CN1779885A - Forming method of addressing electrode and conducting structure for plasma display device - Google Patents
Forming method of addressing electrode and conducting structure for plasma display device Download PDFInfo
- Publication number
- CN1779885A CN1779885A CN 200410091581 CN200410091581A CN1779885A CN 1779885 A CN1779885 A CN 1779885A CN 200410091581 CN200410091581 CN 200410091581 CN 200410091581 A CN200410091581 A CN 200410091581A CN 1779885 A CN1779885 A CN 1779885A
- Authority
- CN
- China
- Prior art keywords
- conductive
- mentioned
- formation method
- web plate
- patterns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
A process for preparing the addressing electrodes and electroconductive structure of plasma display includes such steps as screen printing to generate the mutually parallel multiple electroconductive pattern strips on substrate, and etching to form multiple addressing electrodes. Its advantages are less consumption of material and low cost.
Description
Technical field
The invention relates to a kind of pattern and form technology, and particularly relevant for the invention of the formation method of a kind of addressing electrode of plasma display and conductive structure.
Background technology
In recent years, because the progress of microelectric technique impels the flourish of information, communication and network technology and related industry thereof, the display that is used to present various literal, data, pattern and dynamic image becomes indispensable necessary part.Wherein, plasma display with its large scale, self-luminous, no visual angle is interdependent, frivolous and advantage such as full color and have great application potential, is expected to become the main flow of follow-on flat-panel screens.
Fig. 1 is a kind of perspective exploded view of known plasma display.Please refer to Fig. 1, plasma display 100 mainly is by prebasal plate (frontsubstrate) 110, discharge gas (not expressing among the figure) and 120 formations of metacoxal plate (rearsubstrat).Wherein, prebasal plate 110 is made of substrate 10, X electrode and Y electrode, and X electrode and Y electrode be arranged on the substrate 10, and is coated with dielectric layer 11 and protective layer 12.
From the above, the formation method of known addressing electrode 15 is that the silver paste that will contain photosensitive material earlier is coated on the substrate 20 comprehensively, this silver paste is exposed and developing process afterwards, to form the addressing electrode 15 of strip pattern on substrate 20 again.Hence one can see that, forms in the technology at this pattern and must remove a large amount of expensive silver pastes, to form the addressing electrode 15 of strip.Yet the silver paste that is removed in this technology also can't reclaim use, thereby cause the waste on the manufacturing cost again.
In order to solve above-mentioned problem, as is generally known the somebody proposes the another kind of method that forms addressing electrode 15, this method is utilized screen printing technology and directly form addressing electrode 15 on substrate 20.Yet therefore and be not suitable for the manufacturing process of the display of high-resolution, because screen printing technology can't form meticulousr pattern.
Summary of the invention
In view of this, purpose of the present invention just provides a kind of formation method of addressing electrode and conductive structure of plasma display, with the quantity of material that is consumed in the minimizing technology, and then saves manufacturing cost.
The present invention proposes a kind of formation method of addressing electrode of plasma display, and this method provides the conductive photoreceptor material earlier, then carries out screen printing process, so that this conductive photoreceptor material is arranged on the substrate, thereby forms many conductive patterns that are parallel to each other.Then, provide light shield, this light shield has many printing opacity patterns that are parallel to each other.Afterwards this light shield is arranged on the substrate top, so that each printing opacity pattern of light shield all is arranged in the individual top of one of these conductive patterns.Wherein, the live width of each printing opacity pattern less than its live width of conductive pattern of correspondence.Then, be that mask carries out microphotograph technology to these conductive patterns with this light shield, on substrate, to form many addressing electrodes.
Preferred embodiment according to the present invention is described, and this conductive photoreceptor material for example is the mixture of metal and photosensitive material, and its preferably mixture of copper, platinum or silver and photosensitive material.
Preferred embodiment according to the present invention is described, after forming these addressing electrodes, also comprises these addressing electrodes are carried out sintering (sintering) technology, to remove the nonmetallic materials in these addressing electrodes.
Preferred embodiment according to the present invention is described, above-mentioned screen printing technology is that the web plate that will have a plurality of openings is arranged on the substrate, then the conductive photoreceptor material is coated on the web plate, so that the conductive photoreceptor material flow on the substrate via these openings, to form above-mentioned conductive pattern, afterwards again with web plate by removing on the substrate.Wherein, the live width of these conductive patterns for example is between 100 microns to 120 microns.And in one embodiment, the spacing of these conductive patterns for example is 100 microns.
Preferred embodiment according to the present invention is described, with conductive pattern patterning case with the step that forms these addressing electrodes in, comprise that the spacing that makes these addressing electrodes is 200 microns, and in one embodiment, comprise that also the live width that makes these addressing electrodes is 70 microns.
The invention provides a kind of formation method of conductive structure, be suitable on substrate, forming a plurality of conductive structures.The method is that the conductive photoreceptor material is provided earlier, carries out screen printing technology then, so that the conductive photoreceptor material is arranged on the substrate, thereby forms a plurality of conductive patterns on substrate.Then carry out microphotograph technology, form a plurality of conductive structures with these conductive patterns of patterning.
Preferred embodiment according to the present invention is described, the step of above-mentioned microphotograph technology comprises provides the light shield with a plurality of printing opacity patterns earlier, then this light shield is arranged on the substrate top, so that each printing opacity pattern of light shield all is arranged in the individual top of one of these first photosensitive pattern.And each printing opacity pattern is less than first photosensitive pattern of its correspondence.Afterwards, be that mask carries out microphotograph technology to these first photosensitive pattern with this light shield, on substrate, to form a plurality of conductive structures.
Preferred embodiment according to the present invention is described, and this conductive photoreceptor material for example is the mixture of metal and photosensitive material, and its preferably mixture of copper, platinum or silver and photosensitive material.
Preferred embodiment according to the present invention is described, after forming these conductive structures, also comprises these conductive structures are carried out sintering process, to remove the nonmetallic materials in these conductive structures.
Preferred embodiment according to the present invention is described, and the step that forms these first photosensitive pattern comprises that the spacing of the printing opacity pattern that makes on the light shield is 200 microns, and in one embodiment, comprises that also the live width that makes the printing opacity pattern for example is 70 microns.In addition, the live width of these first photosensitive pattern for example is between 100 microns to 120 microns.
Preferred embodiment according to the present invention is described, above-mentioned screen printing technology is that the web plate that will have a plurality of openings earlier is arranged on the substrate, then the conductive photoreceptor material is coated on the web plate, so that the conductive photoreceptor material flow on the substrate via these openings, to form the first above-mentioned photosensitive pattern, afterwards again with web plate by removing on the substrate.Wherein, the live width of these first photosensitive pattern for example is between 100 microns to 120 microns.And in one embodiment, the spacing of these first photosensitive pattern for example is 100 microns.
Preferred embodiment according to the present invention is described, in with the step of these conductive pattern patterning cases with the formation conductive structure, comprise that the spacing that makes these conductive structures is 200 microns, and in one embodiment, comprise that also the live width that makes these conductive structures is 70 microns.
The present invention utilizes screen printing technology to form a plurality of larger-size conductive patterns earlier on substrate, carries out microphotograph technology afterwards again, with these conductive patterns of patterning, and then forms a plurality of conductive structures with the size that meets demand on substrate.Only carry out pattern with microphotograph technology and form technology and compare with known, the present invention can reduce pattern and form the quantity of material that is removed in the technology, and then saves manufacturing cost.
State with other purpose, feature and advantage and can become apparent on the present invention for allowing, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Fig. 1 is a kind of perspective exploded view of known plasma display.
Fig. 2 A to Fig. 2 C is the formation flow process profile of the conductive structure of one of the present invention preferred embodiment.
Fig. 3 is the schematic top plan view of the web plate 204 of Fig. 2 A.
Fig. 4 is the schematic top plan view of the light shield 212 of Fig. 2 B.
The main element description of symbols
10,20: substrate
11,17: dielectric layer
12: protective layer
13: discharging chamber
15: addressing electrode
21: fluorescent material layer
30: barrier
100: plasma display
110: prebasal plate
120: metacoxal plate
202: the conductive photoreceptor material
204: web plate
206: conductive pattern
210: the opening of web plate
212: light shield
214: the printing opacity pattern of light shield
216: scraper
230: conductive structure
240: exposure light source
The X:X electrode
The Y:Y electrode
Embodiment
The present invention utilizes the mode of screen printing after forming a plurality of conductive patterns on the substrate, utilizes these conductive patterns of microphotograph art pattern CADization again, to obtain to have the conductive structure of actual required size.Compare with known technology, the present invention not only can save manufacturing cost, also can form the comparatively meticulous rete of pattern, so that be applied in the manufacturing of display of high-resolution.Below will the present invention be described, but it is not in order to limit the present invention for embodiment.The ordinary skill of technical field that the present invention belongs to can be done variation to following embodiment slightly according to the present invention's spirit, precisely because still belong in the present invention's the scope.
Fig. 2 A to Fig. 2 C is the formation flow process profile of the conductive structure of one of the present invention preferred embodiment.At this formation method of the present invention's conductive structure will be described with the manufacturing process of addressing electrode shown in Figure 1 15.
Please refer to Fig. 2 A, at first utilize conductive photoreceptor material 202 and web plate 204 to carry out screen printing technology, on substrate 20, to form a plurality of conductive patterns 206.This screen printing technology is earlier web plate 204 to be arranged on the substrate 20, then conductive photoreceptor material 202 coated on the web plate 204, so that conductive photoreceptor material 202 can flow on the substrate 20 via the opening 210 of web plate 204, thereby formation conductive pattern 206.At this, can finish by scraper 216 usually and above-mentioned conductive photoreceptor material 202 is coated on step on the Printing screen 204.In addition, conductive photoreceptor material 202 for example is to be formed by the preferable metal mixed of photosensitive material and conductivity.For instance, conductive photoreceptor material 202 for example is with silver, copper or platinum mixes by general common photosensitive material.
From the above, web plate 204 for example be have a plurality of strips open 210, as shown in Figure 3.Therefore, by web plate 204 formed conductive patterns 206 also is the pattern of strip, and in one of the present invention example, the live width a of these conductive patterns 206 for example is between 100 microns to 120 microns, and the spacing between these conductive patterns 206 (spac e) b for example is 100 microns.It should be noted that, open 210 shape and arrangement mode that the present invention does not limit web plate 204 are shown in Figure 3, and the ordinary skill of technical field that the present invention belongs to can be selected the shape and the arrangement mode of the opening 210 of web plate 204 according to the pattern of actual process institute desire formation.
Please refer to Fig. 2 B, on substrate 20, form after the conductive pattern 206, follow web plate 204 by removing on the substrate 20.Then, carry out microphotograph technology with 212 pairs of conductive patterns of light shield 206.Wherein, have a plurality of printing opacity patterns 214 (as shown in Figure 4) on the light shield 212, and these printing opacity patterns 214 can be with desire formation or the pattern of desiring to remove is identical, characteristic on the photosensitive material that carries out microphotograph technology is decided, the ordinary skill of technical field that the present invention belongs to should be understood its details, will not give unnecessary details herein.In the present embodiment, printing opacity pattern 214 for example is identical with the pattern of addressing electrode 15 (see figure 1)s of desire formation.In other words, printing opacity pattern 214 for example is strip and the printing opacity pattern that is parallel to each other.
Please continue B, light shield 212 is arranged at substrate 20 tops, so that each printing opacity pattern 214 all is positioned at conductive pattern 206 tops with reference to Fig. 2.Be mask then, these conductive patterns 206 carried out exposure technology by light source 240 with light shield 212.Afterwards, please refer to Fig. 2 C, light shield 212 is removed from substrate 20 tops, then the conductive pattern 206 after these exposures is carried out developing process, on substrate 20, to form a plurality of conductive structures 230.In the present embodiment, the addressing electrode 15 in these conductive structures 230 plasma display 100 that promptly is Fig. 1.In addition, in one of the present invention example, the live width c of the conductive structure 230 of this place formation for example is 70 microns.And because the live width a of formed conductive pattern 206 is between 100 microns to 120 microns among Fig. 2 A, and spacing b is 100 microns, so spacing (space) d of 230 of these conductive structures then for example is between 100 microns to 200 microns.
Particularly, manufacturing process with plasma display 100 is an example, after the pattern of finishing addressing electrode 15 forms technology, also can carry out sintering process usually, removing the nonmetallic materials (for example being photosensitive material etc.) in the addressing electrode 15, and then improve its conductivity.
Though it should be noted that the foregoing description is that addressing electrode 15 with plasma display shown in Figure 1 100 is that example is done explanation, it is not the manufacturing process that the present invention is defined as the plasma display 100 of Fig. 1.The ordinary skill of technical field that the present invention belongs to should be understood that the present invention also can be applicable in the plasma display of other kenel, for example is to have in trellis (waffle) barrier or the plasma display of cellular (honey comb) barrier.In addition, the present invention also can be applied in other technology that forms conductive structure.In other words, the foregoing description is of the present invention in order to illustrate, is not in order to limit the present invention's range of application.
In sum, the present invention utilizes screen printing technology to form a plurality of larger-size conductive patterns earlier on substrate, carries out microphotograph technology afterwards again, with these conductive patterns of patterning, and then forms the less conductive structure of a plurality of sizes on substrate.Therefore the present invention can have following advantage:
1. only carry out the technology that pattern forms with microphotograph technology and compare with known, the present invention can reduce pattern and form the quantity of material that is removed in the technology, and then saves manufacturing cost.
2. only carry out the technology that pattern forms with screen printing technology and compare with known, the present invention can form comparatively meticulous pattern, therefore can be applicable in the manufacturing process of plasma display of high-resolution.
Though the present invention with preferred embodiment openly as above; right its is not in order to limit the present invention; the ordinary skill of any technical field that the present invention belongs to; in thought that does not break away from the present invention and scope; when can doing a little change and improvement, so the present invention's protection range is as the criterion when looking claims person of defining.
Claims (17)
1. the formation method of the addressing electrode of a plasma display is characterized in that comprising:
The conductive photoreceptor material is provided;
Carry out screen printing technology, bar conductive pattern more than formation is parallel to each other on substrate;
Light shield is provided, this light shield have be parallel to each other more than bar printing opacity pattern;
This light shield is arranged at this substrate top, so that above-mentioned these printing opacity patterns of each of this light shield are arranged in one top of above-mentioned these conductive patterns, wherein the live width of each above-mentioned these printing opacity pattern is less than one the live width of stating on the correspondence in these conductive patterns; And
With this light shield is that mask carries out microphotograph technology to above-mentioned these conductive patterns, to form many addressing electrodes on this substrate.
2. according to the formation method of the addressing electrode of the described plasma display of claim 1, it is characterized in that this conductive photoreceptor material comprises the mixture of metal and photosensitive material.
3. according to the formation method of the addressing electrode of the described plasma display of claim 2, it is characterized in that this conductive photoreceptor material comprises the mixture of copper, platinum or silver and photosensitive material.
4. according to the formation method of the addressing electrode of the described plasma display of claim 1, it is characterized in that after forming above-mentioned these addressing electrodes, also comprising and carrying out sintering process, to remove the nonmetallic materials in above-mentioned these addressing electrodes.
5. according to the formation method of the addressing electrode of the described plasma display of claim 1, it is characterized in that this screen printing technology comprises:
Web plate is arranged on this substrate, and this web plate has a plurality of openings;
This conductive photoreceptor material is coated on this web plate, so that this conductive photoreceptor material flow on this substrate via above-mentioned these openings, to form above-mentioned these conductive patterns, the live width of wherein above-mentioned these conductive patterns is between 100 microns to 120 microns; And
Remove this web plate.
6. according to the formation method of the addressing electrode of the described plasma display of claim 1, it is characterized in that this screen printing technology comprises:
Web plate is provided, and this web plate has a plurality of openings; And
This conductive photoreceptor material is coated on this web plate, so that this conductive photoreceptor material flow on this substrate via above-mentioned these openings, to form above-mentioned these conductive patterns, distance (space) is 100 microns between wherein above-mentioned these conductive patterns.
7. according to the formation method of the addressing electrode of the described plasma display of claim 1, it is characterized in that being that mask carries out microphotograph technology to above-mentioned these conductive patterns and forms in the step of above-mentioned these addressing electrodes with this light shield, comprise that making between above-mentioned these addressing electrodes apart from (space) is 200 microns.
8. according to the formation method of the addressing electrode of the described plasma display of claim 1, it is characterized in that comprising that being that mask carries out microphotograph technology to above-mentioned these conductive patterns and forms in the step of above-mentioned these addressing electrodes with this light shield the live width that makes above-mentioned these addressing electrodes is 70 microns.
9. the formation method of a conductive structure is suitable for forming a plurality of conductive structures on substrate, it is characterized in that the formation method of above-mentioned these conductive structures comprises:
The conductive photoreceptor material is provided;
Carry out screen printing technology, form a plurality of conductive patterns so that this conductive photoreceptor material is arranged on the substrate; And
Carry out microphotograph technology, form a plurality of conductive structures with above-mentioned these conductive patterns of patterning.
10. according to the formation method of the described conductive structure of claim 9, it is characterized in that this microphotograph technology comprises:
Light shield is provided, and this light shield has a plurality of printing opacity patterns;
This light shield is arranged at this substrate top, so that above-mentioned these printing opacity patterns of each of this light shield are arranged in one top of above-mentioned these conductive patterns, wherein each above-mentioned these printing opacity pattern is less than one that states on the correspondence in these conductive patterns;
With this light shield is that mask exposes to above-mentioned these conductive patterns;
Develop to stating these conductive patterns on exposing, to form above-mentioned these conductive structures.
11., it is characterized in that this screen printing technology comprises according to the formation method of the described conductive structure of claim 9:
Web plate is arranged on this substrate, and this web plate has a plurality of openings;
This conductive photoreceptor material is coated on this web plate, so that this conductive photoreceptor material flow on this substrate via above-mentioned these openings, to form above-mentioned these conductive patterns, the live width of wherein above-mentioned these conductive patterns is between 100 microns to 120 microns; And
Remove this web plate.
12., it is characterized in that this screen printing technology comprises: comprising according to the formation method of the described conductive structure of claim 9:
Web plate is provided, and this web plate has a plurality of openings;
This conductive photoreceptor material is coated on this web plate, so that this conductive photoreceptor material flow on this substrate via above-mentioned these openings, to form above-mentioned these conductive patterns, distance (space) is 100 microns between wherein above-mentioned these conductive patterns; And
Remove this web plate.
13., it is characterized in that above-mentioned these conductive patterns of patterning comprise that with the step that forms above-mentioned these conductive structures the spacing (space) that makes above-mentioned these conductive structures is 200 microns according to the formation method of the described conductive structure of claim 9.
14., it is characterized in that above-mentioned these conductive patterns of patterning comprise that with the step that forms above-mentioned these conductive structures the live width that makes above-mentioned these conductive structures is 70 microns according to the formation method of the described conductive structure of claim 9.
15., it is characterized in that this conductive photoreceptor material comprises the mixture of metal and photosensitive material according to the formation method of the described conductive structure of claim 9.
16., it is characterized in that this conductive photoreceptor material comprises the mixture of copper, platinum or silver and photosensitive material according to the formation method of the described conductive structure of claim 15.
17., it is characterized in that after forming above-mentioned these conductive structures, also comprising and carrying out sintering process, to remove the nonmetallic materials in above-mentioned these conductive structures according to the formation method of the described conductive structure of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100915810A CN100477057C (en) | 2004-11-19 | 2004-11-19 | Forming method of addressing electrode and conducting structure for plasma display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100915810A CN100477057C (en) | 2004-11-19 | 2004-11-19 | Forming method of addressing electrode and conducting structure for plasma display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1779885A true CN1779885A (en) | 2006-05-31 |
| CN100477057C CN100477057C (en) | 2009-04-08 |
Family
ID=36770143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100915810A Expired - Fee Related CN100477057C (en) | 2004-11-19 | 2004-11-19 | Forming method of addressing electrode and conducting structure for plasma display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100477057C (en) |
-
2004
- 2004-11-19 CN CNB2004100915810A patent/CN100477057C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN100477057C (en) | 2009-04-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1344005A (en) | Plasma displaying panel and mfg. method thereof | |
| CN1512222A (en) | Liquid crystal display device and its producing method | |
| CN1728321A (en) | Electron emission device and method of manufacturing | |
| CN1293411C (en) | Manufacture for photosensitive insulating film pattern and reflection electrode and its liquid crystal display device | |
| CN1750229A (en) | Electron emission device and manufacturing method for the same | |
| CN1779885A (en) | Forming method of addressing electrode and conducting structure for plasma display device | |
| CN1301526C (en) | Plasma display panel | |
| CN1855346A (en) | Method for manufacturing electrodes of a plasma display panel | |
| CN1624857A (en) | Plasma display panel and method of manufacturing the same | |
| CN1218353C (en) | Electrode structure of plasma display | |
| CN1797666A (en) | Plasma display apparatus | |
| CN100341096C (en) | Plasma display panel having align marks, and method and apparatus for forming align marks | |
| CN101051584A (en) | Field emission type backlight unit and method of manufacturing the same | |
| CN1604263A (en) | Plasma display panel and method of manufacturing the same | |
| CN1819102A (en) | Plasma display panel and method of manufacturing the same | |
| CN1836304A (en) | Plasma display panel manufacturing method | |
| CN1916714A (en) | Patternized technique and contact window | |
| CN1797659A (en) | Method for forming barrier between patternized film layer and plasma display | |
| CN1862751A (en) | Method for manufacturing barrier ribs of a plasma display panel | |
| CN1244952C (en) | Fluorescent light luminotron and its manufacturing method | |
| CN1796108A (en) | Printing shadow masking, printing technique and method for improving ratio between side and bottom | |
| CN1622258A (en) | Plasma display panel | |
| CN1630015A (en) | Electron emission device and method of manufacturing the same | |
| CN1841624A (en) | Plasma display and its front substrate and method for producing front substrate of plasma display | |
| CN1725425A (en) | Electron emission display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090408 Termination date: 20121119 |