CN1677182A - Method for detecting fault of displaying panel - Google Patents
Method for detecting fault of displaying panel Download PDFInfo
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- CN1677182A CN1677182A CN 200410031808 CN200410031808A CN1677182A CN 1677182 A CN1677182 A CN 1677182A CN 200410031808 CN200410031808 CN 200410031808 CN 200410031808 A CN200410031808 A CN 200410031808A CN 1677182 A CN1677182 A CN 1677182A
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Abstract
The invention is a method for detecting defects in display panel, mixing two different curable compounds together to form a conductive adhesive composition, so as to make the display panel and wafer able to be temporarily fixed first to detect defects: if there are the defects, it can easily repair or reprocess the formed semifinished product; otherwise the display panel and the wafer can be permanently fixed, then.
Description
Technical field
The present invention relates to a kind of method of checking defects of display panel, particularly relate to the method that a kind of utilization has the electroconductive binder inspection defects of liquid crystal display panel of two kinds of different cure components.
Background technology
In membrane transistor LCD (TFT-LCD) field, the panel (being generally face glass) of LCD is engaged with driving element etc., general using anisotropic conductive film (Anisotropic Conductive Film, ACF) and anisotropic-electroconductive adhesive (Anisotropic Conductive Adhesive ACA) waits and to make electrically fixing and conducting between two electrodes.These traditional anisotropic conductive materials mainly comprise the bonding agent of polymer base material and are dispersed in the interior conductive particle of this bonding agent.Because the electric conductivity of this anisotropic conductive material, therefore be widely used in engaging of TFT-LCD face glass and components of drive circuit etc., for example winding engages (Tape Automated Bonding automatically, TAB), membrane of flip chip engages (Chipon Film, COF), glass flip chip engages (Chip on Glass, COG), outer pin engages (OuterLead Bonding, joining technique OLB).
Anisotropic conductive film that these are traditional or bonding agent mainly select thermosetting polymer to reach the purpose of highly adhering as base in order to reach the requirement of high reliability.For example use polyester, epoxy resin, silica resin, amido formate resin etc. after high temperature, pressure or catalysis, can carry out condensation or cross-linking reaction, produce three-dimensional reticulate texture, good to repellences such as burn into moisture invasion and attack, have suitable physical strength simultaneously.But because its three-dimensional cross-linked network hardly with any solvent or reagent reacting, therefore on the joint applications engineering of TFT-LCD face glass and driving element, is difficult for carrying out process again.Particularly in the COG process, owing to driving element is the direct and glass substrate relative bonding of naked wafer, often have in process again that naked wafer is destroyed to be remained on the glass substrate, or anisotropic conductive material remains on the glass substrate and can't be removed efficiently, cause the face glass loss from spoilage.The size of face glass is bigger, heals big because of processing the loss that is caused of failing again.
That utilizes that heat cured conventional anisotropic-electroconductive film carries out TFT-LCD face glass and driving element engages and checks that flow process is shown in Fig. 1.At first, add the anisotropic conductive glued membrane and cling the electrode (step 100) of display panels and components of drive circuit.Afterwards, carry out a heating steps (step 101) and make that the thermosets in the anisotropic conductive glued membrane can forever be solidified with immobile liquid LCD panel and components of drive circuit.One ultraviolet light sealing agent is coated on the display panels (step 102) and the ultraviolet light (step 103) that exposes to the sun to solidify the ultraviolet light sealing agent.Then carry out and check that step (step 104) is to check whether defectiveness of display panels and components of drive circuit.If there is not defective, the process (step 106) after then directly carrying out.Yet,, directly scrap panel (step 105) if on panel, find any defective.
On the other hand, for the requirement of reparation property, the alternative select thermoplastic polymer as base to reach the purpose of temporary adhesion.For example use tygon, Polyvinylchloride, polymethylmethacrylate, polyimide etc. to present plastic resin at high temperature.Therefore in the joint applications engineering of TFT-LCD face glass and driving element, when checking process is found to have because of element alignment or engaged the bad defective that causes, driving element defective etc. when bad, just can utilize high temperature to carry out process again, driving element, anisotropic conductive material are removed, avoided expensive face glass to scrap.Yet the plastic behavior meeting of this of thermoplastic resin kind of high temperature influences product reliability under the experience hot environment when follow-up the use.
Reach the purpose of processability again in order to satisfy reliability simultaneously, once attempted utilizing different proportion hybrid thermosetting polymkeric substance and thermoplastic polymer bonding agent as above-mentioned purpose, for example referring to the technical report CP7652K that anisotropic conductive film is applied to COG (Sony chemical company), be used for the UV hardenable coatings of electronic component (to the IEEE processing-A portion of component package and manufacturing technology, volume 17, the 3rd phase, in September, 1994), polymer engineering theory (England Oxford, the Oxford University Press, 1987), and the basic theory (New York of polymeric material; Wiley and Sons publishing company, 1982).The bonding agent of these heat of mixing plasticity and thermosetting polymer as does not expectedly reach required reliability and reaches the purpose of processability again when reality is used.
Summary of the invention
In above-mentioned prior art, the problems that method produced and the shortcoming of traditional inspection defective, the main purpose of the present invention is to provide two kinds of fixed forms, makes to repair after checking step or process again to be able to easier mode and to carry out.These two kinds of fixed forms have different curings, and wherein a kind of is that heat curing and another kind are to utilize exposure to solidify.
Another object of the present invention provides a kind of new electroconductive binder, and they can two kinds of different curing mode fixed objects.
Another purpose of the present invention is to make after finding defective problematic panel to be abandoned.
A further object of the present invention is by reparation easily or process is to improve product percent of pass again.
According to above-described purpose, the invention provides a kind of method of checking display panel, the step that comprises is as follows, temporarily display panel and one drive circuit element is fixed together, check the defective of display panel, and permanent fixation display panel and components of drive circuit.After in checking step, finding defective, carry out a step of repairing display panel.Display panel can be display panels or plasma display in the present invention.
Described temporary transient fixing can realize that electroconductive binder wherein comprises a thermoset resin, a light curable polymkeric substance, a light trigger and electrically conductive particles by the electroconductive binder of heating between display panel and wafer.Permanent fixation can be reached by the electroconductive binder of irradiation between display panel and wafer.
Description of drawings
The process flow diagram that Fig. 1 is to use traditional approach that LCD is engaged with components of drive circuit;
Fig. 2 is that the method according to this invention uses two kinds of different fixing step to inspect defective, and the simple process flow diagram of repairing or processing display panel again; And
Fig. 3 is the process flow diagram that the method according to this invention is used electroconductive binder immobile liquid LCD panel and components of drive circuit.
Embodiment
Preferred implementation of the present invention is described in detail as follows.Yet except these were described in detail, the present invention can also otherwise implement widely.Scope of the present invention is not subjected to the qualification of following embodiment, and is as the criterion with the accompanying Claim scope.
The invention provides a kind of method of checking display panel, the step that comprises is as follows: temporarily display panel and one drive circuit element are fixed, checked the defective of display panel, and permanent fixation display panel and components of drive circuit.After in checking step, finding defective, carry out a step of repairing display panel.Display panel can be display panels or Plasmia indicating panel in the present invention.
Temporary transient fixing can realize that electroconductive binder wherein comprises a thermoset resin, a light curable polymkeric substance, a light trigger and electrically conductive particles by the electroconductive binder of heating between display panel and wafer.Permanent fixation can be reached by the electroconductive binder of irradiation between display panel and wafer.The weight ratio of above-mentioned thermoset resin and light curable polymkeric substance is 50: 50 to 90: 10, and above-mentioned light trigger accounts for the 0.1-5 weight % of composition weight.This conductive particle is dispersed within this bonding agent, and it can be the plastic cement particulate that deposits metal on conductive metal particulate or the surface.
Above-mentioned thermoset resin can be polyester, epoxide, silica resin or amido formate resin.The polymkeric substance of above-mentioned light curable can be ultraviolet light (UV) curable polymer, electron beam (EB) curable polymer, infrared ray (IR) curable polymer or visible light (VL) curable polymer.The polymkeric substance of aforesaid light curable can be epoxy resin, bisphenol resin class, unsaturated polyester (UP) class and acrylate resin class.For example amido formate diacrylate class and epoxy radicals diacrylate class etc.Light trigger can be monomethyl ether, senior alkyl benzoin ether, benzophenone of benzoin etc., and the kind of light trigger is decided according to used light curable type of polymer.
Can be non-aromatic amine such as methacrylic acid N as for visible light (VL) curable polymer, N dimethylamine base ethyl ester and the ketone of the visible light that can absorb the 400-500nm scope or the combination of two ketones.
In the used conductive adhesive compositions of the inventive method, the effect of thermoset resin provides the temporary joint that bond strength is kept driving element and face glass, for follow-up scrutiny program, so its weight should account for 50 weight % to 90 weight % of thermoset resin and light curable total polymer.And based on the demand of processability again, it is above but be no more than 50 weight % that the light curable polymkeric substance should account for 10 weight % of thermoset resin and light curable total polymer.The high more bond strength of the ratio of thermoset resin is strong more.Yet when confirm in the scrutiny program because of face glass or COG bad with the contraposition of driving element electrode engage bad, the face glass cause is bad or during the bad bad phenomenon that causes of driving element cause, the necessity of processing is again arranged.
In the method for inspection LCD of the present invention, face glass and driving element utilize described conductive adhesive compositions bonding and utilize the heating temporary adhesion after, being combined in hereinafter of face glass that is obtained and driving element is sometimes referred to as " semi-manufacture ".
After checking the defective step, use light curable sealing agent envelope to end display panel and wafer.Envelope is halted to comprise suddenly and is applied or be coated with the light curable sealing agent on display panel and wafer, then with rayed light curable sealing agent.The light curable sealing agent can be epoxy resin, bisphenol resin class, unsaturated polyester (UP) class or acrylate resin class.A kind of preferred mode be the light curable sealing agent select with electroconductive binder in the light curable polymer phase with, seal like this to halt and may be incorporated in the permanent fixation step suddenly or in same step, carry out.Ultraviolet light light curable sealing agent can be epoxy resin, bisphenol resin class, unsaturated polyester (UP) class or acrylate resin class.
In the method for inspection LCD of the present invention, scrutiny program comprises the optical instrument inspection and electrically checks two programs.The optical instrument inspection is in order to the alignment condition of inspection panel and element and bonding situation, electrically checks and then sends test pictures by test control system, with the subassembly of determining panel and driving element defectiveness whether.
So-called herein " defective " speech mean any in the LCD can't be by the QC tester that liquid crystal indicator carried out, comprise above-mentioned optical instrument and electrically test.These defectives comprise the misregistration of for example panel and driving element or engage bad, electrically connect bad, when panel is made itself defective or driving element when making itself defective or when liquid crystal display cells drives, cause the bad any defective of quality etc.
For example, when finding that with the optical instrument inspection panel and element have misregistration or bonding situation bad, promptly peel off panel and driving element and reexamine this panel and whether element still can use.If still can use then utilizes conductive adhesive of the present invention and other elements to carry out bonding once again.
And when electrically checking, send test pictures by test control system, can detect whether defectiveness of test panel and driving element itself by the picture of being sent.If when finding panel or the defectiveness of driving element own, then inspect panel or driving element and whether can repair, then can carry out laser preparing and deliver to downstream process subsequently if can repair by test pictures.Then removed and inspected other elements and whether still can be used if can't repair.If still can use then utilizes conductive adhesive of the present invention and other elements to carry out bonding once again.Scrapped if can't repair then.
These optical instruments and electrical the inspection are therefore no longer to be described in further detail test mode well-known to those having ordinary skill in the art.
Used conductive adhesive compositions can be formulated into liquid and applies by modes such as syringes in the method for inspection LCD of the present invention, also can be prepared into the dry film state, uses with the adhesive tape form.
The process flow diagram of inspection method of the present invention as shown in Figure 2.At first, providing a display panel, can be that display panels or other are such as plasma display, with itself and a wafer temporarily fixing (step 10), wherein wafer components of drive circuit normally.By using the bonding agent that mixes, mixed adhesive wherein comprises thermoset resin and light curable polymkeric substance, can carry out temporary transient fixing step after the thermoset resin heating.Then, can directly carry out defect inspection (step 12) to display panel.If find defective in display panel or components of drive circuit, (step 14) is because between panel and the components of drive circuit be temporary transient fixing for the process that can repair at an easy rate or process again.If in display panel or components of drive circuit, all be not checked through defective, then carry out the step (step 16) of permanent fixation, the light curable polymkeric substance in the mixed adhesive is exposed in the light of corresponding wavelength.
The process flow diagram of another kind of inspection method of the present invention as shown in Figure 3.When checking that step begins (step 20), apply electroconductive binder on display panel or components of drive circuit, electroconductive binder wherein can be a potpourri, comprises thermoset resin and light curable polymkeric substance, and electrically conductive particles.Electrically conductive particles is evenly distributed among the electroconductive binder.In addition, light trigger can add in the electroconductive binder, is causing when the irradiate light of corresponding wavelength is in electroconductive binder.
Then, with temporary transient fixed display panel and components of drive circuit, because heating, thermoset resin can be cured with electroconductive binder heating (step 22).Can directly check defective (step 24) to display panel then.If without any defective, panel need end (step 28) by adding the sealing agent envelope in display panel and components of drive circuit.Sealing agent is a light curable, can solidify by exposure.When shining the wavelength of a correspondence, sealing agent will solidify.The light curable sealing agent can be identical with the principal ingredient of light curable polymkeric substance.Therefore, the fixing step after the step of irradiation can be omitted or merge to.
Then, the light of the irradiation of the electroconductive binder in counter plate corresponding wavelength is to live (step 30) with the components of drive circuit permanent fixation.If the composition of sealing agent and light curable polymer phase together, can be finished the step that envelope is ended simultaneously.After panel and components of drive circuit inspection and fixing, will deliver to next process.
Major advantage of the present invention is to provide two kinds of fixed forms to make to repair after checking step or process again to be able to easier mode and to carry out.These two kinds of fixed forms have different curings, and wherein a kind of is that thermal curing method and another kind are to utilize exposure to solidify.In addition, the present invention provides a kind of new electroconductive binder simultaneously, and it can pass through two kinds of different curing mode fixed objects.After the discovery defective, problematic panel does not need to be abandoned in the present invention.In addition, the present invention is to repair easily or process and improved the qualification rate of product again.
To one skilled in the art, though the present invention be illustrated with above-mentioned preferred implementation, but they are not in order to limit spirit of the present invention.Modification of being done in not breaking away from spirit of the present invention and scope and similarly arrangement all should be included in the following claim scope, and such scope should be consistent with the broadest annotation that covers all modifications and similar structures.Therefore, illustrate preferred implementation of the present invention as above, can be used to differentiate do not break away from the various changes of being done in spirit of the present invention and the scope.
Claims (19)
1. method of checking display panels comprises following step:
Temporary transient fixing described display panels and one drive circuit element;
Check the defective of this display panels; And
This display panels of permanent fixation and this components of drive circuit.
2. the method for inspection display panels as claimed in claim 1, also be included in check find defective in the step after, the step of repairing described display panels.
3. method of checking display panel comprises:
Heat an electroconductive binder with a temporary transient fixing described display panel and a wafer, wherein said electroconductive binder comprises a thermoset resin, a light curable polymkeric substance, a light trigger and electrically conductive particles; And
Check the defective of described display panel.
4. the method for inspection display panel as claimed in claim 3, also be included in check find defective in the step after, repair the step of described defective.
5. the method for inspection display panel as claimed in claim 4 also comprises the step of sealing described display panel and described wafer.
6. the method for inspection display panel as claimed in claim 5 also comprises the step of the described electroconductive binder of irradiation with described display panel of permanent fixation and described wafer.
7. the method for inspection display panel as claimed in claim 3 also comprises the step of coating light curable sealing agent on described display panel and the described wafer.
8. the method for inspection display panel as claimed in claim 7, wherein said light curable sealing agent are selected from ultraviolet light light curable sealing agent, electron beam light curable sealing agent, the curable sealing agent of infrared ray and visible light light curable sealing agent.
9. the method for inspection display panel as claimed in claim 8, wherein said ultraviolet light light curable sealing agent is selected from epoxy resin, bisphenol resin class, unsaturated polyester (UP) class and acrylate resin class.
10. the method for inspection display panel as claimed in claim 9 also comprises the step with the described light curable sealing agent of rayed.
11. the method for inspection display panel as claimed in claim 7 also comprises with the step of the described electroconductive binder of rayed with described display panel of permanent fixation and described wafer.
12. comprising optical instrument, the method for inspection display panel as claimed in claim 3, wherein said inspection step check step.
13. as the method for the inspection display panel of claim 12, wherein said inspection step comprises electronic device and checks step.
14. the method for inspection display panel as claimed in claim 3, the weight ratio of wherein said thermoset resin and described light curable polymkeric substance is 50: 50 to 90: 10.
15. as the method for the inspection display panel of claim 14, wherein said light trigger accounts for the 0.1-5 weight % of composition weight.
16. the method for inspection display panel as claimed in claim 3, wherein said thermoset resin are selected from polyester, epoxide, silica resin and amido formate resin.
17. as the method for the inspection display panel of claim 16, wherein said light curable polymkeric substance is selected from uv-curable polymkeric substance, electron beam curable polymkeric substance, infrared ray curable polymer and visible light curable polymer.
18. as the method for the inspection display panel of claim 17, wherein said light curable polymkeric substance is the uv-curable polymkeric substance that is selected from epoxy resin, bisphenol resin class, unsaturated polyester (UP) class and acrylate resin class.
19. a method of checking defects of liquid crystal display panel comprises:
Temporarily fix described display panels and described wafer by heating the electroconductive binder between a display panels and a wafer, wherein said electroconductive binder comprises a thermoset resin, a light curable polymkeric substance, a light trigger and electrically conductive particles;
Check the defective of this display panels;
Envelope is ended this display panels and this wafer; And
Described display panels of permanent fixation and described wafer by shining described electroconductive binder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410031808 CN1677182A (en) | 2004-03-30 | 2004-03-30 | Method for detecting fault of displaying panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410031808 CN1677182A (en) | 2004-03-30 | 2004-03-30 | Method for detecting fault of displaying panel |
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| CN1677182A true CN1677182A (en) | 2005-10-05 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101424795B (en) * | 2007-11-02 | 2010-12-01 | 群康科技(深圳)有限公司 | LCD and detecting method thereof |
| CN101339896B (en) * | 2007-07-02 | 2011-09-07 | 日东电工株式会社 | Method for joining adhesive tape to semiconductor wafer and method for separating protective tape |
| CN101802697B (en) * | 2007-09-26 | 2012-02-15 | 夏普株式会社 | Method for manufacturing liquid crystal panel |
| CN106646957A (en) * | 2017-03-14 | 2017-05-10 | 惠科股份有限公司 | Display unit process control method and system |
| CN112444688A (en) * | 2019-08-29 | 2021-03-05 | 三赢科技（深圳）有限公司 | Detection device and detection method for pressed conductive product |
-
2004
- 2004-03-30 CN CN 200410031808 patent/CN1677182A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101339896B (en) * | 2007-07-02 | 2011-09-07 | 日东电工株式会社 | Method for joining adhesive tape to semiconductor wafer and method for separating protective tape |
| CN101802697B (en) * | 2007-09-26 | 2012-02-15 | 夏普株式会社 | Method for manufacturing liquid crystal panel |
| CN101424795B (en) * | 2007-11-02 | 2010-12-01 | 群康科技(深圳)有限公司 | LCD and detecting method thereof |
| CN106646957A (en) * | 2017-03-14 | 2017-05-10 | 惠科股份有限公司 | Display unit process control method and system |
| CN106646957B (en) * | 2017-03-14 | 2018-07-20 | 惠科股份有限公司 | Display unit process control method and system |
| WO2018166140A1 (en) * | 2017-03-14 | 2018-09-20 | 惠科股份有限公司 | Method and system for controlling display unit process |
| US10180589B2 (en) | 2017-03-14 | 2019-01-15 | HKC Corporation Limited | Display unit process control method and system |
| CN112444688A (en) * | 2019-08-29 | 2021-03-05 | 三赢科技（深圳）有限公司 | Detection device and detection method for pressed conductive product |
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