CN1721633A - Half-formed heat-insulating board and assembling technique thereof - Google Patents

Half-formed heat-insulating board and assembling technique thereof Download PDF

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Publication number
CN1721633A
CN1721633A CN 200510013508 CN200510013508A CN1721633A CN 1721633 A CN1721633 A CN 1721633A CN 200510013508 CN200510013508 CN 200510013508 CN 200510013508 A CN200510013508 A CN 200510013508A CN 1721633 A CN1721633 A CN 1721633A
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China
Prior art keywords
heat
grid cloth
plane
insulating board
metal base
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Pending
Application number
CN 200510013508
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Chinese (zh)
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潘凤岐
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潘凤岐
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Priority to CN 200510013508 priority Critical patent/CN1721633A/en
Publication of CN1721633A publication Critical patent/CN1721633A/en
Pending legal-status Critical Current

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Abstract

This invention provides one semi-shaped constant plate and its assembling process, which comprises the following structures: non-metal base board with certain thickness; adhesive glue plasm; net cloth with the metal plate bottom of plane, wherein, the upper surface is composed of plane and edges inclined surface with orderly set with adhesive glue and net cloth stricken on the non metal base board planes and two near incline with the rest two incline net unconnected. The assemble process comprises two steps of sticking and coating.

Description

Half-formed heat-insulating board and packaging technology thereof
Technical field
What the present invention relates to is the moulding insulating product and the packaging technology thereof of architectural usefulness, particularly be half-formed heat-insulating board and packaging technology thereof.
Background technology
Exterior-wall heat insulation is the architectural novel energy-conserving measure of China, insulation layer is set on vertical exterior wall realizes energy-conservation attention and the approval that has obtained market.Insulation layer commonly used on the skin is made up of bonding grid cloth and adhesive mortar on polyphenyl plate, concrete structure and construction technology are: smear bonding agent in the polyphenyl plate bottom surface with certain specification size, the bottom surface attaching that scribbles bonding agent is cemented on the vertical exterior wall; In the front of polyphenyl plate, promptly lateral surface is scraped the daub slurry; Press to embed grid cloth, the grid cloth that covers on the adjacent polyphenyl plate requires to overlap mutually between the edge and gains in strength with this; After treating the rubber cement drying, on grid cloth, smear special-purpose rubber cement again one time, when smearing special-purpose rubber cement, grid cloth lap-joint rib is obstructed projection and other parts levelling; Batch scrape facing putty, brushing exterior wall special coating smearing on the face of special-purpose rubber cement.
The defective of above-mentioned prior art is: complex process, the construction period is long.As, smearing adhesive mortar on the polyphenyl plate face needs three days dry periods, moisture is fully volatilized after grid coverage cloth again; Puttying again after smearing adhesive mortar on the grid cloth need stop 48 hours equally.If not according to the requirement of above-mentioned duration, can make that large quantity of moisture can not fully volatilize seepage in body of wall in the adhesive mortar, easily cause the exterior wall after the application to burst apart.
In addition, prior art insulation layer manufacture craft waste of material is big.On straight wall, make insulation layer and construct that not only difficulty is big, also as easy as rolling off a logly fall to expect waste material; The difficulty that site operation exists also influences the quality of insulation layer.
Summary of the invention
The objective of the invention is to overcome the deficiency of above-mentioned technology, a kind of semiproduct of making in advance are provided, construction technology is simple, the construction period is short, the half-formed heat-insulating board and the packaging technology thereof of saving material quick-assembling.
The technical scheme that solves the problems of the technologies described above is:
A kind of half-formed heat-insulating board, its structure comprises: have non-metal base plate, bonding rubber cement, the grid cloth of setting thickness; Wherein the bottom surface of non-metal base plate is the plane, is made up of plane and the inclined-plane that is enclosed in horizontal edge above it, is disposed with bonding rubber cement and grid cloth in the above; Grid cloth sticks on the plane of non-metal base plate and the top on two adjacent inclined-planes, and the grid cloth of all the other tops, two inclined-planes is not adhering state.
The width of the grid cloth of described not adhering state is less than or equal to the closing of width (1d+1b) on inclined-plane and another inclined-plane of being adjacent for the width greater than its inclined-plane, below.
Described non-metal base plate is pasted with the width on two adjacent inclined-planes of grid cloth greater than the width on two inclined-planes that are not pasted with grid cloth.
Described non-metal base plate is one of them a substrate of flame-retardant polystyrene cystosepiment, extruded polystyrene warming plate or other nonmetals.
Described grid cloth is a fiberglass gridding cloth.
A kind of packaging technology to above-mentioned half-formed heat-insulating board, carry out according to the following steps:
(1). paste: on the bottom surface of half-formed heat-insulating board, smear bonding agent, it is sticked on the vertical exterior wall, paste half-formed heat-insulating board according to following order: another piece half-formed heat-insulating board of two slope abuts that half-formed heat-insulating board is not pasted grid cloth is pasted with two inclined-planes of grid cloth, and the inclined-plane of grid cloth below it of not pasting extended overlap joint to the inclined-plane that another piece half-formed heat-insulating board is pasted with grid cloth;
(2). smear seam: the depression that adjacent two half-formed heat-insulating board grid cloth lap-joints form is smeared seam with bonding rubber cement, smear height and whole half-formed heat-insulating board levelling behind the seam.
The invention has the beneficial effects as follows:
1. the present invention makes semiproduct in advance with warming plate, and operation at the construction field (site) has only two procedures, that is, paste and smear seam.The so-called operation of pasting is: only be bonded on the exterior wall at non-metal base plate baseplane daub, one pastes promptly; What is called is smeared tailor's preface: to every half-formed heat-insulating board not the grid cloth of adhering state reach that to connect the recess that is attached on the non-metal base plate inclined-plane that is adjacent floating with glue, there is not the rib stalk behind the grid cloth overlap joint daub, promptly smear the seam levelling, seam crossing need not to apply again other slurry again.
2. the present invention can guarantee the accuracy of grid cloth overlap joint and the planeness of basal plane at the prefabricated product of factory floor.
3. the present invention is the processing that is prefabricated in the factory, and has avoided that prior art is on-the-spot pastes the waste that grid cloth can cause the rubber cement to criticize to scrape the material that trickling causes.
4. quality is good, not influenced by weather, environment etc.
5. technology is simple, and is easy to operate, and cost is low, simplifies twice by original 4-5 procedure, and the quick construction duration is short, can reduce material and cost, and steady quality can be controlled, and it is secure to reach standard-required.
6. the duration is lacked the efficient height.Finished needs 96 hours with the process system that technology is arranged, the present invention only needed to finish in 32 hours, improved the work efficiency half as much again than prior art.
Description of drawings
Fig. 1 is a front view of the present invention;
Fig. 2 is the A-A sectional view of Fig. 1;
Fig. 3 is the front view of non-metal base plate among Fig. 1;
Fig. 4 is the upward view of Fig. 2;
Fig. 5 is adjacent two scheme of installations of the present invention.
The specific embodiment
Below in conjunction with accompanying drawing embodiments of the invention are described in further detail.
Fig. 1 is a front view of the present invention; Fig. 2 is the A-A sectional view of Fig. 1; Fig. 3 is the front view of non-metal base plate among Fig. 1; Fig. 4 is the upward view of Fig. 2; Fig. 5 is adjacent two scheme of installations of the present invention.
As shown, the present invention is a kind of half-formed heat-insulating board, and its structure comprises: have non-metal base plate 1, bonding rubber cement 2, the grid cloth 3 of setting thickness; Wherein the bottom surface 1c of non-metal base plate 1 is the plane, is made up of plane 1a and the inclined-plane 1b, the 1d that are enclosed in 1a edge, plane above it, is disposed with bonding rubber cement 2 and grid cloth 3 in the above; Grid cloth 3 sticks on the top of plane 1a and two adjacent inclined-plane 1b of non-metal base plate 1, and the grid cloth 3 of all the other two inclined-plane 1d tops is not adhering state.
The bottom surface 1c of above-mentioned non-metal base plate 1 is the plane, directly is bonded on the outer body of wall behind this plane daub.Above the face non-metal base plate 1 relative, form by the plane 1a that is positioned at middle body and two inclined-plane 1b and two inclined-plane 1d of being enclosed in 1a edge, plane above it with bottom surface 1c.
Adjacent two inclined-plane 1b width two other adjacent inclined-plane 1b width corresponding with it does not wait above the above-mentioned non-metal base plate 1, and the width of two inclined-plane 1b that is pasted with grid cloth 3 is greater than the width of two inclined-plane 1b that are not pasted with grid cloth 3.Purpose of design of the present invention is to make not to be pasted with grid cloth 3 and to be overlapped on and to be adjacent on the inclined-plane 1b that is pasted with grid cloth 3 broads, so promptly keep prior art and between every half-formed heat-insulating board, overlap the advantage of grid cloth 3 with the control cracking of gaining in strength, make that again the scope of overlap joint grid cloth 3 back appearance depressions is as far as possible little on inclined-plane between the every half-formed heat-insulating board, be convenient to smearing the seam levelling.
The width L of the grid cloth 3 of described not adhering state be less than or equal to for width greater than the inclined-plane 1d in its below inclined-plane 1d and another inclined-plane 1b of being adjacent width close 1d+1b.
Described non-metal base plate 1 is pasted with the width of two adjacent inclined-plane 1b of grid cloth 3 greater than the width of two inclined-plane 1d that are not pasted with grid cloth 3.
Described non-metal base plate 1 is one of them a substrate of flame-retardant polystyrene cystosepiment, extruded polystyrene warming plate or other nonmetals.
Described grid cloth 3 is a fiberglass gridding cloth.
A kind of to above-mentioned half-formed heat-insulating board packaging technology, undertaken by following two steps:
(1). paste: on the 1c of the bottom surface of half-formed heat-insulating board, smear bonding agent 5, it is sticked on the vertical exterior wall 4, paste half-formed heat-insulating board according to following order: two inclined-plane 1d that half-formed heat-insulating board is not pasted grid cloth 3 are pasted with two inclined-plane 1b of grid cloth 3 in abutting connection with another piece half-formed heat-insulating board, and the inclined-plane 1d of grid cloth 3 below it that does not paste extended overlap joint to the inclined-plane 1b that another piece half-formed heat-insulating board is pasted with grid cloth 3;
(2). smear seam: the depression that adjacent two half-formed heat-insulating board grid cloth 3 lap-joints form is smeared seam with bonding rubber cement, smear height and whole half-formed heat-insulating board levelling behind the seam.
According to two above-mentioned process steps of the present invention, half-formed heat-insulating board is assembled on the outer body of wall 4 successively, not only satisfy and continue traditional technical requirements grid cloth and must between two substrates, be the overlap joint state and improve bulk strength, realize that simultaneously the body of wall speed of warming plate assembling is fast, construction technology simple, increase substantially the work efficiency rate, guarantee assembling quality.

Claims (6)

1. a half-formed heat-insulating board is characterized in that its structure comprises: have non-metal base plate (1), bonding rubber cement (2), the grid cloth (3) of setting thickness; Wherein the bottom surface (1c) of non-metal base plate (1) is the plane, is made up of plane (1a) and the inclined-plane (1b, 1d) that is enclosed in edge, plane (1a) above it, is disposed with bonding rubber cement (2) and grid cloth (3) in the above; Grid cloth (3) sticks on the plane (1a) of non-metal base plate (1) and the top on two adjacent inclined-planes (1b), and the grid cloth (3) of all the other tops, two inclined-planes (1d) is not adhering state.
2. according to the half-formed heat-insulating board described in the claim 1, the width (L) that it is characterized in that the grid cloth (3) of described not adhering state is less than or equal to inclined-plane (1d) for the width greater than its inclined-plane, below (1d) and the closing of the width on another inclined-plane (1b) of being adjacent (1d+1b).
3. according to the half-formed heat-insulating board described in the claim 1, it is characterized in that described non-metal base plate (1) is pasted with the width on two adjacent inclined-planes (1b) of grid cloth (3) greater than the width on two inclined-planes (1d) that are not pasted with grid cloth (3).
4. according to the half-formed heat-insulating board described in the claim 1, it is characterized in that described non-metal base plate (1) is one of them a substrate of flame-retardant polystyrene cystosepiment, extruded polystyrene warming plate or other nonmetals.
5. according to the half-formed heat-insulating board described in the claim 1, it is characterized in that described grid cloth (3) is fiberglass gridding cloth.
6. claim 1 half-formed heat-insulating board packaging technology is characterized in that carrying out according to the following steps:
(1). paste: on the bottom surface of half-formed heat-insulating board (1c), smear bonding agent (5), it is sticked on the vertical exterior wall (4), paste half-formed heat-insulating board according to following order: two inclined-planes (1d) that half-formed heat-insulating board is not pasted grid cloth (3) are pasted with two inclined-planes (1b) of grid cloth (3) in abutting connection with another piece half-formed heat-insulating board, and the inclined-plane (1d) of grid cloth (3) below it of not pasting extended overlap joint to the inclined-plane (1b) that another piece half-formed heat-insulating board is pasted with grid cloth (3);
(2). smear seam: the depression that adjacent two half-formed heat-insulating board grid cloth (3) lap-joint forms is smeared seam with bonding rubber cement, smear height and whole half-formed heat-insulating board levelling behind the seam.
CN 200510013508 2005-05-16 2005-05-16 Half-formed heat-insulating board and assembling technique thereof Pending CN1721633A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200510013508 CN1721633A (en) 2005-05-16 2005-05-16 Half-formed heat-insulating board and assembling technique thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200510013508 CN1721633A (en) 2005-05-16 2005-05-16 Half-formed heat-insulating board and assembling technique thereof

Publications (1)

Publication Number Publication Date
CN1721633A true CN1721633A (en) 2006-01-18

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200510013508 Pending CN1721633A (en) 2005-05-16 2005-05-16 Half-formed heat-insulating board and assembling technique thereof

Country Status (1)

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CN (1) CN1721633A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102561685A (en) * 2010-12-13 2012-07-11 五冶集团上海有限公司 Construction method of extruded polystyrene foamed plastic insulation boards in house energy-saving materials

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102561685A (en) * 2010-12-13 2012-07-11 五冶集团上海有限公司 Construction method of extruded polystyrene foamed plastic insulation boards in house energy-saving materials
CN102561685B (en) * 2010-12-13 2016-01-27 五冶集团上海有限公司 The construction method of residence energy saving material extrusion molding polystyrene polyfoam warming plate

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