A kind of making gas panel light solidified barrier size
Technical field
The invention belongs to the gas discharge technical field, be specifically related to a kind of making gas panel light solidified barrier size.
Background technology
In the manufacturing technology of known gas panel barrier, the method that adopts is the barrier size that the printing multilayer contains glass powder with low melting point and high-melting-point filler on the glass sheet of back, the glass transition point of this glass powder with low melting point is at 400-450 ℃, fusing point is lower than 600 ℃, and the high-melting-point filler can be MgO or TiO
2Organic binder bond adopts polyvinyl alcohol (PVA), Ju Xi Bi Tong, tygon butyrate, ethyl cellulose or derivatives thereof, adds the micromolecule volatile solvent in addition again and regulates its viscosity.For example, French Thomson Plasma Co., Ltd. mentions in its patent CN00105510.0CN1271154 G09G3/28, selects to have added polyvinyl alcohol (PVA), Ju Xi Bi Tong, tygon butyrate, ethyl cellulose in the tackifier of its barrier material.Adopt Infrared Heating after being printed on the glass plate, make the resin in the tackifier produce the hot glue connection, thereby solidify.
Organic binder bond adopts the ethyl cellulose derivant in about the patent CN02114644.6CN1392206 C09D101/08 of dielectric paste.These organic common features are, can produce the effect of glue connection when Infrared Heating between the molecular resin, form superpolymer, thereby solidify and make wherein glass dust and filler form coating and be attached to glass substrate.The shortcoming that infra-red heat is solidified mainly is: 1, set time is long, infrared curing needs about 80 ℃ temperature, the glue connection reaction that heat causes is carried out slower, and the thickness of gas panel barrier often will reach more than 100 microns, this needs repeatedly printing, repeatedly solidify, the time spent is grown and is unfavorable for large-scale production; 2, energy consumption is higher, owing to use infrared ray as heating source, needs continuous working when volume production, and power consumption is high; 3, easily produce volatility and pollute, in order to regulate parameters such as set time and viscosity, the heat curing slurry is difficult to avoid using volatile organic solvent, causes air pollution.
Summary of the invention
The objective of the invention is to overcome the shortcoming of above-mentioned prior art, provide a kind of and do not relied on heating as the curing energy, and curing rate is fast, film forming is smooth smooth, free of contamination making gas panel barrier size.
For achieving the above object, the technical solution used in the present invention is: the prepolymer resin that contains 10%-20% by mass percentage, the light trigger of 2%-4%, the reactive diluent of 10%-20%, the high-melting-point filler of the glass powder with low melting point of 30%-40% and 25%-40%.
The said prepolymer resin of the present invention is bisphenol A epoxy acrylate, phenolic aldehyde epoxy acrylate, urethane acrylate, polyester acrylate, polyether acrylate, cellulose-acrylate, bisphenol-A epoxy methacrylate, phenolic aldehyde epoxy methacrylates, urethane methacrylate, polyester methacrylate, polyethers methacrylate or the cellulose methacrylate that contains acrylate or methacrylate functional; Light trigger is to divide benzophenone, alpha, alpha-dimethyl oxygen base-α-phenyl acetophenone, the α that produces free radical when ultraviolet excitation, α-diethoxy acetophenone, 2-hydroxy-2-methyl-1-phenylacetone, 1-hydroxyl-cyclohexyl benzophenone, α-amine alkyl phenones, two benzoyl phenyl phosphine oxide, tetramethyl Michler's keton or 4,4 '-two phenoxy group benzophenone; Reactive diluent is styrene, butyl acrylate, vinyl acetate, 1,6-hexanediol double methacrylate, two contracts/the two acrylic acid esters, two of tripropylene glycol contract/and the two acrylic acid esters of triethylene Glycol, ethoxyquin bisphenol-A double methacrylate or polyglycol double methacrylate.
Owing to contain light trigger in the barrier size of the present invention, thus do not rely on be heating and curing but relies on ultraviolet cause the reaction of photochemistry glue connection with barrier size attached to after on the glass substrate, so the curing rate of barrier is fast, film forming is smooth smooth, and is pollution-free.
Embodiment:
Embodiment 1: contain 10% bisphenol A epoxy acrylate by mass percentage, 4% benzophenone, 20% styrene, 30% glass powder with low melting point and 36% high-melting-point filler.
Embodiment 2: contain 20% phenolic aldehyde epoxy acrylate by mass percentage, alpha, alpha-dimethyl oxygen base-α-phenyl acetophenone of 2%, 10% butyl acrylate, 40% glass powder with low melting point and 28% high-melting-point filler.
Embodiment 3: contain 18% urethane acrylate by mass percentage, 3% α, α-diethoxy acetophenone, 15% vinyl acetate, 39% glass powder with low melting point and 25% high-melting-point filler.
Embodiment 4: contain 12% polyester acrylate by mass percentage, 2-hydroxy-2-methyl-1-phenylacetone of 4%, 18% 1,6-hexanediol double methacrylate, 35% glass powder with low melting point and 31% high-melting-point filler.
Embodiment 5: contain 15% polyether acrylate by mass percentage, 1-hydroxyl-cyclohexyl benzophenone of 2%, 12% two contract/the two acrylic acid esters of tripropylene glycol, 32% glass powder with low melting point and 39% high-melting-point filler.
Embodiment 6: contain 12% cellulose-acrylate by mass percentage, 3% α-amine alkyl phenones, 11% two contract/the two acrylic acid esters of triethylene Glycol, 34% glass powder with low melting point and 40% high-melting-point filler.
Embodiment 7: contain 16% bisphenol-A epoxy methacrylate by mass percentage, two benzoyl phenyl phosphine oxides of 2%, 17% ethoxyquin bisphenol-A double methacrylate, 35% glass powder with low melting point and 30% high-melting-point filler.
Embodiment 8: contain 11% phenolic aldehyde epoxy methacrylates by mass percentage, 4% tetramethyl Michler's keton, 10% polyglycol double methacrylate, 38% glass powder with low melting point and 37% high-melting-point filler.
Embodiment 9: contain 18% urethane methacrylate by mass percentage, 3% 4,4 '-two phenoxy group benzophenone, 15% styrene, 37% glass powder with low melting point and 27% high-melting-point filler.
Embodiment 10: contain 12% polyester methacrylate by mass percentage, 4% benzophenone, 16% polyglycol double methacrylate, 36% glass powder with low melting point and 32% high-melting-point filler.
Embodiment 11: contain 14% polyethers methacrylate by mass percentage, 2% α, α-diethoxy acetophenone, 13% two contract/the two acrylic acid esters of tripropylene glycol, 35% glass powder with low melting point and 36% high-melting-point filler.
Embodiment 12: contain 20% cellulose methacrylate by mass percentage, 3% α-amine alkyl phenones, 10% 1,6-hexanediol double methacrylate, 40% glass powder with low melting point and 27% high-melting-point filler.
Barrier size of the present invention is under the UV-irradiation of 365nm, and photoinitiator molecules reaches excited state and homolysis takes place, and produces free radical.Under the initiation of free radical, the macromolecular structure that the chain polymerization reaction generates the glue connection takes place in the double bond functional group of prepolymer resin, reaches the purpose of curing, thereby glass powder with low melting point and filler are bonded on the glass plate, forms smooth smooth coating.The effect of reactive diluent is the viscosity of regulating whole system.They are also non-volatile in solidification process, and itself also participate in reaction, form dendritic structure.