CN1692485A - Gold alloy bonding wire for semiconductor device and process for producing the same - Google Patents

Gold alloy bonding wire for semiconductor device and process for producing the same Download PDF

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Publication number
CN1692485A
CN1692485A CNA2003801003581A CN200380100358A CN1692485A CN 1692485 A CN1692485 A CN 1692485A CN A2003801003581 A CNA2003801003581 A CN A2003801003581A CN 200380100358 A CN200380100358 A CN 200380100358A CN 1692485 A CN1692485 A CN 1692485A
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China
Prior art keywords
connecting line
orientation
less
ratio
semiconductor device
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CN100352026C (en
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宇野智裕
寺岛晋一
巽宏平
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Nippon Steel Chemical and Materials Co Ltd
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Nippon Steel Corp
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  • Wire Bonding (AREA)

Abstract

A gold alloy bonding wire for semiconductor device that attains collective improvement with respect to high strength/high elasticity for realizing narrow pitch bonding, stability of loop configuration, suppression of wire flowing, leaning property, bonding or fatigue characteristics at wedge bonded portions, etc. and excels in the suitability for industrial mass production; and a process for producing the same. With respect to the gold alloy bonding wire, in the crystal grain structure of longitudinal section of boding wire, the ratio of area of crystal grains exhibiting [111] orientation to area of crystal grains exhibiting [100] orientation among the crystal orientations in the longitudinal direction of wire is 1.2 or greater.

Description

The gold bonding wire of semiconductor device and production method thereof
Technical field
The present invention relates to be used to connect the electrode on the semiconductor element and the semiconductor device by using gold bonding wire of outside lead, and the method for producing described connecting line.
Background technology
At present, make by high-purity 4N type gold (purity＞99.99 quality %) and linear diameter is about 20 to be used to connect electrode and outside lead on the semiconductor element to about 50 microns connecting line.Usually use in conjunction with hyperacoustic thermo-compressed system as the technology that connects connecting line, in order to connect described Technology Need jockey commonly used and to be used for inserting the capillary anchor clamps of connecting line.Heat and melt an end of connecting line by the electric arc heat supply, thereby utilize surface tension to form ball, described ball is crimped on the electrode of the semiconductor element of 150 to 300 ℃ of heating, then, by the ultrasonic wave crimping the direct wedge bond of connecting line is arrived the outside lead side.For device is used as semiconductor device (for example transistor or IC), after connecting line is connected, use the epoxy sealing device, thus the lead frame part of protection silicon, connecting line and assembling silicon.Except the character of improving them, improve they and the relation of element on every side, and improve such as using and the overall performance of reliability becomes more and more important.
Be accompanied by the high density integrated semiconductor components and reduce the trend of its thickness, in order to reduce the thickness of semiconductor element, gold bonding wire must be satisfied all character, for example prolong gold bonding wire, reduce connecting line diameter, form the high line of apsides (loop) or form the low line of apsides.
The material that engages with connecting line also changes.Except using traditional Al alloy, connecting line and electrode material use now and are fit to superintegrated Cu and Cu alloy on the silicon substrate.Even if in the electrode member of Al alloy, Cu and Cu alloy, also gone strong on and used little spherical contact to satisfy narrow spacing, and distortion and the reliability of keeping joint strength, ball in measuring junction become more and more important.
In order to satisfy the requirement of high density integrated semiconductor components, for make spacing narrow down, reduce connecting line size, increase the quantity of pin (pin), the length that prolongs connecting line, and the contact characteristic that obtains gold bonding wire has all proposed strict requirement.
For instance, inject the resin-sealed step of high viscosity thermosetting epoxy resin at a high speed, thereby the problem that the connecting line distortion contacts with adjacent connecting line occurring.In addition, when spacing narrows down, and connecting line is when becoming long and thin, is desirable in the distortion (hereinafter also being called connecting line bending (wire sweep)) that suppresses connecting line when resin-sealed, even if a spot of inhibition.The requirement that spacing is narrowed down is also very strong.At present, the spacing in the batch process is still 60 microns level.50 microns spacing also develops, and is expected at and can realizes 45 microns very narrow spacing in two or three years, and such spacing is considered to the limit of ball bond several years ago.In future,, will be expected to realize 20 microns spacing along with the development of packaging technology.
In many kinds of semiconductor packagings, BGAs (ball grid array) and CSPs (wafer-level package (chip size packages)) have narrow spacing.Their assembling mode is compared with the lead frame structure of routine based on plate and band, and such assembling mode restriction (for example reducing lead spacing) is less.When using described plate and band, must be careful, to realize connecting low reaching under 150-170 ℃ the connection temperature.Compare with in 210 to 300 ℃ of being connected of implementing down in the lead frame situation, this has reduced by tens degrees centigrade with temperature.Therefore, wish to realize at low temperatures the connection of thin space always., contact area slack-off owing to spreading at low temperatures reduces and very thin capillary end, and spherical contact and wedge contact must satisfy very strict performance requirement and have good reliability.
The connecting line needs that satisfy the demand possess some fundamental characteristics, so that in Connection Step, can highly precisely control line of apsides shape, improvement engages with electrode part and lead portion, and in the number of assembling steps behind Connection Step, suppresses the distortion of connecting line.
Up to the present, in order to increase the intensity of connecting line, add multiple alloying element usually.In present main flow connecting line-High Purity Gold connecting line, in order to stop the oxidation of spherical part, the perhaps rising of resistance, the addition of alloying element is restricted to several ppm to tens ppm.Therefore, although the controllability of the line of apsides and engagement characteristics are superior, it still can not solve the strength problem that suppresses connecting line distortion or thermal impact part (neck) when forming described ball satisfactorily.In recent years, in some ICs, used total addition level to increase to about 1% high alloy connecting line.But, improve connecting line in the effect of the distortion when resin-sealed and unsatisfactory, the problem that exists the engagement characteristics with lead-in wire to reduce.
As realizing high-intensity method, advised the multiple layer metal connecting line that uses core different with periphery.For instance, Japanese unexamined patent publication No. open (kokai (Te Kaiping)) has been instructed for 56-21354 number with Au and has been covered the Ag core and the connecting line that obtains, and Japanese unexamined patent publication No. open (kokai) has been instructed for 59-155161 number and had the connecting line that the surface is coated with the conductive metal core of Au.By preparing heart yearn and periphery with different metals, to compare with the connecting line of making by common use homogenous material, described connecting line is expected to satisfy the requirement of high strength and high engagement characteristics.But in fact, also in semiconductor, do not use the report of multilayer interconnection.
Therefore, in order to satisfy the needs of following High Density Packaging, connecting line should only not satisfy their indivedual requirements, and presses for a kind of material that can improve bulk property of exploitation.
The connecting line that suitable adjacent electrode spacing is not more than 50 microns thin space joint must satisfy wedge bond characteristic and inclination character simultaneously, this is new problem, and can advantageously improve high strength and high resiliency, line of apsides controllability, engagement characteristics, can suppress the traditional problem of connecting line bending simultaneously.
About the connecting line of realizing that thin space connects, research has trended towards using billon, has used the material that replaces gold, and uses multilayer interconnection.Describe below and state the problem that runs into when method realizes the thin space connection with the batch process level in the use.
By in gold, adding alloying element, cause solution hardening, precipitation-hardening and owing to forming the sclerosis that compound causes, and dislocation interacts, can increase the required intensity of conventional connecting line to a certain extent.But, be limited only, and in addition, in the distortion that is difficult to the inhibition connecting line when resin-sealed by adding that alloying element gains in strength or increase modulus of elasticity.When connecting line bending in the conventional Sealing Technology up to 5% or when bigger because the connecting line distortion mainly occurs in plastic region, the increase of connecting line intensity is effective for suppressing the connecting line bending.On the other hand, because the nearest development of resin-sealed technology, if present connecting line curved major strain, and the increase of modulus of elasticity becomes even more important.But, for increasing to, the modulus of elasticity with the billon connecting line is not less than 88 MPa, and it is not enough only depending on the solid solution of alloying element and separating out.In addition, if in order to gain in strength and modulus of elasticity and high concentration ground adds alloying element, to cause new problem, hole, described spherical part engagement characteristics appear in for example oxidation on connecting line surface, described spherical contact when forming reduction, resistance excessively increases etc.
Make the alloying element solid solution that adds the connecting line material, the conventional method of separating out and form compound by the kind and the concentration of select adding element, be difficult in and be used for gold bonding wire very in the batch process that the connection of thin space forms spherical contact.
The heart yearn of the above-mentioned multilayer interconnection that is made of heart yearn and periphery can have different character with periphery, and is expected to have different potential character.But the production of multilayer interconnection is very complicated, and it is produced in batches also to exist and much waits the problem that solves, and for example cost is owing to the increase of step and new equipment increases, and very difficult quality control (for example uniformity of characteristic and stability).In multilayer interconnection, can more easily improve some specific characteristic.But multilayer interconnection still is difficult to satisfy fully thin space and connects required complicated connecting line characteristic, much waits the problem that solves in actual use in addition.
Therefore, no matter replace gold and also be to use multilayer interconnection, all be difficult to satisfy thin space and connect all required character with alloy material.The connecting line that thin space engages must have high intensity, high elasticity and suppress the high rigidity of connecting line bending, and must be when improving line of apsides controllability and joint, reduces cost and the resistance increase is minimized.
In addition, when spacing becomes less than 40 microns, cause new problem, the inclination of the upstanding portion on for example spherical contact, up to the present this also is not a problem.In many pins/thin space connects, in the assembling of single IC, there are different connecting line length and different line of apsides height.But different with the conventional assemble method of the identical line of apsides shape of use in chip, this trends towards producing the problem that relates to line of apsides control.Caused that in recent years the problem of serious concern is that the connecting line upstanding part is fallen down near spherical contact, thus too near from adjacent connecting line.Described phenomenon is known as inclination, and is just becoming the main cause that reduces thin space connection mass productivity.
Only increase the intensity and the modulus of elasticity of connecting line, perhaps on the contrary, reduce intensity, can not easily improve the inclination of the upstanding portion on the spherical contact.Even if increase or be reduced in the elongation at break of frequent use in the connecting line mechanical characteristic, can not suppress to tilt.This is that the upstanding portion on the spherical contact is out of shape and is twisted because because the heat in ball when fusing and because the formation of the line of apsides, and the character that is different from bus plays a leading role.Therefore, the routine improvement method based on mechanical characteristic is faced with the limit.In order to handle described inclination, must develop the connecting line material based on new theory.
The connecting line of gaining in strength merely in addition, can not satisfy deformation characteristic, joint strength and the long-term reliability that high density connects wedge contact in (for example thin space connection) fully.When spacing is not shorter than 70 microns in the prior art, described problem can not take place in the wedge bond.But in the thin space in future connects, the characteristic of improving wedge bond will become important.
Because the main thin space that adopts is connected in substrate and substrate, wherein thin connecting line, because the refinement of capillary end and the connection area of reduction and low connection temperature greatly, all can be in wedge bond the initiation problem.That is to say that a lot of problems in the wedge bond are not also conscientiously handled so far, therefore must handle as the new problem that realizes thin space.
Wedge bond forms the special syndeton that is different from very much the spherical part distortion, for example connecting line carries out complex behavior at a high speed, big deformation takes place, with the good bonding strength of institute's coupling part maintenance, and after forming wedge bond, the shape of stable cutting connecting line in the bead step that forms thin space.At present, also do not need to consider top situation in the wedge bond.Therefore, improve the related factor of the connecting line material of wedge bond and unclear, and not about the report of the example of the connecting line product that improves the wedge bond characteristic.Often point out that highly enriched connecting line shows the wedge bond character of reduction usually at low temperatures.For instance, increase the intensity of connecting line iff the interpolation by high concentration, the operation leeway of keeping the wedge bond characteristic can reduce.In order to satisfy the demand that spacing narrows down, use high-intensity thin connecting line, and improve the wedge bond characteristic and become an important techniques problem.
In addition, at wedge contact, except connection performance, also need to improve dependability.Their sealing resin of silicon, metal framework, connecting line and covering has different thermal coefficient of expansions and modulus of elasticity, and is easy to produce thermal deformation.It is believed that (generation heat) during use, perhaps during temperature cycles (for example cooling) repeatedly, thermal stress is concentrated in the wedge contact, causes the fracture during the soft heat (reflowing).When connecting line attenuated, wedge bond also attenuated, and can produce the problem of thermal fatigue on the connecting line face.In addition, be accompanied by the use of unleaded solder recent years, heavy deformation temperature uprises, and has therefore quickened thermal fatigue.At present and do not know the factor of improving the wedge bond reliability in the connecting line material.Wedge contact reliability (for example fatigue durability) during use with labyrinth of gross distortion has a great difference with the control line of apsides or the distortion of the connecting line when sealing and joint reliability.Therefore, this be conventional simple material design (for example by controlling component and concentration thereof) can't realize.
Therefore, a target of the present invention provides the gold bonding wire of semiconductor element, it has the high strength of suitable short spacing connection and high bending rigidity (flexural rigidity), the connecting line diameter that reduces and the connecting line length of increase have the engagement characteristics of improvement and are suitable for plant-scale batch process; And provide the method for producing described connecting line.
From the point of view, in order to realize that thin space connects, the inventor is devoted to improve intensity, modulus of elasticity, the wedge bond character of connecting line always comprehensively, suppresses the distortion of connecting line, and the research and development that improves the inclination of the upstanding portion on the spherical contact; And the aggregate structure of having found the control connection line first is important and effective.
Summary of the invention
Describe below in order to realize the main points of the above-mentioned target of the present invention.
(1) a kind of gold bonding wire that is used for semiconductor device, wherein, in the grainiess on the connecting line longitudinal cross-section, longitudinally in the crystal orientation, the chip area of [111] orientation is not less than 1.2 with the ratio of the chip area of [100] orientation at connecting line.
(2) a kind of gold bonding wire that is used for semiconductor device, wherein, in the grainiess on the connecting line longitudinal cross-section, longitudinally in the crystal orientation, the shared area ratio of crystal grain of [111] orientation is not less than 55% at connecting line.
(3) a kind of gold bonding wire that is used for semiconductor device, wherein, in the grainiess on the connecting line longitudinal cross-section, if the radius of connecting line is represented with R, and part that will be from connecting line central authorities to R/2 is as middle body, so on the crystal orientation of the vertical middle body of connecting line, [111] the ratio R a of the chip area of the chip area of [111] orientation and [100] orientation on the ratio R c of the chip area of Qu Xiang chip area and [100] orientation and the whole connecting line cross section, satisfy differential ratio (differential ratio) absolute value between the two | 1-Rc/Ra| * 100 (%) is less than 30%, and the ratio R a on the whole connecting line cross section is not less than 1.2.
(4) gold bonding wire that be used for semiconductor device one of any according to (1) to (3), wherein, in the grainiess on the connecting line longitudinal cross-section, if the radius of connecting line is represented with R, at connecting line longitudinally in the crystal orientation, ratio in the chip area that has [111] orientation wherein at least in one or more layers and the chip area of [100] orientation is not less than 1.6 zone, and should be not less than 1/10 of connecting line radius R by the width of zone on the connecting line radial direction.
(5) gold bonding wire that be used for semiconductor device one of any according to (1) to (4), wherein, in the grainiess on the connecting line longitudinal cross-section, if the radius of connecting line is represented with R, at connecting line longitudinally in the crystal orientation, than the zone that is not less than 60%, and should be not less than 1/10 of connecting line radius R by the width of zone on the connecting line radial direction at the shared area of the crystal grain that has [111] orientation wherein at least in one or more layers.
(6) gold bonding wire that be used for semiconductor device one of any according to (1) to (3), wherein, in the grainiess on the connecting line longitudinal cross-section, if the radius of connecting line is represented with R, at connecting line longitudinally in the crystal orientation, less than 0.9 zone, and should be not less than 1/10R by the width of zone on the connecting line radial direction at the ratio of the chip area that has [111] orientation wherein at least in one or more layers and the chip area of [100] orientation, but less than 1/3 R.
(7) gold bonding wire that be used for semiconductor device one of any according to (1) to (3) or (6), wherein, in the grainiess on the connecting line longitudinal cross-section, if the radius of connecting line is represented with R, at connecting line longitudinally in the crystal orientation, than the zone that is not less than 50%, and should be not less than 1/10 of connecting line radius R by the width of zone on the connecting line radial direction at the shared area of the crystal grain that has [100] orientation wherein at least in one or more layers.
(8) gold bonding wire that be used for semiconductor device one of any according to (1) to (7), wherein, in the grainiess on the connecting line longitudinal cross-section, longitudinally in the crystal orientation, the shared ratio of the gross area of the crystal grain of [11 1] orientation and [100] orientation is not less than 50% at connecting line.
(9) gold bonding wire that be used for semiconductor device one of any according to (1) to (8), wherein, on the connecting line longitudinal cross-section, if the radius of connecting line is represented with R, and part that will be from connecting line central authorities to R/2 is as middle body, on the crystal orientation of the vertical middle body of connecting line, the gross area with crystal grain of [111] orientation and [100] orientation is not less than 60% at the shared ratio of middle body.
(10) a kind of gold bonding wire that is used for semiconductor device, wherein, in the grainiess on the connecting line longitudinal cross-section, if the radius of connecting line is represented with R, and part that will be from the connecting line surface to the R/3 depths is as surface layer part, on the crystal orientation of the vertical surface layer part of connecting line, [111] Qu Xiang chip area is not less than 1.6 with the ratio of the chip area of [100] orientation, and on whole connecting line cross section, the chip area of [111] orientation is not less than 1.2 with the ratio of the chip area of [100] orientation.
(11) gold bonding wire that be used for semiconductor device one of any according to (1) to (10), wherein, in the grainiess on the connecting line longitudinal cross-section, if the radius of connecting line is represented with R, and part that will be from the connecting line surface to the R/3 depths is as surface region, on the crystal orientation of the vertical surface region of connecting line, the gross area with crystal grain of [111] orientation and [100] orientation is not less than 50% at the shared ratio of middle body.
(12) a kind of gold bonding wire that is used for semiconductor device, wherein, on the connecting line longitudinal cross-section, perhaps on the crystal orientation of being measured by X-ray diffraction on the direction longitudinally perpendicular to connecting line, the crystal grain of [111] orientation is not less than 1.2 with the volume ratio of the crystal grain of [100] orientation.
(13) gold bonding wire that be used for semiconductor device one of any according to (1) to (12), wherein, on the connecting line longitudinal cross-section of length, comprise that at least two or more its crystal orientations depart from connecting line and are not less than the crystal grain of connecting line diameter 70% less than 15 ° and its length in the inclination angle longitudinally greater than 5 times of connecting line diameters.
(14) gold bonding wire that be used for semiconductor device one of any according to (1) to (13), wherein, described connecting line comprises gold as key component, and comprises total concentration C 1Be that one or more of 0.002 to 0.03 quality % are selected from the element of Y, Ca, Yb and Eu, and comprise total concentration C 2Be that one or more of 0.002 to 0.05 quality % are selected from the element of La, Tb, Dy and Nd, add component concentrations at 0.1＜C 1/ C 2In＜10 the scope.
(15) a kind of gold bonding wire that is used for semiconductor device, wherein, in the grainiess of connecting line longitudinal cross-section, if the radius of connecting line is represented with R, and part that will be from connecting line central authorities to R/2 is as middle body, the ratio R c of the chip area of chip area and [100] orientation of [111] of the vertical middle body of connecting line orientation so, ratio R s with chip area with the chip area of [100] orientation of [111] of the vertical periphery of connecting line orientation, satisfy differential ratio absolute value between the two | 1-Rc/Rs| * 100 (%) is less than 30%.
(16) gold bonding wire that is used for semiconductor device of basis (15), wherein, in the grainiess on the connecting line longitudinal cross-section, longitudinally in the crystal orientation, the chip area of [111] orientation is not less than 1.0 with the ratio R a of the chip area of [100] orientation at connecting line.
(17) gold bonding wire that is used for semiconductor device of basis (15) or (16), wherein, in the grainiess on the connecting line longitudinal cross-section, if the radius of connecting line is represented with R, and think that the part from connecting line central authorities to R/3 is a core, on the crystal orientation of the vertical core of connecting line, the ratio R d of the chip area of the chip area of [111] orientation and [100] orientation is in from 0.1 to 0.8 scope.
(18) gold bonding wire that be used for semiconductor device one of any according to (15) to (17), wherein, on the crystal orientation of the vertical periphery of connecting line, the chip area of [111] orientation is not less than 1.2 with the ratio R s of the chip area of [100] orientation.
(19) gold bonding wire that be used for semiconductor device one of any according to (15) to (18), wherein, in the grainiess of connecting line longitudinal cross-section, if the radius of connecting line is represented with R, and with part from the connecting line surface to R/5 as the outermost part, on the crystal orientation of the vertical outermost part of connecting line, the chip area of [111] orientation is not more than 1.0 with the ratio R t of the chip area of [100] orientation.
(20) gold bonding wire that be used for semiconductor device one of any according to (1) to (19), wherein, [111] direction of described crystal grain and [100] deviation in driction connecting line longitudinally the inclination angle in 10 ° of scopes.
(21) gold bonding wire that be used for semiconductor device one of any according to (1) to (20), wherein, perpendicular to connecting line longitudinally the crystal grain quantity on the cross section from 0.04 to 4 of every square micron.
(22), a kind of use founding materials is produced the method for semiconductor device by using gold bonding wire by the combination step that comprises calendering (rolling), The pre-heat treatment, succeeding stretch and after-baking, wherein carry out taking turns described various processing with described order at least, wherein Ya Yan working (finishing) area ratio is not less than 95%; Heating-up temperature in the The pre-heat treatment (absolute temperature) is in 20 to 70% scope of founding materials fusing point; The working (finishing) area ratio of succeeding stretch is not less than 99.5%; And the heating-up temperature in the after-baking (absolute temperature) is in 20 to 70% scope of founding materials recrystallization temperature.
(23), a kind of method of using founding materials to produce the semiconductor device by using gold bonding wire by the combination step that comprises calendering, first stretching, The pre-heat treatment, succeeding stretch and after-baking, wherein carry out taking turns described various processing with described order at least, wherein the working (finishing) area ratio in calendering and first the stretching is not less than 95%; Heating-up temperature in the The pre-heat treatment (absolute temperature) is in 20 to 70% scope of founding materials fusing point; The working (finishing) area ratio of succeeding stretch is not less than 99.5%; Average rate of extension is 50 to 1000m/min; The vessel temp of stretching connecting line is 5 to 45 ℃; Heating-up temperature in the after-baking (absolute temperature) is in 20 to 70% scope of founding materials recrystallization temperature; And scanning tension force (sweep tension) is 0.2 to 70mN.
(24) a kind of method of the production semiconductor device by using gold bonding wire according to claim 22 or 23, wherein at a plurality of drawing dies that are used for stretching, be no less than 30% drawing die and have and be not less than 10% section and reduce than (area reduction raio).
(25), a kind of method of using founding materials to produce the semiconductor device by using gold bonding wire by the combination step that comprises calendering, first stretching, The pre-heat treatment, succeeding stretch and after-baking, wherein carry out taking turns described various processing with described order at least, wherein the working (finishing) area ratio in calendering and first the stretching is not less than 95%; Heating-up temperature in the The pre-heat treatment (absolute temperature) is in 30 to 70% scope of founding materials fusing point (absolute temperature); The working (finishing) area ratio of succeeding stretch is not less than 99.5%; Average rate of extension is 100 to 800m/min; Tension force difference before and after the drawing die is in the scope of 0.1 to 50 MPa; Heating-up temperature in the after-baking (absolute temperature) is in 30 to 70% scope of founding materials recrystallization temperature (absolute temperature); And in first stretching and succeeding stretch, the stretching angle in drawing die exit is not more than 30
(26) method of the production semiconductor device by using gold bonding wire of a kind of basis (25), wherein at a plurality of drawing dies that are used for stretching, section reduces than what account for the drawing die sum less than three kinds of drawing dies of 7%, 7 to 11% and 11 to 20% and is no less than 10%.
(27) method of the production semiconductor device by using gold bonding wire of a kind of basis (25) or (26), wherein in the after-baking step, the heating furnace that use has following Temperature Distribution comes continuous sweep (sweep) and heat treatment connecting line, wherein the heating-up temperature Te at heating furnace two ends (absolute temperature) than middle body heating-up temperature Tm (absolute temperature) low 0.02 to 0.3Tm.
Description of drawings
Fig. 1 is the schematic diagram by gold bonding wire (the connecting line diameter the is 25 microns) grain mark of EBSP measurement.
Fig. 2 is the schematic diagram by gold bonding wire (the connecting line diameter the is 18 microns) grain mark of EBSP measurement.
Embodiment
By the aggregate structure of concern gold bonding wire and the relation between the present known thin space connecting line connection, the inventor find first by control specific crystal orientation, specific crystal orientation than and connecting line in the distribution of crystal orientation, can improve the various characteristics (for example intensity, modulus of elasticity, line of apsides controllability, joint and to the inhibition of connecting line bending) of connecting line, and can improve some and be difficult to improved characteristic simultaneously in the past, thereby realized comprehensive improvement; In addition, can also solve the built in problem that thin space connects, for example the reduction of the inclination of the upstanding portion on the reliability of wedge bond characteristic, wedge bond and the spherical contact.
Be semiconductor device by using gold bonding wire and production method thereof described in the present invention (1) to (14), (20) and (22) below.
Described gold bonding wire has the fibrous aggregate structure at the connecting line longitudinal extension.Its length and modulus of elasticity can be by being chosen in connecting line longitudinally on the crystal orientation direction, and the ratio of the chip area of [111] orientation and the chip area of [100] orientation is not less than 1.2 method to be strengthened.The intensity and the modulus of elasticity that is not less than 90MPa of 300MPa have been confirmed to realize being not less than.When the orientation of control aggregate structure, especially, the modulus of elasticity specific strength more effectively increases, and this is that conventional material designing institute based on the interpolation element can't be realized.
When realizing high strength and high modulus of elasticity, compare with conventional material, can reduce the connecting line bending more than 20% when resin-sealed.This just provides possibility for the very thin connecting line that uses diameter to be not more than 15 microns, and so thin connecting line is essential for spacing is narrowed to being not more than 40 microns.In addition, the diameter of connecting line can be lowered 10% or more, but still keeps identical intensity, and from reducing the angle of material cost, this just provides very big advantage.
By controlling described structure with [111] orientation that increases crystal grain rather than [100] orientation that increases crystal grain, can gain in strength and modulus of elasticity, and advantageously realize the balling-up characteristic, up to the present when attempting usually to gain in strength by the unit that adds high concentration, also there are some problems in the formation of ball.For instance, even when the ratio that forms sphere diameter/connecting line diameter is 1.3 to 1.6 times bead, described ball still has good spherical characteristic, and is favourable for forming the connection that spacing is not more than 40 microns.This owing to: when the orientation of not only control orientation of [111] direction but also control [100] direction, the structure of connecting line not only influences the connecting line fracture characteristics after the wedge bond, and influences the formation of structure when ball solidifies.
[111] orientation of direction not only influences intensity, and helps to increase hot strength and bending strength (yield strength).Therefore, when on connecting line, applying big load when resin-sealed, perhaps when connecting line length, suppressed the elastically-deformable generation of connecting line effectively.Up to the present,, can gain in strength to a certain extent, but be accompanied by because the problem that the connecting line resistance that the high concentration interpolation causes increases by increasing the addition that forms alloying element in the connecting line.In future, must design the ICs that under high frequency, processes, so the increase of connecting line resistance can reduce semi-conductive function.On the contrary, by the orientation of control crystal grain on [111] direction and [100] direction, can increase the intensity of connecting line but do not increase its resistance, such connecting line has very big advantage, comprises being used for H.D LSIs, for example ASICs etc.
[111] Qu Xiang chip area is selected as being not less than 1.2 with the ratio (being abbreviated as area in the following description than [111]/[100]) of the chip area of [100] orientation.This is that the modulus of elasticity that is increased is to suppressing the effect that the connecting line bending is only played for a short time because if area compares less than 1.2.Preferably, area is not less than 1.4 than [111]/[100].This is because if the area ratio is not less than 1.4, can increase the effect that suppresses the connecting line bending.More preferably, select area to be not less than 2.5, thereby increase modulus of elasticity and bending rigidity than [111]/[100], thereby, the effect that suppresses the connecting line bending further increased.Although for there not being the concrete upper limit, area can be stablized less than 20 connecting line than the upper limit of [1111/[100] and relatively easily produce.This is because be difficult in the crystal grain of removing [100] orientation on the mass-produced level fully, and only stays the crystal grain of [111] orientation.
Comparatively speaking, the structure of observing the general gold bonding wire of using can learn area than [111]/[100] less than 1.2.Even those so-called very strong connecting lines, when on the commercial scale of place during steady production, their area is than [111]/[100] even less than 1.1.
In the present invention, crystal orientation has with respect to the connecting line longitudinal direction and is not more than 10 ° inclination angle.That is, in described scope, various orientation characteristics can be showed in the connecting line, can influence the characteristic of connecting line effectively.If crystal orientation surpasses 10 ° with respect to the inclination angle of connecting line longitudinal direction, to the influence that connects straight line character deviation may appear.
On the crystal orientation on the connecting line longitudinal cross-section, the shared area ratio of crystal grain of [111] orientation is not less than at 55% o'clock, can gain in strength and modulus of elasticity, and improve the linearity of the line of apsides, thereby increase the feasibility that thin space connects.
When forming the line of apsides of connecting line, according to the complicated track of the line of apsides, by advantageously forming the line of apsides regularly by strain and plastic deformation.Comprise the combination of straight line portion, sweep and folded part perpendicular to the line of apsides on the semiconductor chip direction.On the other hand, on the horizontal direction with respect to semiconductor chip, connecting line is linearly.Preferred line of apsides plastic deformation in vertical direction, thus bending and folding formed, and keep linearity in the horizontal direction as far as possible.When connecting line became thinner afterwards, linearity may reduce.In by the conventional material design of adding element, be difficult to not only keep linearity but also keep complicated line of apsides shape with sweep and folded part.
Therefore, when the crystal grain control connection line structure by [111] orientation, can satisfy conflicting character effectively simultaneously, for example crooked in vertical direction and folding, and being in line property in the horizontal direction.If the shared area ratio of crystal grain of [11 1] orientation is not less than 55%, in complicated line of apsides shape (for example the triangle line of apsides, the trapezoidal line of apsides or the ladder line of apsides), can advantageously control sweep and folded part, improve the linearity of the line of apsides simultaneously.
More preferably, longitudinally in the crystal orientation, the shared area ratio of crystal grain of [111] orientation is not less than 55% at connecting line, and the ratio of the chip area of [111] orientation and the chip area of [100] orientation is not less than 1.2.This is because except the shared area ratio of the crystal grain of regulation [111] orientation, be not less than under 1.2 situations at the ratio of the chip area of selecting [111] orientation with the chip area of [100] orientation, can suppress the distortion of connecting line when resin-sealed, and in large-scale production, can improve the productive rate that thin space connects.
In addition, when the shared area of crystal grain of [100] orientation than in 3 to 20% scopes the time, control the line of apsides easily at high speed, reduce the decentralization of high partial shape; Widen the proper range of condition of contact, for example load, sonic oscillation etc., thus can in large-scale production, improve the productive rate that connects.That is,, only rely on [100] orientation, often be difficult to the distortion of control connection line when when direction applies external force longitudinally perpendicular to connecting line.When the shared area ratio of crystal grain of [100] orientation is in 3 to 20% scopes, can control the line of apsides reposefully, elastic deformation can be transformed into plastic deformation reposefully when connecting connecting line, and has improved productivity ratio.If [100] area of direction ratio is less than 3%, above-mentioned effect is very little.On the other hand, surpassing [100] direction area of 20% gains in strength and the effect of modulus of elasticity based on the crystal grain of [111] orientation than suppressing.
Can improve the connecting line that must satisfy many requirements by the average structure of merely controlling on the entire cross section.To think in the past and be difficult to improved inclination and sliding properties in order to improve, find by connecting line is divided into central area and surface region on cross section, and the control crystal orientation is a kind of effective method in each district.Describe below by the control connection line structure and suppress to tilt and the method for sliding properties.
Be not more than 50 microns and when implement connecting, the inclination of upstanding portion connecting line often causes problem near the spherical contact when keeping spacing.Linearity mentioned above refers to the whole linearity of the whole line of apsides, what said herein inclination related to is local straight line, specifically, is near the inclination of the straight line portion the spherical contact, here, the narrowest and bending in vertical direction and folding the most serious of the spacing of adjacent connecting line.In the technology that is tilted in the connection of large-scale production thin space of described part inhibition connecting line, become an important task.Merely relying on connecting line mechanical characteristics such as high strength, high elastic modulus and elongation at break is difficult to suppress to tilt.
Although, also require to stop to tilt in the horizontal owing near the bending the spherical contact with folding very large deformation and distortion takes place.But rely on conventional method, be difficult to suppress to tilt based on mechanical characteristic.In addition, in general, only the control crystal orientation is not enough to suppress fully tilt on the cross section of connecting line.But have been found that the uniformity that strengthens crystal orientation on the connecting line cross section, and particularly the structure of control connection line middle section the inclination of upstanding portion connecting line is effective near the spherical contact for reducing.
That is to say, at connecting line longitudinally in the crystal orientation, if the radius of connecting line is represented with R, and part that will be from connecting line central authorities to R/2 is as middle body, so by will be on the crystal orientation of the vertical middle body of connecting line the ratio of chip area and the chip area of [100] orientation of [111] orientation be decided to be Rc, and the chip area of [111] orientation on the whole connecting line cross section and the ratio of the chip area that [100] are orientated are decided to be Ra, making it to satisfy differential ratio absolute value between the two | 1-Rc/Ra| * 100 (%) is less than 30%, and the ratio R a that is provided with on the whole connecting line cross section is not less than 1.2, suppresses to tilt.
Herein, for area than [111]/[100], ratio R a on the whole connecting line cross section is made as is not less than 1.2, and in addition, the ratio R c of control connection line middle body and the differential ratio absolute value between the ratio R a on the entire cross section | 1-Rc/Ra| * 100 (%) less than 30%, thereby strengthens the uniformity of structure on the whole connecting line cross section.After ball being connected to chip section point, when the Free Transform connecting line formed the line of apsides on four direction, the connecting line with said structure can suppress the inclination of connecting line upstanding portion.In addition, for uniformity, by control area than the area of [111]/[100], particularly middle body than can suppressing to tilt and distortion when resin-sealed, and do not damage the availability of productive rate, engagement characteristics and the line of apsides shape of connecting line.
Next, the method for improving the connecting line characteristic by the structure of control connection line near surface is described below.
When in large-scale production, using the thin connecting line that is not more than 40 microns to realize very narrow spacing, the pitch smaller between hole capillaceous and the connecting line, and resistance to sliding increases to the degree that can not ignore.In addition, must consider that sealing the time occupies the increase of the SiO2 powder filler of sealing resin more than 80% to the vibrations of connecting line and the connecting line bending followed.Therefore, need improve connecting line and intercapillary sliding properties, and increase the rigidity of connecting line, thereby connecting line is shaken and the bending of reduction connecting line resisting when resin-sealed.Except improvement is used for improving the linearity and inclination character of intensity, modulus of elasticity, line of apsides shape of thin space connecting line connection performance, only also need further to improve by conventional design of components sliding properties and the rigidity that can not improve.The inventor has been found that the overall structure on control connection line cross section, distributes by the crystal orientation in the further control connection line superficial layer and can realize above-mentioned requirements effectively.
Specifically, if the radius of connecting line is represented with R, and part that will be from the connecting line surface to the R/3 depths is as surface layer part, so by will be on the crystal orientation of the vertical surface layer part of connecting line the ratio of chip area and the chip area of [100] orientation of [111] orientation be made as and be not less than 1.6, and will be on whole connecting line cross section the ratio of chip area and the chip area of [100] orientation of [111] orientation be made as and be not less than 1.2, can strengthen intensity and modulus of elasticity simultaneously; Suppress the connecting line bending; Control line of apsides shape; Improve sliding properties; And enhancing rigidity.
Be made as by ratio and be not less than 1.6, can reduce resistance to sliding capillaceous with the chip area of chip area and [100] orientation of [111] orientation; Improve the line of apsides controllability that diameter is not more than 15 microns superfine connecting line; Suppress the generation of connecting line surface scars; And improve connecting line when resin-sealed and filler collision and the surface state that causes.In order to increase rigidity and to suppress the bending of connecting line when resin-sealed, except the structure of control surface layer segment, to form also that area is not less than 1.2 structure than [111]/[100] on the whole connecting line cross section.The area that surface layer part is set is not less than 1.6 than [111]/[100].This is because if area than less than 1.6, can not improve sliding properties and rigidity well., for clear and definite crystal orientation distributes, thereby guarantee to improve most effectively the effect of sliding properties and rigidity herein, the boundary of middle body and surface layer part is decided to be apart from R/3 place, connecting line surface.More preferably, the area of surface layer part can be made as and be not less than 2.5 than [111]/[100], and the average area on the entire cross section is made as and is not less than 1.2 than [111]/[100], thereby improve the effect that improves sliding properties and suppress the distortion of connecting line simultaneously.
In order to deal with the trend that increases pin and reduce spacing, people often attempt to have different connecting line length and different line of apsides height in single IC connecting line is connected, the problem that this causes with regard to the decentralization that is accompanied by owing to line of apsides height.For instance, if line of apsides shape can remain unchanged, can reduce the possibility that contacts between the connecting line by the line of apsides height that alternately changes between the adjacent connecting line.But in the connecting line that uses at present, be conditional for the height of the accurate control line of apsides.Be as short as in about 3 millimeters conventional package assembly in connecting line length, line of apsides height is determined by near the part of the affected by heat ball, and can relatively easily control the height of the line of apsides.On the other hand, in the connection of current many pins thin space, connecting line length increases to and surpasses 5 millimeters, and line of apsides height changes in very wide scope, and the decentralization that reduces line of apsides height becomes extremely important.
In order to reduce the decentralization of line of apsides height, need to find the structure of control connection line, and in addition, except control crystal orientation (for example above-mentioned [111] orientation or [100] orientation), the quantity of crystal grain plays a significantly greater role in the unit are.That is, confirm when perpendicular to connecting line longitudinally the crystal grain quantity on the cross section be 0.04 to 4 of every square micron, and connecting line longitudinally on the crystal orientation area on the entire cross section be not less than at 1.4 o'clock than [111]/[100], connecting line intensity increases; Even if connecting line length surpasses 5 millimeters, line of apsides height also can reduce; And can advantageously control the line of apsides.Select the scope of crystal grain quantity herein.This be because if the quantity of crystal grain less than 0.04/ μ m 2, when the orientation of crystal grain adjacent one another are was widely different, the shape of the line of apsides was inconsistent easily.In addition, by producing the usual step of connecting line, on whole connecting line, be difficult to be formed uniformly 4 of every square microns or more trickle crystal grain.
Except the average proportions of crystal orientation in the whole and subregion of connecting line, the aggregate structure of connecting line also comprises the zone with good crystalline orientation, thereby can further improve intensity, modulus of elasticity, the controllability of the line of apsides and the bending of inhibition connecting line of connecting line.
In whole connecting line, have and be not less than 1.2 area than [111]/[100], and have in one or more layers at least area wherein than [111]/[100] be not less than 1.6 and the width that connecting line directly makes progress be not less than the connecting line radius R 1/10 regional the time, can further improve the linearity of the connecting line that forms the line of apsides.This is because in area was not less than 1.6 layer than [111]/[100], because the direction of orientation of crystal, connecting line showed high modulus of elasticity.And it is believed that the linearity of connecting line improves because the dislocation that has suppressed to cause because of connecting line distortion increases and the distortion that causes because of processing.Herein, when directly upwards existing area to be not less than 1.6 than [111]/[100] at connecting line, and its width can obtain top effect when being not less than 1/10 layer of connecting line radius R efficiently.When area is not less than 2 than [111]/[100], and the width that directly makes progress at connecting line of such zone is not less than at 15% o'clock of the connecting line radius R, can obtain better effect.It is necessary having one or more oriented layer.More preferably, two-layer or more oriented layer should be arranged.
In addition, similarly, when connecting line is not less than 60% at the area ratio that has wherein [111] direction crystal grain at least in one or more layers, and the width that connecting line directly makes progress be not less than the connecting line radius R 1/10 regional the time, can gain in strength and modulus of elasticity, and further improve linearity.Herein, be not less than 1.6 situation and compare with area is made as than [111]/[100], be made as by area ratio and be not less than 60%, can further increase modulus of elasticity [111] direction crystal grain.Even if connecting when can not keep the linear diameter that connects so far, also confirmed to improve the linear effect that connects not being shorter than on 3 millimeters the connection length less than 20 microns thin connecting line.
In addition, be not less than 1.2 area than [111]/[100] when having in the crystal orientation longitudinally at connecting line in the whole connecting line, and have in one or more layers at least area wherein than [111]/[100] less than 0.9 and the width that connecting line directly makes progress be not less than the connecting line radius R 1/10 but during less than 1/3R regional, can further improve the stability that forms the line of apsides.When forming the line of apsides at a high speed, the plastic deformation of connecting line vertically and on the vertical direction becomes irregular connecting line, thereby has increased the decentralization of line of apsides shape.Area than [111]/[100] less than 0.9 zone in, it is believed that crystal along [100] direction orientation, and owing to alleviated the scrambling in the plastic deformation, thereby stablized the line of apsides.Herein, when directly upwards exist at connecting line area than [111]/[100] less than 0.9 and its width be not less than when layer of 1/10 of connecting line radius R, can obtain better effect.On the other hand, when the width of above-mentioned layer greater than the connecting line radius R 1/3 the time, the line of apsides becomes and is difficult to control.Not only use thin connecting line, and be not less than 30 microns thick connecting line with diameter and also can obtain described effect.More preferably, when in connecting line footpath long-pending upward than [111]/[100] less than 0.6 and its width when being not less than 15% layer of connecting line radius R, obtain the effect that further strengthens.It is necessary having one or more oriented layer.Preferably there is two-layer or multilayer.
Similarly, in order further to improve the controllability of the line of apsides, should have in the whole connecting line and be not less than 1.2 area than [111]/[100], and at the area that also should have wherein [100] direction crystal grain at least in one or more layers than being not less than 50% and be not less than 1/10 zone of connecting line radius R at the width that connecting line directly makes progress, thereby can further strengthen the effect of stablizing line of apsides shape.The increase of [100] direction crystal grain that is to say, owing to can reduce the decentralization of line of apsides height and improve its linearity.This just can deal with the increase of connection speed, and controls the line of apsides easily, keeps stability simultaneously, even if the speed that connects connecting line will be increased to up to 0.1 second or more in short-term in future.
In order further to strengthen intensity, modulus of elasticity, line of apsides controllability, and inhibition connecting line bending, and in large-scale production, improve thin space and connect, not only need the above-mentioned area of connecting line is controlled wholly or in part than [111]/[100], and need control wholly or in part the total area ratio of [111] and [100] crystal grain.
If at whole connecting line longitudinally in the crystal structure, have and be not less than 1.2 area than [111]/[100], and the ratio with [111] orientation and gross area of the crystal grain of [100] orientation is not less than 50%, can strengthen and improve wedge bond and reduce the effect that connecting line connects defective.When on the Au/Pt coating that at low temperatures thin connecting line is connected on the BGA plate and when keeping narrow spacing, wedge bond may deterioration.Carrying out plasma clean on described plate is effective measures for the intensity of improving wedge bond, but because the plastic deformation of connecting line often is accompanied by the generation of fold defect.Up to the present, improving wedge bond also is not very outstanding with the problem that reduces the connecting line fold defect.When thin connecting line was connected on the plate and keeps thin space, the problems referred to above can progressively expose to the open air, and in order to promote thin space to connect in large-scale production, also needed to solve described problem.
Found only to regulate area and also be not enough to solve simultaneously wedge bond and the folding problem of connecting line, and effective method is that total area ratio Pm with [111] in the connecting line and [100] crystal grain is made as and is not less than 50% than [111]/[100].The total area ratio Pm of control [111] and [100] crystal grain provides following benefit: the deformation behavior of control connecting line when wedge bond; Enhancing is connected with coating; And the vibrations that bring to connecting line when being reduced in cutting connecting line afterbody after the wedge bond reduce the folding of connecting line.Herein, if the shared area of [111] and [100] crystal grain than sum less than 50%, the scope of improving the folding suitable condition of contact of wedge bond and connecting line is restricted; If Pm is not less than 60%, can further strengthen the temperature that is not higher than 165 ℃ (suitable temperatures that are connected with substrate) under improve the effect of wedge bond.More preferably, if Pm is not less than 70%, use the wedge bond of the thin connecting line that is not coarser than 18 microns, and reduce the connecting line fold defect, the spacing that thin space connects can be reduced to less than 40 microns by improvement.
If at whole connecting line longitudinally on the crystal orientation, have and be not less than 1.2 area than [111]/[100], if and will from radius be R connecting line central authorities to the part of R/2 as middle body, and on the crystal orientation of the vertical middle body of connecting line, [111] the ratio Pc of direction and [100] direction chip area sum is not less than 60%, except improving the linearity, can also during producing connecting line, reduce the fracture of connecting line so; Reduce connecting line and vertically go up the decentralization of mechanical characteristic; And increase the productive rate that thin connecting line is produced.
Productive rate when producing in order to improve, the inventor finds that simple control area is not enough than [111]/[100]; The structure of the middle body from connecting line central authorities to R/2 is for the important effect that improved productive rate; And effective method is made as the ratio Pc of the gross area of [111] direction in the middle body and [100] direction crystal grain and is not less than 60%.Preferably, if Pc is not less than 70%, can further strengthen the effect of stablizing mechanical characteristic.More preferably, if Pc is not less than 80%, can reduces the fracture of connecting line and further boost productivity.By increasing the productivity ratio of thin connecting line, can stably supply the connecting line product, thereby deal with large-scale production.Thereby the user who makes connecting line obtains more material benefit.
If on the connecting line longitudinal cross-section, at whole connecting line longitudinally on the crystal orientation, have and be not less than 1.2 area than [111]/[100], if and will from radius be R connecting line the surface to the part of R/3 as surface portion, longitudinally in the crystal orientation, the ratio Ps of [111] direction and [100] direction chip area sum is not less than 50% in the surf zone, so at connecting line, using when resin-sealed, described connecting line will have the effect that the inhibition connecting line flexibility of enhancing is disperseed.
In order in resin-sealed step, to reduce the connecting line contact deficiency, find that except reducing above-mentioned connecting line bending, the decentralization that reduces the connecting line flexibility also is an effective method.Usually obtain the connecting line flexibility by the deformation quantity that seals the back connecting line divided by connecting line length herein.The reason of impelling the connecting line flexibility to disperse is that the resin distortion is uncertain in the metal die, and the connecting line flexibility changes with the variation that is applied to the external force direction on the connecting line length.In order in irregular resin distortion, to stablize the flexibility of connecting line, find that effective method is except the area in the whole connecting line is made as and is not less than 1.2 than [111]/[100], and particularly the ratio Ps of [111] direction in the surf zone and [100] direction chip area sum is made as and is not less than beyond 50%, the structure also will controlling from the surface of connecting line to the surf zone of R/3.Herein, ratio Ps is set as and is not less than 50%.This is to be little because if Ps, reduces the effect of flexibility standard deviation less than 50%.Preferably, Ps is not less than 60%, to such an extent as to even if having when reaching 4 millimeters or longer span in connecting line length, also can stablize the flexibility of connecting line.More preferably, in order to strengthen above-mentioned effect with the thin connecting line that is not coarser than 18 microns, connect and keep narrowly to the spacing that is not more than 40 microns in large-scale production thereby further strengthen, Ps should be not less than 70%.
In the total area ratio of control [111] direction and [100] direction crystal grain, also can realize essentially identical control for other crystal orientation.As the crystal orientation except that [111] direction and [100] direction, can also on the direction of for example [110], [112] and [122], control, thereby obtain on the connecting line surface, to suppress the effect that crackle takes place.Form the low line of apsides if strictly control the line of apsides, neck can suffer damage because of receive heat near ball so.Even if by merely regulating mechanical characteristic, even if, can not reduce infringement to neck perhaps by merely controlling the area on the structural plane described in the whole connecting line than [111]/[100] such as connecting line intensity.Therefore, except control [111] direction and [100] direction, can also on [110], [112] and [122] direction, be orientated, the line of apsides be hanged down in the injury and the realization of neck thereby reduce.
In addition, when seeking suitable crystal orientation ratio, the length of connecting line that need be observed is not less than the diameter of connecting line at least.More preferably, the length of connecting line is not less than 1.5 times of connecting line diameter, thereby obtains to strengthen the average data of measuring reproducibility.In order to check the direction of crystal orientation in the connecting line regional area, the length that needs to select to observe is not less than 1.5 times of the connecting line diameter, and more preferably is not less than its 3 times in addition.
For gain in strength, modulus of elasticity and reducing by the resin-sealed connecting line bending that causes, in its length is in the longitudinal cross-section of connecting line of 5 times of the connecting line diameter or more times, need two or more its crystal orientations and connecting line longitudinally angle 15 ° of angles with interior crystal grain, and described crystal grain is not less than 70% of connecting line diameter in the length of connecting line on vertically.In whole connecting line or in the regional area of connecting line,, except the average crystalline orientation or their ratio of controlling many crystal grain, also to keep being orientated the length of crystal grain fully in order further to strengthen mechanical characteristic.
In general observation, regard the orientation area of angle difference in about 15 ℃ of scopes as a crystal grain herein.Form the line of apsides with connecting line and with resin-sealed step in, when connecting line was out of shape owing to external force, the bending in most of deformation was greater than the diameter of connecting line.Therefore, in order to suppress deformation, need the length of orientation crystal grain to be not less than 70% of connecting line diameter, and have fibre structure in the vertical.
Then, the connecting line of the present invention that proposes in (15) to (21) is described below in the above.
Connecting line has at the vertical upwardly extending coma poly structure of connecting line.By observing the grainiess in the connecting line longitudinal cross-section, if the radius of connecting line is represented with R, part that will be from connecting line central authorities to R/2 is as middle body, and think that their outside is a periphery, [111]/[100] area of the ratio R c (the hereinafter referred area is than [111]/[100]) of the chip area that the chip area of [111] orientation and [100] are orientated in the middle body and periphery is than the satisfied differential ratio absolute value between the two of Rs so | and 1-Rc/Rs| * 100 (%) is not less than 30%, thereby implements to connect and promote when spacing narrows down wedge bond at low temperatures.Especially, the control of the orientation of described aggregate structure can improve intensity, modulus of elasticity and bonding strength when realizing the deformation of wedge contact, and it is irrealizable that this is based on the conventional material designing institute that adds element.
Therefore, even if use diameter to be not more than 20 microns very thin connecting line, described connecting line is necessary for the very narrow spacing that realizes being not more than 50 microns, compare with the method for using conventional material, also can reduce more than 10% in the connecting line bending when resin-sealed, in addition, connect temperature and can reduce more than 30 ℃, thereby guaranteed continuous connection to a great extent.Therefore, resin plate and band needn't stand high temperature again, and have improved productivity ratio and reliability to a great extent.
Below the effect of concise and to the point description control crystal orientation.During orientation on increasing [111] direction, except increasing hot strength, can also play the effect that increases bending strength, but this is not sufficient to keep at low temperatures thin space usually.Therefore, by using the orientation of [100] direction, can when forming ball, wedge bond, cutting afterbody and arc discharge improve the forming characteristic of connecting line.
When connecting line length increased, control crystal grain was in the orientation of [111] direction and [100] direction, was effective for the plastic deformation at inhibition connecting line when resin-sealed.Up to the present, by increasing the amount that forms the element of alloy in the connecting line, can gain in strength to a certain extent.But the interpolation element of high concentration is accompanied by the problem that connecting line resistance increases always.In future, the ICs that design is processed under high frequency is necessary, so the increase of connecting line resistance can cause the reduction of semiconductor function.On the other hand, the connecting line that control crystal grain is orientated on [111] direction and [100] direction shows the intensity of increase, and can not increase resistance, and a lot of advantages is provided, and comprises being used for H.D LSI, for example ASIC.
By being orientated on orientation and [100] direction on control [111] direction, promptly come the structure of control connection line than [111]/[100] by control area, can control the thin connecting line that wedge bond, the control line of apsides and working strength increase fully.That is to say, during than [111]/[100], can gain in strength and modulus of elasticity at control area, thus the element of the interpolation high concentration before having realized simultaneously adopting with the method for gaining in strength a plurality of characteristics that help forming ball that can't realize simultaneously.For instance, even if when the bulb diameter/connecting line diameter that can not stablize formation before the formation is 1.2 to 1.6 bead, described ball also can be kept good sphere and be advantageously used in thin space and connect.This is that the control of crystal grain to [111] orientation and [100] orientation has not only influenced the fracture of connecting line after the wedge bond, and has influenced the formation of structure when ball solidifies.
The present invention controls connecting line middle body and periphery than aspect, [111]/[100] from area, between these two parts, produce different structures, thereby improve conflicting requirement simultaneously, promptly gain in strength and improve connection performance, use traditional connecting line material to be difficult to realize such effect.The area that increases periphery is than [111]/[100], thereby gains in strength and modulus of elasticity, suppresses the resin distortion simultaneously.In addition, the area that suppresses middle body increases than [111]/[100], thereby increases bonding strength when wedge shape connects, and the fracture shape of stable connecting line.That is, find that the control connection line structure is not enough equably, it is important utilizing the architectural difference between connecting line middle body and the periphery energetically.
With [111]/[100] area of middle body and periphery than the differential ratio absolute value between Rc and the Rs | 1-Rc/Rs| * 100 (%) is made as and is not less than 30%.This be because when described value less than 30% the time, though can improve intensity or connection performance to a certain extent, very difficultly improve them simultaneously.In addition, although be not particularly limited, from keeping the angle of production stability and easiness, the higher limit of differential ratio should be less than 90%.
More preferably, the differential ratio between Rc and the Rs is not less than 40%.This is because when differential ratio is not less than 40%, and wedge bond can more advantageously be connected on the electrode on the soft material (for example described substrate and band).More preferably, when differential ratio is not less than 50%, can improve wedge bond greatly being lower than under 160 ℃ the temperature, to strengthen applicability to latest type joint (for example BGA, CSP etc.).
When the absolute value of above-mentioned differential ratio (1-Rc/Rs) * 100 (%) is in above-mentioned scope, can obtain favourable characteristic.In addition, described value positive and negative has slight difference in some purposes.When (1-Rc/Rs) * 100 (%)＜-30%, the Rc of middle body is higher, and is more favourable for very thin connecting line at low temperatures.On the other hand, when (1-Rc/Rs) * 100 (%)＞30%, the Rs height of periphery, can obtain to suppress by the resin-sealed distortion that causes effect.
As for the boundary of cutting apart the connecting line zone, if will be decided to be core from the zone of connecting line central authorities to three/radius (R/3), then its outside is the outer coversheet part from the surface to the zone of 2R/3, and the area of core and surface layer part is represented with Rd and Rf respectively than [111]/[100], needs the differential ratio absolute value between them so | 1-Rd/Rf| * 100 (%) is not less than 30%.This is because by the part from the surface to 2R/3 is decided to be surface layer part, and remaining R/3 is core, corresponding to the described part thickening of above-mentioned periphery, thereby the distortion that suppresses connecting line is shown the effect of further enhancing.
On the vertical crystal orientation of the connecting line on the connecting line longitudinal cross-section, be boundary with 1/2 of connecting line radius, connecting line is divided into middle body and periphery.Herein, [111] if of middle body/[100] area than [111]/[100] area of Rc and periphery than the differential ratio absolute value between the Rs | 1-Rc/Rs| * 100% is not less than 30%, and the average area on the vertical entire cross section of connecting line is not less than 1.0 than [111]/[100], and intensity and engagement characteristics strengthen simultaneously so.Especially, the linearity of connecting line is enhanced, and has further strengthened the effect of inhibition connecting line bending, thereby the thin space that can deal with the very thin connecting line of use connects.
Except control is divided into the structure of connecting line middle body and periphery thereof, with regard to the crystal orientation on the whole connecting line cross section, by increasing the ratio of [111] direction rather than [100] direction, can play the effect that strengthens bending rigidity and bending strength.
By comprising that complicated line of apsides track, opening/closing are used for the anchor clamps of line that are clamped and connected, and, can use connecting line to come the line of apsides of formation rule based on a series of processes that air stream tension force is sent connecting line.Therefore, the elastic deformation and the plastic deformation of essential control connection line.By on the entire cross section of connecting line, increasing average [111]/[100] area, and strengthen bending rigidity and bending strength,, also can stablize and keep effectively the linearity of connecting line even after forming the complicated line of apsides than Ra.By increasing bending rigidity and bending strength, can suppress the elastic deformation and the plastic deformation of connecting line, carrying out resin-sealed and the bending when bearing very big load of high speed thereby can reduce connecting line.
Average [111]/[100] area on the whole connecting line cross section is made as than Ra is not less than 1.0.This be because if Ra less than 1.0, bending rigidity and bending strength can not increase simultaneously.If Ra is not less than 1.0, can increase modulus of elasticity and bending rigidity simultaneously.Even if use diameter to be not more than 18 microns connecting line like this, also can improve the linearity of connecting line, reduce the bending of connecting line; And further improve the applicability of described connecting line in 40 microns or more closely spaced connection.In addition, need Ra to be not less than 1.2.This is because if Ra is not less than 1.2, can guarantee the linearity of the line of apsides simultaneously and the sweep in the required complicated line of apsides shape (for example trapezoidal line of apsides and the ladder line of apsides) and the controllability of folded part in thin space connects.
Longitudinally in the crystal orientation, on the connecting line longitudinal cross-section, the part from connecting line central authorities to R/3 is decided to be core at connecting line, and [111]/[100] area of core is located at than Rd in 0.1 to 0.8 the scope.In this case, intensity increases, and wedge bond strengthens simultaneously.In addition, improved the tired patience on the wedge bond, thereby strengthened reliability.Therefore,, also can guarantee good wedge bond, and strengthen the mass productivity that thin space connects even if use 20 microns or thinner thin connecting line and thin processing capillary.In addition, when using lead free solder in the future, can significantly reduce the generation of the defective (for example crackle and fracture) of wedge contact, the rising of simultaneous reflowing temperature.Therefore, described connecting line has promoted the actual use of lead free solder, and can be used for semiconductor packaging and solve environmental problem.
As for the reliability between the operating period, the tired patience of the wedge contact of very large deformation for example takes place in order to obtain labyrinth, as previously described, almost there is not the report of this respect at present; And the connecting line material factor that is used for improving reliability is also not clear.In the temperature cycles step of forming by soft heat, heat release between the operating period and cooling, the various elements that comprise silicon, metal framework, connecting line and sealing resin show different thermal coefficient of expansions and modulus of elasticity, and these all are the factors that influences reliability.Therefore infer the heat distortion and concentrate in the wedge bond, thereby cause fracture.For the stress of the wedge contact that alleviates gross distortion, need improve the tired patience of these parts.Therefore, the inventor notices the reliability that can improve wedge contact by control structure first.
That is to say that in order to improve the tired patience of bonding part, [111]/[100] area that reduces the connecting line core is than Rd, and the area ratio of the crystal grain of the crystal grain of increase [100] orientation and [111] orientation.In addition, in order to gain in strength fully and to improve the wedge bond characteristic, and strengthen the reliability of thin space in connecting, the area that [111]/[100] area that periphery is set is higher than middle body than Rs is than Rc more than 30% comprehensively.In the expansion of conventional material design,, can slightly improve described tired patience by increasing high temperature percentage elongation (often following the reduction of connecting line intensity).Therefore, such processing makes the line of apsides of thin connecting line be difficult to control, and the increase of connecting line bending makes it to be difficult to deal with the thin space connection.Yet, can thoroughly improve described character by the crystal grain of [100] orientation that suitably distributes at the connecting line core, and bring any detrimental effect hardly.With regard to the connecting line core, in order under the situation of not damaging connecting line intensity, further to improve the reliability of wedge contact, use the structure of [100] orientation the zone from connecting line central authorities to R/3 (being called core), this zone is darker than the middle body from connecting line central authorities to R/2.
In described core, [111]/[100] area of core is located at than Rd in 0.1 to 0.8 the scope.This be because if Rd less than 0.1, very difficult assurance is not thicker than the intensity of 15 microns thin connecting line.On the other hand, if Rd surpasses 0.8, the effect that improves the tired patience of wedge contact reduces.
In addition, suitably regulate parameters R c, Rs, Rd and Ra, the area that middle body and periphery are set is than the differential ratio between Rc and the Rs | and 1-Rc/Rs| * 100% is not less than 30%, ratio R d in the core is located in 0.1 to 0.8 the scope, and [111]/[100] area that is provided with on the whole connecting line cross section is not less than 1.0 than Ra.Desired during just as control structure, owing to increased the anti-Qu Qiangdu of bending rigidity and increase, connecting line intensity is increased, wedge bond improves, connecting line is crooked to be reduced, and owing to be not more than 1 millimeter short span, near the hot strength the wedge contact increases, and this is a kind of composite action.
In the thin space that uses BGA substrate or band connects, in same encapsulation, can form the connecting line line of apsides of different length in many cases.Height between chip surface and wedge bond surface is not simultaneously, and in short-term in span, near wedge contact, connecting line and the insertion angle that connects between the surface are relatively large, thereby when the transportation sample, can crack at wedge contact when perhaps carrying out tension test, cause the wedge contact fracture, although this does not often take place.Therefore, parameters R c, Rs, Rd and Ra are controlled in the above-mentioned scope, so that when connecting the wedge bond of short span, the range of choice of relatively easily extended operation condition.
In periphery [111]/[100] area is not less than 1.2 connecting line than Rs, can gain in strength, improve wedge bond simultaneously, thereby further improve near the inclination of the upstanding portion the described spherical contact.The effect of fouling control to tilting is described below.
Reach in 50 microns or the littler connection in that spacing is narrow, near the connecting line of the upstanding portion the spherical contact tilts to have become a problem.Linearity mentioned above refers to the whole linearity of the whole line of apsides, what said herein inclination related to is local straight line, specifically, is near the inclination of the straight line portion the spherical contact, here, the narrowest and bending in vertical direction and folding the most serious of the spacing of adjacent connecting line.In large-scale production thin space step of connecting, the inclination that suppresses connecting line in these parts is an important task.
In order to suppress described inclination, the essential prevention laterally lodges, although because crooked or folding connecting line generation serious deformation or distortion near the spherical contact.Only the conventional method based on mechanical characteristic is not enough to suppress described inclination.Only the orientation of the average crystalline on the control connection line cross section also is not enough for suppressing described inclination.The inventor finds that it is effective that being distributed in of crystal orientation on the control connection line cross section suppressed described inclination aspect.
Promptly, if [111] of connecting line middle body and periphery/[100] area is not less than 30% than the differential ratio absolute value between Rc and the Rs, if and [111] of periphery/[100] area increases to than Rs and be not less than 1.2, so just can suppress effectively to tilt.It is believed that area by relative reduction middle body is than [111]/[100], local buckling when forming the line of apsides becomes easier with folding, the periphery area then can stop the lodging of the connecting line part on the spherical contact than the increase of [111]/[100], thereby suppresses to tilt.When ball melted, the connecting line on the spherical contact partly tended to be heated and recrystallization takes place, and also was that intensity reduces maximum zone here usually.Structure to this part is improved, and the area that increases the connecting line periphery reduces than [111]/[100] because the intensity decreases that heat causes; Think that promptly this is to suppress one of factor that tilts.
Herein, [111]/[100] area of periphery is set at than Rs is not less than 1.2.This is because if Rs less than 1.2, suppresses the effect deficiency of inclination.More preferably, Rs is not less than 1.5.This is that tilt problem can frequently take place because if increase the line of apsides height of thin space in connecting.But, be not less than at Rs under 1.5 the situation, even if line of apsides height surpasses 300 microns, also be enough to suppress to tilt.
In addition, if connecting line middle body and periphery [111]/[100] area is not less than 30% than the differential ratio absolute value between Rc and the Rs, if increasing to than Rs, [111] of periphery/[100] area is not less than 1.2, if and the ratio R d in the core in the R/3 is adjusted in 0.1 to 0.8 the scope, can reduce the connecting line bending in the reverse ladder connection that is difficult at present overcome, thereby promote the multilayer chiop in the large-scale production to connect.
In oppositely ladder connected, wedge contact was positioned at the position that is higher than spherical contact; Near the length of the connecting line upstanding portion of spherical contact is several times of common connection; Plastic deformation partly has special structure, and the frequent defective that and lodging crooked such as connecting line take place.Cause the reason of described defective and cause the reason of inclination recited above similar.Therefore, by in the periphery of the inside of connecting line, connecting line and superficial layer, crystal structure being controlled at connecting line, make it to satisfy the relation between aforesaid [100] orientation and [111] orientation, thereby reduced the crooked and decline of connecting line, thereby improved the productivity ratio that reverse ladder connects.
In the thin space that uses thin connecting line connected, there was scar on the connecting line surface, and owing to the scraped finish of capillary tube inner wall to connecting line, inside capillaceous is also blocked.The inventor finds can improve described these problems by the structure in the most surfaces zone in the control connection line.
That is to say, in the grainiess on the connecting line longitudinal cross-section, if the radius of connecting line is represented with R, and the part from the connecting line surface to the R/5 depths is decided to be the outermost part, scar or polishing scratch in order to reduce the connecting line surface so, thereby suppress obstruction capillaceous and increase the number of times that capillary uses continuously, on the crystal orientation of the vertical outermost part of connecting line, [111]/[100] area is made as than Rt is not more than 1.0.
Herein, [111]/[100] area the outermost part that will be from the connecting line surface to the R/5 depths is set in than Rt and is not more than in 1.0 scopes.This is because friction and sliding properties between capillary tube inner wall and the connecting line surface depend primarily on the part of connecting line surface to the R/5 depths.If the Rt in described zone surpasses 1.0, friction and sliding properties deterioration, and be difficult to the effect that acquisition is enough to improve connecting line surface scars or capillary obstruction.More preferably, Rt is in being not more than 0.8 scope.This is that the incidence of defective (for example connecting line surface scars or capillary stop up) will increase so because if the difference in size between aperture capillaceous and the connecting line diameter is 4 microns or littler (this is likely in thin space connects).By selecting Rt in being not more than 0.8 scope, can strengthen and improve effect, thereby suppress the generation and the obstruction capillaceous of scar.
Crystal orientation among preferred the present invention comprises that those depart from connecting line and are not more than 10 ° crystal orientation in the inclination angle longitudinally.Usually, even if, also can have angle difference to a certain degree between the single crystal for the crystal orientation of a certain specific direction.In addition, different sample preparation methods and test methods (for example measuring the method for crystal orientation) also can cause angle difference to a certain extent.Herein, if crystal orientation depart from connecting line longitudinally angle be not more than 10 °, then the feature of crystal orientation will be included, and can fully influence the character of connecting line.If surpass 10 ° in the inclination angle longitudinally but crystal orientation departs from connecting line, then deviation may take place in the influence to connecting line.
In order to tackle previous described increase pin and to reduce the trend of spacing, people attempt to realize having being connected of different connecting line length and different line of apsides height in single IC always, but the dispersion of line of apsides height often is accompanied by some problems.For instance, when line of apsides shape always remains unchanged, can reduce the possibility that contacts between connecting line by the line of apsides height that alternately changes between adjacent connecting line.But, use present connecting line, the ability of accurately controlling line of apsides height is limited.Be as short as in about 3 millimeters conventional package assembly in connecting line length, line of apsides height depends near the part of the affected by heat of ball, and can relatively easily control line of apsides height.Yet in many pins thin space in modern times connected, connecting line length increased to and surpasses 5 millimeters, and the height of the line of apsides is distributed in the wide scope, so it is extremely important to reduce the decentralization of line of apsides height.
In order to reduce the decentralization of line of apsides height, find the structure of essential control connection line, in addition, except the crystal orientation of controlling above-mentioned for example [111] direction and [100] direction, the quantity of the crystal grain in the unit are also plays an important role.Confirmed if select [111]/[100] area of connecting line middle body and periphery to be not less than 30% than differential ratio absolute value between Rc and the Rc, and perpendicular to connecting line longitudinally the crystal grain quantity on the cross section be 0.04 to 4 of every square micron, intensity can increase so; Even if for long 5 millimeters connecting line, the decentralization of line of apsides height also can reduce; And can advantageously control the line of apsides.Select the scope of crystal grain quantity herein.This be because if the quantity of crystal grain less than 0.04/ μ m 2, when the orientation of crystal grain adjacent one another are was widely different, line of apsides shape can be tending towards disperseing.In addition, adopt common connecting line production stage, be difficult in the fine grain that is formed uniformly 4 of every square microns or more in the whole connecting line.
The connecting line of the present invention that has proposed in (1) to (21) above above having described.The aggregate structure of connecting line is not also known and is not reported yet.Although the aggregate structure of various metals is known in rolling stock and the thin stretching connecting line, but for the relation between method for metal working, component and the aggregate structure, and the relation between aggregate structure and the material therefor characteristic does not still have consistent viewpoint.Up to the present, aggregate structure is still according to X-ray diffraction or use the electron beam diffraction of TEM to measure, but their thin aggregate structures to about 25 microns and softer metal connecting line of energy measurement diameter not.
Analytical technology is just in fast development, the zone X ray detecting analysis that can have very little measured zone, the Electron Back-Scattered Diffraction analysis (EBSP) of exploitation recently, and similarly method all is to measure the very very effective method of measurement of small sample.Wherein, EBSP can relatively easily measure the such fine rule of connecting line, to observe the aggregate structure on its section.For instance, Fig. 1 has shown the result with the gold bonding wire of 25 microns of EBSP observation diameters, wherein can measure the orientation of crystal exactly.By using top up-to-date analytical technology, confirm first with regard to the fine structure of connecting line, can measure the distribution of the crystal orientation on single compact grained crystal orientation and the whole cross section in pin-point accuracy ground, and have good reproducibility.But, herein, even if by EBSP or X ray measure connecting line the surface or its throwing face, also differing obtains correct data surely.Only should be understood that correct set many experiment conditions (for example sample preparation and instrumentation) after, just may the analysis of pin-point accuracy ground be orientated.
In addition, in EBSP measured, the orientation that can observe each crystal grain was determined the area of crystal grain.But when using X-ray diffraction, can draw the volume ratio of crystal orientation according to the X ray intensity on each crystal orientation.Therefore, by X-ray measurement on the connecting line longitudinal cross-section or perpendicular to the crystal orientation on the cross section longitudinally, if [111] Qu Xiang crystal grain is not less than 1.2 with the volume ratio of the crystal grain of [100] orientation, just can increase the intensity and the modulus of elasticity of connecting line, and in the bending that can reduce connecting line when resin-sealed.Confirmed among the present invention except that above-mentioned [111] direction and [100] direction chip area than the chip area ratio, also the volume of each crystal orientation that can record according to the X-ray diffraction method is recently definite.
When using X-ray diffraction, the intensity reflects of X ray area.That is to say that the area ratio of the crystal grain of [111] orientation or [100] orientation can be expressed by the ratio of the X ray intensity of described crystal orientation.
Therefore, in the X ray intensity that connecting line is vertically measured, if [111] ratio of the X ray intensity of X ray intensity and [100] the orientation crystal grain of orientation crystal grain is not less than 1.2, intensity increases so, modulus of elasticity strengthens, and in the bending that can reduce connecting line when resin-sealed.As for the chip area ratio except that above-mentioned [111] direction and [100] direction chip area ratio among the present invention, their relation also can recently be represented with the X ray intensity of each crystal orientation.
Then, the connecting line production method of the present invention (22) of proposition in above-mentioned (1) to (14), (20) and (21) is described below to (24).
The method of control crystal orientation mainly comprises control production technology and the component of adding formation alloy described below.
A kind of method of using founding materials to produce the semiconductor device by using gold bonding wire by the combination step that comprises calendering, The pre-heat treatment, succeeding stretch and after-baking, wherein carry out taking turns described various processing with described order at least, wherein Ya Yan working (finishing) area is than being not less than heating-up temperature (absolute temperature) in 95% The pre-heat treatment in 20 to 70% scope of founding materials fusing point; The working (finishing) area ratio of succeeding stretch is not less than 99.5%; And the heating-up temperature in the after-baking (absolute temperature) is in 20 to 70% scope of founding materials recrystallization temperature.Described method can be regulated the crystal grain with [111] orientation and [100] orientation of connecting line on vertically.
Calendering can be used the roll with circular groove, and the roll that perhaps has square groove carries out, and perhaps adopts and forges (swaging) calendering.Connecting line can use big drawing die partly to stretch.If the connecting line average diameter before and after the calendering represents that with Df and Dg total processing stage of calendering can be used { 1-(Dg/Df) 2(%) represents in } * 100.Then, mainly use drawing die to stretch.Stretched mechanical is the machinery that can use a plurality of drawing die stretching connecting lines simultaneously.If the connecting line radius before and after stretching represents that with Rf and Rg total processing stage of stretching can be used { 1-(Rg/Rf) 2(%) represents in } * 100.The inwall of drawing die need be handled with superhard metal or diamond, to have excellent stability.Heat treatment method is: batch heat, and the connecting line that wherein is in the winding state is placed in the heating furnace and heats a period of time; Perhaps continuous heat is wherein ceaselessly sent connecting line in the heating connecting line in the heating furnace of predetermined length.
Satisfy at the same time under the condition of above-mentioned calendering processing stage, stretch process degree and heat treatment heating-up temperature, can easily impel the orientation on [111] direction and [100] direction.Do not satisfy any one above-mentioned condition and all will be difficult to control structure.For instance, when rolling total processing stage less than 95%, perhaps when stretching total processing stage less than 99.5% the time, be difficult to process complete aggregate structure, and be difficult to increase area in the final aggregate structure than [111]/[100], wherein the heating by subsequently can partly realize replying (recovery)/recrystallization.When the heating-up temperature in the heat treatment (absolute temperature) less than the raw material fusing point 20% the time, be difficult in the crystal orientation of facilitating in the stretching step subsequently along [111] and [100] direction.When heating-up temperature up to 70% when above of raw material fusing point, be difficult to keep area and be not less than 1.2 than [111]/[100], although because connecting line is stretched to final connecting line diameter, the ratio of other crystal orientation beyond [111] orientation becomes very high.
In addition, will be located at the heating-up temperature in the after-baking in 20 to 70% the temperature range of raw material recrystallization temperature.This be because when heating-up temperature be low to moderate less than recrystallization temperature 20% the time, except lacking [111] crystal orientation, because the problem of connecting line bending also can take place in the existence that processing is twisted.On the other hand, when heating-up temperature surpass the raw material recrystallization temperature 70% the time, the connecting line surface can be by severe oxidation, and the wedge bond deterioration.Here, since closely related with fusing point in The pre-heat treatment, so use the reference of fusing point as temperature in the The pre-heat treatment.And in after-baking, then use recrystallization temperature.This is because must regulate temperature in the after-baking, obtains identical structure thereby have in final step in the material of different stretch processing stage.Because processing stage is reflected in the recrystallization temperature indirectly, so by determining that on the basis of recrystallization temperature temperature range is easy to the control orientation.The method of determining recrystallization temperature has several, wherein can be with in the temperature variant curve of elongation at break, and the temperature when elongation at break increases suddenly is as recrystallization temperature.
In order to facilitate the crystal orientation along [111] and [100] direction effectively, heating is divided into The pre-heat treatment and two steps of after-baking.The effect of The pre-heat treatment is to introduce predetermined directivity in the disordered crystal orientation that forms by calendering, so that obtain along the aggregate structure of predetermined direction development by stretching step subsequently.Then heat treatment section has then brought out answer/recrystallization, thereby can control the crystal grain with [111] orientation and [100] orientation simultaneously.
In addition, in order to control described structure, the invention provides a kind of method of using founding materials to produce the semiconductor device by using gold bonding wire by the combination step that comprises calendering, first stretching, The pre-heat treatment, succeeding stretch and after-baking, wherein carry out taking turns described various processing with described order at least, wherein the working (finishing) area ratio in the calendering is not less than 95%; Heating-up temperature in the The pre-heat treatment (absolute temperature) is in 20 to 70% scope of founding materials fusing point; The working (finishing) area ratio of succeeding stretch is not less than 99.5%; Average rate of extension is 50 to 1000m/min; The vessel temp of stretching connecting line is 5 to 45 ℃; Heating-up temperature in the after-baking (absolute temperature) is in 20 to 70% scope of founding materials recrystallization temperature; And scanning tension force 0.2 to 70mN.According to described method, can on connecting line is vertical, control crystal grain with [111] orientation and [100] orientation and the distribution of orientations on the control cross section simultaneously.
For the distribution of crystal orientation on the control connection line cross section, can during heating treatment control rate of extension, draft temperature and scanning tension force effectively, processing is compared and heat treatment temperature is not enough because only control.Specifically, in the scope of above-mentioned processing ratio and heat treatment temperature, average rate of extension is set as 50 to 1000m/min; The vessel temp of stretching connecting line is set as 5 to 45 ℃; Scanning tension force in the after-baking is set as 0.2 to 70mN, with the uniformity that increases crystal orientation on the whole cross section and the orientation of reconciliation statement surface layer part-structure.By in suitable scope, regulating processing ratio, heat treatment temperature, rate of extension, draft temperature and scanning tension force, can on whole connecting line longitudinal cross-section, (rather than partly) pin-point accuracy ground control structure distribute.Stipulate separately these parameter conditions to be described below although be difficult to some condition.
Average rate of extension is made as 50 to 1000m/min.This is because when average rate of extension during less than 50m/min, vertically go up skew and mass production capabilities decline take place.On the other hand, when average rate of extension surpassed 1000m/min, the dynamics recrystallization may take place, thereby be difficult to keep the uniformity of crystal orientation in the heat that produces during owing to the stretching connecting line.When the vessel temp of stretching connecting line was lower than 5 ℃, the connecting line surface may be cooled.On the other hand, when vessel temp surpasses 45 ℃, reply in the outermost area of connecting line, thereby cause the dispersion of structure, increase operator's burden, and cause operation failure.When the scanning tension force in the after-baking during less than 0.2mN, when connecting line was mobile in stove, connecting line may be swung, thereby produced the dispersion of condition of heat treatment.When scanning tension force surpassed 70mN, the connecting line diameter may attenuate.
From strengthening the angle of structural controllability, need under following condition, implement described step: roll total processing stage and be not less than 95%; Total processing stage that stretches is not less than 99.5%; Heating-up temperature in the The pre-heat treatment (absolute temperature) is in 30 to 70% scope of raw material fusing point; And the heating-up temperature in the after-baking is in 30 to 70% scope of raw material recrystallization temperature.By described method, can further improve the integrity degree of [111] orientation and [100] orientation.
In addition, from the angle of control structure, after calendering, The pre-heat treatment, stretching connecting line and after-baking step, need to increase step, perhaps meticulous stretching connecting line step and the combination of heat treatment step for the third time of meticulous stretching connecting line.The purpose of adding the step of meticulous stretching connecting line is, attenuates and increases the intensity that partial dislocation increases connecting line by the crystal grain that makes the connecting line near surface.The purpose that increases the step of meticulous stretching connecting line and the combination of heat treatment step for the third time is, [111] orientation of periphery by making connecting line and the crystal grain of [100] orientation are more tiny than the crystal grain of part in the central, further increase sliding properties and suppress the connecting line bending, improve intensity by the surface of reforming simultaneously.
More preferably a plurality of drawing dies that are being used for stretching, being no less than 30% drawing die has and is not less than 10% section and reduces ratio, thereby increase the uniformity of crystal orientation on the whole cross section, and the area between reduction middle body and the periphery is than the difference of [111]/[100].This is because the drawing die of the connecting line that is used for stretching in the prior art has usually and is not more than 6% section and reduces ratio, and it is believed that increasing section reduces than promoting the connecting line surface layer part to being not less than 10%, and the homogenizing of middle body.The high-speed stretch connecting line has and is not less than 10% section and reduces ratio because be no less than 30% the drawing die that is used to stretch, so even if also can be controlled described structure on the large-scale production level.
In addition, in order to control described structure,, be no less than 30% drawing die and have and be not less than 10% section and reduce ratio at a plurality of drawing dies that are used for stretching.In the case, the uniformity of crystal orientation is enhanced on the not only whole cross section, and above-mentioned area is also effectively increased than [111]/[100].The connecting line of producing by stretching has suppressed the bending of connecting line; Because the increase of intensity and modulus of elasticity has improved the linearity of line of apsides shape, and suppressed the inclination of the upstanding portion on the spherical contact, and improved the feasibility that thin space connects.
For the distribution of various crystal orientations in the control connection line, and the diameter of control crystal grain, need to select the appropriate section of each drawing die to reduce order, the angle that connecting line inserts drawing die of ratio, drawing die and the pulling force when stretching.For instance, remain unchanged by the angle of connecting line being inserted drawing die, perhaps when stretching, regulate pulling force, structure on the whole connecting line cross section is kept evenly, perhaps connecting line vertically on not only local but also orientation (tens meters to the hundreds of myriametre) control table surface layer in big scope, thereby produce uniform connecting line.Arrangement as for drawing die, for instance for the structure of control connection line middle body and surface layer part thereof, using section to reduce than the drawing die that is not less than 10% near the step of final connecting line diameter, is the speed that the slight delay connecting line narrows down under 40 to 400m/sec the situation in rate of extension perhaps.
Except mainly coming the control structure according to production method, can also usually further suppress to tilt by the unit that adds in the connecting line effectively, described in recent years being tilted in realizes having become a problem in the thin space.
By using now the Au that uses mainly as modern connecting line material, add total concentration C as key component 1Be that one or more of 0.002 to 0.03 quality % are selected from the element of Y, Ca, Yb and Eu, and add total concentration C 2Be that one or more of 0.002 to 0.05 quality % are selected from the element of La, Tb, Dy and Nd, these add component concentrations and maintain 0.1＜C 1/ C 2In＜10 the scope, thereby obtain the billon connecting line.Except the formation that helps [111] direction crystal grain, the interpolation of these components can also further suppress to tilt.Suppress to tilt by above-mentioned connecting line production method.In addition, can come control structure, thereby further suppress to tilt by adding above-mentioned element near the part of affected by heat ball.Herein, if C 1Less than 0.002 quality %, if perhaps C 2Less than 0.002 quality %, the effect of control structure is little.On the other hand, if C 1Surpass 0.03 quality %, if perhaps C 2Less than 0.05 quality %, the bond strength of the spherical contact on the Al alloy pad descends.If 0.1＜C 1/ C 2＜10, the combination of this two group element may produce synergy so, makes the integrity degree of [111] orientation relatively easily control, and thoroughly improves serviceability (for example stability of the line of apsides and joint).
More preferably above-mentioned production method is combined with following connecting line material, wherein above-mentioned two kinds of element set have 0.4＜C 1/ C 2＜6 concentration relationship, thus the effect of control crystal orientation further promoted, so that within the scope of the invention with crystal orientation [111] and [100] setting.
The method (25) that production connecting line of the present invention (15) to (21) is described below is to (27).
The method of control crystal orientation mainly comprises control production technology and the component of adding formation alloy described below, and is as described below.
In order to control the structure of gold bonding wire, the invention provides a kind of method of using founding materials to produce the semiconductor device by using gold bonding wire by the combination step that comprises calendering, first stretching, The pre-heat treatment, succeeding stretch and after-baking, wherein carry out taking turns described various processing with described order at least, wherein the working (finishing) area ratio in calendering and first the stretching is not less than 95%; Heating-up temperature in the The pre-heat treatment (absolute temperature) is in 30 to 70% scope of founding materials fusing point; The working (finishing) area ratio of succeeding stretch is not less than 99.5%; Average rate of extension is 100 to 800m/min; Tension force difference before and after the drawing die is in 0.1 to 50MPa scope; Heating-up temperature in the after-baking (absolute temperature) is in 30 to 70% scope of founding materials recrystallization temperature; And in first stretching and succeeding stretch, the stretching angle in drawing die exit is not more than 30 °.In the scope of these conditions, can be by regulating on the connecting line of the present invention's regulation is vertical, to obtain to have the crystal grain of [111] orientation and [100] orientation.
Calendering can be used the roll with circular groove, and the roll that perhaps has square groove carries out, and perhaps forges calendering.Connecting line can use big drawing die partly to stretch.If the connecting line average diameter before and after the calendering represents that with Df and Dg the working (finishing) area ratio of calendering can be used { 1-(Dg/Df) 2(%) represents in } * 100.Then, the main calendering drawing die that uses stretches.Stretched mechanical is the machinery that can use a plurality of drawing die stretching connecting lines simultaneously.If the connecting line mean radius before and after stretching represents that with Rf and Rg the working (finishing) area ratio of stretching can be used { 1-(Rg/Rf) 2(%) represents in } * 100.The inwall of drawing die need be handled so that it has excellent stability with superhard metal or diamond.Heat treatment method can be that the connecting line that will twine is placed in the heating furnace and heat-treats in batches; Perhaps in having the heating furnace of predetermined length, send connecting line continuously, thereby carry out continuous heat.
Must carry out suitable selection for the conditions such as heating-up temperature in above-mentioned calendering working (finishing) area ratio, stretch process area ratio and the heat treatment.The reason of selecting these conditions is because if the working (finishing) area ratio is less than 95% in calendering and first the stretching, perhaps working (finishing) area compared less than 99.5% o'clock in the succeeding stretch, be difficult to process complete aggregate structure, and be difficult to adjust area in the final aggregate structure than [111]/[100], wherein the heating by subsequently can partly realize answer/recrystallization.In addition, if the heating-up temperature in the heat treatment, is difficult in the crystal orientation of facilitating in the stretching step subsequently along [111] and [100] direction less than 30% of raw material fusing point.On the other hand, if heating-up temperature surpasses 70%, although connecting line is stretched to final connecting line diameter, the ratio of [111] orientation in addition increases, and very difficult control area is than [111]/[100].
Average rate of extension is set as 100 to 800m/min.This is to descend because if average rate of extension, vertically goes up generation skew and mass production capabilities less than 100m/min.On the other hand, if average rate of extension surpasses 800m/min, the dynamics recrystallization may take place, thereby be difficult to keep the uniformity of crystal orientation in the heat that produces during owing to the stretching connecting line.Tension force difference before and after the drawing die is set as 0.1 to 50MPa.This is in order to come the processing distortion of control connection line near surface by the tension force difference before and after the control drawing die.If difference less than 0.1MPa, is disperseed in the structure longitudinally easily at connecting line.If difference, causes the problem of thin connecting line fracture greater than 50MPa.In addition, if in first stretching and succeeding stretch, the stretching angle in drawing die exit is not more than 30 °, and machining stress is controlled in perpendicular on the connecting line longitudinal cross-section, and the structure in easy control connection line and the periphery thereof.
For facilitate near the connecting line central authorities and near the superficial layer area need control the condition of processing and answer/recrystallization within the specific limits than the difference of [111]/[100].For instance, in calendering, stretching for the first time and succeeding stretch, need to adopt to change processing stage or change near the central authorities and near the method for the machining stress the superficial layer, perhaps adopt a kind of during heating treatment (for example during The pre-heat treatment and the after-baking) can change the method for the answer/recrystallization on the depth direction from the connecting line surface to inside.Further,, can and use in the stretching step of drawing die, introduce machining stress near the superficial layer place, and,, can discharge machining stress in surface layer part again by the dynamics recrystallization by improving processing speed in calendering by in conjunction with above-mentioned two aspects.Can also produce variations in temperature on the connecting line depth direction by changing temperature, translational speed and tension force during the heat treatment.Aggregate structure processed and replied/and the synergy of recrystallization influences.By suitably being used in combination processing conditions and heat-treat condition, can change area on the connecting line internal direction than [111]/[100].
In the step of diameter reduction progressively, condition everywhere needn't be identical, and change these conditions (for example angle of bend) by the diameter according to connecting line, can produce the difference that crystal orientation distributes near connecting line central authorities or superficial layer.The section of drawing die reduces ratio, rate of extension and heat treatment temperature and can relatively easily change and control in the stretch process, and obtains described effect easily.At a plurality of drawing dies of connecting line that are used for stretching, at least be no less than 10% quantity with every kind and use section to reduce than less than three kinds of drawing die groups of 7%, 7 to 11% and 11 to 20%, so that respectively near central authorities and control crystal orientation near the superficial layer.By drawing die quantity and the combination order thereof that changes top three kinds of drawing die groups, can in the connecting line range of structures of the present invention's regulation, regulate the crystal orientation ratio subtly.
In addition, the heating furnace that use has following Temperature Distribution comes the continuous sweep connecting line, and it is heat-treated, wherein the heating-up temperature Te at heating furnace two ends (absolute temperature) than middle body heating-up temperature Tm (absolute temperature) low 0.02 to 0.3Tm, thereby cause near the central authorities and near the variation of the recrystallization behavior superficial layer, thereby on the connecting line depth direction, control crystal orientation.Only produce the heating furnace of air-flow by use, and pass through continuous sweep and heat treatment connecting line in stove, the crystal orientation of all right control connection line near surface at predetermined portions.
If connecting line is formed as the connecting line material of key component by comprising Au, can relatively easily obtain according to structure of the present invention.Preferably, the oxidation when considering the operability of producing in the connecting line step and forming ball needs connecting line to comprise Au as key component; Comprise total concentration C 3Be that one or more of 0.0005 to 0.02 quality % are selected from the element of Be, Ca, La, In, Gd, Nd, Ce, Dy, Tb and Y; Perhaps comprise total concentration C 4Be that one or more of 0.003 to 0.1 quality % are selected from the element of Ag, Sn, Pd, Pt and Cu.More preferably, if above-mentioned total concentration C 3Be 0.005 to 0.015 quality %,, and be convenient to production control easier formation connecting line structure of the present invention.
Embodiment
Example I
To connecting line of the present invention (1) to (14), (20) and (22) and production method (22) thereof be described to (24) by the mode of embodiment below.
By using golden purity to be not less than the electrolysis gold of about 99.995 quality % and adding essential element, fusing and casting have the billon of table 1 to the chemical constituent shown in 5 in melting furnace, calendering gained ingot casting, The pre-heat treatment, the stretching of use drawing die in heating furnace, and come continuous sweep and heat connecting line by after-baking, thereby produce connecting line of the present invention.Select final connecting line diameter to be not more than 20 microns substantially.
To specifically describe production stage now.At first, the preparation diameter is 6 to 30 millimeters a ingot casting.In the calendering step, use thin roll to roll ingot casting with 30 to 200m/min speed, be 0.5 to 1.5 millimeter until the connecting line diameter.In the The pre-heat treatment step, described connecting line was maintained in 250 to 800 ℃ the stove 0.1 to 2 hours, open-air cooling outside placing stove then.In stretching step, the stretching device and the use that are provided with a plurality of drawing dies by use are coated with adamantine drawing die, under 20 to 35 ℃ stretched container temperature, and 80 to 400m/sec speed stretching connecting line.The inwall of drawing die cleans with ultrasonic before use.It is two kinds that the section of used drawing die reduces score, and promptly 5 to 8% low section reduces than reducing ratio with 12 to 15% maximum section of passenger flow.The quantity that maximum section of passenger flow reduces than drawing die accounts for 35 to 80% of all drawing dies.In the after-baking step, use infrared heating furnace with 20 centimetres of even thermals treatment zone.Send connecting line continuously, and its stove by 250 to 700 ℃ is heat-treated, rate travel is 50 to 800m/min, and scanning tension force is in 2 to 60mN scope, so that the percentage elongation of connecting line is 3 to 5% in the tensile test.Table 3 has been set forth the concrete production method of the embodiment shown in the table 2.
In order to connect connecting line, use automatic connection cord jockey commonly used to carry out sphere/wedge bond.In ball bond, form ball by arc discharge at the connecting line end, and by thermo-compressed, and use ultrasonic wave that described ball is connected on the electrode film.In addition, the other end of connecting line by wedge bond to lead frame, the perhaps lead portion of BGA substrate.Keep 50 microns electrode spacing, carry out thin space and connect, with the applicability of checking connecting line of the present invention that the thin space that will need future is connected.
The appropriate section that is used to connect connecting line is the electrode film on the silicon substrate, promptly the about 0.8 micron Al alloy firm of thickness (Al-1%Si, Al-0.5%Cu, Al-1%Si-0.5%Cu) or Cu wiring (0.01 micron/Ni0.4 of Au micron/Cu0.4 micron).Use the surface to be coated with the lead frame of Ag (thickness: 1 to 4 micron), perhaps the surface is coated with the glass epoxide substrate of Au/Ni/Cu connecting line as the appropriate section that connects wedge bond.
By the intensity and the modulus of elasticity of tension test measurement connecting line, they are representative mechanical characteristics of connecting line.The length of sample is 10 millimeters, and sample number is 5, and calculates mean value.
As for the structure of connecting line, the connecting line that etching is vertically cut open, and use SEM to check the quantity of crystal grain.In addition, by the EBSP method, measure the crystal orientation of the sample area of cutting open in the same manner.Draw the shared area ratio of crystal grain of [111] direction on the whole connecting line cross section or [100] orientation.To be that the connecting line central authorities of R partly are decided to be middle body to R/2 from radius, and the part from the connecting line surface to the R/3 depths will be decided to be surface layer part.In the case, obtain on the connecting line longitudinal cross-section area ratio of [111] orientation crystal grain in middle body and the surface layer part.
The linearity of the line of apsides that connects in order to estimate is used projecting apparatus (projector) to observe 100 from top to bottom and is kept the connecting line that 6 millimeters spacings (span) connect.Measure on the connecting line and depart from the deviation of the best part as amount of bow with respect to the line that connects spherical contact and wedge contact.Be be evaluated as favourablely less than the average amount of bow of connecting line diameter, and represent with ◎; The average amount of bow that is not less than two connecting line diameters is be evaluated as defective, and represents with △; And marginal average amount of bow is be evaluated as and can not causes problem, and represents with zero.
As for the nemaline stability of Connection Step hogging (line of apsides controllability), every connecting line is measured the height of the line of apsides at three positions, and estimate the standard deviation of line of apsides height.Sample size is 50, and uses light microscope to measure.Three measuring points comprise: the connecting line length mid point that part, line of apsides summit and highly being easy to disperse directly over the spherical contact.When the standard deviation of line of apsides height is not less than a half of connecting line diameter, it is very big to be evaluated as decentralization.When the half of standard deviation less than the connecting line diameter, it is little and be favourable to be evaluated as decentralization.Based on described evaluation, when the dispersion at three positions all hour, it is stable estimating line of apsides shape, and represents with ◎.Disperse when big as a position, estimate the line of apsides and be shaped as better, and represent with zero.Disperse when big as two positions, line of apsides shape represents with △, and when being dispersed in three positions when all big, the usefulness * expression of line of apsides shape.In the two kinds of line of apsides shapes connecting line is estimated: span is 4 millimeters the line of apsides (shape 1 is used among the BGA etc. more and more) and the span line of apsides that is 6 microns (shape 2, difficult under such span obtain stable line of apsides shape).
In thin space connects, trend towards in same chip, connecting the line of apsides of differing heights, this keeps linearity and suppresses the problem that line of apsides shape is disperseed with regard to being accompanied by.In order more strictly to estimate the stability of line of apsides shape, estimate high and the low line of apsides.Connect the low line of apsides and 50 maximum heights that 50 maximum heights are not higher than 100 microns and be not less than 300 microns high lines of apsides.Measure described two classes and have the linearity of the line of apsides of differing heights.When average amount of bow during less than the connecting line diameter, it is favourable estimating these two kinds of lines of apsides, and represents with ◎.When the average amount of bow of having only a kind of line of apsides is not less than the connecting line diameter, can cause problem usually, and represent with zero.When the average amount of bow of two kinds of lines of apsides all is not less than the connecting line diameter, must be improved, and be represented this line of apsides with △.When a kind of average amount of bow of the line of apsides was not less than the diameter of two connecting lines, the line of apsides was defective, and with * expression.
In order to estimate two kinds of stability (line of apsides controllability), on two positions that comprise line of apsides summit and connecting line length mid point, measure the height of the line of apsides with line of apsides of differing heights at line of apsides vpg connection.When the standard deviation of line of apsides height is not less than a half of connecting line diameter, described line of apsides shape is be evaluated as serious dispersion.On four positions, promptly in the standard deviation of the line of apsides height of measuring on two positions of every kind in the line of apsides of two kinds of differing heights, when equal hour of the decentralization of the height at four positions, it was stable estimating described line of apsides shape, and represents with ◎; When the decentralization of the height at a position is big, estimates the described line of apsides and be shaped as better, and represent with zero; And when the decentralization of the height at two or more positions was big, described line of apsides shape was represented with △.
In order to estimate wedge bond, connecting line is connected the resin substrates that the surface is coated with the Au/Ni/Cu connecting line.The sample stage of assembling sample is maintained under the temperature that is low to moderate 175 ℃, and wedge bond becomes more challenging under this temperature.Use the reference of the chip of 10 200-pins, and connect 2000 connecting lines altogether as evaluation.Use light microscope to observe, if the once interruption of the continuous attended operation that causes by the wedge bond defective, perhaps in two or more local defectives of for example peeling off found, judge that then this is because underproof wedge bond is caused, and represent this wedge bond with △.No problem and when not having defective, wedge bond is evaluated as well, and represents with ◎ when continuous connection.If connection is finished smoothly continuously, but observes when peeling off in a place, this situation can not cause problem between above-mentioned two kinds of situations, and wedge bond is represented with zero in this.
After under the wedge bond condition, being connected on the resin substrates connecting line, check the generation of connecting line fold defect.Described connecting line is because plastic deformation and partially folded phenomenon is different from the connecting line bending defect of common connecting line bulk deformation.Keeping under 3 millimeters the span, connect 2000 connecting lines.When the quantity of fold defect was 0, the evaluation connecting line was folded into very good, and represented with ◎.When the quantity of fold defect was 2, it was in fact no problem to be evaluated as, and connecting line is folding represents with zero.When the quantity of fold defect is in 2 to 4 scope, need some improvement, so connecting line is folding represents with △.
As for the tilt problem that occurs recent years, it refers near the phenomenon of the connecting line upstanding portion lodging of spherical contact, from observing the connecting line upstanding portion, and estimate the maximum spacing that the connecting line upstanding portion departs from the vertical line that passes spherical contact central authorities with respect to the horizontal direction of chip.Connecting line length is 4 millimeters, and sample size is 30.When described spacing during less than the connecting line diameter, it is suitable that this inclination is be evaluated as.When described spacing during greater than the connecting line diameter, because upstanding portion tilts, this inclination is be evaluated as defective.Occurrence frequency according to inclination defect is estimated: defective occurs in three or more places and represent with △; There is not the local defective that takes place to represent with ◎; The usefulness zero of the generation of defective between above-mentioned two kinds of situations is represented.
As for the sliding properties of connecting line, also there is not consistent evaluation method in the present technique field.Among the present invention, connecting line is moved in capillary with predetermined speed and predetermined angle, measure the tractive effort of this moment, and survey the surface appearance of connecting line by SEM observation post.If tractive effort is little, and also do not find scar on the connecting line surface, estimating sliding properties be well, and represents with ◎.If tractive effort is big or find scar on the connecting line surface, even if slight scar is represented sliding properties with zero.
As for measurement, use water-tight equipment to be assembled with the lead frame of semiconductor element (being connected with connecting line on it), and keep about 4 millimeters span with epoxy sealing in the connecting line bending (resin distortion) when resin-sealed.Then, use soft * ray nondestructive detecting apparatus to come the inside of transmission with resin-sealed semiconductor element, and, and the value (percentage) that its mean value obtains divided by the length of span of connecting line is defined as connecting line bending after the sealing to the amount of bow of the crooked largest portions of 30 sample in measurement connecting lines.
As for the decentralization of sealing back connecting line bending, when standard deviation the connecting line bending of finding as mentioned above 0.8% in the time, estimate described connecting line and be bent into stablely, and represent with ◎; When standard deviation is in 0.8 to 2% scope, estimates the connecting line bending and have virtually no problem, and represent with zero; And when standard deviation is not less than 2%, estimates the connecting line bending and in fact can cause problem, and represent with △.
The condition of productive rate when producing connecting line as for evaluation, when the connecting line diameter is stretched to 18 microns, if every kilogram of ingot casting connecting line breaks are less than 0.5, and the standard deviation of 30 sample breakage intensity is reduced to less than 4.9mN, then can keep good productivity ratio, and the productive rate of this moment is represented with ◎.When the connecting line breaks, when perhaps the decentralization of fracture strength did not satisfy above-mentioned condition, productive rate was represented with zero.And when every kilogram of ingot casting connecting line breaks is more than 0.5 time, and the standard deviation of 30 sample breakage intensity is when being not less than 4.9mN, productive rate represents that with △ the productivity ratio of this moment must further be improved.
Table 1 has been set forth the relation between connecting line structure and the connecting line serviceability.Table 2 and 3 has been set forth the relation between each component, production method and the connecting line structure of adding in the connecting line that mainly comprises Au.To provide the evaluation result of connecting line of the present invention form, provide with the form of comparing embodiment and depart from evaluation result that the present invention constitutes with embodiment.
In table 1, embodiment 1 to 15 relates to the connecting line of the present invention (1); Embodiment 1 to 6,9,10 and 12 to 15 relates to the connecting line of the present invention (2); Embodiment 1 to 8 and 12 to 15 relates to the connecting line of the present invention (3); Embodiment 3 to 6,8,9,11,12 and 15 relates to the connecting line of the present invention (10); And embodiment 1 to 12 relates to the connecting line of the present invention (21).Comparing embodiment in the table 1 is the embodiment that does not meet the present invention's (1) connecting line structure formation.
Table 2 and 3 has been set forth each component, production method and the connecting line structure of adding in the connecting line that mainly comprises Au.Embodiment 16 to 31 adopts the production method that satisfies any method of describing in the present invention (22) to (24) and the connecting line of producing, and described connecting line meets the present invention's (1) connecting line structure formation.Wherein, embodiment 16 to 27 has the Au alloy connecting line that the present invention's (14) component constitutes, and embodiment 28 to 31 is that the component of discontented unabridged version invention (14) constitutes but the connecting line that adopts production method of the present invention to make.On the other hand, the connecting line in the comparing embodiment (5) to (9) had not both adopted the production method of describing among the present invention (22) to (24), and the structure that does not also have connecting line of the present invention (1) constitutes.
In table 4 and 5, embodiment 32 to 34 is connecting lines of the present invention (4); Embodiment 34 and 35 is connecting lines of the present invention (5); Embodiment 35 to 37 is connecting lines of the present invention (6); Embodiment 36 and 37 relates to the connecting line of the present invention (7); And embodiment 32,24,26 and 37 relates to the connecting line of the present invention (13).
In table 6 and 7, embodiment 42 to 49 relates to the connecting line of the present invention (8); Embodiment 43 to 49 relates to the connecting line of the present invention (9); And embodiment 42 and 44 to 49 relates to the connecting line of the present invention (11).
Table 1
The crystal orientation ratio The every square of brilliant material of little material number Connecting line Electrode material Hot strength (MPa) Modulus of elasticity (GPa) Linearity (6mm is long) Line of apsides controllability Tilt Connecting line bending (%) Slide
Whole connecting line Superficial layer The differential ratio (absolute value) of flat [111]/[100] the area ratio in central and whole cross section Material Diameter (μ m) Shape 1 (4mm is long) Shape 2 (6mm is long)
Area is than [111]/[100] [111] ratio (%) Area is than [111]/[100]
Embodiment 1 ????1.2 ????53 ????1.4 ????0.20 ??0.05 ?Au ??25 ?Al-Si ??320 ??90 ??◎ ??◎ ??◎ ??◎ ????3.8 ????○
2 ????1.4 ????55 ????1.3 ????0.15 ??0.08 ?Au ??20 ?″ ??326 ??90 ??◎ ??◎ ??◎ ??◎ ????3.4 ????○
3 ????2.0 ????55 ????2.1 ????0.10 ??0.1 ?Au ??18 ?Al-Si-Cu ??330 ??91 ??◎ ??◎ ??◎ ??◎ ????3.3 ????◎
4 ????2.4 ????68 ????2.7 ????0.10 ??0.1 Au alloy 4 ??20 ?Al-Cu ??342 ??92 ??◎ ??◎ ??◎ ??◎ ????2.5 ????◎
5 ????5.2 ????80 ????5.5 ????0.08 ??0.2 Au alloy 5 ??20 ?″ ??372 ??95 ??◎ ??◎ ??◎ ??◎ ????2.4 ????◎
6 ????10.0 ????85 ????10.2 ????0.05 ??1 Au alloy 4 ??20 ?Al-Si-Cu ??378 ??102 ??◎ ??◎ ??◎ ??◎ ????2.2 ????◎
7 ????1.4 ????47 ????1.5 ????0.10 ??0.5 Au alloy 6 ??20 ?Cu ??311 ??91 ??○ ??◎ ??○ ??◎ ????3.6 ????○
8 ????2.1 ????40 ????2.2 ????0.15 ??0.1 ?Au ??20 ?Al-Cu ??317 ??92 ??○ ??◎ ??○ ??◎ ????3.2 ????◎
9 ????1.5 ????55 ????2 ????0.35 ??1 Au alloy 1 ??20 ?″ ??321 ??92 ??◎ ??○ ??◎ ??○ ????3.7 ????◎
10 ????1.8 ????60 ????1.5 ????0.35 ??3 Au alloy 2 ??20 ?Al-Si ??352 ??93 ??◎ ??◎ ??◎ ??○ ????3.2 ????○
11 ????2.0 ????48 ????2.4 ????0.36 ??0.1 Au alloy 3 ??20 ?″ ??341 ??96 ??○ ??◎ ??○ ??○ ????3.0 ????◎
12 ????1.5 ????47 ????1.2 ????0.34 ??0.1 ?Au ??20 ?Al-Si ??332 ??92 ??○ ??◎ ??○ ??○ ????3.7 ????○
13 ????1.8 ????60 ????2 ????0.20 ??0.02 Au alloy 1 ??20 ?″ ??343 ??92 ??◎ ??◎ ??○ ??◎ ????3.2 ????◎
14 ????1.5 ????55 ????1.4 ????0.10 ??0.02 ?Au ??20 ?Cu ??327 ??92 ??◎ ??◎ ??○ ??◎ ????3.5 ????○
15 ????3.5 ????65 ????3.8 ????0.15 ??5 Au alloy 2 ??20 ?Al-Si-Cu ??354 ??96 ??◎ ??◎ ??○ ??◎ ????2.7 ????◎
Comparing embodiment 1 ????1.1 ????40 ????1.2 ????0.15 ??0.05 ?Au ??20 ?Al-Si ??253 ??73 ??△ ??△ ??× ??△ ????5.4 ????○
2 ????1.1 ????52 ????1.3 ????0.10 ??0.08 ?Au ??20 ?″ ??272 ??78 ??△ ??△ ??× ??△ ????5.1 ????○
3 ????1.0 ????30 ????1.1 ????0.10 ??0.1 ?Au ??20 ?Al-Si-Cu ??256 ??76 ??△ ??△ ??× ??△ ????5.7 ????○
4 ????0.9 ????40 ????0.8 ????0.15 ??0.05 ?Au ??20 ?Al-Cu ??235 ??72 ??△ ??△ ??× ??△ ????6.3 ????○
Table 2
Connecting line component (quality %)
??????????????????????????C1 Total amount 1 ?????????????????????????C2 Total amount 2 Total amount 1/ total amount 2 ??Au Title material
??Y ??Ca ??Yb ??Eu ??La ???Tb ??Dy ??Nd
Embodiment ??16 ??0.001 ??0.001 ??0.002 ??0.001 ??0.001 ??0.002 ??1.0 Residue
??17 ??0.002 ??0.001 ??0.003 ???0.002 ??0.002 ??0.004 ??0.8 Residue
??18 ??0.001 ??0.002 ??0.003 ??0.002 ??0.002 ??0.002 ??0.006 ??0.5 Residue Au alloy 1
??19 ??0.003 ??0.004 ??0.003 ??0.01 ???0.005 ??0.005 ??0.010 ??1.0 Residue Au alloy 2
??20 ??0.005 ??0.005 ??0.01 ??0.002 ??0.002 ??0.004 ??2.5 Residue
??21 ??0.005 ??0.01 ??0.015 ???0.01 ??0.01 ??0.020 ??0.8 Residue
??22 ??0.005 ??0.01 ??0.015 ??0.01 ??0.01 ??0.020 ??0.8 Residue
??23 ??0.005 ??0.01 ??0.015 ???0.01 ??0.01 ??0.020 ??0.8 Residue Au alloy 3
??24 ??0.005 ??0.01 ??0.015 ??0.01 ??0.01 ??0.020 ??0.8 Residue
??25 ??0.005 ??0.005 ??0.005 ??0.005 ??0.02 ??0.01 ???0.005 ??0.005 ??0.005 ??0.025 ??0.8 Residue Au alloy 4
??26 ??0.001 ??0.001 ??0.001 ??0.003 ??0.01 ??0.001 ??0.020 ??0.2 Residue Au alloy 5
??27 ??0.01 ??0.006 ??0.01 ??0.026 ??0.001 ???0.001 ??0.001 ??0.003 ??8.7 Residue Au alloy 6
??28 ??0.0005 ??0.0005 ??0.001 ??0.001 ??0.001 ??0.001 ??0.003 ??0.3 Residue
??29 ??0.001 ??0.001 ??0.001 ??0.003 ???0.0005 ??0.0005 ??0.001 ??3.0 Residue
??30 ??0.0005 ??0.001 ??0.0015 ??0.008 ???0.001 ??0.01 ??0.028 ??0.05 Residue
??31 ??0.08 ??0.1 ??0.08 ??0.26 ??0.008 ??0.008 ??0.006 ??0.022 ??11.8 Residue
Comparing embodiment ??5 ??0.0005 ??0.0005 ??0.001 ??0.0005 ???0.0005 ??0.0005 ??0.0015 ??0.7 Residue
??6 ??0.005 ??0.01 ??0.015 ???0.01 ??0.01 ??0.020 ??0.8 Residue
??7 ??0.05 ??0.01 ??0.015 ??0.01 ??0.01 ??0.020 ??0.8 Residue
??8 ??0.005 ??0.01 ??0.015 ???0.01 ??0.01 ??0.020 ??0.8 Residue
??9 ??0.005 ??0.01 ??0.015 ??0.01 ??0.01 ??0.020 ??0.8 Residue
Table 3
Production method The crystal orientation ratio The differential ratio (absolute value) of average [111]/[100] the area ratio in central and whole cross section Every square micron number of die
Calendering degree (%) The ratio (%) of the relative fusing point of The pre-heat treatment temperature Level of stretch (%) Rate of extension (m/min) The stretched container temperature (℃) Height reduces the ratio (%) of drawing die The ratio of after-baking temperature and recrystallization temperature (%) Whole connecting line Superficial layer
Area is than [111]/[100] [111] ratio (%) Area is than [111]/[100]
Embodiment ??16 ??98 ????35 ????99.5 ??200 ????25 ????40 ????45 ????1.2 ????52 ????1.4 ????0.10 ??0.05
??17 ??99 ????50 ????99.5 ??200 ????25 ????40 ????45 ????1.5 ????55 ????1.6 ????0.15 ??0.1
??18 ??99.9 ????40 ????99.5 ??100 ????25 ????60 ????35 ????1.5 ????55 ????2 ????0.35 ??1
??19 ??99 ????40 ????99.5 ??200 ????25 ????40 ????45 ????1.8 ????55 ????1.8 ????0.35 ??3
??20 ??98 ????70 ????99.5 ??300 ????25 ????40 ????75 ????1.5 ????55 ????1.4 ????0.05 ??0.9
??21 ??98 ????50 ????99.5 ??500 ????8 ????34 ????45 ????4.0 ????70 ????4.5 ????0.20 ??0.5
??22 ??98 ????50 ????100 ??300 ????20 ????40 ????70 ????1.4 ????55 ????1.5 ????0.15 ??0.02
??23 ??98 ????40 ????99.8 ??200 ????30 ????50 ????38 ????1.9 ????48 ????2.4 ????0.36 ??0.1
??24 ??98 ????35 ????99.9 ??200 ????43 ????40 ????75 ????1.5 ????62 ????1.7 ????0.20 ??3
??25 ??99 ????60 ????99.5 ??100 ????25 ????40 ????45 ????2.5 ????68 ????2.7 ????0.10 ??0.1
??26 ??99.5 ????50 ????99.95 ??400 ????25 ????40 ????35 ????5.2 ????80 ????5.5 ????0.08 ??0.2
??27 ??98 ????55 ????99.5 ??300 ????20 ????40 ????48 ????1.4 ????47 ????1.5 ????0.10 ??0.5
??28 ??98 ????40 ????99 ??70 ????25 ????5 ????35 ????1.8 ????60 ????1.7 ????0.15 ??0.7
??29 ??98 ????50 ????99.5 ??600 ????23 ????40 ????50 ????2.5 ????55 ????2.7 ????0.15 ??5
??30 ??98 ????60 ????99.5 ??200 ????25 ????10 ????45 ????1.5 ????55 ????1.8 ????0.34 ??0.1
??31 ??98 ????55 ????99.5 ??200 ????25 ????10 ????60 ????1.4 ????55 ????1.2 ????0.20 ??0.05
Comparing embodiment ??5 ??80 ????- ????97 ??100 ????25 ????20 ????70 ????1.1 ????40 ????1.2 ????0.05 ??0.05
??6 ??99 ????10 ????97 ??40 ????25 ????20 ????52 ????1.1 ????32 ????1.4 ????0.35 ??2
??7 ??98 ????50 ????99 ??1200 ????2 ????10 ????60 ????1.0 ????38 ????1.1 ????0.15 ??0.03
??8 ??98 ????90 ????90 ??300 ????25 ????15 ????83 ????0.9 ????40 ????0.8 ????0.20 ??0.05
??9 ??98 ????50 ????99.5 ??200 ????25 ????10 ????85 ????0.9 ????45 ????1 ????0.20 ??0.05
Table 4
The crystal orientation ratio Every square micron number of die Connecting line
Whole connecting line Superficial layer The differential ratio (absolute value) of average [111]/[100] the area ratio in central and whole cross section The layer A that ratio [111]/[100] are different [111] ratio among the layer A [100] ratio among the layer A Material Connecting line diameter (μ m)
Area is than [1001]/[100] [111] ratio (%) Area is than [111]/[100] Ratio [111]/[100] The ratio of layer wide and radius
Example is executed reality ??32 ????1.2 ????45 ????1.4 ????0.20 ????1.68 ????0.3 ??42％ ??25％ ??0.1 ??Au ????18
??33 ????1.4 ????42 ????1.3 ????0.15 ????1.97 ????0.2 ??63％ ??32％ ??0.2 Au alloy 2 ????18
??34 ????2.0 ????60 ????2.1 ????0.10 ????8.00 ????0.3 ??80％ ??10％ ??0.1 Au alloy 3 ????15
??35 ????1.3 ????40 ????2.7 ????0.10 ????0.86 ????0.3 ??30％ ??35％ ??0.2 ??Au ????20
??36 ????1.4 ????50 ????5.5 ????0.08 ????0.48 ????0.2 ??25％ ??52％ ??0.2 Au alloy 2 ????18
??37 ????1.4 ????52 ????10.2 ????0.05 ????0.29 ????0.2 ??20％ ??70％ ??0.3 Au alloy 4 ????15
??38 ????1.3 ????38 ????1.2 ????0.34 ????1.33 ????0.15 ??40％ ??30％ ??0.1 ??Au ????18
??39 ????1.4 ????50 ????2 ????0.20 ????0.95 ????0.2 ??38％ ??40％ ??0.2 Au alloy 1 ????18
??40 ????1.3 ????55 ????1.4 ????0.10 ????3.75 ????0.05 ??75％ ??20％ ??0.3 Au alloy 1 ????18
??41 ????1.4 ????48 ????3.8 ????0.15 ????0.75 ????0.05 ??30％ ??40％ ??0.5 ??Au ????18
Table 5
Electrode material Hot strength (MPa) Modulus of elasticity (GPa) Linearity (millimeters long) Line of apsides controllability The evaluation of the high and low line of apsides (line of apsides height 100,300 μ m) Tilt Connecting line bending (%) Slide
Shape 1 (4mm is long) Shape 2 (6mm is long) Linearity Line of apsides controllability
Embodiment ??32 ??Al-Si ????320 ????95 ????◎ ????◎ ????◎ ????○ ????△ ??◎ ??2.8 ??○
??33 ??″ ????326 ????95 ????◎ ????◎ ????◎ ????◎ ????△ ??◎ ??3.3 ??○
??34 ??Al-Si-Cu ????330 ????105 ????◎ ????◎ ????◎ ????◎ ????△ ??◎ ??2.5 ??○
??35 ??Al-Si ????342 ????92 ????◎ ????◎ ????◎ ????△ ????○ ??◎ ??3.7 ??○
??36 ??″ ????320 ????95 ????◎ ????◎ ????◎ ????△ ????◎ ??◎ ??2.8 ??○
??37 ??Al-Si-Cu ????378 ????102 ????◎ ????◎ ????◎ ????△ ????◎ ??◎ ??2.8 ??○
??38 ??Al-Si ????332 ????92 ????◎ ????◎ ????◎ ????△ ????△ ??◎ ??3.7 ??○
??39 ??″ ????343 ????92 ????◎ ????◎ ????◎ ????△ ????△ ??◎ ??3.4 ??○
??40 ??Cu ????327 ????92 ????◎ ????◎ ????◎ ????△ ????△ ??◎ ??3.5 ??○
??41 ??Al-Si-Cu ????354 ????96 ????◎ ????◎ ????◎ ????△ ????△ ??◎ ??3.6 ??○
Table 6
[111] total area ratio and on [100] direction The crystal orientation ratio Every square micron number of die
Whole connecting line Superficial layer The differential ratio (absolute value) of average [111]/[100] the area ratio in central and whole cross section The layer A that ratio [111]/[100] are different The ratio of [111] among the layer A The ratio of [100] among the layer A
Pm on the whole connecting line Centre Pc (R/2) Surface Ps (R/3) Area is than [111]/[100] [111] ratio (%) Area is than [111]/[100] Ratio [111]/[100] The ratio of layer wide and radius
Embodiment ??42 ??52％ ??53％ ??52％ ??1.5 ????48 ??2 ????0.15 ????- ????- ????- ????- ????0.1
??43 ??52％ ??65％ ??47％ ??1.8 ????45 ??1.8 ????0.15 ????2.17 ????0.13 ????65％ ????30％ ????0.1
??44 ??62％ ??63％ ??62％ ??1.2 ????52 ??1.4 ????0.20 ????1.68 ????0.15 ????42％ ????25％ ????0.05
??45 ??67％ ??72％ ??67％ ??1.4 ????55 ??1.3 ????0.15 ????2.03 ????0.22 ????65％ ????32％ ????0.08
??46 ??71％ ??85％ ??65％ ??1.8 ????68 ??5.5 ????0.08 ????0.48 ????0.2 ????25％ ????52％ ????1
??47 ??73％ ??64％ ??74％ ??2.4 ????62 ??2.7 ????0.10 ????- ????- ????- ????- ????0.1
??48 ??81％ ??68％ ??85％ ??4.8 ????57 ??4.8 ????0.10 ????- ????- ????- ????- ????0.2
??49 ??91％ ??95％ ??90％ ??5.2 ????80 ??5.5 ????0.08 ????- ????- ????- ????- ????0.2
??50 ??44％ ??45％ ??43％ ??2.1 ????40 ??2.2 ????0.15 ????1.68 ????0.13 ????42％ ????25％ ????0.1
??51 ??46％ ??62％ ??40％ ??2.1 ????40 ??2.2 ????0.15 ????- ????- ????- ????- ????0.1
Table 7
Electrode material Hot strength (MPa) Modulus of elasticity (GPa) Linearity (6 millimeters long) Line of apsides controllability Wedge bond Connecting line is folding Tilt Connecting line bending (%) The decentralization of connecting line bending Slide Connecting line is produced productive rate
Material Connecting line diameter (μ m) Shape 1 (4mm is long) Shape 1 (6mm is long)
Embodiment ??42 ??Au ????18 ?Al-Cu ????317 ????92 ????○ ????◎ ????○ ????◎ ????◎ ????◎ ????3.2 ????◎ ??○ ??○
??43 ??Au ????18 ?Al-Cu ????317 ????92 ????○ ????◎ ????○ ????◎ ????◎ ????◎ ????3.2 ????○ ??◎ ??◎
??44 Au alloy 2 ????20 ?Al-Si ????320 ????90 ????○ ????◎ ????◎ ????◎ ????◎ ????◎ ????3.8 ????◎ ??◎ ??◎
??45 Au alloy 3 ????18 ?″ ????326 ????90 ????◎ ????◎ ????◎ ????◎ ????◎ ????◎ ????3.4 ????◎ ??◎ ??◎
??46 Au alloy 1 ????18 ?″ ????321 ????92 ????◎ ????○ ????◎ ????◎ ????◎ ????○ ????3.7 ????◎ ??○ ??◎
??47 Au alloy 4 ????18 ?Al-Cu ????342 ????92 ????◎ ????◎ ????◎ ????◎ ????◎ ????◎ ????2.5 ????◎ ??○ ??◎
??48 Au alloy 5 ????18 ?″ ????358 ????93 ????◎ ????◎ ????◎ ????◎ ????◎ ????◎ ????2.4 ????◎ ??○ ??◎
??49 Au alloy 5 ????15 ?″ ????370 ????95 ????◎ ????◎ ????◎ ????◎ ????◎ ????◎ ????2.7 ????◎ ??○ ??◎
??50 ??Au ????20 ?Al-Cu ????317 ????92 ????○ ????◎ ????○ ????○ ????○ ????◎ ????3.2 ????○ ??◎ ??○
??51 ??Au ????18 ?Al-Cu???? ????317 ????92 ????○ ????◎ ????○ ????○ ????○ ????◎ ????3.2 ????○ ??○ ??◎
The connecting line of the present invention of embodiment 1 to 15 has and is not less than 1.2 area than [111]/[100], and it is characterized in that high strength and be not less than the high elastic modulus of 300MPa and 90MPa, and is reduced to the connecting line bending less than 4.0%.Wherein, in embodiment 2 and 3, area is than in 1.4 to 2.5 scope; The connecting line bending is reduced to less than 3.5%.In embodiment 4 to 6, the area ratio is not less than 2.5; The connecting line bending is improved to less than 2.5%.On the other hand, in comparing embodiment 1 to 4, connecting line has less than 1.2 area than [111]/[100], shows 270MPa or littler intensity, and the modulus of elasticity that is lower than 80MPa.Connecting line bending as a result is up to 5% or higher.
Embodiment 1 to 6,9 and 10 connecting line satisfy the present invention's (2) 55% [111] the direction chip area ratio of being not less than, and show high strength, high modulus of elasticity, and the linearity of the line of apsides shape of improving and the low temperature wedge bond of improvement.The embodiment 7,8,11,12 of the present invention's (2) structure formation can not be never satisfied in described improvement, perhaps obtains in the comparing embodiment 1 to 4.
The corresponding connecting line with the present invention (3) of embodiment 1 to 8 and 13 to 15 connecting line, [111] of its centre/[100] area than average [111]/[100] area on Rc and the whole cross section than the differential ratio absolute value between the Ra | 1-Rc/Ra| * 100 (%) less than 30%, and the ratio R a that has on the whole cross section of connecting line of this structure is not less than 1.2.As for switching performance, confirmed that such structure can suppress the inclination of the upstanding portion on the spherical contact.The embodiment 9 to 12 of the present invention's (3) structure formation can not be never satisfied in above-mentioned improvement, perhaps obtains in the comparing embodiment 1 to 4.
Embodiment 3 to 6,8,9,11 and 12 connecting line are corresponding to the connecting line of the present invention (4), and the area in its superficial layer is not less than 1.6 than [111]/[100], and the area in the whole cross section of connecting line is not less than 1.2 than [111]/[100].Thereby aspect switching performance, improved sliding properties; Made things convenient for the control of the line of apsides; Reduced obstruction capillaceous; And reduced the scar on connecting line surface.The embodiment 1,2,7,10 and 12 of the present invention's (4) structure formation can not be never satisfied in above-mentioned improvement, perhaps obtains in the comparing embodiment 1 to 4.
As for the controllability of the line of apsides, when span was 4 millimeters, the connecting line of the embodiment of the invention 1 to 26 formed the stable line of apsides, yet had very big decentralization in comparing embodiment 1 to 4 hogging wire shaped.When span is 6 millimeters, be among the embodiment 1 to 12 of 0.04 to 4 of every square micron in crystal grain quantity, obtain stable line of apsides shape, and obtain excellent line of apsides controllability.
To the influence of structure, consult the table 2 that relates to Au alloy connecting line as for each component and production method, satisfy the working condition of the present invention (22) to (24) in one of any, and in required structure, realized being not less than 1.2 area than [111]/[100].If relatively, have the embodiment 28 to 31 that the component of embodiment 16 to 27 that the component of according to the present invention (14) constitutes and discontented unabridged version invention (14) constitutes and have difference aspect structure and the serviceability.In the embodiment 4 to 7 of the serviceability of the connecting line that constitutes corresponding to component, suppressing to realize excellent improvement aspect the inclination with embodiment 25 to 27.But described this improvement can not the displaying from table 1 has among the embodiment 9 to 11 of serviceability of the connecting line that the composition of embodiment 18,19 and 23 constitutes and obtains.Comparing embodiment 5 to 9 is situations of discontented unabridged version invention working condition, wherein area than [111]/[100] less than 1.2.
In the connecting line of embodiment 32 to 34, exist area to be not less than 1.6 layer, and described layer is directly upwards kept the width that is not less than R/10 at connecting line than [111]/[100].Therefore, compare with the embodiment 35 to 41 that does not satisfy above-mentioned condition, maximum line of apsides height is not more than the high line of apsides that 100 microns the low line of apsides and maximum line of apsides height be not less than 300 microns and shows good linearity.Wherein, in embodiment 33 and 34, [111] area ratio of described layer is not less than 60%, so linearity is further improved.
In the connecting line of embodiment 35 to 37, exist area than [111]/[100] less than 0.9 layer, and described layer connecting line directly upwards its width be not less than R/10, but less than R/3.Therefore, compare with 38 to 41 with the embodiment 32 to 34 that does not satisfy above-mentioned condition, maximum line of apsides height is not more than the high line of apsides that 100 microns the low line of apsides and maximum line of apsides height be not less than 300 microns and shows stable line of apsides shape.In embodiment 36 and 37, [100] area ratio of described layer is not less than 50%, and therefore, the stability of line of apsides shape is further improved.
As for the connecting line of embodiment 42 to 49, the total area ratio of setting the crystal grain of [111] orientation and [100] orientation according to the present invention is not less than 50%.Therefore, compare with 51 with the embodiment 50 that does not satisfy described condition, confirm that wedge bond improves, the connecting line fold defect reduces in addition.
In the connecting line of embodiment 43 to 49 and 51, set [111] orientation of the middle body from connecting line central authorities to R/2 and the total area ratio of the crystal grain that [100] are orientated according to the present invention and be not less than 60%.Thereby, compare with 50 with the embodiment 42 that does not satisfy described condition, confirm that connecting line productivity ratio improves when the connecting line diameter is stretched to 18 microns.
In the connecting line of embodiment 42 and 44 to 49, set [111] orientation of the surface region from the connecting line surface to R/3 and the total area ratio of the crystal grain that [100] are orientated according to the present invention and be not less than 50%.Thereby, compare with 51 with the embodiment 43,50 that does not satisfy described condition, confirm using when resin-sealed, suppressed the decentralization of connecting line bending.
In addition, in some samples, note the main crystal orientation beyond observing [111] orientation is orientated with [100], there is the crystal grain of a large amount of [112] orientations in confirmation in the connecting line of embodiment 42 and 44, and the crystal grain that in embodiment 43, has a large amount of [110] and [122] orientation, confirm thus when guaranteeing stability, may form 4 millimeters long spans and not be higher than the low line of apsides of 150 microns line of apsides height.
Embodiment 32 to 34 is the connecting lines of according to the present invention (10); Embodiment 35 to 37 is the connecting lines of according to the present invention (20); And embodiment 36 and 37 is the connecting lines of according to the present invention (21).Embodiment 38 and 40 satisfies the present invention (1), but the structure of the connecting line of discontented unabridged version invention (4) constitutes.The structure of the connecting line of embodiment 39 and 41 discontented unabridged version inventions (6) constitutes.
Confirmed to exist in the connecting line of embodiment 32,34,36 and 37 length to be not less than two or more crystal grain of 70% of connecting line diameter, its crystal orientation departs from connecting line and is not more than 15 ° in the inclination angle longitudinally.Compare with 38 to 42 with embodiment 33,35, the resin distortion is reduced to less than 3%.Fig. 2 has shown the EBSP measurement result on the gold bonding wire cross section among the embodiment 36, and has shown the grain mark the when inclination angle is not less than 15 °.Observe the crystal grain that two or more its crystal orientations are orientated at the connecting line middle body in connecting line is not more than 15 ° inclination angle on vertically.
In order to gain in strength, must to increase the addition of alloying element, but cause the increase of material resistance.Mainly comprise in the connecting line of Au at embodiment 1 to 19, be suppressed to being not more than 10%, realize greatly 300 to 400MPa intensity simultaneously with respect to pure gold resistance increase.On the other hand, in connecting line,, have to add other element with high concentration (＞1 quality %) in order to obtain to be not less than the high strength of 300MPa based on conventional component.But when adding the element of for example Cu, Pd or Pt with the amount that is not less than 1 quality %, with respect to proof gold, resistance increases more than 30% inevitably.
Example II
Describe connecting line of the present invention (15) to (21) below by the mode of embodiment, and their production method (25) is to (27).
By using golden purity to be not less than the electrolysis gold of about 99.995 quality %, fusing and casting comprise total concentration one or more in 0.0005 to 0.02 quality % scope and are selected from the billon of the element of Be, Ca, La, In, Gd, Nd, Ce, Dy, Tb and Y in melting furnace; Perhaps comprise total concentration one or more in 0.003 to 0.1 quality % scope and be selected from the billon of the element of Ag, Sn, Pb, Pt and Cu, roll the gained ingot casting then, in heating furnace The pre-heat treatment, use drawing die to stretch, and come continuous sweep and heat connecting line by after-baking, thereby produce connecting line.Selecting final connecting line diameter is 20 microns.
Table 8 and 9 has been listed the crystal orientation area ratio of described connecting line and the serviceability of described connecting line.
Table 10 has been listed working condition.In these embodiments, satisfy the working condition of the present invention's regulation, and in comparing embodiment, at least one working condition is positioned at outside the scope of the present invention's regulation.
Table 8
Crystal orientation is than ([111/[100] area is than R) Every square micron number of die Connecting line diameter (μ m) Electrode material Wedge bond
Relation (is boundary with radius/2) between Rc of central authorities and peripheral Rs Whole connecting line Relation (is boundary with radius/3) between Rc of central authorities and peripheral Rf Area is than Rt (R/5) in most of surface portions Metal framework On resin strip
|1-Rc/Rs| The Rc of central authorities Peripheral Rs [111]/[100] area compares Ra Core Rd area is than (R/3) |1-Rd/Rf| ??220℃ ??180℃ 160℃
Embodiment ??61 ??36％ ????0.84 ????1.32 ????1.20 ????0.74 ????40％ ????1.2 ????0.1 ????20 ??Al-Si ??◎ ??○ ??◎
??62 ??45％ ????0.66 ????1.20 ????1.07 ????0.56 ????47％ ????1.2 ????0.08 ????20 ??″ ??◎ ??◎ ??○
??63 ??62％ ????0.50 ????1.30 ????1.10 ????0.40 ????57％ ????1.3 ????0.03 ????20 ??Al-Si-Cu ??◎ ??◎ ??◎
??64 ??64％ ????0.40 ????1.10 ????0.93 ????0.30 ????57％ ????0.9 ????0.06 ????20 ??″ ??◎ ??◎ ??◎
??65 ??83％ ????0.25 ????1.50 ????1.19 ????0.15 ????57％ ????1.2 ????0.1 ????20 ??Al-Cu ??◎ ??◎ ??◎
??66 ??75％ ????0.40 ????1.60 ????1.30 ????0.35 ????80％ ????1.2 ????0.05 ????20 ??″ ??◎ ??◎ ??◎
??67 ??90％ ????0.30 ????3.00 ????2.33 ????0.20 ????92％ ????2.0 ????0.1 ????20 ??″ ??◎ ??◎ ??◎
??68 ??44％ ????0.85 ????1.52 ????1.35 ????0.80 ????25％ ????1.2 ????1 ????20 ??Al-Si-Cu ??◎ ??◎ ??○
??69 ??31％ ????0.90 ????1.30 ????1.20 ????0.85 ????20％ ????1.3 ????0.5 ????20 ??Cu ??◎ ??○ ??○
??70 ??75％ ????0.30 ????1.22 ????0.99 ????0.20 ????35％ ????1.2 ????1.5 ????20 ??Al-Si ??◎ ??◎ ??◎
??71 ??34％ ????0.67 ????1.02 ????0.93 ????0.57 ????34％ ????0.7 ????4.3 ????20 ??″ ??◎ ??○ ??○
??72 ??43％ ????0.70 ????1.22 ????1.09 ????0.60 ????40％ ????1.2 ????0.1 ????20 ??Al-Cu ??◎ ??◎ ??○
??73 ??31％ ????0.80 ????1.16 ????1.07 ????0.70 ????35％ ????1.2 ????1 ????20 ??″ ??◎ ??○ ??○
??74 ??37％ ????1.3 ????0.95 ????1.04 ????1.20 ????36％ ????1.1 ????0.1 ????20 ??Al-Si ??◎ ??○ ??○
??75 ??41％ ????1.2 ????0.85 ????0.94 ????1.10 ????42％ ????0.7 ????0.4 ????20 ??″ ??◎ ??◎ ??○
??76 ??75％ ????1.4 ????0.80 ????0.95 ????1.30 ????70％ ????0.5 ????4.2 ????20 ??Al-Si ??◎ ??◎ ??◎
Comparing embodiment ??11 ??18％ ????0.90 ????1.10 ????1.05 ????0.80 ????25％ ????1.1 ????0.1 ????20 ??Al-Si ??△ ??△ ??△
??12 ??27％ ????0.88 ????1.20 ????1.12 ????0.78 ????5％ ????1.3 ????0.2 ????20 ??″ ??△ ??△ ??△
??13 ??27％ ????1.10 ????1.50 ????1.40 ????1.00 ????30％ ????1.3 ????0.03 ????20 ??Al-Si-Cu ??△ ??△ ??△
??14 ??11％ ????0.80 ????0.90 ????0.88 ????0.70 ????15％ ????1.1 ????0.1 ????20 ??Al-Si ??△ ??△ ??△
??15 ??22％ ????1.10 ????0.90 ????0.95 ????1.00 ????25％ ????0.7 ????1 ????20 ??″ ??△ ??△ ??△
??16 ??15％ ????1.50 ????1.30 ????1.35 ????1.40 ????118％ ????1.2 ????2 ????20 ??Al-Cu ??△ ??△ ??△
Table 9
The sphere of bead (1.4 times of connecting line diameters) Connecting line bending when resin-sealed The linearity of the line of apsides (6 millimeters long) The high temperature soft heat Thermal cycling test Short span is peeled off Tilt Oppositely connect crooked Connecting line surface scars and polishing scratch The thin space capillary stops up Line of apsides shape stability (5 millimeters long)
200 microns of line of apsides height 350 microns of line of apsides height
Embodiment ????61 ??◎ ??◎ ??◎ ??◎ ??◎ ??◎ ????◎ ????○ ??◎ ????○ ??○ ????◎
????62 ??◎ ??◎ ??○ ??◎ ??◎ ??◎ ????◎ ????○ ??◎ ????○ ??○ ????◎
????63 ??◎ ??◎ ??○ ??◎ ??◎ ??◎ ????◎ ????○ ??◎ ????○ ??○ ????○
????64 ??◎ ??○ ??○ ??◎ ??◎ ??○ ????◎ ????○ ??◎ ????◎ ??◎ ????◎
????65 ??◎ ??◎ ??○ ??◎ ??◎ ??◎ ????◎ ????◎ ??◎ ????○ ??○ ????◎
????66 ??◎ ??◎ ??◎ ??◎ ??◎ ??◎ ????◎ ????◎ ??◎ ????○ ??○ ????◎
????67 ??◎ ??◎ ??◎ ??◎ ??◎ ??◎ ????◎ ????◎ ??◎ ????○ ??○ ????◎
????68 ??◎ ??◎ ??◎ ??○ ??○ ??○ ????◎ ????◎ ??○ ????○ ??○ ????◎
????69 ??◎ ??◎ ??◎ ??○ ??○ ??○ ????◎ ????○ ??○ ????○ ??○ ????◎
????70 ??◎ ??○ ??○ ??◎ ??◎ ??○ ????◎ ????○ ??◎ ????○ ??○ ????◎
????71 ??◎ ??○ ??○ ??◎ ??◎ ??○ ????○ ????○ ??○ ????◎ ??◎ ????○
????72 ??◎ ??◎ ??○ ??◎ ??◎ ??◎ ????◎ ????○ ??◎ ????○ ??○ ????◎
????73 ??◎ ??◎ ??○ ??◎ ??◎ ??◎ ????○ ????○ ??○ ????○ ??○ ????◎
????74 ??◎ ??◎ ??○ ??○ ??○ ??○ ????○ ????○ ??○ ????○ ??○ ????◎
????75 ??◎ ??○ ??○ ??○ ??○ ??○ ????○ ????○ ??○ ????◎ ??◎ ????◎
????76 ??◎ ??○ ??○ ??○ ??○ ??○ ????○ ????○ ??○ ????◎ ??◎ ????○
Comparing embodiment ????11 ??△ ??○ ??△ ??△ ??△ ??○ ????△ ????△ ??△ ????△ ??△ ????○
????12 ??△ ??○ ??△ ??△ ??△ ??○ ????△ ????△ ??△ ????△ ??△ ????○
????13 ??△ ??○ ??○ ??△ ??△ ??△ ????△ ????△ ??△ ????△ ??△ ????△
????14 ??△ ??△ ??△ ??△ ??△ ??○ ????△ ????△ ??△ ????△ ??△ ????○
????15 ??△ ??△ ??△ ??△ ??△ ??△ ????△ ????△ ??△ ????△ ??△ ????△
????16 ??△ ??○ ??○ ??△ ??△ ??△ ????△ ????△ ??△ ????△ ??△ ????△
Table 10
Production method
Calendering degree (%) The ratio (%) of the relative fusing point of The pre-heat treatment temperature Real time level of stretch (%) Secondary tractive degree (%) Rate of extension (m/min) Tension force difference (MPa) before and after the drawing die The stretching angle (°) The drawing die area reduces ratio
??＜7％ 7-11％ 11-20％ The ratio of the relative recrystallization temperature of after-baking
Embodiment ????61 ????98 ????50 ????95 ????99.8 ????200 ??1-5 ????20 ????40 ????40 ????20 ????50
????62 ????99 ????50 ????98 ????99.5 ????300 ??1-10 ????15 ????30 ????50 ????20 ????45
????63 ????99.9 ????55 ????99 ????99.7 ????250 ??2-20 ????25 ????20 ????50 ????30 ????60
????64 ????99 ????65 ????99.5 ????99.5 ????200 ??0.1-2 ????20 ????35 ????40 ????25 ????45
????65 ????98 ????40 ????99.9 ????99.99 ????300 ??1-5 ????20 ????60 ????20 ????20 ????50
????66 ????99 ????35 ????98.5 ????99.9 ????400 ??1-5 ????20 ????45 ????40 ????15 ????45
????67 ????98 ????50 ????99.8 ????99.995 ????300 ??0.5-5 ????20 ????40 ????40 ????20 ????55
????68 ????98 ????45 ????99.8 ????99.8 ????300 ??1-5 ????25 ????40 ????40 ????15 ????45
????69 ????99 ????50 ????99.9 ????99.9 ????250 ??1-10 ????20 ????40 ????40 ????20 ????65
????70 ????99 ????50 ????99.99 ????99.9 ????300 ??5-15 ????20 ????35 ????50 ????15 ????45
????71 ????99 ????60 ????99 ????99.95 ????400 ??1-5 ????20 ????40 ????40 ????20 ????40
????72 ????98 ????50 ????99.5 ????99.5 ????300 ??2-20 ????20 ????50 ????30 ????20 ????48
????73 ????99.5 ????45 ????98.8 ????99 ????150 ??1-5 ????20 ????40 ????30 ????30 ????45
????74 ????98 ????65 ????99 ????99.5 ????600 ??5-45 ????5 ????50 ????35 ????15 ????35
????75 ????99 ????65 ????99.8 ????99.5 ????650 ??3-20 ????20 ????65 ????25 ????10 ????30
????76 ????98 ????70 ????99.5 ????99.5 ????700 ??2-35 ????20 ????70 ????15 ????15 ????35
Comparing embodiment ????11 ????80 ????90 ????97 ????100 ??0.5-1 ????20 ????80 ????20 ????0 ????80
????12 ????99 ????10 ????97 ????97 ????80 ??3-20 ????45 ????50 ????50 ????0 ????50
????13 ????98 ????50 ????93 ????99 ????200 ??0.08-10 ????60 ????75 ????5 ????20 ????60
????14 ????98 ????90 ????99 ????90 ????300 ??8-65 ????20 ????5 ????75 ????20 ????40
????15 ????98 ????50 ????93 ????99.5 ????1200 ??0.03-1 ????20 ????40 ????40 ????20 ????25
Below the concise and to the point concrete production stage of describing according to described embodiment.At first, the preparation diameter is 6 to 30 millimeters a ingot casting.In the calendering step, use thin roll to roll ingot casting with 10 to 100m/min speed, be 0.5 to 1.5 millimeter until the connecting line diameter.In the The pre-heat treatment step, described connecting line was maintained in 250 to 800 ℃ the stove 0.1 to 2 hours, open-air cooling outside placing stove then.In stretching step, continuously elongated device and use that a plurality of drawing dies are housed by use are coated with adamantine drawing die, keep drawing die front and back tension force difference in 0.1 to 50MPa scope, the speed stretching connecting line with 50 to 400m/sec.Reduce ratio according to section, used drawing die comprise have less than 7%, 7 to 11% and 11 to 20% sections reduce than three groups of drawing dies.In the after-baking step, use infrared heating furnace with 20 centimetres of even thermals treatment zone.Continuous mobile connecting line, and heat-treat by 250 to 700 ℃ stove, rate travel are 50 to 800m/min, to such an extent as to percentage elongation is 3 to 5% in the tensile test.
In the embodiment 64,65 and 70 to 76 of table 10, regulate the heating-up temperature Te at heating furnace two ends in the after-baking step, make its than middle body heating-up temperature Tm low 0.02 to 0.3Tm.
In order to connect connecting line, use automatic connection cord jockey commonly used to carry out sphere/wedge bond.In ball bond, form ball by arc discharge at the connecting line end, and pass through thermo-compressed, and described ball is connected on the electrode film by ultrasonic wave.In addition, the other end of connecting line is arrived on the lead frame (Cu alloy) by wedge bond, perhaps the lead portion at the bottom of the CSP belt material.Keep the spacing of 70,50 and 40 at electrode, carry out thin space and connect.
The appropriate section that is used for being connected with connecting line is the electrode film on the silicon substrate, be the about 0.8 micron Al alloy firm (Al-1%Si of thickness, Al-0.5%Cu, Al-1%Si-0.5%Cu) or Cu connecting line (0.01 micron/Ni0.4 of Au micron/Cu0.4 micron).
To electrode, and the connecting line on it of stretching makes it to break to form peg piece (stud bumps) with ball bond.When the laminates chip, need on same chip, come with the hybrid mode formation peg piece and the line of apsides, at first on all electrodes, form the peg piece, by ball portion is received on the lead portion, then the connecting line wedge bond is formed the line of apsides to the peg piece then.
As for the connecting line structure, the connecting line that etching is longitudinally cut open, and use SEM to determine the quantity of crystal grain.In addition, by the EBSP method, measure the crystal orientation in the sample area of cutting open in the same manner.Obtain the chip area ratio that has [111] orientation or [100] orientation on the whole connecting line cross section.In order to draw [111]/[100] area in each zone, will be that the connecting line central authorities of R partly are decided to be middle body to R/2 from radius, and its outside will be decided to be periphery than Rc and Rs.Zone from connecting line central authorities to R/3 is decided to be core, and [111]/[100] area of obtaining in the core compares Rd.When measuring crystal orientation, the crystal grain of various orientations refers to crystal orientation with respect to the connecting line crystal grain of inclination angle in 10 ° longitudinally.
In order to estimate wedge bond, connecting line is connected on the lead frame that the surface is coated with Ag (thickness: 1 to 4 micron), perhaps the surface is coated with on the resin strip substrate of Au/Ni/Cu connecting line.When using lead frame, the sample stage of assembling sample is maintained under 220 ℃ the temperature commonly used; In the time of at the bottom of using belt material, the sample stage of assembling sample is maintained under 180 ℃ of temperature commonly used, and under more difficult 160 ℃ of carrying out of wedge bond.Use 10 200-pin chips as the reference of estimating, and connect 2000 connecting lines altogether.Use observation by light microscope, if the once interruption of the continuous attended operation that causes by the wedge bond defective, perhaps the defective of for example peeling off in two or more local discoveries is judged that then this is because underproof wedge bond is caused, and is represented this wedge bond with △.No problem and when not having defective, wedge bond is evaluated as well, and represents with ◎ when continuous connection.If connection is finished smoothly continuously, but observes when peeling off in a place, this situation can not cause problem between above-mentioned two kinds of situations, and wedge bond is represented with zero in this.
As for the formation of the ball that influences wedge bond, low reaching under 160 ℃ the temperature wedge bond is connected on the tape substrates, and observes 10 beads that diameter is 1.4 times of connecting line diameters by SEM.When ball has really when spherical, represent the spherical characteristic of ball with ◎, and be favourable; Having really when spherical when observing two or more balls, and is favourable, but when departing from connecting line central authorities, represents with zero.
When the connecting line bending (resin distortion) of measuring when resin-sealed, connect connecting line keeping under 5 mm lengths, forming the trapezoidal line of apsides, and to keep the connecting line height be about 300 microns.After this, by using water-tight equipment biphenyl epoxy resin sealed sample commonly used.Then, use the inside of soft * ray nondestructive detecting apparatus transmission semiconductor element, and, and the value (percentage) that its mean value obtains divided by the length of connecting line is defined as connecting line bending after the sealing to the connecting line amount of bow of 30 sample in measurements at predetermined portions.Connecting line bending less than 4% is be evaluated as well, and represents with ◎; Represent to be not less than 6% connecting line bending with △, because such connecting line bending may cause the connecting line contact in thin space; And the connecting line amount of bow between 4 to 6% is represented with zero.
In order to estimate the linearity that connects the line of apsides, use projecting apparatus to observe 100 from top to bottom and keep the connecting line that 6 millimeters spacings (span) connect.Measure on the connecting line and depart from the deviation of the best part as amount of bow with respect to the line that connects spherical contact and wedge contact.Be be evaluated as favourablely less than the average amount of bow of connecting line diameter, and represent with ◎; The average amount of bow that is not less than two connecting line diameters is be evaluated as defective, and represents with △; And marginal average amount of bow is be evaluated as and can not causes problem, and represents with zero.
In order to estimate the reliability of wedge contact, carry out high temperature soft heat test and thermal cycling test.By connecting line being connected on the Cu alloy lead wire framework with 200 pins, and then sealing and obtain sample with biphenyl epoxy resin commonly used.Sample is two chips that have 400 pins altogether.In the soft heat test, for the adapted to leadless welding compound, under 280 ℃, carry out the soft heat test, this temperature is higher than the low working temperature of solution altogether of conventional Sn-Pb, measures electrology characteristic then.As long as there is a connecting line non-conductive, just represent the reliability of wedge contact with △; When electrology characteristic is no problem, represent with ◎; And when situation is between top two kinds of situations, represents that wherein all pins all conduct electricity with zero, but have two or more pins to have high resistance that this may be because connection reliability is not fine.
In thermal cycling test, estimate thermo-lag between the actual operating period in the mode of quickening, between-55 ℃ and 125 ℃, heat up repeatedly and lower the temperature.After test 300 times, decompose mould, remove resin, and near wedge contact, carry out tension test (disbonded test).The mean value of the peel strength of the wedge bond after comparative heat cyclic test peel strength when just being connected.When the reduction of test back peel strength was not more than 20%, the wear-resistant of wedge contact was favourable, and reliability is represented with ◎.When intensity reduces greater than 70% the time, defective may take place, and represents reliability with △, when situation is between top two kinds of situations, represent with zero, can keep the electricity connection this moment.
Estimate near the short span wedge contact hot strength by disbonded test.Inter-chip pitch is about 450 microns, and connecting line length is about 1 millimeter, and connecting line is connected on the above-mentioned resin strip.Connecting line is carried out disbonded test, and estimate hot strength when being not less than 60mN for good when peel strength (being fracture strength), and represent with ◎; When peel strength during less than 20mN, hot strength has problem in use, and represents with △; And when situation is between top two kinds of situations, represent with zero.
As for the tilt problem that occurs recent years, it refers near the phenomenon of the connecting line upstanding portion lodging of spherical contact, observe the connecting line upstanding portion from the direction of relative chip level, and estimate the maximum spacing that the connecting line upstanding portion departs from the vertical line that passes spherical contact central authorities.Connecting line length is 4 millimeters, and sample size is 50.Estimate the inclination under two kinds of situations, promptly have the line of apsides and the line of apsides that is used for the about 350 microns height of having of stricter evaluation of about 220 microns maximum height commonly used.When described spacing during, think and advantageously suppressed inclination less than the connecting line diameter; When described spacing during greater than the connecting line diameter, because upstanding portion tilts, this inclination is be evaluated as defective.Occurrence frequency according to inclination defect is estimated: defective occurs in three or more places and represent with △; There is not the local defective that takes place to represent with ◎; The usefulness zero of the generation of defective between above-mentioned two kinds of situations is represented.
As for the applicability in laminated chip connects, when oppositely ladder connects, estimate the bending of connecting line.On electrode, form the peg piece, and make spherical contact be positioned at the position that is lower than wedge contact, and form wedge bond in the above.By using the chip of ladder, connect connecting line, so that near the connecting line upstanding portion the spherical contact is about 350 microns up to 450 microns.From 200 connecting lines of top observation, as long as when wherein having upstanding portion to tilt to be not less than the amount of 4 times of connecting line diameters, the connection of connecting line is be evaluated as defective, and represents with △; When the maximum deflection amount of all connecting lines was not more than 2 times of connecting line diameter, it was good estimating that connecting line connects, and represents with ◎; And when situation is between top two kinds of situations,, judges in general the use not have problem, and represent with zero although bend to a certain extent.
As for the scar on connecting line surface, form 100 lines of apsides, and use SEM to observe.When connecting line did not go out scar outwardly, the connecting line surface was represented with ◎; As long as find out that one is represented with △ during greater than 10 microns scar; And when situation is between top two kinds of situations, the scar problem can not occur, represent with zero.Stop up as for capillary, the connection number of times (for example until being difficult to continue connection, perhaps the shape of the line of apsides is affected) before capillary stops up relatively takes place.When connecting number of times less than 100,000 o'clock, it is short estimating the life-span capillaceous, and produces rate variance, and the capillary of this moment stops up to be represented with △; When number of times is not less than at 500,000 o'clock, the productivity ratio evaluation is good, and represents with ◎; When situation is between top two kinds of situations, judges in general the use not have problem, and represent with zero.
As for the nemaline stability of Connection Step hogging (line of apsides controllability), every connecting line is measured the height of the line of apsides at three positions, and estimate stable according to the standard deviation of line of apsides height.In order to estimate the practical application in the difficult stable thin space long span of line of apsides shape connects, connect connecting line in two ways, promptly 5 millimeters formation lines of apsides of the connecting line height that is with length is respectively about 200 microns and about 350 microns trapezoidal line of apsides.Select every group to comprise 50 lines of apsides, and use optical microscope measuring.Measure at the position that three line of apsides height trend towards disperseing, promptly spherical contact directly over part, line of apsides summit and connecting line length mid point.
When the standard deviation of line of apsides height is not more than a half of connecting line diameter, decentralization is be evaluated as very big; And when the half of standard deviation less than the connecting line diameter, decentralization is be evaluated as little, and the line of apsides has good stability.Based on described evaluation, when the decentralization of the height at three positions all hour, it is stable estimating line of apsides shape, and represents with ◎.When the decentralization of the height at a position was big, line of apsides shape stability was better, and represents with zero.When the decentralization of the height at two positions was big, line of apsides shape stability represented with △, and when the decentralization of the height at three positions is all big, the usefulness * expression of line of apsides shape.
In table 8,9 and 10, embodiment 61 to 76 relates to the connecting line of the present invention (15); Embodiment 61 to 63,65 to 69, and 72 to 74 connecting lines that relate to the present invention (16); Embodiment 61 to 67 and 70 to 73 relates to the connecting line of the present invention (17); Embodiment 61 to 70 and 72 relates to the connecting line of the present invention (18); Embodiment 64,71,75 and 76 relates to the connecting line of the present invention (19); And embodiment 61,62,64 to 70 and 72 to 76 relates to the connecting line of the present invention (21).Comparing embodiment 11 to 16 in the table 1 is embodiment that the connecting line structure of discontented unabridged version invention (15) constitutes.
In the connecting line of embodiment 61 to 76, [111] of the middle body of connecting line and periphery thereof/[100] area is than the differential ratio absolute value of Rc and Rs | and 1-Rc/Rs| * 100 (%) is not less than 30%, and confirm when using the lead frame of main use at present, can improve wedge bond.In addition, can advantageously generate and be about 1.3 times of big beads of connecting line diameter.In the absolute value of crystal orientation differential ratio was not less than 40% embodiment 62 to 68,70,72,75 and 76, when connecting line was connected on the resin strip under 180 ℃, wedge bond improved.In addition, in embodiment 63 to 67,70 and 76, wherein the absolute value of crystal orientation differential ratio is not less than 50%, even if the wedge bond on the resin strip also is improved under 160 ℃ low temperature.And in the connecting line of comparing embodiment 11 to 16 because the absolute value of crystal orientation differential ratio is less than 30%, thus with lead frame or with the wedge bond of resin strip be not enough.
In the connecting line of the embodiment 61 to 63,65 to 69 that relates to the present invention (16) and 72 to 74, [111]/[100] area of connecting line central authorities and periphery is than the differential ratio absolute value of Rc and Rs | and 1-Rc/Rs| * 100 (%) is not less than 30%, and average [111]/[100] area on the whole connecting line cross section is not less than 1.0 than Ra.Therefore, when suppressing the connecting line bending, can improve joint.But, in comparing embodiment 11 to 16, can not find out this improvement.In embodiment 61 and 66 to 69, the average Ra value of setting on the whole connecting line cross section is not less than 1.2, and can improve the linearity of the line of apsides when keeping long span.
In the connecting line of the embodiment 61 to 67 that relates to the present invention (17) and 70 to 73, [111]/[100] area of connecting line central authorities and periphery is than the differential ratio absolute value of Rc and Rs | 1-Rc/Rs| * 100 (%) is not less than 30%, and the area the core from connecting line central authorities to R/3 than Rd in 0.1 to 0.8 scope.Confirmed that these connecting lines can promote wedge bond constantly the same of inhibition connecting line bending, in addition, in the high temperature soft heat test heat of neutralization cyclic test relevant, also verified good reliability with the wear-resistant of wedge bond.Wherein, in embodiment 61 to 63,65 to 67,72 and 73, confirmed since wherein connecting line except satisfying differential ratio between middle body and the periphery and the area in the core than the Rd, average [111]/[100] area on these whole connecting line cross sections also is not less than 1.0 than Ra, so near the peel strength the wedge bond is enough big in short span connects.
In the connecting line of the embodiment 61 to 70 that relates to the present invention (18) and 72, [111]/[100] area of connecting line central authorities and periphery is than the differential ratio absolute value of Rc and Rs | and 1-Rc/Rs| * 100 (%) is not less than 30%, and the area in the periphery is not less than 1.2 than Rs.Confirm to use such connecting line to realize gratifying wedge bond, and can improve the inclination of 200 microns high lines of apsides.Wherein, even at line of apsides height during up to 350 microns, the connecting line that uses Rs to be not less than 1.5 embodiment 65 to 68 also can improve the inclination of the line of apsides well.In the connecting line of embodiment 61 to 67,71 and 72, | 1-Rc/Rs| * 100 (%) 〉=30%, Rs 〉=1.2, and the area in the core than Rd between 0.1 to 0.8, these connecting lines have the effect that reduces the connecting line bending when oppositely ladder connects.
In the connecting line of the embodiment 64,71,75 that relates to the present invention (19) and 76, [111]/[100] area the outermost part from the surface to R/5 is not more than 1.0 than Rt, and this can reduce the lip-deep scar incidence of connecting line; In useful life before the prolongation capillary is blocked, therefore increased productivity ratio.
In the connecting line of the embodiment 61,62,64 to 70 that relates to the present invention (21) and 72, [111]/[100] area of connecting line central authorities and periphery is than the differential ratio absolute value of Rc and Rs | and 1-Rc/Rs| * 100 (%) is not less than 30%, and crystal grain quantity is in the scope of 0.04 to 4 of every square micron.Confirmed for such connecting line,, can reduce the decentralization of line of apsides height, and can advantageously control the shape of the line of apsides, kept stability simultaneously keeping under 5 millimeters the situation of connecting line length.
Industrial applicability
Semiconductor device according to the invention can be gained in strength and elastic modelling quantity with gold bonding wire and production method thereof; It is crooked to suppress connecting line; Suppress the inclination of the upstanding portion on the spherical contact; Thoroughly improve connection or the wear-resistant characteristic of wedge contact, and strengthen the productivity ratio on the commercial scale.

Claims (27)

1, a kind of gold bonding wire that is used for semiconductor device, wherein, in the grainiess on the connecting line longitudinal cross-section, longitudinally in the crystal orientation, the chip area of [111] orientation is not less than 1.2 with the ratio of the chip area of [100] orientation at connecting line.
2, a kind of gold bonding wire that is used for semiconductor device, wherein, in the grainiess on the connecting line longitudinal cross-section, longitudinally in the crystal orientation, the shared area ratio of crystal grain of [111] orientation is not less than 55% at connecting line.
3, a kind of gold bonding wire that is used for semiconductor device, wherein, in the grainiess on the connecting line longitudinal cross-section, if the radius of connecting line is represented with R, and part that will be from connecting line central authorities to R/2 is as middle body, so on the crystal orientation of the vertical middle body of connecting line, [111] the ratio R a of the chip area of the chip area of [111] orientation and [100] orientation on the ratio R c of the chip area of Qu Xiang chip area and [100] orientation and the whole connecting line cross section, satisfy differential ratio absolute value between the two | 1-Rc/Ra| * 100 (%) is less than 30%, and the ratio R a on the whole connecting line cross section is not less than 1.2.
4, according to any one the gold bonding wire that is used for semiconductor device of claim 1 to 3, wherein, in the grainiess on the connecting line longitudinal cross-section, if the radius of connecting line is represented with R, at connecting line longitudinally in the crystal orientation, ratio in the chip area that has [111] orientation wherein at least in one or more layers and the chip area of [100] orientation is not less than 1.6 zone, and should be not less than 1/10 of connecting line radius R by the width of zone on the connecting line radial direction.
5, according to any one the gold bonding wire that is used for semiconductor device of claim 1 to 4, wherein, in the grainiess on the connecting line longitudinal cross-section, if the radius of connecting line is represented with R, at connecting line longitudinally in the crystal orientation, than the zone that is not less than 60%, and should be not less than 1/10 of connecting line radius R by the width of zone on the connecting line radial direction at the shared area of the crystal grain that has [111] orientation wherein at least in one or more layers.
6, according to any one the gold bonding wire that is used for semiconductor device of claim 1 to 3, wherein, in the grainiess on the connecting line longitudinal cross-section, if the radius of connecting line is represented with R, at connecting line longitudinally in the crystal orientation, less than 0.9 zone, and should be not less than 1/10R by the width of zone on the connecting line radial direction at the ratio of the chip area that has [111] orientation wherein at least in one or more layers and the chip area of [100] orientation, but less than 1/3R.
7, according to claim 1 to 3 or 6 any one gold bonding wires that are used for semiconductor device, wherein, in the grainiess on the connecting line longitudinal cross-section, if the radius of connecting line is represented with R, at connecting line longitudinally in the crystal orientation, than the zone that is not less than 50%, and should be not less than 1/10 of connecting line radius R by the width of zone on the connecting line radial direction at the shared area of the crystal grain that has [100] orientation wherein at least in one or more layers.
8, according to any one the gold bonding wire that is used for semiconductor device of claim 1 to 7, wherein, in the grainiess on the connecting line longitudinal cross-section, longitudinally in the crystal orientation, the shared ratio of the gross area of the crystal grain of [111] orientation and [100] orientation is not less than 50% at connecting line.
9, according to any one the gold bonding wire that is used for semiconductor device of claim 1 to 8, wherein, on the connecting line longitudinal cross-section, if the radius of connecting line is represented with R, and part that will be from connecting line central authorities to R/2 is as middle body, on the crystal orientation of the vertical middle body of connecting line, the gross area with crystal grain of [111] orientation and [100] orientation is not less than 60% at the shared ratio of middle body.
10, a kind of gold bonding wire that is used for semiconductor device, wherein, in the grainiess on the connecting line longitudinal cross-section, if the radius of connecting line is represented with R, and part that will be from the connecting line surface to the R/3 depths is as surface layer part, on the crystal orientation of the vertical surface layer part of connecting line, [111] Qu Xiang chip area is not less than 1.6 with the ratio of the chip area of [100] orientation, and on whole connecting line cross section, the chip area of [111] orientation is not less than 1.2 with the ratio of the chip area of [100] orientation.
11, according to any one the gold bonding wire that is used for semiconductor device of claim 1 to 10, wherein, in the grainiess on the connecting line longitudinal cross-section, if the radius of connecting line is represented with R, and part that will be from the connecting line surface to the R/3 depths is as surface region, on the crystal orientation of the vertical surface region of connecting line, the gross area with crystal grain of [111] orientation and [100] orientation is not less than 50% at the shared ratio of middle body.
12, a kind of gold bonding wire that is used for semiconductor device, wherein, on the connecting line longitudinal cross-section, perhaps on the crystal orientation of being measured by X-ray diffraction on the direction longitudinally perpendicular to connecting line, the crystal grain of [111] orientation is not less than 1.2 with the volume ratio of the crystal grain of [100] orientation.
13, according to any one the gold bonding wire that is used for semiconductor device of claim 1 to 12, wherein, on the connecting line longitudinal cross-section of length, comprise that at least two or more its crystal orientations depart from connecting line and are not less than the crystal grain of connecting line diameter 70% less than 15 ° and its length in the inclination angle longitudinally greater than 5 times of connecting line diameters.
14, according to any one the gold bonding wire that is used for semiconductor device of claim 1 to 13, wherein, described connecting line comprises gold as key component, and comprises total concentration C 1Be that one or more of 0.002 to 0.03 quality % are selected from the element of Y, Ca, Yb and Eu, and comprise total concentration C 2Be that one or more of 0.002 to 0.05 quality % are selected from the element of La, Tb, Dy and Nd, add component concentrations at 0.1＜C 1/ C 2In＜10 the scope.
15, a kind of gold bonding wire that is used for semiconductor device, wherein, in the grainiess of connecting line longitudinal cross-section, if the radius of connecting line is represented with R, and part that will be from connecting line central authorities to R/2 is as middle body, and the part of its outside is as periphery, the ratio R c of the chip area of chip area and [100] orientation of [111] of the vertical middle body of connecting line orientation so, ratio R s with chip area with the chip area of [100] orientation of [111] of the vertical periphery of connecting line orientation, satisfy differential ratio absolute value between the two | 1-Rc/Rs| * 100 (%) is less than 30%.
16, according to the gold bonding wire that is used for semiconductor device of claim 15, wherein, in the grainiess on the connecting line longitudinal cross-section, longitudinally in the crystal orientation, the chip area of [111] orientation is not less than 1.0 with the ratio R a of the chip area of [100] orientation at connecting line.
17, according to the gold bonding wire that is used for semiconductor device of claim 15 or 16, wherein, in the grainiess on the connecting line longitudinal cross-section, if the radius of connecting line is represented with R, and think that the part from connecting line central authorities to R/3 is a core, on the crystal orientation of the vertical core of connecting line, the ratio R d of the chip area of the chip area of [111] orientation and [100] orientation is in from 0.1 to 0.8 scope.
18, according to any one the gold bonding wire that is used for semiconductor device of claim 15 to 17, wherein, on the crystal orientation of the vertical periphery of connecting line, the chip area of [111] orientation is not less than 1.2 with the ratio R s of the chip area of [100] orientation.
19, according to any one the gold bonding wire that is used for semiconductor device of claim 15 to 18, wherein, in the grainiess of connecting line longitudinal cross-section, if the radius of connecting line is represented with R, and with part from the connecting line surface to R/5 as the outermost part, on the crystal orientation of the vertical outermost part of connecting line, the chip area of [111] orientation is not more than 1.0 with the ratio R t of the chip area of [100] orientation.
20, according to any one the gold bonding wire that is used for semiconductor device of claim 1 to 19, wherein, [111] direction of described crystal grain and [100] deviation in driction connecting line longitudinally the inclination angle in 10 ° of scopes.
21, according to any one the gold bonding wire that is used for semiconductor device of claim 1 to 20, wherein, perpendicular to connecting line longitudinally the crystal grain quantity on the cross section from 0.04 to 4 of every square micron.
22, a kind of method of using founding materials to produce the semiconductor device by using gold bonding wire by the combination step that comprises calendering, The pre-heat treatment, succeeding stretch and after-baking, wherein carry out taking turns described various processing with described order at least, wherein Ya Yan working (finishing) area ratio is not less than 95%; Heating-up temperature in the The pre-heat treatment (absolute temperature) is in 20 to 70% scope of founding materials fusing point; The working (finishing) area ratio of succeeding stretch is not less than 99.5%; And the heating-up temperature in the after-baking (absolute temperature) is in 20 to 70% scope of founding materials recrystallization temperature.
23, a kind of method of using founding materials to produce the semiconductor device by using gold bonding wire by the combination step that comprises calendering, first stretching, The pre-heat treatment, succeeding stretch and after-baking, wherein carry out taking turns described various processing with described order at least, wherein the working (finishing) area ratio in calendering and first the stretching is not less than 95%; Heating-up temperature in the The pre-heat treatment (absolute temperature) is in 20 to 70% scope of founding materials fusing point; The working (finishing) area ratio of succeeding stretch is not less than 99.5%; Average rate of extension is 50 to 1000m/min; The vessel temp of stretching connecting line is 5 to 45 ℃; Heating-up temperature in the after-baking (absolute temperature) is in 20 to 70% scope of founding materials recrystallization temperature; And scanning tension force is 0.2 to 70mN.
24, a kind of method of the production semiconductor device by using gold bonding wire according to claim 22 or 23 wherein at a plurality of drawing dies that are used for stretching, is no less than 30% drawing die and has and be not less than 10% section and reduce ratio.
25, a kind of method of using founding materials to produce the semiconductor device by using gold bonding wire by the combination step that comprises calendering, first stretching, The pre-heat treatment, succeeding stretch and after-baking, wherein carry out taking turns described various processing with described order at least, wherein the working (finishing) area ratio in calendering and first the stretching is not less than 95%; Heating-up temperature in the The pre-heat treatment (absolute temperature) is in 30 to 70% scope of founding materials fusing point (absolute temperature); The working (finishing) area ratio of succeeding stretch is not less than 99.5%; Average rate of extension is 100 to 800m/min; Tension force difference before and after the drawing die is in 0.1 to 50MPa scope; Heating-up temperature in the after-baking (absolute temperature) is in 30 to 70% scope of founding materials recrystallization temperature (absolute temperature); And in first stretching and succeeding stretch, the stretching angle in drawing die exit is not more than 30 °.
26, a kind of method of the production semiconductor device by using gold bonding wire according to claim 25, wherein at a plurality of drawing dies that are used for stretching, section reduces than what account for the drawing die sum less than three kinds of drawing dies of 7%, 7 to 11% and 11 to 20% and is no less than 10%.
27, a kind of method of the production semiconductor device by using gold bonding wire according to claim 25 or 26, wherein in the after-baking step, the heating furnace that use has following Temperature Distribution comes continuous sweep and heat treatment connecting line, wherein the heating-up temperature Te at heating furnace two ends (absolute temperature) than middle body heating-up temperature Tm (absolute temperature) low 0.02 to 0.3Tm.
CNB2003801003581A 2002-11-27 2003-10-03 Gold alloy bonding wire for semiconductor device and process for producing the same Expired - Lifetime CN100352026C (en)

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JPS5621354A (en) * 1979-07-30 1981-02-27 Tanaka Kikinzoku Kogyo Kk Bonding wire for semiconductor element
DE3230376C2 (en) * 1982-08-14 1984-10-11 Demetron Gesellschaft für Elektronik-Werkstoffe mbH, 6540 Hanau Gold or gold alloy wire
JPS59155161A (en) * 1983-02-23 1984-09-04 Daiichi Denko Kk Wire for bonding of semiconductor element
EP0647722B1 (en) * 1993-04-08 1999-12-08 Nippon Steel Corporation Gold alloy wire for use in a semiconductor device
JP2922388B2 (en) * 1993-04-22 1999-07-19 新日本製鐵株式会社 Gold alloy fine wire for bonding
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CN104022094A (en) * 2014-05-30 2014-09-03 江西蓝微电子科技有限公司 Silver europium alloy bonding wire and manufacturing method thereof
CN105161476A (en) * 2015-06-19 2015-12-16 汕头市骏码凯撒有限公司 Bonding copper wire for fine-pitch IC packaging and manufacturing method thereof
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CN111886685A (en) * 2018-09-21 2020-11-03 日铁化学材料株式会社 Cu alloy bonding wire for semiconductor device
CN111886685B (en) * 2018-09-21 2021-10-08 日铁化学材料株式会社 Cu alloy bonding wire for semiconductor device
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CN113218956A (en) * 2021-05-13 2021-08-06 厦门多彩光电子科技有限公司 Welding wire evaluation method for LED lamp bead

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