CN1718431A

CN1718431A - Method for electroplating and grinding plate rolls before forming pore

Info

Publication number: CN1718431A
Application number: CN 200410063768
Authority: CN
Inventors: 井上学; 祐成和弘; 松本典子; 小沼智之; 重田龙男
Original assignee: Think Laboratory Co Ltd
Current assignee: Think Laboratory Co Ltd
Priority date: 2004-07-07
Filing date: 2004-07-07
Publication date: 2006-01-11

Abstract

An electroplating and grinding technology for the plate-making roller before microholes are formed includes such steps as lifting insoluble anode to make it close to lower surface of plate-making roller, supplying the filtered electroplating liquid, electroplating, fixing the liquid-infiltratable abrasive particles and flexible body or superfibres to the surface of grinding head with electrode, supplying electrolyzing liquid, moving the grinding head back and forth along the surface of said roller for electrolytic grinding.

Description

Method for plating and grinding plate roll to be manufactured before forming micro-holes

Technical Field

The present invention relates to a plating and polishing method for a plate-to-be-manufactured roll before forming minute holes (セル), which can form a copper sulfate plating layer having a uniform thickness without pits and pits ona plate-to-be-manufactured roll for gravure printing, and can perform semi-finish polishing and mirror finish polishing in a short time without using grinding wheel polishing, thereby providing a high-quality plate-to-be-manufactured roll.

Background

The following describes 2 plate making methods for a plate roll to be produced for gravure printing.

(1) In the laser plate-making process of the plate-to-be-produced roll of the straight plate type, the roll is carried in, the ultra-precision cylinder machining is performed by a lathe, and then the semi-finish grinding, and mirror finishing are performed by a grinding wheel, or the cylinder grinding which is corrected to a perfect circle by stripping chromium with hydrochloric acid is performed, and then the plate falling grinding which cuts off a certain thickness is performed, and then degreasing, nickel plating, acid copper plating, and semi-finish grinding, and mirror finishing by a grinding wheel are performed. Then, steps such as coating formation of a photosensitive film, image printing by a laser exposure apparatus, alkali development, formation of fine holes by etching, stripping of a photoresist by a strong base, chrome plating, sanding, and carrying out are performed.

(2) In the laser platemaking process of a roller to be made of a barard (バラ - ド) plating type, carrying in of a roller after removing a used barard copper plating layer, degreasing, a weak adhesion surface treatment of applying a photographic waste liquid, copper sulfate plating, semi-finish polishing by a grinding wheel, finish polishing, and mirror finish polishing are performed. Then, steps such as coating formation of a photosensitive film, image printing by a laser exposure apparatus, alkali development, formation of fine holes by etching, stripping of a photoresist by a strong base, chrome plating, sanding, and carrying out are performed.

Further, there are engraving plates by an electronic engraving machine or a laser engraving machine, and the like.

As prior art documents related to the gravure plate making technique, Japanese patent application No. Hei 10-193551, Japanese patent application No. Hei 10-193552, Japanese patent application No. 2000-062342, Japanese patent application No. 2000-062343, Japanese patent application No. 2000-062344, Japanese patent application No. 2001-179923, Japanese patent application No. 2001-179924, Japanese patent application No. 2001-187440, Japanese patent application No. 2001-187441, Japanese patent application No. 2001-191475, Japanese patent application No. 2001-191476, Japanese patent application No. 2001-260304, Japanese patent application No. 2002-127369, Japanese patent application No. 2002-187249, Japanese patent application No. 2002-187250, Japanese patent application No. 2002-200728, Japanese patent application No. 2002-200729, Japanese patent application No. 2002-307640, Japanese patent application No. 2002-763041, etc. are mentioned.

In a conventional copper sulfate plating method and apparatus for a plate-to-be-produced roll for gravure printing, a phosphorus-containing copper anode is used as an anode for copper plating, and it is known to use a phosphorus-containing copper anode having a composition containing 350 to 700ppm of phosphorus, 2 to 5ppm of oxygen, and the balance of copper and inevitable impurities as one of the phosphorus-containing copper anodes for plating.

In the conventional copper sulfate plating method and apparatus for a plate-to-be-made roll for gravure printing, a box-shaped roll holding rotary transport device transported by a stacker crane is mounted on a frame of a plating apparatus main body, theplate-to-be-made roll for gravure printing, which is held at both ends by the box-shaped roll holding rotary transport device, is connected to a cathode, and is immersed in a plating solution stored in a plating tank to rotate, and a plating current is passed between the plate-to-be-made roll and phosphorus-containing copper balls as plating metal immersed in the plating solution as an anode. Then, copper balls composed of phosphorus-containing copper containing 2-5 ppm of oxygen and 350-700 ppm of phosphorus are fed into the anode cage in an electroplating bath, and electroplating is carried out at a high current density of 10-15A/dm 2.

The phosphorus-containing copper balls contain inevitable impurities, and black anode sludge is attached to the surfaces of the plated metal copper balls. The anode sludge is separated from the plated metal copper balls by stirring of the liquid and dissolution of the plated metal copper balls, floats in the plating liquid, and adheres to the surface of the plate roll, causing pocks (micro-bumps) and pits (pinholes).

In addition, in order to avoid excessive dissolution of the copper balls of the plating metal and excessive increase in the copper ion concentration in the plating solution, which makes it impossible to obtain an appropriate copper sulfate plating, it is necessary to periodically discharge the plating solution and perform maintenance of diluting the plating solution so as to obtain an appropriate copper ion concentration.

In a method of copper plating of a semiconductor wafer, a method of applying a plating current using a phosphorus-containing copper ball as an anode is performed.

(patent document 1) Japanese patent application laid-open No. 5-214586

(patent document 2) Japanese patent application laid-open No. 8-67932

(patent document 3) Japanese patent application laid-open No. 11-061488

(patent document 4) Japanese patent application laid-open No. 2003-171797

(patent document 5) Japanese patent laid-open publication No. 2002-275698

In the conventional copper sulfate plating method and apparatus for a plate-to-be-produced roll for gravure printing, the plating method and apparatus using an insoluble anode have not been adopted at all.

The following technical documents are available as a method and an apparatus for copper sulfate plating using an insoluble anode other than the method of dissolving phosphorus-containing copper spheres.

(patent document 6) japanese patent application laid-open No. 2003-166100.

(patent document 7) Japanese patent application laid-open No. 2002-068743 discloses a method for producing easily soluble copper oxide, a copper-plating material, and a copper-plating method.

(patent document 8) Japanese Kokai publication No. 2002-515549.

(patent document 9) Japanese patent application laid-open No. Hei 08-501827.

As can be seen from the plate making process, the processing steps performed by the grindstone polishing apparatus are several, and it takes 30 minutes or more for polishing before copper sulfate plating and polishing after copper sulfate plating. The grinding wheel polishing apparatus needs to prepare 4 types of rough grinding wheels for plate dropping, semi-finish grinding wheels before mirror surface processing, finish grinding wheels, and mirror surface processing grinding wheels, and also needs to have versatility to cope with the size of a roll of 100 mm. phi. times.1000 mm to 300 mm. phi. times.2000 mm, and needs to be equipped with an automatic grinding wheel replacement mechanism, and further, in order to shorten the time, 2-point polishing or 4-point polishing in which polishing is performed simultaneously from both sides is performed. For this reason, the grinding wheel grinding apparatus becomes an extremely expensive device. Further, since the grindstone polishing apparatus is a wet type apparatus, it cannot be installed in the same room as the photosensitive film coating apparatus and the laser exposure apparatus, which have adverse effects on moisture, and there is no structure in which the grindstone polishing apparatus can polish the plate-making roll while being held by the box-shaped roll holding and rotating conveyor apparatus conveyed by the stacker crane installed in the plating line.

In the conventional copper sulfate plating method and apparatus for a plate-to-be-produced roll for gravure printing, the electrolytic abrasive grain polishing method and apparatus have not been used at all.

The following technical documents exist as an electrolytic abrasive grain polishing method and apparatus.

(patent document 10) Japanese patent application laid-open No. Hei 10-156627 discloses a method for polishing tungsten by electrolytic mirror polishing.

(patent document 11) Japanese patent application laid-open No. Hei 10-086020 discloses a method and an apparatus for electrolytic machining of a dynamic pressure generating groove of a dynamic pressure bearing.

(patent document 12) Japanese patent application laid-open No. H09-192933A method and apparatus for fine electrolytic machining.

(patent document 13) Japanese patent application laid-open No. Hei 09-192932 discloses a method and an apparatus for processing a micro-cell.

(patent document 14) Japanese patent application laid-open No. Hei 07-241728 discloses a method for electrolytic abrasive grain polishing of stainless steel.

(patent document 15) Japanese patent application laid-open No. Hei 07-185938 discloses a high-speed electrolytic rough machining method and apparatus therefor.

(patent document 16) Japanese patent laid-open No. H06-023663A method and apparatus for ultra-smooth non-contact polishing.

According to the conventional copper plating method using phosphorus-containing copper balls as an anode, inevitable impurities are accumulated in the plating solution and adhere to the surface of the roll to be produced, causing pits and pits. The copper plating method using high-purity phosphorus-containing copper balls as anodes for copper sulfate plating of semiconductor wafers has increased the plating cost and cannot be used.

In addition, according to the conventional copper plating method using phosphorus-containing copper balls as anodes, since the distance between the anode and the roll to be manufactured is large, the plating current concentrates on both ends of the roll, and the plating thickness increases in the vicinity of both ends of the roll. For this reason, when grinding wheel cylinder grinding is performed, grinding is performed to a large extent in the vicinity of both ends of the roller. Since the grinding wheel cylinder polishing apparatus is large, expensive, and time-consuming to machine, it is known that the electrolytic polishing apparatus cannot uniformly polish a non-uniform plating thickness by considering the use of the electrolytic polishing apparatus which is small, inexpensive, and short in machining time, and therefore, in order to apply the electrolytic polishing apparatus, it is necessary to configure an electroplating system capable of uniformly polishing a plating thickness along the entire length of a roll to be manufactured.

In order to solve the above problems, the present inventors have adopted a method of performing a copper plating treatment on a plate-making roll using an insoluble anode. In this method, an insoluble anode is used, for example, an anode having a catalyst applied to the surface of titanium, and a current liquid is formed outside a plating tank, and inevitable impurities are captured by a filter, and plating is performed using a plating liquid containing no inevitable impurities, so that anode sludge is not generated. However, there is no example of the use in a plating line for a roll to be produced for gravure printing.

The inventors of the present application set a plating apparatus in a research facility, the plating apparatus including a plating tank having an insoluble anode and a plating solution replenishment tank for forming a plating solution and circulating the plating solution from the plating tank; placing a box-shaped roller clamping rotary conveying device conveyed by a stacking crane on an electroplating device body framework, and enabling a plate to be made for gravure printing, which is clamped at two ends by the box-shaped roller clamping rotary conveying device, to be positioned on the upper side of the electroplating tank; under the conditions of the apparatus, it was studied how to form a plating layer having a uniform thickness over the entire length of a plate roll to be manufactured, which has a relatively different size, without generating pits or depressions when an insoluble anode of a plating tank is provided.

As a result, they have found that, in the process of supplying the plating solution from the plating solution replenishment tank to the plating tank, inevitable impurities contained in the plating solution are supplementarily removed, and plating free from pitting and pitting can be performed; further, it has been found that when the roll-facing surface is smooth, and an insoluble anode which is parallel to the roll to be made and is energized as an anode is brought close to the lower surface of the roll to be made with a gap of 5mm to 30mm, and a plating current is applied, the plating is performed with a uniform thickness along the entire length of the roll without the influence of current concentration due to the inflow of the plating current at both ends of the roll, and a plating layer with a desired thickness is obtained in a short time by irradiating the roll with ultrasonic waves, reducing the plating solution immersion area of the roll to be made, applying shower, or the like. Further, there has been obtained an effect that, when a large number of roll-to-be-manufactured plating is performed, the relationship between the copper concentration of the plating liquid and the integrated value of the plating current and the sulfuric acid concentration are detected because the copper concentration and the sulfuric acid concentration of the plating liquid are insufficient, and a necessary amount of copper-containing fine powder or sulfuric acid is automatically supplied to the plating liquid supply tank, thereby realizing automation and unmanned operation of the plating line.

Then, the inventors of the present invention have considered to eliminate the grindstone polishing apparatus from the plate-making line and have made investigations and developments to provide an electrolytic abrasive grain polishing apparatus instead of the grindstone polishing apparatus.

The present inventors first placed a box-shaped roller clamping rotary transport device substantially identical to the box-shaped roller automatic attaching and detaching device shown in japanese patent publication No. 57-36995 on a water washing device, stored an electrolyte plating solution composed of pure water + 1 wt% sodium nitrate + 1 wt% abrasive grains having a grain diameter of 0.8 μm Φ or less in a water washing water storage tank, installed an industrial robot as a reciprocating device of a polishing head at the rear of the device, prepared a polishing head body having a concave cylindrical surface having the same size as a polishing grindstone at the front end of a robot arm, connected to a cathode, and formed a polishing head by superposing a porous elastic body having liquid impregnation properties on the concave cylindrical surface as an electrode part and finally superposing a super fiber (specifically zailon (ザイロン) (registered trademark: products of toyobo corporation)) having high creep resistance, high strength, and high temperature durability on the surface, an electrolytic abrasive grain polishing test was performed by a polishing system having the polishing head.

Zailon (ザイロン) is a fiber obtained by liquid-crystal spinning of Polyparaphenylenebenzobisoxazole (PBO) having a very linear molecular structure, which is rigid and has a thickness of only 1mm phi, has a remarkable strength of 450 kg, and has the highest levels of strength, modulus of elasticity, heat resistance and flame retardancy among conventional organic fibers.

The box-shaped roller clamping rotary conveying device clamps two ends of a plate-making roller, connects the plate-making roller to an anode, rotates at a required rotating speed, presses the plate-making roller by a grinding head, sprays electrolyte, and allows an electrolytic current to flow for grinding. In the polishing theory, when an electrolytic current is applied, a passivation film is formed on the surface of the plate-making roll facing the polishing head, the passivation film covering the micro-protrusions in the passivation film is wiped off by abrasive grains on the surface of the nanofibers captured by the polishing head, and the micro-protrusions are dissolved and removed by the electrolytic current, thereby smoothing the surface. However, the roll cannot be efficiently ground. After a short time has elapsed from the start, a passivation film is deposited to prevent the surface of the roll to be manufactured from being electrolyzed, thereby preventing the roll from being efficiently ground. If the electrolytic current flows and the passivation film formed on the portion of the roller surface corresponding to the polishing head is not removed, the passivation film becomes an oxide film after a certain time has elapsed, and if the passivation film becomes an oxide film, the passivation film becomes a film in which the abrasive grains are difficult to remove, and the passivation film is deposited.

Further, it has been found that abrasive grains in the electrolyte are captured on the surface of the nanofibers of the polishing head, and the roll to be manufactured is polished by the abrasive grains, which does not greatly promote the polishing.

If the polishing pressure is low, only a small amount of electrolytic abrasive polishing is performed, and if the polishing pressure is increased, electrolytic abrasive polishing is increased, but even if the polishing pressure is increased to a limit at which the pinching rotation of the roll to be produced is not affected, the passivation film is deposited, and the passivation film cannot be effectively removed by the abrasive grains contained in the electrolyte.

Therefore, instead of the super fiber, electrolytic abrasive grain polishing was performed by using a polishing head formed of a sponge-like elastic body (specifically, scotch coat (スコツチブライト) (product of registered trademark: sumitose lim (スリ - エム)) having a structure in which abrasive grains equivalent to a grinding wheel equivalent to No. 800 are fixed and superposed thereon.

As a result, when time passes, if the passivation film is not removed, the passivation film is accumulated as an oxide film in a spot pattern, and the electrolytic abrasive grain polishing is hindered.

The time during which the electrolytic current was applied and the time during which the electrolytic current was not applied were alternately set to 20 seconds, so that oxidation of the passivation film could be avoided, and the entire surface was polished in about 45 minutes. In addition, the polished portion was purple. This is considered an alkali burn.

It was also found that when the electrolyte was acidic, the color of the electrolyte was not purple. However, when an electrolytic current is constantly applied, the passivation film is oxidized to cause deposition.

For this reason, the polishing head is modified so that a state in which electrolytic current is constantly supplied and electrolytic abrasive polishing is performed and a state in which electrolytic current is not supplied and abrasive polishing is performed simultaneously exist.

The polishing head is constituted by laminating 2 pieces of strip-like plate-shaped rubber on the concave cylinder surface of the polishing head body, exposing the electrode part in the middle of the concave cylinder surface, laminating a porous elastic body (sponge) on the groove where the electrode part is exposed, flattening the porous elastic body, and finally laminating a scotch (スコツチブライト) as a polishing strip. The results of the grinding showed that rough grinding without remaining pocks was achieved from about 15 minutes.

Since the polishing head has the porous elastic body superimposed on the groove where the electrode portion is exposed, it is ensured that an electrolytic current is caused to flow by the electrolytic solution, and the electrolytic current is caused to flow so that a passivation film is instantaneously formed on the surface portion of theroll to be manufactured, the surface portion facing the groove where the electrode portion is exposed, the passivation film covering the microprotrusion portions of the passivation film was wiped off by abrasive grains fixed to a Stocky Braille (スコツチブライト), and the micro-convex part of the passivation film is dissolved and removed by the electrolytic current to realize smoothing and carry out electrolytic abrasive grain grinding, at the same time, the plate-like rubber is laminated so that the electrolytic current does not flow between the upstream portion and the downstream portion of the porous elastic body, therefore, the surface portion facing the groove where the electrode is exposed can be subjected to abrasive grain polishing (rough polishing) by the scotch cloth (スコツチブライト) after electrolytic abrasive grain polishing without forming the passivation film.

Next, when electrolytic abrasive grain polishing was performed on the roll to be produced, on which copper sulfate plating had just been completed, using zailon (ザイロン) in which a microfiber was superimposed instead of scotch cloth (スコツチブライト) having fixed abrasive grains, mirror finish polishing could not be performed. Therefore, when the electrolytic abrasive grain polishing was performed on the roll to be manufactured immediately after the rough polishing by the scotch cloth (スコツチブライト), the mirror finish polishing could be performed in about 15 minutes.

Further, in the case where electrolytic abrasive grain polishing is performed on a roll to be produced on which a hard plating layer is formed after forming fine holes by using a polishing head of a Schlegzblankholder (スコツチブライト) on which fixed abrasive grains are superposed, burrs of a chromium plating layer extending to the corners of the fine holes can be removed in a short time.

Then, for example, a polishing head of 1 block having a cylindrical surface with a curvature radius of 150mm is prepared, and in order to perform rough polishing or mirror polishing on a plate-to-be-manufactured roll for gravure printing having various sizes in a range of 80mm to 300mm in diameter, as the diameter of the plate-to-be-manufactured roll becomes smaller, the contact angle between the plate-to-be-manufactured roll and the scotch (スコツチブライト) and the zaleplon (ザイロン) becomes smaller, and therefore, good polishing cannot be performed.

Therefore, the contact angles between the stargardt lapatin (スコツチブライト) and the zailon (ザイロン) and the plate-making roll can be changed according to the diameter of the plate-making roll, and an experiment in which a polishing head capable of pressing the stargardt lapatin (スコツチブライト) and the zailon (ザイロン) against the plate-making roll well can be made and polishing can be repeated is carried out, whereby a good mirror finish of electrolytic abrasive grain polishing can be realized. In addition, even if a grinding disc capable of reciprocating motion by a rotary driving mode is manufactured, electrodes are embedded into a radial shape, and circular Stockhol cloth Laplacot (スコツチブライト) and a zailon (ザイロン) are overlapped for grinding, in the occasion, good mirror finish can be realized by electrolytic abrasive grain grinding.

The present invention has been completed based on the above-described process.

Disclosure of Invention

The present invention provides a method for plating and polishing a plate-to-be-manufactured roll before forming micro-holes, which can form a copper sulfate plating layer having a uniform thickness without pits and depressions on the plate-to-be-manufactured roll for gravure printing, can perform semi-finish polishing and mirror finish polishing in a short time without using grinding wheel polishing, and can provide a high-quality plate-to-be-manufactured roll.

The plating and polishing method for a plate-to-be-produced roll before forming micropores according to the invention of claim 1, wherein the plate-to-be-produced roll is subjected to copper sulfate plating and then to polishing to form a mirror-finished state; the method is characterized in that:

in the copper sulfate electroplating, both ends of a plate-making roll as an object to be plated are rotatably supported, and are energized to a cathode in a plating tank and rotated at a desired rotation speed, an insoluble anode is positioned below the plate-making roll and has a length equal to or longer than the maximum length of the plate-making roll, the roll-facing surface is smooth and is energized to an anode in parallel with the plate-making roll, the insoluble anode is raised to approach the lower surface of the plate-making roll, and a plating solution from which inevitable impurities causing pockmarks and pits are removed by a filter is supplied to perform electroplating;

in the polishing, both ends of a plate-making roll are rotatably supported and connected to an anode to rotate, a polishing head body has an electrode portion connected to a cathode in a part of a roll pressing surface, a liquid-impregnated abrasive particle-fixing flexible body or a microfiber, which is made of a nonwoven fabric having a high frictional strength and fixes abrasive particles, is superposed on the polishing head body, the liquid-impregnated abrasive particle-fixing flexible body or the microfiber is brought into close contact with the plate-making roll, an electrolytic solution is supplied to the contact surface, the plate-making roll is pressed against the concave surface, and the polishing head is reciprocated in the longitudinal direction of the roll surface, whereby electrolytic polishing is performed in a part of the plate-making roll corresponding to the electrode portion, and friction polishing is performed in another part where an electrolytic current does not flow.

The plating and grinding method for a plate-to-be-produced roll before forming the micro-holes of the invention of claim 2, wherein copper sulfate plating is performed on the plate-to-be-produced roll, then semi-finish grinding is performed, and then finish grinding is performed; the method is characterized in that:

in the semi-finishing polishing, both ends of a plate-making roll are rotatably supported and connected to an anode to rotate, a polishing head body has a concave cylindrical surface and an electrode portion connected to a cathode in a part of the concave cylindrical surface, a liquid-impregnated abrasive particle fixing flexible body in which abrasive particles are fixed to a nonwoven fabric having a high frictional strength is hung on the polishing head body, the liquid-impregnated abrasive particle fixing flexible body is brought into close contact with the plate-making roll to be pressed against the plate-making roll by the concave cylindrical surface, an electrolytic solution is supplied to a contact surface between the plate-making roll and a polishing tape, and the polishing head is reciprocated in a longitudinal direction of the roll surface to reciprocate the polishing tape in a longitudinal direction of the roll surface, electrolytic polishing is performed on a portion of the roll to be produced corresponding to the electrode portion, and rubbing polishing is performed on the other portion where the electrolytic current does not flow, thereby performing semi-finishing grinding by grinding in which electrolytic abrasive grain grinding using a grinding belt and abrasive grain grinding are mixed;

in the mirror finishing polishing, both ends of a plate-to-be-manufactured roll are rotatably supported and connected to an anode to rotate, a polishing head body has a concave cylindrical surface and an electrode portion connected to a cathode in a part of the concave cylindrical surface, a flexible super fiber having a required large width and being attached to the polishing head body is brought into close contact with the plate-to-be-manufactured roll, the plate-to-be-manufactured roll is pressed against the concave cylindrical surface, an electrolytic solution is supplied to a contact surface between the plate-to-be-manufactured roll and the super fiber, the polishing head is reciprocated in a longitudinal direction of the roll surface to reciprocate the super fiber in the longitudinal direction of the roll surface, electrolytic polishing is performed in a part of the plate-to-be-manufactured roll corresponding to the electrode portion, and friction polishing is performed in another part where an electrolytic current does not flow, thereby performing a mirror finishing polishing in which electrolytic polishing and friction polishing are mixed by the super fiber.

The plating and grinding method for a roll to be produced before forming micropores according to the invention of claim 3 is characterized in that, in addition to the invention of claim 1 or 2: in the copper sulfate plating, a plating solution capable of performing copper sulfate plating is stored in a plating solution replenishment tank, and the plating solution is formed by adding copper-containing fine powder of copper oxide powder, copper carbonate powder, or copper sulfate powder to sulfuric acid, and after inevitable impurities in the plating solution are removed by a filter, the plating solution is supplied to a plating tank having an insoluble anode to perform plating.

The plating and grinding method for a roll to be produced before forming micropores according to the invention of claim 4 is characterized in that, in addition to the invention of claim 3: the copper concentration of the plating liquid in use is measured, and when the copper concentration is insufficient, or when the plating treatment is performed for 1 roll to be manufactured, the accumulated plating current value is measured, and the necessary amount of the copper-containing fine powder is automatically replenished every time the plating treatment is finished.

Effect of the invention according to claim 1

(1) Since the electroplating using an insoluble anode and the electrolytic abrasive polishing are combined, if the roll diameter before electroplating is precisely machined uniformly over the entire length, the roll diameter after electroplating is maintained with uniform precision over the entire length, and therefore, the barrel polishing of the roll after electroplating is not performed by grinding using a grindstone, but is performed by using an electrolytic abrasive polishing of a material that is soft in sliding contact, and is suitable for the copper sulfate electroplating treatment and the polishing treatment in the plate making line before forming micropores.

When the combination of electroplating using an insoluble anode and electrolytic abrasive polishing is not used, specifically, when the combination of electroplating and electrolytic abrasive polishing is used in the past, the thickness of the plating in the vicinity of both ends of the roll surface is larger than that of the other portions, and the roll diameter cannot be corrected to be uniform in the electrolytic abrasive polishing, and pits and pocks may occur even in the mirror polishing.

More specifically, in the plating method using an insoluble anode, a method of dissolving phosphorus-containing copper balls in a plating solution replenishment tank or a method of charging copper oxide powder, copper carbonate powder, or copper sulfate powder into the plating solution replenishment tank can be used as a copper source to be replenished with an electric current solution, and the plating solution from which inevitable impurities causing pockmarks and pits contained in the copper source have been removed by a filter can be supplied to a plating tank to be plated, so that favorable copper sulfate plating can be performed without generation of pockmarks and pits.

Conventionally, since the distance between the anode and the roll to be manufactured is large, the plating current is concentrated at both ends of the roll, and the plating thickness is increased in the vicinity of both ends of the roll. For this reason, the barrel polishing is also performed largely in the vicinity of both ends of the roller. On the other hand, since the surface of the insoluble anode facing the roll is smooth and parallel to the roll to be made, and the insoluble anode is brought close to the lower surface of the roll to be made to perform plating, the plating current has a uniform density along the entire length of the roll, and plating with a uniform thickness can be performed. That is, since the insoluble anode having a length equal to or longer than the maximum length of the roll to be made is raised and plated in proximity to the lower surface of the roll to be made, the roll to be made has versatility in that the lengths of the insoluble anode with respect to the diameter are different from each other. Since the plating is performed by bringing the insoluble anode close to the roll to be made, the plating current does not concentrate in the vicinity of the roll end surface even if the length of the roll to be made is 1/2, for example, with respect to the insoluble anode, and the plating can be performed with a uniform thickness while maintaining a uniform plating current density along the entire length of the roll. Therefore, if the roll diameter before plating is precisely machined uniformly along the entire length, the roll diameter after plating can be maintained at a uniform precision along the entire length, and therefore, the barrel polishing of the roll after plating is not the grinding wheel polishing, but can be applied to the electrolytic abrasive grain polishing in sliding contact with the soft material.

(2) Since electroplating using an insoluble anode and electrolytic abrasive grain polishing are combined, the treatment time can be significantly shortened. That is, in the plating method in which the insoluble anode is brought close to the roll to be produced, the plating current density can be increased without increasing the plating thickness at both ends of the roll as compared with the middle part of the roll, and therefore, the plating time can be shortened, and the polishing time can be shortened considerably, and therefore, the throughput of the production line can be improved.

The polishing time can be shortened to a large extent, and the following is the case.

An electrolytic current flows to instantaneously form a passivation film on the surface of the roll to be produced at a position facing the electrode plate. Since electrolytic current flows to the exposed portion of the electrode portion, a passivation film is instantaneously formed, the polishing strip wipes off the passivation film covering the microprotrusion portion, and the electrolytic current dissolves the microprotrusion portion from which the passivation film is removed, and accumulation of the passivation film is avoided, so that the entire surface of the polishing strip is polished at a portion where the electrolytic current does not flow, and semi-finish polishing and/or mirror finish polishing can be performed in a short time depending on the type of the polishing strip (difference between scotch coat (スコツチブライト) and zailon (ザイロン)), and therefore, cylinder polishing can be performed in a short time without using a grindstone polishing device with respect to a used barard-type plate roll to be manufactured, and plate making time can be shortened as a whole.

Effect of the invention according to claim 2

The same effects as effects (1) and (2) of the invention of item 1 can be obtained.

The grinding can also obtain the following effects.

With respect to the used straight plate type roll to be manufactured, by mixing electrolytic abrasive grain polishing using scotch (スコツチブライト) and abrasive grain polishing with the semi-finish polishing after the falling plate cylinder precision machining by a lathe, the semi-finish polishing can be performed in a much shorter time than the conventional grindstone polishing apparatus.

Then, regarding the mirror finishing polishing after the plating, by mixing the electrolytic abrasive grain polishing using scotch (スコツチブライト) or the like and the abrasive grain polishing, the time for the semi-finish polishing and the mirror finishing polishing using the electrolytic polishing and the friction polishing using zailon (ザイロン) or the like can be made muchshorter than the time for the treatment process of the semi-finish polishing → mirror finishing polishing performed by the conventional wheel polishing apparatus.

With respect to the used barred type plate-making roll after the falling cylinder precision machining by the lathe, by mixing the electrolytic abrasive grain polishing using scotch cloth (スコツチブライト) and the abrasive grain polishing, the semi-finishing polishing can be performed in a much shorter time than the conventional grindstone polishing apparatus.

With respect to the mirror finishing polishing after the plating, by mixing the electrolytic abrasive grain polishing and the abrasive grain polishing using scotch cloth (スコツチブライト) or the like, the time required for the semi-finish polishing and the mirror finishing polishing in which the electrolytic polishing and the friction polishing using zaleplon (ザイロン) or the like are mixed can be made much shorter than the time required for the treatment process of the semi-finish polishing → mirror finishing polishing performed by the conventional grindstone polishing apparatus.

Aggravated effects of invention 3

Since the use of copper balls is stopped and a copper sulfate electroplating solution prepared by adding copper oxide powder, copper carbonate powder, or copper sulfate powder to sulfuric acid is used, the shortage of copper source material can be avoided even if a high current is passed to perform a powerful electroplating.

Aggravating effect of invention 4

In the past, when the phosphorus-containing copper balls and the sulfuric acid were replenished, the operation of the production line was stopped, and the necessary amount of the phosphorus-containing copper balls and the sulfuric acid was replenished after measurement, but the presentinvention can manage the copper ion concentration and the sulfuric acid concentration of the plating solution and automatically measure and replenish the copper source material, so that the operation of the plating line can be prevented from being stopped at the time of replenishing the copper source, the operating rate of the production line can be increased, and the handling of the copper oxide powder, the copper carbonate powder, or the copper sulfate powder having toxicity by a human hand can be prevented.

Drawings

Fig. 1 is a plan view of a plate making plant of example 1 of the present invention.

FIG. 2 is a longitudinal sectional front view of the barrel polishing apparatus according to example 2 of the present invention.

FIG. 3 is a front longitudinal sectional view of a barrel polishing apparatus according to example 3 of the present invention.

Fig. 4 is a plan view of the barrel polishing apparatus according to example 3 of the present invention.

Fig. 5 is a longitudinal sectional side view of the polishing head of the cylindrical polishing apparatus according to example 3 of the present invention, wherein (a) is a state before polishing with respect to the maximum-diameter roll to be made, (b) is a state during polishing with respect to the maximum-diameter roll to be made, and (c) is a state before polishing with respect to the minimum-diameter roll to be made.

Detailed Description

As a plant facility, as shown in example 1, the plant facility was divided into a robot chamber and a plating chamber, an industrial robot and a turret-type roll storage device were installed in the robot chamber, and for any of various plate making methods, a photosensitive film drying acceleration device, a photosensitive film coating device, and a laser exposure device were installed in accordance with laser exposure, development, and etching plate making, a photosensitive film drying acceleration device, a black film coating device, and a laser exposure device were installed in accordance with laser polishing and etching plate making, a laser engraving device was installed in accordance with laser engraving plate making, and an electronic engraving device was installed in accordance with electronic engraving plate making. An electroplating production line is arranged on the lower side of a line of a stacker crane arranged on the top of the electroplating chamber, and a copper sulfate electroplating device or a chromium plating device or a nickel plating device for electroplating the plate-making roller is used as main equipment of the electroplating production line.

In particular, as shown in example 2, a copper sulfate plating apparatus using an insoluble anode and automatically supplying copper-containing fine powder and sulfuric acid was provided, and as a polishing apparatus, a method involving electrolytic polishing was employed, and as shown in example 3, a polishing apparatus for semi-finishing and a polishing apparatus for mirror finishing were preferably provided.

The plating tank is preferably constituted as a fixed tank, and after the plate-to-be-manufactured roll held by the roll turning device is positioned in the plating tank, the plating liquid is supplied from the plating liquid replenishment tank, the liquid surface rises, the plating liquid is completely submerged in the plate making roll or is immersed in the plating liquid only at a diameter of about 1/3 degrees, the plating liquid overflowing at a predetermined liquid surface level is returned to the plating liquid replenishment tank, or as a movable tank capable of freely lifting, and after the plate-making roller clamped in the roller rotating device is positioned in the electroplating device body, the movable groove is positioned in the groove corresponding to the stroke required for the diameter of the plate-making roller to rise, then, the plating liquid is supplied from the plating liquid replenishment tank, the liquid surface rises, the plating liquid is immersed in the plating liquid from about 1/3 to about 1/4 diameters of the plate-making roll, and the plating liquid overflowing while maintaining the liquid surface level is returned to the plating liquid replenishment tank.

The copper sulfate plating method and apparatus for a roll to be produced produce a plating solution in a plating solution replenishment tank and supply copper ions to a plating tank. As a method for producing the plating solution, phosphorus-containing copper balls are put into a plating solution replenishment tank, stirred with air, dissolved by the superimposed action of free sulfuric acid and dissolved oxygen in the plating solution to produce copper ions (cations), and the plating solution is supplied with insufficient copper ions into the plating tank by a liquid supply device including a check valve type pumping port, a pumping pump, a pipe, a flow rate adjustment valve, a filter for trapping unavoidable impurities, and the like. In this case, the metal copper immersed in the plating liquid is brought into contact with a metal more expensive than copper such as gold, platinum, palladium, etc., and air agitation is performed to promote dissolution of copper.

However, as described above, it is preferable to supply the plating liquid replenishment tank with copper-containing fine powder of copper oxide powder, copper carbonate powder, or copper sulfate powder, which is easily soluble in sulfuric acid and is likely to become copper ions, instead of dissolving the phosphorus-containing copper balls.

When installed in a production line, it is preferable to divide the apparatus into a cylindrical polishing apparatus for performing rough cylindrical polishing by rubbing with an abrasive grain-fixing liquid-impregnated flexible body composed of nonwoven fixed abrasive grains having high frictional strength, such as scotch (スコツチブライト) (registered trademark), and a cylindrical polishing apparatus for performing mirror-finish polishing by rubbing with a polishing tape of unfixed abrasive grains as a super fiber.

A cylinder polishing apparatus capable of roughly polishing a cylinder by fixing a liquid-impregnated flexible body with abrasive grains can remove and polish chromium plating burrs. The 2-head type two-stage polishing cylindrical polishing apparatus may be formed to have a polishing head for performing rough cylindrical polishing and a polishing head for performing mirror-finish polishing, but the apparatus is preferably formed to have a large throughput when separated from each other.

The polishing head may have a plate-to-be-manufactured roll longer by, for example, 100mm than the maximum length (about 1300 mm), and the full length of the plate-to-be-manufactured roll for polishing by the polishing head may be in contact with the polishing head at the same time even if the reciprocation stroke for polishing by the polishing head is about 100mm, or the polishing head may have a length substantially equal to that of the plate-to-be-manufactured roll having the minimum length (about 500 mm), and the reciprocation stroke of the polishing head during polishing may be about 900mm with respect to the plate-to-be-manufactured roll having the maximum length (about 1300 mm).

The roll to be produced is sandwiched between both ends thereof and is configured to be rotated while being connected to the anode. The polishing head for polishing the rough cylinder and the polishing head for polishing the mirror surface are both variable polishing heads having a backup (back up) function of obtaining a large contact angle between the starchy-bravain (スコツチブライト) and the zailon (ザイロン) and the plate-to-be-manufactured roll for gravure printing having various sizes, for example, a diameter in the range of 80mm to 300 mm.

Specifically, the polishing head is configured to rotate by sandwiching both ends of the plate-making roll and connecting the plate-making roll to an anode, has a head body configured to bring a flexible polishing tape of a desired width into close contact with the plate-making roll and press the polishing tape against the plate-making roll, has an electrode portion connected to a cathode in a part of the surface of the concave cylinder, supplies an electrolyte to a contact surface between the plate-making roll and the polishing tape, reciprocates the polishing head in the longitudinal direction of the roll surface, performs electrolytic polishing in a part of the plate-making roll corresponding to the electrode portion, and performs friction polishing in another part where an electrolytic current does not flow.

The polishing tape is an abrasive grain-fixed liquid-impregnated flexible body in which abrasive grains are fixed to a nonwoven fabric having a high frictional strength, such as scotch (スコツチブライト) (registered trademark), and electrolytic abrasive grain polishing is performed on a portion of a roll to be made corresponding to an electrode portion, and frictional abrasive grain polishing is performed on another portion where electrolytic current does not flow, or the polishing tape is a microfiber having a high frictional strength, heat resistance strength, and creep strength, such as zailon (ザイロン) (registered trademark), and electrolytic frictional polishing is performed on a portionof the roll to be made corresponding to the electrode portion, and frictional polishing is performed on another portion where electrolytic current does not flow.

The polishing head body is openable and closable, and supported at both ends by left and right open leg links which are constantly subjected to an elastic force in an open state in a state where 2 horizontal rods are separated, both ends of a polishing tape pressing strip to which a belt-shaped electrode portion is fixed to the 2 horizontal rods are stretched in a flat shape, and the polishing head body is moved relatively close to a plate-making roll by a required dimension, and by this movement, the polishing pressing strip is pressed so as to wind the polishing tape around the plate-making roll.

In the case of the variable polishing head, the scotch (スコツチブライト) and the zailon (ザイロン) make uniform sliding contact with each other over the entire length of the contact length of the roll to be made with the plate roll in the circumferential direction of the roll.

When a flexible body is impregnated with an abrasive grain fixing solution such as scotch (スコツチブライト) in which abrasive grains are fixed to a nonwoven fabric, electrolytic abrasive grain polishing is performed on a portion of a roll to be made corresponding to an electrode portion, and rough polishing is performed by simultaneously performing friction polishing on other portions through which an electrolytic current does not flow. This is applicable to polishing before copper sulfate plating, polishing after copper sulfate plating, and polishing for removing chrome plating burrs.

In the case of using a polishing tape having unfixed abrasive grains as a super fiber such as zailon (ザイロン), electrolytic friction polishing is performed on a portion of a roll to be made corresponding to an electrode portion, and friction polishing is performed on other portions where an electrolytic current does not flow, thereby performing mirror finish polishing. This method is suitable for rough machining after copper sulfate plating and grinding after semi-finishing grinding.

The polishing tape is brought into close contact with the roll to be made and pressed against the roll to be made by the polishing head, but the polishing tape and the polishing head include a separate structure and an integrated structure. Preferably, the polishing tape is moved at a low speed in the longitudinal direction thereof during the polishing process, and the polishing position of the polishing tape with respect to the roll to be produced is updated.

When the electrolytic solution is alkaline, deposition of a passivation film is observed in the case of electrolytic abrasive grain polishing by copper sulfate plating, and the electrolytic solution is made acidic in order to favorably polish the entire surface of the cylinder. The method comprises supplying an electrolyte to the surface of the roll to be made in close contact with the polishing tape during polishing, spraying a basic liquid onto the roll to be made after the polishing tape is removed from the roll to be made, spraying neutral water, and opening and closing the liquid receiving plate to prevent the basic and neutral spray water from being mixed with the acidic electrolyte.

The plate making process involves many aspects, and therefore, the best mode of the production line apparatus for carrying out the invention is divided as follows.

(plate making by laser sensitization, development and etching of plate roller with relatively straight plate type)

A process for treating a plate-making roll, which uses a used straight plate printing roll, is carried out by a series of steps including:

(1) precision machining of a blank cylinder is performed by a lathe (precision machining of a cylinder in which both ends of a roller are held by the lathe and rotated and a turning tool cuts a workpiece to a depth of about 25 to 50 μm, for example),

(2) a semi-finishing polishing in which an electrolytic abrasive grain polishing and an abrasive grain polishing are mixed by using a liquid-impregnated abrasive grain-fixed flexible body in which abrasive grains are fixed to a nonwoven fabric having a high frictional strength as typified by Scotch brazetta (スコツチブライト),

(3) copper sulfate plating using an insoluble anode (i.e., a method of rotating both ends of a nip roll at a desired speed, immersing the lower half of the roll in a copper sulfate plating solution and rotating the same, for example, for about 10 to 15 minutes to obtain a copper sulfate coating having a desired thickness), automatic control of the copper ion concentration and sulfuric acid concentration in the plating solution, and automatic metering and automatic replenishment of copper source materials such as copper oxide powder)

(4) A semi-finishing polishing in which an electrolytic abrasive grain polishing in which a flexible body is fixed by using a liquid-impregnated abrasive grain and an abrasive grain polishing are mixed,

(5) mirror polishing in which electrolytic polishing and frictional polishing using a microfiber having high frictional strength, heat-resistant strength and creep strength as represented by zaleplon (ザイロン) are mixed,

(6) a photosensitive film is coated (i.e., a film is formed by rotating the both ends of the nip roller at a desired speed, scanning the photosensitive film coating head toward one end of the roller and the other end of the roller, and uniformly coating the positive-type photosensitive agent or the negative-type photosensitive agent overflowing from the photosensitive film coating head in a shower manner on the roller to dry it),

(7) image printing is performed by a laser exposure device (the both ends of a nip roller are rotated at a desired speed, a laser head is moved close to one end of the roller and scanned toward the other end of the roller, a laser is caused to flash in accordance with image data to expose a photosensitive film to form a latent image)

(8) Alkaline development (i.e., dipping the lower half of the roller into an alkaline developer at about PH9.5 to PH12.0, rotating, and obtaining a photoresist image for a period of 45 seconds to 60 seconds),

(9) the micropores are formed by etching (i.e., the lower half of the roller is immersed in an acidic aqueous solution of copper chloride or ferric chloride and rotated, and the exposed metal surface is chemically etched in about 7 to 8 minutes to thereby form micropores),

(10) the photoresist was stripped off (the lower half of the roll was immersed in a strong alkali developer at pH12.0 to pH13.0 and rotated to dissolve and remove the photoresist image in about 1 minute),

(11) hard chromium plating, hardenable nickel alloy plating, titanium carbide film, DLC film, organic hard film, etc. to provide resistance to brushing.

(laser grinding and etching plate making for plate-making roll of relatively straight plate type)

(1) the plate falling cylinder is precisely machined by a lathe,

(2) a semi-finishing polishing in which an electrolytic abrasive grain polishing in which a flexible body is fixed by using a liquid-impregnated abrasive grain and an abrasive grain polishing are mixed,

(3) copper sulfate electroplating using insoluble anodes

(5) mirror-finish polishing in which electrolytic polishing and rubbing polishing using a microfiber are mixed,

(6) the laser grinding is formed by coating a black film,

(7) by utilizing the laser grinding of the laser grinding device,

(8) by means of the formation of the etched micro-holes,

(9) removal of black film image

(10) A hard film such as a chromium plating layer, a titanium carbide film, a DLC film, an organic hard film, or the like, which provides a brush resistance.

(electronic engraving plate-making of plate roller of relative straight plate type)

(1) the plate falling cylinder is precisely machined by a lathe,

(3) copper sulfate electroplating using insoluble anodes

(6) the micro-holes of an electronic engraving device such as a Herio-Cochinisio-gulf (ヘリオクリツシヨグラフ) and the like which drives a diamond engraving needle to engrave the micro-holes are utilized to form the micro-holes,

(7) a hard film such as a chromium plating layer, a titanium carbide film, a DLC film, an organic hard film, or the like, which provides a brush resistance.

(1) the plate falling cylinder is precisely machined by a lathe,

(3) copper sulfate electroplating using insoluble anodes

(6) by forming micropores of a powerful laser such as a YAG laser, a fiber laser, a Fertom (フエトム) second laser, or a UV laser having a good absorption rate,

(plate making by laser sensitization, development and etching of a plate roll to be produced of the plating type of the counter Barrad)

A used plate roll for reuse by peeling off a used Barrad plating is subjected to the following series of treatment steps:

(1) degreasing (e.g., rotating both ends of a nip roll at a desired speed, applying an alkali to the roll, washing with water, applying an acidic solution, neutralizing the alkali which may remain, repeating the treatment 2 times, and finally washing with water.)

(2) Coating of used photographic waste liquid (strippable surface treatment),

(3) using barred copper sulphate plating of insoluble anodes (e.g. 80-100 μm),

(5) mirror-finish polishing in which electrolytic polishing and frictional polishing using a super fiber with unfixed abrasive grains are mixed,

(6) the photosensitive film is coated and formed on the substrate,

(7) the laser exposure device is used for image printing,

(8) the alkaline development is carried out, and the alkaline development,

(9) the micro-holes are formed by etching,

(10) the photoresist is stripped off and the photoresist is stripped off,

(11) a hard film such as a chromium plating layer, a titanium carbide film, a DLC film, an organic hard film, or the like, which provides a brush resistance.

(laser grinding and etching plate-making for a plate roll to be produced of the plating type of the counter Brad)

(1) degreasing the mixture, namely degreasing the mixture,

(2) coating the used photographic waste liquid,

(3) using barred copper sulfate electroplating of an insoluble anode,

(6) the laser grinding is formed by coating a black film,

(7) by utilizing the laser grinding of the laser grinding device,

(8) the micro-holes are formed by etching,

(9) the removal of the image of the black film,

(plate making by electronic engraving of plate roller of the plating type of the relative Barrad)

(1) degreasing the mixture, namely degreasing the mixture,

(2) coating the used photographic waste liquid,

(3) using barred copper sulfate electroplating of an insoluble anode,

(laser engraving plate-making of a plate-making roll of the plating type of the relative Brad)

A used plate roll for reuse after stripping a used Brad plating layer is subjected to the following series of treatment steps:

(1) degreasing the mixture, namely degreasing the mixture,

(2) coating the used photographic waste liquid,

(3) using barred copper sulfate electroplating of an insoluble anode,

In all of the plate making methods described above, when the hard film to which the brushing resistance is applied is a chrome plating layer, plating burrs formed at the edges of the micropores are removed by semifinishing polishing in which electrolytic abrasive grain polishing and abrasive grain polishing are mixed by using an abrasive grain-fixed liquid-impregnated flexible body composed of abrasive grains fixed to a nonwoven fabric having a high frictional strength such as scotch (スコツチブライト) (registered trademark).

(example 1)

Fig. 1 shows a plan view of a platemaking plant that can be equally applied to all of the platemaking methods described above.

The apparatus shown in fig. 1 constitutes a preferred production line apparatus that allows a platemaker to cope with all orders from one production line for various processing steps that are required to cope with various orders from customers.

In particular, in the equipment configuration shown in fig. 1, a chromium plating apparatus is not provided, and instead, a production line equipment capable of performing nickel alloy electroplating, quenching, heat dissipation and cooling is provided.

The plate-making workshop comprises a robot chamber A and an electroplating chamber B.

An industrial robot 1 is disposed in a robot chamber A on a side close to a plating chamber B so as to be capable of reciprocating rotation, the industrial robot 1 has a robot hand 1a capable of holding both ends of a plate-making roll R to be processed, and an industrial robot 2 is disposed in the robot chamber A on a side away from the plating chamber B, the industrial robot 2 has a robot hand 2a capable of holding both ends of the plate-making roll R to be processed.

In the processing area of the industrial robot 1, a photosensitive film coating device 3b and a laser exposure device 4 are provided, which place a photosensitive film drying acceleration device 3a on top when coating a positive or negative photosensitive film, and the photosensitive film is coated on the roll coated mirror-polished photosensitive film, thereby sufficiently drying the photosensitive film to enable favorable development, and forming a latent image by laser exposure. An induction hardening apparatus 5 and a cooling apparatus 6 are provided in a processing area of the industrial robot 2, and the nickel alloy plating layer in place of the chromium plating layer is subjected to induction hardening, and thereafter, the nickel alloy plating layer can be cooled (cooled) and then taken out.

The 2-table turret type roller stacking devices 7A and 7B stack 2 layers of rollers in an obliquely standing circumferential arrangement, perform indexing positioning, and are located in the processing areas of both the industrial robots 1 and 2.

A relay table device 9, a polishing device 10 for semi-finishing, a polishing device 11 for mirror finishing, a photographic waste liquid coating device 12, a box stacking table 13 for stacking a box-shaped roller clamping rotary conveying device U, a degreasing device 14, a developing device 15, an etching device 16, a photoresist stripping device 17, a substrate nickel plating device 18, 2 copper sulfate plating devices 19, 2 nickel alloy plating devices20, 20 replacing chrome plating, a box assembly table device 21, and a box stacking table 22 are arranged below the row line of a stacker crane 8 arranged at the top of a plating chamber B.

The external production line includes a numerically controlled lathe 23, a roller measuring device 24, and a calibration printing machine 25, which are capable of performing precision cylinder machining for plate dropping.

The polishing apparatus 10 for semifinishing performs semifinishing polishing in which electrolytic abrasive grain polishing in which a flexible body is fixed using liquid-impregnated abrasive grains and abrasive grain polishing are mixed.

The polishing apparatus 11 for mirror finishing performs mirror finishing polishing in which electrolytic polishing and friction polishing using a microfiber with unfixed abrasive grains are mixed.

The industrial robot 2, the quenching apparatus 5, and the cooling apparatus 6 may be provided as an external production line, or the numerically controlled lathe 23 and the roller measuring apparatus 24 may be provided as an internal production line. The sandpaper polishing apparatus may be installed in a production line, but the polishing apparatus 10 for semi-finishing may also be used for removing plating burrs.

The roll R to be manufactured in the plating chamber is transported by the stacker crane 4 and the box-shaped roll clamping and rotating transport device U having 1 pair of opposed clamps.

As shown in jp 55-164095 a/jp 57-36995 a, for example, the box-shaped roller holding and rotating conveyor U clamps both ends of the roll R to be manufactured by 1 pair of opposed holding devices, seals the outer side of the holding cone, and is rotatable when placed in each device, and a plating current is passed through the holding cone asnecessary.

Instead of the stacker crane 8 and the box roller holding/turning conveyor U, a traveling industrial robot capable of reciprocating and rotating freely may be provided, which includes a robot hand capable of holding both ends of the printing roll R to be processed, and each of the devices 10 to 20 may be provided with 1 pair of opposed holding devices capable of holding both ends of the printing roll R to be processed and turning so as to allow an electroplating current to flow through a holding cone as necessary.

The apparatus shown in FIG. 1 is configured to perform the plate making methods described in (0029) and (0033) above. The plate making process of performing the plating process, then performing the semi-finish polishing, and then performing the mirror-finish polishing can also be applied to the plate making methods described in (0030), (0031), (0032), (0034), (0035), and (0036), and the plate making methods described in (0029) to (0036) above can be realized if a laser polishing apparatus, an electronic engraving apparatus, a laser engraving apparatus, or the like is provided.

(example 2)

This example describes in detail an example of copper sulfate plating using an insoluble anode, which constitutes a part of a plate making method, with reference to the drawings.

FIG. 2 shows a copper sulfate plating apparatus using an insoluble anode to which a cassette roller holding rotary conveyor apparatus substantially similar to the cassette roller automatic mounting and dismounting apparatus shown in Japanese patent publication No. 57-36995 is applied, wherein a cassette roller holding rotary conveyor apparatus U is mounted on a plating apparatus main body X to perform copper sulfate plating.

The following is a detailed description. When the box-shaped roller holding transport rotary unit U isplaced on the plating apparatus main body X, a chain 27 of a chain hitch unit which is travel-driven by a motor 26 provided on the plating apparatus main body X engages with a sprocket 29, and the sprocket 29 is fitted and fixed to a main shaft 28 on the driving side of the box-shaped roller holding transport rotary unit U.

The box-shaped roller clamping rotary conveying device U supports the conical holes at both ends of the plate-making roller R by 1 pair of energizable roller clamps 32, 33, the 1 pair of roller clamps 32, 33 are attached to the front ends of 1 pair of

spindles

28, 31 provided from both ends of the suspension frame 30 and opposed to each other, and the 1 pair of liquid-proof covers 34, 35 fitted to the

spindles

28, 31 are moved to prevent the treatment liquid from entering the roller clamps 32, 33 that are energized in contact with the end faces of the plate-making roller R.

The

spindles

28, 31 of the box-shaped roller-gripping carousel U are in contact with brushes connected to the cathodes. Therefore, the roll to be manufactured R rotated by the motor 26 is connected to the cathode. The roll R is rotated by the driving of the motor 26, and a plating current is passed between the roll R and the insoluble anode 36 to perform plating.

In the copper sulfate plating apparatus, a box-shaped roller holding rotary conveyor device U conveyed by a stacker crane is placed on a frame F of a plating apparatus main body X, a plate-to-be-formed roll R for gravure printing, which is held at both ends by the box-shaped roller holding rotary conveyor device U, is immersed in a plating solution 38 stored in a plating tank 37, an insoluble anode 36 is raised to approach the lower surface of the plate-to-be-formed roll R with a gap of 5mm to 30mm formed therebetween, ultrasonic waves are generated from an ultrasonic device 39, and a plating current larger than a normal plating current bya required amount is applied to the plate-to-be-formed roll R as an anode and the plate-to-be-formed roll R as a cathode, thereby performing copper sulfate plating.

The insoluble anode 36 supports the vicinity of both ends in the longitudinal direction to a bracket 41 connected to the lifting device 40, and when the roll to be formed R is positioned in the plating tank 37, the lifting device 40 is operated to be lifted, and the roll-facing surface approaches the lower surface of the roll to be formed R in parallel with a gap of 5mm to 30 mm. The insoluble anode 36 is secured to have a length equal to or longer than the maximum length of the roll to be made R, and the roll-facing surface is smooth. The ascending stroke of the insoluble anode 36 is calculated by inputting the diameter as data when each roll R to be manufactured is processed in the plating line. The diameter of the roller and the depth of immersion of the roller in the plating solution determine the area to be plated, so the necessary plating current can be determined according to the desired plating current density and area to be plated to the roller.

In this copper sulfate plating apparatus, the plating liquid 43 in the plating liquid replenishment tank 42 is supplied to the plating tank 37 by the plating liquid supply device 44 including a check valve type liquid raising port, a liquid raising pump, a pipe, a flow rate adjustment valve, a filter 44a, and the like, thereby replenishing the plating tank 37 with insufficient copper ions, and the filter 44a for trapping inevitable impurities is provided, thereby making it possible to prevent the occurrence of pits and pock marks due to the deposition of inevitable impurities during plating.

The plating vessel 37 of the copper sulfate plating apparatus has overflow vessels 37a at both longitudinal ends, and is configured to control the liquid level of the plating liquid in the plating vessel 37 in an overflow manner so that the roll to be manufactured R is nearly completely immersed in the plating liquid 38, and to return the overflowing plating liquid to the plating liquid replenishment vessel 42 by a liquid return device (line) 45 in a gravity flow-down manner.

The plating tank 37 may be an elevating type, instead of a fixed type as described above.

The copper sulfate plating apparatus is provided with a current totalizer, and each time the plating of 1 of the printing rolls R is started, the plating current is accumulated, and the current at the time of finishing the plating is accumulated, and at the time of finishing the plating of 1 of the printing rolls R, the necessary amount of copper-containing fine powder of copper oxide powder, copper carbonate powder, or copper sulfate powder as a copper source corresponding to consumed copper ions is measured by the automatic powder measuring and feeding device 46 and fed into the plating liquid supply tank 42, and when such feeding is repeated a plurality of times, the copper concentration of the plating liquid 43 is shifted from a management target value, so that the copper concentration of the plating liquid in the plating liquid supply tank 42 is constantly measured by the copper concentration sensor 47, and when the copper concentration sensor 47 detects that the copper concentration is insufficient, the necessary amount of copper-containing fine powder is rapidly measured by the automatic powder measuring and feeding device 46 and fed into the plating liquid supply tank 42, on the other hand, when the copper concentration sensor 47 detects that the copper concentration is not insufficient at the time of finishing the plating on 1 roll R, the automatic powder measuring and feeding device 46 does not feed the copper-containing fine powder into the plating liquid replenishment tank 42, and a double management system is provided.

In this copper sulfate plating apparatus, the sulfuric acid concentration of the plating liquid in the plating liquid replenishment tank 42 is constantly measured by the sulfuric acid concentration sensor 48, and when the sulfuric acid concentration sensor 48 detects that the sulfuric acid concentration is insufficient, the necessary amount of sulfuric acid is measured by the automatic sulfuric acid measuring and feeding device 49 at that time and is replenished into the plating liquid replenishment tank 42.

The automatic powder metering and feeding device 46 automatically measures a necessary amount of the copper-containing fine powder of the copper oxide powder, the copper carbonate powder, or the copper sulfate powder in advance, has a feeding port at a lower end, is stored in a chamber having a valve, and opens the valve when an electric signal output from a copper concentration sensor is input, and feeds the copper-containing fine powder in the chamber to the plating liquid replenishment tank.

The sulfuric acid automatic measuring and feeding device 49 automatically measures a necessary amount in advance, stores the measured amount in the feeding tank, and when an electric signal output from the sulfuric acid concentration sensor is input, opens a valve of the feeding tank to feed the necessary amount of sulfuric acid to the plating liquid replenishment tank.

The copper sulfate plating apparatus feeds a copper-containing fine powder of sulfuric acid, copper oxide powder, steel carbonate powder, or copper sulfate powder from one side of the plating liquid supply tank 42 at a desired ratio, and the copper ions (cations) are generated by stirring with the stirring apparatus 50.

The reaction formula is, for example, when copper oxide powder is used

As described above, the plating liquid is supplied from the plating liquid supply device 42 to the plating vessel 37 by the plating liquid supply device 44 including the check valve type pumping port, the pumping pump, the piping, the flow rate adjustment valve, the filter 44a for trapping inevitable impurities, and the like, so that the plating liquid is replenished into the plating vessel 37, the height of the plating liquid near the surface of the plating liquid completely immersed in the plating vessel 37 is controlled in an overflow manner, and the overflowing plating liquid is returned to the plating liquid replenishment vessel 42 by the liquid return device (piping) 45 in a gravity flow manner.

When the plating is completed, the plating liquid in the plating vessel 37 is returned to the plating liquid replenishment vessel 42 by opening the automatic opening/closing valve 52 provided in the dropping pipe 51 connecting the plating vessel 37 and the plating liquid replenishment vessel 42.

According to the above configuration, the copper ion concentration in the plating liquid can be constantly controlled to an appropriate level, and thus, a favorable copper sulfate plating can be maintained. Since no anode sludge is generated in the plating bath, no pits or depressions are formed on the surface of the copper sulfate plating layer adhered to the roll to be produced, and a beautiful copper sulfate plating layer can be formed in a short time.

(example 3)

This example describes in detail a semi-finishing polishing in which a flexible body is fixed using liquid-impregnated abrasive grains and a mirror finishing polishing of a microfiber to which abrasive grains are not fixed, which constitute a part of a plate making method, with reference to the drawings.

Fig. 3 is a plan view of a barrel polishing apparatus for performing an electrolytic polishing method of barrel polishing on a gravure printing roll to be manufactured according to the present invention, fig. 4 is a plan view, and fig. 5 is a main portion longitudinal sectional side view.

The box-shaped roller holding rotary conveyor U is placed on the apparatus body Y to perform barrel polishing. The cassette roller nip rotary transport device U has substantially the same configuration as the cassette roller automatic attaching and detaching device shown in japanese patent publication No. 57-36995. Therefore, the box roller holding/rotating conveyor U is denoted by the same reference numerals as those shown in fig. 2, and the description thereof is omitted.

When the box-shaped roller holding/rotating conveyor U is placed on the frame of the apparatus main body Y, a chain wheel 56 is engaged with a chain 54 of a chain hitch that is driven by a motor 53 provided in the apparatus main body X, and the chain wheel 56 is fitted and fixed to the main shaft 28 on the drive side of the box-shaped roller holding/rotating conveyor U.

Unlike the case of electroplating, the

spindles

28, 31 of the box-shaped roller holding rotary conveyor U are in contact with wipers 57, 58 connected to the anode. Therefore, the roll to be manufactured R rotated by the motor 53 is connected to the anode.

As shown in fig. 4, the apparatus body Y is moved by a servo motor 60 through a slider 59 guided by a linear guide 58.

For example, 2

horizontal guides

62 and 62 fixed to both end portions of the back surface of the polishing head body 61a of the polishing head 61 are fitted into guide holes of the slider 59 to be guided, and the front end of a piston rod of an air cylinder 63 having a cylinder body fixed to the slider 59 is pivotally attached to the back surface of the polishing head body 61a, whereby the polishing head61 is brought into contact with or separated from the roll-to-be-made roll R by the expansion and contraction operation of the air cylinder 63.

The apparatus body Y will be described with reference to fig. 3 again.

The apparatus main body Y includes a polishing tank 64, an electrolyte return tank 65, an electrolyte storage tank 66, a metal powder capturing filter 67, a shower pipe 68, and a liquid supply device 69, the shower pipe 68 sprays toward the polishing portion of the polishing head 61, and the liquid supply device 69 includes a one-way valve type liquid raising port, a liquid raising pump, a pipe, a flow rate adjusting valve, a filter, and the like, and supplies the electrolyte stored in the electrolyte storage tank 66 to the shower pipe 68.

An electrolyte plating solution containing pure water + sodium nitrate at 1 wt% is stored in the electrolyte storage tank 66. Then, a necessary amount of acid is added to keep the electrolyte acidic. Preferably, the pH is about 3.0.

The shower pipe 68 is supported by the polishing head body 61a and integrally reciprocates.

The polishing tank 64 is an open tank, and receives the sprayed electrolyte and returns to the electrolyte return tank 65 through a drain pipe.

The electrolyte returned to the electrolyte return tank 65 is returned to the electrolyte storage tank 66 after removing metal powder by the metal powder trap filter 67.

The polishing tank 64 is an open tank, but is provided with a drain pan which can be opened and closed freely and prevents the alkaline solution shower which neutralizes the surface of the roll after polishing and the subsequent shower of tap water or the like from falling into the polishing tank 64.

Since the metal powder returned to the electrolyte return tank 65 is substantially dissolved by the acid, an ion exchange column for capturing metal ions may be provided in the electrolyte return tank 65.

The operation will be described below.

The motor 53 provided in the apparatus main body Y is driven to rotate at a desired rotation speed by the plate-making roll R. Subsequently, the air cylinder 63 is expanded, the polishing head 61 is brought into sliding contact with the rotating roll R to be processed, and the cylindrical polishing is started, and at the same time, the pump of the liquid supply device 69 is operated, and the shower pipe 68 sprays the electrolyte toward the back surface of the polishing portion of the polishing head 61. Subsequently, the servo motor 60 is driven, and the slider 59 reciprocates in the surface length direction of the plate-making roll R from the waiting position. Both ends of the polishing head 61 of the slider 59 reciprocate, for example, to project by 50mm outward from the edge of the roll R.

Although not shown in the figure, the polishing apparatus actually includes a shower device for neutralizing and washing with water after polishing. The spraying apparatus sprays an alkaline liquid at first, neutralizes a relatively acidic electrolyte, and then sprays neutral water such as tap water. When this spraying is performed, the liquid receiving plate comes to the lower side of the plate-making roll to avoid mixing of the electrolytic water sprayed during the grinding.

The polishing head 61 is described in detail below.

As shown in FIG. 5(a), in the polishing head 61, 1 pair of brackets 61b are provided on both side portions of the front surface of the polishing head body 61a, upper and lower

open leg links

61c, 61c are pivotally supported by the respective brackets 61b, and gears 61d, 61d fixed to both side base portions of the

open leg links

61c,61c on the respective sides are externally engaged with each other, the upper and lower

open leg links

61c, 61c are swung to a maximum opened state by a spring 61e and a stopper member 61f, both ends of a horizontal rod 61g are supported between the tip portions of the upper open leg link 61c and between the tip portions of the lower open leg link 61c, a polishing tape pressing bar 61h made of a mesh material is fixed to the 2

horizontal rods

61g, 61g is opened in a planar shape, a belt-like electrode portion 61i is attached to the middle of the polishing tape pressing bar 61h, and a rubber plate 61i, a rubber plate, and a rubber plate are attached to, 61k

The polishing head 61 includes a polishing tape 61m disposed in close contact with the electrode portion 61i and the

rubber plates

61j, 61 k.

The polishing tape 61m is a liquid-impregnated abrasive grain-fixed flexible body in which abrasive grains are fixed to a nonwoven fabric having a high frictional strength, such as scotch (スコツチブライト), or a super fiber having a high frictional strength, a high heat resistance, and a high creep strength, such as zailon (ザイロン).

When the polishing tape 61m is a flexible body in which abrasive grains are fixed by liquid-impregnated, it is formed in a large loop when viewed from the lateral direction, and it is transported in a rotation opposite to the rotation of the roller during the polishing process, so that the metal powder and free abrasive grains clogged in the mesh are washed away by the electrolyte solution in the lower portion without polishing one portion. The device for running the polishing tape 61m is not shown. Suitable delivery means may be employed.

When the abrasive belt 61m is a flexible body fixed with liquid-impregnated abrasive grains, it is conveyed from the lower side to the upper side. Similarly, although notshown in detail in the drawings, in practice, for example, a winding tube is sandwiched between lower sandwiching devices, a liquid-impregnated abrasive grain fixing flexible body is wound around the winding tube, a torque is applied in a rotation direction of winding the liquid-impregnated abrasive grain fixing flexible body around the winding tube by a torque motor connected to the winding tube, the liquid-impregnated abrasive grain fixing flexible body fed out from the winding tube is sandwiched between a driving roller and a sandwiching roller above an upper horizontal bar 61g, and is wound around the winding tube for winding against energization of the torque motor.

In the state shown in fig. 5(a), the polishing head 61 is in the standby position and the upper and lower

open links

61c, 61c are maximally opened, and in the state shown in fig. 5(b), the cylinder device 63 is extended, the polishing tape 61m of the polishing head 61 is brought into close contact with the roll to be manufactured R, and the upper and lower

open links

61c, 61c are closed and stopped in proximity to the roll to be manufactured R, thereby performing polishing.

In the state shown in fig. 5(c), the grinding belt 61m is brought into close contact with the small-diameter roll R, and the upper and lower open-

leg links

61c and 61c are closed and stopped so as to be separated from the roll R, thereby performing grinding, with respect to the small-diameter roll R.

As shown in fig. 5(b) and 5(c), the shower pipe 68 shown in fig. 3 and 4 is provided outside the upper open link 61c and the lower open link 61d, and the shower liquid is directed toward the electrode portion 61i behind the polishing tape pressing bar 61 h.

The grinding theory is explained below.

By supplying the electrolytic solution to the surface of the roll R in close contact with the polishing tape 61m and reciprocating the polishing head 61 in the longitudinal direction of the roll surface, the polishing tape 61m is reciprocated in the longitudinal direction of the roll surface, electrolytic polishing is performed on the portion of the roll R corresponding to the electrode portion 61i, and friction polishing is performed on the other portion where the electrolytic current does not flow. The polishing tape 61m moves in the longitudinal direction thereof at a slow speed, and the polishing position of the polishing tape 61m with respect to the roll R to be manufactured is updated, thereby maintaining a good polishing condition.

When the polishing tape 61m is a liquid-impregnated abrasive grain-fixing flexible body in which abrasive grains are fixed to a nonwoven fabric having a high frictional strength, such as scotch (スコツチブライト) (registered trademark), electrolytic abrasive grain polishing is performed on a portion of the roll R corresponding to the electrode portion 61i, and frictional abrasive grain polishing is performed on other portions (rubber covering portions) 61j, 61k where an electrolytic current does not flow, thereby performing rough polishing or removal polishing of chrome plating burrs.

When the polishing tape 61m is a microfiber having high friction strength, heat resistance strength, and creep strength such as zailon (ザイロン) (registered trademark), electrolytic friction polishing is performed on a portion of the roll R corresponding to the electrode portion 61i, and friction polishing is performed on other portions (rubber covering portions) 61j and 61k where the electrolytic current does not flow, thereby performing mirror finishing polishing.

The polishing tape pressing strip 61h functions to wind the polishing tape 61m around the roll R and press the same.

In the polishing using the Scotch-Blatia-pad (スコツチブライト), the peripheral speed of the roll to be made is 200rpm, the speed of the electrode in the roll surface longitudinal direction is 300 to 400mm/sec, and the current density is 0.025A/cm²Pressure of 150g/cm²When the grinding is performed under such conditions, good semi-finish grinding can be performed.

After the polishing with scotch (スコツチブライト), the polishing with zaleplon (ザイロン) was performed. In the polishing using the zailon (ザイロン), the peripheral speed of the roll to be produced is 200rpm, the speed of the electrode in the longitudinal direction of the roll surface is 300 to 400mm/sec, and the current density is 0.025A/cm²At a pressure of 200g/cm²When polishing is performed under such conditions, good mirror finish polishing can be performed.

When the production line is installed, it is preferable to divide the apparatus into a cylinder polishing apparatus for performing rough cylinder polishing by rubbing with an abrasive grain-fixed liquid-impregnated flexible body composed of fixed abrasive grains in a nonwoven fabric having a high frictional strength, such as scotch (スコツチブライト) (registered trademark), and a cylinder polishing apparatus for performing mirror polishing by rubbing with a polishing tape of unfixed abrasive grains as a super fiber.

The polishing head may have a plate-to-be-manufactured roll longer by, for example, 100mm than the maximum length (about 1300 mm), and the entire length of the polishing head may be simultaneously brought into contact with the polishing head to perform polishing even when the reciprocation stroke for polishing the polishing head is about 100mm, or the polishing head may have a length substantially the same as that of a plate-to-be-manufactured roll having the minimum length (about 500 mm), and the reciprocation stroke for polishing the polishing head with respect to the plate-to-be-manufactured roll having the minimum length (about 500 mm) may be about 100mm, and the reciprocation stroke for the polishing head at the time of polishing with respect to the plate-to-be-manufactured roll having the maximum.

The roll to be produced is sandwiched between both ends thereof and is configured to be rotated while being connected to the anode. Both the polishing head for polishing the rough cylinder and the polishing head for polishing the mirror surface are variable polishing heads having a backup function of obtaining a large contact angle between the starchy-bravain (スコツチブライト) and the zailon (ザイロン) and the plate-to-plate roll for gravure printing of various sizes in a range of, for example, 80mm to 300mm in diameter.

When a flexible body is impregnated with an abrasive grain fixing liquid such as scotch (スコツチブライト) in which abrasive grains are fixed to a nonwoven fabric, electrolytic abrasive grain polishing is performed on a portion of a roll to be made corresponding to an electrode portion, and rough polishing is performed by performing friction polishing simultaneously on other portions where electrolytic current does not flow. This is applicable to polishing before copper sulfate plating, polishing after copper sulfate plating, and polishing for removing chrome plating burrs.

In the case of using a polishing tape having unfixed abrasive grains as a super fiber such as zailon (ザイロン), electrolytic friction polishing is performed on a portion of a roll to be made corresponding to an electrode portion, and friction polishing is performed on other portions where an electrolytic current does not flow, thereby performing mirror finish polishing. This is applicable to rough machining after copper sulfate plating and grinding after semi-finishing grinding.

The polishing tape is brought into close contact with the roll to be made and the roll to be made is pressed by the polishing head. Preferably, the polishing tape is moved at a low speed in the longitudinal direction thereof during the polishing process, and the polishing position of the polishing tape with respect to the roll to be produced is updated.

When the electrolytic solution is alkaline, deposition of a passivation film is observed in the case of electrolytic abrasive grain polishing by copper sulfate plating, and the electrolytic solution is acidic in order to favorably polish the entire surface of the cylinder. The method comprises supplying an electrolyte to the surface of the roll to be made in close contact with the polishing tape during polishing, spraying a basic liquid onto the roll to be made after the polishing tape is removed from the roll to be made, spraying neutral water, and opening and closing the liquid receiving plate to prevent the basic and neutral spray water from being mixed with the acidic electrolyte.

The polishing head body is not limited to the structure shown in example 3.

Alternatively, a 2-head type apparatus may be configured by holding a plate-making roll to be polished so that a 1 st polishing head for rough processing, on which a scotch (スコツチブライト) is superimposed, and a 2 nd polishing head for mirror processing, on which a zakilon (ザイロン) is superimposed, are opposed to each other, and cylindrical polishing of the plate-making roll for gravure printing may be performed by the 2-head type apparatus. Alternatively, the polishing may be performed by switching the scotch (スコツチブライト) and zailon (ザイロン) in a 1-head type apparatus.

The present invention may be provided with a device for clamping both ends of a plate-making roll to rotate at a desired rotation speed in a grinding device body without using a box-shaped roll clamping rotary conveying device, and connecting the plate-making roll to an anode.

The present invention is not limited to the configuration in which the box-shaped roller clamping and rotating conveyor U is placed on the apparatus main body Y to perform barrel polishing. The apparatus main body Y may include 1 pair of clamping/rotating devices that clamp the roll to be manufactured and rotate while being connected to the anode, and the roll to be manufactured may be transferred between the industrial robots.

The present invention can perform mirror finishing polishing after copper sulfate plating and before forming micropores in a polishing machine in a shorter time than the polishing time of a grinding wheel polishing machine, and can be applied to removal of chrome plating burrs generated when forming micropores and forming a hard plating layer.

The present invention is not limited to rough finishing and mirror finishing of a plate-making roll to be plated with copper, and grinding of chromium plating burrs to be madeafter removal of fine pores and formation of a hard plating layer. In the plate making, there are a method of forming a zinc plating layer on a plate-making roll, performing cylindrical polishing, performing laser engraving, and re-plating chromium, and a method of forming a nickel plating layer on a plate-making roll, performing cylindrical polishing, and forming fine holes by various methods.

Claims

1. A plating and grinding method for a plate-making roll before forming micropores, wherein copper sulfate plating is performed on the plate-making roll, and then grinding is performed to form a mirror-finished state; the method is characterized in that:

2. A plating and grinding method of a plate-making roller before forming micropores, copper sulfate plating is carried out on the plate-making roller, then semi-finish grinding is carried out, and then mirror finishing grinding is carried out; the method is characterized in that:

in the semi-finishing polishing, both ends of a plate-making roll are rotatably supported and connected to an anode to rotate, a polishing head body has a concave cylindrical surface and an electrode portion connected to a cathode in a part of the concave cylindrical surface, a liquid-impregnated abrasive particle fixing flexible body in which abrasive particles are fixed to a nonwoven fabric having a high frictional strength is hung on the polishing head body, the liquid-impregnated abrasive particle fixing flexible body is brought into close contact with the plate-making roll, the plate-making roll is pressed against the concave cylindrical surface, an electrolyte is supplied to a contact surface between the plate-making roll and a polishing tape, and the polishing head is reciprocated in a longitudinal direction of the roll surface to reciprocate the polishing tape in the longitudinal direction of the roll surface, electrolytic polishing is performed on a portion of the roll to be produced corresponding to the electrode portion, and rubbing polishing is performed on the other portion where the electrolytic current does not flow, thereby performing semi-finishing grinding by grinding in which electrolytic abrasive grain grinding using a grinding belt and abrasive grain grinding are mixed;

in the mirror finishing polishing, both ends of a roll to be manufactured are rotatably supported and connected to an anode to rotate, a polishing head body has a concave cylindrical surface and an electrode portion connected to a cathode in a part of the concave cylindrical surface, a flexible microfiber having a required width and being attached to the polishing head body is brought into close contact with the roll to be manufactured, the microfiber is pressed against the roll to be manufactured by the concave cylindrical surface, an electrolytic solution is supplied to a contact surface between the roll to be manufactured and the microfiber, the polishing head is reciprocated in a longitudinal direction of the roll surface to reciprocate the microfiber in the longitudinal direction of the roll surface, electrolytic polishing is performed in a part of the roll to be manufactured corresponding to the electrode portion, and friction polishing is performed in another part where an electrolytic current does not flow, thereby performing a mirror finishing polishing processin which electrolytic polishing and friction polishing are mixed using the microfiber.

3. The plating and grinding method for a plate roll before forming minute holes according to claim 1 or 2, characterized in that: in the copper sulfate plating, a plating solution capable of performing copper sulfate plating is stored in a plating solution replenishment tank, and the plating solution is formed by adding copper-containing fine powder of copper oxide powder, copper carbonate powder, or copper sulfate powder to sulfuric acid, and after inevitable impurities in the plating solution are removed by a filter, the plating solution is supplied to a plating tank having an insoluble anode to perform plating.

4. The plating and grinding method for a roll to be produced before forming minute holes according to claim 3, characterized in that: the copper concentration of the plating liquid in use is measured, and when the copper concentration is insufficient, or when the plating treatment is performed for 1 roll to be manufactured, the accumulated plating current value is measured, and the necessary amount of the copper-containing fine powder is automatically replenished every time the plating treatment is finished.