CN1700475A - Solid state imaging device and method for producing the same - Google Patents
Solid state imaging device and method for producing the same Download PDFInfo
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- CN1700475A CN1700475A CN 200510072862 CN200510072862A CN1700475A CN 1700475 A CN1700475 A CN 1700475A CN 200510072862 CN200510072862 CN 200510072862 CN 200510072862 A CN200510072862 A CN 200510072862A CN 1700475 A CN1700475 A CN 1700475A
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Abstract
There is provided a solid-state imaging device including: a base that has a through hole penetrating therethrough from a first principal face thereof to a second principal face thereof; a solid-state imaging element whose imaging surface faces an opening on the second principal face side of the through hole and that is fixed to a peripheral region of the opening with a sealing resin; and a translucent plate that is fixed to a peripheral region of an opening on the first principal face side of the through hole with a sealing resin, wherein the peripheral region of at least one of the opening on the first principal face side and the opening on the second principal face side is roughened more than other regions of the base. Thus, a solid-state imaging device that can reduce resin bleeding, while ensuring connection reliability, is provided.
Description
Technical field
The present invention relates to solid photographic device and manufacture method thereof.
Background technology
In recent years, utilize to be subjected to the optics device of light, light-emitting component in high performance, miniaturization, to obtain progress, for example, be used in the automatic switching system of door, so that fields such as remote controls.Wherein particularly solid photographic device is widely used in fields such as medical treatment, industry, information, for example is used on the electronic equipments such as portable phone, digital still camera, video camera.In recent years, follow miniaturization, the slimming of electronic equipment, same strong requirement is also arranged for solid photographic device.In order to respond such requirement, for example, the solid photographic device of above-mentioned requirements has been proposed to satisfy in the TOHKEMY 2002-43554 communique.
Fig. 9 is the profile of the solid photographic device 200 that proposed in the TOHKEMY 2002-43554 communique.As shown in Figure 9, pedestal 32 has tabular form, at central part through hole 17 is arranged, and forms wiring figure 33 on the interarea of downside in the drawings.On wiring figure 33, solid-state imager 30 is installed across projection (bump) 34 upside-down mountings.The interarea of upside is provided with glass plate 31 in the figure of pedestal 32.Filled sealing resin 35, filled sealing resin 36 at the periphery of glass plate 31 at the periphery of solid-state imager 30, the photo detector 38 of solid-state imager 30 is sealed thus.In addition, because Metal Ball 37 is arranged on the outside terminal of pedestal 32, so on the basis at the interval that keeps appropriateness between circuit board that solid photographic device 200 is installed (not having diagram) and the solid photographic device 200, can be electrically connected foregoing circuit plate and solid photographic device 200.And pedestal 32 can use for example glass epoxy resin substrate or ceramic substrate.
Below, with reference to Figure 10 and Figure 11 the manufacture method of solid photographic device 200 is described.At first, photo detector 38 is towards through hole 17, make the position alignment of pedestal 32 and solid-state imager 30 after, on wiring figure 33, solid-state imager 30 (Figure 10 A) is installed across projection 34 upside-down mountings.Then, for the stability that is electrically connected,, inject sealing resin 35 (Figure 10 B) with dispenser (dispenser) 16 in the gap of pedestal 32 and solid-state imager 30.Then, make sealing resin 35 full solidification after, on the precalculated position of the face opposite, with dispenser 16 coating sealing resins 36 (Figure 11 A) with the installed surface of the solid-state imager 30 of pedestal 32.Then, make the position alignment of pedestal 32 and glass plate 31 after, on pedestal 32, load glass plates 31 (Figure 11 B) across sealing resin 36.At last, Metal Ball 37 (with reference to Fig. 9) is installed on the outside terminal of pedestal 32, forms solid photographic device 200 as shown in Figure 9.
But, above-mentioned solid photographic device and manufacture method thereof in the past, there are the following problems: the Position Control of the rounded end 35a (with reference to Figure 12) that forms in the gap of solid-state imager 30 and pedestal 32; The Position Control of rounded end 36a, the 36b (with reference to Figure 12) that forms in the gap of pedestal 32 and glass plate 31; Solid-state imager 30 or glass plate 31 surface state that depends on pedestal 32 and glass plate 31 with respect to the adaptation of pedestal 32.Its result, the resin that the connection reliability of the upside-down method of hull-section construction coupling part that causes because of the lack of fill-out of sealing resin 35 descends, soak into the surface of the pedestal 32 that causes and the back side because of the transition of sealing resin 35 and sealing resin 36 on the contrary oozes out the bad order of (bleed) and soaks into the resin to outside terminal that causes because of the transition of sealing resin 35 and oozes out the bad connection that produces Metal Ball 37, becomes the reason that yields descends.
For the surface state that makes pedestal 32 is stablized, sometimes pedestal 32 is carried out asperities processing such as plasma treatment, blasting treatment, in this case, owing to increased the whole wettability in pedestal 32 surfaces, take place easily so ooze out resin, have the danger that the yields that causes because of above-mentioned bad order descends, bad connections take place Metal Ball 37 from rounded end 35a and rounded end 36a.
On the other hand, pedestal 32 is not implemented under the situation of asperities processing such as plasma treatment, blasting treatment, because of the decline of the adaptation of surface contamination, pedestal 32 and the solid-state imager 30 of wiring figure 33, the danger that the connection reliability of solid-state imager 30 and pedestal 32 descends will take place.
Because above-mentioned phenomenon has the relation of balance (tradeoff), the resin that suppresses to occur in rounded end when keeping stable electrical connection oozes out and is unusual difficulty.
In addition, the size of the rounded end 36a of sealing resin 36 depends on the surface state of the coating amount and the glass plate 31 of sealing resin 36, but the deterioration of the vibration when loading because of glass plate 31, the surface state of glass plate 31, the opening portion of through hole 17 forms excessive rounded end 36b sometimes.In this case, for the incidence angle that makes the light 39 (with reference to Figure 12) that is sent to photo detector 38 becomes big, might cause the perimeter gap (カ ケ) of the output image of solid photographic device 200 and the minimizing of peripheral light amount.
Summary of the invention
The invention provides and when guaranteeing connection reliability, can reduce solid photographic device and the manufacture method thereof that resin oozes out.
The solid photographic device of the 1st scheme of the present invention comprises:
Pedestal has the through hole that extends through its 2nd interarea from its 1st interarea;
Solid-state imager with the opening of its shooting face towards above-mentioned the 2nd interarea side of above-mentioned through hole, and is fixed on the neighboring area of above-mentioned opening by sealing resin;
Light transmission sheet material is fixed on the neighboring area of opening of above-mentioned the 1st interarea side of above-mentioned through hole by sealing resin;
Above-mentioned solid photographic device is characterised in that,
At least one side's of the opening of the opening of above-mentioned the 1st interarea side and above-mentioned the 2nd interarea side above-mentioned neighboring area is than other regional asperitiesization of said base
The solid photographic device of the 2nd scheme of the present invention comprises:
Pedestal has the through hole that extends through its 2nd interarea from its 1st interarea;
Solid-state imager with the opening of its shooting face towards above-mentioned the 2nd interarea side of above-mentioned through hole, and is fixed on the neighboring area of above-mentioned opening by sealing resin;
Light transmission sheet material is fixed on the neighboring area of opening of above-mentioned the 1st interarea side of above-mentioned through hole by sealing resin;
Above-mentioned solid photographic device is characterised in that,
With the neighboring area of the bonding above-mentioned light transmission sheet material in the above-mentioned neighboring area of the opening of above-mentioned the 1st interarea side, than other regional asperitiesization of above-mentioned light transmission sheet material.
The manufacture method of the 1st scheme of solid photographic device of the present invention is characterized in that comprising following operation:
Shaping has the operation of pedestal that extends through the through hole of its 2nd interarea from its 1st interarea;
The operation of the neighboring area of the opening of above-mentioned the 2nd interarea side of the above-mentioned through hole of asperities processing;
With the shooting face of solid-state imager opening, will be fixed on the operation of the above-mentioned neighboring area of above-mentioned opening with sealing resin towards above-mentioned the 2nd interarea side; And
Light transmission sheet material is fixed on the operation of neighboring area of opening of above-mentioned the 1st interarea side of above-mentioned through hole with sealing resin.
The manufacture method of the 2nd scheme of solid photographic device of the present invention is characterized in that comprising following operation:
Shaping has the operation of pedestal that extends through the through hole of its 2nd interarea from its 1st interarea;
The operation of the neighboring area of the opening of above-mentioned the 1st interarea side of the above-mentioned through hole of asperities processing;
With the shooting face of solid-state imager opening, above-mentioned solid-state imager is fixed on the operation of the neighboring area of above-mentioned opening with sealing resin towards above-mentioned the 2nd interarea side of above-mentioned through hole; And
Light transmission sheet material is fixed on the operation of neighboring area of the opening of above-mentioned the 1st interarea side with sealing resin.
The manufacture method of the 3rd scheme of solid photographic device of the present invention is characterized in that comprising following operation:
Shaping has the operation of pedestal that extends through the through hole of its 2nd interarea from its 1st interarea;
With the shooting face of solid-state imager opening, above-mentioned solid-state imager is fixed on the operation of the neighboring area of above-mentioned opening with sealing resin towards above-mentioned the 2nd interarea side of above-mentioned through hole;
The operation of the neighboring area of asperities processing light transmission sheet material; And
Operation with the above-mentioned neighboring area of the neighboring area of the opening of above-mentioned the 1st interarea side of the bonding above-mentioned through hole of sealing resin and above-mentioned light transmission sheet material.
Description of drawings
Fig. 1 is the profile of the solid photographic device of an embodiment of the invention.
Fig. 2 is the enlarged drawing of the bonding position of the flip-chip of Fig. 1 section.
Fig. 3 A, Fig. 3 B are the plane graphs of solid photographic device shown in Figure 1, and wherein, Fig. 3 A is to be the plane graph of observing from the Metal Ball side from plane graph, Fig. 3 B that the glass plate side is observed.
Fig. 4 A, Fig. 4 B are the plane graphs of an example that is illustrated in the manufacture method of the pedestal that uses in the solid photographic device shown in Figure 1.
Fig. 5 A, Fig. 5 B are the profiles of an example of the pedestal that uses in solid photographic device shown in Figure 1 of expression operation that Metal Ball is installed.
Fig. 6 A～Fig. 6 C is the profile of an example of the manufacture method of explanation solid photographic device shown in Figure 1.
Fig. 7 A, Fig. 7 B are the profiles of an example of the manufacture method of explanation solid photographic device shown in Figure 1.
Fig. 8 A, Fig. 8 B are the profiles of an example of the manufacture method of explanation solid photographic device shown in Figure 1.
Fig. 9 is the profile of solid photographic device in the past.
Figure 10 A, Figure 10 B are the profiles that is used to illustrate the manufacture method of solid photographic device in the past.
Figure 11 A, Figure 11 B are the profiles that is used to illustrate the manufacture method of solid photographic device in the past.
Figure 12 is the enlarged drawing of the bonding position of the flip-chip of Fig. 9 section.
Embodiment
At first, the solid photographic device with regard to the 1st scheme of the present invention describes.The solid photographic device of the 1st scheme of the present invention comprises: pedestal, solid-state imager and light transmission sheet material with through hole.Above-mentioned through hole forms from the 2nd interarea that the 1st interarea of pedestal extends through pedestal.At this, so-called " the 1st interarea of pedestal " is meant the interarea of the pedestal that is fixed with light transmission sheet material one side; So-called " the 2nd interarea of pedestal " is meant the interarea of the pedestal that is fixed with solid-state imager one side.
The constituent material of pedestal can use for example glass substrate, glass epoxy resin substrate, ceramic substrate etc.The thickness of pedestal for example is about 0.7～2.5mm.The aperture area of the through hole that is provided with on pedestal in addition, for example is 20～100mm
2About.
Solid-state imager is with the opening of its shooting face towards the 2nd interarea side of through hole, and is fixed on the neighboring area of this opening by sealing resin.At this, so-called " shooting face " for example is meant the face of having arranged photo detector.In addition, light transmission sheet material is fixed on the neighboring area of opening of the 1st interarea side of through hole by sealing resin.The constituent material of light transmission sheet material has no particular limits so long as can see through the material of the light that above-mentioned photo detector accepts and get final product, but for example used thickness is a glass plate etc. about 0.3～0.5mm.In addition, the solid photographic device of the 1st scheme of the present invention, the opening of its 1st interarea side with and at least one side's of the opening of the 2nd interarea side neighboring area, than other regional asperitiesization of pedestal.At this, so-called " asperities " is after having carried out for example asperities such as plasma treatment, blasting treatment processing, and the state of the rugosity (roughness) on surface when being untreated relatively becomes big face zone; In following embodiments of the present invention, by mask in same, produce the asperities processing arranged and do not have the asperities processing, form the asperities of part.Method with the state of numeric representation asperities is to use determining instruments such as contact surface roughness meter, the Ra value of " arithmetic average rugosity (standard JIS B0031, the B0601) " that tries to achieve.Among the present invention, preferably carried out the arithmetic average rugosity on the surface of arithmetic average rugosity Ra when being untreated on the surface of asperities processing, more than the big 0.3 μ m.
In the solid photographic device of the 1st scheme of the present invention, for the opening that makes its 1st interarea side with and at least one side's of the opening of the 2nd interarea side neighboring area, other regional asperitiesization than pedestal, and at above-mentioned neighboring area and above-mentioned other the boundary in zone, the wettability of sealing resin changes.Thus, can prevent that from above-mentioned neighboring area (zone that wettability is high) ooze out to above-mentioned other the resin in zone (zone that wettability is low).In addition, utilize the anchoring effect of above-mentioned neighboring area, can improve the adaptation of connection reliability, pedestal and the light transmission sheet material of pedestal and solid-state imager.
Then, the solid photographic device with regard to the 2nd scheme of the present invention describes.And, in following record, omit the identical content of solid photographic device illustrated with the 1st scheme of the invention described above.
The solid photographic device of the 2nd scheme of the present invention comprises: pedestal, solid-state imager and light transmission sheet material with through hole.Above-mentioned through hole forms from the 2nd interarea that the 1st interarea of pedestal extends through pedestal.In addition, the solid photographic device of the 2nd scheme of the present invention is with the neighboring area of the bonding light transmission sheet material in the neighboring area of the opening of its 1st interarea side, than other regional asperitiesization of light transmission sheet material.Therefore, can bring into play the identical effect of solid photographic device with the 1st scheme of the invention described above.In addition, identical with the solid photographic device of the 1st scheme of the invention described above for more positively bringing into play this effect, at least one side's of the opening of the opening of preferred the 1st interarea side and the 2nd interarea side neighboring area is than other regional asperitiesization of pedestal.
Then, the manufacture method with regard to the 1st scheme of solid photographic device of the present invention describes.The manufacture method of the 1st scheme of solid photographic device of the present invention is the example of manufacture method of solid photographic device that is fit to the 1st scheme of the invention described above.And, in following record, sometimes to the identical content of solid photographic device of the 1st scheme of the invention described above, omit its explanation.
The manufacture method of the 1st scheme of solid photographic device of the present invention comprises: being shaped has the operation of pedestal that extends through the through hole of the 2nd interarea from the 1st interarea; The operation of the neighboring area of the 2nd interarea side opening of asperities processing through hole; With the shooting face of solid-state imager opening, solid-state imager is fixed on the operation of the neighboring area of this opening with sealing resin towards the 2nd interarea side; And the operation of neighboring area of opening that light transmission sheet material is fixed on the 1st interarea side of through hole with sealing resin.
As the method that on pedestal, forms through hole, in the resin-sealed operation when making pedestal, the method that forms through hole with the processing that is shaped is only, but also can wait mechanical processing tools or laser processing means etc. to form through hole with punching (punch) processing in resin-sealed back.The following stated is the operation of asperities processing, by the operation of sealing resin fixed solid imaging apparatus and by the fixing suitable example of the operation of light transmission sheet material of sealing resin.
In the manufacture method of the 1st scheme of solid photographic device of the present invention, owing to comprise the operation that the asperities processing is carried out in the neighboring area of the opening of the 2nd interarea side of through hole, as mentioned above, just can prevent resin to by the asperities change outer the oozing out in zone, and the connection reliability of raising pedestal and solid-state imager.
Then, the manufacture method with regard to the 2nd scheme of solid photographic device of the present invention describes.The manufacture method of the 2nd scheme of solid photographic device of the present invention is other the example of manufacture method of solid photographic device that is fit to the 1st scheme of the invention described above.And, in following record, sometimes for the identical content of manufacture method of the 1st scheme of the solid photographic device of the 1st scheme of the invention described above and solid photographic device of the present invention, omit its explanation.
The manufacture method of the 2nd scheme of solid photographic device of the present invention comprises: being shaped has the operation of pedestal that extends through the through hole of the 2nd interarea from the 1st interarea; The operation of the neighboring area of the opening of the 1st interarea side of asperities processing through hole; With the shooting face of solid-state imager opening, solid-state imager is fixed on the operation of the neighboring area of this opening with sealing resin towards the 2nd interarea side of through hole; And the operation of neighboring area that light transmission sheet material is fixed on the opening of the 1st interarea side with sealing resin.
In the manufacture method of the 2nd scheme of solid photographic device of the present invention, owing to comprise the operation that the asperities processing is carried out in the neighboring area of the opening of the 1st interarea side of through hole, as mentioned above, just might prevent resin to by the asperities change outer the oozing out in zone, and the adaptation of raising pedestal and light transmission sheet material.
Then, the manufacture method with regard to the 3rd scheme of solid photographic device of the present invention describes.The manufacture method of the 3rd scheme of solid photographic device of the present invention is the example of manufacture method of solid photographic device that is fit to the 2nd scheme of the invention described above.And, in following record, for the identical content of manufacture method of the 1st scheme of the solid photographic device of the 2nd scheme of the invention described above and solid photographic device of the present invention, omit its explanation.
The manufacture method of the 3rd scheme of solid photographic device of the present invention comprises: being shaped has the operation of pedestal that extends through the through hole of the 2nd interarea from the 1st interarea; With the shooting face of solid-state imager opening towards the 2nd interarea side of through hole; Solid-state imager is fixed on the operation of the neighboring area of this opening with sealing resin; The operation of the neighboring area of asperities processing light transmission sheet material; And by the operation of the neighboring area of the neighboring area of the opening of the 1st interarea side of the bonding through hole of sealing resin and light transmission sheet material.
In the manufacture method of the 3rd scheme of solid photographic device of the present invention, owing to comprise the operation of the neighboring area of light transmission sheet material being carried out the asperities processing, as mentioned above, just might prevent resin to by the asperities change outer the oozing out in zone, and the adaptation of raising pedestal and light transmission sheet material.
Below, in the reference accompanying drawing, with regard to the solid photographic device of an embodiment of the invention with and manufacture method describe.
Fig. 1 is the profile of the solid photographic device 100 that relates to of an embodiment of the invention.As shown in Figure 1, the pedestal 1 that is made of the insulating properties material has tabular form, has through hole 17 at middle body.Through hole 17 extends through the 2nd interarea 1b of pedestal 1 and forms from the 1st interarea 1a of pedestal 1.On the 2nd interarea 1b of pedestal 1, form wiring figure 2.On wiring figure 2, solid photographic device 5 is installed across golden projection 4 upside-down mountings.On the 1st interarea 1a of pedestal 1, glass plate 7 is set.Filled sealing resin 6 at the periphery of solid-state imager 5, filled sealing resin 8 at the periphery of glass plate 7, photo detector 9 is sealed thus.In addition, because Metal Ball 3 is set on the outside terminal of pedestal 1, so on the basis at the interval that keeps appropriateness between circuit board that solid photographic device 100 has been installed (not having diagram) and the solid photographic device 100, can be electrically connected foregoing circuit plate and solid photographic device 100.And Metal Ball 3 can be used the SnPb63 ball that for example is made of Sn-Pb or Sn-Ag-Cu etc.In addition, Metal Ball 3 can be used the SnPb63 ball that covers SnPb63 on every side at the core of formations such as Cu.
Fig. 2 is the enlarged drawing of section at the bonding position of flip-chip of Fig. 1.As shown in Figure 2, form asperities zone 10, and the asperities processing is carried out in this asperities zone 10, make its rugosity bigger than other zone of pedestal 1 in the part that is connected with sealing resin 6 and sealing resin 8 of pedestal 1.In the present embodiment, the arithmetic average rugosity Ra in asperities zone 10 is about 0.5 μ m, and the arithmetic average rugosity Ra that does not implement the zone (untreated areas) of asperities processing on the pedestal is about 0.1 μ m.Surface at pedestal 1 forms asperities zone 10, and on the border of asperities zone 10 and untreated areas, wettability changes.Therefore, for example when injecting sealing resin 6, even sealing resin 6 has resin to ooze out in the high asperities zone 10 of wettability, the border in asperities zone 10 and untreated areas (being the low zone of wettability) also can stop resin to ooze out.In addition, utilize the anchoring effect in asperities zone 10, can improve the adaptation of connection reliability, pedestal 1 and the glass plate 7 of pedestal 1 and solid-state imager 5.
In addition, as shown in Figure 2, form asperities zone 11, the asperities processing is carried out in this asperities zone 11, make its rugosity bigger than other zone of glass plate 7 in the part that is connected with sealing resin 8 of glass plate 7.Thus, the same with the situation in above-mentioned asperities zone 10, can improve the adaptation of pedestal 1 and glass plate 7.
Fig. 3 A, Fig. 3 B are the plane graphs of solid photographic device 100 shown in Figure 1, and wherein, Fig. 3 A is to be the plane graph of observing from Metal Ball 3 sides from plane graph, Fig. 3 B that glass plate 7 sides are observed.As shown in Figure 3A, cover through hole 17 (not having diagram) in the central authorities of pedestal 1 glass plate 7 is set, by the periphery of sealing resin 8 seal glass plates 7.In addition, shown in Fig. 3 B, the through hole 17 (not having diagram) that covers the central authorities of pedestal 1 is arranged solid-state imager 5, by the periphery of sealing resin 6 sealing solid imaging apparatuss 5.
Fig. 4 A, Fig. 4 B are the plane graphs of an example of the manufacture method of expression pedestal 1.At first, shown in Fig. 4 A,, prepare at the built-in inserted plate (interposer) 40 of lining up to have arranged wiring figure 2 in length and breadth in order to make a plurality of pedestals 1 expeditiously.On each wiring figure 2, form terminal pad (pad) 42 and outside terminal 43.And, in order to improve the productivity of pedestal 1,, equally spaced arrange location hole 41 at the two ends of the Width of built-in inserted plate 40.
The constituent material of this built-in inserted plate 40 can use the metal forming (forming Ni-Au plated film etc. on the Cu paper tinsel) or the metallic lead frame (Fe-Ni material, Cu alloy material etc.) of glue sheet.In the present embodiment, just the example of metallic lead frame as the material that constitutes built-in inserted plate 40 described.The metallic lead frame is shaped processing by punch process or etching and processing etc. and makes.When processing metal making wire frame,, cover by resin coating and state the possibility that partly becomes, from just can't see above-mentioned part in appearance if process the thickness of the metal of the terminal pad 42 of wiring figure 2 and outside terminal 43 part in addition thinly.
Then, the mode of exposing with only terminal pad 42 and outside terminal 43 (with reference to Fig. 4 B) covers the part as pedestal 1 on the built-in inserted plate 40 with epoxies, phenolic or phenyl class insulating resin as the sealant of main component, and forms through hole 17.Thus, shown in Fig. 4 B, on built-in inserted plate 40, form a plurality of pedestals 1.Then, though scheme not shownly, each pedestal 1 is cut one by one.
Fig. 5 A, Fig. 5 B are the profiles of expression example of the operation of installation Metal Ball 3 on pedestal.At this, describe as the example of Metal Ball 3 with regard to using solder ball.Shown in Fig. 5 A, Fig. 5 B, with outside terminal 43 and the Metal Ball 3 on the Reflow Soldering welding pedestal 1.And, Metal Ball 3 is installed on pedestal 1, can be shown in Fig. 5 A, Fig. 5 B, before glass plate 7 and solid-state imager 5 are installed, also can be shown in following Fig. 8 B, after glass plate 7 and solid-state imager 5 are installed.In addition, in the present invention, Metal Ball 3 is not necessary inscape.For example, go up when forming counterbore or through hole, can avoid just not needing Metal Ball 3 under the situation about contacting of the bottom surface of solid-state imager 5 and foregoing circuit substrate at the circuit board that solid photographic device 100 is installed (do not have diagram).
Then, with reference to Fig. 6～Fig. 8, describe with regard to an example of the manufacture method of solid photographic device 100.
At first, as shown in Figure 6A, after loading a plurality of pedestals 1 on the pallet 15, for to pedestal 1 asperities processing predetermined zone (zone that is equivalent to asperities zone 10 as shown in Figure 2) only, and with not carried out the asperities processing behind the zone of asperitiesization again on the mask 14 covering pedestals 1.Mask 14 can use the mask that for example is made of stainless steel or pottery etc., and its thickness is for example about 0.5～1.0mm.
The object lesson of asperities processing, it is effective carrying out following ionization body ashing treatment and blasting treatment; Above-mentioned ionization body ashing treatment for example make the oxygen plasma change gas 13 be radiated at above-mentioned predetermined zone, will be transformed into CO attached to the atomic little part on the top layer of polluter on the above-mentioned predetermined zone and above-mentioned presumptive area
2And H
2Remove behind the gases such as O; The slip that contains the fine ground particle is sprayed in blasting treatment on above-mentioned presumptive area, physically to remove above-mentioned polluter etc.By this asperities processing, can remove the material (grease and dust etc.) that becomes infringement adaptation and infiltrating essential factor.And, owing on above-mentioned predetermined zone, form trickle fluctuating, can obtain the effect of grappling.Therefore, can improve adaptation and wettability.And, in the present embodiment, implement this asperities processing simultaneously at the surface and the back side of pedestal 1.
And, when utilizing plasma treatment to carry out the asperities processing, for example, rating of set is set at 500W, get final product with 30～70 seconds processing times.In addition, when utilizing blasting treatment to carry out the asperities processing, for example abrasive grains can use aluminium oxide particles (granularity: 800～1200mesh (eyelet number per square inch)), carries out with 30～60 seconds processing times.In addition, among Fig. 6 A, with pedestal 1 singly separately after, carry out this asperities processing and be, but also can under the state of pedestal 1 before separately, carry out.
Then, shown in Fig. 6 B, on the electrode pad on the solid-state imager of preparing in addition 5, utilize and use the ball bonding method of ultrasonic wave and thermocompression bonding to form golden projection 4 simultaneously with two sections projectioies.
Then, shown in Fig. 6 C, make solid-state imager 5 upsets that are provided with golden projection 4, make the head branch of golden projection 4 contact the groove of filling conductive paste 12, the crown part that conductive paste 12 is rotated attached to golden projection 4.Conductive paste 12 under this situation can extensively be used in the flip-chip manufacture method at large, for example can use the metal microparticle that will be made of the palladium with good electrical conductivity, silver etc. and have viscosity and the slurry of volatile solvent mixing.In addition, for preventing the short circuit between each terminal pad 42 (with reference to Fig. 4 B),, be the amount that covers about the protruding 4a of crown side of golden projection 4 preferably attached to the adhesion amount of the conductive paste 12 on each golden projection 4.
Then, shown in Fig. 7 A, terminal pad on the pedestal 1 42 and the golden projection 4 corresponding with it are carried out position alignment, and behind loading solid imaging apparatus 5 on the pedestal 1, make solvent evaporates in the conductive paste 12 (with reference to Fig. 6 C) by heat treated, and terminal pad 42 and golden projection 4 are engaged.Then, be the reliability of guaranteeing to be electrically connected, inject sealing resin 6 in the gap of solid-state imager 5 and pedestal 1 with dispenser 16.At this, the part (the asperities zone 10 as shown in Figure 2) that contacts with sealing resin 6 among the 2nd interarea 1b of pedestal 1, carried out the asperities processing and improved wettability in the utilization operation formerly, so the gap (periphery of solid-state imager 5) of sealing resin 6 process solid-state imagers 5 and pedestal 1 promptly is filled.In addition, as mentioned above,, can prevent that sealing resin 6 from oozing out to the resin of untreated areas, arrive outside terminal 43 so for example can prevent the composition that oozes out of sealing resin 6 owing to there is the border of asperities zone 10 and untreated areas.
At this, the sealing resin 6 that injects, for example use the ultraviolet curing resin that contains epoxies, prepolymer class etc. and Photoepolymerizationinitiater initiater, opening irradiation ultraviolet radiation from the 1st interarea 1a side of through hole 17, when injecting sealing resin 6 simultaneously, can prevent that sealing resin 6 is to the zone intrusion of having arranged photo detector 9.
And shown in present embodiment, the flip-chip manufacture method of using golden projection 4 with two sections projectioies to be connected with conductive paste 12 is called binding post bump bond (studbump bonding) manufacture method (SBB manufacture method).
Then, make sealing resin 6 full solidification after, as shown in Figure 7, with presumptive area (as shown in Figure 2 asperities zone 10) the coating sealing resin 8 of dispenser 16 on the 1st interarea 1a of pedestal 1.Asperities zone 10 by the asperities processing by asperitiesization, so improved the wettability of sealing resin 8.In addition, because of there being the border of asperities zone 10 and untreated areas, can prevent that sealing resin 8 from oozing out to the resin of untreated areas.And sealing resin 8 for example can use the resin of the ultraviolet hardening identical with an example of above-mentioned sealing resin 6, or is the resin of the thermohardening type of main component with epoxy resin etc.
Then, shown in Fig. 8 A, between on the pedestal 1, load glass plate 7, and after sealing resin 8 is solidified glass plate 7 is fixed on the surface of pedestal 1 across sealing resin 8.Then, utilize the method shown in above-mentioned Fig. 5 A, B, Metal Ball 3 is installed on wiring figure 2.By said method, can obtain the solid photographic device 100 shown in Fig. 8 B.
And, as shown in Figure 2, in the asperities zone that forms glass plate 7 11 o'clock,, enumerated engraving (engraving) processing etc. that blasting treatment was processed, utilized to the embossing (embossing) that utilizes chemical etching as the method for its asperities processing.By forming asperities zone 11, can prevent that sealing resin 8 from oozing out to the resin of the untreated areas of glass plate 7, and can further improve the adaptation of pedestal 1 and glass plate 7.At this moment, if asperities zone 11 is defined as the part bonding with pedestal 1, just can prevent to arrive the minimizing of amount of the light of photo detector 9, so solid photographic device 100 just may be kept the output characteristic that had originally.
More than, describe with regard to an embodiment of the invention, but the present invention is not limited to above-mentioned execution mode.For example, in manufacture method as the solid photographic device of Fig. 6～shown in Figure 8, behind fixed solid picture pick-up device on the 2nd interarea of pedestal, fastening glass panels on the 1st interarea of pedestal, but also can be behind fastening glass panels on the 1st interarea of pedestal, fixed solid picture pick-up device on the 2nd interarea of pedestal.
As mentioned above, if adopt solid photographic device of the present invention and manufacture method thereof, then can provide a kind of solid photographic device, make it when guaranteeing stable connection reliability, can prevent that resin from oozing out, it is to cause bad order and the bad reason of picture characteristics.
Claims (10)
1. solid photographic device comprises:
Pedestal has the through hole that extends through its 2nd interarea from its 1st interarea;
Solid-state imager with the opening of its shooting face towards above-mentioned the 2nd interarea side of above-mentioned through hole, and is fixed on the neighboring area of above-mentioned opening by sealing resin; And
Light transmission sheet material is fixed on the neighboring area of opening of above-mentioned the 1st interarea side of above-mentioned through hole by sealing resin;
Above-mentioned solid photographic device is characterised in that,
At least one side's of the opening of the opening of above-mentioned the 1st interarea side and above-mentioned the 2nd interarea side above-mentioned neighboring area is than other regional asperitiesization of said base.
2. solid photographic device comprises:
Pedestal has the through hole that extends through its 2nd interarea from its 1st interarea;
Solid-state imager with the opening of its shooting face towards above-mentioned the 2nd interarea side of above-mentioned through hole, and is fixed on the neighboring area of above-mentioned opening by sealing resin; And
Light transmission sheet material is fixed on the neighboring area of opening of above-mentioned the 1st interarea side of above-mentioned through hole by sealing resin;
Above-mentioned solid photographic device is characterised in that,
With the neighboring area of the bonding above-mentioned light transmission sheet material in the above-mentioned neighboring area of the opening of above-mentioned the 1st interarea side, than other regional asperitiesization of above-mentioned light transmission sheet material.
3. as the solid photographic device of claim 2 record, wherein, at least one side's of the opening of the opening of above-mentioned the 1st interarea side and above-mentioned the 2nd interarea side above-mentioned neighboring area is than other regional asperitiesization of said base.
4. the manufacture method of a solid photographic device is characterized in that comprising following operation:
Shaping has the operation of pedestal that extends through the through hole of its 2nd interarea from its 1st interarea;
The operation of the neighboring area of the opening of above-mentioned the 2nd interarea side of the above-mentioned through hole of asperities processing;
With the shooting face of solid-state imager opening, above-mentioned solid-state imager is fixed on the operation of the above-mentioned neighboring area of above-mentioned opening with sealing resin towards above-mentioned the 2nd interarea side; And
Light transmission sheet material is fixed on the operation of neighboring area of the opening of above-mentioned the 1st interarea side with sealing resin.
5. the manufacture method of a solid photographic device is characterized in that comprising following operation:
Shaping has the operation of pedestal that extends through the through hole of its 2nd interarea from its 1st interarea;
The operation of the neighboring area of the opening of above-mentioned the 1st interarea side of the above-mentioned through hole of asperities processing;
With the shooting face of solid-state imager opening, above-mentioned solid-state imager is fixed on the operation of the neighboring area of above-mentioned opening with sealing resin towards above-mentioned the 2nd interarea side of above-mentioned through hole; And
Light transmission sheet material is fixed on the operation of neighboring area of the opening of above-mentioned the 1st interarea side with sealing resin.
6. the manufacture method of a solid photographic device is characterized in that comprising following operation:
Shaping has the operation of pedestal that extends through the through hole of its 2nd interarea from its 1st interarea;
With the shooting face of solid-state imager opening, above-mentioned solid-state imager is fixed on the operation of the neighboring area of above-mentioned opening with sealing resin towards above-mentioned the 2nd interarea side of above-mentioned through hole;
The operation of the neighboring area of asperities processing light transmission sheet material; And
Operation with the above-mentioned neighboring area of the neighboring area of the opening of above-mentioned the 1st interarea side of the bonding above-mentioned through hole of sealing resin and above-mentioned light transmission sheet material.
7. as the manufacture method of the solid photographic device of each record of claim 4 to 6, wherein, in the operation of above-mentioned asperities processing, cover the zone of not handling with mask.
8. as the manufacture method of the solid photographic device of each record of claim 4 to 6, wherein, above-mentioned asperities processing is a plasma treatment.
9. as the manufacture method of the solid photographic device of each record of claim 4 to 6, wherein, above-mentioned asperities processing is blasting treatment.
10. as the manufacture method of the solid photographic device of each record of claim 4 to 6, wherein, in the operation with the fixing above-mentioned solid-state imager of sealing resin, above-mentioned sealing resin is the resin of ultraviolet hardening,
To the above-mentioned neighboring area of the opening of above-mentioned the 2nd interarea side and the bonding position of above-mentioned solid-state imager,, inject above-mentioned sealing resin to above-mentioned adhesive portion position simultaneously from the opening irradiation ultraviolet radiation of above-mentioned the 1st interarea side.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP152316/2004 | 2004-05-21 | ||
| JP2004152316 | 2004-05-21 | ||
| JP111082/2005 | 2005-04-07 |
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| CN100479173C CN100479173C (en) | 2009-04-15 |
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| CNB2005100728626A Expired - Fee Related CN100479173C (en) | 2004-05-21 | 2005-05-20 | Solid state imaging device and method for producing the same |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101536489B (en) * | 2006-11-14 | 2011-03-30 | 凸版印刷株式会社 | Solid-state imaging device and electronic device |
| CN102714211A (en) * | 2010-08-04 | 2012-10-03 | 松下电器产业株式会社 | Solid-state image pickup device |
| CN102740119A (en) * | 2011-04-15 | 2012-10-17 | 特克特朗尼克公司 | Full reference system for predicting subjective quality of three-dimensional video |
| CN112585952A (en) * | 2018-08-30 | 2021-03-30 | 索尼半导体解决方案公司 | Solid-state imaging device and method for manufacturing solid-state imaging device |
-
2005
- 2005-05-20 CN CNB2005100728626A patent/CN100479173C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101536489B (en) * | 2006-11-14 | 2011-03-30 | 凸版印刷株式会社 | Solid-state imaging device and electronic device |
| CN102714211A (en) * | 2010-08-04 | 2012-10-03 | 松下电器产业株式会社 | Solid-state image pickup device |
| CN102714211B (en) * | 2010-08-04 | 2015-06-17 | 松下电器产业株式会社 | Solid-state image pickup device |
| CN102740119A (en) * | 2011-04-15 | 2012-10-17 | 特克特朗尼克公司 | Full reference system for predicting subjective quality of three-dimensional video |
| CN112585952A (en) * | 2018-08-30 | 2021-03-30 | 索尼半导体解决方案公司 | Solid-state imaging device and method for manufacturing solid-state imaging device |
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| Publication number | Publication date |
|---|---|
| CN100479173C (en) | 2009-04-15 |
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