CN1673419A - 矩形材料的电镀装置及矩形材料的运送方法 - Google Patents
矩形材料的电镀装置及矩形材料的运送方法 Download PDFInfo
- Publication number
- CN1673419A CN1673419A CN 200510009093 CN200510009093A CN1673419A CN 1673419 A CN1673419 A CN 1673419A CN 200510009093 CN200510009093 CN 200510009093 CN 200510009093 A CN200510009093 A CN 200510009093A CN 1673419 A CN1673419 A CN 1673419A
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- CN
- China
- Prior art keywords
- mentioned
- rectangle material
- cable
- mounting portion
- rectangle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP041936/2004 | 2004-02-18 | ||
JP2004041936 | 2004-02-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1673419A true CN1673419A (zh) | 2005-09-28 |
CN100447307C CN100447307C (zh) | 2008-12-31 |
Family
ID=35046188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100090935A Expired - Fee Related CN100447307C (zh) | 2004-02-18 | 2005-02-18 | 矩形材料的电镀装置及矩形材料的运送方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN100447307C (zh) |
TW (1) | TWI298358B (zh) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3645319C3 (de) * | 1986-07-19 | 2000-07-27 | Atotech Deutschland Gmbh | Anordnung und Verfahren zum elektrolytischen Behandeln von plattenförmigen Gegenständen |
US5827410A (en) * | 1994-11-15 | 1998-10-27 | Siemens S.A. | Device for the electrolytic treatment of plate-shaped workpieces |
JPH09310198A (ja) * | 1996-05-20 | 1997-12-02 | Dainippon Printing Co Ltd | 電着レジスト乾燥装置 |
JP2002194588A (ja) * | 2000-10-12 | 2002-07-10 | Nkk Corp | 金属ストリップの電気鍍金方法および電気鍍金装置 |
CN1193118C (zh) * | 2001-05-25 | 2005-03-16 | 日本爱铝美克斯株式会社 | 表面处理装置 |
JP4765207B2 (ja) * | 2001-06-26 | 2011-09-07 | パナソニック株式会社 | 全面電気メッキ装置およびそれによって全面メッキリードフレームを製造する方法 |
-
2005
- 2005-02-05 TW TW94103941A patent/TWI298358B/zh not_active IP Right Cessation
- 2005-02-18 CN CNB2005100090935A patent/CN100447307C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TWI298358B (en) | 2008-07-01 |
TW200530436A (en) | 2005-09-16 |
CN100447307C (zh) | 2008-12-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20050928 Assignee: Matsushita semiconductor component (Suzhou) Co., Ltd. Assignor: Panasonic semiconductor discrete device Co Ltd Contract record no.: 2013990000219 Denomination of invention: Electroplating apparatus for rectangle material and conveying method for rectangle material Granted publication date: 20081231 License type: Common License Record date: 20130510 |
|
LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081231 Termination date: 20150218 |
|
EXPY | Termination of patent right or utility model |