CN1697166A - Structure for bearing and installing wafer and bearing seat - Google Patents
Structure for bearing and installing wafer and bearing seat Download PDFInfo
- Publication number
- CN1697166A CN1697166A CNA2004100442022A CN200410044202A CN1697166A CN 1697166 A CN1697166 A CN 1697166A CN A2004100442022 A CNA2004100442022 A CN A2004100442022A CN 200410044202 A CN200410044202 A CN 200410044202A CN 1697166 A CN1697166 A CN 1697166A
- Authority
- CN
- China
- Prior art keywords
- wafer
- stacker
- bearing
- continuing surface
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The disclosed supporting structure for chip is composed of supporting seat and semiconductor chip. The said seat is capable of installing or separating any semiconductor chip, and the semiconductor chip includes multiple contacts and IC elements. The supporting seat is an insulative seat in integration or combination type. The supporting seat sets up at least one supporting surface, where there are contact ends of transfer media matched to contacts of chip. Formed on each transfer medium, welding ends or plugging in ends is extended to selected face of the supporting seat. Thus, semiconductor chip can be assembled or disassembled. The invention eliminates packaging procedure and equipment.
Description
Technical field
The present invention relates to the design of a kind of wafer structure for bearing and installing and stacker, particularly a kind of wafer structure for bearing and installing and stacker that is widely used in memory wafers such as DRAM, SRAM, SDRAM, Flash, DDR or Rambus, microprocessor, logicality or RF RF chip etc.
Background technology
Traditional semiconductor wafer of being finished by the wafer cutting is provided with plural solder joint and integrated circuit component at its selected face, and desire specifically is applied to circuit board etc. electrically during equipment with this wafer, usually must be through one encapsulating structure process; See also shown in Figure 1, it is that plural solder joint 101 these faces at single wafer 10 are provided with electrical outward lead frame, this lead frame is formed with a plurality of fingers 20 that draw, and refer to 101 of 20 selected face and solder joints in drawing, weldering is connected with plain conductor 30, make this wafer 10 and draw by this and with an adhesive body 40 referring to that 20 1 ends form encapsulation, only reserve respectively to draw and refer to 20 other ends, to use with other electric device welding such as circuit board in adhesive body 40 outsides.
From the above, before the wafer of commonly seeing desires to be applied in other electric devices such as circuit board, all must be through loaded down with trivial details encapsulation procedure, and use accurate and expensive machinery and die apparatus to encapsulate, thereby, except causing it to make effectively to reduce with use cost, and cause the application elasticity of this wafer restricted, for example can't change the benefit of wafer arbitrarily to obtain to expand or change, maybe can't make the wafer different circuit pad (as the pad of circuit board face) of coupling arbitrarily, even must eliminate useless full wafer circuit board, therefore because of one is difficult to the wafer of conversion, the enforcement of traditional encapsulating structure, really non-reasonable and practical.
Summary of the invention
It is loaded down with trivial details to the objective of the invention is to solve above-mentioned wafer package process, cause and make and the high problem of use cost, and a kind of encapsulation procedure and equipment exempted is provided, make to make and reduce with use cost, but and the wafer structure for bearing and installing and the stacker of elasticity replacing wafer or stacker application.
The present invention's wafer structure for bearing and installing includes wafer, stacker, and wherein, the face of wafer is provided with plural contact; The pedestal place of stacker is provided with the continuing surface of open shape for putting wafer, is provided with each contact jaw that several mate the switching medium of wafers plural number contacts at continuing surface, and each medium of transferring extends the welding ends that the selected face of stacker forms outer dewiness; By this, select wafer to be located at the continuing surface place of stacker arbitrarily, the plural contact of wafer is connected mutually with the contact jaw of the medium of respectively transferring of continuing surface, form the wafer structure for bearing and installing that to assemble application arbitrarily, so can exempt expensive encapsulation procedure with this.
Described stacker end face is provided with at least one groove, and any one side in this groove can be used as described continuing surface; Described stacker end face is provided with at least one protruding seat, and with any end face of this protruding seat as described continuing surface; Described stacker can be plane pedestal, and with its plane as described continuing surface; The contact jaw of the described switching medium that lies along continuing surface is for fixedly contact or Elastic Contact or be enough to and the plural contact contacting structure of wafer form; The welding ends of described switching medium forms and convexedly stretches in the outer pin form of stacker; The welding ends of described switching medium forms the form that exposes to the selected face of stacker with at least one plane; The welding ends of described switching medium forms slightly and shrinks in the stacker, exposes and have the tin ball to constitute with the welding ends clamping.
Description of drawings
Fig. 1 is the schematic diagram of known chip package structure.
Fig. 2 is formed at the enforcement schematic diagram of groove for continuing surface of the present invention.
Fig. 3 is located at the assembling schematic diagram of groove for continuing surface of the present invention.
Fig. 4 is located at the enforcement schematic diagram of protruding seat for continuing surface of the present invention.
Fig. 5 is located at the enforcement schematic diagram of accepting seat surface for continuing surface of the present invention.
Fig. 6 is the enforcement schematic diagram one of the welding ends of switching medium of the present invention.
Fig. 7 is the enforcement schematic diagram two of the welding ends of switching medium of the present invention.
Fig. 8 is the enforcement schematic diagram three of the welding ends of switching medium of the present invention.
Fig. 9 is the enforcement view of step groove of the present invention.
Figure 10 is the enforcement view of plural groove of the present invention
Concrete enforcement side
See also shown in Figure 2, the present invention can be widely used in various wafers, the present invention's wafer structure for bearing and installing includes wafer 1 and stacker 2, wherein, wafer 1 can be the wafer of silicon, GaAs or moulding that other semi-conducting material is cut apart, and is provided with a plurality of contacts 11 and plans the integrated circuit component that forms in selected face; And can constitute memory wafers such as DRAM, SRAM, SDRAM, Flash, DDR or Rambus, microprocessor, logicality or RF RF chip etc. on concrete the enforcement, there is no limitation;
Stacker 2 is the insulating base frame of one or combination forming, be provided with open fully or open arbitrarily continuing surface 21 for putting wafer 1 at the pedestal chosen place, be provided with each contact jaw 221 of conductivity switching medium 22 of several coupling wafers plural number contacts 11 in this continuing surface 21, and the order medium 22 of respectively transferring extends stacker 2 selected faces and is formed with welding ends 222 or inserted terminal;
By this, see also shown in Figure 3, arbitrarily selected particular wafer 1 is arranged in the continuing surface 21 of stacker 2, make the plural contact 11 of this wafer 1 selected face connect mutually, but promptly form the present invention's flexible application and exempt the wafer structure for bearing and installing of encapsulation procedure with the contact jaw 221 of the medium 22 of respectively transferring of continuing surface 21.
But, continuing surface 21 forms of opening or can opening arbitrarily fully of stacker 2 of the present invention, be to be embodied as at stacker 2 selected end faces to be provided with groove 23, and utilize these groove 23 bottom surfaces as described continuing surface 21, and arrangement is provided with the contact jaw 221 of plural number switching medium 22, be connected to constitute assembling by this, as shown in Figures 2 and 3 with wafer 1; The selected end face that also can be embodied as at stacker 2 is provided with protruding seat 24, and utilizes this end face of protruding 24 as continuing surface 21, and arranges the contact jaw 221 that plural number switching medium 22 is set, and is connected to constitute to assemble with wafer 1, as shown in Figure 4; Also can directly on stacker 2, form plane and as continuing surface 21, and then arrange the contact jaw 221 that plural number switching medium 22 is set, to constitute the assembling connection status with wafer 1, as shown in Figure 5, therefore, the formation of continuing surface 21 of the present invention is not exceeded with single form.
In addition, the plural number switching medium 22 of stacker 2 of the present invention, can be the structural thing that is constituted with metal material, and be fixed in any chosen place of stacker 2, and it lies along the contact jaw 221 enforcement states of continuing surface 21, can be fixed contact jaw or Elastic Contact end or other is enough to plural contact 11 contacting structure forms with wafer 1, as Fig. 2 to shown in Figure 5; Plural number switching medium 22 extends the welding ends 222 that stacker 2 selected faces expose, can be embodied as and convexedly stretch in around the stacker 2 or the pin form of bottom, extremely shown in Figure 5 as Fig. 2, or form and expose to around the stacker 2 or the form of bottom with at least one plane, as Fig. 6, shown in Figure 7, or other is enough to expose and contacts the structural form of application, as shown in Figure 8, be that this welding ends 222 is slightly shunk in the stacker 2, expose and have tin ball 223 to form with these welding ends 222 clampings; Therefore, the form of the complete corresponding or corresponding contact of selectivity of the structural contact jaw 221 that is enough to make plural number switching medium 22 such as and wafer 1 contact 11, and be enough to welding ends 222 is connected with miscellaneous equipment and the structural form used, in the technology of the present invention scope, all can be implemented to constitute.
Use technological means of the present invention, can make the stacker 2 of coupling specific function wafer in advance, assembling is used so that contact jaw 221 and contact 11 are corresponding fully, also can make the stacker 2 of general different chips in advance, and selectivity makes contact jaw 221 and the corresponding assemblings use in contact 11 parts; This shows,, not only exempt the loaded down with trivial details processing procedure (for example must not carry out the routing process) of known wafer package and use accurate and expensive packaging machinery equipment, make and the use cost reduction and can effectively make with the present invention; Also can be because of the open fully of stacker 2 or the continuing surface 21 that can open arbitrarily, and continuing surface 21 plural contact jaw 221 structural forms, reach same stacker 2 convertible different chips 1, or flexible application effect such as same wafer 1 convertible different shape stacker 2, for example, looking circuit board or miscellaneous equipment connects and counts out variation and change the stacker 2 be complementary, or make stacker 2 application become measurement jig, or the crystal that makes stacker 2 supply to finish with encapsulation is assembled to adapt to the different application demand, so more attain practical progressive than known wafer fixed sealing packing technique.
In addition, described stacker 2 does not exceed to provide with a wafer 1 assembling, also groove 23 structural forms as described above, further implement stepped groove 23, as shown in Figure 9, and with each cascaded surface as described continuing surface 21, and be provided with the structural contact jaw 221 of plural number switching medium 22, by this further stacked several wafers 1 of assembling of establishing in cascade groove 23 middle levels; Also can further be implemented in stacker 2 selected faces and be provided with plural groove 23, as shown in figure 10, selected its groove bottom or groove side are as described continuing surface 21, and be provided with the structural contact jaw 221 of plural number switching medium 22, use for implanting arbitrarily with several wafers 1, except that reaching aforementioned suitable effect, and more attain acquisition space and cost savings benefit.
Claims (9)
1, a kind of wafer structure for bearing and installing is characterized in that: include:
Wafer is provided with plural contact in the selected face of wafer;
Stacker, the continuing surface that is provided with open shape in the pedestal place of stacker is provided with each contact jaw that several mate the switching medium of wafers plural number contacts for putting wafer at continuing surface, and each medium of transferring extends the welding ends that the selected face of stacker forms outer dewiness; Select wafer to be located at the continuing surface place of stacker by this arbitrarily, the plural contact of wafer is connected mutually with the contact jaw of the medium of respectively transferring of continuing surface, form the wafer structure for bearing and installing that to assemble application arbitrarily with this.
2, a kind of wafer structure for bearing and installing according to claim 1, it is characterized in that: described stacker end face is provided with at least one groove, and any one side in this groove can be used as described continuing surface.
3, a kind of wafer structure for bearing and installing according to claim 1 is characterized in that: described stacker end face is provided with at least one protruding seat, and with any end face of this protruding seat as described continuing surface.
4, ask 1 described a kind of wafer structure for bearing and installing according to right, it is characterized in that: described stacker can be plane pedestal, and with its plane as described continuing surface.
5, ask 1 described a kind of wafer structure for bearing and installing according to right, it is characterized in that: the contact jaw of the described switching medium that lies along continuing surface is for fixedly contact or Elastic Contact or be enough to and the plural contact contacting structure of wafer form.
6. ask 1 described a kind of wafer structure for bearing and installing according to right, it is characterized in that: the welding ends of described switching medium forms and convexedly stretches in the outer pin form of stacker.
7, ask 1 described a kind of wafer structure for bearing and installing according to right, it is characterized in that: the welding ends of described switching medium forms the form that exposes to the selected face of stacker with at least one plane.
8, ask 1 described a kind of wafer structure for bearing and installing according to right, it is characterized in that: the welding ends of described switching medium forms slightly and shrinks in the stacker, exposes and have the tin ball to constitute with the welding ends clamping.
9, a kind of wafer stacker, it is a stacker of assembling application with wafer arbitrarily, it is characterized in that: the continuing surface that the chosen place of stacker is provided with open shape can supply wafer placement, be provided with each contact jaw of plural number switching medium at the continuing surface place, each medium of transferring extends the selected face of stacker and is formed with the welding ends that exposes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2004100442022A CN1697166A (en) | 2004-05-12 | 2004-05-12 | Structure for bearing and installing wafer and bearing seat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2004100442022A CN1697166A (en) | 2004-05-12 | 2004-05-12 | Structure for bearing and installing wafer and bearing seat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1697166A true CN1697166A (en) | 2005-11-16 |
Family
ID=35349787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2004100442022A Pending CN1697166A (en) | 2004-05-12 | 2004-05-12 | Structure for bearing and installing wafer and bearing seat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1697166A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012027929A1 (en) * | 2010-09-03 | 2012-03-08 | 中兴通讯股份有限公司 | Crystal device without packaging and manufacturing method thereof |
-
2004
- 2004-05-12 CN CNA2004100442022A patent/CN1697166A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012027929A1 (en) * | 2010-09-03 | 2012-03-08 | 中兴通讯股份有限公司 | Crystal device without packaging and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7242078B2 (en) | Surface mount multichip devices | |
| CN1327521C (en) | Planar hybrid diode rectifier bridge | |
| US20100037936A1 (en) | Solar cell assemblies and method of manufacturing solar cell assemblies | |
| US8546938B2 (en) | Stacked package including spacers and method of manufacturing the same | |
| EP0749640A1 (en) | Semiconductor chip affording a high-density external interface | |
| US6176741B1 (en) | Modular Microelectronic connector and method for manufacturing same | |
| US11189556B2 (en) | Manufacturing of a power semiconductor module | |
| US8928150B2 (en) | Multi-chip package and method of manufacturing the same | |
| CN102315135B (en) | Chip package and manufacturing process thereof | |
| US11211373B1 (en) | Double-sided chip stack assembly | |
| CN114172387A (en) | Method for producing an inverter, positioning aid and inverter | |
| US10431530B2 (en) | Power semiconductor module and method for manufacturing the same | |
| US10304777B2 (en) | Semiconductor device having a plurality of semiconductor modules connected by a connection component | |
| CN1697166A (en) | Structure for bearing and installing wafer and bearing seat | |
| CN101479816A (en) | Housing for accommodating an electronic component and electronic component arrangement | |
| KR0148082B1 (en) | Stack semiconductor package and package socket | |
| WO2009117006A1 (en) | Apparatus and method for series connection of two die or chips in single electronics package | |
| US5521124A (en) | Method of fabricating plastic transfer molded semiconductor silicone bridge rectifiers with radial terminals | |
| US20030015777A1 (en) | Connection of packaged integrated memory chips to a printed circuit board | |
| CN108630670B (en) | Packaging module and stacked packaging structure | |
| CN101894830B (en) | Stack type package structure and manufacturing method thereof | |
| CN220797175U (en) | Micro connector | |
| CN102201379B (en) | Device packaging structure and packaging method thereof | |
| CN110416176B (en) | Semiconductor device and manufacturing method thereof, semiconductor assembly and metal connecting piece | |
| EP3327826A1 (en) | A bus bar for the electrical connection of at least two terminals of a battery system and a corresponding battery system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |