CN1697139A - Single-layer polishing pad and method of producing the same - Google Patents
Single-layer polishing pad and method of producing the same Download PDFInfo
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- CN1697139A CN1697139A CN 200510071426 CN200510071426A CN1697139A CN 1697139 A CN1697139 A CN 1697139A CN 200510071426 CN200510071426 CN 200510071426 CN 200510071426 A CN200510071426 A CN 200510071426A CN 1697139 A CN1697139 A CN 1697139A
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Abstract
A surface treatment or a two-step injection molding is used to make an inlaid polishing pad. A surface of the inlaid polishing pad has areas of different rigidity to control the rigidity and compressibility of the inlaid polishing pad. Furthermore, methods of making such an inlaid polishing pads are also disclosed.
Description
Technical field
The invention relates to a kind of lapping device and its manufacture method, and particularly relevant for a kind of single-layer polishing pad and manufacture method thereof.
Background technology
In the manufacture process of semiconductor integrated circuit, along with isolation structure, transistor, metal level and dielectric layer after storehouse gets on from level to level, the surface of wafer is also and then more and more uneven.Be subject to the restriction of the depth of focus (depth of focus) that exposure machine can reach, the process that mask pattern is transferred to photoresistance on the wafer is difficulty all the more just also, the also easy more distortion of exposure result.And chemical mechanical milling method is unique processing procedure that can allow the wafer global planarization, allows above-mentioned problem be solved.
Chemical mechanical milling method is that wafer is pressed on the grinding pad in the middle of carrying out, and allows wafer be covered with on the surface on the grinding pad that grinds slurry and moves, and contains fine abrasive grains and chemical reagent in the slurry and grind.Therefore wafer is on grinding pad when mobile, and the planarization processing procedure of wafer is carried out in the two the help of the mechanical polishing that can be by abrasive grains and the chemical reaction of chemical reagent.
Because the primary goal of chemical mechanical milling method is to allow wafer global planarization equably, but also wants to allow the planarization results of same batch of wafer have repeatability.And the flatness behind hardness of grinding pad (rigidity or stiffness) and compressibility (compressibility or compliance) and the grinding wafer has sizable relation.In general, the grinding pad that hardness is high can increase the flatness of grinding wafer, and the grinding pad that compressibility is high then can increase the uniformity of grinding wafer.Therefore after the higher grinding pad of use hardness grinds wafer, need re-use the uniformity that the lower grinding pad of hardness improves grinding wafer toward contact, this makes that the output of chemical mechanical milling method is lower.
In order to take into account above-mentioned hardness and compressible requirement, many being superimposed together with one deck hard packing at least and one deck cushion at least formed required grinding pad in the prior art, for example No. 5212910 United States Patent (USP) and No. 5257478 disclosed grinding pad of United States Patent (USP).Yet, as described in No. 6217426 United States Patent (USP), though can partly take into account the requirement of the flatness and the uniformity of grinding wafer by the two-layer at least grinding pad that is formed by stacking, but some problems of deriving simultaneously.For example because softness and hardness cushion for the circulation way difference of pressure, can allow the uniformity of grinding become poorer sometimes on the contrary.And if the employed superimposed number of plies of grinding pad is many more, then the hardness of grinding pad and compressible variable are also just many more, cause the flatness and the uniformity of difficult more control grinding wafer.In this external process of lapping, break away from each other because of external force easily by the two-layer at least grinding pad that is formed by stacking.Therefore, No. 6217426 U.S. Patent Publication forms the pattern with projection and irrigation canals and ditches below grinding pad, limits pressure in the delivery areas of grinding pad and the compressibility that increases grinding pad.
In the above-mentioned prior art, process complexity and manufacturing cost have been increased unavoidablely.
Summary of the invention
Therefore purpose of the present invention is exactly in that a kind of required hardness and compressible single-layer polishing pad of having concurrently is provided, with the flatness and the uniformity of taking into account grinding.
Another object of the present invention is that a kind of manufacture method that has required hardness and compressible single-layer polishing pad concurrently is being provided, and utilizes the distribution of the big small holes in the grinding pad material to control the hardness and the compressibility of grinding pad.
According to above-mentioned and other purpose of the present invention, a kind of single-layer polishing pad is proposed.Above-mentioned single-layer polishing pad comprises body, is positioned at the abradant surface of body one side and the fixed support surfaces that is positioned at the body opposite side.Wherein, body is made of the multiple hole polymer.And the density of abradant surface is different with the density of fixed support surfaces.
According to a preferred embodiment of the present invention, the density of above-mentioned abradant surface is greater than the density of fixed support surfaces.
According to another preferred embodiment of the present invention, above-mentioned abradant surface has at least one first area and at least one second area, and the density of first area is greater than the density of second area.
According to the another preferred embodiment of the present invention, above-mentioned fixed support surfaces has at least one the 3rd zone and at least one the 4th zone, and the density in the 3rd zone is greater than four-range density.
According to above-mentioned and other purpose of the present invention, a kind of single-layer polishing pad is proposed.Above-mentioned single-layer polishing pad comprises the abradant surface that is positioned at grinding pad one side, the fixed support surfaces that is positioned at the grinding pad opposite side and between the central part of abradant surface and fixed support surfaces.Wherein, grinding pad is made of the multiple hole polymer.And the porosity of grinding pad central part is greater than the porosity of abradant surface.
According to a preferred embodiment of the present invention, the porosity of above-mentioned fixed support surfaces is greater than the porosity of abradant surface.
According to above-mentioned and other purpose of the present invention, a kind of manufacture method of single-layer polishing pad is proposed.At first, make the foaming pad of smooth first surface and second surface with the foaming method.Then, remove first surface to form new and smooth the 3rd surface.The density of above-mentioned second surface is greater than the density on the 3rd surface, so second surface can be as an abradant surface, and the 3rd surface can be as a fixed support surfaces.
According to above-mentioned and other purpose of the present invention, a kind of manufacture method of single-layer polishing pad is proposed.At first, make the foaming pad of variable thickness with the foaming method.Above-mentioned foaming pad has at least one first area and at least one second area, and the thickness of first area is greater than the thickness of second area.Then, remove a side surface of foaming pad to form smooth first surface.The density of first surface that wherein is positioned at the first area is less than the density of the first surface that is positioned at second area.
According to a preferred embodiment of the present invention, can also further remove the opposite side surface of above-mentioned foaming pad again, to form smooth second surface.
By the invention described above preferred embodiment as can be known, utilize the distribution character of expanded material interior size foaming micella, can produce the single-layer polishing pad of upper and lower surface, also can produce single-layer polishing pad with upper and lower surface that soft durometer differs with soft durometer homogeneous.Therefore, can under the output of the manufacturing cost of taking into account grinding pad and chemical mechanical milling method, be easy to just can reach the uniformity of grinding wafer and the demand of flatness simultaneously.
Description of drawings
For above and other objects of the present invention, feature, advantage and embodiment can be become apparent, being described in detail as follows of accompanying drawing:
Figure 1 shows that the cross-sectional view of the foaming micella distribution situation in the expanded material.
Fig. 2 A-2B is depicted as the cross-sectional view according to a kind of grinding pad of a preferred embodiment of the present invention.
Figure 3 shows that cross-sectional view according to the required mould of a kind of foaming method of another preferred embodiment of the present invention.
Figure 4 shows that the mould that utilizes Fig. 3 comes the cross-sectional view of the foaming body behind the foaming.
Figure 5 shows that the cross-sectional view of foaming body grinding pad of gained after cutting of Fig. 4.
Fig. 6 A-6D is depicted as soft zone and territory, the hard area distribution schematic top plan view on the abradant surface of grinding pad of the grinding pad of Fig. 5.
Description of reference numerals:
100: foaming body 102: polymer
104: foaming micella 106: interior zone
108: surf zone 200: grinding pad
202: end face 203: central part
204: bottom surface 250: grinding pad
252: end face 253: central part
254: bottom surface 300: mould
302: cavity 304: inside top surface
306: inner bottom surface 310: zone
320: zone 400: foaming body
401: polymer 402: the foaming micella
405: height 410: zone
415: zone 420: zone
425: zone 500: grinding pad
510: soft regional 520: the territory, hard area
550: abradant surface 600: wafer
A-A ': hatching line B-B ': hatching line
Embodiment
The invention provides a kind of required hardness and compressible single-layer polishing pad and manufacture method thereof of having concurrently.In preferred embodiment, utilize the distribution character of the different size foaming micella (cell) of expanded material in forming process, produce neither too hard, nor too soft single-layer polishing pad, to solve the problem of known grinding pad.
Plastics utilize known foam forming method can form foaming body (foamed plastic) after adding blowing agent or squeezing into gas.Foaming body inside has many foaming micellas not of uniform size, and the foaming micella that stock size is little can be distributed in the place near the foaming body surface, and the big foaming micella of size can be distributed in the inside of foaming body, as shown in Figure 1.
Figure 1 shows that the cross-sectional view of the foaming micella distribution situation in the expanded material.In Fig. 1, foaming body 100 is made up of the polymer 102 that inside has foaming micella 104.The size of foaming micella 104 that is positioned at foaming body 100 surf zones 108 is less, and the size of foaming micella 104 that is positioned at foaming body 100 interior zones 106 is bigger.So the foaming body quality of unit volume, that is the density of foaming body (density) is that interior zone 106 is less than surf zone 108.Change a mode, the shared volume of hole in the unit volume of the interior zone 106 of foaming body 100, that is porosity (porosity), greater than the porosity of surf zone 108, and being distributed as by surf zone 108 to interior zone 106 of this porosity little by little becomes big.So the result of gained is that the hardness of surf zone 108 of foaming body 100 is bigger, and the compressibility of interior zone 106 is bigger.
Embodiment one
According to a preferred embodiment of the present invention, utilize the method for above-mentioned plastic foamed moulding to make grinding pad.Please refer to Fig. 1, make the foaming body 100 of grinding pad, preferable polyurethane (polyurethane), epoxy resin (epoxy resin), fluosite (phenol formaldehyde resin), melmac (melamine resin) and other the suitable thermosetting resin (thermosetting resin) of including of the raw material of used polymer 102.The method that forms foaming body 100 can be any suitable foaming technology, for example common ejection formation (injection molding) technology in the Polymer Processing.And the soft or hard degree of foaming body 100 is relevant with the raw material of selected polymer 102, and is also relevant with the porosity of integral body after foaming body 100 foaming.Because this is the content that the person skilled in the art can decide adjustment in its sole discretion, does not repeat them here.
The porosity (Pi) of the interior zone 106 of above-mentioned foaming body 100 is preferably greater than 1.3 with the ratio (Pi/Ps) of the porosity (Ps) of surf zone 108, is more preferred from greater than 1.5.And the thickness of foaming body 100 is preferably 2-8mm.
Therefore, can on the thickness direction t of foaming body 100, select suitable position to cut.For example, when A-A ' hatching line and B-B ' hatching line cut foaming body 100, can obtain the grinding pad 200 and 250 shown in Fig. 2 A and Fig. 2 B respectively respectively.The grinding pad 200 of comparison diagram 2A and the grinding pad 250 of Fig. 2 B, because the density of the bottom surface 204 of grinding pad 200 is littler than the density of the bottom surface 254 of grinding pad 250, so the pliability of bottom surface 204 is higher, make the compressibility of bottom surface 204 of grinding pad 200 bigger than the compressibility of the bottom surface 254 of grinding pad 250.
In general; the grinding pad 200 and 250 among Fig. 2 A and Fig. 2 B for example; because its density end face 202 of big (that is porosity is less) has higher hardness with end face 252, can use it to be abradant surface usually, allows end face 202 directly contact with wafer with end face 252. Bottom surface 204 and 254 with less density (that is porosity is bigger) then can be used for fixing and support grinding pad 200 and 250 respectively as the fixed support surfaces of grinding pad 200 and 250.
In addition, as the grinding pad 200 and 250 among Fig. 2 A and Fig. 2 B, its between end face 202 and 252 and the porosity of the central part 203 of bottom surface 204 and 254 and 253 respectively greater than the porosity of end face 202 and 252, and being distributed as by end face 202 and 252 of this porosity little by little becomes big respectively to central part 203 and 253.Particularly, central part 203 and 253 porosity are preferably greater than 1.3 with the ratio of the porosity of end face 202 and 252 respectively, are more preferred from greater than 1.5.For example end face 202 or 252 porosity are 20% o'clock, and central part 203 or 253 porosity are preferably greater than 30%.
According to above-mentioned, because the hardness of grinding pad when big, can allow the flatness of grinding wafer higher; And the compressibility of grinding pad can allow the uniformity of grinding wafer higher when big.So can on the thickness direction of foaming body, selecting suitable position to cut, can obtain having concurrently required hardness and compressible single-layer polishing pad according to demand.
Embodiment two
According to another preferred embodiment of the present invention, can utilize mould 300 as shown in Figure 3, make required grinding pad with the foaming method.Figure 3 shows that cross-sectional view according to the required mould of a kind of foaming method of another preferred embodiment of the present invention.In Fig. 3, mould 300 has a cavity 302, the inner bottom surface 306 of cavity 302 is smooth, and inside top surface 304 is a non-flat forms.Therefore cavity 302 can be distinguished into two different zones of spacing at least, zone 310 and the less zone 320 of spacing that promptly spacing is bigger.
For example, use jet forming method, in mould 300, add polymer and blowing agent, or add polymer and injecting gas, allow polymer foaming in cavity 302.After treating the polymer foaming moulding, the cross-sectional view of the foaming body 400 of gained as shown in Figure 4.Make the foaming body 400 of grinding pad, preferable polyurethane, epoxy resin, fluosite, melmac and other the suitable thermosetting resin of including of the raw material of used polymer 401.And the soft durometer of foaming body 400 and compressibility are relevant with the raw material of selected polymer 401, and be also relevant with the porosity of integral body after foaming body 100 foaming.Because this does not repeat them here for the content that the people who is familiar with this technology can decide adjustment in its sole discretion.
Figure 4 shows that the mould that utilizes Fig. 3 comes the cross-sectional view of the foaming body behind the foaming.In Fig. 4, the distribution of foaming micella 402 in polymer 401 of foaming body 400 inside remains less near the size of the foaming micella 402 of foaming body 400 surf zones, and bigger near the size of the foaming micella 402 in central interior zone.In addition, foaming body 400 has two different zones of thickness, zone 410 and the less zone 420 of thickness that promptly thickness is bigger.Even the equal height place therefore foaming body 400 in, the density that is positioned at the foaming body 400 of zones of different is understood different.Height 405 the place that for example coexists, the density of the foaming body 400 in zone 415 is littler than the density in zone 425.It is because the thickness in the zone 410 at regional 415 places is bigger, and the feasible zone 415 that is positioned at height 405 places is positioned at the central interior place of close foaming body 400, and the identical zone 425 that is positioned at height 405 places is the surface that is in than near foaming body 400 on the contrary.
If cut foaming body 400 along height 405, then can obtain grinding pad as shown in Figure 5.Figure 5 shows that the cross-sectional view of foaming body grinding pad of gained after cutting of Fig. 4.In Fig. 5, the abradant surface 550 of grinding pad 500 have soft regional 510 with territory, hard area 520, corresponding to zone among Fig. 4 410 and zone 420.As described in prior figures 4, soft regional 510 density is less, and the density in territory, hard area 520 is bigger.Therefore soft regional 510 compressibility is preferable, the preferable uniformity in the time of can providing grinding wafer; And the hardness in territory, hard area 520 is bigger, the preferable flatness in the time of can providing grinding wafer.
In addition, can also be along the bottom cutting of the grinding pad 500 of Fig. 5, as cutting along straight line 505.So, can further adjust the compressibility of grinding pad 500 bottom fixed support surfaces.
Fig. 6 A-6D is depicted as soft regional 510 and the distribution schematic top plan view of territory, hard area 520 on the abradant surface 550 of grinding pad 500 of the grinding pad 500 of Fig. 5.In Fig. 6 A, be circular grinding pad to be divided into by the center of circle to circumference area several are fan-shaped, soft regional 510 are staggered with 520 in territory, hard area.And soft regional 510 with the area distributions ratio in territory, hard area 520, then can adjust according to the flatness of grinding and the demand of the uniformity.When wafer 600 when pitch of the laps moves on grinding pad 500, can pass through in regular turn soft regional 510 with territory, hard area 520.Therefore, can allow the demand of taking into account the flatness and the uniformity in the process of lapping of wafer 600.
In Fig. 6 B, then allow soft regional 510 to be positioned at wafer 600 centre through the zone, promptly soft regional 510 distribute ringwise and between grinding pad 500 centers of circle and circumference, allow the central area of wafer 600 can obtain the better grinding uniformity.In Fig. 6 C, soft regional 510 are positioned at the fringe region of grinding pad, can allow the fringe region of wafer 600 can obtain the better grinding uniformity.In Fig. 6 D, then be to allow soft regional 510 middle sections that are positioned at grinding pad, similarly can allow the fringe region of wafer 600 can obtain the better grinding uniformity.
The soft zone of the abradant surface 550 of above Fig. 5 and the described grinding pad 500 of Fig. 6 A-6D and the manufacture method and the configuration mode in territory, hard area also can be performed on the bottom surface of grinding pad 500 as required.So, can further adjust the soft durometer of grinding pad, the better grinding flatness and the uniformity is provided.In addition, the described grinding pad 500 of Fig. 5 is not limited to be applied on the circular grinding pad, also can be applied on the grinding pad of square, strip or other shape.The configuration mode in soft zone and territory, hard area then can be changed with the difformity of grinding pad.Because the above-mentioned content that can decide adjustment in its sole discretion for the people who is familiar with this technology does not repeat them here.
As known from the above, utilize the distribution character of the size foaming micella of polymer on foaming, allow polymer foaming in the mould of inner surface up and down with differentiated levels difference.The difference in level of the inner surface up and down by adjusting the mould zones of different and the distribution patterns of zones of different, and by cutting the top layer up and down of the foaming body of foaming, the required single-layer polishing pad that disposes the soft or hard zone be can obtain, the flatness of grinding wafer and the requirement that the uniformity all can be reached processing procedure made.
By the invention described above preferred embodiment as can be known, utilize the distribution character of expanded material interior size foaming micella, can produce the single-layer polishing pad of upper and lower surface, also can produce single-layer polishing pad with upper and lower surface that soft durometer differs with soft durometer homogeneous.Owing to be single-layer polishing pad, can utilize the internal cavities shape of mould, the material choice of expanded material, the foaming degree of expanded material and hardness and the compressibility that the cutting processing behind the foaming is controlled the grinding pad upper and lower surface respectively again.Therefore, can be under the output of the manufacturing cost of taking into account grinding pad and chemical mechanical milling method, be easy to regard to the uniformity of reaching grinding wafer simultaneously and the demand of flatness.
Polymer body with hole of the present invention is not limited to use the foaming method made, also can use other can form any known technology, insert method (embedded polymeric microelement), polymer beads sintering process (sinteredpolymer particles), reach fiber rubbing method (fiber coating) or the like as the polymerization micella with hole polymer.In addition, single-layer polishing pad of the present invention is not limit yet and is used in cmp processing procedure in the silicon wafer process, can be applicable to the grinding processing procedure of glass and other base material yet.
Though the present invention with preferred embodiment openly as above; yet it is not to be used for limiting the present invention; any people who is familiar with this technology; without departing from the spirit and scope of the present invention; when can doing various changes and modification, so protection scope of the present invention should be as the criterion with the scope that claims were defined.
Claims (20)
1. single-layer polishing pad comprises:
One body, this body are made of the multiple hole polymer;
One abradant surface is positioned at a side of this body; And
One fixed support surfaces is positioned at the opposite side of this body, and the density of this abradant surface is different with the density of fixed support surfaces.
2. single-layer polishing pad as claimed in claim 1 is characterized in that the density of described abradant surface is greater than the density of described fixed support surfaces.
3. single-layer polishing pad as claimed in claim 1 is characterized in that, described abradant surface has at least one first area and at least one second area, and the density of this first area is greater than the density of second area.
4. single-layer polishing pad as claimed in claim 3 is characterized in that, fan-shaped, the annular or circular of being shaped as of described second area.
5. single-layer polishing pad as claimed in claim 1 is characterized in that, described fixed support surfaces has at least one the 3rd zone and at least one the 4th zone, and the density in the 3rd zone is greater than four-range density.
6. single-layer polishing pad as claimed in claim 5 is characterized in that, fan-shaped, annular or circular that described four-range is shaped as.
7. single-layer polishing pad, it is made of the multiple hole polymer, and this single-layer polishing pad comprises:
One abradant surface is positioned at a side of this single-layer polishing pad, and has one first porosity;
One fixed support surfaces is positioned at the opposite side of this single-layer polishing pad, and has one second porosity; And
One central part between abradant surface and fixed support surfaces, and has one the 3rd porosity, and wherein said the 3rd porosity is greater than first porosity.
8. single-layer polishing pad as claimed in claim 7 is characterized in that, the ratio of described the 3rd porosity and first porosity is greater than 1.3.
9. single-layer polishing pad as claimed in claim 7 is characterized in that, described second porosity is greater than first porosity.。
10. the manufacture method of a single-layer polishing pad comprises:
Make a foaming pad with the foaming method, this foaming pad has a smooth first surface and a second surface; And
Remove this first surface forming one the 3rd smooth surface, the density of this second surface is greater than the density on the 3rd surface, and this second surface is an abradant surface, and the 3rd surface is a fixed support surfaces.
11. the manufacture method of single-layer polishing pad as claimed in claim 10 is characterized in that, the raw material of described foaming pad comprises a thermosetting resin.
12. the manufacture method of single-layer polishing pad as claimed in claim 11 is characterized in that, described thermosetting resin is selected from the group that is made up of polyurethane, epoxy resin, fluosite and melmac.
13. the manufacture method of a single-layer polishing pad comprises:
Make a foaming pad with the foaming method, this foaming pad has at least one first area and at least one second area, and the thickness of described first area is greater than the thickness of second area; And
A side surface of removing this foaming pad to be to form a smooth first surface, and the density of first surface that is positioned at described first area is less than the density of the first surface that is positioned at second area.
14. the manufacture method of single-layer polishing pad as claimed in claim 13, it is characterized in that, described foaming method is to use a mould, and the cavity of this mould has at least one first cavity spacing and one second cavity spacing, and this first cavity spacing is greater than the second cavity spacing.
15. the manufacture method of single-layer polishing pad as claimed in claim 13 is characterized in that, comprises that also the opposite side surface of removing this foaming pad is to form a smooth second surface.
16. the manufacture method of single-layer polishing pad as claimed in claim 13 is characterized in that, the raw material of described foaming pad comprises a thermosetting resin.
17. the manufacture method of single-layer polishing pad as claimed in claim 16 is characterized in that, described thermosetting resin is selected from the group that is made up of polyurethane, epoxy resin, fluosite and melmac.
18. the manufacture method of single-layer polishing pad as claimed in claim 13 is characterized in that, described first surface is an abradant surface.
19. the manufacture method of single-layer polishing pad as claimed in claim 13 is characterized in that, described first surface is a fixed support surfaces.
20. the manufacture method of single-layer polishing pad as claimed in claim 13 is characterized in that, fan-shaped, the annular or circular of being shaped as of described first area.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US52148304P | 2004-05-05 | 2004-05-05 | |
| US60/521,483 | 2004-05-05 | ||
| US60/521,740 | 2004-06-29 |
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| Publication Number | Publication Date |
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| CN1697139A true CN1697139A (en) | 2005-11-16 |
| CN100356516C CN100356516C (en) | 2007-12-19 |
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| CNB2005100714267A Active CN100356516C (en) | 2004-05-05 | 2005-05-08 | Single-layer polishing pad and method of producing the same |
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| CN103252729A (en) * | 2012-02-20 | 2013-08-21 | Kpx化工有限公司 | Polishing pad and method of manufacturing the same |
| CN104684686A (en) * | 2012-08-02 | 2015-06-03 | 3M创新有限公司 | Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof |
| CN105706217A (en) * | 2013-11-04 | 2016-06-22 | 应用材料公司 | Printed chemical mechanical polishing pad having abrasives therein |
| CN106163741A (en) * | 2014-03-31 | 2016-11-23 | 富士纺控股株式会社 | Grinding pad and manufacture method thereof |
| CN108127582A (en) * | 2017-12-13 | 2018-06-08 | 湖北鼎汇微电子材料有限公司 | A kind of mold and preparation method for preparing polishing layer |
| CN109048698A (en) * | 2018-06-22 | 2018-12-21 | 阳江市伟艺抛磨材料有限公司 | A kind of polyurethane rubbing down wheel and preparation method thereof |
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| US6221773B1 (en) * | 1996-09-13 | 2001-04-24 | Hitachi, Ltd. | Method for working semiconductor wafer |
| US5944583A (en) * | 1997-03-17 | 1999-08-31 | International Business Machines Corporation | Composite polish pad for CMP |
| KR20010006518A (en) * | 1997-04-18 | 2001-01-26 | 매튜 네빌 | Polishing Pad for a Semiconductor Substrate |
| US6168508B1 (en) * | 1997-08-25 | 2001-01-02 | Lsi Logic Corporation | Polishing pad surface for improved process control |
| JPH11285961A (en) * | 1998-04-03 | 1999-10-19 | Nikon Corp | Polishing pad and polishing method |
| US6544107B2 (en) * | 2001-02-16 | 2003-04-08 | Agere Systems Inc. | Composite polishing pads for chemical-mechanical polishing |
| US20040021243A1 (en) * | 2002-08-02 | 2004-02-05 | Wen-Chang Shih | Method for manufacturing auxiliary gas-adding polyurethae/polyurethane-urea polishing pad |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103252729A (en) * | 2012-02-20 | 2013-08-21 | Kpx化工有限公司 | Polishing pad and method of manufacturing the same |
| CN104684686A (en) * | 2012-08-02 | 2015-06-03 | 3M创新有限公司 | Abrasive elements with precisely shaped features, abrasive articles fabricated therefrom and methods of making thereof |
| CN105706217A (en) * | 2013-11-04 | 2016-06-22 | 应用材料公司 | Printed chemical mechanical polishing pad having abrasives therein |
| US11794308B2 (en) | 2013-11-04 | 2023-10-24 | Applied Materials, Inc. | Printed chemical mechanical polishing pad having particles therein |
| CN110076684A (en) * | 2013-12-20 | 2019-08-02 | 应用材料公司 | Printing chemical mechanical polishing pads with controlled pore rate |
| US11007618B2 (en) | 2013-12-20 | 2021-05-18 | Applied Materials, Inc. | Printing chemical mechanical polishing pad having window or controlled porosity |
| CN106163741A (en) * | 2014-03-31 | 2016-11-23 | 富士纺控股株式会社 | Grinding pad and manufacture method thereof |
| CN106163741B (en) * | 2014-03-31 | 2019-09-17 | 富士纺控股株式会社 | Grinding pad and its manufacturing method |
| CN108127582A (en) * | 2017-12-13 | 2018-06-08 | 湖北鼎汇微电子材料有限公司 | A kind of mold and preparation method for preparing polishing layer |
| CN109048698A (en) * | 2018-06-22 | 2018-12-21 | 阳江市伟艺抛磨材料有限公司 | A kind of polyurethane rubbing down wheel and preparation method thereof |
| CN113661031A (en) * | 2019-04-09 | 2021-11-16 | 恩特格里斯公司 | Sector design of a disc |
| CN113661031B (en) * | 2019-04-09 | 2024-05-07 | 恩特格里斯公司 | Pad conditioner for chemical mechanical planarization assembly and pad conditioner assembly |
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