CN1776897A - Mirror-seat structure with chip package and making method therefor - Google Patents
Mirror-seat structure with chip package and making method therefor Download PDFInfo
- Publication number
- CN1776897A CN1776897A CNA2004100925899A CN200410092589A CN1776897A CN 1776897 A CN1776897 A CN 1776897A CN A2004100925899 A CNA2004100925899 A CN A2004100925899A CN 200410092589 A CN200410092589 A CN 200410092589A CN 1776897 A CN1776897 A CN 1776897A
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- CN
- China
- Prior art keywords
- wafer
- mirror
- seat structure
- microscope base
- support portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Abstract
Structure of mirror base is as following: a support part is setup on inner ring of the mirror base; two sets of metal lead wire are setup on inner wall, downside of the mirror base and surface of the support part; putting upper surface of a chip on the surface of the support part to make the chip connect to metal lead wire of the support part electrically, and the unconnected part is exposed in the mirror base; there is at least a lug located on inner wall of the mirror base and on upper surface of the chip; a transparent plate setup on the lug in order to protect the chip. The invention simplifies manufacturing procedure, lowers height of the structure as well as increases precision of optical image. Advantages are: shortening time of preparation, lowering cost and raised acceptability.
Description
Technical field
The present invention is relevant a kind of chip package structure and manufacture method thereof, and is particularly relevant a kind of with mirror-seat structure and the manufacture method thereof of wafer in conjunction with the wafer package of microscope base.
Background technology
General sensing wafer can be used to sensing one signal, and after receiving this light signal, this sensing wafer is transformed into a signal of telecommunication with this light signal, by being passed on the printed circuit board (PCB) by substrate.
The encapsulating structure of existing tool sensing wafer is generally " wafer directly connects substrate " (chip onboard, COB), as shown in Figure 1, this COB encapsulating structure includes a substrate 10, one sensing wafer 12 is installed on this substrate 10, one flange layer 14 is to be located on this substrate 10 and to be positioned at around this sensing wafer 12, and form groove 16 with this substrate 10, use plural wires 18 to be electrically connected this sensing wafer 12 and this substrate 10, with bonding mode one transparent panel 20 is set on this flange layer 14, this transparent panel 20 is with these groove 16 sealings, make this substrate 10, this transparent panel 20 and this flange layer 14 form a confined space, then stickingly on this transparent panel establish a microscope base 22, promptly finish the encapsulation of sensing wafer 12, this existing encapsulating structure can utilize the scolding tin mode to be arranged on another soft or hard substrate 24.Have in addition in addition coil type encapsulation (tape carrier package, TCP) and glass flip chip (chip onglass, technology such as COG).
But this kind prior art also has the size of a lot of restrictions such as sensing wafer 12 and groove 16 on processing procedure, must consider the routing space, so make the restriction of salty sensing wafer 12 sizes, inferior person so encapsulating structure module are size-constrained and cause assembling manufacturer to reduce in the variability in when assembling, and the processing procedure of this prior art is comparatively complicated loaded down with trivial details, cause and make problems such as spoilage height and manufacturing time be long, and then cause waste product to produce.
In view of this, The present invention be directed to above-mentioned problem, propose a kind of mirror-seat structure and manufacture method thereof of wafer package, with the problem of the above-mentioned prior art generation of effective solution.
Summary of the invention
Main purpose of the present invention is in mirror-seat structure that a kind of wafer package is provided and manufacture method thereof, by by wafer is combined with microscope base, fabrication schedule is simplified, and then manufacturing efficient is increased.
Another object of the present invention is in mirror-seat structure that a kind of wafer package is provided and manufacture method thereof, by directly being bonded in the microscope base by wafer, the whole height of this chip package structure is reduced, and then makes the chip package structure more can flattening.
A further object of the present invention is in mirror-seat structure that a kind of wafer package is provided and manufacture method thereof, by directly being bonded in the microscope base by wafer, whole optical image accuracy is significantly improved.
A further object of the present invention is in mirror-seat structure that a kind of wafer package is provided and manufacture method thereof, because of being different from existing making flow process, time shortening, the cost of making is reduced and the fine ratio of product raising.
According to the present invention, a kind of mirror-seat structure of wafer package, it is to comprise a microscope base, ring is established a support portion on this microscope base inwall, and at least two metal lead wires are set on the surface of microscope base inner wall surface, microscope base bottom side and support portion; One wafer then is provided; this wafer has a first surface and a second surface; and the first surface of this wafer is provided with one of be connected a service area and a line areas; the first surface of wafer is arranged on the support portion; the line areas of wafer and the metal lead wire of support portion are electrically connected; the service area then is emerging in this microscope base; and on the line areas of wafer and with microscope base inwall connection, at least one projection is set; on the projection and above being positioned at the service area transparent panel is being set, injury-free in order to the service area of protection wafer.And the method for making the mirror-seat structure of this wafer package comprises the following steps; one microscope base at first is provided; ring is established a support portion in this microscope base; at least two metal lead wires then are set on microscope base inwall and abutment surfaces; one wafer then is provided; this wafer has a first surface and a second surface; and the first surface of wafer is provided with one of be connected a service area and a line areas; the first surface of wafer is arranged on the support portion; the line areas of wafer and the metal lead wire of support portion are electrically connected; the service area then is emerging in this microscope base; at last on the line areas of wafer and be positioned at least one projection is set on the microscope base inwall; on the projection and above being positioned at the service area of wafer a transparent panel is being set, injury-free in order to the service area of protection wafer.
A kind of mirror-seat structure manufacture method of wafer package wherein, comprises the following steps:
One microscope base is provided, and ring is established a support portion in this microscope base;
On this microscope base inwall and this abutment surfaces, a metal lead wire is set;
One wafer is provided, this wafer has a first surface and a second surface, on this first surface, be provided with the line areas and the service area that are connected, this first surface of this wafer is located on this abutment surfaces, this line areas of this wafer and this metal lead wire are electrically connected; On this line areas of this wafer and be positioned on this microscope base inwall at least one projection is set,, injury-free in order to this service area of protecting this wafer on this projection and above being positioned at this service area of this wafer a transparent panel being set.
Below by cooperate appended graphic explanation in detail by specific embodiment, when the effect that is easier to understand purpose of the present invention, technology contents, characteristics and is reached.
Description of drawings
Fig. 1 is the generalized section of prior art of the present invention;
Fig. 2 is a section constitutional diagram of the present invention;
Fig. 3 is a generalized section of the present invention;
Fig. 4 is a stereogram of the present invention;
Fig. 5 is a upward view of the present invention;
Fig. 6 is the local enlarged diagram of sensing wafer bond circuit of the present invention;
Fig. 7 is the generalized section of the present invention in conjunction with substrate.
Embodiment
The present invention is a kind of mirror-seat structure of wafer package, extremely shown in Figure 5 as Fig. 2, it is to comprise a hollow microscope base 30, the material of this microscope base 30 is to be selected from poly-O-phthalic vinegar amine (Polyphthalamide, PPA) or poly-trimethyl-ethylene terephthalate (LiquidCrystalPolymer, LCP), poly-sulfuration xylene resin (PPS), elder generation's imines at polyethers tenth of the twelve Earthly Branches (PEl) one of them, and on these microscope base 30 inwalls, be equipped with a support portion 32, this support portion 32 is to be formed in one with microscope base 30, and these microscope base 30 inwalls, microscope base 30 bottom sides and 32 surfaces, support portion utilize plating mode or adhesion system that two groups of metal lead wires 34 are set; One sensing wafer 36 then is provided, this sensing wafer 36 be for charge coupled cell (Charge-Coupled Device, CCD) or complementary metal oxide semiconductor (CMOS) one of them; Please consult shown in Figure 6 simultaneously, these sensing wafer 36 upper surfaces are provided with sensing area 38 and the line areas 40 that is connected, then utilize welding WU ball or gold goal mode that sensing wafer 36 upper surfaces are arranged on 32 surfaces, support portion, make the line areas 40 of sensing wafer 36 and metal lead wire 34 electric connections of support portion 32, the sensing area 38 of sensing wafer 36 then is emerging in this microscope base 30, in addition on the line areas 40 of sensing wafer 36 and the junction that is connected with microscope base 30 inwalls one projection 42 is set, this projection 42 can utilize injection molding method and microscope base 30 and support portion 32 to make simultaneously, makes microscope base 30, support portion 32 and projection 42 are formed in one; Then utilize adhesion system that one transparent panel 44 is set on this projection 42, be not subjected to extraneous damage in order to the sensing area 38 of protecting sensing wafer 36, wherein the material of this transparent panel 44 is to be glass or quartz, so promptly finishes the mirror-seat structure of this sensing wafer encapsulation.The mirror-seat structure of this wafer package is except can be applicable to the encapsulation of sensing wafer 36 in addition, also can be applicable to the encapsulating structure (not shown) of light-emitting diode (LightEmitting Diode) wafer, both differences are that the sensing area 38 of sensing wafer 36 is replaced into the luminous zone of LED wafer.
Use when of the present invention, the mirror-seat structure of this wafer package can be set directly on the substrate 46 of a soft or hard, wherein the mode of She Zhiing utilizes weldering WU mode that the metal lead wire 34 of these microscope base 30 bottom sides is electrically connected with substrate 46.So can carry out electrical and image test before the present invention combines with substrate 46, in advance to reduce testing time and process.The present invention mutually combines wafer and microscope base 30 in addition, the time of getting the raw materials ready and material cost in the manufacture process are significantly reduced, and, make the whole height of microscope base 30 reduce because wafer is directly to stick in the microscope base 30, also and then the optical image aligning accuracy is significantly improved.And be the processing procedure that is different from prior art because of wafer is combined with microscope base 30, fabrication schedule is simplified, and then made and make efficient and increase.
The above is by characteristics of the present invention are described by embodiment, its purpose is had the knack of this operator and can be understood content of the present invention and implement according to this making, and non-limiting claim scope of the present invention, so, all other do not break away from equivalence modification or the modification that disclosed spirit is finished, and must be included in the scope of the present utility model.
Claims (19)
1. the mirror-seat structure of a wafer package is characterized in that, comprising:
One microscope base, ring is established a support portion on its inwall;
At least two metal lead wires, it is arranged on the surface of this microscope base inner wall surface, this microscope base bottom side and this support portion;
One wafer, it is to have a first surface and a second surface, on this first surface of this wafer, be provided with the service area and the line areas that are connected, this first surface of this wafer is arranged on below this support portion, this line areas of this wafer and this metal lead wire of this support portion are electrically connected, and this service area of this wafer is emerging in this microscope base; And
At least one projection, it is arranged on this line areas of this wafer and with this microscope base inwall and is connected, and is on this projection and above being positioned at this service area of this wafer a transparent panel being set, injury-free in order to this service area of protecting this wafer.
2. the mirror-seat structure of wafer package as claimed in claim 1 is characterized in that, the material of described this microscope base be selected from poly-O-phthalic vinegar amine or poly-trimethyl-ethylene terephthalate, poly-sulfuration xylene resin, polyethers elder generation at tenth of the twelve Earthly Branches imines one of them.
3. the mirror-seat structure of wafer package as claimed in claim 1 is characterized in that, described this transparent panel material is to be glass or quartz.
4. the mirror-seat structure of wafer package as claimed in claim 1 is characterized in that, described this wafer be for light-emitting diode, charge coupled cell and complementary metal oxide semiconductor one of them.
5. the mirror-seat structure of wafer package as claimed in claim 4 is characterized in that, described this wafer is during for light-emitting diode, and the effect of this service area is to be luminous effect.
6. the mirror-seat structure of wafer package as claimed in claim 4 is characterized in that, described this wafer is during for charge coupled cell or complementary metal oxide semiconductor, and the effect of this service area is to be the sensing effect.
7. the mirror-seat structure of wafer package as claimed in claim 1 is characterized in that, the mirror-seat structure of described this wafer package can be arranged on the substrate, electrically connects by this metal lead wire and this substrate by this microscope base bottom side.
The mirror-seat structure of 8 wafer package as claimed in claim 7 is characterized in that, described this metal lead wire is to utilize weldering WU mode and this substrate to electrically connect.
9. the mirror-seat structure of wafer package as claimed in claim 7 is characterized in that, described this substrate be for flexible base plate or hard substrate one of them.
10. the mirror-seat structure of wafer package as claimed in claim 1 is characterized in that, described this metal lead wire is to be arranged on the surface of this microscope base inner wall surface, this microscope base bottom side surface and this support portion with plating mode or adhesion system.
11. the mirror-seat structure of wafer package as claimed in claim 1 is characterized in that, described this microscope base and this support portion are to be formed in one.
12. the mirror-seat structure of wafer package as claimed in claim 1 is characterized in that, the line areas of described this wafer is to utilize this metal lead wire of WU ball or gold goal mode and this support portion to electrically connect.
13. the mirror-seat structure of wafer package as claimed in claim 1 is characterized in that, described this projection and this microscope base are to be formed in one, and can utilize injection molding method that this microscope base, this support portion and this projection are made simultaneously.
14. the mirror-seat structure of wafer package as claimed in claim 1 is characterized in that, described this transparent panel is to utilize adhesion system to be arranged on this projection.
15. the mirror-seat structure manufacture method of a wafer package is characterized in that, comprises the following steps:
One microscope base is provided, and ring is established a support portion in this microscope base;
On this microscope base inwall and this abutment surfaces, a metal lead wire is set;
One wafer is provided, this wafer has a first surface and a second surface, on this first surface, be provided with the line areas and the service area that are connected, this first surface of this wafer is located on this abutment surfaces, this line areas of this wafer and this metal lead wire are electrically connected;
On this line areas of this wafer and be positioned on this microscope base inwall at least one projection is set,, injury-free in order to this service area of protecting this wafer on this projection and above being positioned at this service area of this wafer a transparent panel being set.
16. the mirror-seat structure manufacture method of wafer package as claimed in claim 15 is characterized in that, described this metal lead wire is to be arranged on the surface of this microscope base inner wall surface, this microscope base bottom side and this support portion with plating mode or adhesion system.
17. the mirror-seat structure manufacture method of wafer package as claimed in claim 5 is characterized in that, the line areas of described this wafer is to utilize this metal lead wire of WU ball or gold goal mode and this support portion to electrically connect.
18. the mirror-seat structure manufacture method of wafer package as claimed in claim 15 is characterized in that, the mirror-seat structure of described this wafer package can be arranged on the substrate, by being electrically connected by this metal lead wire and this substrate.
19. the mirror-seat structure manufacture method of wafer package as claimed in claim 18 is characterized in that, described this metal lead wire is to utilize weldering WU mode and this substrate to electrically connect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2004100925899A CN1776897A (en) | 2004-11-16 | 2004-11-16 | Mirror-seat structure with chip package and making method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2004100925899A CN1776897A (en) | 2004-11-16 | 2004-11-16 | Mirror-seat structure with chip package and making method therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1776897A true CN1776897A (en) | 2006-05-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2004100925899A Pending CN1776897A (en) | 2004-11-16 | 2004-11-16 | Mirror-seat structure with chip package and making method therefor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1776897A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101409298B (en) * | 2007-10-11 | 2010-09-29 | 鸿富锦精密工业（深圳）有限公司 | Imaging apparatus and assembling method thereof |
-
2004
- 2004-11-16 CN CNA2004100925899A patent/CN1776897A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101409298B (en) * | 2007-10-11 | 2010-09-29 | 鸿富锦精密工业（深圳）有限公司 | Imaging apparatus and assembling method thereof |
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| WD01 | Invention patent application deemed withdrawn after publication |