CN1781714A - Soft circuit board of ink jet printing head and its producing method - Google Patents
Soft circuit board of ink jet printing head and its producing method Download PDFInfo
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- CN1781714A CN1781714A CN 200410095551 CN200410095551A CN1781714A CN 1781714 A CN1781714 A CN 1781714A CN 200410095551 CN200410095551 CN 200410095551 CN 200410095551 A CN200410095551 A CN 200410095551A CN 1781714 A CN1781714 A CN 1781714A
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Abstract
The present invention relates to a kind of soft circuit board for ink jetting print head and its making process. The soft circuit board includes one flexible substrate and one metal circuit layer, the flexible substrate has one area capable of being removed and at least one slot connected to the side near the area, and the metal circuit layer is configured on the flexible substrate. The metal circuit layer includes one electroplated line, which is configured in the area capable of being removed, and several signal lines, each of which has one end with one connecting pad and the other end crossing the slot and connected to the electroplated line in the area capable of being removed. In addition, after the flexible substrate in the said area with electroplated line is removed, these signal lines are isolated electrically.
Description
Technical field
(flexible printed circuit board FPCboard), particularly relates to flexible circuit board and the manufacture method thereof of a kind of ink-jet printing head (print head) to the present invention relates to a kind of flexible circuit board.
Background technology
Along with the growth in household PC and computer peripheral market, many computer peripheral products are constantly weeded out the old and bring forth the new, and use the various demands that satisfy the different users.With regard to the image output equipment of computer, common have display and a printer etc., and wherein the kind of printer for example has laser printer (laserprinter), ink-jet printer (inkjet printer) and heat rotary type printer (therma wax-transfer printer) etc.Because the ink-jet printer has advantages such as the less and low price of external form, make the ink-jet printer become the most common printer at present.
The ink-jet technology of prining is with ink pressurization or heating, makes it produce instantaneous pressure, and forces ink to be sprayed from the nozzle (nozzle) of ink-jet printing head (ink jet crystal plate).The ink of ejection forms ink droplet, and is attached to the surface of printed material.Therefore, can be whether against the start of each nozzle of control ink jet crystal plate, and ink-jet printing head (print head) is laterally mobile, add vertically moving of printed material, the feasible ink droplet that nozzle sprayed by ink-jet printing head falls within the position that requires on the printed material exactly, and then forms literal or pattern.What deserves to be mentioned is that the information of prining of ink-jet printer is sent to ink-jet printing head (ink jet crystal plate) via a flexible circuit board usually.The manufacturing process that is applied to the flexible circuit board of ink-jet printing head for this kind is described further.
See also shown in Figure 1ly, it is depicted as the existing known schematic diagram that is applied to the flexible circuit board of ink-jet printing head.The manufacturing process that has known flexible circuit board 100 now comprises several steps.At first, one flexible substrate (flexible substrate) 110 is provided, and flexible substrate 110 has wafer assembling perforate (chip mounting opening) 110a and a plurality of bullports (sprocket hole) 110b that is positioned at flexible substrate 110 both sides, wherein the ink jet crystal plate (not shown) will be disposed at wafer assembling perforate 110a, and bullport 110b is mainly used in volume to volume (Ro11 to Ro11) production continuously.
Then, on flexible substrate 110, form a copper wire layer (copper circuit layer) 120, and this copper wire layer 120 comprises many plating lines (electroplating line) 122, many RCAs 124 and a peripheral plating line (periphery electroplating line) 126, wherein an end of each bar RCA 124 is a 124a of connection pad portion, and the other end of each bar RCA 124 is to extend to wafer assembling perforate 110a.In addition, these RCAs 124 are to be connected to each other by these plating lines 122, and these RCAs 124 are to be connected with peripheral plating line 126.
Then, on copper wire layer 120, electroplate a gold medal layer (not shown) by plating line 122 and peripheral plating line 126.Then, carry out punching processing procedure (punching process) for the formed structure one of above-mentioned processing procedure, so that form a plurality of perforate 110c, and these perforates 110c is positioned on the plating line 122, so that these RCAs 124 electrical isolation each other, and perforate 110c more is positioned on the peripheral plating line 126, so that RCA 124 and peripheral plating line 126 electrical isolation (electricalisolation), and finishes the making of existing known flexible circuit board 100.
Quantity that it should be noted that perforate 110c is many more, and the manufacturing cost that has known flexible circuit board 100 now is also just high more.In addition, the quantity of perforate 110c and size also can influence the structural strength that has known flexible circuit board 100 now.In addition, because plating line 122 is to be distributed in the RCA 124, so the wiring density of RCA 124 also just can't further increase.
This shows that the flexible circuit board of above-mentioned existing ink-jet printing head and manufacture method thereof obviously still have inconvenience and defective, and demand urgently further being improved in structure, method and use.The problem that exists for the flexible circuit board that solves ink-jet printing head and manufacture method thereof, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.
Because the defective that the flexible circuit board of above-mentioned existing ink-jet printing head and manufacture method thereof exist, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, flexible circuit board and manufacture method thereof in the hope of the ink-jet printing head of founding a kind of new structure, can improve the flexible circuit board and the manufacture method thereof of general existing ink-jet printing head, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, create the present invention who has practical value finally.
Summary of the invention
The objective of the invention is to, overcome the defective of the flexible circuit board existence of existing ink-jet printing head, and provide a kind of flexible circuit board and manufacture method thereof of new ink-jet printing head, technical problem to be solved is to make it that a kind of flexible circuit board of ink-jet printing head is provided, it has preferable structural strength and less size, thereby be suitable for practicality more, and have the value on the industry.
Another object of the present invention is to, a kind of manufacture method of flexible circuit board of ink-jet printing head is provided, technical problem to be solved is it is reduced production costs and to shorten the production time-histories, thereby is suitable for practicality more.
The object of the invention to solve the technical problems realizes by the following technical solutions.The flexible circuit board of a kind of ink-jet printing head that proposes according to the present invention, it comprises: a flexible substrate has a removable section and at least one fluting that is connected to the adjacent side of this removable section; An and metallic circuit layer, be disposed on this flexible substrate, and this metallic circuit layer comprises a plating line and most bar RCA, and this plating line is to be disposed on this removable section of this flexible substrate, and an end of each those RCA is a connection pad portion, and the other end of those RCAs is to cross over this fluting respectively, and be connected to this plating line on this removable section, after this flexible substrate that removes this removable section and this plating line, between those RCAs mutual electrical isolation wherein.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The flexible circuit board of aforesaid ink-jet printing head, it comprises a coat of metal, is disposed on this metallic circuit layer.
The flexible circuit board of aforesaid ink-jet printing head, it more comprises a cover layer, is disposed on this flexible substrate, and covers this metallic circuit layer, but expose those connection pad portions of this removable section and those RCAs.
The flexible circuit board of aforesaid ink-jet printing head, wherein said metallic circuit layer more comprises a peripheral plating line, is positioned at the periphery of those RCAs and this plating line, and should the periphery plating line be to be connected with this plating line.
The flexible circuit board of aforesaid ink-jet printing head, wherein said removable section are the routine limits near this flexible substrate, and should the periphery plating line are that this side by this flexible substrate extends this plating line that is connected on this removable section.
The flexible circuit board of aforesaid ink-jet printing head, the length direction of wherein said flexible substrate are parallel with the length direction of this removable section.
The object of the invention to solve the technical problems realizes by the following technical solutions.The manufacture method of the flexible circuit board of a kind of ink-jet printing head that proposes according to the present invention, it may further comprise the steps: a flexible substrate and a metal level are provided, wherein this metal level is to be disposed on this flexible substrate, and this flexible substrate has a removable section and at least one fluting that is connected to the adjacent side of this removable section; This metal level of patterning, to form a metallic circuit layer, and this metallic circuit layer comprises a plating line and most bar RCA, wherein this plating line is to be disposed on this removable section, and an end of each those RCA is a connection pad portion, and the other end of those RCAs is to cross over this fluting respectively, and is connected to this plating line on this removable section; Carry out an electroplating process by this plating line, so that on this metallic circuit layer, form a coat of metal; And remove this flexible substrate and this plating line that is positioned on this removable section, so that between those RCAs mutual electrical isolation.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The manufacture method of the flexible circuit board of aforesaid ink-jet printing head, the method that removes this flexible substrate of being positioned on this removable section and this plating line comprise punching processing procedure and laser processing procedure one of them.
The manufacture method of the flexible circuit board of aforesaid ink-jet printing head after forming this coat of metal, more comprise forming a cover layer in this flexible substrate, and this cover layer is those connection pad portions that expose this removable section and those RCAs.The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The present invention compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, in order to reach aforementioned goal of the invention, major technique of the present invention thes contents are as follows:
The present invention proposes a kind of flexible circuit board of ink-jet printing head, it comprises a flexible substrate and a metallic circuit layer, wherein flexible substrate has a removable section and at least one fluting that is connected to the adjacent side of removable section, and the metallic circuit layer is to be disposed on the flexible substrate.In addition, the metallic circuit layer comprises a plating line and many RCAs, and wherein plating line is to be disposed on the removable section of flexible substrate, and an end of each bar RCA is a connection pad portion, and the other end of these RCAs is to cross over fluting respectively, and is connected to the plating line on the removable section.In addition, after flexible substrate that removes removable section and plating line, between these RCAs mutual electrical isolation.
Based on above-mentioned purpose or other purposes, the present invention proposes a kind of manufacture method of flexible circuit board of ink-jet printing head, and it comprises several steps.At first, provide a flexible substrate and a metal level, wherein metal level is to be disposed on the flexible substrate, and flexible substrate has a removable section and at least one fluting that is connected to the adjacent side of removable section.Then, this metal level of patterning, to form a metallic circuit layer (metal circuit layer), and the metallic circuit layer comprises a plating line and many RCAs, wherein plating line is to be disposed on the removable section, and an end of each bar RCA is a connection pad portion, and the other end of these RCAs is to cross over fluting respectively, and is connected to the plating line on the removable section.Then, carry out an electroplating process (electroplating process), so that on the metallic circuit layer, form a coat of metal (metal protection layer) by plating line.Subsequently, remove the flexible substrate and the plating line that are positioned on the removable section, so that be mutual electrical isolation between these RCAs.
Based on above-mentioned, must on plating line, form perforate compared to known techniques, so that mutual electrical isolation between the RCA, the manufacture method of the flexible circuit board of ink-jet printing head of the present invention only need remove flexible substrate on the removable section and plating line just can make between the RCA electrical isolation mutually, and need not additionally form perforate, and then reduce production costs.In addition, be between RCA compared to the plating line of known techniques, the plating line of the flexible circuit board of ink-jet printing head of the present invention is to be positioned on the removable section, so the wiring density of RCA can further improve.
Via as can be known above-mentioned, the invention relates to a kind of flexible circuit board and manufacture method thereof of ink-jet printing head, wherein, the flexible circuit board of ink-jet printing head comprises a flexible substrate and a metallic circuit layer, wherein flexible substrate has a removable section and at least one fluting that is connected to the adjacent side of removable section, and the metallic circuit layer is to be disposed on the flexible substrate.In addition, the metallic circuit layer comprises a plating line and many RCAs, and wherein plating line is to be disposed on the removable section of flexible substrate, and an end of each bar RCA is a connection pad portion, and the other end of these RCAs is to cross over fluting respectively, and is connected to the plating line on the removable section.In addition, after flexible substrate that removes removable section and plating line, between these RCAs mutual electrical isolation.
By technique scheme, the flexible circuit board of ink-jet printing head of the present invention and manufacture method thereof have following advantage at least:
1, needs on plating line, to form a plurality of perforates compared to known techniques, so that mutual electrical isolation between the RCA, the manufacture method of the flexible circuit board of ink-jet printing head of the present invention only need remove flexible substrate on the removable section and plating line just can make between the RCA electrical isolation mutually, and then reduces production costs and shorten the production time-histories.
2, be that plating line is disposed between the RCA compared to known techniques, the flexible circuit board of ink-jet printing head of the present invention is that plating line is disposed on the removable section, so RCA can have higher wiring density.In addition, because the flexible circuit board of ink-jet printing head has less perforate, therefore the flexible circuit board of ink-jet printing head of the present invention has preferable structural strength.
In sum, the flexible circuit board of ink-jet printing head of the present invention and manufacture method thereof provide a kind of flexible circuit board of ink-jet printing head, and it has preferable structural strength and less size.In addition, the present invention also provides a kind of manufacture method of flexible circuit board of ink-jet printing head, can reduce production costs and shorten the production time-histories.It has above-mentioned many advantages and practical value, and in like product and method, do not see have similar structural design and method to publish or use and really genus innovation, no matter it all has bigger improvement on product structure, method or function, have large improvement technically, and produced handy and practical effect, and the flexible circuit board of more existing ink-jet printing head and manufacture method thereof have the multinomial effect of enhancement, thereby be suitable for practicality more, and have the extensive value of industry, really be a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by a preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Figure 1 shows that the existing known schematic diagram that is applied to the flexible circuit board of ink-jet printing head.
Fig. 2 A is depicted as the schematic top plan view of flexible circuit board before plating line does not remove of ink-jet printing head.
Fig. 2 B is depicted as the schematic top plan view of flexible circuit board after plating line removes of ink-jet printing head.
Fig. 2 C is depicted as the part section structural representation according to the flexible circuit board of the ink-jet printing head of preferred embodiment of the present invention.
100: existing known flexible circuit board 110,210: soft base
110a: wafer assembling perforate 110b: bullport
110c, 210c: perforate 120: copper wire layer
122,222: plating line 124,224: RCA
124a, 224a: connection pad portion 126,226: peripheral plating line
200: the flexible circuit board 210a of ink-jet printing head: removable section
210b: fluting 220: metallic circuit layer
230: coat of metal 240: cover layer
The specific embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, flexible circuit board and its specific embodiment of manufacture method, structure, method, manufacture method, processing method, step, feature and the effect thereof of the ink-jet printing head that foundation the present invention is proposed, describe in detail as after.
See also shown in Fig. 2 A, be the schematic top plan view of flexible circuit board before plating line does not remove of ink-jet printing head.See also shown in Fig. 2 B, be the schematic top plan view of flexible circuit board after plating line removes of ink-jet printing head.Please consult simultaneously shown in Fig. 2 A and Fig. 2 B, the flexible circuit board 200 of ink-jet printing head comprises a flexible substrate 210 and a metallic circuit layer 220, wherein flexible substrate 210 has a removable section 210a and the fluting 210b that is connected to the adjacent side of removable section 210a, and metallic circuit layer 220 is to be disposed on the flexible substrate 210.In addition, metallic circuit layer 220 comprises plating line 222 and many RCAs 224, and wherein plating line 222 is to be disposed on the removable section 210a of flexible substrate 210, shown in Fig. 2 A.In addition, an end of each bar RCA 224 is a 224a of connection pad portion, and the other end of these RCAs 224 is to cross over fluting 210b respectively, and is connected to the plating line 222 on the removable section 210a, shown in Fig. 2 A.It should be noted that after flexible substrate 210 that removes removable section 210a and plating line 222, is mutual electrical isolation between these RCAs 224, shown in Fig. 2 B.
Please continue to consult shown in Fig. 2 B, left perforate 210c more can be as the assembling district of ink jet crystal plate after the flexible substrate 210 that removes removable section 210a and the plating line 222, so the electric signal of ink-jet printer can be passed to ink-jet printing head via 224a of connection pad portion and RCA 224.In addition, the material of flexible substrate 210 for example is polyimides (polyimide), mylar (polyester resin) or other suitable soft insulation materials.In addition, the material of metallic circuit layer 220 for example is copper or other conductive material.
Compared to known techniques a plurality of perforate 110c are formed on the plating line 122, so that RCA 124 electrical isolation (as shown in Figure 1) each other, 200 need of the flexible circuit board of ink-jet printing head of the present invention remove the flexible substrate 210 and plating line 222 of removable section 210a, just can make between the RCA 224 electrical isolation mutually.It should be noted that because the negligible amounts of the perforate that the flexible circuit board 200 of ink-jet printing head of the present invention is had, therefore the flexible circuit board 200 of ink-jet printing head of the present invention has lower production cost.In addition, because the negligible amounts of perforate, so the flexible circuit board 200 of ink-jet printing head has preferable structural strength.In addition, because plating line is to be positioned on the removable section 210a, so the RCA 224 of the flexible circuit board 200 of ink-jet printing head can have higher wiring density.
See also shown in Fig. 2 C, be part section structural representation according to the flexible circuit board of the ink-jet printing head of preferred embodiment of the present invention.Please consult simultaneously shown in Fig. 2 A and Fig. 2 C, metallic circuit layer 220 for example more comprises a peripheral plating line 226, and peripheral plating line 226 is the peripheries that are positioned at these RCAs 224 and plating line 222.In addition, removable section 210a is the side near flexible substrate 210, and peripheral plating line 226 for example is that side by flexible substrate 210 extends the plating line 222 that is connected on the removable section 210a.In addition, the length direction of flexible substrate 210 for example is parallel with the length direction of removable section 210a, so the width of the flexible circuit board 200 of ink-jet printing head can further dwindle.
From the above, when the material of metallic circuit layer 220 for example is the copper metal,, therefore on metallic circuit layer 220, dispose a coat of metal 230, shown in Fig. 2 C for fear of the surface generation oxidation of the metallic circuit layer 220 that is constituted by the copper metal.In addition, coat of metal 230 for example is a gold medal layer or a nickel/gold layer.In addition, the flexible circuit board 200 of ink-jet printing head more comprises a cover layer 240, and in order to covering flexible substrate 210 and metallic circuit layer 220 (shown in Fig. 2 C), but cover layer 240 is the 224a of connection pad portion and the removable section 210a that expose RCA 224.For the manufacture method of the flexible circuit board 200 of ink-jet printing head, its be describe in detail as after.
See also shown in Fig. 2 A to Fig. 2 C, the manufacture method of the flexible circuit board 200 of ink-jet printing head comprises several steps.At first, provide a flexible substrate 210 and a metal level (not illustrating), wherein flexible substrate 210 has removable section 210a and the fluting 210b (shown in Fig. 2 A) that is connected to the adjacent side of removable section 210a, and metal level is to be disposed on the flexible substrate 210.What deserves to be mentioned is that metal level can directly be disposed at (for example being doubling plate) on the flexible substrate 210, and metal level also can be disposed at (for example being three ply board) on the flexible substrate 210 by an adhesion coating (not shown).
Then, this metal level of patterning is to form a metallic circuit layer 220.In addition, metallic circuit layer 220 comprises plating line 222, peripheral plating line 226 and RCA 224, wherein plating line 222 is to be disposed on the removable section 210a, and an end of each bar RCA 224 is the 224a of connection pad portion, and the other end of these RCAs 224 is to cross over fluting 210b respectively, and is connected to the plating line 222 on the removable section 210b.In addition, peripheral plating line 226 is the peripheries that are positioned at plating line 222 and these RCAs 224, and peripheral plating line 226 is to be connected with plating line 222.
Then, carry out an electroplating process (electroplating process) by plating line 222, so that on metallic circuit layer 220, form a coat of metal 230, shown in Fig. 2 C.
Subsequently, on the formed structure of above-mentioned processing procedure, form a cover layer 240, and cover layer 240 is the 224a of connection pad portion and the removable section 210a that expose RCA 224.
Afterwards, remove the flexible substrate 210 and plating line 222 that are positioned on the removable section 210a, so that be mutual electrical isolation between these RCAs 224, shown in Fig. 2 B.In addition, removing method for example is punching processing procedure, laser processing procedure (laser process), etch process or other suitable processing procedures.
From the above, numerous perforate 110c need be formed compared to known techniques and electrical isolation (as shown in Figure 1) mutually could be made between the RCA 124, the manufacture method of the flexible circuit board 200 of ink-jet printing head of the present invention only need remove flexible substrate 210 on the removable section 210a and plating line 222 just can make between the RCA 224 electrical isolation mutually, and removes the assembling district that left perforate 210c after flexible substrate 210 and the plating line 222 on the removable section 210a more can be used as wafer.In addition, the quantity of the formed perforate 110c of known techniques is many more, and its production cost also increases, and therefore the manufacture method of the flexible circuit board 200 of ink-jet printing head of the present invention not only has the advantage on the cost, more can shorten the production time-histories.
In sum, the flexible circuit board of ink-jet printing head of the present invention and manufacture method thereof have following advantage:
1, needs on plating line, to form a plurality of perforates compared to known techniques, so that mutual electrical isolation between the RCA, the manufacture method of the flexible circuit board of ink-jet printing head of the present invention only need remove flexible substrate on the removable section and plating line just can make between the RCA electrical isolation mutually, and then reduces production costs and shorten the production time-histories.
2, be that plating line is disposed between the RCA compared to known techniques, the flexible circuit board of ink-jet printing head of the present invention is that plating line is disposed on the removable section, so RCA can have higher wiring density.In addition, because the flexible circuit board of ink-jet printing head has less perforate, therefore the flexible circuit board of ink-jet printing head of the present invention has preferable structural strength.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the method that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, but every content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (9)
1, a kind of flexible circuit board of ink-jet printing head is characterized in that it comprises:
One flexible substrate has a removable section and at least one fluting that is connected to the adjacent side of this removable section; And
One metallic circuit layer, be disposed on this flexible substrate, and this metallic circuit layer comprises a plating line and most bar RCA, and this plating line is to be disposed on this removable section of this flexible substrate, and an end of each those RCA is a connection pad portion, and the other end of those RCAs is to cross over this fluting respectively, and is connected to this plating line on this removable section
After this flexible substrate that removes this removable section and this plating line, between those RCAs mutual electrical isolation wherein.
2, the flexible circuit board of ink-jet printing head according to claim 1 is characterized in that it comprises a coat of metal, is disposed on this metallic circuit layer.
3, the flexible circuit board of ink-jet printing head according to claim 1 is characterized in that it more comprises a cover layer, is disposed on this flexible substrate, and covers this metallic circuit layer, but expose those connection pad portions of this removable section and those RCAs.
4, the flexible circuit board of ink-jet printing head according to claim 1 is characterized in that wherein said metallic circuit layer more comprises a peripheral plating line, is positioned at the periphery of those RCAs and this plating line, and should the periphery plating line be to be connected with this plating line.
5, the flexible circuit board of ink-jet printing head according to claim 4, it is characterized in that wherein said removable section is the side near this flexible substrate, and should the periphery plating line be that this side by this flexible substrate extends this plating line that is connected on this removable section.
6, the flexible circuit board of ink-jet printing head according to claim 1, the length direction that it is characterized in that wherein said flexible substrate are parallel with the length direction of this removable section.
7, a kind of manufacture method of flexible circuit board of ink-jet printing head is characterized in that it may further comprise the steps:
One flexible substrate and a metal level are provided, and wherein this metal level is to be disposed on this flexible substrate, and this flexible substrate has a removable section and at least one fluting that is connected to the adjacent side of this removable section;
This metal level of patterning, to form a metallic circuit layer, and this metallic circuit layer comprises a plating line and most bar RCA, wherein this plating line is to be disposed on this removable section, and an end of each those RCA is a connection pad portion, and the other end of those RCAs is to cross over this fluting respectively, and is connected to this plating line on this removable section;
Carry out an electroplating process by this plating line, so that on this metallic circuit layer, form a coat of metal; And
Remove this flexible substrate and this plating line that are positioned on this removable section, so that be mutual electrical isolation between those RCAs.
8, the manufacture method of the flexible circuit board of ink-jet printing head according to claim 7, the method that it is characterized in that removing this flexible substrate of being positioned on this removable section and this plating line comprise punching processing procedure and laser processing procedure one of them.
9, the manufacture method of the flexible circuit board of ink-jet printing head according to claim 7; it is characterized in that after forming this coat of metal; more comprise forming a cover layer, and this cover layer is those connection pad portions that expose this removable section and those RCAs in this flexible substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100955517A CN100384629C (en) | 2004-11-29 | 2004-11-29 | Soft circuit board of ink jet printing head and its producing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100955517A CN100384629C (en) | 2004-11-29 | 2004-11-29 | Soft circuit board of ink jet printing head and its producing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1781714A true CN1781714A (en) | 2006-06-07 |
| CN100384629C CN100384629C (en) | 2008-04-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100955517A Expired - Fee Related CN100384629C (en) | 2004-11-29 | 2004-11-29 | Soft circuit board of ink jet printing head and its producing method |
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| CN (1) | CN100384629C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017164944A (en) * | 2016-03-15 | 2017-09-21 | セイコーエプソン株式会社 | Liquid discharge head and liquid discharge device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5471163A (en) * | 1993-11-16 | 1995-11-28 | Hewlett-Packard Company | Tab circuit fusible links for disconnection or encoding information |
| CN1224511C (en) * | 2002-01-28 | 2005-10-26 | 飞赫科技股份有限公司 | Structure and making method of flexible circuit board for ink-jet printing head |
| KR100462604B1 (en) * | 2002-05-20 | 2004-12-20 | 삼성전자주식회사 | Ink jet print head, bonding method of flexible printed circuit cable for ink jet print head and the apparatus adopting the same |
| KR100456029B1 (en) * | 2002-11-14 | 2004-11-08 | 삼성전자주식회사 | Flexible Printed Circuit |
-
2004
- 2004-11-29 CN CNB2004100955517A patent/CN100384629C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017164944A (en) * | 2016-03-15 | 2017-09-21 | セイコーエプソン株式会社 | Liquid discharge head and liquid discharge device |
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| Publication number | Publication date |
|---|---|
| CN100384629C (en) | 2008-04-30 |
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