CN1746732A - Display panels and circuit substrate manufacturing method thereof - Google Patents
Display panels and circuit substrate manufacturing method thereof Download PDFInfo
- Publication number
- CN1746732A CN1746732A CN 200410051445 CN200410051445A CN1746732A CN 1746732 A CN1746732 A CN 1746732A CN 200410051445 CN200410051445 CN 200410051445 CN 200410051445 A CN200410051445 A CN 200410051445A CN 1746732 A CN1746732 A CN 1746732A
- Authority
- CN
- China
- Prior art keywords
- connector
- driving
- chip
- leads
- many
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
A kind of display panels, it comprises one first substrate and one second substrate, this second substrate and this first substrate are superimposed mutually, this second substrate comprises many first leads, many second leads, one chip for driving and a connector, many first leads of one end and this of this chip for driving link to each other, wherein, this second substrate also comprises a connector pressing district, this connector is positioned in this connector pressing district, the other end of this chip for driving forms with this connector by these many second leads and is electrically connected, this chip for driving is used in this display panels of driving and makes its display image, and this connector is used in external unit and is connected.The present invention also provides a kind of circuit substrate manufacturing method of display panels.
Description
[technical field]
The invention relates to the manufacture method of the circuit substrate of a kind of display panels and this display panels.
[background technology]
Nowadays, computing machine and electronics technology fast development, all be prevalent in each corner of society as palmtop computer, notepad and notebook etc., develop in response to computing machine, electronic product direction also strong towards calculation function, that speed is fast and volume is little, inner connector volume also has with the trend of significantly dwindling.The display panels method for making adopts directly with chip (Integrated Circuit more at present, IC) be arranged on (Chip On Glass on the glass substrate, COG), utilize flexible printed wiring board (Flexible Print Circuit again, FPC) (Printed CircuitBoard PCB) is connected with chip and printed circuit board (PCB).Wherein, connector (Connector) generally is mounted on the printed circuit board (PCB), and (Surface MountTechnology SMT) is installed in connector (Connector) on the flexible printed wiring board but also can adopt surface mounting technique.
Please refer to Fig. 1, is a kind of synoptic diagram of display panels 100 of prior art.This liquid crystal panel 100 comprises first substrate 41, second substrate 42, chip for driving 46 and lead 45.This first substrate 41 and second substrate 42 are superimposed mutually, and this chip for driving 46 is arranged on this second substrate 42, and make viewing area 43 display images by lead 45 connection control circuits (figure does not show).
In this liquid crystal panel 100, this chip for driving 46 is connected by lead 48, flexible printed wiring board 49 and connector 50, and this connector 50 can just be connected with computing machine or other electronic equipment, also can save the space of printed circuit board (PCB).
But flexible printed wiring board 49 easily produces defectives such as bad connection or folding wound in production and transportation, make exhibit stabilization not good, thereby influence the characteristic of liquid crystal panel, and it is not high to cause producing yield.
[summary of the invention]
Flexible printed wiring board causes loose contact or folding wound easily in the prior art in production and transportation in order to overcome, and causes the not good defective of exhibit stabilization of liquid crystal panel, the invention provides a kind of exhibit stabilization display panels preferably.
The present invention also provides a kind of circuit substrate manufacturing method of above-mentioned display panels.
The scheme that technical solution problem of the present invention is adopted is: a kind of display panels is provided, it comprises one first substrate and one second substrate, this second substrate and this first substrate are superimposed mutually, this second substrate comprises many first leads, many second leads, one chip for driving and a connector, many first leads of one end and this of this chip for driving link to each other, wherein, this second substrate also comprises a connector pressing district, this connector is positioned in this connector pressing district, the other end of this chip for driving forms with this connector by these many second leads and is electrically connected, this chip for driving is used in this display panels of driving and makes its display image, and this connector is used in external unit and is connected.
The circuit substrate manufacturing method of display panels of the present invention, it may further comprise the steps: a substrate is provided, and many first leads of coating and many second leads form chip for driving pressing district and connector pressing district simultaneously on this substrate; In this chip for driving pressing district and connector pressing district, be coated with aeolotropic conductive film respectively; On the aeolotropic conductive film in this chip for driving pressing district, chip for driving is set, many first leads of itself and this and these many second leads is formed be electrically connected; On the aeolotropic conductive film in this connector pressing district, connector is set, many second leads of itself and this is formed be electrically connected, be connected with this chip for driving by these many second leads.
Compared to prior art, display panels of the present invention does not adopt flexible printed wiring board and directly by lead connector is attached on second substrate, therefore can exempt the loose contact that in production and transportation, causes because of flexible printed wiring board or roll over the defective of hindering, thereby can make the exhibit stabilization of liquid crystal panel better.In the method for making of this display panels circuit substrate, be to adopt aeolotropic conductive film directly connector to be attached to make it on the lead to be connected with chip for driving, can fully ensure the electric connection between this connector and chip for driving, therefore can improve the production yield of product.
[description of drawings]
Fig. 1 is a prior art structure of liquid crystal display panel synoptic diagram.
Fig. 2 is a structure of liquid crystal display panel synoptic diagram of the present invention.
Fig. 3 is the part-structure synoptic diagram of second substrate among Fig. 2.
Fig. 4 is the circuit substrate method for making process flow diagram of display panels of the present invention.
Fig. 5 is the circuit substrate manufacturing method synoptic diagram of display panels of the present invention.
Fig. 6 is that circuit substrate among Fig. 3 is along the phantom view of VI-VI direction.
[embodiment]
Please together referring to figs. 2 and 3, Fig. 2 is a structure of liquid crystal display panel synoptic diagram of the present invention, Fig. 3 is the part-structure synoptic diagram of second substrate among Fig. 2.This display panels 1 comprises first substrate 4 and second substrate 3, and this first substrate 4 and second substrate 3 are superimposed mutually, and this second substrate 3 comprises chip for driving 5, connector 10, many first leads 9 and many second leads 11.Please also refer to Fig. 5, have a connector pressing district 6 on this second substrate 3, this connector 10 is positioned in this connector pressing district 6, and be connected makes viewing area 2 display images to an end of this chip for driving 5 with control circuit (figure does not show) by many first leads; The other end of this chip for driving 5 is connected with this connector 10 by these many second leads 11, and this connector 10 can be connected with printed circuit board (PCB), computing machine or other external electronic device.This chip for driving 5 is by aeolotropic conductive film (Anisotropic Conductive Film, ACF) 7 (please refer to Fig. 6) form with these many first leads 9 and many second leads 11 and are electrically connected, this connector 10 also is to form by many second leads of aeolotropic conductive film 7 and this 11 to be electrically connected, and finally reaches the electric connection between this chip for driving 5 and this connector 10.
Please together with reference to figure 3, Fig. 4 and Fig. 5, Fig. 4 is the circuit substrate method for making process flow diagram of display panels of the present invention, and Fig. 5 is the circuit substrate manufacturing method synoptic diagram of display panels of the present invention.The circuit substrate method for making of display panels of the present invention may further comprise the steps: a substrate at first is provided, and many first leads 9 of coating and many second leads 11 form chip for driving pressing district 6 and connector pressing district 8 (steps 401) simultaneously on this substrate; Be coated with aeolotropic conductive film (step 402) respectively in this chip for driving pressing district and connector pressing district; On the aeolotropic conductive film in this chip for driving pressing district 6, chip for driving 5 (step 403) is set; On the aeolotropic conductive film in this connector pressing district 8, connector 10 (step 404) is set.
Please refer to Fig. 6, be circuit substrate among Fig. 3 along the phantom view of VI-VI direction, promptly link the phantom view of chip for driving 5 and many first leads by aeolotropic conductive film.Be the electric connection of a metal coupling 22 with the aeolotropic conductive film 7 of chip for driving 5 shown in the figure, other metal coupling 22 connected modes of chip for driving 5 also at this in like manner.This aeolotropic conductive film 7 is made of binder 23 and electrically conductive particles, and this electrically conductive particles inside has conductive materials 26 and its outside is coated with dielectric film 25, and wherein binder 23 can be an insulating resin, also can be epoxy resin or acryl resin.Metal coupling 22 is positioned at the below of chip for driving 5, with metal coupling 22 during down with lead 9 pressings, be crashed to pieces with the dielectric film 25 of electrically conductive particles in the organic bond 23 that contacts under the metal coupling 22, conductive materials 26 fully contacts with metal coupling 22 and can realize electrically connecting.
The electric connection mode that connector 10 and many second leads 11 are realized by aeolotropic conductive film 7 also therewith in like manner.
Display panels 1 of the present invention does not adopt flexible printed wiring board and directly by lead 11 connector 10 is attached on second substrate 3, therefore can exempt the loose contact that in production and transportation, causes because of flexible printed wiring board or roll over the defective of hindering, thereby can make the exhibit stabilization of liquid crystal panel better.In the method for making of this display panels circuit substrate, be to adopt aeolotropic conductive film 7 directly connector 10 to be attached to make it on the lead 11 to be connected with chip for driving 5, can fully ensure the electric connection of 5 of this connector 10 and chip for driving, therefore can improve the production yield of product.
Claims (7)
1. display panels, it comprises one first substrate and one second substrate, this second substrate and this first substrate are superimposed mutually, this second substrate comprises many first leads, many second leads, one chip for driving and a connector, many first leads of one end and this of this chip for driving link to each other, it is characterized in that: this second substrate also comprises a connector pressing district, this connector is positioned in this connector pressing district, the other end of this chip for driving forms with this connector by these many second leads and is electrically connected, this chip for driving is used in this display panels of driving and makes its display image, and this connector is used in external unit and is connected.
2. display panels as claimed in claim 1 is characterized in that: between this chip for driving and these many first leads and these many second leads is to form by aeolotropic conductive film to be electrically connected.
3. display panels as claimed in claim 1 or 2 is characterized in that: this connector is to form by aeolotropic conductive film to be electrically connected with this second lead.
4. the circuit substrate manufacturing method of a display panels, it may further comprise the steps:
One substrate is provided, and many first leads of coating and many second leads form chip for driving pressing district and connector pressing district simultaneously on this substrate;
In this chip for driving pressing district and connector pressing district, be coated with aeolotropic conductive film respectively;
On the aeolotropic conductive film in this chip for driving pressing district, chip for driving is set, many first leads of itself and this and these many second leads is formed be electrically connected;
On the aeolotropic conductive film in this connector pressing district, connector is set, many second leads of itself and this is formed be electrically connected, be connected with this chip for driving by these many second leads.
5. the circuit substrate manufacturing method of display panels as claimed in claim 4, it is characterized in that: this aeolotropic conductive film is made of binder and electrically conductive particles.
6. the circuit substrate manufacturing method of display panels as claimed in claim 5, it is characterized in that: the binder of this aeolotropic conductive film is an insulating resin.
7. the circuit substrate manufacturing method of display panels as claimed in claim 5, it is characterized in that: this electrically conductive particles inside has conductive materials and its outside is coated with dielectric film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410051445 CN1746732A (en) | 2004-09-09 | 2004-09-09 | Display panels and circuit substrate manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410051445 CN1746732A (en) | 2004-09-09 | 2004-09-09 | Display panels and circuit substrate manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1746732A true CN1746732A (en) | 2006-03-15 |
Family
ID=36166333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410051445 Pending CN1746732A (en) | 2004-09-09 | 2004-09-09 | Display panels and circuit substrate manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1746732A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103336601A (en) * | 2013-06-14 | 2013-10-02 | 业成光电（深圳）有限公司 | Touch display device |
| CN104375712A (en) * | 2014-12-10 | 2015-02-25 | 重庆墨希科技有限公司 | Production method of touchscreen binding area sliver paste protective structure |
| CN104391605A (en) * | 2014-12-10 | 2015-03-04 | 重庆墨希科技有限公司 | Protective structure for silver paste in binding region |
| CN104461141A (en) * | 2014-12-10 | 2015-03-25 | 重庆墨希科技有限公司 | Production method of bonding area silver paste protection structure of touch screen |
| CN104461140A (en) * | 2014-12-10 | 2015-03-25 | 重庆墨希科技有限公司 | Production method of bonding area silver paste protection structure |
| CN104461139A (en) * | 2014-12-10 | 2015-03-25 | 重庆墨希科技有限公司 | Production method of bonding area silver paste protection structure |
-
2004
- 2004-09-09 CN CN 200410051445 patent/CN1746732A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103336601A (en) * | 2013-06-14 | 2013-10-02 | 业成光电（深圳）有限公司 | Touch display device |
| CN104375712A (en) * | 2014-12-10 | 2015-02-25 | 重庆墨希科技有限公司 | Production method of touchscreen binding area sliver paste protective structure |
| CN104391605A (en) * | 2014-12-10 | 2015-03-04 | 重庆墨希科技有限公司 | Protective structure for silver paste in binding region |
| CN104461141A (en) * | 2014-12-10 | 2015-03-25 | 重庆墨希科技有限公司 | Production method of bonding area silver paste protection structure of touch screen |
| CN104461140A (en) * | 2014-12-10 | 2015-03-25 | 重庆墨希科技有限公司 | Production method of bonding area silver paste protection structure |
| CN104461139A (en) * | 2014-12-10 | 2015-03-25 | 重庆墨希科技有限公司 | Production method of bonding area silver paste protection structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1744375B (en) | Connecting substrate, connecting structure and connection method | |
| US20050183884A1 (en) | Flexible printed circuit board | |
| CN102116987A (en) | Electronic paper display panel and manufacture method thereof, electronic paper display device | |
| US20030231275A1 (en) | Liquid crystal display device | |
| US20030117543A1 (en) | Structure of a display device | |
| CN1717147A (en) | Flexible wiring substrate and preparing method, flexible wiring substrate of distribution chip and electronic apparatus | |
| CN1837911A (en) | Display device | |
| CN1746732A (en) | Display panels and circuit substrate manufacturing method thereof | |
| WO2022233071A1 (en) | Display panel and display apparatus | |
| WO2020156595A9 (en) | Flexible circuit board and manufacturing method, display device, circuit board structure and display panel thereof | |
| CN109951951B (en) | Printed circuit board and display device | |
| US8253031B2 (en) | Printed circuit board | |
| CN1245059C (en) | Electronic parts module and electric equipment | |
| US8742264B2 (en) | Electronic apparatus | |
| CN2735377Y (en) | Flip chip structure | |
| CN113296630A (en) | Touch display device and manufacturing method | |
| TWI288267B (en) | Liquid crystal display panel and method of fabricating the circuit substrate of the liquid crystal display panel | |
| CN2768375Y (en) | Installing structure of flexible printed circuit plate | |
| CN213903994U (en) | Display device | |
| CN100480786C (en) | Composite crystal structure of glass, and LCD of using the composite crystal structure of glass | |
| CN1185912C (en) | Differential circuit structure of PCB and its preparing process | |
| CN1847931A (en) | Display base and LCD with the base | |
| CN2763834Y (en) | Glass compound crystal structure and LCD using same | |
| CN2784973Y (en) | Lcd | |
| US11880110B2 (en) | Array substrate and display panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |