CN1777688A - Gold alloy and method for manufacturing a dental restoration - Google Patents

Gold alloy and method for manufacturing a dental restoration Download PDF

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Publication number
CN1777688A
CN1777688A CNA2004800104151A CN200480010415A CN1777688A CN 1777688 A CN1777688 A CN 1777688A CN A2004800104151 A CNA2004800104151 A CN A2004800104151A CN 200480010415 A CN200480010415 A CN 200480010415A CN 1777688 A CN1777688 A CN 1777688A
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China
Prior art keywords
alloy
weight
porcelain
gold
temperature
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CNA2004800104151A
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Chinese (zh)
Inventor
约瑟夫·马里亚·范德泽尔
特奥多鲁斯·雅各布斯·格林威斯
巴斯蒂安·菲利普·范戴克
阿德里亚努斯·雅各布斯·德威特
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Elephant Dental BV
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Elephant Dental BV
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Publication of CN1777688A publication Critical patent/CN1777688A/en
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
    • A61K6/00—Preparations for dentistry
    • A61K6/80—Preparations for artificial teeth, for filling teeth or for capping teeth
    • A61K6/802—Preparations for artificial teeth, for filling teeth or for capping teeth comprising ceramics
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
    • A61K6/00—Preparations for dentistry
    • A61K6/80—Preparations for artificial teeth, for filling teeth or for capping teeth
    • A61K6/84—Preparations for artificial teeth, for filling teeth or for capping teeth comprising metals or alloys
    • A61K6/844—Noble metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

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  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Engineering & Computer Science (AREA)
  • Veterinary Medicine (AREA)
  • Materials Engineering (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Epidemiology (AREA)
  • Plastic & Reconstructive Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Dental Prosthetics (AREA)
  • Ceramic Products (AREA)
  • Dental Preparations (AREA)

Abstract

The present invention relates to an alloy with a high gold content. This alloy preferably comprises more than 99 wt.% gold. Further, the invention relates to a method for manufacturing a metal-ceramic dental restoration by pressing on or firing on of a suitable porcelain. The porcelains used here have a certain maximum processing temperature and a coefficient of thermal expansion in a certain range.

Description

Au-alloy and prepare the method for dental restoration
Technical field
The present invention relates to a kind of au-alloy, more specifically relate to au-alloy with high gold content.The invention still further relates to a kind of method that is used to prepare gold-ceramic tooth restoration.
Background technology
In decades, the au-alloy with high gold content has been used for dental restoration, particularly because their biological and chemical inertia, and their attracting deep yellow.
For aesthetic reasons, these alloys are fired with porcelain.This porcelain by manual construction in layer.In the last few years, pottery also was pressed (pressed on).This compaction procedure may further comprise the steps: have or do not have the scumbling coating, utilize press ceramic (press ceramic) to suppress (press over) from the supporting structure thing of metal alloy by " lost-wax process ".Burn or the dry process of falling wax in use many alloys, long-time heating under relatively-high temperature simultaneously, thus make and on alloy, form thick oxide layers.In many cases, this oxide skin causes dark-coloured edge or profile.
From aesthetic view point, need take a plurality of steps so that on metal alloy structure, form the least possible oxide compound.
Yet,, be starved of oxide skin in order between press ceramic and metal alloy structure, to have good joint.
Therefore, need a kind of high gold-content alloy, its solidus temperature is enough high with respect to the application temperature of pottery, and firing temperature or the press temperature than pottery or porcelain is high 50 ℃ usually, when heating, this alloy forms oxide skin in air, this layer for wait to fire or engaging of porcelain to be pressed is necessary, and this oxide skin is visible hardly or invisible fully.
Summary of the invention
According to the present invention, alloy with high gold content, i.e. so-called " high gold-content alloy " have been had been found that, keep yellow after its oxidation, this alloy is suitable for the metal-ceramic system, in this system, use the tooth that is customized on the au-alloy to fire or suppress and have aesthstic xanchromatic au-alloy with pottery or porcelain.In addition, alloy of the present invention has the biocompatibility of height.
In the gold base thing, alloy of the present invention comprises the zinc of 0.01-0.05 weight %; 0.01-0.05 the indium of weight %; 0.01-0.05 the manganese of the silver of weight % and 0.01-0.05 weight %.
The gold base thing is made up of gold basically, but can contain a spot of pollutent, as long as they do not produce negative color effects and do not influence biocompatibility.
In preferred embodiments, alloy of the present invention comprises the gold of at least 99 weight %.Fit closely alloy is made up of the gold of 99.80 weight %, the zinc of 0.05 weight %, the indium of 0.05 weight %, the silver of 0.05 weight % and the manganese of 0.05 weight % basically.
Use high gold-content alloy of the present invention, have been found that and itself and ceramic sintering or compacting can be able to be kept intensive gold color simultaneously.
That alloy of the present invention provides is stable, as thin as a wafer, may monomolecular oxide skin, its very slight color is not so produce bad color effects.Yet, the alloy below zone of oxidation enough engages doughtily, and show the joint that can have good metal-pressed glass or metal-porcelain.
Particularly, the existence of manganese provides good joint.Tin and indium are guaranteed the enhancement of oxide compound.Incidentally, au-alloy of the present invention does not have very high intensity, but have been found that this for the application of this alloy not necessarily.
The solidus temperature of alloy of the present invention is 1030-1100 ℃; For preferred alloy, solidus temperature is 1045-1065 ℃.For alloy of the present invention, thermal expansivity (25-500 ℃ of measurement) is m/m. ℃ of 14.5-15.5 μ; To preferred alloy is m/m. ℃ of 14.8-15.3 μ.
High gold-content alloy has been known in the art.For example, DE-OS 4419408 has described a kind of dental alloy, and it has the gold of 95-98 weight %; The titanium of 1-4 weight %; And one or more of 0.05-1.5 weight % are selected from the element of Re, Rh, Ru, Ir and Ta.
Moreover, US-A-5,922,276 relate to a kind of dental alloy with good oxide color, and this alloy comprises the gold of at least 99.5 weight %, the zinc of 0.1-0.25 weight %, the indium of 0.1-0.25 weight % and Rt, Pd, RH, Ir, Re or their combination of the highest 0.3 weight %.It clearly states should avoid such as elements such as copper, manganese and iron, because they produce dark-coloured and colored oxide compound.
In addition, the present invention relates to a kind of method for preparing the metal-ceramic tooth with restoration, comprise utilizing and add the pressed glass of hot pressing color of teeth to the whole or part supporting structure thing that obtains by alloy of the present invention, at 25 to 500 ℃ or to the scope of glass transition temperature (by Schwellenwert decision between the two) during measurement, the thermal expansivity of described pressed glass (CTE) is 12.5-14.5km/m.K, be preferably 13.0-14.5km/m.K, and the press temperature of described pressed glass is for being lower than at least 50 ℃ of described alloy solidus temperatures.
In this method, in by the mould of " lost-wax process " preparation, utilize heating to suppress described pressed glass.Such method is more effective and economical than the ordinary method of in layer using porcelain.In addition, compare, during pressing form less bubble and crackle with applied layer in layer.Also have, alloy of the present invention also can use this ordinary method to apply.
More specifically, in drawing method of the present invention, the wax-pattern tool that makes one or more teeth and/or grind one's teeth in sleep is embedded in this mould among the Carrara  (coming from Elephant Dental B.V., The Netherl) of refractory materials such as Universal DustlessInvestment.Then, after solidifying the punch die that makes by refractory materials, with the wax after-flame.After this, the pressed glass bead with closure on connecting passage adds in the punch die, and this is by suppressing glass in wherein adding with having thermoplastic fire-resistant cylinder.In this punch die, the structure of high gold-content alloy of the present invention exists as described.This structure can for example form by CAD/CAM approach.
Preferably, pressed glass can obtain with color of teeth.The painted of porcelain is known to those skilled in the art.Described the method that is fit in DE-OS-1999 04 522, the document is interpreted as inserting in this specification sheets, to be used to describe staining method.
In preferred embodiments, before compacting, at first so-called lining is administered on the alloy.This lining has the fusing point than low 50 ℃ of the press temperature of suppressing glass usually.The lining that is fit to is by the SiO of 58.5 weight % 2, 12.6 weight % Al 2O 3, 11.0 weight % K 2The Na of O, 7.1 weight % 2The CeO of O, 10.4 weight % 2, 0.4 weight % LiO 2Form.The independent coating that this lining can be used as 20-40 μ m thickness is used and is burnt at about 900 ℃.
The pressed glass that is fit to can have following (preferably) composition: the Al of 7-15 weight % 2O 3, 13-23 weight % (K 2O+Na 2O), (Sb of 1-3 weight % (BaO+CaO), 1-3 weight % 2O 3+ Li 2O) and the fluorine of 0.2-1.2 weight %, surplus is the SiO that comprises colouring component 2
The powder that is formed by these glass compositions preferably has the granularity less than 106 μ m.This powder binding agent granulation, and the dry compacting of single shaft at room temperature, then for example 800-1000 ℃, preferred 900-960 ℃ sintering temperature 1 minute to 1 hour, preferred 1-30 minute.
In addition, the present invention relates to a kind of method for preparing the metal-ceramic dental restoration, it comprises fires tooth on the supporting structure thing that the alloy of one of claim 1-3 according to the present invention makes with porcelain, described porcelain is 12.5-14.5 μ m/m.K at 25 to 500 ℃ or the thermal expansivity measured to the scope of glass transition temperature (by Schwellenwert decision between the two), and the firing temperature of described porcelain hangs down at least 50 ℃ than the solidus temperature of this alloy.The firing ceramics that is fit to has following (preferably) composition: the SiO of 64.1-67.0% 2, 11.0-12.5% Al 2O 3, 10.1-11.6% K 2The Na of O, 6.6-8.6% 2The Sb of the CaO of O, 0.7-1.1%, the BaO of 0.4-1.3%, 0-2.1% 2O 3, 0-0.2% Li 2The fluorine-containing pigment of O and 0-0.6%.Preferred firing ceramics has following (preferably) composition: 64.1% SiO 2, 14.2% Al 2O 3, 11.1% K 2O, 6.6% Na 2O, 1.1% CaO, 0.4% BaO, 1.4% Sb 2O 3, 0.2% Li 2O and 0.6% fluorine-containing pigment (F 2With pigments).
Each CTE described in this specification sheets or claims is at 25 to 500 ℃ or measures to the scope of glass transition temperature (by Schwellenwert decision between the two).And each percentage ratio is the weight percentage with respect to composition total weight, except as otherwise noted.
Compacting or firing temperature need hang down at least 50 ℃ than the solidus temperature of alloy, so that avoid metal construction distortion in pressing process.The CTE of pressed glass or porcelain need make the CTE ratio of alloy suppress the high 0.5-2.0 μ of the CTE m/m.K of glass or porcelain.When difference during greater than 2.0 μ m/m.K, in the porcelain crackle can appear; When difference during less than 0.5 μ m/m.K, engaging in the resulting structures thing between pressed glass or porcelain and the alloy may be insecure.In described scope, the pressure that porcelain cooling back is stood makes and can obtain firm reparation.
The present invention will obtain more detailed description in following non-limiting example or by these non-limiting examples.
Embodiment
Embodiment 1 (contrast)
In vacuum induction furnace, weigh and melt following metal under dividing potential drop is the argon gas of 400 holders in the fine aluminium crucible: the rhodium of the platinum of the gold of 97.625 weight %, 1.5 weight %, the zinc of 0.5 weight %, 0.375 weight %, casting is Already on the rod in the punch die of vacuum chamber then.After the casting, from vacuum induction furnace, take out punch die and open this punch die.
It is plate that excellent roller is put down, but chooses this plate heating during plate is turned back to the rolling condition wantonly.After this, claim bar with this plate cutting, and alloy is cut into cubes.
Then in the mosaic block punch die that cast alloys engages to graphitiferous, the phosphoric acid salt that is preheating to 750 ℃ in electric pouring device under 1200 ℃.After the oxidation, this alloy has lark.
Provide with being bonded in the table 3 of porcelain.
Embodiment 2 (contrast)
Prepare alloy in embodiment 1 described identical mode: the platinum of the gold of 98.2 weight %, 1.2 weight %, the zinc of 0.1 weight, 0.3% rhodium and 0.2% indium with following composition.After the oxidation, this alloy has lark.
Embodiment 3
The alloy that has following composition with embodiment 1 described same way as preparation: the zinc of the gold of 99.8 weight %, 0.05 weight, 0.05% indium, 0.05% silver, 0.05% manganese.After the oxidation, this alloy has strong yellow.
Embodiment 4 (contrast)
The alloy that has following composition with embodiment 1 described same way as preparation: the zinc of the gold of 99.7 weight %, 0.1 weight, 0.2% indium (seeing US-A-5,922,276).After the oxidation, this alloy has lark, but does not have the good bond of embodiment 3.
The result of embodiment 1-4 is presented in the following table
Metal component Embodiment number (component of weight %)
1 2 3 US 5922276
Gold platinoiridita zinc indium silver manganese rhodium 97.625 1.5 - 0.5 - - - 0.375 98.2 1.2 - 0.1 0.5 - - 0.3 99.8 - - 0.05 0.05 0.05 0.05 - 99.7 - - 0.1 0.2 - - -
Tensile strength, the MPa yield-point, the MPa elongation at break, % dimension formula hardness, the HV liquidus line, ℃ solidus curve, μ m/m. ℃ of oxidation color of ℃ thermal expansivity (20-500 ℃) engages porcelain, % is in conjunction with press ceramic, % 180 79 23.4 75 1,080 1,060 15.3 Huangs/ash 75 71 160 63 31.9 43 1,070 1,050 15.1 Huangs/ash 71 73 133 51 53 37 1,060 1,050 15.0 yellow 70 72 142 54 34 38 1,060 1,050 15.1 yellow 61 63
The casting diameter is that 20mm and thickness are the alloy disk of 1.0mm.After the casting, water foundry goods with thick and thin alumina lap.Make the distortion of metal-ceramic dish from the top by the drift (stamp) with bulb then, porcelain is downward.Make the crooked 0.4mm of dish at the center, consistently be out of shape and remove the pottery that in metal, has minimal cracks with what reach disk.After disconnecting porcelain, remove loose porcelain particle with nylon brush by the surface of fracture, afterwards the surface of fracture was placed in the ultra sonic bath 10 minutes.
After the disconnection, sample is by the amount on scanning electron microscope test residue porcelain surface.The percentage ratio of oxidized metal surface that still is coated with pottery is by with measurements of getting off: with the amount of silicon on the E.D.A.X. measurement port surface, and with itself and metallic surface unmasked portion and 100% by the surface ratio of porcelain covering.Average surface mark or remaining pottery provide in last table.The value that still is coated with the residual surface of porcelain shows: when disconnecting the porcelain piece, most of porcelain is still attached on the alloy.The test shows of other alloy system is higher than 50% percentage ratio and do not cause problem in practice.

Claims (5)

1, a kind of alloy, it comprises the zinc of 0.01-0.05 weight %, the indium of 0.01-0.05 weight %, the silver of 0.01-0.05 weight %, manganese and remaining the gold base thing of 0.01-0.05 weight %.
2, the alloy of claim 1, it comprises the gold of 99 weight %.
3, claim 1 or 2 alloy, it is composed of the following components basically: the silver of the zinc of the gold of 99.80 weight %, 0.05 weight %, the indium of 0.05 weight %, 0.05 weight % and the manganese of 0.05 weight %.
4, a kind of method for preparing the metal-ceramic dental restoration, it comprises and utilizing on the whole or part supporting structure thing that the pressed glass add the hot pressing color of teeth makes to the alloy by one of aforementioned claim, wherein said pressed glass is 12.5-14.5 μ m/m.K at 25 ℃ to 500 ℃ or the thermal expansivity measured to the temperature range by Schwellenwert decision between the two of glass transition temperature, and the press temperature of wherein said pressed glass is than low at least 50 ℃ of the solidus temperature of described alloy.
5, a kind of method for preparing the metal-ceramic dental restoration, it comprises fires tooth on the supporting structure thing that the alloy of one of claim 1-3 makes with porcelain, wherein said porcelain is 12.5-14.5 μ m/m.K at 25 to 500 ℃ or the thermal expansivity measured to the temperature range by Schwellenwert decision between the two of glass transition temperature, and the firing temperature of described porcelain is than low at least 50 ℃ of the solidus temperature of described alloy.
CNA2004800104151A 2003-05-19 2004-05-18 Gold alloy and method for manufacturing a dental restoration Pending CN1777688A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1023458A NL1023458C2 (en) 2003-05-19 2003-05-19 Gold alloy as well as a method for manufacturing a dental restoration.
NL1023458 2003-05-19

Publications (1)

Publication Number Publication Date
CN1777688A true CN1777688A (en) 2006-05-24

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EP (1) EP1627088A1 (en)
JP (1) JP2007527955A (en)
KR (1) KR20050118301A (en)
CN (1) CN1777688A (en)
BR (1) BRPI0408748A (en)
CA (1) CA2520131A1 (en)
NL (1) NL1023458C2 (en)
WO (1) WO2004101835A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104367383A (en) * 2013-08-16 2015-02-25 刘俐旻 Porcelain tooth structure containing nanogold

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7279054B2 (en) * 2004-05-14 2007-10-09 The Argen Corporation Dental prosthesis method and alloys

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2922226B2 (en) * 1989-10-16 1999-07-19 株式会社徳力本店 Decorative white gold alloy
NL9200564A (en) * 1992-03-26 1993-10-18 Elephant Edelmetaal Bv Dental alloy and dental porcelain for dental purposes.
DE19525361A1 (en) * 1995-02-16 1996-08-22 Herbst Bremer Goldschlaegerei Platinum- and/or palladium-contg. gold@ dental alloy
US5922276A (en) * 1998-02-17 1999-07-13 The Argen Corporation Gold alloy for porcelain/metal dental restorations
ATE291103T1 (en) * 2000-09-29 2005-04-15 Cendres & Metaux Sa FLAMMABLE, HIGH-GOLD DENTAL ALLOY

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104367383A (en) * 2013-08-16 2015-02-25 刘俐旻 Porcelain tooth structure containing nanogold

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BRPI0408748A (en) 2006-03-28
CA2520131A1 (en) 2004-11-25
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NL1023458C2 (en) 2004-11-22
WO2004101835A1 (en) 2004-11-25
KR20050118301A (en) 2005-12-16

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