CN1755856A - Multi-beam photoelectric sensor - Google Patents

Abstract

The invention provides a photoelectric sensor with a plurality of optical axes which has width of a corresponding dangerous area and a diameter of a minimal detecting object and can flexibly change the length of a cylinder for light projection and receiving, the number of optical shafts, the distance between optical shafts, etc. A light projection and receiving device series comprises an optical module series, a common conducting wire and a conducting wire between adjacent modules, wherein, the optical module series only consists of a plurality of optical modules which are arranged into a row, the optical module consists of an optical system of an optical shaft 1, a light projection circuit of the optical shaft 1 and a primary trigger corresponding to a shift register which are connected into an integral body, the common conducting wire is corporately connected with a module for light projection from one end to the other end of a module series for light projection, the conducting wire between adjacent modules is only connected with an adjacent module for light projection, each optical module forming the optical module series is respectively connected with a belt-shaped cable; therefore, the conducting wire between adjacent modules is used to connect the trigger inside the adjacent optical module subordinatively to form the shift register. Therefore, the ordinal operation of each optical module of the optical module series is formed according to the data sent by the shift register in sequence.

Description

Multi-beam photoelectric sensor

Technical field

The present invention relates to be used to monitor the multi-beam photoelectric sensor of human body of swarming into the deathtrap etc., particularly correspondence can change the multi-beam photoelectric sensor of projection and accepted light with length, optical axis number and the optical axis spacing etc. of cylinder neatly as the width of the deathtrap of object, the diameter that minimum detects object etc.

Background technology

This multi-beam photoelectric sensor, as everyone knows, have light projector row be accommodated in the light projector made in the column shape container with cylinder and light-receiving device be listed as be accommodated in make in the column shape container be subjected to the light cylinder, by making those projection and accepted lights vacate proper spacing, dispose in the opposed mode of projection and accepted light face with cylinder, the product health check-up goes out to use up curtain between projection and accepted light is with cylinder.

At present, the projection and accepted light device row of taking in the column shape container, generally the combination by the multiaxis optical module with unit optical axis number (for example, 4 optical axises, 8 optical axises, 16 optical axises etc.) constitutes.This multiaxis optical module is, the optical parameter of unit optical axis number (words of light projector are exactly light-emitting component and light projector lens, and the words of light-receiving device are exactly photo detector and sensitive lens), and by the fixing resin frame of optical interval, the device that has kept integratedly.

; existing like this multi-beam photoelectric sensor; because be combination according to the fixing multiaxis optical module of optical axis number and optical axis spacing; decide the device of the projection and accepted light length of cylinder, optical axis number, optical axis spacing etc.; so the width of corresponding deathtrap as object, the diameter that minimum detects object etc., change projection and accepted light neatly is very difficult with length, optical axis number and the optical axis spacing etc. of cylinder.

Therefore, the applicant, at first proposing to have the light projector row that are accommodated in the column shape container and light-receiving device row is motions (with reference to patent documentation 1) of the new multi-beam photoelectric sensor that constitutes of the aggregate with 1 optical module.

According to this new multi-beam photoelectric sensor, because be accommodated in light projector row and light-receiving device row in the column shape container, aggregate by 1 optical module constitutes, can select projection and accepted light with the length of cylinder and make with 1 optical axis unit, so the advantage that can generate the light curtain that precisely is fit to width as the deathtrap of object is arranged.

Patent documentation 1:JP spy opens the 2002-124170 communique.

Like this with previous the applicant's the relevant multi-beam photoelectric sensor of motion, the formation light projector is with optical system or be subjected to the optical element of light with optical system, be accommodated in the individual module certainly, compare with existing light curtain, the light curtain that can easier generation precisely be fit to width as the deathtrap of object, but for corresponding each module, the electric parts that is called light projector circuit and light receiving circuit, because prepare the circuit substrate of the optical module of corresponding a plurality of different numbers in advance, make its optical module corresponding by their combinations, so be necessary to maintain in advance the circuit substrate of a plurality of kinds as the stock with arbitrary number.Therefore, for circuit substrate, the stock control number of parts can not reduce to below the some.

Summary of the invention

The invention provides a kind of multi-beam photoelectric sensor, it is for the identical electric parts that is used for each optical axis, make per 1 optical axis carry out modularization,, can reduce the number of the kind of pre-prepd circuit substrate in order to generate the light curtain that precisely is fit to width as the deathtrap of object.

Other purposes and the action effect that also have about the present invention are by the record with reference to following specification, if professional's words should be understood than being easier to.

Multi-beam photoelectric sensor of the present invention is, have light projector row be accommodated in the light projector made in the column shape container with cylinder and light-receiving device be listed as be accommodated in make in the column shape container be subjected to the light cylinder, by making those light projectors with cylinder and be subjected to light to vacate proper spacing, dispose in the opposed mode of projection and accepted light face with cylinder, thus light projector with cylinder and be subjected to light with cylinder between the product health check-up device that goes out to use up act.

In this multi-beam photoelectric sensor, the light projector row contain light projector module column and light projector signal transmission member, this light projector module column is only a plurality of light projectors to be formed a line with module and form, this light projector light projector optical system of module by 1 optical axis, the light projector circuit of 1 optical axis, 1 grade the trigger that is equivalent to shift register is integrated and constitute, this light projector signal transmission member, it has common conductor wire and in abutting connection with the intermodule conductor wire, this common conductor wire, jointly connect from be positioned at light projector with the light projector of an end of module column with module to the light projector module that is positioned at the other end, this is in abutting connection with the intermodule conductor wire, only between adjacent light projector is with module, be connected to each other, and constitute light projector each light projector module, be electrically connected with signal transmission member with light projector respectively with module column.

Light-receiving device row contain be subjected to light with module column be subjected to the light signal transmission member, this is subjected to the light module column is only formed a line with module by light and form a plurality of, this is subjected to light to be subjected to the light optical system with module by 1 optical axis, the light receiving circuit of 1 optical axis, 1 grade the trigger that is equivalent to shift register is integrated and constitute, this is subjected to the light signal transmission member, it has common conductor wire and in abutting connection with the intermodule conductor wire, this common conductor wire, jointly connecting from being positioned at is subjected to light to be subjected to light module with module to what be positioned at the other end with the light that is subjected to of an end of module column, this is in abutting connection with the intermodule conductor wire, only be connected to each other between with module at the adjacent light that is subjected to, and constitute be subjected to light with module column respectively be subjected to the light module, be electrically connected with signal transmission member with being subjected to light respectively.

And the light projector of adjacency is with between the trigger in the module, and adjacency be subjected to light with between the trigger in the module, use and carry out subordinate in abutting connection with the intermodule conductor wire and connect, constitute shift register.

Thus, according to the data that transmitted successively by shift register, the formation light projector is worked by light with each light projector of module column successively with module with the light that respectively is subjected to of module column with module and formation.

According to such structure, respectively light projector with module and be subjected to light with module on, not only take in the optical system (light projector optical system or be subjected to the light optical system) of 1 optical axis, even also taken in 1 grade the trigger being equivalent to shift register and the electric circuit (light projector circuit or light receiving circuit) of 1 optical axis.The light projector of adjacency is with between the trigger in the module, and the light that is subjected to of adjacency is used between the interior trigger of module, carrying out subordinate with adjacency intermodule conductor wire connects, thereby formation shift register, based on having or not of the bit of this shift register, make optical axis validation selectively, carry out the working successively of a plurality of optical axises of light curtain.Therefore, by number and the interval repeated arrangement of each 1 axle module (light projector is with module or be subjected to the light module) being used expectation, and be connected with each conductor wire of signal transmission member (light projector is with signal transmission member or be subjected to the light signal transmission member) (common conductor wire with in abutting connection with the intermodule conductor wire), though for the optical axis number what, be used for the necessary at least part of each optical axis, can collect in light projector with module and be subjected to light to make the light curtain with module.That is, can reduce part kind number.The stock of different circuit substrates who there is no need to prepare the optical axis number of corresponding a plurality of kinds is self-evident.And, for the not reusable the sort of member of each optical axis, cut off with suitable length for signal transmission member, column shape container and light projector are with cylinder and be subjected to the light cylinder, the member in use is same shape perpendicular to the section of longitudinal direction in the optional position of the longitudinal direction of post member (for example extrusion molding member) and, cycle relevant with the longitudinal direction of post, by cutting off with suitable length, can be the minimization of part kind number.

In addition, signal transmission member forms with common conductor wire with in abutting connection with the intermodule conductor wire is integrated also under the state of insulation that keeps conductor wire separately.

According to such structure, be used for light projector with signal transmission member and light projector with module or be subjected to light to become easy with the operation that is electrically connected that is subjected to light with module with signal transmission member.Especially, in abutting connection with the intermodule conductor wire, because do not having when integrated, be scattered here and there a plurality of short-terms, quantity control and operation are pretty troublesome, if but integrated, handle and can also can come simply and exactly to hold the number of its line by the length of signal transmission member as a coherent signal transmission member than being easier to.

At this moment, the light projector signal transmission member also can be when having a plurality of heart yearns, and specific heart yearn is made into the flat cable of being cut apart by a plurality of perforation, and specific heart yearn plays a role in abutting connection with the intermodule conductor wire as only interconnective between adjacent block.Same, be subjected to the light signal transmission member, also can be when having a plurality of heart yearns, specific heart yearn is made into the flat cable of being cut apart by a plurality of perforation, and specific heart yearn plays a role in abutting connection with the intermodule conductor wire as only interconnective between adjacent block.

If adopt such flat cable, on specific heart yearn,, only its enforcement is called the processing of cutting apart with suitable spaced perforation, just can on flat cable, simply realize common conductor wire and in abutting connection with the intermodule conductor wire.

In addition, the light projector optical system contains light-projecting component, and when the circuit component that is equivalent to light-projecting component, light projector circuit and trigger is accommodated into the IC encapsulation, can go between the lead-in wire of IC encapsulation as the pressure welding that flat cable connects usefulness, the IC encapsulation can be connected on the flat cable in pressure welding.Equally, be subjected to the light optical system to contain photo detector, and when the circuit component that is equivalent to photo detector, light receiving circuit and trigger is accommodated into the IC encapsulation, can go between the lead-in wire of IC encapsulation as the pressure welding that flat cable connects usefulness, the IC encapsulation can be connected on the flat cable in pressure welding.

According to such structure, even if the flat cable side is not provided with any socket, also can encapsulate the optional position that is connected to simply on the flat cable to IC, projection and accepted light can be changed more neatly with length, optical axis number and the optical axis spacing etc. of cylinder.

And, the light projector module is, make under the state of lens component that constitutes the light projector optical system and IC encapsulation the carrying out optical axis coupling of taking in optical element, come incorporate light projector optical module by the optical element frame, the IC encapsulation, light-projecting component is installed on lead frame at least and makes lead frame and go between and offer the hole of location usefulness for same member, at the bend of this lead-in wire, the optical element frame can be formed with the projection of location usefulness in the corresponding position, hole with the location usefulness of the bend that is opened in lead-in wire.

Equally, be subjected to the light module to be, make under the state that constitutes lens component that is subjected to the light optical system and IC encapsulation the carrying out optical axis coupling of taking in optical element, come the incorporate light optical module that is subjected to by the optical element frame, the IC encapsulation, photo detector is installed on lead frame at least, and make lead frame and lead-in wire be same member, offer the hole of location usefulness at the bend of this lead-in wire, the optical element frame can be formed with the projection of location usefulness in the corresponding position, hole with the location usefulness of the bend that is opened in lead-in wire.

According to such structure, when this IC encapsulation is installed on flat cable, location for the lens component of optical element (light-projecting component and photo detector), do not utilize the profile of the casting mold body etc. of IC encapsulation, and, can improve the accuracy of location by making and being consistent for hole, the location of optical element frame with the location usefulness of the bend that is arranged on lead-in wire of projection.

At this moment, also can be the hole of location usefulness as the hole of opening at the bend of lead-in wire.According to such structure, if IC encapsulation be defined as upside, flat cable is defined as downside, because the limit of interior all downsides in hole, play the effect of the contact site when lead-in wire is penetrated flat cable, simultaneously, be present in limit in the vertical plane for above-below direction, play the effect of the connecting portion that location left-right and front-back direction uses, so when this IC encapsulation is penetrated flat cable, owing to the lead-in wire from directly over be pressed into the deflection that is not easy to cause lead-in wire, so be not easy to take place the small dislocation of the optical element on the lead frame, the advantage of keeping the optical axis performance arranged.

The hole of location usefulness be shaped as cubic hole, can be for up and down all directions all around, the limit with straight line constitutes the hole respectively.

In addition, use in the signal transmission member at light projector, jointly connect from being positioned at light projector and use the common conductor wire of module with the light projector of an end of module column with module to the light projector that is positioned at the other end, contain light projector electric current supplying wire and conversion clock line and ground wire, and the D input of trigger can be connected to adjacently, the Q output of trigger be connected to adjacent in abutting connection with intermodule conductor wire other party in abutting connection with intermodule conductor wire one side.Equally, be subjected to light with in the signal transmission member, jointly connecting from being positioned at is subjected to light to be subjected to light common conductor wire with module with module to what be positioned at the other end with the light that is subjected to of an end of module column, contain and be subjected to photoelectric current supply line and conversion clock line and ground wire, and the D input of trigger can be connected to adjacently, the Q output of trigger be connected to adjacent in abutting connection with intermodule conductor wire other party in abutting connection with intermodule conductor wire one side.

According to such structure, only, just can make the suitable work of electric circuit in the IC encapsulation by the arrangement of suitable design to the lead-in wire of IC encapsulation.

According to the present invention, by number and the interval repeated arrangement of each 1 axle module (light projector is with module or be subjected to the light module) being used expectation, and be connected with each conductor wire of signal transmission member (light projector is with signal transmission member or be subjected to the light signal transmission member) (common conductor wire with in abutting connection with the intermodule conductor wire), though for the optical axis number what, be used for the necessary at least part of each optical axis, can collect in light projector with module and be subjected to light to make the light curtain with module.

Description of drawings

Fig. 1 is the stereoscopic figure that light projector related to the present invention is used (used by light) cylinder.

Fig. 2 is the stereogram of seeing from front one side of transducer assembly.

Fig. 3 is the stereogram of seeing from the back side one side of transducer assembly.

Fig. 4 is the exploded perspective view of transducer assembly.

Fig. 5 is the exploded perspective view of many optical axises assembly.

Fig. 6 is the exploded perspective view (its 1) of 1 optical module.

Fig. 7 is the exploded perspective view (its 2) of 1 optical module.

Fig. 8 is the profile of 1 optical module (one-piece type).

Fig. 9 (a), Fig. 9 (b) are the in-built profiles of expression encapsulation light IC.

Figure 10 is the location structure key diagram (its 1) of optical element frame and encapsulation light IC.

Figure 11 is the location structure key diagram (its 2) of optical element frame and encapsulation light IC.

Figure 12 (a), Figure 12 (b) are the location structure key diagrams (its 3) of optical element frame and encapsulation light IC.

Figure 13 (a), Figure 13 (b) are the key diagrams of the variation of 1 optical module of expression.

Figure 14 is the profile of the connection state of expression flat cable and pressure welding formula lead-in wire.

Figure 15 is the key diagram of the maintenance structure of flat cable.

Figure 16 is the exploded perspective view of the state before the expression shielding component sets dress.

Figure 17 is the key diagram of the conducting structure of shield member and supporting frame.

Figure 18 is the exploded perspective view of the state behind the expression shielding component sets dress.

Figure 19 is the stereogram of the structure of indication circuit part assembly.

Figure 20 (a), Figure 20 (b) are the key diagrams of the inaccessible structure in front of column shape container.

Figure 21 is the profile of light projector with (used by light) cylinder.

Figure 22 is the key diagram (its 1) of the variation of expression shielding structure.

Figure 23 (a), Figure 23 (b) are the key diagrams (its 2) of the variation of expression shielding structure.

Figure 24 is all circuit diagrams of multi-beam photoelectric sensor related to the present invention.

Figure 25 is the sequential chart of all work of display circuit.

Figure 26 is the key diagram in the moment of conversion clock.

Embodiment

Below, with reference to accompanying drawing, describe the execution mode that the present invention suits in detail.The stereoscopic figure of the light projector usefulness that the present invention relates to (used by light) cylinder as shown in Figure 1.Shown in figure, the multi-beam photoelectric sensor that the present invention relates to, the cylinder 10 that the light projector of subtend configuration is used and used by light when having use.

The container of this cylinder 10, have column shape container body 101, block this column shape container body one open-ended end cap 102, block the other end opening end cap 103, block the front panel 104 of front one side.Describe in detail as described later, column shape container body 101, end cap the 102, the 103rd, metal, and section slightly is the U font.The transparent plastic plate of light that front panel 104 adopts being used.Taken in transducer assembly 10A in the inside of this cylinder 10.

Represent the stereogram seen from front one side of transducer assembly at Fig. 2 respectively, represented the stereogram of seeing from the back side one side of transducer assembly at Fig. 3.It seems clearly that by these figure transducer assembly 10A is made of as main body many optical axises assembly 200A and the circuit component assembly 300 that is screwed in the back side of this many optical axises assembly one side.Describe in detail as described later, many optical axises assembly 200A, incorporate a plurality of 1 optical module constitute as the center by forming a line.On the one hand, circuit component assembly 300 is made of as main body the circuit substrate that has loaded CPU etc.In addition, in these figure, the 400th, connector part assembly.

The exploded perspective view of transducer assembly as shown in Figure 4.In addition, also described the vessel 101 of explanation just now among the figure simultaneously, end cap 102,103, front panel 104.

Such as previously explained, take in the container of transducer assembly 10A, contain the column shape container body 101 that section slightly is the U font, the same section that blocks both ends open roughly is the end cap 102,103 of U word shape, blocks the front panel 104 of front one side.

In more detail, column shape container body 101 1 ends make containment member 105 between wherein and by end cap 102 blocking, and are fixing with screw 110.Same, the other end of column shape container body 101 makes containment member 106 between wherein and by end cap 103 blocking, and is fixing with screw 112.Latch 109 injects end cap 102, is screwed.At the front end of the electric wire 107 of drawing, connector 108 between electric wire is installed from this latch 109.This electric wire 107 is utilized when connecting light projector more than 1 or 2 with (perhaps be subjected to light with) cylinder 10.

On the one hand, at the end cap 103 as the other end, the socket 111 of corresponding latch 109 fixes by Screw 113.Slightly be the opening of front one side of the column shape container of U font at the section that constitutes like this, make valve rubber 120, adhesion sheet material 121, containment member 116,117,118,119 and insulation sheet material 114,115, front panel 104 bondings are fixed between wherein.

On the one hand, many optical axises assembly 200A, 1 optical module 200, flat cable 220, the cable rack 230 of several numbers of corresponding optical axis, the supporting frame 250 that contain several numbers of corresponding optical axis also constitute thus.

The amplification exploded perspective view of many optical axises assembly as shown in Figure 5.In the drawings, only amplify the part of 4 optical axises of expression.It seems clearly by figure, 1 optical module 200, be the some optical elements that contain lens component 201 to be combined as a whole by resinous optical element frame 203 form, describe in detail as described later that pressure welding formula of side lead-in wire 205a is outstanding state below it.

Flat cable 220 is that many heart yearns parallel to each other have been taken in the banded cover layer of resin system inside, and the cable of its length is adjusted in cutting at random such as enough scissors of energy or cutter.In this example, contain 8 heart yearns forming by the 1st heart yearn 220-1, the 2nd heart yearn 220-2, the 3rd heart yearn 220-3, the 4th heart yearn 220-4, the 5th heart yearn 220-5, the 6th heart yearn 220-6, the 7th heart yearn 220-7, the 8th heart yearn 220-8.Wherein, about exported the 5th heart yearn 220-5 of dual-purpose by the D of D flip-flop input and Q, by being cut apart with the perforation 220-5a that uniformly-spaced opens.This be because, with regard to other heart yearns, can distribute as common line a plurality of 1 optical module 220, relative with it is to have only the 5th heart yearn 220-5, must export dual-purpose as the D input and the Q of the D flip-flop in each 1 optical module 200.

Cable rack 230 is the integrally formed product of resin, contains the cushion part 230a that is positioned at central authorities and surface and has wavy groove, from four jiaos of 4 of erecting of this cushion part 230a the stand up 230c of portion, 230c, 230c, 230c.These 230c of portion that stand up form teat 230d respectively.This teat 230d describes in detail as described later, be embedded into the 250a of the portion of standing up that is formed on supporting frame 250 1 sides left and right sides edge part recess 250c and by fastening.

Supporting frame 250 is metallic article (for example, phosphor bronze), forms along its longitudinal direction a plurality of sections are the shape that the コ word shape partly couples together.Left and right sides edge part at opposite one another a pair of the stand up 250a of portion, the 250a that constitute コ word shape part forms recess 250b, and this recess 250b is chimeric and by fastening with the teat 230d that is formed on the 250c of the portion of respectively standing up on the cable rack 230.In addition, form hole 250c in the bottom of the 250a of the portion of respectively standing up of supporting frame 250, this hole 250c is with to be formed on teat 230b below the cable rack 230 chimeric and both are located.

It seems clearly that by above because the opposed part of standing up the 250a of portion, 250b that forms at supporting frame 250 is equipped with cable rack 230, cable rack 230 is by equidistant location and be fixed.In addition, be equipped with flat cable 220 above the cushion part 230a of cable rack 230,,, can make 1 optical module 200 and flat cable 220 electric connections owing to be pressed from above from top overlapping 1 optical module 200.

At this moment emphasis is, describe in detail as described later, all be accommodated in optical element frame 203 1 sides owing to be equivalent to the electric circuit element of 1 grade the D flip-flop etc. of light part (light-emitting component or photo detector), its drive circuit, shift register, so along the installation site of the longitudinal direction of the flat cable 220 of each 1 optical module 200, can be described as and not be subjected to any restriction.Therefore, opposed a pair of the stand up 250a of portion, the 250a that form on the supporting frame 250 in abutting connection with number and when spacing can freely be set, because this is in abutting connection with number and in abutting connection with the optical axis number and the optical axis spacing of the direct corresponding multi-beam photoelectric sensor of spacing, according to the present invention, can significantly improve the design freedom of optical axis number and optical axis spacing.

Next, several concrete structures of 1 optical module 200 are described.The exploded perspective view of 1 optical module (its 1) is by shown in Figure 6.In this example, 1 optical module 200 contains lens component 201, trap 202, optical element frame 203, barricade 204, encapsulation light IC205 and constitutes thus.In addition, 201a is the projection of lens component location usefulness among the figure, and 204a is beam profile shaping hole, and 205a is a pressure welding formula lead-in wire, and 205b is dual in-line package (DIP).

Lens component 201 is plastic lenss of often saying, and the one side forms the projection 201a of location usefulness.Trap 202 is the devices that are equivalent to the shank of optical system, is coupled with lens component 201 axle center.Optical element frame 203 is the integrally formed product of plastics, and the lens component 201 and the trap 202 of coaxial coupling taken in its inside.On the one hand, in the bottom surface of optical element frame 203 side, overlapping barricade 204 and the encapsulation light IC205 of being equipped with.Describe concrete mounting structure in addition in detail.Barricade 204 is the devices that encapsulation light IC205 played shielding action, is made of metal partss such as for example phosphor bronzes.Substantial middle portion at barricade 204 forms beam profile shaping hole 204a.

Encapsulation light IC205 has dual in-line package (DIP) 205b that makes with transparent resin.From the both sides of the edge portion of this dual in-line package 205b, pressure welding formula lead-in wire 205a is supporting with outstanding downwards state.Like this, be each lead-in wire of dual in-line package 205b present inventor's etc. particular views as the conception of pressure welding formula lead-in wire 205a, be very novel.Certainly, about this thing of pressure welding formula lead-in wire 205a, beyond the leg as encapsulation IC, the connection purposes that also for example is used for the conducting etc. between substrate, but like this pressure welding formula lead-in wire 205a is used as the lead-in wire of encapsulation light IC205, by it is inserted flat cable 220, then encapsulation light IC205 can be installed in the optional position of the longitudinal direction of flat cable 220, according to such formation, be not limited only at multi-beam photoelectric sensor, can also on various Optical devices, improve the configuration degree of freedom of optical element (light-emitting component or photo detector) significantly.

In the inside of encapsulation light IC205, the back is in the mode of reference Figure 24 explanation, taken in optical element (light-emitting component or photo detector), optical element drive circuit, make D flip-flop that drive circuit works successively etc.

An object lesson of such internal circuit as shown in figure 24.It seems clearly by figure, take in circuit 20 with the situation of cylinder, be subjected to light to take in circuit 30 with the situation of cylinder at light projector.The drive circuit 22 of the Q output that circuit 20 contains 1 grade the D flip-flop (note is made D type FF) 21 that constitutes shift register, import this D flip-flop 21, the light-emitting component 23 that drives with the output of drive circuit 22.D flip-flop 21 is through a plurality of shift registers that connect and compose, and its result makes each circuit 20 be successively operating state (active state) one by one.

On the one hand, circuit 30 contains photo detector 31, amplify the amplifying circuit 32 of photo detector 31 outputs, constitute 1 grade the D flip-flop (note is made D type FF) 34 of shift register and export a side between amplifying circuit, exported the analog switch 33 of control switch by the Q of D flip-flop 34.At this moment, D flip-flop 34 is through connecting and composing shift register, and each D flip-flop 34 is worked successively one by one.

Like this,, take in these circuit 20 or 30 in the encapsulation light IC205, as 1 optical module 200 and integrated for the present invention.For 1 optical module of the present invention, also have circuit component also to be about optical element not only, because the part that each optical axis uses, all be accommodated in 1 optical module one side, so, though for the optical axis number what, be used for the necessary at least part of each optical axis, can collect in light projector with module and be subjected to light to make the light curtain with module.That is, can reduce part kind number.

Also have, being called the action effect that improves design freedom and can understanding so like this: because be incorporated in 1 optical module one side based on circuit 20 shown in Figure 24 or 30, so this circuit that is contained 20 or 30 whether integrated as encapsulation light IC may not be necessary condition.

That is,,, also can carry on the circuit substrate small pieces of special use, be accommodated in 1 optical module 200 about circuit 20 shown in Figure 24 or 30 for the present invention.In addition, as long as himself function of flat cable because have a necessary conductive pattern parallel to each other just enough, if there is suitable length, just can replace flexible circuit board etc.At this moment,, 1 optical module is installed and is made its conducting, also can at random adopt free joint constructions such as perforation connection for the optional position of the conductor fig on flexible base, board.

The exploded perspective view of 1 optical module (its 2) as shown in Figure 7.Example hereto, the top side of dual in-line package 205b are provided with the masking-out printing 205c with fenestra 205d.Like this, because masking-out printing 205c and fenestra 205d also can have the beam shaping function.In addition, according to masking-out printing 205c,, can avoid the interference component of sneaking into to built-in optical element although use transparent resin as encapsulating material.

The profile of 1 optical module (one-piece type) as shown in Figure 8.This example is not to resemble each individual part to be accommodated in the optical element frame 203 Fig. 6 and Fig. 7, but is shaped by inserting in advance, and those parts are combined into one.On figure, 205a is a pressure welding formula lead-in wire, and 205e is a lead frame, the 206th, and the encapsulation of band lens, 206a is a lens arrangement, the 207th, frisket member, the 208th, slit, the 209th, optical element.

It seems clearly that by figure this example is on the lead frame 205e in the encapsulation 206 that is inserted in the band lens, has carried optical element 209 and other circuit component, by making its usefulness resin integrally formed, along with lens arrangement 206a is shaped together.

Below, the in-built profile of the encapsulation light IC that the structure of demonstration use Fig. 6 and Fig. 7 uses is shown in Fig. 9 (a), Fig. 9 (b).Same Fig. 9 (a) is that lead frame is packaging, and same Fig. 9 (b) is that substrate is packaging.

As previously explained like that, for anything, having the device that is called encapsulation light IC of such pressure welding formula lead-in wire 205a, is very novel structure, is that the present inventor waits creation alone.

For the packaging encapsulation light IC205 of the lead frame shown in Fig. 9 (a), with the incorporate lead frame 205i of pressure welding formula lead-in wire 205a on, directly loaded optical element 205j and circuit component 205k.For this example, on lead frame 205i, the reflector configuration 205h through punch process formation mortar shape recess because its bottom centre disposes optical element 205j, plays the effect that improves light projector or be subjected to optical efficiency especially.Also have, symbol 205g is transparent sealing resin.In addition, be known about the front end shape of pressure welding formula lead-in wire 205a, make the front end of left and right sides difference portion sharp-pointed when promptly front end is divided into two strands of shapes, the slit between two difference portions is pressed into the heart yearn of flat cable, and both are conducted.Also have for this example,, guarantee guiding path for each circuit component and optical element by the suitable banded conducting wire of punching press on the flat shape of lead frame 205i.

Packaging for the substrate shown in Fig. 9 (b), be provided with the circuit substrate 205l of the two sides type different with lead frame 205i, on circuit substrate 205l, load in optical element 205j and the circuit component 205k, a side forms the pressure welding formula lead-in wire 205a conductor fig of conducting separately below circuit substrate 205l, weld together with each lead frame 205i by it, each pressure welding formula lead-in wire 205a and optical element 205j and circuit component 205k are conducted.

For this example, following advantage is arranged: because have the substrate 205l different, and rigidity is improved with lead frame 205i, even the pressure the when connection of pressure welding formula lead-in wire 205a is arranged, because the dislocation of optical element 205j also can not take place in the rigidity of circuit substrate 205l.

Promptly, for packaging with the lead frame shown in the figure (a), because lead frame 205i has loaded optical element 205j on himself, owing to be added in the pressure on the pressure welding formula lead-in wire 205a, the anxiety that the problems such as small dislocation that internal leadframe deflection, optical element 205j take place are arranged, but for having such advantage: because the rigidity of substrate 205l even deflection takes place pressure welding formula lead-in wire 205a, also is difficult for taking place the dislocation of optical element 205j with the substrate assembly shown in the figure (b).

Below, optical element frame and the locating structure that encapsulates light IC are described.Shown in Fig. 9 (a), lead frame 205i goes up and loads optical element 205j and circuit component 205k, it is inserted shaping with sealing resin 205g, and use the encapsulation light IC205 of the lead-in wire of giving prominence to from lead frame 205i as pressure welding formula lead-in wire 205a, and as Figure 6 and Figure 7, during the employing formation that a side is loaded below optical element frame 203, must make the position of the optical element 205j in the encapsulation light IC205, correctly be coupled with the optical axis that is built in the lens 201 in the optical element frame 203.

Can consider that following method is as the method that realizes: for example the dual in-line package 205b at encapsulation light IC205 is provided with the location teat, makes itself and the location indentations that is arranged on optical element frame 203 1 sides chimeric etc.If adopt such locating structure, because the shaping error of dual in-line package 205b may not make the position of optical element 205f and the optical axis of lens 201 correctly be coupled.

Therefore, for the present invention, not on the encapsulation 205b of encapsulation light IC205, but between the arbitrary portion of the outstanding lead frame of encapsulation 205b and optical element frame 203, positioning, thereby can realize encapsulating correct location between the optical axis of optical element 205f in the 205b and lens 201.

The locating structure key diagram of optical element frame and encapsulation light IC (its 1～they are 3 years old) is shown in Figure 10～Figure 12 (a), Figure 12 (b).The state that has broken away from slightly up and down from encapsulation light IC205 shown in Figure 10 and optical element frame 203 clearly in the marginal portion, the left and right sides of optical element frame 203, forms a plurality of cooperation teat 203b downwards.

On the one hand, in the bottom (bent corners portion) from the outstanding downwards pressure welding formula lead-in wire 205a of encapsulation light IC205, the cooperation teat 203b of corresponding encapsulation light IC205 one side forms connecting hole 205f.And, as shown in figure 11, if IC205 is contained on the optical element frame 203 fully encapsulation light, a plurality of cooperation teat 203b of encapsulation 205b one side, insert the connecting hole 205f of the bottom that is positioned at pressure welding formula lead-in wire 205a respectively, realize the correct location of the bottom of encapsulation 205b and pressure welding formula lead-in wire 205a thus.

Yet, if locate both like this, pressure welding formula lead-in wire 205a and lead frame 205i one, and loaded optical element 205j on this lead frame 205i, and in order correctly to keep " loaded " position according to assembly precision with respect to the optical element 205j of lead frame 205i, if the forming accuracy of the cooperation teat 203b of the positioning accuracy of strict control optical element frame 203 and lens 201 and relative optical element frame 203 just can realize encapsulating the correct contraposition of the optical axis of optical element 205j in the light IC205 and lens 201.

At this moment, the hole 205f of location usefulness can be used as the cubic hole of opening on the bend of lead-in wire.According to such structure, in the middle of the bottom that is positioned at cubic mouthful week, top, the right, the left side, the bottom of level, contact site when playing the lead-in wire insertion on the one hand, the connecting portion of the location usefulness of left and right directions is played on the right and the left side on the one hand, therefore, following advantage is arranged: when this electronic component inserts flat cable, be difficult for making the lead-in wire deflection because of directly over lead-in wire, depressing, also be difficult for taking place the small dislocation of the optical element on the lead frame thus, keep the optical axis performance.

In addition, also there is expression more in detail the position about the connecting hole 205f of the bottom that is located at pressure welding formula lead-in wire 205a in Figure 12 (a), Figure 12 (b) lining.That is, connecting hole 205f correctly is formed at the corner location of bend of lead frame 205i and pressure welding formula lead-in wire 205a.For this reason, as shown in figure 11,, then cooperate the upper end of the vertical stretch 205m of teat 203b and pressure welding formula lead-in wire 205a to join if encapsulation light IC205 is properly installed on a following side of optical element frame 203.Therefore, have the following advantages: if the leading section bundle of pressure welding formula lead-in wire 205a is pushed in order to puncture its lining on flat cable, each cooperates teat 203b, respectively a side below the interior week of connecting hole 205f is depressed directly over it, the downward pressing force that optical element frame 203 is granted, have no on the vertical stretch 205m that passes to reed 205a of loss, thereby pressure welding formula lead-in wire 205a is difficult for deflection.

Promptly, if though vertical stretch 205m deflection, owing to drawn by it, also deflection of lead frame 205i in the encapsulation light IC205, the optical element 205j that loads on it also has the anxiety that dislocation takes place, but according to the position relation of such cooperation teat 203b and connecting hole 205f, pressure welding formula lead-in wire 205a is difficult for deflection, thereby the advantage that is difficult for taking place such optical element dislocation is arranged.

Below, the key diagram of the variation of 1 optical module of expression is shown in Figure 13 (a), Figure 13 (b).In addition, same Figure 13 (a) is to use pressure welding formula lead-in wire to accept the example of socket, and same Figure 13 (b) is the use-case that makes that the spring terminal sheet is accepted socket.As the explanation of carrying out with reference to the circuit diagram of Figure 24 just now, place as the principal character of 1 optical module of the present invention, any is arranged is not only to take in optical element also electric circuit to be taken in, a bit be to be loaded in the optional position of the longitudinal direction of the flexible circuit board that does not have flat cable to this 1 optical module simply in addition.

Thus, the latter particularly, as long as pressure welding formula terminal and free contact point from the bottom surface one of 1 optical module side-prominent come out, take in or the circuit component aggregate about optical element, should be to take in any form all to have no relations.It seems, 1 optical module is divided into 2 parts up and down.If downside as socket, upside as the part incorporating section, the replacing in the time of then can seeking fault and the simplicity of maintenance.

The design example that obtains of viewpoint is shown in Figure 13 (a) and (b) thus.In the example of same Figure 13 (a), though 1 optical module 200 himself with previously described the same, make socket 200A between between it and the flat cable 220.A side on this socket 200A is provided with the lead-in wire receiving orifice 205A-1 of the pressure welding formula lead-in wire 205a that accepts 1 optical module 200, and one pleurapophysis comes out the pressure welding formula lead-in wire 205A-2 that pricks at each heart yearn of flat cable from the bottom surface.

On the one hand, in the example of Figure 13 (b), 1 optical module 200 is one side-prominent spring contact terminal (figure is demonstration not) from the bottom surface.On the one hand, be provided with socket 200A between 1 optical module 200 and the flat cable.A side on this socket 200A, forming side-prominently from the bottom surface one of 1 optical module 200 does not have a conductor fig 205A-3 illustrated and that the spring contact terminal joins.These conductor figs 205A-3, be conducting to respectively give prominence to one side in the bottom surface pressing formula lead-in wire 205A-2, from outstanding the pressing formula lead-in wire 205A-2 to penetrate each heart yearn of flat cable 220 and be switched on of these sockets 200A.As 1 optical module, can adopt various structures like this.

Below, the profile of the connection state of expression flat cable and pressure welding formula lead-in wire is as shown in figure 14.In the drawings, the 201st, lens component, the 202nd, trap, the 205th, encapsulation light IC, the 220th, flat cable, 220a are the bends of flat cable, 205a is a pressure welding formula lead-in wire, the 230th, cable rack.It seems clearly that from figure pressure welding formula lead-in wire 205a penetrates flat cable 220 and runs through it and to a following side break-through.At this moment,, be pressed into the corresponding heart yearn of flat cable 220, both are switched on by front end slit at each pressure welding formula lead-in wire 205a.Flat cable 220 is on the limit of 1 optical module that forms a line, by bend 220a bending and along the bottom fold of cable rack 230.

The key diagram of flat cable maintenance structure as shown in figure 15.201 is lens components in the drawings, the 203rd, and optical element frame, the 230th, cable rack, 203d is the engaging pawl of optical element frame, and 230e is the engaging section of cable rack, and 220a is the bend of flat cable, 220b is a cable connector, and 220-1～220-8 is the 1st heart yearn～the 8th heart yearn of flat cable.

By figure clearly, flat cable 220 is keeping being clipped in up and down the state between the cushion part 230a of the bottom of optical element frame 203 and cable rack 230.Optical element frame 203 and cable rack 230 fixedly prevent to be pulled up by the engaging that engages pawl 203d and the 230e of section portion firmly.

Below, even just the production scene is under abominable interference environment, also can be used for avoiding formation influence, shield member that the interference to multi-beam photoelectric sensor produces and describes.The exploded perspective view of the state before the expression shielding component sets dress as shown in figure 16, the key diagram of the conducting construction of shield member and supporting frame as shown in figure 17, the exploded perspective view of the state behind the expression shielding component sets dress is as shown in figure 18.

As shown in figure 16, the feature of multi-beam photoelectric sensor of the present invention is to carry out following configuration: resembling on the parallel conductor member of flat cable etc., do not needing locational arbitrarily 1 optical module at its longitudinal direction is carried out particularly complicated processing.Opposite, this is the reason that produces 1 shortcoming.Promptly, span 250e in the gap of 1 optical module of adjacency and 1 optical module, owing in the 250e of this space, expose the parallel conductor figure, if by the front one side generation electromagnetic interference of container etc., can be influential to direct conductor fig, become and disturb the cause of sneaking into.

Therefore example as shown in figure 16 is provided with top shield member 260, by the gap that this member covers intermodule, prevents to disturb and sneaks into parallel conductor module (for example, each heart yearn of tape conductor etc.).

Shown in figure, above shield member 260, have the central portion 260a that extends to the module row column direction, prolong and the 260b of portion, 260b in the direction side of extending to the left and right from its both sides of the edge portion.Prolong in the side and the 206b of portion and the side prolongs between the 206b of portion, form engaging pawl 260c, 260c.And, shield member above this 260 is covered on a series of 1 optical module assembly, 260c engages the location of deciding both with the top bight of the optical element frame 203 of 1 optical module according to the engaging pawl, prolong by the side simultaneously and the space 250e that the 260b of portion blocks intermodule, a necessary bridging effect.

At this moment as shown in figure 17, the side is prolonged and the 260b of portion shown in arrow among the figure, and the direction of direction expansion to the left and right imposes elasticity, and the side is prolonged the leading section that the 250b of portion and contacted with the inner surface of the 250d of the portion of standing up of supporting frame 250 thus, forms and contacts conducting portion 260e.Therefore, the eddy current that is generated by electromagnetic interference effect looses to supporting frame 250 1 effluents owing to contact the effect of conducting portion 260e, and the result plays the effect that promotes screening effect.As shown in figure 18, after shield member assembling, the space of intermodule is prolonged by the side and the 260b of portion and central portion 260a clogs fully, but because the existence of fenestra 260d, can guarantee light projector or be subjected to the optical axis of light.

Like this, according to the example of Figure 16～Figure 18, by the top shield member 260 of metallic (for example, phosphor bronze) is set, the space 250e that generates in abutting connection with intermodule is covered fully, can prevent sneaking into the interference of the conductor fig (flat cable etc.) below it reliably.

Below, the stereogram of the structure of indication circuit part assembly is as shown in figure 19.Shown in figure, circuit component assembly 300 has CPU substrate 301, connector base board 302, frame substrate 303.Frame substrate 303, when a side kept CPU substrate 301 and connector base board 302 in its lower section, side was keeping many optical axises assembly 200A above it.

On CPU substrate 301, circuit shown in Figure 24 40 or circuit 50 have been loaded.That is, on the circuit 40 of light projector cylinder one side, treatment circuit (CPU) 41, gate circuit 42, display circuit 43 have been loaded, imput output circuit 44, telecommunication circuit 45.Same, being subjected to light, loaded treatment circuit (CPU) 51, amplifying circuit 52, display circuit 53, imput output circuit 54, telecommunication circuit 55 with on the circuit 50 of cylinder.

Display circuit 43,53 possesses the light-emitting component that shows usefulness separately, and these light-emitting components 301a as shown in figure 19, is arranged in a lateral edge portion of CPU substrate 301 with proper spacing.Be equivalent to these light-emitting components 301a separately directly over the position, the light guide section 303e and the frame substrate 303 that extend to vertical direction form as one, the front end 303f of these light guide sections 303e, the gap by optical element frame 203 is exposed to a top side.For this reason, though light-emitting component 301a is arranged on the substrate, by light guide section 303e guiding top, 303f shines the outside from its front end, becomes the good device of visibility of demonstration from its light that sends.

Frame substrate 303 has the opposed a pair of support projection 303a of left and right directions, 303b.Between support projection 303a, the 303a of adjacency, there is groove 303c,, optical element frame 203 located and is fixed on a top side of frame substrate 303 by insert the appropriate section of optical element frame 203 at this groove 303c.Its result with reference to Fig. 2, as preceding explanation, has finished the transducer assembly 10A that circuit component assembly 300 is combined in the following side of many optical axises assembly 200A.

Below, the key diagram of the inaccessible structure in the front of column shape container is shown in Figure 20 (a), Figure 20 (b).Shown in Figure 20 (a), block the front panel 104 of the front openings of container, be to use the light projector plate 104a that relatively has rigidity that makes by plastics etc. and the conductive membrane 104b of its back side one side lamination to make.And shown in Figure 20 (b), the layered product that light projector plate 104a and conductive membrane 104b constitute embeds the front openings portion of column shape container body 101, by there not being illustrated adhesive tape etc. fixing.Owing to have conductive membrane 104b, therefore can alleviate the influence that inner parallel conductor (flat cable etc.) is disturbed like this in the back side of light projector plate 104a one side

Below, the end view drawing of light projector usefulness (used by light) cylinder is as shown in figure 21.Among the figure, the 101st, the column shape container body, the 104th, front panel, the 114th, the insulation sheet material, the 203rd, the optical element frame, the 220th, flat cable, the 230th, cable rack, the 302nd, connector base board, 302a are connectors, the 303rd, frame substrate.Previously described these parts are accommodated in the column shape container body 101 as shown in the figure, and both ends are blocked by the end cap 102,103 that has before illustrated.

Below, the expression shielding structure variation key diagram (its 1) as shown in figure 22, same key diagram (its 2) is shown in Figure 23 (a), Figure 23 (b).As previously described, 200,200 span 250e of 1 optical module of adjacency have these interference to sneak into the anxiety of flat cable.So Figure 16～previous example shown in Figure 180 is by being stamped barricade 260 above the metallic, the performance bridging effect on this., this situation, according to the connection number of optical module, the top barricade 260 of must at every turn all reforming.To this, in the example shown in Figure 22～Figure 23 (a), Figure 23 (b),, can shield each space respectively by shield blade 273 or 274 or virtual module 271 or 272 are housed respectively in those spaces.According to such formation, as long as intermodule is apart from being certain, just be connected number with module irrelevant, the space that can cover intermodule.

The enlarged drawing of virtual module 271 is shown in Figure 23 (b).Shown in figure, virtual module 271 has non-conductive body and the side-prominent metal 271e of foot of rubber-like, a 271e in its lower section.Module body is the non-conductive components with top 271a and left and right side 271b, forms 4 teat 271c, 271c, 271d, 271d from its both ends.Wherein teat 271c, 271c are the teats of depressing usefulness, and teat 271d, 271d prevent the teat that is pulled up.If such virtual module 271 is pressed into intermodule space 250e separately, depressing teat 271c, the 271c of usefulness and the appropriate section of supporting frame 250 joins, even and if the 271e of foot, 271e have reaction also to make it adjoint, virtual module 271 is by the 271e of foot, 271e, be adjacent to supporting frame 250, fix preventing to be pulled up simultaneously by the anti-271d of section portion, the 271d that pulls up usefulness.

On the one hand, shield blade 273 is amplified expression as Figure 23 (a).Shown in figure, shield blade 273 is by metal sheet formations such as (for example, phosphor bronzes), have top panel 273a, side panel 273b.The both ends of plate 273a form the branching portion 273c separate to the left and right in the above, 273c and branching portion 273d, 273d, by these two branching portions the corresponding teat on the supporting frame from it face insert, shield blade 273 is contained on the space.In addition, contact chip 273e crooked among the figure has elasticity, because it contacts with the inner surface of supporting frame 250, makes conducting between the two.Also have symbol 273e to prevent the projection that is pulled up, play the effect that prevents that shield blade is pulled up thus.

Get back to Figure 22, virtual module 272 is the members at the outer surface metal-plated membrane of the resin system body with same structure, has equally to depress with teat 272a and prevent to pull up up and down to use teat 272b.In addition, shield blade 274 is the sheet metals that are the コ word shape by the section that the most simple punch process forms, and has to prevent to be pulled up sheet 274a.

Like this, in the present invention, the gap of intermodule and even space 250e are blocked, prevented from its space and the heart yearn of gap in flat cable sneaked into interference with the virtual module 271,272 or the shield blade 273,274 of loading.And according to such difference load mode, as long as prepare in advance the virtual module that meets the optical axis spacing or the shield blade of certain kind, just can and the shroud module that has nothing to do of optical axis number between the gap.

At last, with reference to Figure 24 and Figure 25, describe with regard to all figure of multi-beam photoelectric sensor related to the present invention.As previously described, multi-beam photoelectric sensor related to the present invention contains and is built in light projector with the circuit part of cylinder be built in and be subjected to the circuit part of light with cylinder.With in the cylinder, contain the circuit 20 of corresponding each optical axis and the circuit 40 of corresponding CPU substrate at light projector, same illuminating cylinder also has the circuit 30 of corresponding each optical axis and the circuit 50 of corresponding CPU substrate.

If illustrate with cylinder from light projector, circuit part 20 is built in 1 optical module 200 at that.As mode built-in and that take in, can on each circuit substrate small pieces, load the related circuit part, also can shown in Fig. 6, Fig. 7, Fig. 9 (a), Fig. 9 (b) etc., constitute encapsulation light IC205.In addition, the joint construction of each 1 optical module 200 and the flat cable that becomes its connecting object, parallel conductor flexible base, board etc. should make its structure that meets the conductor fig side decide.

1 parallel conductor member one side that optical module should connect is if flat cable as shown in Figure 5 220 then adopts the pressure welding formula lead-in wire 205a shown in Figure 10～Figure 12 (a), Figure 12 (b) as joint construction.Relative therewith, if parallel conductor member one side is a flexible circuit board, can adopt the spring contact terminal that can on the optional position on its conductor fig, connect and through-hole structure etc.

What no matter is done, preferably should not need special numerous and diverse processing that 1 optical module is installed like that in the position of any longitudinal direction on the parallel conductor member.Thus, because can load 1 optical module, the design freedom of optical axis spacing and optical axis number is increased in the optional position of the longitudinal direction on the parallel conductor member.Also have, the moment of signal a～d and waveform among the figure should be with reference to the sequential charts of Figure 25.

On the one hand, the circuit 40 that loads on the CPU substrate contains treatment circuit (CPU) 41, gate circuit 42, display circuit 43, imput output circuit 44.Be connected with a succession of circuit 20 of adjacency by parallel conductors such as flat cables, will by a series of D flip-flop 21,21 ... constitute shift register, the Q output of the D flip-flop 21 of the output by each grade makes drive circuit 6 work, and light-emitting component is lighted successively.At this moment come controlling and driving constantly by signal d.

Below, about being subjected to the light cylinder, each circuit 30 is accommodated in 1 optical module separately.Take in mode about it, can be loaded on the circuit substrate small pieces as previously described or conduct encapsulation light IC.

Circuit 30 contains following part and constitutes: photo detector 31, amplifying circuit 32, analog switch 33, D flip-flop 34.In addition, about being connected of 1 optical module and parallel conductor member, with flat cable also can, also can with flexible circuit board.And and the light projector side same, a series ofly between 1 optical module of adjacency be connected by conductor fig, thereby formation shift register, response is equivalent to the Q output of the D flip-flop of each section output, opens analog gate 44, thereby the output of the light-emitting component of each module treatment circuit 51 of packing into.

As above detailed description, according to the embodiment of the present invention, as 1 optical module 200 that constitutes many optical axises assembly 200A, because not only take in optical element, even also take in the part of circuit 20,30, simultaneously, the parallel conductor member that should be connected with optical module 200 is the joint construction of single key stroke with being connected of it, therefore can load 1 optical module 200 in the position arbitrarily of the longitudinal direction of parallel conductor member one side, and significantly improve the design freedom of optical axis spacing and optical axis number.

Special in addition, because when adopting the terminal construction of pressure welding formula lead-in wire 205a as 1 optical module 200 1 side, adopt flat cable 220 as its parallel conductor member of correspondence, so it is easy all the more that connection between the two becomes, correspondence optical axis spacing and optical axis number arbitrarily flexibly.

Also have,, it as circuit substrate small pieces and encapsulation light IC205, is reached the purpose that improves rate of finished products and productivity ratio for this reason about in 1 optical module 200, taking in the electric circuit part.Especially, in the example of circuit component as encapsulation light IC205, be located at the lock structure of the engaging teat 203b of the connecting hole 205f of bottom of its pressure welding formula terminal pins 205a and optical element frame 203 1 sides by employing, can reach the high precision int that the optical element 205f in the encapsulation is consistent with the coupling position of the optical axis of lens component 201.

In addition, on the parallel conductor member during with 1 optical module of any spacing configuration, about the space that generates at the intermodule of adjacency, it is blocked with top shield member 260, perhaps block with virtual module 271,272 or shield blade 273,274 respectively, can prevent from reliably thus to sneak into the parallel conductor (heart yearn of flat cable etc.) that exposes spatially from the interference that container front one side is come.

In addition, especially when using flat cable as the parallel conductor member, as shown in Figure 5, on the heart yearn 220-5 of the D of D flip-flop input and Q output dual-purpose, perforation 220-5a is indicated with certain intervals, cut apart corresponding heart yearn thus, can load 2 different lead-in wires on same heart yearn, becoming can the corresponding D flip-flop of parallel conductor figure fully for this reason.That is, cut apart in abutting connection with the heart yearn part because the D input of the flat cable of the Q of the flat cable of leading portion output and back segment is connected to each other, as long as 2 lead-in wire positions on the same circuit are consistent, just can the corresponding circuits formation.

Claims (13)

1. multi-beam photoelectric sensor, have light projector row be accommodated in the light projector made in the column shape container with cylinder and light-receiving device be listed as be accommodated in make in the column shape container be subjected to the light cylinder, by making those light projectors with cylinder and be subjected to light to vacate proper spacing, dispose with light projector face and the opposed mode of sensitive surface with cylinder, thereby light projector with cylinder and be subjected to light with cylinder between the product health check-up go out to use up curtain, it is characterized in that

The light projector row contain,

The light projector module column, it is only a plurality of light projectors to be formed a line with module and form, this light projector with module by the light projector circuit of the light projector optical system of 1 optical axis, 1 optical axis, be equivalent to shift register 1 grade trigger integrated and constitute,

The light projector signal transmission member, it has common conductor wire and in abutting connection with the intermodule conductor wire, this common conductor wire, jointly connect from be positioned at light projector with the light projector of an end of module column with module to the light projector module that is positioned at the other end, this only is connected to each other between adjacent light projector is with module in abutting connection with the intermodule conductor wire

Constitute light projector each light projector module, be electrically connected with signal transmission member with light projector respectively with module column;

The light-receiving device row contain,

Be subjected to the light module column, it is only formed a line with module by light and form a plurality of, this be subjected to light with module by the light receiving circuit that is subjected to light optical system, 1 optical axis of 1 optical axis, be equivalent to shift register 1 grade trigger integrated and constitute,

Be subjected to the light signal transmission member, it has common conductor wire and in abutting connection with the intermodule conductor wire, this common conductor wire, jointly connecting from being positioned at is subjected to light to be subjected to light module with module to what be positioned at the other end with the light that is subjected to of an end of module column, this only is connected to each other between with module at the adjacent light that is subjected in abutting connection with the intermodule conductor wire

Constitute be subjected to light with module column respectively be subjected to the light module, be electrically connected with signal transmission member with being subjected to light respectively, and

The light projector of adjacency is with between the trigger in the module, and adjacency be subjected to light with between the trigger in the module, use and carry out subordinate in abutting connection with the intermodule conductor wire and connect, constitute shift register,

Thus, according to the data that transmitted successively by shift register, the formation light projector is worked by light with each light projector of module column successively with module with the light that respectively is subjected to of module column with module and formation.

2. multi-beam photoelectric sensor as claimed in claim 1 is characterized in that,

The light projector signal transmission member is under the state of insulation that keeps conductor wire separately, forms with common conductor wire with in abutting connection with the intermodule conductor wire is integrated.

3. multi-beam photoelectric sensor as claimed in claim 1 is characterized in that,

Be subjected to the light signal transmission member, be under the state of insulation that keeps conductor wire separately, forms with common conductor wire with in abutting connection with the intermodule conductor wire is integrated.

4. multi-beam photoelectric sensor as claimed in claim 1 is characterized in that,

The light projector signal transmission member, when having a plurality of heart yearns, specific heart yearn is made into the flat cable of being cut apart by a plurality of perforation, and specific heart yearn plays a role in abutting connection with the intermodule conductor wire as only interconnective between adjacent block.

5. multi-beam photoelectric sensor as claimed in claim 1 is characterized in that,

Be subjected to the light signal transmission member, when having a plurality of heart yearns, specific heart yearn is made into the flat cable of being cut apart by a plurality of perforation, and specific heart yearn plays a role in abutting connection with the intermodule conductor wire as only interconnective between adjacent block.

6. multi-beam photoelectric sensor as claimed in claim 4 is characterized in that,

The light projector optical system contains light-projecting component,

When the circuit component that is equivalent to light-projecting component, light projector circuit and trigger is accommodated into the IC encapsulation, the lead-in wire of IC encapsulation is gone between as the pressure welding that flat cable connects usefulness, the IC encapsulation can be connected on the flat cable in pressure welding.

7. multi-beam photoelectric sensor as claimed in claim 5 is characterized in that,

Be subjected to the light optical system to contain photo detector,

When the circuit component that is equivalent to photo detector, light receiving circuit and trigger is accommodated into the IC encapsulation, the lead-in wire of IC encapsulation is gone between as the pressure welding that flat cable connects usefulness, the IC encapsulation can be connected on the flat cable in pressure welding.

8. multi-beam photoelectric sensor as claimed in claim 6 is characterized in that,

The light projector module is, making under the state of lens component that constitutes the light projector optical system and IC encapsulation the carrying out optical axis coupling of taking in optical element, comes incorporate light projector optical module by the optical element frame,

IC encapsulates, and light-projecting component is installed at least and makes lead frame and go between to offer the hole of location usefulness for same member, at the bend of this lead-in wire on lead frame;

The optical element frame is formed with the projection of location usefulness in the corresponding position, hole with the location usefulness of the bend that is opened in lead-in wire.

9. multi-beam photoelectric sensor as claimed in claim 7 is characterized in that,

Be subjected to the light module to be,, come the incorporate light optical module that is subjected to by the optical element frame making under the state that constitutes lens component that is subjected to the light optical system and IC encapsulation the carrying out optical axis coupling of taking in optical element,

IC encapsulates, and photo detector is installed at least and makes lead frame and go between to offer the hole of location usefulness for same member, at the bend of this lead-in wire on lead frame;

The optical element frame is formed with the projection of location usefulness in the corresponding position, hole with the location usefulness of the bend that is opened in lead-in wire.

10. multi-beam photoelectric sensor as claimed in claim 8 is characterized in that, the hole of location usefulness is cubic hole.

11. multi-beam photoelectric sensor as claimed in claim 9 is characterized in that, the hole of location usefulness is cubic hole.

12. multi-beam photoelectric sensor as claimed in claim 1 is characterized in that,

Use in the signal transmission member at light projector,

Jointly connect from be positioned at light projector with the light projector of an end of module column with module to the common conductor wire of the light projector that is positioned at the other end with module, contain light projector electric current supplying wire and conversion clock line and ground wire, and

The D input of trigger is connected to the adjacent side in abutting connection with the intermodule conductor wire, and the Q output of trigger is connected to the adjacent other party in abutting connection with the intermodule conductor wire.

13. multi-beam photoelectric sensor as claimed in claim 1 is characterized in that,

Be subjected to light with in the signal transmission member,

Jointly connect from being positioned at and be subjected to light to be subjected to the common conductor wire of light with module to what be positioned at the other end, contain and be subjected to photoelectric current supply line and conversion clock line and ground wire with module with the light that is subjected to of an end of module column, and

The D input of trigger is connected to the adjacent side in abutting connection with the intermodule conductor wire, and the Q output of trigger is connected to the adjacent other party in abutting connection with the intermodule conductor wire.

Images