CN1715958A - The manufacture method of optical module and device - Google Patents
The manufacture method of optical module and device Download PDFInfo
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- CN1715958A CN1715958A CN 200410027935 CN200410027935A CN1715958A CN 1715958 A CN1715958 A CN 1715958A CN 200410027935 CN200410027935 CN 200410027935 CN 200410027935 A CN200410027935 A CN 200410027935A CN 1715958 A CN1715958 A CN 1715958A
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- Prior art keywords
- optical module
- substrate
- mould
- manufacture method
- preformed member
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Abstract
A kind of manufacture method of optical module, it may further comprise the steps: make first substrate, this substrate is a mould; Second substrate is provided, and this substrate is a preformed member; Mould and preformed member are heated to the transition temperature of preformed member with the infrared ray quartz heater; Mould is placed the preformed member top, and the pressure that adopts water vapor to produce carries out the hot padding moulding to preformed member; Cooling, UV cured, die sinking forms optical module.The device of making this optical module is provided simultaneously.
Description
[technical field]
The invention relates to a kind of manufacture method of optical module and make the used device of this optical module.
[background technology]
In recent years, be widely used in the optical module in the optical head fields such as (Pick-Up Head) of hand-set digit camera, DVD, mainly developed and two kinds of forming methods.Wherein a kind of method be adopt with frit preformed to have to a certain degree surface accuracy and the glass blank of profile, be placed on then in the mould with predetermined surface precision, the optical module that mold pressing obtains having the certain surface structure is carried out in heating, does not need to carry out processing such as grinding and polishing.
On November 17th, 1984 a kind of optical module that disclosed Japanese patent application is disclosed for 59-203732 number manufacture method in, frit is placed in the anchor clamps, be heated to temperature corresponding to viscosity be 105.5 to 107 minutes the pool temperature value.But following problem can take place this method: mold temperature is higher, and mould and glass contact time are long, the surface of easy mold damage, thus the glass degree of accuracy is lower, and the low while of efficient also consumes the more energy.
Another kind method is to adopt plastic material, the United States Patent (USP) the 5th that on November 24th, 1998 was announced, disclose for 840, No. 352 in a kind of manufacture method of lens, it is to utilize injection molding method (Injection Molding) that plastic material is formed Fresnel (Fresnel) lens.But utilize this kind method in the process of high-temperature molding, have residual stress to produce easily, especially when the size of lens is big more, cause the lens buckling deformation easily more.So the optical texture degree of accuracy that the method forms is poor, be difficult for accurately duplicating.
[summary of the invention]
In order to overcome prior art optical assembly manufacturing method cost height, efficient is low and degree of accuracy is low problem, the invention provides the optical assembly manufacturing method that a kind of cost is low, efficient is high and degree of accuracy is high.
In order to overcome prior art optical module manufacturing installation cost height, efficient is low and degree of accuracy is low problem, the invention provides the optical module manufacturing installation that a kind of cost is low, efficient is high and degree of accuracy is high.
Optical assembly manufacturing method provided by the invention may further comprise the steps: make first substrate, this substrate is a die substrate; Second substrate is provided, and this substrate is a preformed member; Mould and preformed member are heated to the transition temperature of preformed member with the infrared ray quartz heater; Mould is placed the preformed member top, and the pressure that adopts water vapor to produce carries out the hot padding moulding to preformed member; Cooling, UV cured; Die sinking forms optical module.
A kind of optical module manufacturing installation provided by the invention comprises a mould open/close device, a pressurization power source, two heating arrangements, temperature control system (figure does not show), pumped vacuum systems and curing system and is positioned at a mould rest area of this mould open/close device inside, a substrate rest area relative with this mould rest area.Wherein, the pressurization power source adopts water vapor, and heating arrangement adopts the infrared ray quartz heater, adopts UV cured technology after the hot pressing.
Compared to existing technology, the invention has the beneficial effects as follows: because the pressure that optical assembly manufacturing method of the present invention and device adopt water vapor to produce carries out mold pressing, thereby uniform pressure can produce high precision face shape and duplicate, and do not need operation at high temperature as prior art, energy savings simultaneously.Thereby this optical assembly manufacturing method and device are made, and the optical module cost is low, efficient is high and degree of accuracy is high.
[description of drawings]
Fig. 1 is an optical assembly manufacturing method process flow diagram of the present invention.
Fig. 2 is the first substrate photoresistance coating synoptic diagram of optical assembly manufacturing method of the present invention.
Fig. 3 is first base plate exposure, the development synoptic diagram of optical assembly manufacturing method of the present invention.
Fig. 4 is the first substrate etching substrates synoptic diagram of optical assembly manufacturing method of the present invention.
Fig. 5 is that the first substrate photoresistance of optical assembly manufacturing method of the present invention is peeled off synoptic diagram.
Fig. 6 is the hot-forming synoptic diagram of optical assembly manufacturing method of the present invention.
Fig. 7 is the optical module stereographic map of optical assembly manufacturing method gained of the present invention.
[embodiment]
Seeing also Fig. 1, is the process flow diagram of optical assembly manufacturing method of the present invention.The manufacture method of optical module of the present invention may further comprise the steps: make first substrate, this substrate is a mould (step 101); Second substrate is provided, and this substrate is a preformed member (step 102); Mould and preformed member are heated to the transition temperature (step 103) of preformed member with the infrared ray quartz heater; Mould is carried out hot padding moulding (step 104) in the preformed member top with the pressure that water vapor produces; Cooling, die sinking forms optical module (step 105).
Seeing also Fig. 2 to Fig. 5, is that first substrate 30 of optical assembly manufacturing method of the present invention is made flow process (step 101), and wherein, the material of this first substrate 30 is a silicon, also can be glass, and it is shaped as rectangle.
It may further comprise the steps: first substrate 30 is arranged at carries out dewatering roast in vacuum or the nitrogen environment, baking temperature is 100 ℃～120 ℃, and the time is 4～6 minutes.On this first substrate 30, evenly be coated with a photoresist layer 600, as shown in Figure 2.Wherein, the photoresistance of coating is organic photoresist material, can adopt positive photoresist or negative photoresist.Present embodiment is to adopt negative photoresist.The method of coating photoresistance adopts spin coating method, also can adopt spraying method.First substrate 30 of coated photoresist layer 600 is placed heated baking on the backing plate, promptly soft roasting.Wherein, baking temperature is 90 ℃～100 ℃, and stoving time is 20～30 minutes.
As shown in Figure 3, utilizing in advance, the light shield of layout (figure does not show) exposes, development step.The light shield of pre-designed pattern is aimed at first substrate 30, carried out step of exposure.Wherein, the light source of exposure is a ultraviolet light source, adopts the exposure of projection exposure technology, and promptly this light shield is parallel to first substrate 30.The light that light source sends sees through light shield and exposes on the photoresist layer 600, is subjected to the photoresistance generation photosensitized reaction of irradiate light, generates the composition that is not soluble in developer solution.After the exposure first substrate 30 is placed heated baking on the backing plate, promptly roasting firmly, photoresistance is further hardened, make its exposed portion 640 separate than indissoluble.Wherein, baking temperature be 100 ℃～120 ℃ between, stoving time is 20～30 minutes.Carry out development step, the photoresistance pattern that is designed in advance.Spray developing liquid on first substrate 30, wherein, developer solution is a dimethylbenzene, and this first substrate 30 remained static 30～60 seconds, makes the photoresistance of unexposed portion fully be dissolved in developer solution, then the design transfer of light shield is to photoresist layer 600.
As shown in Figure 4, adopt dry-etching method that this first substrate 30 is carried out etching.Dry-etching method can be to splash etching (Sputtering Etching), ion beam milling (Ion Etching), plasma etching (Plasma Etching) or reactive ion etching (Reactive Ion Etching) etc.Present embodiment adopts reaction ionic etching method.First substrate 30 is placed in the reaction chamber (figure does not show), and voltage is 300～500V, and indoor vacuum tightness is 10
-1～10
-3Torr, wherein, gaseous ion can be chloride, as phenixin (CCl
4), boron chloride (BCl
3) or chlorine (Cl
2).Because gaseous ion is quickened bombardment to first substrate, 30 surfaces by electric high pressure, first substrate, 30 surfaces are not removed by bombardment by the photoresistance cover part, and the part that exposed portion 640 covers first substrate, 30 surfaces is protected, and forms specific pattern.
As shown in Figure 5, the exposed portion 640 of first substrate, 30 surperficial photoresistances is peeled off.After exposed portion 640 has been removed, obtain being used to make first substrate 30 of light guide plate, the pattern on these first substrate, 30 surfaces, promptly in advance the design pattern, consistent with mask pattern, be optical texture 32, this optical texture 32 can be optical grating construction or lattice point structure, pattern is a lattice point structure in the present embodiment, and it is shaped as cylindric.
One second substrate 40 (step 102) is provided, its material be polymethylmethacrylate (Polymethyl Methacrylate, PMMA).
As shown in Figure 6, one optical module manufacturing installation 50 is provided, this optical module manufacturing installation 50 comprises a mould open/close device 51, a pressurization power source 55, two heating arrangements 56, temperature control system (figure does not show), pumped vacuum systems 57 and curing system 58, and is positioned at a mould rest area 52 of this mould open/close device inside, a substrate rest area 54 relative with this mould rest area.Wherein this pressurization power source 55, two heating arrangements 56, curing system 58 are positioned at this mould open/close device 51 inside.Wherein should adopt water vapor to drive by pressurization power source 55, this heating arrangement 56 adopts the infrared ray quartz heater, and this curing system 58 adopts ultraviolet curing device.
Wherein, these mould open/close device 51 usefulness are pneumatic, hydraulic pressure or mechanical mode open closed mould, so that put into glass preformed member and the optical module that takes out completion; Temperature control system adopts thermopair, optical pyrometer or other attemperating unit; The present invention simultaneously can work under vacuum and two kinds of environment of air, when need one forming room in a vacuum, i.e. and a clear glass outer cover or have the confined space of the metal housing of transparent window that the space of vacuum space or filling with inert gas is provided; The present invention should pressurize and further comprise a circulation system (figure does not show) in the power source 55, and this system comprises to be injected and two parts of exhaust, and resource is made full use of.
(step 103) as shown in Figure 6 starts mould open/close device 51, and first substrate 30 that above-mentioned steps is made places the mould rest area 52 of this optical module manufacturing installation 50, second substrate 40 placed the substrate rest area 54 of this optical module manufacturing installation 50.In pressurization power source 55, inject hot water or water vapor, temperature by temperature control system control hot water or water vapor, open heating arrangement 56 heating second substrate 40, and guarantee that the water vapor in the pressurization power source 55 can not cool off fast, as the temperature T 0 arrival polymethylmethacrylate transition temperature T of second substrate 40
gIn the time of=108 ℃, this first substrate 30 and apply pressure to this second substrate 40 (step 104) descends.Close heating arrangement 56, start the stimulation that ultraviolet curing device 58, the second substrates are subjected to ultraviolet light source, (be shorter than 1 second) at the utmost point in the short time and produce the gummed sclerosis.Start the exhaust system in the pressurization power source 55, the steam continuation heating of cooling is ready for next flow process, in cooling channel 582, feed water or air subsequently, with these second substrate, 40 coolings.After 40 coolings of this second substrate this first substrate 30 is removed, promptly obtain optical module 70 as shown in Figure 7, a surperficial tool optical texture 72 of this optical module 70, this optical texture 72 are that optical texture 32 transfer printings by this first substrate 30 obtain (step 105).
Because optical assembly manufacturing method of the present invention and mould thereof adopt water vapor pressure, thereby pressure is even, can produce high precision face shape and duplicate, simultaneously owing to adopt the quartzy heating of infrared ray, can transient heating, long-time operation at high temperature expends the energy unlike prior art.Thereby the present invention makes that the optical module cost is low, efficient is high and degree of accuracy is high.
Optical assembly manufacturing method of the present invention is not limited to first embodiment, wherein, can start pumped vacuum systems 57 to 10
-6Torr after second substrate transfer printing success, turns off pumped vacuum systems 57, charges into nitrogen in forming room, makes internal pressure greater than atmospheric pressure, starts mould open/close device 51 then, takes out optical module 70.The material of this second substrate can also be methacrylic resin, polyacrylic resin, polycarbonate or polyvinyl resin; The present invention also can once put into the polylith mould, extrudes the polylith optical module simultaneously.
Claims (13)
1. optical assembly manufacturing method, it may further comprise the steps: make first substrate, this substrate is a mould; Second substrate is provided, and this substrate is a preformed member; Adopt the infrared ray quartz heater to be heated to the transition temperature of preformed member on mould and preformed member; Mould is placed the preformed member top, and the pressure that adopts water vapor to produce carries out the hot padding moulding to preformed member; Cooling, UV cured, die sinking forms optical module.
2. the manufacture method of optical module according to claim 1, it is characterized in that: the material of this first substrate is silicon or nickel.
3. the manufacture method of optical module according to claim 1 is characterized in that: when making first substrate, comprise the step that is coated with an even photoresist layer.
4. the manufacture method of optical module according to claim 3 is characterized in that: this coating one even photoresist layer is to adopt spraying method.
5. the manufacture method of optical module according to claim 3 is characterized in that: this coating one even photoresist layer is to adopt spin coating method.
6. the manufacture method of optical module according to claim 3, it is characterized in that: the photoresistance of coating is positive photoresist or negative photoresist.
7. the manufacture method of optical module according to claim 3 is characterized in that: further comprise a dewatering roast step, this step is positioned at before the coating photoresist layer step.
8. the manufacture method of optical module according to claim 3 is characterized in that: further comprise a soft roasting step, this step is positioned at after the coating photoresist layer step.
9. optical module manufacturing installation, comprise a mould open/close device, pressurization power source, two heating arrangements, temperature control system, pumped vacuum systems, a curing system and be positioned at a mould rest area of this mould open/close device inside, a substrate rest area relative with this mould rest area, wherein should adopt water vapor to drive by the pressurization power source, this heating arrangement adopts the infrared ray quartz heater, and this curing system adopts ultraviolet curing device.
10. optical module manufacturing installation according to claim 9 is characterized in that: in this pressurization power source a circulation system is arranged.
11. optical module manufacturing installation according to claim 10 is characterized in that: the circulation system of this optical module manufacturing installation is formed by injecting with two parts of exhaust.
12. optical module manufacturing installation according to claim 9 is characterized in that: this temperature control system comprises a thermopair.
13. optical module manufacturing installation according to claim 9 is characterized in that: this temperature control system comprises an optical pyrometer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100279355A CN100405085C (en) | 2004-06-28 | 2004-06-28 | Method and device for producing optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100279355A CN100405085C (en) | 2004-06-28 | 2004-06-28 | Method and device for producing optical module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1715958A true CN1715958A (en) | 2006-01-04 |
| CN100405085C CN100405085C (en) | 2008-07-23 |
Family
ID=35821957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100279355A Expired - Fee Related CN100405085C (en) | 2004-06-28 | 2004-06-28 | Method and device for producing optical module |
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| Country | Link |
|---|---|
| CN (1) | CN100405085C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101318286B (en) * | 2008-07-03 | 2010-06-02 | 温州宏丰电工合金有限公司 | Method of manufacturing penetration type side direction composite board band and mould hot-press arrangement thereof |
| CN101282370B (en) * | 2007-04-04 | 2011-05-18 | 比亚迪股份有限公司 | Mobile phone shell and preparation method thereof |
| CN115373232A (en) * | 2022-10-24 | 2022-11-22 | 无锡邑文电子科技有限公司 | Wafer photoresist stripping equipment and method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5840352A (en) * | 1993-09-06 | 1998-11-24 | Fuji Photo Film Co., Ltd. | Fresnel lens manufacturing apparatus |
| US20040036201A1 (en) * | 2000-07-18 | 2004-02-26 | Princeton University | Methods and apparatus of field-induced pressure imprint lithography |
| DE19819761C2 (en) * | 1998-05-04 | 2000-05-31 | Jenoptik Jena Gmbh | Device for separating a shaped substrate from an embossing tool |
| US6350360B1 (en) * | 2000-04-07 | 2002-02-26 | Sandia Coroporation | Method of fabricating a 3-dimensional tool master |
| CN1478642A (en) * | 2002-08-30 | 2004-03-03 | 张哲豪 | Gas subfebrile temperature in pression shaping method |
-
2004
- 2004-06-28 CN CNB2004100279355A patent/CN100405085C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101282370B (en) * | 2007-04-04 | 2011-05-18 | 比亚迪股份有限公司 | Mobile phone shell and preparation method thereof |
| CN101318286B (en) * | 2008-07-03 | 2010-06-02 | 温州宏丰电工合金有限公司 | Method of manufacturing penetration type side direction composite board band and mould hot-press arrangement thereof |
| CN115373232A (en) * | 2022-10-24 | 2022-11-22 | 无锡邑文电子科技有限公司 | Wafer photoresist stripping equipment and method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100405085C (en) | 2008-07-23 |
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