CN1773804A - Surge protector module containing voltage-dependent resistor disc - Google Patents
Surge protector module containing voltage-dependent resistor disc Download PDFInfo
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- CN1773804A CN1773804A CN 200510100476 CN200510100476A CN1773804A CN 1773804 A CN1773804 A CN 1773804A CN 200510100476 CN200510100476 CN 200510100476 CN 200510100476 A CN200510100476 A CN 200510100476A CN 1773804 A CN1773804 A CN 1773804A
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- electrode member
- ring
- housing
- surge protector
- piezoresistive wafer
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Abstract
A surge protector module with ring piezo-resistance plate consists of the first and the second electrode element with roughly flat projection surfaces, and shell surrounding said piezo-resistance plate between the first and second concave surfaces of electrode element. It is featured as having central hole on electrode element to correspond to ring piezo-resistance plate being set between two electrode elements, combining the first and the second electric contact surfaces of said piezo-resistance plate closely and separately with the first projection surfaces of the first electrode element and the second projection surface of the second electrode element through fastening bolt.
Description
Invention field
The present invention relates to a kind of surge protector module that is used for power-supply system.More particularly, relate to a kind of surge protector module that constitutes by piezoresistive wafer.
Background of invention
In recent years, the extensive use of the information electronic device that constitutes by extensive and very lagre scale integrated circuit (VLSIC), surge protection device miscellaneous arises at the historic moment.Surge and powerful electromagnetic interference thereof are serious to the destruction of the electronic message unit of fragility and the consequence that causes thus; especially; enter the surge of electronic equipment from mains side; the probability of spiking is bigger; therefore, the surge protection device that is used for power-supply system with big discharge capacity will become essential.Discharge capacity is a technical term, is meant the impulse current peak value that flows through surge protection device.Big discharge capacity refers to that in the industry custom discharge capacity is more than 100KA.
At present, surge protection device has many weak points, mainly is:
1. adopt many piezoresistive wafers surge protector module that constitutes big surge current tolerance capacity in parallel; though this structure has characteristics such as residual voltage is low, the piezoresistive wafer cost is low; but many piezoresistive wafer parallel connections will be carried out piezoresistive wafer strict coupling; but also need complicated testing circuit monitor the operating state of each piezoresistive wafer, be suitable difficulty so will reach that the electric current of every piezoresistive wafer all carries on a shoulder pole.
2. the surge protector module of forming with single disc piezoresistive wafer; the piezoresistive wafers that are welded with lead-in wire that adopt more; between lead-in wire and the piezoresistive wafer; form a kind of small size contact; when powerful surge current flows through piezoresistive wafer; limit the transfer of heat, can not obtain enough big pulse current tolerance capacity, and very weak to the duration in the impact tolerance of the temporary overvoltage of second.
3. the surge protection device that adopts big diameter disc shape piezoresistive wafer to constitute; because big diameter disc shape piezoresistive wafer is under dry pressuring forming process; can cause compact density inhomogeneous; under surge current impacts; CURRENT DISTRIBUTION on the piezoresistive wafer is inhomogeneous, can be than being easier to cause phenomenons such as puncture, deterioration.
Summary of the invention
The objective of the invention is to the deficiency of avoiding above-mentioned, reach by following measure:
A kind of surge protector module that contains piezoresistive wafer hereinafter to be referred as module, comprises piezoresistive wafer, electrode member etc.
Described piezoresistive wafer is the piezoresistive wafer of annular, has the cirque structure of center drilling, and first, second relative and electrical contact surface substantially flat is arranged.
This module also comprises having generally flat and have and protrude the first and second surperficial electrode members.Specifically, described two electrode members have the protrusion plane of metalloid flange plate structure; Two electrode members have the centre bore corresponding with the ring varistor sheet; Described ring varistor sheet is between first, second electrode member, and first electrical contact surface of ring varistor sheet and second electrical contact surface, by fastening bolt, protrude second of the surface and second electrode member with first of first electrode member respectively and protrude surperficial fluid-tight engagement.Secondly, two electrode members also have and are lower than another depression plane of protruding the plane, and between the platform that protrudes the place, plane is positioned among the depression plane, protrude plane and depression plane parallel.Promptly first electrode member has the first depression plane, and second electrode member has the second depression plane.
In actual applications, the protrusion of electrode member surface also can be the same surface that is in a plane with the depression plane.So, though can use, very easily cause the electrical contact surface and the electrode member loose contact of ring varistor sheet.
First, second electrode member mainly is the splicing ear as bus, and first, second electrode member preferably is made of the metal with big thermal capacity simultaneously, is used to absorb the ring varistor sheet at a large amount of heats by huge surge current produced.In this manner, this module can reduce because the electrical property of damage that heat causes and ring varistor sheet is aging, and prevents the possibility that the ring varistor sheet catches fire and explodes.Because first, second electrode member has big relatively thermal capacity, and first, second electrode member has big relatively conductive contact surfaces, more uniform heat distribution is provided also can for the interior ring varistor sheet of module, therefore, can reduces the ring varistor sheet that causes by heat and damage.
Described module also comprises fastening bolt, and fastening bolt mechanically is pressed in first, second electrode member on the ring varistor sheet by the central through hole of electrode member, ring varistor sheet.Structure like this, compare with the structure that electrode member or conductive lead wire are welded on the ring varistor sheet, conductive contact surfaces increases, and can make the electric current that flows through the ring varistor sheet more even, thereby can avoid module because big electric current concentration of local is impacted caused partial breakdown.Fastening bolt is preferably made by having the higher materials such as polytetrafluoroethylene of insulation property and intensity.But, also can adopt other suitable similar material manufacturing.If without insulating material, the bolt that can adopt metal material to manufacture adds an insulating case realization that surrounds metal material.
Described module also comprises between first concave face and second concave face of electrode member, and surrounds the housing and the housing seal circle of ring varistor sheet.Housing and housing seal circle are that insulating material is made, and housing, housing seal circle and electrode member seal the ring varistor sheet together.Housing is the thin ring of annular, and external diameter is consistent with two electrode member concave face external diameters, and internal diameter is approximately greater than the internal diameter of two electrode member concave faces.In the housing upper and lower end face, housing groove is set, its size is adaptive with the housing seal circle, and the housing seal circle is put among the housing groove.Here, contact if housing can seal well with the concave face of electrode member, then housing seal circle, housing groove are not the structures that must be provided with.
Housing is to make by having the higher materials such as polytetrafluoroethylene of insulation property and intensity.But, also can adopt other suitable insulating material manufacturing that comprises pottery.
Secondly, in the shell structure of foregoing description, housing and arbitrary electrode member can be integrals and become cylindrical shell shape structure.So, then the inner bottom part at this cylindrical shell still needs to form a boss plane, and this boss plane contacts with the electrical contact surface of ring varistor sheet.
Protrude the opposite face on surface at electrode member, bolt seal annular groove and bolt seal ring are set, bolt seal ring suitability is put into the bolt seal annular groove; The central lines of the center line of bolt seal annular groove and bolt seal ring and electrode member centre bore; Structure like this, behind the assembling fastening bolt, can avoid pollutant to enter in the module from the centre bore of electrode member, cause the ring varistor sheet to make moist, pollute, cause the leakage current of ring varistor sheet to increase, and the electrical property deterioration of the ring varistor sheet that causes.Not necessarily bolt seal annular groove and bolt seal ring must be set all on two electrode members here.Be connected with bolt when the centre bore of arbitrary electrode member adopts the blind hole helicitic texture, then on this electrode member, just can omit bolt seal annular groove and bolt seal ring.
The ring varistor sheet can pass through mould compression moulding, behind the sintering, and the aluminium-plated or metal conducting layer in surface; Form insulating barrier after laying the upper glass coating in the exterior lateral sides of ring varistor sheet and centre bore side.Because piezoresistive wafer adopts loop configuration, can make the quick resistor disc compact density uniformity of annular, compact density excellent in uniform than the collar plate shape piezoresistive wafer of same side area, in manufacture process, can avoid the inhomogeneities of the compact density that causes because of the powder poor mobile performance, thereby make the current density of piezoresistive wafer increase, stability strengthens.
This surge protector module is mainly used in the surge protection of low-voltage, middle power voltage supply system.By reading the drawings and detailed description of following embodiment of the present invention, those skilled in the art will recognize that these purposes of the present invention, but these explanations are example structure of the present invention is described.
Brief Description Of Drawings
In the drawings,
Fig. 1 is a perspective view of the present invention;
Fig. 2 is the present invention's first electrode and bolt seal ring combining structure cutaway view;
Fig. 3 is the cutaway view of the present invention's second electrode structure;
Fig. 4 is the cutaway view of shell structure of the present invention;
Fig. 5 is the cutaway view of housing of the present invention and sealing ring combining structure;
Fig. 6 is the cutaway view of the sheet of ring varistor of the present invention;
Fig. 7 is a combining structure cutaway view of the present invention.
Embodiment describes in detail
Now, will carry out specific description with reference to accompanying drawing to the present invention hereinafter, wherein will provide the present invention embodiment of springing forth.But the present invention can adopt various ways to implement, and should not be limited to embodiment given here; It is in order to make these contents disclosed herein more in detail with complete that the present invention provides these embodiment.In the accompanying drawings, the element that the representative of similar label is similar uses here that term " makes progress ", similar terms such as " downwards ", " vertically ", " level " are just to illustration purpose.
Shown in the figure is according to surge protector module of the invention process, represents with label 1.
As Fig. 1, a kind of surge protector module 1 that is made of piezoresistive wafer comprises first electrode member 101, second electrode member 102 and ring varistor sheet 2 etc.
As Fig. 2, first electrode member 101 includes first and protrudes surface 1011, first concave face 1012, and there is through hole 108 at the center.First protrude surface 1011 parallel with first concave face 1012 and be positioned among first concave face 1012 between.Protrude the opposite face on surface at first of first electrode member 101, bolt seal annular groove 109 and bolt seal ring 5 are set, bolt seal ring 5 suitabilities are put into bolt seal annular groove 109; The centre bore central lines of the center line of bolt seal annular groove 109 and bolt seal ring 5 and first electrode member 101.First electrode member 101 is integral body and axisymmetric.
As Fig. 3, second electrode member 102 includes second and protrudes surface 1021, second concave face 1022, and there is the screwed hole 10 of blind hole shape at the center.Second protrude surface 1021 parallel with second concave face 1022 and be positioned among second concave face 1022 between.Second electrode member 102 is integral body and axisymmetric.
Described first electrode member 101, second electrode member 102 are preferably made by the material of perfect heat-dissipatings such as aluminium.
As Fig. 6, ring varistor sheet 2 is the thin slice annular, have first electrical contact surface 201 and second electrical contact surface 202 up and down, and there is through hole 203 at the center.
As Fig. 7, module 1 also comprises the fastening bolt 3 of being with nut 301.Fastening bolt 3 is made by insulating material.Described insulated bolt 3 has the nut 301 of a diameter greater than the first electrode member central through hole 108, and screw rod 302 has the screw thread that cooperates with the screwed hole of centre 10 of second electrode member 102.The diameter of nut 301 is also greater than the diameter of bolt seal annular groove 109.
As Fig. 4 and Fig. 5, module 1 also comprises housing 4, and housing 4 is between second concave face 1022 of first concave face 1012 of first electrode member 101 and second electrode member 102.The external diameter of housing 4 is consistent with the external diameter of first electrode member 101, second electrode member 102; And the internal diameter of housing 4 is slightly larger than the concave face internal diameter of first electrode member 101, second electrode member 102.
In the upper surface of housing 4, also be provided with enclosure slot 401, sealing ring 6 suitabilities are put into enclosure slot 401; Lower surface at housing 4 also is provided with enclosure slot 402, and sealing ring 7 suitabilities are put into enclosure slot 402.
As Fig. 1 and Fig. 7, during assembling, bolt seal ring 5 suitabilities are put into bolt seal annular groove 109, sealing ring 6 suitabilities are put into enclosure slot 401, and sealing ring 7 suitabilities are put into enclosure slot 402.Ring varistor sheet 2, housing 4 are placed between first electrode member 101 and second electrode member 102; First electrical contact surface 201 of ring varistor sheet 2 and second electrical contact surface 202 protrude second of surface 1011, second electrode member 102 with first of first electrode member 101 respectively and protrude surface 1021 and contact continuous; Fastening bolt 3 passes the central through hole 108 of first electrode member 101 and the central through hole 203 of ring-like piezoresistive wafer 2, with screwed hole of centre 10 secure fit of second electrode 102.Fastening bolt 3 gives first electrode member 101, ring varistor sheet 2 and second electrode member 102 fastening, forms good being electrically connected.Bolt seal ring 5, sealing ring 6, sealing ring 7 are sealed first electrode member 101, housing 4 and second electrode member, 102 formed cavity volumes.
In application; module 1 can directly be connected across in low-voltage, the middle voltage source system; for example; in a power supply electric surge guard box; power line directly or by fuse links to each other with first electrode member 101 or second electrode member 102; so that by first electrode member 101, ring varistor sheet 2, the second electrode members 102 form fault current path.Under the normal situation of power circuit, ring varistor sheet 2 is high impedance, does not have electric current to flow through module 1; When the surge voltage that surpasses design was arranged on power circuit, 2 impedances of ring varistor sheet reduced rapidly, make surge current flow through module 1, formed the shunt access of electric current, with the protection relevant device.The purposes and the application of the known such surge protection apparatus of those skilled in the art no longer describe in detail herein.
According to foregoing, the method that is used to form some elements of described module 1 is known for those skilled in the art.The first metal electrode element, 101, the second metal electrode elements 102 for example, insulated bolt 4, housing 4 can be by machine work, the method manufacturing of casting or punching press.Each these element can one formation.
Claims (7)
1. a surge protector module that is made of piezoresistive wafer comprises first electrode member (101), second electrode member (102) and ring varistor sheet (2), it is characterized in that:
Described first electrode member (101) includes first and protrudes surface (1011), first concave face (1012), and has centre bore (108);
Described second electrode member (102) includes second and protrudes surface (1021), second concave face (1022), and has centre bore (10);
Described ring varistor sheet (2) is the thin slice annular, have first electrical contact surface (201) and second electrical contact surface (202), and there is through hole (203) at the center, and ring varistor sheet (2) is positioned between first electrode member (101) and second electrode (102);
The fastening bolt (3) that also comprises band nut (301); Fastening bolt (3) passes the central through hole (203) of the centre bore (108) of first electrode member (101), ring-like piezoresistive wafer (2) and the centre bore (10) of second electrode (102), gives fastening.
2. a kind of surge protector module that constitutes by piezoresistive wafer according to claim 1; it is characterized in that: also comprise housing (4); housing (4) is positioned between second concave face (1022) of first concave face (1012) of first electrode member (101) and second electrode member (102), and surrounds ring varistor sheet (2).
3. a kind of surge protector module that is made of piezoresistive wafer according to claim 2 is characterized in that: the external diameter of housing (4) is consistent with the external diameter of first electrode member (101), second electrode member (102); And the internal diameter of housing (4) is slightly larger than the internal diameter of first concave face (1012) and second concave face (1022).
4. according to claim 2 or 3 described a kind of surge protector modules that are made of piezoresistive wafer, it is characterized in that: the centre bore of described second electrode member (102) is the screwed hole (10) of blind hole type; Fastening bolt (3) passes the central through hole (108) of first electrode member (101) and the central through hole (203) of ring-like piezoresistive wafer (2) is connected fastening with the screwed hole (10) of second electrode (102).
5. a kind of surge protector module that constitutes by piezoresistive wafer according to claim 4, it is characterized in that: protrude the opposite face on surface (1011) at first of first electrode member (101), bolt seal annular groove (109) and bolt seal ring (5) are set, and bolt seal ring (5) suitability is put into bolt seal annular groove (109); The center line of bolt seal annular groove (109) and bolt seal ring (5) and first electrode member centre bore (108) central lines.
6. a kind of surge protector module that is made of piezoresistive wafer according to claim 5 is characterized in that: the upper surface in housing (4), also be provided with enclosure slot (401), and sealing ring (6) suitability is put into enclosure slot (401); Also be provided with enclosure slot (402) in the lower surface of housing (4), sealing ring (7) suitability is put into enclosure slot (402).
7. a kind of surge protector module that is made of piezoresistive wafer according to claim 6 is characterized in that: the lower surface of housing (4) is connected as a whole with second concave face (1022) of second electrode member (102), thereby forms one-piece type cylindrical shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101004763A CN100389529C (en) | 2005-10-25 | 2005-10-25 | Surge protector module containing voltage-dependent resistor disc |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101004763A CN100389529C (en) | 2005-10-25 | 2005-10-25 | Surge protector module containing voltage-dependent resistor disc |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1773804A true CN1773804A (en) | 2006-05-17 |
| CN100389529C CN100389529C (en) | 2008-05-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101004763A Expired - Fee Related CN100389529C (en) | 2005-10-25 | 2005-10-25 | Surge protector module containing voltage-dependent resistor disc |
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| Country | Link |
|---|---|
| CN (1) | CN100389529C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101771241B (en) * | 2008-11-06 | 2012-08-29 | 长沙普天天籁防雷科技有限公司 | Method and device for protecting optical transceiver from destruction of thunder and surge pulse |
| CN104852369A (en) * | 2015-04-29 | 2015-08-19 | 陈斌 | Surge protector |
| CN117081023A (en) * | 2023-08-21 | 2023-11-17 | 济南雷盾电子技术有限公司 | Maintenance-free charging pile power lightning protection device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE456623B (en) * | 1987-02-23 | 1988-10-17 | Asea Ab | surge |
| JPH01233705A (en) * | 1988-03-15 | 1989-09-19 | Matsushita Electric Ind Co Ltd | Surge absorber |
| US5224008A (en) * | 1991-06-25 | 1993-06-29 | Texas Instruments Incorporated | Surge protection device and system |
| US5375030A (en) * | 1993-09-27 | 1994-12-20 | Texas Instruments Incorporated | Surge protection device and system |
| US6430020B1 (en) * | 1998-09-21 | 2002-08-06 | Tyco Electronics Corporation | Overvoltage protection device including wafer of varistor material |
-
2005
- 2005-10-25 CN CNB2005101004763A patent/CN100389529C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101771241B (en) * | 2008-11-06 | 2012-08-29 | 长沙普天天籁防雷科技有限公司 | Method and device for protecting optical transceiver from destruction of thunder and surge pulse |
| CN104852369A (en) * | 2015-04-29 | 2015-08-19 | 陈斌 | Surge protector |
| CN104852369B (en) * | 2015-04-29 | 2017-12-22 | 陈斌 | Surge protector |
| CN117081023A (en) * | 2023-08-21 | 2023-11-17 | 济南雷盾电子技术有限公司 | Maintenance-free charging pile power lightning protection device |
| CN117081023B (en) * | 2023-08-21 | 2024-02-06 | 济南雷盾电子技术有限公司 | Maintenance-free charging pile power lightning protection device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100389529C (en) | 2008-05-21 |
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