CN1744110B - Memory card - Google Patents
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- CN1744110B CN1744110B CN 200510066246 CN200510066246A CN1744110B CN 1744110 B CN1744110 B CN 1744110B CN 200510066246 CN200510066246 CN 200510066246 CN 200510066246 A CN200510066246 A CN 200510066246A CN 1744110 B CN1744110 B CN 1744110B
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Abstract
This invention is to provide an ultra-miniaturized, thin-sized memory card provided with a mechanism for preventing a wrong insertion to a memory card slot. A multi-function memory card is composed of a card body and a cap for housing the card body. The card body is made of mold resin that encapsulates plural semiconductor chips mounted on a main surface of a wiring substrate. The card body is housed into the cap with the back face of the wiring substrate facing outward. Guide channels are provided at both side faces of the cap for preventing that the card is inserted upside down. Further, a convex section is provided at the trailing edge of the cap for preventing that the card is inserted in the wrong direction.
Description
The cross reference of related application
The application requires the right of priority of Japanese patent application No.2004-257244 that submitted on September 3rd, 2004 and the Japanese patent application No.2004-129602 that submitted on April 26th, 2004.Here, its content is introduced the application by reference.
Technical field
The present invention relates to storage card, and relate more particularly to be applied to effectively technology as the storage card of extra small, the thin size in the card slot that is inserted into the portable terminal device of for example cellular communication.
Background technology
Except telephony feature, cell phone has the Internet and connects mail transmission, functions such as picture catching, navigation.Recently, also increased security function, the example of this respect comprises non-contacting IC-card.
Along with aforesaid cellular multifunction, in as the field that is inserted into the card in the cellular storage card slot, also developed the multiple card that promotes multifunction by reducing on miniaturization and the size.
The international open No.WO01/84490 (patent references 1) of patent discloses such storage card of seeking multifunction.
Multifunction
[references 1]
The international open No.WO01/84490 of patent
Summary of the invention
As various types of storage cards, have such configuration usually as the storage card that is inserted in the cellular storage card slot, the semi-conductor chip that wherein is installed in the suprabasil resin-encapsulated of wiring is accommodated in the shell of resin making.Label with descriptions such as name of product, production firm, memory capacity is set on the surface of shell, and is provided with the external connection terminals that is connected to the bonder terminal in the storage card slot on its back of the body surface thus.
When such storage card is inserted in the cellular storage card slot, the user may make a mistake the direction (front or rear direction, the perhaps direction at the front or the back side) of card, to such an extent as to perhaps they often insert storage card with the direction of mistake.When card inserts with the direction of mistake, bonder terminal in the slot be bent or the external connection terminals that blocks and not the bonder terminal of corresponding this external connection terminals contact with one another, therefore caused the shortcoming of the circuit in destruction or the defective semiconductor chip.Particularly, the miniaturization of card makes and judges which direction is front or rear or which direction is that the front or the back side are very difficult.Therefore, providing the mechanism that can prevent to insert mistakenly storage card slot definitely in the exploitation of storage card is a basic assignment.
Further, such storage card is used by often will block the cellular telephone subscribers that inserts or extract from slot.Therefore, the mechanism that is provided at the connection reliability between a segment length keeps bonder terminal in the slot and card on the time the external connection terminals also is a basic assignment.
And such storage card requires reducing of miniaturization and size, and requires multifunction.In order to satisfy this opposite requirement, in a kind of technology of manufacture process requirement of card in the wiring substrate, the polylith semi-conductor chip to be installed, wherein each piece has the size of no more than 100 microns reduction by polishing its back of the body surface, and requires in the exploitation of card structure that semi-conductor chip is can be in limited size as much as possible to carry out layering.
The purpose of this invention is to provide a kind of storage card with the mechanism that can prevent to insert mistakenly storage card slot definitely.
Another object of the present invention provide a kind of can a segment length keep on the time with storage card slot in the storage card of connection reliability of bonder terminal.
Another object of the present invention provides a kind of multifunctional storage card with the card structure that can increase the quantity of wanting mounted semiconductor chip.
Above mentioned purpose of the present invention and other purpose and novel characteristics of the present invention will become obvious according to the description and the accompanying drawing of this instructions.
Be the short summary of the invention of the typical case in the invention disclosed in this instructions below.
Storage card according to the present invention comprises: sheet card body, wherein be installed in have on it surface that forms a plurality of external connection terminals another surperficial semi-conductor chip of wiring substrate with resin-encapsulated; And sheet cover, has groove on the one surface of being formed at, that be used to hold the card body, wherein block in the groove that body is contained in cover so that expose a surface of wiring substrate, two corner parts as cover one side of leading edge when plug-in card provide sphering to handle, form the classification guide channel in the two side portions of cover, so as the width on a surface to be different with another surperficial width and the outshot on perpendicular to the direction on a surface, given prominence to when being formed on plug-in card as the opposite side of the cover of trailing edge.
The effect that typical case in invention disclosed invention is in this application obtained will be carried out concise and to the point explanation hereinafter.
The present invention can realize a kind of storage card with the mechanism that can prevent to insert mistakenly storage card slot definitely.
The present invention can realize a kind of can a segment length keep on the time with storage card slot in the storage card of connection reliability of bonder terminal.
The present invention can realize a kind of storage card of card structure of the quantity with the semi-conductor chip that can increase layering.
Description of drawings
Fig. 1 represents the planimetric map of the back of the body appearance of multifunctional storage card according to an embodiment of the invention;
Fig. 2 represents the planimetric map of the front surface outward appearance of multifunctional storage card according to an embodiment of the invention;
Fig. 3 is the sectional view of the major part of multifunctional storage card according to an embodiment of the invention;
Fig. 4 represents the block diagram of the exemplary system of multifunctional storage card according to an embodiment of the invention;
Fig. 5 is used to explain the view of the function of the external connection terminals of multifunctional storage card according to an embodiment of the invention;
Fig. 6 is the view that is used to explain the position relation between the bonder terminal of the external connection terminals of multifunctional storage card according to an embodiment of the invention and storage card slot;
Fig. 7 is the view that is used to explain according to the position relation between the bonder terminal of the external connection terminals of the multifunctional storage card of a comparative examples and storage card slot;
Fig. 8 is the sectional view that is illustrated in the structure of guiding groove set on the multifunctional storage card according to an embodiment of the invention;
Fig. 9 represents that multifunctional storage card according to an embodiment of the invention is inserted into the sectional view of the state in the connector of storage card slot;
Figure 10 is the sectional view of example that is illustrated in the position of guiding groove set on the multifunctional storage card according to an embodiment of the invention;
Figure 11 is the sectional view of another example that is illustrated in the position of guiding groove set on the multifunctional storage card according to an embodiment of the invention;
Figure 12 represents the planimetric map of the front surface of multifunctional storage card according to an embodiment of the invention;
Figure 13 represents the outboard profile of multifunctional storage card according to an embodiment of the invention;
Figure 14 represents the outboard profile of multifunctional storage card according to an embodiment of the invention;
Figure 15 represents the outboard profile of multifunctional storage card according to an embodiment of the invention;
Figure 16 represents the planimetric map of the front surface of multifunctional storage card according to an embodiment of the invention;
Figure 17 represents the outboard profile of multifunctional storage card according to an embodiment of the invention;
Figure 18 (a) and Figure 18 (b) are the views of wrong contact preventing mechanism that is used to explain the bonder terminal of the external connection terminals of multifunctional storage card according to an embodiment of the invention and storage card slot;
Figure 19 represents the planimetric map of the back of the body appearance of multifunctional storage card according to another embodiment of the present invention;
Figure 20 represents the planimetric map of the front surface outward appearance of multifunctional storage card according to another embodiment of the present invention;
Figure 21 is the view of wrong contact preventing mechanism that is used to explain the bonder terminal of the external connection terminals of multifunctional storage card according to another embodiment of the present invention and storage card slot;
Figure 22 be expression a kind of wherein according to another embodiment of the present invention multifunctional storage card be inserted into the planimetric map of the state in the connector;
Figure 23 be expression a kind of wherein according to another embodiment of the present invention multifunctional storage card be inserted into the planimetric map of the state in the connector;
Figure 24 be expression a kind of wherein according to another embodiment of the present invention multifunctional storage card be inserted into the planimetric map of the state in the connector;
Figure 25 explains the card body be used to the connect multifunctional storage card according to another embodiment of the present invention view to the method for lid;
Figure 26 explains the card body be used to the connect multifunctional storage card according to another embodiment of the present invention view to the method for lid;
Figure 27 explains the card body be used to the connect multifunctional storage card according to another embodiment of the present invention view to the method for lid;
Figure 28 explains the card body be used to the connect multifunctional storage card according to another embodiment of the present invention view to the method for lid;
Figure 29 explains the card body be used to the connect multifunctional storage card according to another embodiment of the present invention view to the method for lid;
Figure 30 explains the card body be used to the connect multifunctional storage card according to another embodiment of the present invention view to the method for lid;
Figure 31 represents the planimetric map of the arrangement of the external connection terminals of multifunctional storage card according to another embodiment of the present invention;
Figure 32 is the planimetric map of the front surface outward appearance of the adapter of representing that multifunctional storage card inserted according to another embodiment of the present invention;
Figure 33 is the planimetric map of the back of the body appearance of the adapter of representing that multifunctional storage card inserted according to another embodiment of the present invention;
Figure 34 is the planimetric map that expression is used to connect the wiring pattern of the external connection terminals of multifunctional storage card and the corresponding external connection terminals of adapters;
Figure 35 is the planimetric map of arrangement that is illustrated in the opening portion of the connector that is provided with on the adapter that multifunctional storage card inserted according to another embodiment of the present invention;
Figure 36 is the planimetric map that is illustrated in the protection chip that is provided with on the adapter that multifunctional storage card inserted according to another embodiment of the present invention.
Embodiment
Embodiments of the invention will be hereinafter by carrying out detailed explanation with reference to the accompanying drawings.It should be noted that identical label composes to identical assembly, be used for explaining the repetition of explanation of institute's drawings attached of embodiment it to be omitted in.
Storage card according to present embodiment is a kind of extra small, large-capacity multifunctional storage card that also has security function except having memory function.It is used to be inserted into such as in the cellular storage card slot of the third generation.
Fig. 1 and Fig. 2 are the planimetric map of expression according to the multifunctional storage card outward appearance of this embodiment, and wherein Fig. 1 represents to have formed on it surface of external connection terminals, and Fig. 2 represents its apparent surface.Further, Fig. 3 is the sectional view of this storage card main portion of expression.It should be noted that the surface that forms external connection terminals on it is called as back of the body surface, and surface shown in Figure 2 is called as front surface.
On the back of the body surface of wiring substrate 2, form a plurality of (for example, 20) external connection terminals 5.These external connection terminals 5 are being arranged in two row on the short side direction of wiring substrate 2.Further, external connection terminals 5 by be formed on wiring in the substrate 2 wiring and closing line 6 be electrically connected to semi-conductor chip (3C, 3M, 3F).For the ease of test, except external connection terminals 5, a plurality of calibrating terminals 7 are arranged on the back of the body surface of wiring substrate 2.Effectively being arranged as of calibrating terminal 7: calibrating terminal 7 is placed between the external connection terminals 5 of lining up two row.
Have with the groove (recessed portion) that blocks the about same size of body 1A size and be formed on the back of the body surface of covering 1B.Card body 1A be accommodated in this groove and the back of the body surface of wiring substrate 2 towards the outside, and join to by binder and to cover 1B.The degree of depth that is used to hold the groove of card body 1A approximates the thickness of card body 1A greatly, covers the back of the body surface of 1B and the back of the body surface of wiring substrate 2 thus and roughly forms same plane.The flat shape of card body 1A is for example, to have the rectangle of long side of 14mm and the short side of 11mm.Further, the thickness that comprises the card body 1A of wiring substrate 2 and casting resin 4 is 0.8mm.
(casting resin 4 3F) is made by the thermoset epoxy resin that comprises the crystal filling material for 3C, 3M to be used to encapsulate the semi-conductor chip that is installed on wiring substrate 2 first type surfaces.On the other hand, the lid 1B that is used to hold card body 1A forms by having the briquetting of making than those thermoplastic resins that forms low frictional resistance of the thermoset epoxy resin of casting resin 4 and hardness.Although do not illustrate, under the situation of actual product, the label with description of name of product, production firm, memory capacity etc. is set on the front surface (surface shown in Figure 2) of the lid 1B corresponding with the front surface of multifunctional storage card 1.Alternatively, these information can be printed onto on the front surface that covers 1B sometimes.
The external dimensions that is used to hold the lid 1B of card body 1A has the long side of 16mm and the short side of 12.5mm.Locate to be provided as the mistake insertion that is used for making multifunctional storage card 1 insert the cell phone slot in the side (one of a pair of short side) of lid 1B and prevent machine-processed outshot 1C with correct direction.Outshot 1C forms and has the thickness of 0.7mm point-blank from the end to end of this side.
The part place that the thickness of lid 1B is provided with outshot 1C therein is 1.6mm, and is 1.2mm at the thickness of the part that is used to hold card body 1A.Card body 1A is covered by lid 1B, makes the size of multifunctional storage card 1 equal to cover the size of 1B.As mentioned above, comprise that the multifunctional storage card of card body 1A and lid 1B is very little dimensionally and thin, have the long side of 16mm, the short side of 12.5mm and the thickness (thickness that only forms the part of outshot 1C therein is 1.6mm) of 1.2mm.
The manufacturing of multifunctional storage card 1 is used has for example several big wiring substrates that decuple wiring substrate 2 areas.Should big wiring substrate form to matrix form a plurality of wiring patterns unit that wiring substrate 2 needs thereon.When making multifunctional storage card 1, (3C, 3M 3F) at first are installed on each unit of big wiring substrate semi-conductor chip, and then, (3C, 3M 3F) are electrically connected by closing line 6 for the wiring pattern of the substrate of connecting up greatly and semi-conductor chip.Subsequently, this big wiring substrate is arranged in the casting resin mould of being made by a mold and bed die, with use the whole semi-conductor chips of casting resin 4 encapsulation (3C, 3M, 3F).Then, by using cutting blade and separately, thereby obtain the card body 1A that has said external size and rectangular parallelepiped protrusion part shape in a large number with this big wiring substrate and casting resin 4 cuttings.On the other hand, thermoplastic resin is injected in the casting resin mould different with above mentioned mould, covers 1B so that form thus.Then, card body 1A is received in the groove that covers 1B, and both are joined together by binder.Adopt a kind of wherein with semi-conductor chip (3C, 3M, 3F) be installed in each unit of big wiring substrate and all resins encapsulation, and will connect up greatly then substrate and casting resin 4 method of cutting, can improve the throughput rate of card body 1A and reduce its manufacturing cost.
And, be used to engage the operation of covering 1B and card body 1A in order to simplify, double sticky tape is bonded at the surface of the casting resin 4 that takes off from the casting resin mould, and then, big wiring substrate, casting resin 4 and double sticky tape is cut simultaneously.The lip-deep card body 1A that this can provide double sticky tape wherein to be bonded at casting resin 4, both can be only be received in the groove that covers 1B and engage by blocking body 1A thus.Attention when substrate, casting resin 4 and double sticky tape are connected up in cutting greatly at the same time, need rotate to the front surface of cutting blade from double sticky tape towards the surperficial direction of the big wiring substrate back of the body.This can remove the binder that is bonded on the blade from cutting blade when cutting double sticky tape when cutting casting resin 4 and big wiring substrate, this makes and can prevent because the deterioration in cutting operation that the viscosity of the binder on the cutting blade causes.
Then, will the system configuration according to the multifunctional storage card 1 of this embodiment be made an explanation.Multifunctional storage card 1 according to this embodiment has, for example, first lip-deep 6 semi-conductor chips of the wiring substrate 2 that constitutes a card body 1A part (3C, 3M, 3F).Six semi-conductor chips (3C, 3M, 3F) in, semi-conductor chip 3C forms interface controller, and semi-conductor chip 3M forms the IC-card microcomputer as safety governor.Four remaining semi-conductor chip 3F form storer.The semi-conductor chip 3F of four composition storeies is engaged with each other at wiring substrate 2 higher slices and by binder.Forming the semi-conductor chip 3C of interface controller and the semi-conductor chip 3M of composition IC-card microcomputer has than the littler area of semi-conductor chip 3F of forming storer, so that they are arranged on the semi-conductor chip 3F of the top side by side, and join the semi-conductor chip 3F of the top to by binder.
Fig. 4 is that expression is by aforementioned three types semi-conductor chip (3C, 3F, 3M) block diagram of the exemplary system of the multifunctional storage card 1 of Zu Chenging.The storer that is formed on the semi-conductor chip 3F comprises it for example being the flash memory of electric erasable and writeable nonvolatile memory.The storage unit of flash memory comprises it for example being that MISFET or have with stacked gate structure of floating gate is provided with ONO (oxide-nitride thing-oxide (oxide-nitride-oxide)) grid insulating film and selects the MISFET of splitting bar structure of the memory transistor part of transistor part.The memory span that is formed on a flash memory on the semi-conductor chip 3F is a 4G bit for example.Therefore, the mass storage that has 4G bit * 4=2G byte (16G bit) according to the multifunctional storage card with four semi-conductor chip 3F 1 of this embodiment.
The interface controller that is formed on the semi-conductor chip 3C has a plurality of interface control modes, and wherein it is by according to from the operation of the control mode control external interface of the instruction of outside with at the operation of the memory interface of storer (semi-conductor chip 3F).The memory card interface mode is consistent with the interface specification of various simple storage card.For example, interface controller is realized the function of memory card controller by the programmed control that is used to support the memory card interface standard.Further, can after interface controller interpolation control program is firmware, support pre-determined memory card interface standard by from network, downloading.Further, can forbid carrying out after the pre-determined program, make pre-determined memory card interface standard unavailable by the License Info that obtains from network.
The aforementioned interface controling appliance is with good grounds to receive or sends to the function of interface control mode of the state recognition memory card interface of outside order or bus from the outside by external connection terminals 5, change the function of highway width according to the memory card interface control mode of identification, carry out the function of Data Format Transform according to the memory card interface control mode of identification, power supply is opened/function of reset, carry out the function that interface is controlled by the IC-card microcomputer that is formed on the semi-conductor chip 3M, by the function that the storer that is formed on the semi-conductor chip 3F carries out interface control, the function of supply voltage conversion etc.
The IC-card microcomputer that is formed on the semi-conductor chip 3M as safety governor is connected to interface controller and the special external splicing ear 5 that is formed on the semi-conductor chip 3C, and wherein the IC-card microcomputer is carried out safe handling according to the signal condition of this external connection terminals 5 or from the operational order that interface controller (semi-conductor chip 3C) provides.This IC-card microcomputer is provided with, for example, and the function that can be used for the electronic accounting service of authorizing by the assessment of ISO/IEC15408/qualification organization.Further, can so that the IC-card microcomputer work with storer by using memory card interface.This allows the connection between for example cellular antenna and the IC-card microcomputer, thereby can realize being similar to the noncontact interface of noncontact type i C card, so cell phone can be as coming and going the pass or debit card.Antenna can form on the surface of wiring substrate 2 or lid 1B.
Fig. 5 represents to be arranged in the function example of the external connection terminals 5 of the back of the body surface of forming the wiring substrate 2 that blocks a body 1A part.Each of 20 external connection terminals 5 (No. 1 to No. 20) comprises dedicated terminals and the shared public terminal of each interface control mode that is respectively applied for each interface control mode.DAT2, DAT0, DAT1, DAT4/D3, DAT5/D2, DAT6/SDIO/D0 and DAT7/D1 are respectively data terminal.Further, CD/DAT3 is a card detection/data terminal, CMD is the order input/output terminal, Vcc is a power supply terminal, Vss is the ground terminal of circuit, CLK/SCLK is a clock input terminal, I/O-ic is the input/output terminal that is exclusively used in the IC-card microcomputer, LA and LB are the exterior antenna connectors, INS is used to detect the terminal that inserts and extract, BS is the bus state terminal, and Vcc-ic is exclusively used in the power supply terminal of IC-card microcomputer and CLK-ic is the clock input terminal that is exclusively used in the IC-card microcomputer.
Said external splicing ear 5 comprises and is similar to the copper (Cu) that is formed on the wiring of wiring in the substrate 2, and nickel plating (Ni) and gold-plated (Au) have been carried out in its surface.As shown in Figure 1, the length of each of two external connection terminals 5 of composition power supply terminal (Vcc) and ground terminal (Vss) is longer than the length of other external connection terminals 5.This is a kind of configuration, wherein when multifunctional storage card 1 is installed in the cellular slot, can make power supply terminal (Vcc) and ground terminal (Vss) can be apace be included in slot in bonder terminal contact, to be provided to semi-conductor chip (3C by other external connection terminals 5 at various signals, 3F 3M) powers before.Prevent semi-conductor chip (3C, 3F, fault 3M) thus.
What explain subsequently is according to the architectural feature of the multifunctional storage card 1 of this embodiment as mentioned above, multifunctional storage card 1 in this embodiment has a kind of structure, comprising semi-conductor chip (3C has been installed above it, 3F, wiring substrate 2 3M) and these semi-conductor chips of encapsulation (3C, 3F, the lid 1B that the card body 1A of casting resin 4 3M) is made by thermoplastic resin covers, and wherein has only the back of the body surface of the card body 1A that has formed external connection terminals 5 thereon to be exposed to the outside.
As mentioned above, for reduce semi-conductor chip (3C, 3F, the difference of thermal expansivity 3M) and between the casting resin 4, (casting resin 4 of material 3M) comprises a large amount of filling materials for 3C, 3F, for example quartzy filling material as packaged semiconductor.In contrast to resin cast article with filling material or the cast article that comprises a small amount of filling material, wherein have the resin cast article that has mixed a large amount of inorganic fillers and have increase with frictional resistance bonder terminal and have high rigidity.Therefore, when the friction of itself and bonder terminal, produce the problem that bonder terminal is caused very big infringement.Consider this point, the multifunctional storage card 1 of this embodiment has a kind of structure, wherein blocking the lid 1B that body 1A makes by hardness ratio casting resin 4 low thermoplastic resins is covered, and do not comprise filling material or have the filling material capacity that is less than casting resin 4, frictional resistance of being made by thermosetting resin thus, have increase and the casting resin 4 with high rigidity can not be exposed to the leading edge of card.This can set up a kind of structure, and wherein when multifunctional storage card 1 was inserted in the cell phone slot, the terminal that is included in the connector in the slot did not contact with casting resin 4.Particularly, the leading edge of the lid 1B that the termination contact of connector is made by soft thermoplastic resin to be being shifted, and then, and contact external connection terminals 5 has no chance to cause caused damage or wearing and tearing when contacting hard casting resin 4 when them thus.Therefore, the connection reliability between bonder terminal and the external connection terminals 5 can keep for a long time.Note, the film of being made by soft thermoplastic resin can be covered on the surface portion of lid 1B of contact-connection assembly for electric terminal and prevent by the damage on the contact multifunctional storage card 1 caused bonder terminal or the countermeasure of wearing and tearing as a kind of.In this case, lid 1B can be formed by the thermosetting resin mold.
What explain subsequently is that a kind of mistake when the multifunctional storage card 1 according to this embodiment is installed in the cellular slot is inserted the mechanism that prevents.
When storage card is installed in the storage card slot of cell phone or digital camera, for example, the user may make mistakes on the direction (front or rear direction, the perhaps direction at the front or the back side) of card, to such an extent as to they can often insert storage card with the direction of mistake.If the storage card that inserts with the opposite way round partly is inserted into slot, then the user can feel to have determined that card inserts with correct direction, to such an extent as to the user further is inserted into storage card the bottom.Thereby the bonder terminal in the slot limpens, and perhaps therefore Ka external connection terminals and bonder terminal that should external connection terminals not being contacted has mistakenly each other stayed the shortcoming of the circuit in deterioration or the defective semiconductor chip.Multifunctional storage card 1 according to this embodiment has the external dimensions littler than conventional storage card, makes aforesaid wrong the insertion be easy to take place.Consider this factor, the multifunctional storage card 1 of this embodiment has the mechanism that can prevent wrong insertion definitely as described below.
As mentioned above, the multifunctional storage card 1 of this embodiment is provided with outshot 1C in the side of lid 1B, so that it is thicker than other parts only to be provided with the part of outshot 1C.Further, because this outshot 1C only is arranged on the quilt surface of covering 1B, the front surface of multifunctional storage card 1 is put down than back of the body surface.
When multifunctional storage card 1 is inserted in the cellular slot, the direction at front or rear direction and front or the back side can by determine with finger lip-deep recessed/outstandingly correctly judge.Further, the height that is included in the opening portion of connector in the slot is done forr a short time than the thickness of the lid 1B that is provided with outshot 1C, can not exist the storage card that inserts with the opposite way round partly to enter into the chance of slot thus, even because the user may make mistakes on the direction of card and they attempt to insert storage card with the opposite way round, outshot 1C can not be inserted into connector.
Be arranged on the outshot 1C that covers 1B and not only be used to prevent aforesaid wrong the insertion, and can be used for multifunctional storage card 1 is extracted from slot.Particularly, multifunctional storage card 1 has very little size in length and width, and has extremely thin thickness, to such an extent as to extract very difficulty of multifunctional storage card 1 apace from slot.But, even in a part of covering 1B the outshot 1C thicker than other parts being set allows when multifunctional storage card 1 is installed in the slot, outshot 1C also is exposed to the outside of connector, can multifunctional storage card 1 be extracted from slot apace by pinching with drawing outshot 1C with finger thus.In this case, the groove 9 that elongation is set on the front surface with respect to the multifunctional storage card 1 of the position of as shown in Figures 2 and 3 outshot 1C has further facilitated extracting from slot.And the section shape of outshot 1C that is positioned at corner part in terminals side is processed, with sphering or inclined-planeization.When the size of the sphering processing section of the outshot 1C that is positioned at corner part or inclined-planeization part do more hour, the operation of extracting of card becomes and is more prone to.For example, more preferably, do the radius-of-curvature of section shape of leading edge of De Bika or the size of inclined-planeization part in the size of the radius-of-curvature of the section shape of the outshot 1C of terminals side corner part or inclined-planeization part and want big.
Although outshot 1C can be formed on the front surface (labelled surface) that covers 1B, if it is formed on back of the body surface (exposing the surface of external connection terminals 5), then multifunctional storage card 1 is easier makes thin size.Outshot 1C is formed under the situation on the front surface that covers 1B therein, for example, the maximum ga(u)ge of multifunctional storage card 1 become the part place that outshot 1C wherein is set lid 1B thickness (1.6mm) and in the thickness sum of the place, back of the body surface of lid 1B exposed exterior splicing ear 5.On the other hand, when outshot 1C is formed on back of the body when surface of covering 1B, the maximum ga(u)ge of multifunctional storage card 1 is only determined by the thickness of the lid 1B at the part place that forms outshot 1C.Particularly, the maximum ga(u)ge of multifunctional storage card 1 equals to form the thickness (1.6mm) of lid 1B at the part place of outshot 1C.
Further, when outshot 1C was formed on the back of the body surface of covering 1B, as shown in Figure 6, the distance that the terminal 11 of connector can translation when multifunctional storage card 1 is inserted in the cellular slot externally produced between splicing ear 5 and the terminal 11.Therefore, can prevent that terminal 11 from worsening, thus can a segment length guarantee on the time external connection terminals 5 and terminal 11 between the reliability that connects.On the other hand, suppose that outshot 1C is formed on the front surface place of covering 1B.Under the design size condition of limited, guarantee terminal 11 when multifunctional storage card 1 is inserted in the cellular slot externally between splicing ear 5 and the terminal 11 distance of translation be unusual difficulty.Therefore, must increase the height of connector 10 as shown in Figure 7, forming this space, thereby make connector 11 sizes become big.Even when the multifunctional storage card 1 of this embodiment is connected to conversion adapter in the connector that need be inserted into the storage card slot that is designed for other standard, for the same reason, the size of conversion adapter can be done very for a short time by the back of the body surface formation outshot 1C at lid 1B.
As Fig. 8 and shown in Figure 2, the surface, two limits of the lid 1B of classification guide channel 12 in the multifunctional storage card 1 of present embodiment (on the surface, two limits of long side) gone up and formed.Each guide channel 12 forms along the surface, limit of the front surface of lid 1B, and has width and the height that is respectively 0.55mm.The guide channel 12 feasible width width narrow 0.55mm * 2=1.1mms more surperficial than the back of the body that cover the front surface of 1B are set on the surface, two limits of the front surface that covers 1B.Guide channel 12 is set to be inserted when it is inserted in the cellular slot upside down to prevent multifunctional storage card 1.
As shown in Figure 9, the top plate 13 of the connector 10 that inserted of multifunctional storage card 1 is provided with and has width big and than the width on the back of the body surface of the covering 1B little otch 14 of width than the front surface that covers 1B.Otch 14 is arranged on the top plate 13 of connector 10, thus, even the user attempts multifunctional storage card 1 card is inserted in the connector 10 upside down, the back of the body surface with lid 1B of broad width can not enter into otch 14, thereby can prevent wrong the insertion definitely.
Further, when multifunctional storage card 1 is inserted into top plate 13 when being provided with in the connector 10 of above mentioned otch 14, the top surface of multifunctional storage card 1 in height equals top plate 13.On the other hand, when multifunctional storage card 1 is inserted into another its top plate when not being provided with in the connector of otch, multifunctional storage card 1 can not be inserted into this connector, unless make the thickness of multifunctional storage card 1 littler, suppose that the height of this connector equals connector 10 than the thickness of top plate 13.Particularly,, can make the thickness that covers 1B bigger, thereby make the thickness that is contained in the card body 1A that covers among the 1B can be bigger than the thickness of top plate 13 than the thickness of top plate 13 when multifunctional storage card 1 is inserted into its top plate 13 when being provided with in the connector of otch 14.This makes that increasing the lamination quantity that is installed in the semi-conductor chip in the wiring substrate 2 becomes possibility, can promote the high capacity and the multifunction of multifunctional storage card 1 thus.When the thickness of top plate 13 is set as 0.15mm to 0.2mm, for example, can guarantee wherein can layering have the space of about 70 μ m to the thick semi-conductor chip of 80 μ m.
The lip-deep guide channel 12 in two limits at lid 1B can be formed on the back of the body surface of covering 1B.But, on front surface, form guide channel 12 substrate 2 that helps guaranteeing connecting up and can be accommodated in wherein scope, and therefore, help obtaining the high capacity of multifunctional storage card 1 and multi-functional.Particularly, when guide channel 12 was formed on the front surface that covers 1B, the width that is accommodated in the lip-deep card body of the back of the body that covers 1B 1A was not subjected to the restriction of guide channel as shown in figure 10.On the other hand, as shown in figure 11 when guide channel 12 is formed on the back of the body surface of covering 1B, the width that is accommodated in the lip-deep card body of the back of the body that covers 1B 1A is restricted, to such an extent as to the wiring substrate area or be installed in the wiring suprabasil semi-conductor chip area be restricted.
Shown in Figure 12 and 13, the multifunctional storage card 1 of this embodiment all has corner part on the both sides of a side, that is to say, the leading edge in the time of in being inserted into cellular slot is processed into rounded form.This sphering is handled the lip-deep corner part of the back of the body office that not only is set in place in lid 1B, also is set in place the corner part office on the front surface of guide channel 12 formed lid 1B.For example, be positioned at the radius-of-curvature (R on the back of the body surface of covering 1B
1) be 1.5mm, and be positioned at the radius-of-curvature (R of front surface with formation guide channel 12 thereon
2) be 1.0mm.
On the other hand, its radius-of-curvature is bigger as mentioned above sphering is handled the corner part office that is not arranged on when multifunctional storage card 1 is inserted in the slot as on the both sides of a side of trailing edge.Therefore, have very big shape difference between the leading edge of lid 1B and the trailing edge, the position of leading edge can easily identify at a glance when multifunctional storage card 1 is inserted in the slot thus.Further, the corner part with rounded form of larger radius of curvature provides easy rotation when it contacts with the inwall of connector.Therefore, even insert angle, can also obtain level and smooth insertion to skew on one side.In order to obtain aforesaid effect definitely, need be with radius-of-curvature (R
1, R
2) be arranged to that the width (W=0.55mm) than guide channel 12 is big at least.
As shown in figure 14, the inclined-plane processing is provided at when multifunctional storage card 1 is inserted in the cellular slot side place as the lid 1B of leading edge, and the section shape of this leading edge is formed taper thus.Be offset in vertical direction even insert angle when multifunctional storage card 1 is inserted in the slot, this also allows level and smooth insertion.
Although the processing of above mentioned inclined-plane can be provided in a side place of the front surface that covers 1B or a side place on back of the body surface, can obtain good effect by on two surfaces, the inclined-plane processing being set all.Further, along with inclined-plane size (C
1) become bigger, can obtain better effect.Therefore, for example, need be with inclined-plane size (C
1) be arranged to than be formed on the trailing edge that covers 1B the inclined-plane size (C of outshot 1C
2) want big.As shown in figure 15, sphering can be set on leading edge handles rather than the inclined-plane processing.Equally in this case, when radius-of-curvature is provided with greatly, insertion is become be easy to.
Disclosed as Figure 14 or Figure 15, the insertion operation of extracting operation and card of card can be by card the section shape of leading edge obtain facility, the section shape of this leading edge has than bigger inclined-plane of the section shape of the corner part of the terminals side that is positioned at outshot 1C or bigger radius-of-curvature.
As Figure 16 and shown in Figure 17, the surface, two limits (being positioned at the surface, two limits of long side) of the multifunctional storage card 1 lid 1B among this embodiment is provided with recess groove 15.Each recess groove 15 is that the one end finishes in the surface of guide channel 12 from the front surface of lid 1B half elliptic or the rectangular channel that the surface extends of supporting or opposing.The recess groove can only form on a side of lid.
As mentioned above, external connection terminals 5 is arranged in two row on the back of the body surface of multifunctional storage card 1.Therefore, when the terminal 11 of the connector 10 that should be connected to the external connection terminals 5 that is arranged in back delegation when the process of multifunctional storage card 1 being inserted or extracting connector 10 contacts with the external connection terminals 5 that is positioned at front delegation mistakenly, inappropriate signal can be input to semi-conductor chip (3C, 3F, circuit 3M), thus mistake produced.Under opposite extreme situations, circuit may damage.
Multifunctional storage card 1 according to this embodiment comprises the lid 1B that its surface is formed from a resin, to such an extent as to be easy to produce static.Therefore, when multifunctional storage card 1 is inserted into connector 10, can worry to cover static on the 1B can enter into by the terminal 11 of connector 10 semi-conductor chip (3C, 3F, 3M) in.Consider this factor, forming the length of two external connection terminals 5 of power supply terminal (Vcc) and ground terminal (Vss) can do longlyer than the length of other external connection terminals 5 as mentioned above, so that as quickly as possible to semi-conductor chip (3C, 3F, 3M) power supply, (3M) charge transfer in is to power supply terminal (Vcc) or ground terminal (Vss) for 3C, 3F will to flow into semi-conductor chip by other external connection terminals 5 thus.But; if owing to contact with the mistake of the terminal 11 that does not correspond to this external connection terminals 5, static is to semi-conductor chip (3C, 3F; 3M) enter into semi-conductor chip (3C before powering; 3F, 3M), then at each semi-conductor chip (3C; 3F; 3M) going up the esd protection element that is provided with can not fully work, to such an extent as to it can not eliminate the ESD electric charge, thereby damages circuit.Further, if when under the situation that cell phone power is opened, extracting multifunctional storage card 1, take place to contact with the mistake of the terminal 11 that does not correspond to external connection terminals 5, then inappropriate signal can be provided to semi-conductor chip (3C, 3F, 3M) in, thereby cause fault such as write error.
At the recess groove 15 that all is provided with on the surface, two limits of lid 1B is to be used to prevent contact with the mistake of the terminal 11 that does not correspond to this external connection terminals 5 when multifunctional storage card 1 inserts or extracts cellular slot.
As shown in figure 18, between a plurality of terminals 11 that in the connector 10 that multifunctional storage card 1 is inserted, form, cam 16 controls of the terminal 11 that should be connected to the external connection terminals 5 that is positioned at a next row by being installed to the one end parts with or do not contact with external connection terminals 5.Shown in Figure 18 (a), when multifunctional storage card 1 is inserted in the connector 10, the tip of cam 16 contacts with the guide channel 12 of the lid 1B that will push downwards, and because this downward motion, this terminal 11 that should be connected to the external connection terminals 5 that is positioned at a next row is pushed downwards.Cam 16 is pushed upwardly by the unshowned spring that is arranged on its part, but its limit movement that makes progress is during contacting with guide channel 12 when its tip.Therefore, when the external connection terminals 5 that is positioned at front one row from the top of these terminals 11 through out-of-date, make the tip of cam 16 contact with guide channel 12, the external connection terminals that is positioned at front one row from the top process of these terminals 11 can not contact with terminal 11 thus, because they are pushed downwards.Then, shown in Figure 18 (b), when the leading edge of multifunctional storage card 1 is inserted in the connector 10 fully, the external connection terminals 5 that is positioned at front one row reach should connected connector 10 the position, and the external connection terminals 5 that is positioned at a next row reaches the position on should connected terminal 11.In this case, be formed on the position that the lip-deep recess groove 15 in the limit of covering 1B reaches the tip of cam 16, the tip of cam 16 does not contact with guide channel 12 thus.By this, its cam 16 that is limited by guide channel 12 that moves upward is upwards improved by spring pressure, and the feasible thus terminal 11 that upwards improves with the motion of cam 16 contacts with the external connection terminals 5 that is positioned at a next row.
On the other hand, when the multifunctional storage card 1 that is inserted into connector 10 is pulled out, the tip that is inserted into the cam 16 among the recess groove 15 is at first by being pushed downwards with contacting of guide channel 12, and along with this motion, pushed downwards with the terminal 11 that the external connection terminals 5 that is positioned at a next row contacts, make not contact with external connection terminals 5.Therefore, be similar to the situation of insertion, can prevent from definitely to contact with the mistake of the terminal 11 that does not correspond to this external connection terminals 5.
Notice that aforesaid recess groove 15 can form only being positioned on the surface, an only limit at a place, carry out high-precision control but the motion of cam 16 can be provided with recess groove 15 by the surface, two limits at lid 1B.
Therefore, have relative simple manufacturing process and large-duty advantage as the above-mentioned multifunctional storage card of constructing 1.Particularly, card body 1A can produce in a large number by simple process, wherein semi-conductor chip (3C, 3F 3M) is installed in the above-mentioned big wiring substrate carrying out wire-bonded, and at semi-conductor chip (3C, 3F, 3M) by after casting resin 4 encapsulation, the big wiring of cutting substrate.Therefore, throughput rate is very high.Further, above-mentioned outshot 1C, guide channel 12, recess groove 15 or sphering are handled or the inclined-plane processing can be carried out mold and realizes simply by the lid 1B that is made by thermoplastic resin.It is very simple to be used for that card body 1A is received into the operation of covering 1B, because both only engage.
On the other hand, if the card body 1A that obtains from big wiring substrate is carried out extra processing to form outshot 1C, guide channel 12 or recess groove 15 or card body 1A to be carried out sphering handle and the inclined-plane processing, it is complicated more that manufacturing process can become, thereby reduce throughput rate.On the other hand, form outshot 1C, guide channel 12 or recess groove 15 therein, perhaps by use be used for the mould that the casting film resin-encapsulated is installed in the suprabasil semi-conductor chip of wiring carry out that sphering is handled or the situation of inclined-plane processing under, production department comprehends and becomes very simple.But the hard casting resin of being made by thermoplastic resin is to outer exposed, thus can not avoid the connector service life shortening or and connector between the problem of deterioration of connection reliability.
Figure 19 and Figure 20 are the planimetric map of expression according to the outward appearance of the multifunctional storage card of this embodiment, and wherein Figure 19 represents wherein the formed surface of external connection terminals (back of the body surface), and Figure 20 represents its opposite face (front surface).
In multifunctional storage card 1 according to this embodiment, be formed on recess groove 15 on two side surfaces that cover 1B be arranged in the external connection terminals 5 that is positioned at a next row near.Particularly, be that two recess grooves 15 are determined positions so that compare to the trailing edge translation with embodiment 1, and further, they are arranged so that be equidistant to the trailing edge that covers 1B.
As mentioned above, recess groove 15 being set is used for preventing to contact with the mistake of the terminal 11 that does not correspond to this external connection terminals 5 when multifunctional storage card 1 inserts or extracts cellular slot.Prevent to contact the fault that can prevent, can also prevent the short circuit or the damage of the driving circuit of input/output interface such as write error with the mistake of terminal.
When recess groove 15 is arranged near the trailing edges of lid 1B, control with or the brachium of the cam 16 that do not contact with the terminal 11 that is provided with in the connector 10 that multifunctional storage card 1 is inserted can to do than among the embodiment 1 (seeing Figure 18) as shown in figure 21 shorter.This has realized the cam mechanism of compact design in connector 10, thereby can miniaturization connector 10.Further, the back of the body of multifunctional storage card 1 surface is difficult to respect to the surface tilt with the terminal that forms connector 10 thereon, is equidistant because two recess grooves 15 are arranged in the trailing edge that covers 1B.Therefore, being positioned at a next row's the external connection terminals 5 and the terminal 11 of connector 10 can contact each other uniformly.More preferably, recess groove 15 is arranged in respect to the external connection terminals 5 that is positioned at front one row and compares the more close position that is positioned at a next row's external connection terminals 5 near trailing edge and with the external connection terminals 5 that is positioned at front one row.
Further, the multifunctional storage card 1 according to this embodiment is provided with the anti-slip tank 17 that has and be positioned at lip-deep recess groove 15 shapes about the same in a limit of covering 1B.This anti-slip tank 17 is arranged in respect to recess groove 15 and is close to the leading edge place of covering 1B.
Figure 22 is that each represents that all a kind of wherein multifunctional storage card 1 is inserted into the planimetric map of the state in the connector 10 to Figure 24.Note the top plate 13 of not shown connector 10 in Figure 22 and Figure 23.
Further, the surface of nearly all guide channel 12 is all covered by top plate 13.Because guide channel 12 is near the formation of trailing edge from leading edge to lid 1B continuously, so when multifunctional storage card 1 was installed in the connector 10, two of multifunctional storage card 1 surfaces, limit were almost completely covered by top plate as shown in figure 24.Therefore, even when the top surface for the back of the body surface of covering 1B and top plate 13 have equal height and make recess groove 15 and anti-slip tank 17 when formation and otch 14 form on top plate 13 on the guide channel 12, the area that is used for multifunctional storage card 1 is easy to determine that by top plate 13 multifunctional storage card 1 can be installed to connector 10 definitely thus.More preferably, comparing guide channel 12 with the external connection terminals 5 that is positioned at a next row extends longlyer to trailing edge.Because compare guide channel 12 and extend longlyer to trailing edge with the external connection terminals 5 that is positioned at a next row, thus the position that the top plate 13 of guide channel 12 has been fixed the external connection terminals 5 that is positioned at a next row covered, thus can fix and being connected of connector 10.
What explain subsequently is the method that is used for card body 1A is connected to the lid 1B of multifunctional storage card 1.
First method is, as shown in figure 25, in advance binder 20 is applied on the back of the body surface of covering 1B, and will blocks body 1A as shown in figure 26 and be inserted into and cover 1B.In this case, binder 20 can be applied on the card body 1A.But, will block body 1A be installed to cover among the 1B after, this method requires the measure of a kind of fixedly card body 1A, this measure uses any method to come off the 1B from lid to prevent card body 1A, till binder 20 sclerosis.Therefore, these a lot of times of method consumption are attached to and cover 1B will block body 1A.
Consider this factor, as shown in figure 27,, wherein will block body 1A as shown in figure 28 and be pushed in the groove that covers 1B by the elastic deformation of using projection 21 in advance around the flute profile resin projection 21 of the lid 1B that makes by thermoplastic resin.This allows card body 1A fix by projection 21, and does not need to be used for to prevent that card body 1A is from come off measure till binder 20 hardens of lid 1B.Projection 21 can be resin mould form an integral body with lid 1B.
Further, as Figure 29 and shown in Figure 30, for example, can adopt the ca(u)lk method, wherein card body 1A be inserted into by conventional method cover among the 1B after, by use have the anchor clamps 22 of ultrasound wave generation mechanism softening and be out of shape the groove that covers 1B around, be inserted into and cover among the 1B thereby will block body 1A.It is noted that and to adopt Figure 27 under the situation of method shown in Figure 30, to omit the process that is used to apply binder 20.
Figure 31 is the planimetric map according to the multifunctional storage card of this embodiment, wherein in order to provide interchangeability to dissimilar storage card with various criterion, changed the arrangement of external connection terminals 5, and Figure 32 and Figure 33 are the planimetric maps of the adapter that inserts of this multifunctional storage card, and wherein Figure 32 represents that front surface side and Figure 33 represent to carry on the back face side (forming the surface of external connection terminals thereon).
Figure 32 and the adapter 30 shown in Figure 33 have the external dimensions identical with those storage cards that is called as " memory stick Duo " by Sony production (after this simply being called memory stick) and external connection terminals 31 so that the interchangeability with this memory stick to be provided.Memory stick has 10 external connection terminals, makes adapter 30 also have 10 external connection terminals 31 (#1 is to #10).In as the multifunctional storage card 1 that is inserted in this adapter 30 according to this embodiment, when being inserted into adapter 30, have only 10 external connection terminals 5 (#1 is to #10) that are in leading edge to be used, and 10 external connection terminals 5 that are in trailing edge are not used.10 external connection terminals 5 that are in trailing edge can be used as the extended terminal of memory stick, perhaps as the terminal that is used for function except that memory stick.
Connector 33 has the structure that is similar to the connector 10 among embodiment 1 and the embodiment 2, except the quantity of terminal 35 is 10.Surface that has label and equating that the front surface of adapter 30 in height becomes for multifunctional storage card 1 have dwindled its size.
When multifunctional storage card 1 is inserted into adapter 30, direction to multifunctional storage card 1 determines, so that 10 external connection terminals 5 of multifunctional storage card 1 do not pass as shown in figure 34 10 external connection terminals 5 and are positioned at the wiring 36 that 10 external connection terminals 31 at adapter 30 places couple together accordingly.
Locate because be used for the long side (side that is parallel to direction of insertion) that the opening portion of connector 33 is arranged in its adapter 30, do not have the chance that when multifunctional storage card 1 is inserted in the card slot, from cellular card slot, exposes multifunctional storage card 1.Therefore, there is not the chance that multifunctional storage card 1 is extracted mistakenly or multifunctional storage card 1 comes off from adapter 30 from adapter 30.
When the opening portion that is used for connector 33 as shown in figure 35 is arranged in the short side place of the trailing edge that is positioned at adapter 30, even when adapter 30 is inserted in the cellular card slot, the possibility that also exists multifunctional storage card 1 from adapter 30, to pull out.In this case, in order to overcome the shortcoming that multifunctional storage card 1 comes off from adapter 30, can be provided at the antiskid claw of explaining among the embodiment 2 18 at connector 33 places of adapter 30.
In order to prevent the situation of power supply sudden power in using cellular process; (Vcc can comprise IC circuit (protection chip 37) that is used to detect power-off and the capacitor that is used to provide Emergency Power between Vss) at the terminal of multifunctional storage card 1 and the power supply terminal of adapter 30 as shown in figure 36.According to this; when cellular battery is removed or adapter 30 when being extracted from cellular card slot mistakenly; to report the signal of power-off or be used for starting the order of forcing termination offers multifunctional storage card 1 from protection chip 37 semi-conductor chip; and can provide Emergency Power (Vcc by protection chip 37; Vss), thus can prevent the fault of semi-conductor chip.
The invention that the inventor realized has been carried out particularly explaining based on embodiment in the above, but the invention is not restricted to the embodiments described, and does not break away under the situation of essence of an invention and scope and certainly carry out various modifications.
Although the foregoing description has been described the multifunctional storage card with memory card function and IC-card function, this card is not limited to have the card of these functions.For example, the present invention can be applied to having the card of various functions, for example only has the card of memory card function, and the card that only has the IC-card function comprises card with the semi-conductor chip that is different from memory card function or IC-card function etc.According to the function of card, the various modifications that are installed in kind, quantity and the combination of the suprabasil semi-conductor chip of wiring are possible.For example, for the card that only has memory card function, its system can have the memory chip that forms electric erasable and writeable nonvolatile memory thereon and be used to control the memory interface interface operable controller chip that memory chip is carried out by one or more and be configured.Further, externally the quantity of splicing ear 5 also can be carried out various modifications.For example, when the requirement of external connection terminals 5 seldom the time, all external connection terminals 5 can form with a row.
Can realize different functions by kind or the combination that change is installed in the suprabasil semi-conductor chip of wiring of card body according to storage card of the present invention, it not only can be applied to multifunctional storage card widely thus, can also be applied to other multifunction card, communication card, I/O card etc.
Claims (23)
1. storage card comprises:
Sheet card body wherein is installed in and has its top and form the semi-conductor chip of wiring substrate first type surface top on back of the body surface of a plurality of external connection terminals with resin-encapsulated; And
The sheet cover has formed above one surface, as to be used to hold described card body groove,
Wherein said card body is contained in the described groove of described cover, so that expose the first type surface of described wiring substrate, and
The outstanding outshot in a wherein said surface is formed on when plug-in card the side as the described cover of trailing edge.
2. according to the storage card of claim 1,
Wherein said semi-conductor chip comprises having first semi-conductor chip that forms electric erasable and writeable nonvolatile memory therein and have second semi-conductor chip that is formed for therein controlling for the memory interface interface operable controller of described nonvolatile memory, and
Wherein described second semi-conductor chip and described first semi-conductor chip are carried out lamination with on the first type surface that is installed in described wiring substrate.
3. according to the storage card of claim 2, wherein said semi-conductor chip further comprises the 3rd semi-conductor chip, and the 3rd semi-conductor chip has the IC-card microcomputer that the conduct that forms therein is used for carrying out according to the operational order that provides from described interface controller the safety governor of safe handling.
4. according to the storage card of claim 1, wherein said cover is formed by resin, and this resin is littler than the frictional resistance of resin that encapsulates described semi-conductor chip and bonder terminal with the frictional resistance of bonder terminal.
5. according to the storage card of claim 4, wherein said cover is formed by thermoplastic resin, and the resin that encapsulates described a plurality of semi-conductor chips is formed by thermosetting resin.
6. according to the storage card of claim 1, the described a plurality of external connection terminals that wherein are formed on described wiring substrate top comprise the first terminal group of arranging along perpendicular to card insertion direction, and along arrange and be arranged in described the first terminal group perpendicular to card insertion direction before or be arranged in second terminal group after the described the first terminal group.
7. according to the storage card of claim 1,
The leading edge of the described cover of the leading edge in the time of wherein will be as plug-in card forms has sphering section shape or inclined-plane section shape,
The corner part that wherein will be formed on the described outshot of a surface of described cover forms has sphering section shape or inclined-plane section shape, and
Wherein than the corner part of described outshot, the described leading edge of described cover is processed into bigger sphering section shape or inclined-plane section shape.
8. according to the storage card of claim 7,
Also comprise the classification guide channel, the limit part that it is formed on described cover makes that the width on a surface is different with another surperficial width, and
It is bigger than another surperficial width that the described classification guide channel that wherein is formed on the limit part of described cover is formed the width that makes a surface.
9. according to the storage card of claim 1, the radius-of-curvature that wherein is positioned at described cover two corner part offices on one side is bigger than the radius-of-curvature as two corner part offices of the another side of described trailing edge when card inserts.
10. storage card according to Claim 8, the radius-of-curvature that wherein is positioned at described cover two corner part offices on one side is bigger than the width of the described classification guide channel of two limit parts that are formed on described cover.
11. according to the storage card of claim 10,
Wherein the classification guide channel is formed on the part place, two limits of described cover, so that the width on a surface is different with another surperficial width, and
Two corner parts that provide sphering to handle are provided an end of each classification guide channel that wherein is formed on the part place, two limits of described cover, and the radius-of-curvature of an end of each classification guide channel is bigger than the width of the described classification guide channel that is positioned at part place, two limits.
12. according to the storage card of claim 10, one side wherein along providing the inclined-plane processing as the described cover of described leading edge when the plug-in card.
13., wherein on two surfaces of described cover, provide the processing of described inclined-plane according to the storage card of claim 12.
14. according to the storage card of claim 12,
Wherein the described outshot at described cover provides the inclined-plane processing, and inclined-plane length is bigger than the inclined-plane length of the inclined-plane processing that provides in described teat office in the inclined-plane processing that described cover provides on one side.
15. storage card according to Claim 8, wherein the recess groove is formed on the part of described classification guide channel of two limit parts of described cover.
16. according to the storage card of claim 1, one side wherein handle along the sphering that provides when the plug-in card as the described cover of described leading edge.
17. according to the storage card of claim 15,
The described a plurality of external connection terminals that wherein are formed on described wiring substrate top comprise along the first terminal group of arranging perpendicular to card insertion direction with along arranging and be arranged in before the described the first terminal group perpendicular to card insertion direction or afterwards second terminal group, and
Distance between wherein said recess groove and described second terminal group is littler than the distance between described recess groove and the described the first terminal group.
18. according to the storage card of claim 17, wherein provide described recess groove, and described recess groove is to being arranged in the equidistant position of described trailing edge with described cover so that on one of them of two limit parts of described cover, form a recess groove.
19. storage card according to Claim 8 wherein is provided with anti-slip tank, to prevent from the connector landing on a part that is formed on the described classification guide channel on two limit parts of described cover.
20. according to the storage card of claim 1, wherein said card body is contained in the described groove of described cover by the ca(u)lk method.
21. according to the storage card of claim 1, further comprise adapter, this adapter comprises connector that described storage card is installed on it and the external connection terminals that is electrically connected with the external connection terminals of described card body.
22. according to the storage card of claim 21, the opening portion of wherein said connector is arranged in a side of described adapter on the direction vertical with described adapter direction of insertion.
23. according to the storage card of claim 21, wherein said adapter has built-in power supply unit with the described semi-conductor chip power supply in the described storage card that is installed to described connector.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP129602/2004 | 2004-04-26 | ||
| JP2004129602 | 2004-04-26 | ||
| JP2004257244A JP4651332B2 (en) | 2004-04-26 | 2004-09-03 | Memory card |
| JP257244/2004 | 2004-09-03 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101514548A Division CN101620687B (en) | 2004-04-26 | 2005-04-25 | Memory card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1744110A CN1744110A (en) | 2006-03-08 |
| CN1744110B true CN1744110B (en) | 2010-04-28 |
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ID=36139471
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510066246 Expired - Fee Related CN1744110B (en) | 2004-04-26 | 2005-04-25 | Memory card |
| CN2009101514548A Expired - Fee Related CN101620687B (en) | 2004-04-26 | 2005-04-25 | Memory card |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101514548A Expired - Fee Related CN101620687B (en) | 2004-04-26 | 2005-04-25 | Memory card |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN1744110B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4843447B2 (en) | 2006-03-31 | 2011-12-21 | 株式会社東芝 | Semiconductor device and memory card using the same |
| JP5207868B2 (en) * | 2008-02-08 | 2013-06-12 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
| JP2011118905A (en) | 2009-12-07 | 2011-06-16 | Samsung Electronics Co Ltd | Memory card and electronic equipment |
| CN104794523B (en) * | 2009-12-07 | 2018-10-12 | 三星电子株式会社 | Storage card and electronic device |
| JP6253607B2 (en) * | 2015-03-16 | 2017-12-27 | 東芝メモリ株式会社 | Manufacturing method of semiconductor memory card |
| KR102566995B1 (en) * | 2016-06-02 | 2023-08-14 | 삼성전자주식회사 | Memory card adaptor |
| CN110324263B (en) | 2018-03-30 | 2021-06-29 | 华为技术有限公司 | Method, equipment and system for transmitting multicast message |
| CN209297344U (en) * | 2018-12-06 | 2019-08-23 | 深圳市江波龙电子股份有限公司 | A kind of storage card |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1374573A (en) * | 2001-03-13 | 2002-10-16 | 宏碁股份有限公司 | Memory card socket |
| CN2603540Y (en) * | 2003-03-13 | 2004-02-11 | 钜航科技股份有限公司 | Memory card connector |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004118511A (en) * | 2002-09-26 | 2004-04-15 | Renesas Technology Corp | Memory card and its manufacturing method |
-
2005
- 2005-04-25 CN CN 200510066246 patent/CN1744110B/en not_active Expired - Fee Related
- 2005-04-25 CN CN2009101514548A patent/CN101620687B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1374573A (en) * | 2001-03-13 | 2002-10-16 | 宏碁股份有限公司 | Memory card socket |
| CN2603540Y (en) * | 2003-03-13 | 2004-02-11 | 钜航科技股份有限公司 | Memory card connector |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2004-118511A 2004.04.15 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1744110A (en) | 2006-03-08 |
| CN101620687A (en) | 2010-01-06 |
| CN101620687B (en) | 2011-07-13 |
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