CN1778983A - Multi-layer nanometer film coater for reinforcing mould surface - Google Patents
Multi-layer nanometer film coater for reinforcing mould surface Download PDFInfo
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- CN1778983A CN1778983A CN 200510083078 CN200510083078A CN1778983A CN 1778983 A CN1778983 A CN 1778983A CN 200510083078 CN200510083078 CN 200510083078 CN 200510083078 A CN200510083078 A CN 200510083078A CN 1778983 A CN1778983 A CN 1778983A
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Abstract
A multi-layer coated equipment in nanometer level which consists of the following parts: evacuated chamber, cylinder framework for clapboard with aperture, at least four pieces of clapboards which were fixed on cylinder framework, dividing the evacuated chamber into at least four disconnecting chambers, central pump-line with aperture , at least two evaporating plants and one ion source which were fixed on evacuated chamber wall, at least four work rests each of which was fixed in one disconnecting chamber separately, single-core multi-spindle magneto fluid gearing and bleeding point. All the clapboards, cylinder framework and work rests can do synchronous revolution by sharing one revolution axis. This equipment can be used to deposit multilayer membrane in nanometer level and to modulate membrane composition and thickness. Advantages are component singleness in each membrane and sharp and clear interface among different membranous layers. It can be used in surface peening of die and other parts.
Description
Technical field
But the present invention relates to a kind of film coating apparatus that is used for the depositing nano multilayer film of reinforcing mould surface.
Background technology
Physical vapor deposition is applied to the every field of national economy in large quantities as a kind of advanced person's material surface modifying technology.Recent two decades comes to have obtained using widely at decoration industry based on the unitary film of TiN.The fast development of Chinese manufacturing has proposed more and more higher requirement to machine-shaping instruments such as instrument, mould and other component of machine at aspects such as hardness, wear resistancies, and the rete of single component often can not reach these requirements.Because multilayer film comprises the rete that two or more material forms, therefore often be better than single rete at hardness, wear resistance, shock resistance, aspect such as corrosion-resistant.Announced a kind of nitrided case among the patent CN1156598C, the MULTILAYER COMPOSITE membrane structure that 2 microns TiN layer and 1.5 microns TiCN layer constitute by the 150-180 micron.Announced the MULTILAYER COMPOSITE membrane structure that rete and middle transitional layer by any two kinds of compositions among TiN, TiCN, TiAlN and the TiAlCN constitute among the patent US6558749B2, their performance all is better than single rete.
Nano-multilayer film is by two or more the material multilayer film that form of growth alternately on the yardstick of nanometer, and its composition and (or) Adjustable structure system.By changing and controlling diaphragm layer material, modulation period and modulation ratio, can prepare different nano-multilayer films.In some nanometer multilayer membrane structure, because superhard effect (superhardness) can appear in the difference between the parameters such as Young's modulus, lattice parameter, state of interface, dislocation energy between the different retes.Since (W.M.C.Yang after at first finding the superhard effect of metal/metal nano-multilayered structures in 1977 such as Yang, T.Tsakalakos, and J.E.Hilliard.Enhanced elastic modulus in composition-modulated gold-nickel and copper-palladium foils.J.Appl.Phys.48,876-879,1977), metal/ceramic (K.K.Shih and D.B.Dove.Ti/Ti-N Hf/Hf-N andW/W-N multilayer films with high mechanical hardness.Appl.Phys.Lett.61 (6), 654-656,1992), pottery/pottery (M.L.Wu, W.D.Qian, Y.W.Chung, et al.Superhard coatings of CNx/ZrN multilayersprepared by DC magnetron sputtering.Thin Solid Films.308-309,113-117,1997) the superhard effect of nano-multilayered structures is also by corresponding discovery.
The discovery of nano superhard effect provides a brand-new direction to surface engineering technology.Studies show that rete the nano superhard effect occurs and need possess following condition: at first must form clear sharp-pointed interface between each rete, the graded of composition can make interface width increase on the interface, and the increase of interface width can seriously reduce the mechanical property (X.Chu of nano-multilayer film, S.A.Barnett.Model of superlattice yield stress and hardness enhancements.J.Appl.Phys.77,4403-4411,1995).Secondly, the modulation period of nano-multilayer film must be in certain scope.Dislocation theory and relevant result of study (W.M.C Yang and M.L.Wu) show, according to the difference of aspects such as nano-multilayer film film set member, modulation ratio, interface width, comparatively tangible superhard effect can appear in multilayer film when be the 3-20 nanometer modulation period generally speaking.
Provide a kind of among the patent US5330853 and formed the TiAlNx/TiAlNy multilayer film, yet be 1 micron its modulation period, differs greatly with 3-20 nanometer modulation period of the superhard effect of common generation nano-multilayer film by the control nitrogen atmosphere.All adopt linear fashion transmission workpiece among patent US5340454 and the JP2004255285, and vacuum chamber is separated into some interference-free each other spaces with dividing plate.When workpiece in different spaces during transmission, can the deposit multilayer film.But its objective is the functional film layer of deposit multilayer, rather than composition or structure has the nano superhard rete that periodically alternately changes.Announced among the patent CN1530459A a kind of in same vacuum chamber the equipment of depositing nano multilayer film, the target of the heterogeneity of some cross-distribution wherein is housed, by generating the multi-layer nano composite membrane to the machinery control of workpiece revolution transmission and the electrical control of different target sedimentation rates.Yet the phase mutual interference meeting of different targets when deposition makes and can't form clear sharp-pointed interface between the different retes, and the increase of interface width can seriously reduce the performance of nano-multilayer film.In addition, this patent also can only adopt allogeneic reaction atmosphere, can't metal refining/pottery or need pottery/ceramic membrane system of differential responses atmosphere.The method of the rete of the adjustable system of a kind of similar deposition composition also is provided among the patent US5750207, but the mutual interference problem still can't solve different target plated film the time, and can only feed allogeneic reaction gas.Announced a kind of method control target steam output by the setting pulse number among the patent CN1616707A, but when alternately or order is opened or when closing evaporation source and the depositing nano multilayer film.Yet close and have remaining metal ion in the evaporation source final vacuum chamber, these ions will inevitably cause the pollution on the composition when opening next evaporation source plated film, thereby can't deposit the multilayer film with clear interface.This patent also can only adopt allogeneic reaction gas in addition.If add to vacuumize together operation in the gap therein in order to reduce the mutual interference of target composition phase, but can greatly reduce production efficiency.Relate to the preparation technology of two kinds of super hard nano multilayer films among patent CN1470671A and the CN200410053490.8, yet do not related to the structure of any preparation facilities.
Summary of the invention:
The object of the present invention is to provide a kind of device that can prepare nano-multilayer film with superhard effect.Nano-multilayer films such as this device energy metal refining/metal, metal/ceramic and pottery/pottery also can be modulated membranous layer ingredient and thickness, and each membranous layer ingredient is single in the multilayer film of formation, can form clear sharp-pointed interface between the different retes.In addition, breadboard limitation can be thoroughly broken away from particular structure and transmission design, is beneficial to the industrial production of mass-producing.
In order to achieve the above object, the invention provides a kind of multi-layer nanometer film coater that is used for the tool and mould field, it comprises: vacuum chamber; Round shape membrane support frame is arranged in the vacuum chamber; At least four dividing plates are installed on the round shape membrane support frame and with vacuum chamber and are separated at least four insulated chambers; The center extraction pipe is arranged in the described round shape membrane support frame; At least two evaporation units are arranged on the wall of described vacuum chamber, and the insulated chamber at any two evaporation unit places is non-conterminous; Ion source is arranged on the wall of described vacuum chamber, is not in together in the insulated chamber with any described evaporation unit; At least four work rests, each work rest are installed on respectively in the independently described insulated chamber, and described work rest, described dividing plate and described round shape membrane support frame can rotate synchronously around same hollow shaft; The concentric multiaxis transmission mechanism of magnetic current sealing is installed on the top or the bottom of described vacuum chamber, and outward introduces vacuum chamber in by described vacuum chamber power; Bleeding point is arranged at a side relative with the concentric multiaxis transmission mechanism of described magnetic current sealing and is connected with the center extraction pipe.
On the described round shape membrane support frame at least four openings are arranged.
At least two first openings and two second openings are arranged on the extraction pipe of described center.Wherein first opening is corresponding with evaporation unit, and second interleaved openings is interspersed between first opening, and second port area is greater than first port area.
Described evaporation unit comprises magnetron sputtering target, cathode arc target etc.
Each described evaporation unit also comprises independently airing system.
Described ion source can adopt point-like or linear Hall source, Kaufman source or ICP source etc.
The axis of rotation is installed on the described work rest one time, or the secondary axis of rotation also is installed on demand.
Many rotating speed adjustable motors are installed outside described vacuum chamber, and the power of described motor is introduced in the described vacuum chamber by the concentric multiaxis transmission mechanism of described magnetic current sealing and is passed to described hollow shaft, axis of rotation and the secondary axis of rotation by gear, bearing etc.
Description of drawings
Fig. 1 is the vacuum chamber vertical view of the film coating apparatus of the embodiment of the invention 1;
Fig. 2 is the vacuum chamber vertical view of the film coating apparatus of the embodiment of the invention 2.
Embodiment
Below in conjunction with accompanying drawing the present invention is further described.
Embodiment 1:
As shown in Figure 1, door for vacuum chamber 17, ion source 9, first evaporation unit 4 and second evaporation unit 14 are installed on the vacuum-chamber wall 16.Wherein all is furnished with independently airing system on each evaporation unit.Round shape membrane support frame 3 and a plurality of dividing plate 7 are housed in the vacuum chamber, and round shape membrane support frame 3 and dividing plate 7 are divided into four insulated chambers 10 with vacuum chamber.Four openings 6 are arranged on the round shape membrane support frame 3.Be provided with center extraction pipe 2 in the round shape membrane support frame 3, two first openings 15 and two second openings 11 are arranged on the center extraction pipe 2.Wherein first opening 15 is corresponding with evaporation unit, second opening, 11 staggered being interspersed between first opening 15, and second opening, 11 areas are greater than first opening, 15 areas.Be separately installed with work rest 5 in each insulated chamber 10.Work rest 5, dividing plate 7 and round shape membrane support frame 3 can be equipped with on the work rest 5 on 1, axis of rotation 1 of an axis of rotation workpiece can be installed around same hollow shaft 12 rotations.The vacuum chamber top is equipped with the concentric twin shaft transmission mechanism 8 of magnetic current sealing, this device is positioned at the outer part of vacuum chamber and is connected with two rotating speed adjustable motors, the part that this device is positioned at vacuum chamber by transmission components such as gear, bearings with transmission of power to hollow shaft 12 and an axis of rotation 1, and the rotating speed of two axles can carry out independent control by the combination of two rotating speed of motor.Center extraction pipe 2 is positioned at the one end sealing of vacuum chamber top, is positioned at vacuum chamber bottom one termination bleeding point 13.
Working method following (is example with depositing TiN/SiC nano-multilayer film) during plated film:
The Ti target is installed on first evaporation unit 4, and the Si target is installed on second evaporation unit 14.
Open door for vacuum chamber 17, load workpiece.Close door for vacuum chamber 17, be evacuated to required vacuum tightness.Workpiece cleans on 9 pairs of work rests 5 of unlatching ion source, can keep a certain rotation rotating speed of work rest 5 in cleaning process according to the concrete shape of workpiece.Other work rest 5 that will not clean after cleaning finishes rotates to ion source 9 correspondence positions and cleans workpiece on this work rest.Repeating this is operated to all workpiece cleaning and finishes.Then, the airing system by first evaporation unit 4 feeds N
2, feed C by the airing system of second evaporation unit 14
2H
2, open two evaporation units simultaneously and begin plated film.Can keep a certain rotation rotating speed of work rest 5 according to the particular case of workpiece in the coating process.Simultaneously can by control separately evaporation unit and the parameter of airing system, control the thickness of rete independently.During plated film, keep all insulated chambers are bled by bleeding point 13.When the first layer film thickness reaches desirable value, two other work rests without plated film are rotated to two evaporation unit correspondence positions, repeat the nanometer multilayer film thickness of this operation on workpiece and reach desirable value.
Two evaporation units of being furnished with the independent gas supply system and four work rest in insulated chamber 10 independently is installed in the film coating apparatus of present embodiment.The insulated chamber at two evaporation unit places is non-conterminous, therefore the workpiece on the work rest experiences an evacuation process in not corresponding with evaporation unit insulated chamber between depositing TiN and SiC film, can discharge metal vapors and the reactant gases of a plated film interior remnants of insulated chamber in the cycle effectively, thereby reduce of the influence of a last coating process dramatically next coating process.In addition, because second opening, 11 areas are greater than first opening, 15 areas, the lower air pressure that evacuation process causes can also reduce the phase mutual interference of the metal vapors and the reactant gases of two different coating process that carry out simultaneously effectively.Present embodiment plated film efficient height is suitable for the mass-producing nanometer multilayer surface strengthening of the comparatively single mould of plated film planar orientation, large-scale instrument, large parts.
Embodiment 2:
As shown in Figure 2, two door for vacuum chamber 28, two ion sources 22, first evaporation unit 19, second evaporation unit 24, the 3rd evaporation unit 29 and the 4th evaporation units 36 are installed on the vacuum-chamber wall 35.Wherein all is furnished with independently airing system on each evaporation unit.Round shape membrane support frame 25 and a plurality of dividing plate 23 are housed in the vacuum chamber, and round shape membrane support frame 25 and dividing plate 23 are divided into eight insulated chambers 21 with vacuum chamber.A plurality of openings 27 are arranged on the round shape membrane support frame 25.Be provided with center extraction pipe 33 in the round shape membrane support frame 25, four first openings 30 and four center extraction pipe second openings 32 are arranged on the center extraction pipe 33.Wherein first opening 30 is corresponding with evaporation unit, second opening, 32 staggered being interspersed between first opening 30, and second opening, 32 areas are greater than first port area 30.Be separately installed with work rest 34 in each insulated chamber 21.Work rest 34, dividing plate 23 and round shape membrane support frame 25 can be around 20 rotations of same hollow shaft, and the axis of rotation 18 and the secondary axis of rotation 37 are housed on the work rest 34, on the secondary axis of rotation 37 workpiece can be installed.The vacuum chamber top is equipped with the concentric three-axle gear 26 of magnetic current sealing, this device is positioned at the outer part of vacuum chamber and is connected with three rotating speed adjustable motors, the part that this device is positioned at vacuum chamber by transmission components such as gear, bearings with transmission of power to hollow shaft 20, the axis of rotation 18 and the secondary axis of rotation 37, and the rotating speed of three axles can carry out independent control by the combination of three rotating speed of motor.Center extraction pipe 33 is positioned at the one end sealing of vacuum chamber top, is positioned at vacuum chamber bottom one termination bleeding point 31.
Working method following (is example with depositing TiN/SiC nano-multilayer film) during plated film:
The Ti target is installed on first evaporation unit 19 and the 3rd evaporation unit 29, the Si target is installed on second evaporation unit 24 and the 4th evaporation unit 36.
Open door for vacuum chamber 28, load workpiece.Close door for vacuum chamber 28, vacuum chamber is evacuated to required vacuum tightness by bleeding point 31.The workpiece of opening on 22 pairs of two work rests 34 of ion source cleans, and keeps work rest 34 certain a rotation and secondary rotation rotating speed in the cleaning process.Other work rest 34 that will not clean after cleaning finishes rotates to ion source 22 correspondence positions and cleans workpiece on it.Repetitive operation to all workpiece cleaning finish.Airing system by first evaporation unit 19 and the 3rd evaporation unit 29 feeds N then
2, feed C by the airing system of second evaporation unit 24 and the 4th evaporation unit 36
2H
2, open four evaporation units simultaneously and begin plated film.Can keep work rest 34 certain a rotation and secondary rotation rotating speed according to the needs of workpiece plated film in the coating process, simultaneously can by control separately evaporation unit and the parameter of airing system, control the thickness of rete independently.During plated film, keep all insulated chambers are bled by bleeding point 31.When the first layer film thickness reaches desirable value, rotate to the correspondence position of four evaporation units with four without other work rest of plated film, repeat the nanometer multilayer film thickness of this operation on workpiece and reach desirable value.
Four evaporation units of being furnished with the independent gas supply system and eight work rest in insulated chamber 21 independently is installed in the film coating apparatus of present embodiment.The insulated chamber at any two evaporation unit places is non-conterminous, therefore the workpiece on the work rest experiences an evacuation process in not corresponding with evaporation unit insulated chamber between depositing TiN and SiC film, can discharge metal vapors and the reactant gases of a plated film interior remnants of insulated chamber in the cycle effectively, thereby reduce of the influence of a last coating process dramatically next coating process.In addition, because second opening, 32 areas are greater than first port area 30, the lower air pressure that evacuation process causes can also reduce the phase mutual interference of the metal vapors and the reactant gases of two different coating process that carry out simultaneously effectively.Present embodiment plated film efficient height is suitable for the mass-producing nanometer multilayer surface strengthening of the comparatively single mould of plated film planar orientation, large-scale instrument, large parts.
Claims (10)
1, a kind of multi-layer nanometer film coater that is used for the tool and mould field is characterized in that, comprises:
Vacuum chamber;
Round shape membrane support frame is arranged in the vacuum chamber;
At least four dividing plates are installed on the round shape membrane support frame and with vacuum chamber and are separated at least four insulated chambers;
The center extraction pipe is arranged in the described round shape membrane support frame;
At least two evaporation units are arranged on the wall of described vacuum chamber, and the insulated chamber at any two evaporation unit places is non-conterminous;
Ion source is arranged on the wall of described vacuum chamber, is not in together in the insulated chamber with any described evaporation unit;
At least four work rests, each work rest are installed on respectively in the independently described insulated chamber, and described work rest, described dividing plate and described round shape membrane support frame can rotate synchronously around same hollow shaft;
The concentric multiaxis transmission mechanism of magnetic current sealing is installed on the top or the bottom of described vacuum chamber, and outward introduces vacuum chamber in by described vacuum chamber power;
Bleeding point is arranged at a side relative with the concentric multiaxis transmission mechanism of described magnetic current sealing and is connected with the center extraction pipe.
2, film coating apparatus according to claim 1 is characterized in that, on the described round shape membrane support frame at least four openings is arranged.
3, film coating apparatus according to claim 1 is characterized in that, at least two first openings and two second openings are arranged on the extraction pipe of described center.Wherein first opening is corresponding with evaporation unit, and second interleaved openings is interspersed between first opening, and second port area is greater than first port area.
4, film coating apparatus according to claim 1 is characterized in that, described evaporation unit comprises magnetron sputtering target, cathode arc target etc.
5, film coating apparatus according to claim 1 is characterized in that, each described evaporation unit also comprises independently airing system.
6, film coating apparatus according to claim 1 is characterized in that, described ion source can adopt point-like or linear Hall source, Kaufman source or ICP source etc.
7, film coating apparatus according to claim 1 is characterized in that, the axis of rotation is installed on the described work rest one time.
8, film coating apparatus according to claim 7 is characterized in that, the secondary axis of rotation also is installed on the described work rest.
9, film coating apparatus according to claim 1, it is characterized in that, many rotating speed adjustable motors are installed outside described vacuum chamber, and the power of described motor is introduced in the described vacuum chamber by the concentric multiaxis transmission mechanism of described magnetic current sealing and is passed to described hollow shaft, axis of rotation and the secondary axis of rotation by transmission component.
10, film coating apparatus according to claim 7 is characterized in that, described transmission mechanism comprises gear, bearing.
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2005100830785A CN100398691C (en) | 2005-07-14 | 2005-07-14 | Multi-layer nanometer film coater for reinforcing mould surface |
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| CNB2005100830785A CN100398691C (en) | 2005-07-14 | 2005-07-14 | Multi-layer nanometer film coater for reinforcing mould surface |
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| CN1778983A true CN1778983A (en) | 2006-05-31 |
| CN100398691C CN100398691C (en) | 2008-07-02 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101942647A (en) * | 2010-06-09 | 2011-01-12 | 黄峰 | Structure of coated process chamber |
| CN102181923A (en) * | 2011-04-28 | 2011-09-14 | 浙江昀丰新能源科技有限公司 | Vapor phase epitaxy device and vapor phase epitaxy method |
| CN102877026A (en) * | 2012-09-27 | 2013-01-16 | 中国科学院长春光学精密机械与物理研究所 | Vacuum depositing device for multilayer film devices |
| CN108677160A (en) * | 2018-08-13 | 2018-10-19 | 武汉科瑞达真空科技有限公司 | A kind of new type of continuous coating film production line based on public rotation loading pallet |
| CN109338319A (en) * | 2018-11-02 | 2019-02-15 | 太原理工大学 | A method of improving carbide surface titanium aluminium nitrogen coating obdurability |
| CN109898062A (en) * | 2019-03-07 | 2019-06-18 | 厦门阿匹斯智能制造系统有限公司 | A kind of magnetic-controlled sputtering coating equipment and film plating process |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2525100Y (en) * | 2001-04-20 | 2002-12-11 | 北京长城钛金公司 | New cathode electric arc ion film coating device |
| JP3873935B2 (en) * | 2003-06-18 | 2007-01-31 | セイコーエプソン株式会社 | Ferroelectric memory device |
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- 2005-07-14 CN CNB2005100830785A patent/CN100398691C/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101942647A (en) * | 2010-06-09 | 2011-01-12 | 黄峰 | Structure of coated process chamber |
| CN102181923A (en) * | 2011-04-28 | 2011-09-14 | 浙江昀丰新能源科技有限公司 | Vapor phase epitaxy device and vapor phase epitaxy method |
| CN102877026A (en) * | 2012-09-27 | 2013-01-16 | 中国科学院长春光学精密机械与物理研究所 | Vacuum depositing device for multilayer film devices |
| CN102877026B (en) * | 2012-09-27 | 2014-12-24 | 中国科学院长春光学精密机械与物理研究所 | Vacuum depositing device for multilayer film devices |
| CN108677160A (en) * | 2018-08-13 | 2018-10-19 | 武汉科瑞达真空科技有限公司 | A kind of new type of continuous coating film production line based on public rotation loading pallet |
| CN108677160B (en) * | 2018-08-13 | 2020-12-29 | 武汉科瑞达真空科技有限公司 | Continuous coating production line based on revolution and rotation loading tray |
| CN109338319A (en) * | 2018-11-02 | 2019-02-15 | 太原理工大学 | A method of improving carbide surface titanium aluminium nitrogen coating obdurability |
| CN109898062A (en) * | 2019-03-07 | 2019-06-18 | 厦门阿匹斯智能制造系统有限公司 | A kind of magnetic-controlled sputtering coating equipment and film plating process |
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