connects between above-mentioned a plurality of busbars is made into the big wiring figure of width, and with respect to the length direction that electric current flows through, width is greater than length.

15, switching power unit as claimed in claim 14, it is characterized in that: above-mentioned a plurality of busbars have the part that becomes almost parallel mutually by arranged at predetermined intervals, and, the width of the overlapping parallel part of these a plurality of busbars is greater than above-mentioned predetermined space, in the overlapping parallel part of these a plurality of busbars, these a plurality of busbars are connected by wiring figure.

16, switching power unit as claimed in claim 15 is characterized in that: the above-mentioned wiring figure that connects between above-mentioned a plurality of busbars is cut apart in order to connect semiconductor device.

17, a kind of power-supply system is characterized in that having adopted the described switching power unit of claim 12.

18, a kind of electronic installation is characterized in that having adopted the described power-supply system of claim 17.

19, a kind of electronic installation is characterized in that having adopted the described switching power unit of claim 12.

Images