CN1760722A - Heated substrate support and method of fabricating same - Google Patents
Heated substrate support and method of fabricating same Download PDFInfo
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- CN1760722A CN1760722A CNA2005100939345A CN200510093934A CN1760722A CN 1760722 A CN1760722 A CN 1760722A CN A2005100939345 A CNA2005100939345 A CN A2005100939345A CN 200510093934 A CN200510093934 A CN 200510093934A CN 1760722 A CN1760722 A CN 1760722A
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- groove
- substrate support
- heat radiator
- generating component
- heat
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- 239000000758 substrate Substances 0.000 title claims abstract description 105
- 238000004519 manufacturing process Methods 0.000 title description 23
- 238000000034 method Methods 0.000 claims abstract description 61
- 239000000463 material Substances 0.000 claims description 54
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 43
- 229910052782 aluminium Inorganic materials 0.000 claims description 43
- 239000004411 aluminium Substances 0.000 claims description 21
- 239000000725 suspension Substances 0.000 claims description 12
- 238000003466 welding Methods 0.000 claims description 8
- 230000008901 benefit Effects 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 230000020169 heat generation Effects 0.000 claims description 4
- 238000005242 forging Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 229910000838 Al alloy Inorganic materials 0.000 claims 6
- 238000000137 annealing Methods 0.000 claims 1
- 238000007788 roughening Methods 0.000 claims 1
- 230000008569 process Effects 0.000 description 22
- 238000000429 assembly Methods 0.000 description 11
- 230000000712 assembly Effects 0.000 description 11
- 238000009826 distribution Methods 0.000 description 10
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 4
- 230000006378 damage Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 230000008439 repair process Effects 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000002775 capsule Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000002421 finishing Substances 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000013529 heat transfer fluid Substances 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49083—Heater type
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49194—Assembling elongated conductors, e.g., splicing, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49908—Joining by deforming
- Y10T29/49915—Overedge assembling of seated part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49908—Joining by deforming
- Y10T29/49925—Inward deformation of aperture or hollow body wall
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Resistance Heating (AREA)
Abstract
A method and apparatus for forming a substrate support is provided herein. In one embodiment, the substrate support includes a body having a support surface and at least one groove. A heater element clad with a malleable heat sink is disposed in the groove. Substantially no air is trapped between the clad heater element and the groove. An insert is disposed in the groove above the heater. The insert substantially completely covers and contacts the clad heater element and the sides of the groove. A cap is disposed in the groove above the insert. The cap covers and contacts the insert and has an upper surface disposed substantially flush with the support surface.
Description
Technical field
Embodiments of the invention generally are provided for the substrate support and the manufacture method thereof of base material manufacturing technology.
Background technology
Active array display LCD or panel display Chang Zuowei such as computing machine and the TV screen is used.Roughly, panel comprises two layers of glass plate, accompanies one deck liquid crystal material each other.Wherein one deck glass plate comprises and is disposing the conducting film of one deck at least that is connected with power supply unit thereon at least.The electric power that is fed to conducting film by power supply unit has changed the direction of liquid crystal material, and produces macroscopic pattern, for example literal or figure on display.Wherein a kind of processing procedure that is commonly used to produce panel is plasma enhanced chemical vapor deposition method (PECVD).
The plasma enhanced chemical vapor deposition method generally is to be applied to thin film deposition on base materials such as for example silicon or quartz wafer, large-area glass goods or polymkeric substance manufacturing goods.Normally the application of vacuum that includes base material is indoor reaches the plasma enhanced chemical vapor deposition method by gaseous precursors is guided to.Gaseous precursors is flowed through the position typically at the distribution plate near the vacuum processing chamber top.The RF electric power that gaseous precursors in the process chamber is supplied because of one or more (RF) power supply of accepting to be connected with process chamber (for example being stimulated) formation plasma of switching on.The gas that is stimulated reacts and is being positioned at the substrate surface formation layer of material that has on the temperature controlled substrate support.Base material is accepted in some is used when being low-temperature polycrystalline silicon layer, and substrate support can be heated to more than 400 degree Celsius.The volatile by-product that is produced in the reaction is then discharged from process chamber via exhaust system.
Generally speaking, make substrate support that flat-panel screens is used and belong to large-scale, often above 550 millimeters * 650 millimeters.The substrate support of high-temperature use through forging or welding, is encapsulated in one or more heat generating components and thermopair within the aluminum body typically.Substrate support is typically in higher temperatures (promptly surpassing 350 degree Celsius and approaching 500 degree Celsius) operation down.Since be at high temperature to operate, if fail heat to be drawn and is distributed to the substrate support place in good time, just may be because of form the heat generating component fault that focus very easily makes package in the substrate support in the part.
Though the substrate support of this kind purposes has shown good manufacturing usefulness, but this support in fact is difficult for making and is quite expensive.In addition, because the cost costliness of material and manufacturing substrate support, substrate support manufacturing failure is that the utmost point must be avoided.In addition, if substrate support is failed during fabrication, the base material that it supported just may be impaired.Because these phenomenons may take place after finishing several processing procedure, therefore the substrate loss that causes in processing procedure just may be very huge.In addition, in replace making process chamber, also can produce expensive base material turnout loss during impaired support, when replacing or repair substrate support, must stop work because of making process chamber.Especially, substrate support of new generation must cooperate base material thereby size more than 2 square centimeters to increase under near 500 degree Celsius, addresses the above problem and becomes more urgent.
Therefore, have and to seek the Improvement type substrate support.
Summary of the invention
The present invention provides the substrate support embodiment of heating at this.In one embodiment, this substrate support comprises a body it has supporting surface and at least one groove.Dispose the heat generating component that coats by the malleability heat radiator in the groove.Between heat generating component that is coated and groove, there is no air in fact.Above groove internal heat generation assembly, insert is arranged.This insert covers and touches heat generating component and the trench wall that is coated in fact.Above the insert in groove operculum colpi is arranged.This operculum colpi covers and touches insert, and the position of its upper surface flushes with stayed surface in fact.
In another embodiment, this substrate support comprises a body it has supporting surface and at least one groove.Dispose the heat generating component that centers on by the malleability heat radiator in the groove.Heat radiator can be made up of one or more parts.The heat radiator top disposes an operculum colpi in the groove, and has a upper surface, is configured to its orientation and flushes with supporting surface in fact.
In another embodiment, it provides the method that forms substrate support.The method that forms substrate support comprises the step that body is provided, and is formed with at least one groove in the upper support surface of this body; And inserting the step of a heat generating component to this groove, this heat generating component is by being centered on than the made heat radiator of the more soft material of this body.Heat radiator can be made up of one or more parts.The operculum colpi position is above groove internal heat generation assembly and heat radiator.The upper surface of operculum colpi comes down to the upper support flush with this body.
Description of drawings
For the characteristic of detailed ground explain the invention described above more, the summary of the invention described above can further be described, partly and with description of drawings with reference to embodiment.What deserves to be mentioned is that accompanying drawing just illustrates typical specific embodiment of the present invention, is not to limit the scope of the invention therefore, and the present invention can comprise other equal effectively specific embodiment.
Fig. 1 is the sectional view with manufacturing process chamber of substrate support of the present invention;
Fig. 2 is the partial section view of the substrate support assembly embodiment of Fig. 1;
Fig. 3 is the process flow diagram that the present invention is used to make substrate support;
4-7 figure is according to the method for Fig. 3 explanation partial section view at the substrate support assembly of different manufacturing steps assemblings;
8A-E figure is the partial section view of another substrate support in the different fabrication phases; And
9A-E figure is the partial section view of another substrate support in the different fabrication phases.
In order to help to understand, same components common among each figure is all used identical numbering.
Description of reference numerals:
100 systems, 304 steps
102 process chambers, 306 steps
104 gas supply sources, 308 final steps
106 walls, 602 lower portion
Top, 108 ends 604 partly
110 cap assemblies, 610 upper surfaces
112 operation rooms, 800 substrate support assemblies
114 inflators, 802 grooves
118 distribution plates, 804 heat generating components
More than 806 sidewall of 120 interior side
122 power supplys, 808 ladders
124 bodies, 810 lower sidewall parts
126 lower sides, 812 side wall upper part parts
814 ends of 128 holes
130 power supplys, 816 first malleability heat radiator
132 heat generating components, 818 second malleability heat radiator
134 upper surfaces, 820 instruments
138 supporting components, 822 operculum colpis
140 base materials, 824 welds
142 arbors, 826 upper surfaces
144 handles cover 830 bodies
146 flexible capsule 832 recesses
148 cover frame 834 upper surfaces
150 lifter pins, 836 recesses
154 lifter plates, 838 upper surfaces
160 first terminal 900 assemblies
162 second terminal 902 suspension columns
190 thermopairs, 904 central principal part parts
204 grooves, 906 tops
206 walls, 908 exterior walls
210 clads, 910 inwalls
214 inserts, 916 first malleability heat radiator
218 operculum colpis, 918 second malleability heat radiator
220 sheaths, 932 recesses
222 eelctric dipoles, 934 upper surfaces
224 assemblies, 936 recesses
226 holes
228 channels
230 bottoms
232 somes
234 somes
300 methods
302 steps
Embodiment
The invention relates to substrate support that a kind of heating is provided with and manufacture method.The present invention is with the PECVD system, for example take from AKT (Applied Materials, Inc., Santa Clara, PECVD system California) makes exemplary illustration.But, should be appreciated that the present invention also can use other kind system architecture, for example the system of physics vapour deposition system, ion implant system, etch system, other chemical gas-phase deposition system and other use hot type substrate support.
Fig. 1 is the sectional view of 100 embodiment of plasma auxiliary chemical vapor deposition system.System 100 comprises the process chamber 102 that is connected to gas supply source 104.Process chamber 102 by a plurality of walls 106, a bottom 108, and a cap assemblies 110 define operation room 112.Operation room 112 passes in and out process chambers 102 by the discrepancy end (not shown) on a plurality of wall walls 106 for base material 140 typically.This a plurality of walls 106 and bottom 108 typically is single aluminium block or other can be made for the material of processing procedure purposes.This cap assemblies 110 comprises a pump inflator 114, and it can make operation room 112 and exhaust end (can comprise various pumps, not show) communicate.
This cap assemblies 110 is to be supported and can be removed so that use process chamber 102 by a plurality of walls 106.Generally speaking cap assemblies 110 comprises aluminium.Distribution plate 118 is to be coupled to cap assemblies 110 interior side 120.Distribution plate 118 typically is aluminum.Central part comprises a through hole area, other gas of making thing and supplied by gas supply source 104 can be transported to operation room 112 through this district.The structure of the through hole area of distribution plate 118 is to be used for gas is dispensed in the process chamber 102 fifty-fifty through distribution plate 118.
Hot type substrate support assembly 138 is the middle positions that are configured in the process chamber 102.Substrate support assembly 138 is supporting base material 140 in manufacture process.In one embodiment, substrate support assembly 138 comprises an aluminium body 124, the heat generating component that at least one embedding is arranged 132 of Feng Jinqi inside and a thermopair 190.Body 124 can optionally add coating or process plating.In addition, body 124 can be the material of ceramic material or other and processing environment compatibility.
Heat generating component 132 for example is configured in the electrode in the supporting component 138, is to be coupled to power supply 130 also controllable type ground position supporting component 138 and base material 140 thereon to be heated to predetermined temperature.Typically, heat generating component 132 can make the temperature maintenance of base material 140 under Celsius approximately 150 sammings that arrive at least about 460 degree.
Usually, but supporting component 138 has the upper surface 134 of lower side 126 and support base material.In one embodiment, the structure of the upper surface 134 of support is to be used for Area of bearing to take advantage of about 650 millimeters base material more than or equal to about 550.In one embodiment, the area of plane of the upper surface 134 of support more than or equal to about 0.35 square centimeter so that support size is taken advantage of 650 millimeters base material more than or equal to about 550.In one embodiment, the area of plane of the upper surface 134 of support is more than or equal to about 2.7 square centimeters (so that support size is taken advantage of 1800 millimeters base material more than or equal to about 1500).The upper surface 134 of this support can be Any shape or structure usually.In one embodiment, the upper surface 134 of support can be the polygon of essence.In one embodiment, the upper surface of support is a quadrilateral.
Supporting component 138 has several holes 128, and several lifter pins 150 can be accepted in its configuration orientation.Lifter pin 150 typically comprises ceramic material or Electroplating Aluminum.Generally speaking, when 150 of lifter pins in normal position when (that is, 138 withdrawals of self-supporting assembly), lifter pin 150 has first end 160, it flushes with the upper surface 134 of supporting component 138 in fact or is sagging slightly.First end 160 is generally tubaeform in order to avoid lifter pin 150 drops via hole 128.Second end 164 of lifter pin 150 extends to after the lower side 126 of supporting component 138.Lifter pin 150 can be given prominence to stayed surface 134 by lifter plate 154 self-supporting assemblies, 138 superior displacements, so as to base material being moved apart supporting component 138 one section space length is arranged.
Supporting component 138 gives ground connection usually and can excite and be configured in the gas between supporting component 138 and distribution plate 118 in the operation room 112 so that power supply 122 is fed to the RF power supply of distribution plate 118 (or other or near the electrode of chamber lid assembly).Generally speaking the RF power supply of power supply 122 supplies is to cooperate according to the base material size to select for use to drive chemical vapor deposition process.
Around also supporting in addition, supporting component 138 covers frame 148.Generally speaking, cover that frame 148 can prevent at the rim deposit of base material 140 and supporting component 138 in order to avoid base material is attached on the supporting component 138.
Fig. 2 is the partial section view that is presented at the heat generating component 132 of configuration in the groove 204 that forms in the substrate support assembly 138.Heat generating component 132 generally comprises several and is seated in the electric conductivity assembly 224 in the eelctric dipole 222 and covers with protection sheath 220.Heat generating component 132 also comprises the clad 210 that surrounds protection sheath 220.Clad 210 forms one with protection sheath 220, does not have air chamber in fact in one embodiment between its clad 210 and the sheath 220, and heat generating component 132 can wrap tightly with suitable coating synusia 210 around sheath 220 and be coated.Perhaps, clad 210 also can be formed by the pipeline of diameter greater than sheath 220, again via the mold pull and around sheath 220 bendings of heat generating component 132.In addition, expection heat generating component 132 also can comprise by clad 210 therebetween mobile for heat transfer fluid around pipeline (not shown) all around.
Generally speaking, clad 210 has good heat conductivity, and its thickness is enough to produce focus as heat radiator so that can prevent heat generating component 132 in fact during operation under the high rate of heat addition.So, clad 210 generally can comprise any material with high thermal conductivity so that the heat radiator of the heat that clad 210 can be during operation produced as electric conductivity assembly 224.The thickness of the clad 210 that various uses is required can calculate according to heat generating component 132 required thermal load quantity.The material of clad 210 is general also than body 124 softnesses of substrate support assembly 138, or has more malleability, in order to avoid make groove 204 distortion when inserting heat generating component 132.In one embodiment, clad 210 can be moulded aluminum by highly purified superfine and make, and for example aluminum 1100 is to about aluminium 3000100 series.In another embodiment, clad 210 can be born cold or hot 1XXX series material and made by any, and wherein X is an integer.Clad 210 can be annealed fully.In one embodiment, clad 210 is to form with aluminum 1100-0.Among another embodiment, clad 210 is to form with aluminium 3004.
Heat generating component 132 is disposed in the groove 204 that the upper surface 134 of substrate support assembly 138 forms, or in many grooves.In addition, can form at the lower side 126 of substrate support in order to the groove 204 that holds heat generating component 132.Groove 204 has a plurality of walls 206 and bottom 230, and it generally is not tight contact when assembling.Groove 204 can form with any number, size or pattern according to actual needs on the body 124 of substrate support assembly 138, to produce employed heat generating component 132 desired heat distribution kenels.The degree of depth of groove 204 generally be enough to after inserting groove 204, can make 132 of heat generating components on desired position and its degree of depth look purposes and difference.In one embodiment, the depth calculation of its groove 204 is the centres that make the upper body 124 at substrate support assembly 138 of heat generating component 132 essence.
In one embodiment, the diameter of groove 204 is bigger but littler than the diameter of clad 210 before inserting than the sheath 220 of heat generating component 132, as shown in Figure 4.Heat generating component 132 is to push embedding toward groove 204, so that the clad 210 of malleability is in the oxide layer toward fashionable distortion of groove 204 interpolations and destruction itself, so as to making the contact that globality is arranged between heat generating component 132 and the groove 204.Because the diameter of groove 204 is bigger than sheath 220, when in groove 204, inserting heat generating component 132, can't damage electric conductivity assembly 224 and eelctric dipole 222.
A plurality of walls 206 of groove 204 can be straight and parallel in fact.As required, a plurality of walls 206 of groove 204 can slightly form with angle or taper, and make the bottom 230 of groove 204 partly narrower slightly than the top of groove 204.Angle of taper between a plurality of walls 206 is generally less than 3 degree, though also can use bigger angle of taper.A plurality of walls 206 of taper make heat generating component 132 be easy to insert, and the formation globality contacts with body 124 tight attachings and groove 204 bottoms 230 that narrow down still are enough to make clad 210.
Groove 204 bottoms 230 can be radial to cooperate the shape of heat generating component 132.In addition, or simultaneously, the in addition alligatoring of groove 204 bottoms 230, or be textured, to help between heat generating component 132 clads 210 and substrate support assembly 138 bodies 124, forming sealing more closely or locking.Superficial makings also can prevent to produce displacement between heat generating component 132 and substrate support assembly 138 bodies 124.
In groove 204 bottoms 230, also can provide channel 228.Channel 228 can make air that heat generating component 132 and groove 204 are locked more when inserting heat generating component 132.When inserting heat generating component 132 in the groove 204, some 232 meeting distortion of clad 210 are filled up channel 228 and are contacted to property more comprehensively with substrate support assembly 138 bodies 124 integral body.There is no bubble in fact and rest between clad 210 and the groove 204, make that the heat transfer effect from heat generating component 138 toward substrate support assembly 138 bodies 124 more improves.As required, before inserting heat generating component 132, can clean groove 204 earlier to remove any existing oxide that is present on Surface Groove 204 surface of contact.For example, oxide layer can grind off with Corrosive Materia, etching, or elder generation is coated with the inhibitor layer of micron thickness last time to remove oxide layer at the surface of contact of Surface Groove 204 before inserting heat generating component 132.
Insert 214 is to be configured in top in the groove 204, heat generating component 132, and it is closely to contact with clad 210 and substrate support assembly 138 bodies 124.Insert 214 generally is by making with clad 210 identical materials, can improving the heat transmission of sending from heat generating component 132 more.The bottom of insert 214 partly 234 can be bending or be can with the more even shape that cooperates of upper surface of the clad 210 of heat generating component 132.In insert 214, can form several vent ports 226, so as when assembling insert 214 bottoms partly 234 and heat generating component 132 between air can discharge, so that the more contact of globality to be arranged between the clad 210 of guaranteeing insert 214 and heat generating component 132.In one embodiment, describe as Fig. 6, the lower portion 602 of insert 214 is to contact position, upper strata 604 with a plurality of walls 206 of groove 204 then summary is outstanding and do not touch a plurality of walls 206.For example, thousands of/inch can be given prominence in position, upper strata 604.The surface of reducing between a plurality of walls 206 of insert 214 and groove 204 contacts impels insert 214 to be easy to insert in the groove 204.Insert 214 is struck hammer, scrolling, pushes or forges when entering groove 204, can eliminate just that this is outstanding.The flexibility of insert 214 materials makes this process be easy to carry out and is unlikely and causes the material of body 124 to be out of shape in fact.After inserting groove 204, can repair insert 214 so that a real surface to be provided so that allow operculum colpi 218 cover on the insert 214.
Fig. 3 is the process flow diagram of embodiment of the manufacture method 300 of above-mentioned substrate support assembly.The method that Fig. 3 describes then further specifies with reference Fig. 4-7.Method 300 comprises step 302, and wherein heat generating component 132 is to be seated in the clad 210.In step 304, this heat generating component 132 is to be inserted in the groove 204 that forms in the substrate support assembly 138.Heat generating component 132 can be through the application of force, and for example, mechanical pressure or water pressure engine are forced to enter in the groove 204.The heat generating component 132 that also can utilize other method to be coated inserts in the groove 204.Show that as Fig. 4 because the thickness of clad 210, groove 204 is slightly narrower than the diameter of heat generating component 132 usually.The clad 210 of malleability can be out of shape when groove 204 is inserted in stressed pressure.This advantage can cause contact in fact fully between clad 210 and the groove 204, describes as Fig. 5.Also please refer to Fig. 5, in one embodiment, will force the some 232 of clad 210 to enter the channel 228 that in groove 204, forms with the application of force.
Next, in step 306, insert 214 is to insert groove 204 to cover heat generating component 132, describes as Fig. 6.Insert 214 has filled up the space that is not occupied by heat generating component 132 in the groove 204 in fact.Inserting the method for heat generating component 132 in the insert 214 general available step 304 pushes in the embedding groove 204.In case insert 214 has been installed, a clean positive force has just been arranged on the heat generating component 132.As described in the embodiment of Fig. 6 displaying, the upper surface 610 of insert 214 maintains the upper surface 134 a little more than substrate support assembly 138 after step 306.
At last, in step 308, an operculum colpi 218 (as Fig. 7) is to insert in the groove 204.Operculum colpi 218 can use the mode identical with step 304 and 308 to insert in the groove.Operculum colpi 218 compresses insert 214 and heat generating component 132 is applied clean positive force.When pushing insert 214, insert 214 outstanding parts 604 expand and contact with a plurality of walls 206 of groove 204.The overhang that position, insert 214 upper strata 604 provides and insert 214 upper surfaces 610 stretch out the degree of the upper surface 134 of substrate support assembly 138 can be according to pushing intensity and fully operculum colpi 218 being inserted in the grooves 204 the deformation calculating that can produce when flushing with the upper surface 134 of substrate support assembly 138.The degrees of expansion that should calculate insert 214 enables to fill up groove 204, and the optional groove 204 that makes is outwards opened, broadens or is out of shape to guarantee insert 214 to have globality to contact with a plurality of walls 206 of groove 204.
The step 308 that operculum colpi 218 inserts grooves 204 is finished operculum colpi 218 being covered promptly accuse after on substrate support assembly 138 bodies 124.As required, can repair the upper surface 134 of substrate support assembly and operculum colpi 218 is used for support base material with improvement upper surface 134.
Fig. 8 A-E shows the partial section view of substrate support 800 in the different fabrication phases among another embodiment.Material supporting component 800 generally comprises body 830, has at least a groove 802 to form on its stayed surface 134.Heat generating component 804 is to be configured in groove 802 interior temperature with management and control substrate support assembly 800.Body 830 generally be by with above-mentioned body 124 identical materials manufacturings, well heater 804 generally then be with above-mentioned heat generating component 132 materials similar manufacturings.
Groove 802 generally comprises a plurality of sidewalls 806 and a bottom 814.A plurality of sidewalls 806 can be from the bottom 814 outside flares, or form perpendicular to stayed surface 134 in fact, show as Fig. 8 A-E.Ladder 808 is to form at a plurality of sidewalls 806, and side wall upper part part 812 and lower sidewall part 810 are separated.Lower sidewall part 810 generally defines the narrower part of groove 802.
The first malleability heat radiator 816 is configured in the groove 802 and contacts with bottom 814.The first malleability heat radiator 816 can use and be applicable to the made of making above-mentioned clad 210.The upper surface of the first malleability heat radiator 816 can wrap in the recess 832 that wherein forms.Recess 832 generally can receive and put the some of heat generating component 804 in groove 802.
The second malleability heat radiator 818 is configured in the groove 802, and and first heat radiator 816 between clip hot assembly 804, show as Fig. 8 B.Second heat radiator 818 can be through measuring to produce a kind of obstacle that cooperates with the lower portion 812 of groove 802.Second heat radiator 818 can comprise a recess 836 that forms at its lower surface to accept and to place the some of heat generating component 804.Second heat radiator 818 is applicable to the made of producing above-mentioned clad 210, and in one embodiment, first and second heat radiator 816,818 is to use the same material manufacturing.In another embodiment, wherein at least one can high-purity, superfine plastics aluminum can make for first and second heat radiator 816,818, and for example aluminum 1100 is to about aluminium 3000100 series, and can additionally fully anneal.In another embodiment, clad 816,818 can be born cold or hot 1XXX series material and made by any, and wherein X is an integer.In another embodiment, first and second heat radiator the 816, the 818th is formed by aluminum 1100-0.First and second heat radiator 816,818 generally is to surround heat generating component 804 and itself and body 830 are separated.
The upper surface 834 of second heat radiator 818 generally extends to the height of ladder more than 808.Show that as Fig. 8 C instrument 820 can insert in the groove 802 so that heat radiator 816,818 is exerted pressure.Instrument 820 causes malleability material (including heat radiator 816,818) distortion and closely contacts with a plurality of sidewalls 806 and the heat generating component 804 of body 830.Therefore original oxide layer on the tight contact failure surface in contact that is caused by heat radiator 816,818 deformation, has improved the heat transmission of heat generating component 804 and body 830.In deformation process, the top 834 of last heat radiator 818 (second heat radiator 818) generally just flushes with ladder 808.
Then operculum colpi 822 is inserted in the groove 802, cover heat radiator 816,818 and heat generating component 804.Generally speaking operculum colpi 822 is to utilize the made that is suitable for making above-mentioned operculum colpi 218.Operculum colpi 822 can be made up of one or more layers material layer of being separated by.Among the embodiment that Fig. 8 D describes, operculum colpi 822 comprises three layers.
Fig. 9 A-E shows the partial section view of substrate support 900 in the different fabrication phases among another embodiment.Substrate support assembly 900 generally comprises body 830, has at least a groove 802 to form on its stayed surface 134.Heat generating component 804 is configured in groove 802 interior temperature with management and control substrate support assembly 900.
The first malleability heat radiator 916 is configured in the groove 802 and contacts with bottom 814.The first malleability heat radiator 916 generally is a made of making above-mentioned heat radiator 816 to be applicable to.The section that the first malleability heat radiator 916 generally has the C shape.In the embodiment of Fig. 9 A-E, first heat radiator 916 comprises central principal part part 904 and two extension suspension columns 902.Suspension column 902 respectively comprises a top 906, an inwall 910 and an exterior wall 908.The structure of exterior wall 908 is the lower portion 812 that are used for engaged groove 802.The top 906 of the first malleability heat radiator 916 may extend to above the ladder 808 that more than 802 sidewall of groove 806 forms.Recess 932 can form at the upper surface of the first malleability heat radiator, 916 central parts 904.Recess 932 generally can receive and put the some of heat generating component 804 in groove 802.
It is interior between the suspension column 902 of the first malleability heat radiator 916 that the second malleability heat radiator 918 is configured in groove 802, shows as Fig. 9 B.Clip heat generating component 804 between first and second heat radiator 916,918.Second heat radiator 918 can comprise a recess 936 that forms at its lower surface to accept and to put the some of heat generating component 804.Second heat radiator 918 can be with being applicable to the made of making above-mentioned clad 916, and in one embodiment, first and second heat radiator 916,918 is to use the same material manufacturing.For example, wherein at least one can high-purity, superfine plastics aluminum makes for first and second heat radiator 916,918, and for example aluminum 1100 is to about aluminium 3000-100 series, and can additionally fully anneal.In another embodiment, clad 916,918 can be born cold or hot 1XXX series material and made by any, and wherein X is an integer.In another embodiment, first and second heat radiator the 916, the 918th is formed by aluminum 1100-0.First and second heat radiator 916,918 is general to be surrounded heat generating components 804 and makes it and body 830 separates.
One upper surface 934 of second heat radiator 918 extends to the height of ladder more than 808 usually.Show that as Fig. 9 C an instrument 820 can insert in this groove 802 so that heat radiator 916 and 918 is exerted pressure.This instrument 820 causes malleability material (comprising heat radiator 916,918) distortion, and closely contacts with heat generating component 804 with a plurality of sidewalls 806 of body 830, has therefore improved the heat transmission between heat generating component and the body 830.In deformation process, the top 906,934 of first and second heat radiator 916,918 flushes with ladder 808 usually.Second heat radiator 918 is inserted grooves 802 can cause first heat radiator, 916 suspension columns 902 and body 830 and second heat radiator 918 reciprocation each other, and then destroyed oxide layer existing on the surface in contact.The destruction of oxide layer and/or removal can improve the heat transmission between heat generating component 804 and the body 803.
In the embodiment of Fig. 9 D-E, operculum colpi is by continuous welding place 824 coupling bodies 830.After the welding, the upper surface 838 of operculum colpi can be repaired or be made it to flush with the upper surface 134 of body.In the embodiment of Fig. 9 E, the upper surface 138 of operculum colpi 822 is to be trimmed to stayed surface 134 to flush.
Therefore, the substrate support assembly embodiment that is provided has good heat conductivity between the heat generating component of embedding and substrate support body.Utilize the effect of a malleability material to make closely contact between heat generating component and the substrate support body, and the groove that failed call is put heat generating component has accurate tolerance deviation to machine-building, therefore can reduce the cost of substrate support assembly and improve the usefulness of well heater.
Though above-mentioned explanation about embodiments of the invention, reaches more embodiment of the invention and do not break away from its basic area yet yet also can become other through modification, its field is defined by claims.
Claims (49)
1. substrate support comprises:
One body has a stayed surface;
At least one groove is formed in this body;
One heat generating component is configured in the described groove; And
One heat radiator contacts around described heat generating component and with this heat generating component and body.
2. substrate support as claimed in claim 1 is characterized in that, described heat radiator comprises: aluminium, its heat conductivity is higher than this body.
3. substrate support as claimed in claim 1 is characterized in that, described heat radiator comprises:
One aluminium alloy, it is to be selected from serial 1XXX (wherein X is an integer) to serial 3000-100 aluminium.
4. substrate support as claimed in claim 1 is characterized in that described heat radiator comprises aluminium 3004.
5. substrate support as claimed in claim 1 is characterized in that, described heat radiator is through annealing.
6. substrate support as claimed in claim 1 is characterized in that, there is no air in fact between this heat radiator and this heat generating component.
7. substrate support as claimed in claim 1 is characterized in that, it is tubaeform to what extend out that the trench wall of the opposite face of described groove is.
8. substrate support as claimed in claim 1 is characterized in that, also comprises:
One is formed on the channel of contiguous this channel bottom, and wherein this channel comes down to be full of by described heat radiator.
9. substrate support as claimed in claim 1 is characterized in that, also comprises:
One insert, it is positioned at this groove internal heat generation assembly top.
10. substrate support as claimed in claim 9 is characterized in that, also comprises:
One or more vent ports, its formation also runs through this insert.
11. substrate support as claimed in claim 9 is characterized in that, described insert comprises and this heat radiator identical materials.
12. substrate support as claimed in claim 1 is characterized in that, also comprises: one is configured in the operculum colpi in this groove.
13. substrate support as claimed in claim 12 is characterized in that, an outside surface of described operculum colpi comes down to dispose at grade with this stayed surface.
14. substrate support as claimed in claim 12 is characterized in that, described operculum colpi is at least through welding or forging on its position.
15. substrate support as claimed in claim 1 is characterized in that, the Area of bearing of described supporting surface is taken advantage of about 650 millimeters more than or equal to about 550 millimeters.
16. substrate support as claimed in claim 1 is characterized in that, described surface-supported supporting surface comes down to polygon.
17. a substrate support comprises:
One aluminum body has a stayed surface and at least one groove;
One heat generating component, it is coating the malleability heat radiator all around and can embed in this groove through pushing;
One insert is configured in this groove, and wherein this insert is to contact with a plurality of walls of heat generating component and groove; And
One operculum colpi is configured in this groove, and the outside surface of this operculum colpi flushes configuration with body in fact.
18. substrate support as claimed in claim 17 is characterized in that, described heat radiator comprises:
One aluminium alloy is selected from about aluminium 1XXX (wherein X is an integer) to about aluminium 3000-100 series.
19. substrate support as claimed in claim 17 is characterized in that, described heat radiator comprises: aluminium 3004.
20. a substrate support comprises:
One aluminum body has a stayed surface;
This at least one groove is formed in this body;
One first malleability heat radiator is configured in this groove;
One heat generating component is configured in this groove and contacts with this first heat radiator; And
One second malleability heat radiator is configured in this groove and contacts with first heat radiator and heat generating component.
21. substrate support as claimed in claim 20 is characterized in that, described first heat radiator comprises: aluminum, its heat conductivity is higher than this body.
22. substrate support as claimed in claim 20 is characterized in that, described first and second heat radiator comprises:
Aluminium alloy, it is to be selected from serial 1XXX to serial 3000-100 aluminium, wherein this X is an integer.
23. substrate support as claimed in claim 20 is characterized in that, at least one heat radiator comprises aluminium 3004.
24. substrate support as claimed in claim 20 is characterized in that, at least one heat radiator is annealed.
25. substrate support as claimed in claim 20 is characterized in that, described second heat radiator is to embed in the groove through pushing.
26. substrate support as claimed in claim 20 is characterized in that, has ladder to form in described a plurality of trench walls at least one trench wall.
27. substrate support as claimed in claim 20 is characterized in that, also comprises:
One or more operculum colpis are configured on this ladder and envelope heat generating component and heat radiator in this groove, and wherein this a plurality of trench walls are outwards to expand to be less than the about 3 sealing angles of spending.
28. substrate support as claimed in claim 27 is characterized in that, also comprises:
One operculum colpi, it is configured in the groove and at least one is welding or forges on its position.
29. substrate support as claimed in claim 28 is characterized in that, described operculum colpi comprises and this body identical materials.
30. substrate support as claimed in claim 20 is characterized in that, also comprises:
One pressure seal, it is between the atmosphere that is configured in outside this second heat radiator and the groove.
31. substrate support as claimed in claim 20 is characterized in that, described first heat radiator also comprises: by a plurality of suspension columns that this first heat radiator extends, wherein this second heat radiator is to be configured between these suspension columns.
32. a substrate support is characterized in that, comprises:
One aluminum body has a stayed surface and at least one groove;
One heat generating component is configured in this groove;
One first malleability heat radiator, comprise an aluminium alloy, be selected from about aluminium 1XXX (wherein X is an integer) to about aluminium 3000-100 series and to be configured in this groove interior and this heat generating component and this body separated, this first heat radiator has a plurality of suspension columns, and it is along being extended outward by a plurality of walls that this groove defined by a central part;
One second malleability heat radiator comprises an aluminium alloy, is selected from about aluminium 1XXX (wherein X is an integer) to about aluminium 3000-100 series, and can be through pushing between the suspension column that embeds this first heat radiator, and this first and second heat radiator can separate this heat generating component and this body; And
One operculum colpi is configured in this groove, and the outside surface of described operculum colpi flushes with this body stayed surface in fact.
33. a method that forms a substrate support is characterized in that, comprises following steps:
The step of one body is provided, and this body has at least one groove and forms in its surface;
Insert the step of a heat generating component in this groove, wherein this heat generating component is to be seated in the skin of a clad, there is no air in fact and exist between this clad and heat generating component, and this clad is suitable as a heat radiator and uses;
One insert is configured in the step of the heat generating component top that is coated in this groove; And
One operculum colpi is inserted step in this groove, and wherein an outside surface of this operculum colpi comes down to flush configuration with body.
34. method as claimed in claim 33 is characterized in that, described clad comprises:
One aluminium alloy, it is selected from about aluminium 1XXX (wherein X is an integer) to about aluminium 3000-100 series.
35. a method that forms a substrate support, it comprises following steps:
The step of one body is provided, and this body has at least one groove and is formed on its stayed surface;
One heat generating component is inserted step in this groove, and this heat generating component is to use material than this body softness to coat and suitable to use as a heat radiator;
Cover the step of the heat generating component coated with being configured in a insert in this groove; And
Cover the step of this groove with an operculum colpi, a upper surface of this operculum colpi comes down to and supports the upper surface flush configuration.
36. method as claimed in claim 35 is characterized in that, also comprises:
The step that to be discharged through the channel of contiguous this channel bottom at the gas between this heat generating component and the body.
37. method as claimed in claim 35 is characterized in that, the step of described coating heat generating component also comprises:
Around this heat generating component, dispose the step of comfortable clad material sheet.
38. method as claimed in claim 35 is characterized in that, the step that the described heat generating component that will be coated inserts groove also comprises:
Before the heat generating component that will be coated inserts, the step that the original oxide layer of flute surfaces is removed by elder generation.
39. method as claimed in claim 35 is characterized in that, the step that the described heat generating component that will be coated inserts this groove also comprises:
The heat generating component that is coated is pushed the step that embeds in the groove.
40. method as claimed in claim 35 is characterized in that, provides the step of the body with at least one groove also to comprise:
With this trench bottom surfaces step of roughening in addition.
41. method as claimed in claim 35 is characterized in that, the step of described covering groove also comprises:
This operculum colpi is welded on its locational step.
42. a method that forms a substrate support comprises following steps:
The step of one aluminum body is provided, and this aluminum body has at least one groove and forms in its surface;
The step of configuration one first malleability heat radiator in this groove;
One heat generating component is inserted the step of this groove;
With the step of one second malleability fin arrangement above this groove internal heat generation assembly;
To this second heat radiator fully exert pressure make at least one heat radiator can and the step that closely contacts of this body; And
With the step that an operculum colpi inserts this groove and sealed, wherein the outside surface of this operculum colpi comes down to flush with this body.
43. a method that forms a substrate support, it comprises following steps:
The step of one aluminum body is provided, and this aluminum body has at least one groove and forms in its surface;
Include the aluminum first malleability heat radiator more soft with one and insert step in this groove than this body material;
Include the aluminum second malleability heat radiator more soft than this body material with one and insert step in this groove, this first and second heat radiator sandwich has a heat generating component; And
With the step of an operculum colpi covering groove, a upper surface of this operculum colpi comes down to and this support upper surface flush configuration.
44. method as claimed in claim 43 is characterized in that, also comprises:
Remove the step of the original oxide layer of this flute surfaces.
45. method as claimed in claim 43 is characterized in that, the step of described covering groove also comprises:
At least one operculum colpi is welded or forges in its locational step.
46. method as claimed in claim 43 is characterized in that, the described step that second heat radiator is inserted this groove also comprises:
Make the paired step of this first and second heat radiator.
47. method as claimed in claim 43 is characterized in that, the described step that second heat radiator is inserted this groove also comprises:
The some of this second heat radiator is inserted into step in the feature that is defined by this first heat radiator.
48. method as claimed in claim 43 is characterized in that, the described step that second heat radiator is inserted this groove also comprises:
This second heat radiator is inserted into step between the suspension column that this first heat radiator extends outward.
49. method as claimed in claim 48 is characterized in that, the described step that second heat radiator is inserted between the suspension column of this first heat radiator also comprises: make this suspension column of this first heat radiator abut against the step of a plurality of walls of this groove.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/965,601 US20060075970A1 (en) | 2004-10-13 | 2004-10-13 | Heated substrate support and method of fabricating same |
| US10/965,601 | 2004-10-13 | ||
| US11/115,575 US7674338B2 (en) | 2004-10-13 | 2005-04-26 | Heated substrate support and method of fabricating same |
| US11/115,575 | 2005-04-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1760722A true CN1760722A (en) | 2006-04-19 |
| CN1760722B CN1760722B (en) | 2010-11-24 |
Family
ID=36144021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2005100939345A Expired - Fee Related CN1760722B (en) | 2004-10-13 | 2005-08-19 | Heated substrate support and method of fabricating same |
Country Status (2)
| Country | Link |
|---|---|
| US (3) | US20060075970A1 (en) |
| CN (1) | CN1760722B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8124915B2 (en) * | 2003-05-09 | 2012-02-28 | Pregis Intellipack Corporation | Sealing device |
| SG144830A1 (en) * | 2007-01-18 | 2008-08-28 | Applied Materials Inc | High temperature fine grain aluminum heater |
| US20090078202A1 (en) * | 2007-09-26 | 2009-03-26 | Neocera, Llc | Substrate heater for material deposition |
| US9917001B2 (en) * | 2008-01-21 | 2018-03-13 | Applied Materials, Inc. | High temperature fine grain aluminum heater |
| JP5791412B2 (en) * | 2010-07-26 | 2015-10-07 | 日本碍子株式会社 | Ceramic heater |
| US9490150B2 (en) | 2012-07-03 | 2016-11-08 | Applied Materials, Inc. | Substrate support for substrate backside contamination control |
| US11330673B2 (en) | 2017-11-20 | 2022-05-10 | Applied Materials, Inc. | Heated substrate support |
| US11499229B2 (en) * | 2018-12-04 | 2022-11-15 | Applied Materials, Inc. | Substrate supports including metal-ceramic interfaces |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US1087198A (en) * | 1913-11-12 | 1914-02-17 | Clarence S Steward | Electric heating unit. |
| US1969760A (en) * | 1932-05-26 | 1934-08-14 | American Instr Company | Electric heater |
| US2222192A (en) * | 1938-10-12 | 1940-11-19 | Westinghouse Electric & Mfg Co | Flatiron |
| US2389588A (en) * | 1942-10-29 | 1945-11-27 | Westinghouse Electric Corp | Heating apparatus |
| US2541118A (en) * | 1945-04-11 | 1951-02-13 | Birtman Electric Co | Resistance element for electric irons |
| US2875312A (en) * | 1956-09-27 | 1959-02-24 | Thermel Inc | Heating assembly and method of production thereof |
| US5104459A (en) * | 1989-11-28 | 1992-04-14 | Atlantic Richfield Company | Method of forming aluminum alloy sheet |
| CN1076326A (en) * | 1992-03-12 | 1993-09-15 | 淄博电热电器厂 | Combined type electric heating plate moulding process and electric heating plate |
| US5844205A (en) * | 1996-04-19 | 1998-12-01 | Applied Komatsu Technology, Inc. | Heated substrate support structure |
| US5963840A (en) * | 1996-11-13 | 1999-10-05 | Applied Materials, Inc. | Methods for depositing premetal dielectric layer at sub-atmospheric and high temperature conditions |
| US6035101A (en) * | 1997-02-12 | 2000-03-07 | Applied Materials, Inc. | High temperature multi-layered alloy heater assembly and related methods |
| US6376815B1 (en) * | 1998-01-12 | 2002-04-23 | Furukawa Electric Co., Ltd. | Highly gas tight substrate holder and method of manufacturing the same |
| US6147334A (en) * | 1998-06-30 | 2000-11-14 | Marchi Associates, Inc. | Laminated paddle heater and brazing process |
| US6087632A (en) * | 1999-01-11 | 2000-07-11 | Tokyo Electron Limited | Heat processing device with hot plate and associated reflector |
| JP2000243542A (en) * | 1999-02-24 | 2000-09-08 | Nhk Spring Co Ltd | Heater unit and manufacture thereof |
| US6477980B1 (en) * | 2000-01-20 | 2002-11-12 | Applied Materials, Inc. | Flexibly suspended gas distribution manifold for plasma chamber |
| US6500356B2 (en) * | 2000-03-27 | 2002-12-31 | Applied Materials, Inc. | Selectively etching silicon using fluorine without plasma |
| US20010035403A1 (en) * | 2000-05-18 | 2001-11-01 | Albert Wang | Method and structure for producing flat wafer chucks |
| US6506291B2 (en) * | 2001-06-14 | 2003-01-14 | Applied Materials, Inc. | Substrate support with multilevel heat transfer mechanism |
| KR100430604B1 (en) * | 2001-11-23 | 2004-05-10 | 주성엔지니어링(주) | Molding heater used for heating wafer and fabrication method thereof |
| US6897411B2 (en) * | 2002-02-11 | 2005-05-24 | Applied Materials, Inc. | Heated substrate support |
| JP2003253449A (en) * | 2002-02-27 | 2003-09-10 | Sumitomo Electric Ind Ltd | Semiconductor or liquid crystal manufacturing apparatus |
| KR20040075178A (en) | 2003-02-20 | 2004-08-27 | 엘지전자 주식회사 | fabricating apparatus for oxide thin film |
| US7154070B2 (en) * | 2004-10-08 | 2006-12-26 | Furukawa-Sky Aluminum Corp. | Heater plate and a method for manufacturing the heater plate |
-
2004
- 2004-10-13 US US10/965,601 patent/US20060075970A1/en not_active Abandoned
-
2005
- 2005-04-26 US US11/115,575 patent/US7674338B2/en not_active Expired - Fee Related
- 2005-08-19 CN CN2005100939345A patent/CN1760722B/en not_active Expired - Fee Related
-
2008
- 2008-07-23 US US12/178,228 patent/US8065789B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US7674338B2 (en) | 2010-03-09 |
| US20060075971A1 (en) | 2006-04-13 |
| US20080271309A1 (en) | 2008-11-06 |
| US20060075970A1 (en) | 2006-04-13 |
| CN1760722B (en) | 2010-11-24 |
| US8065789B2 (en) | 2011-11-29 |
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