CN1707615A

CN1707615A - Producing method for sliding device of thin film magnetic head

Info

Publication number: CN1707615A
Application number: CN 200510075578
Authority: CN
Inventors: 佐佐木芳高
Original assignee: TDK Corp
Current assignee: TDK Corp
Priority date: 2000-02-22
Filing date: 2001-01-02
Publication date: 2005-12-14
Anticipated expiration: 2021-01-02
Also published as: JP3914366B2; CN100350456C; JP2001236619A

Abstract

The method for manufacturing the slider is provided with a stage for forming an air bearing face to base materials for slider including a thin film magnetic head element and a stage for partially etching the air bearing face so that the part corresponding to the thin film magnetic head element of the air bearing face forms the same face as the other part or is disposed at the position nearer to a recording medium than that of the other part.

Description

The manufacture method of sliding device of thin film magnetic head

The application is that application number is 01101358.3, the applying date is January 2 calendar year 2001 and denomination of invention dividing an application for the application of " manufacture method of sliding device of thin film magnetic head ".

Technical field

The present invention relates to have the medium opposed faces relative and be configured near the manufacture method of the sliding device of thin film magnetic head of the thin film magnetic head element the medium opposed faces with recording medium.

Background technology

In recent years, follow the raising of the area recording density of hard disk unit, require to improve the performance of thin-film head.As thin-film head, be extensive use of composite type thin-film magnetic head, the record-header that this composite type thin-film magnetic head will have the induction type electromagnetic transformation element of the usefulness of writing constitutes with the stacked back of the reproducing head of magnetic resistance (the following MR (Magnetoresistive) that the is called again) element with the usefulness of reading.As the MR element, the AMR element that utilizes anisotropic magnetoresistive (not only following be called AMR (AnisotrpicMagnetoresistive)) effect is arranged and use the GMR element of huge magnetic resistance (following but also be called GMR (Giant Magnetoresistive)) effect, used the reproducing head of AMR element to be called the AMR head or singly to be called the MR head.The AMR head is used as record surface density and surpasses 1G bit/(inch) ²Reproducing head, the GMR head is used as record surface density and surpasses 3G bit/(inch) ²Reproducing head.In recent years, nearly all use the GMR head.

As the method that improves the reproducing head performance, have the MR film is become amr film to the method for high material such as the magneto resistive sensitivity of gmr film etc. with optimize the graphic width of MR film, the i.e. method such as track width and MR height of resetting.MR highly be only from the end of MR air-bearing surface one side to the length (highly) of the end of an opposite side.In addition, air-bearing surface is meant the face relative with magnetic recording medium of thin-film head.

On the other hand, follow the raising of reproducing head performance, also require to improve the performance of record-header.For the area recording density in the performance that improves record-header, be necessary to improve recording track density.For this reason, be necessary to realize the record-header of narrow track structure, make with the record gap layer be clipped in the middle thereon the width of air-bearing surface of the bottom magnetic pole that forms down and upper magnetic pole be several microns to sub-micrometer scale.Above-mentioned width is one of the principal element of the performance of decision record-header.In order to reach above-mentioned narrow track structure, used semiconductor processing technology.In addition, as the other factors of decision record-header performance, graphic width is arranged, especially throat's height (Throat Height) arranged.Throat highly be meant 2 magnetic pole layers through the opposed part of record gap layer, be pole parts from the end of air-bearing surface to the length (highly) of the end of an opposite side.In order to improve the performance of record-header, wish to dwindle throat's height.This throat's height is added the amount of grinding decision in man-hour by air-bearing surface.

Like this, in order to improve the performance of thin-film head, it is very important that record-header and reproducing head are formed evenly.

As the desired condition of the thin-film head that can realize high density recording, for reproducing head, the playback of dwindling track width is arranged, increase and reset output and reduce noise etc., for record-header, have and dwindle recording track, improve and improve non-linear transition shift (Non-lineat transition shift) characteristic etc. as the rewriting characteristic of the characteristic when the region overlapping that recording medium is write data writes data.

The float type thin-film head general using of uses such as hard disk unit is made of the slider that has formed thin film magnetic head element in rearward end.The slider utilization makes it float over the surface of recording medium because of the airflow that the recording medium rotation produces.

Here, with reference to Figure 23 A to Figure 26 A, Figure 23 B to Figure 26 B and Figure 27 the example of manufacture method of the thin film magnetic head element of correlation technique is described.Have, Figure 23 A represents the cross section vertical with air-bearing surface to Figure 26 A again, and Figure 23 B represents the cross section parallel with the air-bearing surface of pole parts to Figure 26 B.

In this manufacture method, at first, shown in Figure 23 A and Figure 23 B, for example, by aluminium oxide carbonization titanium (Al ₂O ₃TiC) on the substrate 101 of Xing Chenging, deposit for example form about about 5～10 μ m of thickness by aluminium oxide (Al ₂O ₃) insulation course 102 that forms.Next, the lower shield 103 that the reproducing head that formation is formed by magnetic material on insulation course 102 is used.

Secondly, thickness is 100～200nm for example to utilize sputter for example to form on lower shield 103.The bottom shield gap film 104 that forms by insulating material such as aluminium oxide.Secondly, on bottom shield gap film 104, forming thickness is the playback MR element 105 of tens nm.Secondly, on bottom shield gap film 104, form a pair of electrode layer 106 that is electrically connected with MR element 105.

Secondly, at bottom shield gap film 104, MR element 105 with above the electrode layer 106, for example utilize sputter to form the top shielding interstitial membrane 107 that forms by insulating material such as aluminium oxide, and MR element 105 is embedded in the shield gap film 104,107.

Secondly, on top shielding interstitial membrane 107, the thick top shielding layer of about 3 μ m that forms the reproducing head that constitutes by magnetic material and these two usefulness of the record-header lower magnetic pole (following note is made lower magnetic pole) 108 of holding concurrently.

Secondly, shown in Figure 24 A and Figure 24 B, on lower magnetic pole 108, forming by dielectric film, the film formed thickness of for example aluminium oxide is the record gap layer 109 of 0.2 μ m.Secondly, in order to form magnetic circuit, record gap layer 109 is carried out partial etching form contact hole 109a.Next, the thickness that the record-header that formation is formed by magnetic material on the record gap of pole parts layer 109 is used is the upper magnetic pole sheet 110 of 0.5～1.0 μ m.Meanwhile, be used for forming above the contact hole 109a of magnetic circuit, forming the magnetosphere 119 that forms by magnetic material be used for forming magnetic circuit.

Secondly, shown in Figure 25 A and Figure 25 B, as mask, utilize ion etching that record gap layer 109 and lower magnetic layer 108 are carried out etching with top pole piece 110.Shown in Figure 25 B, the structure that each sidewall of upper magnetic pole part (upper magnetic pole sheet 110), record gap layer 109 and part lower magnetic pole 108 vertically is formed to autoregistration is called equilibrium (Trim) structure.

Secondly, form comprehensively the about 3 μ m of thickness by the film formed insulation course 111 of aluminium oxide.Secondly,, this insulation course 111 is ground, make it smooth up to the surface of upper magnetic pole sheet 110 and magnetosphere 119.

Secondly, on smooth insulation course 111, the 1st layer film coil 112 that forms by copper (Cu) that for example forms that the induction type record-header uses.Secondly, in accordance with regulations figure forms photoresist layer 113 on insulation course 111 and coil 112.Secondly, have an even surface, under the temperature of regulation, the surface of photoresist layer 113 is heat-treated in order to make.Secondly, formation the 2nd layer film coil 114 on photoresist layer 113.Secondly, at photoresist layer 113 with above the coil 114, figure according to the rules forms photoresist layer 115.Secondly, have an even surface, under the temperature of regulation, the surface of photoresist layer 115 is heat-treated in order to make.

Secondly, shown in Figure 26 A and Figure 26 B,, form the upper magnetic pole layer 116 that forms by recording magnetic material, for example permalloy (NiFe) at upper magnetic pole sheet 110, photoresist layer 113,115 with above the magnetosphere 119.Secondly, the outer coating 117 that formation is for example formed by aluminium oxide on upper magnetic pole layer 116.At last, the slider that comprises above-mentioned each layer is carried out machine work, form the air-bearing surface 118 of the thin-film head that comprises record-header and reproducing head, finish the making of thin film magnetic head element.

Figure 27 is the planimetric map of the thin film magnetic head element shown in presentation graphs 26A and Figure 26 B.Have again, in the figure, omitted outer coating 117 and other insulation course and dielectric film.

Secondly, the formation and the manufacture method thereof of slider are described to Figure 30 with reference to Figure 28.Figure 28 is the ground plan of an example of formation of the air-bearing surface of expression slider.As shown in the drawing, make slider float over the surface of recording medium in order to utilize the airflow that produces by the rotation of recording mediums such as disk, the air-bearing surface in the slider 120 forms certain shape.Have, in Figure 28, symbol 121a represents protuberance again, and 121b represents recess.In addition, near configuration thin film magnetic head element 122 end of the air outflow side of the air-bearing surface in slider 120 (upside among Figure 28).The configuration example of this thin film magnetic head element 122 is as forming like that shown in Figure 26 A and Figure 26 B.C portion among Figure 28 is corresponding with Figure 26 B.

Slider 120 can resemble to be made following.At first, cutting off in one direction to become the diaphragm that the slider part that comprises thin film magnetic head element 122 respectively (below be called the slider part) is arranged in multiple row, form the template that is called bar that slider is partly formed a line.Secondly, this is carried out attrition process form air-bearing surface, and then, protuberance 121a and recess 121b formed.Secondly, cut off bar and isolate each slider 120.

Figure 29 is the sectional view along the 29-29 line of Figure 28.In Figure 29, only represent the major part in the thin film magnetic head element 122.As shown in figure 29, the major part of slider 120 for example is made of the substrate 101 that utilizes aluminium oxide carbonization titanium to form.The remaining part of slider 120 for example is made of alumina insulating layer 127, thin film magnetic head element 122 of forming in this insulation course 127 etc.The major part of insulation course 127 is outer coatings 117.

On the air-bearing surface in slider 120; in order to prevent the corrosion of lower shield 103, lower magnetic pole 108, upper magnetic pole sheet 110 and upper magnetic pole layer 116 etc.; for example to open flat 9-93027 communique as the spy disclosed, also can form the diaphragm that has used diamond-like-carbon (DLC) etc.Figure 30 is expression floats over the state on the recording medium 140 like this at the slider 120 that has formed diaphragm 128 on the air-bearing surface a sectional view.

Particularly in the method for area recording density, method that improves line recording density and the method that improves track density are arranged in the performance that improves hard disk unit.During high performance hard disk unit, being placed on line recording density or track density according to emphasis in design, is different to the specific strategy of the integral body of record-header, reproducing head or thin-film head.That is,, for example require record-header and reproducing head both sides' track width little when emphasis being placed on when designing on the track density.

On the other hand, when emphasis being placed on when designing on the line recording density,, require to improve the output and dwindle half-peak value width in the output of resetting of resetting for example to reproducing head.When emphasis being placed on when designing on the line recording density, and then, require to dwindle distance between hard disk and the slider (below be called magnetic gap).When realizing 20～30G/ (inch) ²Area recording density the time, magnetic gap for example is that 15～25nm is necessary.

Dwindling of magnetic gap can reach by the float-amount that dwindles slider.Dwindling except the dwindling of the raising of the playback output that helps reproducing head and half-peak value width of magnetic gap also helps to improve the rewriting characteristic of record-header.

Below, the problem that exists when dwindling magnetic gap is described.In the past, the air-bearing surface of slider 120 ground and for example used the Buddha's warrior attendant mortar, carried out on the stannum dish of rotation.

, the hardness of the multiple material of formation slider 120 there are differences.For example, if the hardness of the aluminium oxide of magnetic material, for example NiFe and insulation course 127 uses of use such as the aluminium oxide carbonization titanium of the stupalith that uses as substrate 101 and lower shield 103, lower magnetic pole 108, upper magnetic pole sheet 110, upper magnetic pole layer 116 is compared, the hardness maximum of aluminium oxide carbonization titanium, the hardness minimum of NiFe, the hardness of aluminium oxide is between aluminium oxide carbonization titanium and NiFe.

Like this, when use Buddha's warrior attendant mortar as lapping compound on Xi Nuomo dish when comprising different a plurality of layers the slider 120 of hardness and closely grind, between different a plurality of layers of hardness, produce step difference.For example, as shown in figure 29, between the layer that forms by magnetic materials such as NiFe, for example upper magnetic pole layer 116 and the insulation course, under the state of upper magnetic pole layer 116 introducing insulation course 127, produce the step difference of 1～2nm, between insulation course 127 and substrate 101, under the state of insulation course 127 introducing substrates 101, produce the step difference of 4～5nm.At this moment, the step difference between the air-bearing surface of the air-bearing surface of thin film magnetic head element 122 and the substrate except diaphragm 128 101 is 5～7nm.

Here, as shown in figure 30, when the thickness of protective seam 128 is 5nm, the air-bearing surface of thin film magnetic head element 122 and and the air-bearing surface of the protective seam 128 of substrate 101 counterparts between step difference be about 10～12nm.And if the distance between slider 120 and the recording medium 140 is 10nm during slider 120 come-up, the then face of air-bearing surface one side of the thin film magnetic head element 122 the during come-up of slider 120 and the distance between the recording medium 140, promptly magnetic gap becomes 20～22nm.The highest 30G/ of being of area recording density (inch) that the magnetic gap of this degree can reach ²About.

Like this, in the thin-film head of correlation technique, because the step difference that produces than other parts under the state that part corresponding with thin film magnetic head element 122 on the air-bearing surface of slider 120 is being introduced is big, so it is very difficult to dwindle magnetic gap, as a result, there is the problem that is difficult to improve recording density.

In addition, as mentioned above, in the thin-film head of correlation technique, be difficult to dwindle magnetic gap, particularly, can not satisfy fully and improve reproducing characteristics, promptly improve the playback output of playback time and the hope of dwindling half-peak value width.Therefore, in correlation technique, the error rate of the hard disk unit that high-density recording is employed rises, and has the low problem of yield rate of hard disk unit.

Have again, open the manufacture method that discloses a kind of slider in the flat 8-339511 communique the spy, in the operation of the air-bearing surface that grinds slider, compare with the component parts that constitutes thin film magnetic head element, unevenly corrode component parts insulator on every side, make component parts more outstanding than insulator.

But, in this technology, on the air-bearing surface of slider, between insulator and component parts, produce very big step difference, so there is the problem that must form the thickness of unnecessary protection film in order to eliminate this step difference because of special.

On the other hand, when magnetic gap dwindled, slider and recording medium were easy to generate collision, damaged recording medium easily.In order to prevent such phenomenon, be necessary to improve the flatness on recording medium surface.But,, then be easy to generate the absorption between slider and the recording medium if improve the flatness on recording medium surface.

Therefore, open flat 8-287440 communique the spy, the spy opens in flat 8-293111 communique and the flat 11-120528 communique of Te Kai etc., disclose a kind of technology that the projection that prevents to adsorb usefulness is set on the face relative with medium of slider.

Open in the flat 7-230615 communique the spy, disclose a kind of technology that on the recess that produces between slider and the magnetic head element, is provided with during surface on manufacturing sliding device for the last surface that makes slider is smooth by the film formed diaphragm of insulation.Open in the flat 7-230615 communique the spy,, show the 1st following method and the 2nd method on recess as the method that diaphragm is set.The 1st method: utilization sputter at comprise surface and magnetic head element portion on the slider on form diaphragm on whole of face of surface one side after, the guarantor who removes by the last surface that grinds slider on the last surface of slider expands film.The 2nd method: comprise surface and magnetic head element portion on the slider on form photosensitive organic film on whole of face of surface one side; only make the photosensitive organic film sensitization on the last surface of magnetic head element portion and remove; then; utilization sputters at whole and goes up the formation diaphragm; at last, remove remaining photosensitive organic film.

But, open in the disclosed technology of flat 7-230615 communique the spy, though the last surface of slider, promptly relative with medium face are smooth, but because of on the face relative of slider, being provided with the above-mentioned projection that prevents to adsorb usefulness etc., so exist the face relative that is difficult to make slider to form the problem of needed shape with medium with medium.

In addition, open open a kind of like this technology in the flat 11-185418 communique the spy, in order to prevent the absorption of slider and recording medium, air inflow side on the air-bearing surface of slider is provided with protuberance, simultaneously, outside the bight of deacration outflow end, when recording medium stopped, air-bearing surface contacted with the angle of not parallel with recording medium face regulation.

But, open in the flat 11-185418 communique in the disclosed technology the spy, though can prevent the absorption of slider and recording medium, but because of the step difference that produces between the part corresponding that can not eliminate air-bearing surface and the other parts, so there is the problem that is difficult to dwindle magnetic gap with thin film magnetic head element.

Summary of the invention

The object of the present invention is to provide the manufacture method of the slider that a kind of thin-film head uses, can make the come-up of the slider that thin-film head uses low, and the face relative with medium of the slider that thin-film head can be used forms needed shape.

The manufacture method of the slider that thin-film head of the present invention is used is the manufacture method that has the medium opposed faces relative with recording medium and be configured in the slider that near the thin-film head of the thin film magnetic head element the medium opposed faces uses, and has:

The raw material of using for the slider that comprises thin film magnetic head element forms the operation of medium opposed faces; And

At least a portion to the medium opposed faces carries out etching, part corresponding with thin film magnetic head element in the medium opposed faces and the step difference between the other parts are reduced or will be configured in locational operation than the more close recording medium of at least a portion in the other parts with the corresponding part of thin film magnetic head element.

In the manufacture method of the slider that thin-film head of the present invention is used, by at least a portion of etching medium opposed faces, part corresponding with thin film magnetic head element in the medium opposed faces of slider and the step difference between the other parts are reduced or will be configured on the position than the more close recording medium of at least a portion in the other parts with the corresponding part of thin film magnetic head element.

In the manufacture method of the slider that thin-film head of the present invention is used, the operation that forms the medium opposed faces also can comprise grinds slider with the face that becomes the medium opposed faces in the raw material.

In addition, in the manufacture method of the slider that thin-film head of the present invention is used, also can and then have the operation that after etching procedure, on the medium opposed faces, forms diaphragm.At this moment, diaphragm also can be by being formed by diamond-like-carbon.In addition, manufacture method of the present invention also can and then have the operation that forms protuberance on diaphragm.

In addition, the manufacture method of the slider that thin-film head of the present invention is used and then have after forming the medium opposed faces operation of formation diaphragm on the medium opposed faces, in etching procedure, also etching diaphragm partly.At this moment, diaphragm also can be formed by diamond-like-carbon.In addition, the thickness of diaphragm also can be more than or equal to part corresponding with thin film magnetic head element in the medium opposed faces under the state before the etching procedure and the step difference between at least a portion in the other parts.

In addition, in the manufacture method of the slider that thin-film head of the present invention is used, also can in etching procedure, form protuberance on the other parts in the medium opposed faces.

In addition, in the manufacture method of the slider that thin-film head of the present invention is used, can in etching procedure, use ion to grind, also can use reactive ion etching.

In addition, in the manufacture method of the slider that thin-film head of the present invention is used, also can in etching procedure, utilize focused ion beam to carry out etching.At this moment, in etching procedure, can with the end of medium opposed faces the position alignment that benchmark carries out focused ion beam also.

In addition, in the manufacture method of the slider that thin-film head of the present invention is used, utilizing focused ion beam to carry out in the operation of etching, the shape of medium opposed faces is being become in the medium opposed faces with the end of air inflow side compare the intermediate portion with the end of air outflow side to the side-prominent shape of recording medium one.At this moment, utilizing focused ion beam to carry out in the operation of etching, the shape of medium opposed faces also can be that end from the air inflow side on the medium opposed faces is to the curved shape in the end of air outflow side.

In addition, in the manufacture method of the slider that thin-film head of the present invention is used, thin film magnetic head element also can have magnetoresistive element, is utilizing focused ion beam to carry out in the operation of etching, also can control from the end of medium opposed faces one side of magnetoresistive element to the length of the end of an opposite side.

In addition, in the manufacture method of the slider that thin-film head of the present invention is used, thin film magnetic head element can have also that the mode that comprises mutually with magnetic is coupled, in the mutual opposed pole parts of medium opposed faces one side, and have and comprise the 1st and the 2nd magnetosphere of one deck at least respectively, be located at the film coil that clearance layer between the 1st magnetospheric pole parts and the 2nd magnetospheric pole parts and at least a portion are provided with under state of insulation the 1st and the 2nd magnetosphere between the 1st and the 2nd magnetosphere, utilizing focused ion beam to carry out in the operation of etching, also can control from the end of medium opposed faces one side of pole parts to the length of the end of an opposite side.

Description of drawings

Perhaps can fully understand other purpose of the present invention, feature and interests by following explanation.

Figure 1A and Figure 1B are the sectional views of an operation in the example of manufacture method of expression thin film magnetic head element.

Fig. 2 A and Fig. 2 B are the sectional views that is used for illustrating the next operation of operation of Figure 1A and Figure 1B.

Fig. 3 A and Fig. 3 B are used for the sectional view of the next operation of operation of key diagram 2A and Fig. 2 B.

Fig. 4 A and Fig. 4 B are used for the sectional view of the next operation of operation of key diagram 3A and Fig. 3 B.

Fig. 5 A and Fig. 5 B are used for the sectional view of the next operation of operation of key diagram 4A and Fig. 4 B.

Fig. 6 A and Fig. 6 B are the sectional views of the formation of expression one routine thin film magnetic head element.

Fig. 7 is the planimetric map of the major part of the thin film magnetic head element shown in presentation graphs 6A and Fig. 6 B.

Fig. 8 is the ground plan of formation of an example of the air-bearing surface of expression slider.

Fig. 9 is the sectional view that is used for illustrating an operation in the slider manufacture method of the present invention the 1st embodiment.

Figure 10 is the sectional view of the next operation of presentation graphs 9.

Figure 11 represents that also slider floats over the sectional view of the lip-deep state of recording medium in the next operation of expression Figure 10.

Figure 12 is the performance plot of a routine playback output waveform of the expression thin film magnetic head element that utilizes the slider that the manufacture method of the 1st embodiment of the present invention makes.

Figure 13 is the sectional view of an operation that is used for illustrating the slider manufacture method of the 2nd embodiment of the present invention.

Figure 14 represents that also slider floats over the sectional view of the lip-deep state of recording medium in the next operation of expression Figure 13.

Figure 15 is the sectional view of an operation that is used for illustrating the manufacture method of the 3rd embodiment of the present invention.

Figure 16 represents that also slider floats over the sectional view of the lip-deep state of recording medium in the next operation of expression Figure 15.

Figure 17 is the sectional view of an operation that is used for illustrating the manufacture method of the 4th embodiment of the present invention.

Figure 18 represents that also slider floats over the sectional view of the lip-deep state of recording medium in the next operation of expression Figure 17.

Figure 19 is the sectional view of an operation that is used for illustrating the manufacture method of the 5th embodiment of the present invention.

Figure 20 represents that also slider floats over the sectional view of the lip-deep state of recording medium in the next operation of expression Figure 19.

Figure 21 is the sectional view of an operation that is used for illustrating the manufacture method of the 6th embodiment of the present invention.

Figure 22 represents that also slider floats over the sectional view of the lip-deep state of recording medium in the next operation of expression Figure 21.

Figure 23 A and Figure 23 B are the sectional views of an operation of manufacture method that is used for illustrating the thin film magnetic head element of connection technology.

Figure 24 A and Figure 24 B are used for the sectional view of the next operation of operation of key diagram 23A and Figure 23 B.

Figure 25 A and Figure 25 B are used for the sectional view of the next operation of operation of key diagram 24A and Figure 24 B.

Figure 26 A and Figure 26 B are the sectional views of connection technique film magnetic head element.

Figure 27 is the planimetric map of connection technique film magnetic head element.

Figure 28 is the ground plan that an example of the air-bearing surface of expression slider constitutes.

Figure 29 is the sectional view along the 29-29 line of Figure 28.

Figure 30 is the sectional view that the expression slider floats over the lip-deep state of recording medium.

Embodiment

Below, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[the 1st embodiment]

The sliding device of thin film magnetic head (being called slider to place an order) that is applicable to the 1st embodiment of the present invention has as the air-bearing surface of the medium opposed faces relative with recording medium and is configured near the air-bearing surface thin film magnetic head element.

At first, with reference to Figure 1A to Fig. 6 A, Figure 1B to Fig. 6 B and Fig. 7, a routine manufacture method of the thin film magnetic head element of the slider that is applicable to the 1st embodiment of the present invention is described.Have, Figure 1A to Fig. 6 A represents the cross section vertical with air-bearing surface again, and Figure 1B to Fig. 6 B represents the cross section parallel with the air-bearing surface of pole parts.

The manufacture method of the thin film magnetic head element that this is routine shown in Figure 1A and Figure 1B, at first, for example by aluminium oxide carbonization titanium (Al ₂O ₃TiC) on the substrate 1 of Xing Chenging deposit for example by aluminium oxide (Al ₂O ₃) insulation course 2 of the about 5 μ m of thickness that form.Next, the lower shield 3 that the thick reproducing head of about 3 μ m that formation is formed by magnetic material, for example permalloy on insulation course 2 is used.Lower shield 3 for example with photoresist as mask, utilize electrochemical plating on insulation course 2, to form selectively.Secondly, integrally form the thick insulation course that forms by aluminium oxide of 4～5 μ m for example, for example utilize that CMP (cmp) grinds up to exposing lower shield 3, again planarization (not shown) is carried out on the surface.

Secondly, shown in Fig. 2 A and Fig. 2 B, on lower shield 3, form for example the bottom shield gap film 4 of the about 20～40nm of thickness as dielectric film.Secondly, on bottom shield gap film 4, form the thick playback of tens nm MR element 5.MR element 5 for example forms by selectively the MR film that utilizes sputter to form being carried out etching.Have, MR element 5 can adopt the element of the magnetosensitive film that has used demonstration magnetoresistances such as AMR element, GMR element or TMR (tunnel magnetoresistive effect) element again.Secondly, on bottom shield gap film 4, form the thick pair of electrode layers 6 that is electrically connected with MR element 5 of tens nm.Secondly, on bottom shield gap film 4 and MR element 5, form the thick top shielding interstitial membrane 7 of for example about 20～40nm, and MR element 5 is embedded in the

shield gap film

4,7 as dielectric film.Insulating material as

shield gap film

4,7 uses has aluminium oxide, aluminium nitride, diamond-like-carbon (DLC) etc.In addition,

shield gap film

4,7 can utilize sputtering method to form, and also can utilize chemical vapour phase growth method (CVD) to form.

Secondly, on top shielding interstitial membrane 7, form the thick top shielding layer that forms by magnetic material of about 1.0～1.5 μ m that reproducing head and record-header the use lower magnetic pole (following note is made lower magnetic pole) 8 of holding concurrently selectively.Have, lower magnetic pole 8 is made of the 1st layer of 8a and the 2nd layer of 8b described later, the 3rd layer of 8c again.The 1st layer of 8a of lower magnetic pole 8 is configured on the position relative with at least a portion of film coil described later.

Secondly, by the 1st layer above the 8a, form the 2nd layer of 8b and the 3rd layer of 8c of the lower magnetic pole 8 of about 1.5～2.5 μ m of thickness in lower magnetic pole 8.The 2nd layer of 8b forms the pole parts of lower magnetic pole 8, and is connected with the face of record gap described later layer one side of the 1st layer of 8a (upside among Fig. 2 A and Fig. 2 B).The 3rd layer of 8c is used for and the 1st layer of 8a and the part that upper magnetic pole layer described later is connected, and is configured near the position the center of film coil described later.In the 2nd layer of 8b and end position decision throat height with respect to the air-bearing surface 30 opposite sides of the part of upper magnetic pole layer.

The 2nd layer of 8b and the 3rd layer of 8c of lower magnetic pole 8 can use the NiFe (weight of Ni:80%, the weight of Fe:20%), the high saturation magnetic flux density material Ni Fe (weight of Ni:45%, the weight of Fe:55%), utilize electrochemical plating to form, also can use materials such as high saturation magnetic flux density material FeN, FeZrN, utilize sputtering method to form.In addition, also can use the non-crystalline material etc. of high saturation magnetic flux density material C oFe, Co system.

Secondly, shown in Fig. 3 A and Fig. 3 B, integrally form the dielectric film 9 that forms by aluminium oxide of about 0.3～0.6 μ m of thickness.

Secondly, utilize photo-mask process to make photoresist form figure, form the framework that is used for utilizing framework electrochemical plating formation film coil.Secondly, utilize the framework electrochemical plating, use the film coil that for example forms of about 1.0～2.0 μ m of this frame shape precedent such as thickness, about 1.2～2.0 μ m of coil-span by copper (Cu).Secondly, remove framework, have, among the figure, symbol 10a represents to be used for connecting the connecting portion of film coil 10 and conductive layer described later (lead-in wire).

Secondly, shown in Fig. 4 A and Fig. 4 B, integrally form the insulation course 11 that forms by aluminium oxide of about 3～4 μ m of thickness.Secondly, for example utilize the CMP method that insulation course 11 is ground, the 2nd layer of 8b and the 3rd layer of 8c up to exposing lower magnetic pole 8 then, carry out planarization to the surface.Here, though in Fig. 4 A, do not expose film coil 10, also can expose film coil 10.

Secondly, at the 2nd layer of 8b of the lower magnetic pole of exposing 8 and the 3rd layer of 8c and above the insulation course 11, forming for example thickness that is formed by insulating material is the record gap layer 12 of 0.2～0.3 μ m.Insulating material as record gap layer 12 uses generally has aluminium oxide, aluminium nitride, monox based material, silicon nitride series material and diamond-like-carbon (DLC) etc.In addition, record gap layer 12 can utilize sputtering method to form, and also can utilize the CVD method to form.

Secondly, in order to form magnetic circuit, above the 8c, record gap layer 12 is carried out partial etching form contact hole the 3rd layer of lower magnetic pole 8.In addition, the part on the connecting portion 10a of film coil 10 is carried out partial etching to record gap layer 12 and insulation course 11 and is formed contact hole.

Secondly, shown in Fig. 5 A and Fig. 5 B, on record gap layer 12, the upper part of the 3rd of 8 the layer of 8c forms the upper magnetic pole layer 13 of about 2.0～3.0 μ m of thickness from air-bearing surface 30 to lower magnetic pole, simultaneously, form the conductive layer 16 of about 2.0～3.0 μ m of thickness, so that connect the connecting portion 10a of film coil 10.Upper magnetic pole layer 13 contacts with the 3rd layer of 8c of lower magnetic pole 8 through the 3rd layer of contact hole that the part above the 8c forms in lower magnetic pole 8, is coupled in the mode of magnetic.

Upper magnetic pole layer 13 can use the NiFe (weight of Ni:80%, the weight of Fe:20%), the high saturation magnetic flux density material Ni Fe (weight of Ni:45%, the weight of Fe:55%) etc., utilize electrochemical plating to form, also can use materials such as high saturation magnetic flux density material FeN, FeZrN, utilize sputtering method to form.In addition, also can use the non-crystalline material etc. of high saturation magnetic flux density material C oFe, Co system.In addition, in order to improve high frequency characteristics, also can make upper magnetic pole layer 13 form the magnetospheric structure of overlapping good which floor inorganic insulating membrane and permalloy etc.

Secondly, as mask, utilize ion etching that record gap layer 12 is carried out etching selectively with top magnetic pole layer 13.At this moment ion etching for example can be adopted and use BCl ₂, Cl ₂Gas and CF Deng chlorine unit prime system ₄, SF ₆Deng fluorine element is the reactive ion etching (RIE) of gases such as gas.Secondly, for example utilize that argon ion grinds,, form the equalizing structure shown in Fig. 5 B the 2nd layer of 8b of lower magnetic pole 8 about 0.3～0.6 μ m of etching selectively.If according to this equalizing structure, can prevent to write the increase of the effective track width that the broadening of the magnetic line of force of fashionable generation causes because of narrow magnetic track.

Secondly, shown in Fig. 6 A and Fig. 6 B, integrally forming the thickness that is for example formed by aluminium oxide is the outer coating 17 of 20～40 μ m, and makes its flattening surface, forms not shown electrode welding zone again.At last, comprise the attrition process of the slider of above-mentioned each layer, form the air-bearing surface 30 of the thin-film head that comprises record-header and reproducing head, thereby finish the making of thin film magnetic head element.

Fig. 7 is the planimetric map of the major part of the thin film magnetic head element shown in presentation graphs 6A and Fig. 6 B.Have again, in Fig. 7, omitted outer coating 17, other insulation course and dielectric film.

Thin film magnetic head element in this example has the medium opposed faces relative with recording medium (air-bearing surface 30), reproducing head and record-header (induction type electromagnetic transformation element).Lower shield 3 and top shielding layer (lower magnetic pole 8) that reproducing head has MR element 5 and MR element 5 is shielded, this lower shield 3 makes the part of its air-bearing surface 30 1 sides that MR element 5 is clipped in the middle and relative configuration with top shielding layer 8.

The mode that record-header comprises mutually with magnetic links and the mutual opposed pole parts of air-bearing surface 30 1 sides, the film coil 10 that the record gap layer 12 between the pole parts that have the lower magnetic pole 8 and the upper magnetic pole layer 13 that comprise 1 layer at least, is located at lower magnetic pole 8 and upper magnetic pole layer 13 and at least a portion are provided with between lower magnetic pole 8 and upper magnetic pole layer 13 and with their insulation.

Secondly, one routine slider of the manufacture method of the slider that uses present embodiment is described with reference to Fig. 8.Fig. 8 is the ground plan of formation of an example of the air-bearing surface of expression slider.As shown in the drawing, the air-bearing surface in the slider 20 is formed certain shape, so that the airflow that utilizes the rotation because of recording mediums such as disks to produce makes slider 20 float over the recording medium surface.Have, in Fig. 8, symbol 21a represents protuberance again, and 21b represents recess.In addition, near configuration thin film magnetic head element 22 end of the air outflow side of the air-bearing surface in slider 20 (upside among Fig. 8).The configuration example of the dazzling element 22 of this film is as forming like that shown in Fig. 6 A and Fig. 6 B.A portion among Fig. 8 is corresponding with Fig. 6 B.

Secondly, the manufacture method of the slider of present embodiment is described with reference to Fig. 9 to Figure 11.Fig. 9 is the sectional view that is used for illustrating an operation in the slider manufacture method of present embodiment.Figure 10 is the sectional view of the next operation of presentation graphs 9.Figure 11 represents that also slider floats over the sectional view of the lip-deep state of recording medium in the next operation of expression Figure 10.Fig. 9 to Figure 11 represents the section represented by the 9-9 line among Fig. 8.In addition, in Fig. 9 to Figure 11, only represent the major part in the thin film magnetic head element 22.

In the manufacture method of the slider of present embodiment, at first, cut off the part to become the slider 20 that comprises thin film magnetic head element 22 respectively (below be called the slider part) in one direction and be arranged in the diaphragm of multiple row, form the template that is called bar that slider is partly formed a line.The used raw material of bar and slider of the present invention is corresponding.

Secondly, as shown in Figure 9, the bar that comprises the part that becomes slider 20 is carried out attrition process form air-bearing surface 30, the major part of slider for example constitutes by the substrate 1 that is formed by aluminium oxide carbonization titanium.The remaining part of slider 20 for example is made of alumina insulating layer 27 and the thin film magnetic head element 22 that forms in this insulation course 27 etc.The major part of insulation course 27 is outer coatings 17.

After above-mentioned attrition process, at the step difference that produces on the air-bearing surface 30 of slider 20 between the different a plurality of layers of hardness.Attrition process for example uses the emery as lapping compound to add the alkaline Buddha's warrior attendant mortar that alkaline lubricating fluid constitutes, and carries out on the Xi Nuomo of rotation dish.At this moment, because can when utilizing alkaline Buddha's warrior attendant mortar that the insulation course 27 that is formed by aluminium oxide is carried out chemical etching, carry out mechanical lapping to insulation course 27 and the lower shield 3 that forms by magnetic material, lower magnetic pole 8 and upper magnetic pole layer 13, so, can make the step difference between insulation course 27, lower shield 3, lower magnetic pole 8 and the upper magnetic pole layer 13 be approximately 0.

But, even use above-mentioned alkaline Buddha's warrior attendant mortar to grind, can not eliminate the step difference between insulation course 27 and the substrate 1, between insulation course 27 and substrate 1, insulation course 27 is introduced into substrate 1, produces the step difference of 4～5nm.At this moment, the step difference between the face of air-bearing surface 30 1 sides of the face of air-bearing surface 30 1 sides of thin film magnetic head element 22 and substrate 1 is about 4～5nm.

Secondly, in the present embodiment, as shown in figure 10, form photoresist 31 selectively on the part corresponding in the air-bearing surface 30 of slider 20 with thin film magnetic head element 22 and insulation course 27.Secondly, with photoresist 31 as mask, by etching, preferably resemble that ion grinds or reactive ion etching dry etching, air-bearing surface 30 is carried out partial etching.At this moment etch amount for example is 5nm more than or equal to the step difference between the face of air-bearing surface 30 1 sides of the face of air-bearing surface 30 1 sides of thin film magnetic head element 22 and substrate 1.In the present embodiment, the operation that air-bearing surface 30 is carried out partial etching becomes the etching to substrate 1.

By above-mentioned etching; as shown in figure 11; on the air-bearing surface 30 of the slider 20 before diaphragm 28 forms; perhaps reduce the part corresponding with thin film magnetic head element 22 and with the corresponding part of substrate 1 between step difference; perhaps, the part corresponding with thin film magnetic head element 22 be in than with the corresponding part of substrate 1 in the position of the more close recording medium 40 of at least a portion on.Reduce the part corresponding with thin film magnetic head element 22 and with the corresponding part of substrate 1 between the situation of step difference under, preferably make two parts form same plane.

Secondly, on the air-bearing surface 30 of slider 20, for example, form protuberance 21a and recess 21b as shown in Figure 8, make air-bearing surface 30 form certain shape, so that the airflow that utilizes the rotation of recording medium to produce makes slider 20 float over the recording medium surface.

Secondly, as shown in figure 11, on whole of the air-bearing surface 30 of slider 20, form and be used for the diaphragm 28 of protective film magnetic head element 22.The material of this diaphragm 28 for example can use diamond-like-carbon (DLC).

At last, cut off bar, isolate each slider 20.Have again, in the present embodiment, forming on the air-bearing surface 30 at slider 20 in the operation of protuberance 21a and recess 21b, as shown in figure 11, at the edge of air-bearing surface 30 1 sides of slider 20, near the edge of the air outflow side (left side among Figure 11) the thin film magnetic head element 22 carrying out chamfered.

As shown in figure 11; in the slider 20 that the manufacture method of utilizing present embodiment is made; distance when being 5nm, slider 20 come-ups as if the thickness of establishing protective seam 28 between slider 20 and the recording medium 40 is 10nm, and the face of air-bearing surface 30 1 sides of thin film magnetic head element 22 and distance, the magnetic gap between the recording medium 40 were 15nm when then slider 20 floated.Magnetic gap in the slider 120 of the magnetic gap in this slider 20 and correlation technique shown in Figure 30 is compared, and dwindles more than the 5nm.

As described above; in the present embodiment; on the air-bearing surface 30 of the slider 20 before diaphragm 28 forms; air-bearing surface 30 is carried out partial etching; make the part corresponding and reduce with step difference between the corresponding part of substrate 1 with thin film magnetic head element 22; perhaps; make the part corresponding with thin film magnetic head element 22 be in than with the corresponding part of substrate 1 in the position of the more close recording medium 40 of at least a portion on; then, on whole of air-bearing surface 30, form diaphragm 28.

Therefore, if according to present embodiment, the step difference of face that can make air-bearing surface 30 1 sides of the face of air-bearing surface 30 1 sides of thin film magnetic head element 22 and substrate 1 is 0 or near 0, perhaps, the face of air-bearing surface 30 1 sides of thin film magnetic head element 22 is configured on the position than the more close recording medium 40 of face of air-bearing surface 30 1 sides of substrate 1.As a result, if according to present embodiment, utilize dwindling of magnetic gap, can improve the playback output of reproducing head and dwindle half-peak value width, the result can improve recording density.Figure 12 illustrates the routine playback output waveform in the thin film magnetic head element 22 of the slider 20 that the manufacture method of utilizing present embodiment makes.In the figure, symbol PW50 represents the half-peak value width of output of resetting.Half-peak value width PW50 is the time more than 50% when being output as peak value of resetting.

In addition, if according to present embodiment,, can improve the rewriting characteristic in the record-header by dwindling magnetic gap.

In addition, if according to present embodiment, because of the air-bearing surface 30 to slider 20 has carried out partial etching, so can make the air-bearing surface 30 of slider 20 form desired shape, for example as shown in Figure 11, form make the part corresponding with thin film magnetic head element 22 be in than with the locational shape of the corresponding more close recording medium 40 of part of substrate 1.

In addition, if according to present embodiment, because of the edge near the air outflow side the thin film magnetic head element 22 (left side among Figure 11) carries out chamfered at the edge of air-bearing surface 30 1 sides of slider 20, so can make the come-up of slider 20 lower.

[the 2nd embodiment]

Below, the manufacture method of the slider of the 2nd embodiment of the present invention is described with reference to Figure 13 and Figure 14.Figure 13 is the sectional view of an operation of manufacture method that is used for illustrating the slider of present embodiment.Figure 14 represents that also slider floats over the sectional view of the lip-deep state of recording medium in the next operation of expression Figure 13.Figure 13 and Figure 14 represent the section represented by the 9-9 line of Fig. 8.In addition, in Figure 13 and Figure 14, the major part of thin film magnetic head element 22 only is shown.

In the manufacture method of the slider of present embodiment, as shown in Figure 9,, the same with the 1st embodiment up to carrying out till attrition process forms the operation of air-bearing surface 30 to comprising the bar that becomes the slider part.

Secondly, in the present embodiment, as shown in Figure 13, in the air-bearing surface 30 of slider 20, on the part corresponding, form photoresist 31 selectively with thin film magnetic head element 22 and insulation course 27.At this moment, simultaneously, in the air-bearing surface 30 of slider 20, on the part part corresponding with substrate 1, formation is used for forming has the photoresist 32 that prevents the protuberance of functions such as adsorbing described later.

Secondly, with

photoresist

31,32 as mask, by etching, preferably resemble that ion grinds or reactive ion etching dry etching, air-bearing surface 30 is carried out partial etching.At this moment etch amount for example is 5nm more than or equal to the step difference between the face of air-bearing surface 30 1 sides of the face of air-bearing surface 30 1 sides of thin film magnetic head element 22 and substrate 1.In the present embodiment, the operation that air-bearing surface 30 is carried out partial etching becomes the etching to substrate 1.

By above-mentioned etching, as shown in figure 14, on the air-bearing surface 30 of the slider 20 before diaphragm 28 forms, formation has the protuberance 33 that prevents functions such as adsorbing on the corresponding part of a part and substrate 1.Simultaneously; on the air-bearing surface 30 of the slider 20 before diaphragm 28 forms; or reduce the part corresponding with thin film magnetic head element 22 and with the corresponding part of substrate 1 between step difference, or will the part corresponding be configured in thin film magnetic head element 22 than with the corresponding part of substrate 1 in the position of the more close recording medium 40 of at least a portion (except the part corresponding) with protuberance 33 on.Reduce the part corresponding with thin film magnetic head element 22 and with the corresponding part of substrate 1 between the situation of step difference under, part corresponding with thin film magnetic head element 22 and the part corresponding with substrate 1 (except the part corresponding with protuberance 33) are formed at grade.

Secondly, on the air-bearing surface 30 of slider 20, for example, form protuberance 21a and recess 21b as shown in Figure 8, air-bearing surface 30 is formed desired shape, so that the airflow that utilizes the rotation of recording medium to produce makes slider 20 float over the recording medium surface.

Secondly, as shown in figure 14, on whole of the air-bearing surface 30 of slider 20, form and be used for the diaphragm 28 of protective film magnetic head element 22.The material of this diaphragm 28 for example can use diamond-like-carbon (DLC).

At last, cut off bar, isolate each slider 20.Have again, in the present embodiment, forming on the air-bearing surface 30 at slider 20 in the operation of protuberance 21a and recess 21b, as shown in figure 14, on the edge of air-bearing surface 30 1 sides of slider 20, near the edge of the air outflow side (left side among Figure 14) the thin film magnetic head element 22 carrying out chamfered.

If according to present embodiment; because of the air-bearing surface 30 to slider 20 before diaphragm 28 forms has carried out partial etching; so the air-bearing surface 30 of slider 20 can be formed desired shape, for example, form and have the such shape of protuberance 33 that prevents to adsorb usefulness.

In addition, if according to present embodiment, because of on the air-bearing surface 30 of slider 20, on the part part corresponding, protuberance 33 is set with substrate 1, so when recording medium begins to rotate, can prevent the absorption of slider 20 and recording medium 40, simultaneously, when rotation status forwards rotation halted state and slider 20 to and contacts with recording medium 40, can alleviate mutual collision in recording medium 40.

The formation of other of present embodiment, effect and effect are the same with the 1st embodiment.

[the 3rd embodiment]

Below, the manufacture method of the slider of the 3rd embodiment of the present invention is described with reference to Figure 15 and Figure 16.Figure 15 is the sectional view of an operation of manufacture method that is used for illustrating the slider of present embodiment.Figure 16 represents that also slider floats over the sectional view of the lip-deep state of recording medium in the next operation of expression Figure 15.Figure 15 and Figure 16 represent the section represented by the 9-9 line of Fig. 8.In addition, in Figure 15 and Figure 16, the major part of thin film magnetic head element 22 only is shown.

Secondly, in the present embodiment, as shown in Figure 15, on whole of the air-bearing surface 30 of slider 20, form and be used for the diaphragm 28 of protective film magnetic head element 22.The material of this diaphragm 28 for example uses diamond-like-carbon (DLC).This thickness that protect to expand film 28 for example is 5nm more than or equal to the step difference of the face of air-bearing surface 30 1 sides of the face of air-bearing surface 30 1 sides of thin film magnetic head element 22 and substrate 1.

Secondly, in the air-bearing surface 30 of slider 20, on the part corresponding, form photoresist 31 selectively with thin film magnetic head element 22 and insulation course 27.At this moment, simultaneously in the air-bearing surface 30 of slider 20, on the corresponding part of a part and substrate 1, formation is used for forming has the photoresist 32 that prevents the protuberance of functions such as adsorbing described later.

Secondly, with

photoresist

31,32 as mask, by etching, preferably resemble that ion grinds or reactive ion etching dry etching, air-bearing surface 30 is carried out partial etching.At this moment etch amount for example is 5～10nm more preferably greater than the step difference between the face of air-bearing surface 30 1 sides of the face of air-bearing surface 30 1 sides that equal thin film magnetic head element 22 and substrate 1.In the present embodiment, the operation that air-bearing surface 30 is carried out partial etching becomes the etching to diaphragm 28, according to circumstances, becomes the etching of substrate 1 sometimes.

By above-mentioned etching, as shown in figure 16, on the air-bearing surface 30 of slider 20, has the protuberance 34 that prevents functions such as adsorbing in a part and the formation of substrate 1 counterpart.Simultaneously, on air-bearing surface 30, or reduce the part corresponding with thin film magnetic head element 22 and with the corresponding part of substrate 1 between step difference, or will the part corresponding be configured in thin film magnetic head element 22 than with the corresponding part of substrate 1 in the position of the more close recording medium 40 of at least a portion (except the part corresponding) with protuberance 34 on.Reduce the part corresponding with thin film magnetic head element 22 and with the corresponding part of substrate 1 between the situation of step difference under, part corresponding with thin film magnetic head element 22 and the part corresponding with substrate 1 (except the part corresponding with protuberance 33) are formed at grade.

Secondly, on the air-bearing surface 30 of slider 20, for example, form protuberance 21a and recess 21b as shown in Figure 8, make air-bearing surface 30 form desired shape, so that the airflow that utilizes the rotation of recording medium to produce makes slider 20 float over the recording medium surface a little.

At last, cut off bar, isolate each slider 20.Have again, in the present embodiment, forming on the air-bearing surface 30 at slider 20 in the operation of protuberance 21a and recess 21b, as shown in figure 16, on the edge of air-bearing surface 30 1 sides of slider 20, near the edge of the air outflow side (left side among Figure 14) the thin film magnetic head element 22 carrying out chamfered.

As shown in figure 16; in the slider 20 that the manufacture method of utilizing present embodiment is made; if establishing the thickness of diaphragm 28 is 5nm; distance during slider 20 come-ups between slider 20 and the recording medium 40 is 10nm, and the face of air-bearing surface 30 1 sides of thin film magnetic head element 22 and distance, the magnetic gap between the recording medium 40 were 15nm when then slider 20 floated.Magnetic gap in the slider 120 of the magnetic gap in this slider 20 and connection technology shown in Figure 30 is compared, and dwindles more than the 5nm.

As described above; in the present embodiment; after forming diaphragm 28 on the air-bearing surface 30 with step difference; on the air-bearing surface 30 of slider 20; diaphragm 28 is carried out partial etching; make the part corresponding and reduce with step difference between the corresponding part of substrate 1 with thin film magnetic head element 22; perhaps, make the part corresponding with thin film magnetic head element 22 be configured in than with the corresponding part of substrate 1 in the position of the more close recording medium 40 of at least a portion (except the part corresponding) with protuberance 34 on.

Therefore; if according to present embodiment; the step difference of face that can make air-bearing surface 30 1 sides of the face of air-bearing surface 30 1 sides that comprise diaphragm 28 thin film magnetic head elements 22 and substrate 1 is 0 or near 0; perhaps, the face of air-bearing surface 30 1 sides of the thin film magnetic head element 22 that comprises diaphragm 28 is configured on the position than the more close recording medium 40 of face of air-bearing surface 30 1 sides of substrate 1.As a result, the same if according to present embodiment with the 1st embodiment, can make slider 20 float-amounts little, promptly can dwindle magnetic gap.In addition, if according to present embodiment, by dwindling magnetic gap, can improve the playback output of reproducing head and dwindle half-peak value width, the result can improve recording density.

In addition, if according to present embodiment, because of the air-bearing surface 30 to slider 20 has carried out partial etching, so the air-bearing surface 30 of slider 20 can be formed desired shape, for example, as shown in figure 16, form and have the such shape of protuberance 34 that prevents to adsorb usefulness.

In addition, if according to present embodiment, because of on the air-bearing surface 30 of slider 20, the part corresponding with substrate 1 in a part is provided with protuberance 34, so when recording medium begins to rotate, can prevent the absorption of slider 20 and recording medium 40, simultaneously, when rotation status forwards rotation halted state and slider 20 to and contacts with recording medium 40, can alleviate mutual collision in recording medium 40.

[the 4th embodiment]

Below, the manufacture method of the slider of the 4th embodiment of the present invention is described with reference to Figure 17 and Figure 18.Figure 17 is the sectional view of an operation of manufacture method that is used for illustrating the slider of present embodiment.Figure 18 represents that also slider floats over the sectional view of the lip-deep state of recording medium in the next operation of expression Figure 17.Figure 17 and Figure 18 represent the section represented by the 9-9 line of Fig. 8.In addition, in Figure 17 and Figure 18, the major part of thin film magnetic head element 22 only is shown.

Secondly, in the present embodiment, as shown in figure 17, on the air-bearing surface 30 of slider 20, utilize focused ion beam (Focused Ion Beam; Below, note is made FIB) at least a portion of 100 pairs of air-bearing surfaces 30 carries out etching, and part corresponding with thin film magnetic head element 22 and the step difference between the other parts are reduced.Utilize the etching of FIB100 can be only the part corresponding with substrate 1 in the air-bearing surface 30 of slider 20 to be carried out, also can the whole face of air-bearing surface 30 be carried out.

When utilizing FIB100 only the part corresponding with substrate 1 in the air-bearing surface 30 of slider 20 to be carried out etching, for example, at first the boundary position with substrate 1 and insulation course 27 is the position that benchmark is aimed at FIB100 on air-bearing surface 30, secondly, make FIB100 scanning substrate 1, carry out etching.The direction of scanning of FIB100 can be the left and right directions among Figure 17, can be the direction vertical with paper, also can be other direction.FIB100 equals the etch amount of substrate 1 or near the step difference of the face of air-bearing surface 30 1 sides of the face of air-bearing surface 30 1 sides of thin film magnetic head element 22 and substrate 1, for example, is 5nm in addition.

When the whole face to air-bearing surface 30 carries out the etching of FIB100, for example, at first the end with the air outflow side (left side of Figure 17) of air-bearing surface 30 is the position that benchmark is aimed at FIB100, secondly, make whole of FIB100 scanning air-bearing surface 30, carry out etching.At this moment, owing on air-bearing surface 30, existing because of thin film magnetic head element 22 and insulation course 27 are introduced into the step difference that substrate 1 produces, thus only substrate 1 is carried out etching beginning to utilize FIB100 the chances are, till this step difference disappearance.After step difference disappears, etched film magnetic head element 22 and insulation course 27.The direction of scanning of FIB can be the left and right directions among Figure 17, can be the direction vertical with paper, also can be other direction.In addition, FIB100 equals the etch amount of substrate 1 or near the step difference of the face of air-bearing surface 30 1 sides of the face of air-bearing surface 30 1 sides of thin film magnetic head element 22 and substrate 1, for example, is 5nm.When utilizing FIB100 etched film magnetic head element 22 and insulation course 27, etch amount is more than above-mentioned step difference.

In addition, when utilizing FIB100 etched film magnetic head element 22 and insulation course 27, also can be by the control etch amount, control from the end of air-bearing surface 30 1 sides of MR element 5 to the length (highly) of the end of an opposite side, be the MR height and from the end of air-bearing surface 30 1 sides of the pole parts of record-header to the length (highly) of the end of an opposite side, be throat's height.

By the etching of above-mentioned FIB100, as shown in figure 18, on the air-bearing surface 30 of the slider 20 before diaphragm 28 forms, can make step difference between substrate 1, thin film magnetic head element 22 and the insulation course 27 is 0 or near 0.

Secondly, on the air-bearing surface 30 of slider 20, for example, form protuberance 21a and recess 21b as shown in Figure 8, make air-bearing surface 30 form desired shape, so that the airflow that utilizes the rotation of recording medium to produce floats on the recording medium surface slider 20 a little.

Secondly, as shown in Figure 18, on whole of the air-bearing surface 30 of slider 20, form and be used for the diaphragm 28 of protective film magnetic head element 22.The material of this diaphragm 28 for example uses diamond-like-carbon (DLC).The thickness of this diaphragm 28 for example is 3～5nm.

At last, cut off bar, isolate each slider 20.Have again, in the present embodiment, forming on the air-bearing surface 30 at slider 20 in the operation of protuberance 21a and recess 21b, as shown in figure 18, at the edge of air-bearing surface 30 1 sides of slider 20, near the edge of the air outflow side (left side among Figure 14) the thin film magnetic head element 22 carrying out chamfered.

As shown in figure 18; in the slider 20 that the manufacture method of utilizing present embodiment is made; if establishing the thickness of diaphragm 28 is 5nm; distance during slider 20 come-ups between slider 20 and the recording medium 40 is 10nm, and the face of air-bearing surface 30 1 sides of thin film magnetic head element 22 and distance, the magnetic gap between the recording medium 40 were 15nm when then slider 20 floated.Magnetic gap in the slider 120 of the magnetic gap in this slider 20 and connection technology shown in Figure 30 is compared, and has roughly dwindled more than 5～7nm.

As described above; in the present embodiment; on the air-bearing surface 30 of the slider 20 before forming diaphragm 28; at least a portion of air-bearing surface 30 is carried out the etching of FIB100; part corresponding with thin film magnetic head element 22 and the step difference between the other parts are reduced; then, on whole of air-bearing surface 30, form diaphragm 28.

Therefore, if according to present embodiment, the step difference of face that can make air-bearing surface 30 1 sides of the face of air-bearing surface 30 1 sides of thin film magnetic head element 22 and substrate 1 is 0 or near 0.As a result,, can make slider 20 float-amounts little, promptly can dwindle magnetic gap if according to present embodiment.In addition, if according to present embodiment, by dwindling magnetic gap, can improve the playback output of reproducing head and dwindle half-peak value width, the result can improve recording density.Utilize in the thin film magnetic head element 22 of the slider 20 that the manufacture method of present embodiment makes the playback output waveform for example as shown in Figure 12.

In addition, if according to present embodiment,, can improve the rewriting characteristic of record-header by dwindling magnetic gap.

In addition, if according to present embodiment, because of utilizing FIB100 that at least a portion of the air-bearing surface 30 of slider 20 has been carried out etching, so the air-bearing surface 30 of slider 20 can be formed desired shape, for example, on air-bearing surface 30, form with the part corresponding with thin film magnetic head element 22 be configured in than with the position of the corresponding more close recording medium 40 of part of substrate 1 on such shape.

In addition, if according to present embodiment, because of the edge near the air outflow side the thin film magnetic head element 22 (left side among Figure 18) carries out chamfered at the edge of air-bearing surface 30 1 sides of slider 20, so can make the come-up of slider 20 lower.

In addition, if according to present embodiment, because of when utilizing FIB100 etched film magnetic head element 22 and insulation course 27, controlling MR height and throat's height, so can control MR height and throat's height accurately by controlling its etch amount.

In addition, if according to present embodiment, for example the end with the air outflow side of air-bearing surface 30 is the position that benchmark removes to aim at FIB100, by making whole of FIB100 scanning air-bearing surface 30 and carrying out etching, compare with the face that utilization has used the attrition process of price fixing to form, can improve the flatness of air-bearing surface 30.

[the 5th embodiment]

Below, the manufacture method of the slider of the 5th embodiment of the present invention is described with reference to Figure 19 and Figure 20.Figure 19 is the sectional view of an operation of manufacture method that is used for illustrating the slider of present embodiment.Figure 20 represents that also slider floats over the sectional view of the lip-deep state of recording medium in the next operation of expression Figure 19.Figure 19 and Figure 20 represent the section represented by the 9-9 line of Fig. 8.In addition, in Figure 19 and Figure 20, the major part of thin film magnetic head element 22 only is shown.

In the manufacture method of the slider of present embodiment, as shown in Figure 9, up to carrying out attrition process and form air-bearing surface 30 and then utilize on the air-bearing surface 30 at slider 20 FIB100 at least a portion of air-bearing surface 30 to be carried out till etching makes the operation that part corresponding with thin film magnetic head element 22 and the step difference between the other parts reduce as shown in figure 19, the same with the 4th embodiment to comprising the bar that becomes slider 20 parts.

Secondly, in the present embodiment, on the air-bearing surface 30 of slider 20, for example, form protuberance 21a and recess 21b as shown in Figure 8, make air-bearing surface 30 form desired shape, so that the airflow that utilizes the rotation of recording medium to produce makes slider 20 float over the recording medium surface a little.

Secondly, as shown in Figure 20, on whole of the air-bearing surface 30 of slider 20, form and be used for the diaphragm 28 of protective film magnetic head element 22.The material of this diaphragm 28 for example uses diamond-like-carbon (DLC).

Secondly, on the diaphragm 28 of the corresponding part of a part and substrate 1, for example utilize and peel off method (lift-off) and form and have the protuberance 35 of preventing functions such as absorption.The material of this protuberance 35 for example uses diamond-like-carbon (DLC).

At last, cut off bar, isolate each slider 20.Have again, in the present embodiment, on the air-bearing surface 30 of slider 20, form in the operation of protuberance 21a and recess 21b, as shown in figure 20, at the edge of air-bearing surface 30 1 sides of slider 20, near the edge of the air outflow side (left side among Figure 20) the thin film magnetic head element 22 carrying out chamfered.

If according to present embodiment, because of on the air-bearing surface 30 of slider 20, the part corresponding with substrate 1 in a part is provided with protuberance 35, so when recording medium 40 begins to rotate, can prevent the absorption of slider 20 and recording medium 40, simultaneously, when rotation status forwards rotation halted state and slider 20 to and contacts with recording medium 40, can alleviate mutual collision in recording medium 40.

The formation of other of present embodiment, effect and effect are the same with the 4th embodiment.

[the 6th embodiment]

Below, the manufacture method of the slider of the 6th embodiment of the present invention is described with reference to Figure 21 and Figure 22.Figure 21 is the sectional view of an operation of manufacture method that is used for illustrating the slider of present embodiment.Figure 22 represents that also slider floats over the sectional view of the lip-deep state of recording medium in the next operation of expression Figure 21.Figure 21 and Figure 22 represent the section represented by the 9-9 line of Fig. 8.In addition, in Figure 21 and Figure 22, the major part of thin film magnetic head element 22 only is shown.

In the manufacture method of the slider of present embodiment, as shown in Figure 9,, the same with the 1st embodiment up to carrying out till attrition process forms the operation of air-bearing surface 30 to comprising the bar that becomes slider 20 parts.

Secondly, in the present embodiment, as shown in figure 21, utilize FIB100 that the whole face of air-bearing surface 30 is carried out etching.Just, in the present embodiment, such as shown in figure 22, make it as many by the etch amount that increases FIB100, the shape of air-bearing surface 30 is become in air-bearing surface 30 with the end of air inflow side compare the intermediate portion with the end of air outflow side to the side-prominent shape (hereinafter referred to as crown) of recording medium 40 1 in the etch amount of each end side of air inflow side and air outflow side.At this moment, it is the shape of arc to air outflow side end that the shape of air-bearing surface 30 preferably flows into side end from air, and promptly the shape of drum surface or shape similarly also can be other shapes such as roof shape, dome cap shape, cone shape.

Secondly, such as shown in figure 22, on whole of the air-bearing surface 30 of slider 20, form and be used for the diaphragm 28 of protective film magnetic head element 22.The material of this diaphragm 28 for example uses diamond-like-carbon (DLC).

At last, cut off bar, isolate each slider 20.Have again, in the present embodiment, forming on the air-bearing surface 30 at slider 20 in the operation of protuberance 21a and recess 21b, as shown in figure 22, on the edge of air-bearing surface 30 1 sides of slider 20, near the edge of the air outflow side (left side among Figure 20) the thin film magnetic head element 22 carrying out chamfered.

If according to present embodiment, because of utilizing FIB100 that the air-bearing surface 30 of slider 20 is carried out etching, so, by to each part control etch amount, can make the shape of the air-bearing surface 30 of slider 20 become desired shape, for example resemble crown shape as described above.

In addition, if according to present embodiment, be processed into crown by shape with air-bearing surface 30, so when recording medium 40 begins to rotate, can prevent the absorption of slider 20 and recording medium 40, simultaneously, when rotation status forwards rotation halted state and slider 20 to and contacts with recording medium 40, can alleviate mutual collision in recording medium 40.

Have again, the invention is not restricted to the various embodiments described above, can carry out all changes.For example, the present invention go for not having the induction type electromagnetic transformation element playback film special magnetic head, have only the record film special magnetic head of induction type electromagnetic transformation element and the thin-film head that utilizes the induction type electromagnetic transformation element to write down and reset.

As described above, if manufacture method according to sliding device of thin film magnetic head of the present invention, at least a portion to the medium opposed faces is carried out etching, thereby, on the medium opposed faces, or reduce part corresponding and the step difference between the other parts with thin-film head, or the part corresponding with thin-film head is configured on the position than the more close recording medium of at least a portion in the other parts, so, can reduce the come-up of sliding device of thin film magnetic head, and, the face relative with medium of sliding device of thin film magnetic head can be formed desired shape.

In addition, in the manufacture method of sliding device of thin film magnetic head of the present invention,, can prevent the mutual absorption of slider and recording medium when when forming diaphragm on the medium opposed faces and on diaphragm, form protuberance.

In addition, in the manufacture method of sliding device of thin film magnetic head of the present invention, when the part beyond the part corresponding with thin film magnetic head element in the medium opposed faces in etching procedure forms protuberance, can prevent the mutual absorption of slider and recording medium.

In addition, in the manufacture method of sliding device of thin film magnetic head of the present invention, when utilizing focused ion beam to carry out etching when the shape of medium opposed faces being become in the medium opposed faces compare the intermediate portion to the side-prominent shape of recording medium one with the end of air outflow side, can prevent the mutual absorption of slider and recording medium with the end of air inflow side.

In addition, in the manufacture method of sliding device of thin film magnetic head of the present invention, during to the tip lengths of an opposite side, can control this length from the end of medium opposed faces one side of magnetoresistive element accurately when utilizing focused ion beam to carry out etching and control.

In addition, in the manufacture method of sliding device of thin film magnetic head of the present invention, during to the tip lengths of an opposite side, can control this length from the end of medium opposed faces one side of pole parts accurately when utilizing focused ion beam to carry out etching and control.

According to the above description, clearer for implementing various form of the present invention and variation this point thereof.Therefore, in the impartial scope of claim scope,, also can implement the present invention below for the form beyond the above-mentioned most preferred embodiment.

Claims

1, the manufacture method of the slider used of a kind of thin-film head, this method is the manufacture method that has the medium opposed faces relative with recording medium and be configured in the slider that near the thin-film head of the thin film magnetic head element the above-mentioned medium opposed faces uses, it is characterized in that having:

Formation comprises substrate, be configured in the insulation course on the aforesaid substrate and the operation of the base material that the slider of the thin film magnetic head element that forms in above-mentioned insulation course is used; And

In the base material that above-mentioned slider is used, the operation of the medium opposed faces that the face that the interface by grinding and aforesaid substrate and insulation course intersects, the base material formation of using for above-mentioned slider and the interface of aforesaid substrate and insulation course intersect;

In the operation of above-mentioned formation medium opposed faces,, in above-mentioned medium opposed faces, produce step difference with respect to state with the corresponding part retraction of substrate with the part corresponding with thin film magnetic head element by above-mentioned grinding;

The manufacture method of the slider that thin-film head is used, after above-mentioned formation medium opposed faces operation, also have the partial etching corresponding with aforesaid substrate, so that in above-mentioned medium opposed faces, the part corresponding with thin film magnetic head element be configured in than with the corresponding part of substrate in the locational operation of the more close recording medium of at least a portion.

2, the manufacture method of the slider of using as the thin-film head of claim 1 record is characterized in that: also be included in the operation that forms diaphragm after the above-mentioned etching procedure on above-mentioned medium opposed faces.

3, the manufacture method of the slider of using as the thin-film head of claim 2 record, it is characterized in that: said protection film is formed by diamond-like-carbon.

4, the manufacture method of the slider of using as the thin-film head of claim 2 record is characterized in that: also be included in the operation that forms protuberance on the said protection film.

5, the manufacture method of the slider of using as the thin-film head of claim 1 record is characterized in that: also be included in the operation that on above-mentioned medium opposed faces, forms diaphragm after the operation that forms above-mentioned medium opposed faces,

In above-mentioned etching procedure, said protection film is carried out partial etching.

6, the manufacture method of the slider of using as the thin-film head of claim 5 record, it is characterized in that: said protection film is formed by diamond-like-carbon.

7, the manufacture method of the slider of using as the thin-film head of claim 5 record; it is characterized in that: the thickness of said protection film more than or equal to above-mentioned etching procedure before in the above-mentioned medium opposed faces, the part corresponding with thin film magnetic head element and with the corresponding part of substrate at least a portion between step difference.

8, the manufacture method of the slider of using as the thin-film head of claim 1 record is characterized in that: in above-mentioned etching procedure, form protuberance on the part corresponding with aforesaid substrate in the medium opposed faces.

9, the manufacture method of the slider of using as the thin-film head of claim 1 record is characterized in that: use ion to grind in above-mentioned etching procedure.

10, the manufacture method of the slider of using as the thin-film head of claim 1 record is characterized in that: use reactive ion etching in above-mentioned etching procedure.

11, the manufacture method of the slider of using as the thin-film head of claim 1 record is characterized in that: utilize focused ion beam to carry out etching in above-mentioned etching procedure.

12, the manufacture method of the slider of using as the thin-film head of claim 11 record is characterized in that: in above-mentioned etching procedure, be the position alignment that benchmark carries out focused ion beam with the end of medium opposed faces.

13, the manufacture method of the slider of using as the thin-film head of claim 11 record, it is characterized in that: in above-mentioned etching procedure, the shape of above-mentioned medium opposed faces is become in the medium opposed faces compare with the end of air outflow side with the end of air inflow side, their center section is to the side-prominent shape of recording medium one.

14, the manufacture method of the slider of using as the thin-film head of claim 13 record, it is characterized in that: in above-mentioned etching procedure, the shape of above-mentioned medium opposed faces is that end from the air inflow side on the medium opposed faces is to the curved shape in the end of air outflow side.

15, the manufacture method of the slider of using as the thin-film head of claim 11 record, it is characterized in that: above-mentioned thin film magnetic head element has magnetoresistive element, in above-mentioned etching procedure, control from the end of medium opposed faces one side of above-mentioned magnetoresistive element to the length of the end of an opposite side.

16, the manufacture method of the slider of using as the thin-film head of claim 11 record, it is characterized in that: above-mentioned thin film magnetic head element has that the mode that comprises mutually with magnetic is coupled, in the mutual opposed pole parts of medium opposed faces one side, and have and comprise the 1st and the 2nd magnetosphere of one deck at least respectively, be located at clearance layer between the above-mentioned the 1st magnetospheric pole parts and the above-mentioned the 2nd magnetospheric pole parts and at least a portion at the film coil that under state, is provided with between the above-mentioned the 1st and the 2nd magnetosphere for the insulation of the above-mentioned the 1st and the 2nd magnetosphere

In above-mentioned etching procedure, control from the end of medium opposed faces one side of above-mentioned pole parts to the length of the end of an opposite side.