CN1672468A - Sealing plate for electroluminecense element and mother glass substrate for taking a large number of sealing plates - Google Patents
Sealing plate for electroluminecense element and mother glass substrate for taking a large number of sealing plates Download PDFInfo
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- CN1672468A CN1672468A CNA038183331A CN03818333A CN1672468A CN 1672468 A CN1672468 A CN 1672468A CN A038183331 A CNA038183331 A CN A038183331A CN 03818333 A CN03818333 A CN 03818333A CN 1672468 A CN1672468 A CN 1672468A
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- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 3
- 150000003852 triazoles Chemical class 0.000 description 3
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- DCZNSJVFOQPSRV-UHFFFAOYSA-N n,n-diphenyl-4-[4-(n-phenylanilino)phenyl]aniline Chemical compound C1=CC=CC=C1N(C=1C=CC(=CC=1)C=1C=CC(=CC=1)N(C=1C=CC=CC=1)C=1C=CC=CC=1)C1=CC=CC=C1 DCZNSJVFOQPSRV-UHFFFAOYSA-N 0.000 description 2
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- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 2
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- 238000000926 separation method Methods 0.000 description 2
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- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/04—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
Abstract
A sealing plate for an EL element having an increased resistance against an external pressure and capable of preventing a damage thereto even if the external pressure is applied thereto and a mother glass substrate for taking a large number of the sealing plates, the mother glass substrate comprising organic EL elements (100, 104) having plate-like transparent substrates, organic EL stacked bodies, and sealing plates, the sealing plates further comprising recessed parts having center parts formed in recessed shapes to specify the peripheral projected parts around the peripheral parts thereof, wherein the sealing plate (30) of the organic EL element (100) is subjected to a chemical strengthening treatment by an ion exchange, and the sealing plate (30a) of the organic EL element (104) comprises a curved portion (35) with a radius of curvature of 300 mum at the corner part (34) of the recessed part (32a).
Description
Technical field
The present invention relates to sealing plate for electroluminescent device and, be used to produce the mother glass substrate of a plurality of sealing plates, particularly middle body be restricted to concavity in case on the covered substrate the EL element of stacked EL duplexer with sealing plate and be used to produce the mother glass substrate of a plurality of sealing plates.
Background technology
Electroluminescence (hereinafter referred to as EL) element is suitable for use as mobile phone and the vehicle ' display part with electronic equipments such as information systems, in general, it is made of with sealing plate institute substrate that is formed with the EL stacked film on the surface and EL element, wherein said EL element with sealing plate middle body be processed to concavity, so that limit peripheral projection portion at peripheral part, the end face of this peripheral projection portion is to be bonded on the substrate by bonding agent, thereby the EL stacked film that forms on the substrate is covered.The adhesive linkage that substrate and sealing plate are formed by the bonding agent that is configured on the sealed portion between substrate and the peripheral projection portion bonds together.
As the material of sealing plate, can adopt metal, glass or resin etc.When wherein sealing plate constitutes by metal, electrical insulating property with the extraction electrode part that keeps forming on the substrate is a purpose, must on the bonding agent that sealed portion disposed between substrate and the peripheral projection portion, add the liner of insulating properties, thereby the gap between substrate and the peripheral projection portion resembles the liner greatly, and the possibility that outside moisture is invaded from this part increases.In addition, it is transparent that the top light emitting structure that obtains the light that comes from luminescent layer from sealing plate one side requires sealing plate, so can not use the sealing plate that is made of metallic plate.
Therefore, when EL element adopted the top light emitting structure, sealing plate can adopt plastics or the glass with insulating properties and transparency.But, plastics because of water absorption that himself had seldom as sealing plate material, in contrast, glass because of its excellent insulating properties, the transparency and resistance to water be commonly used for sealing plate material.
As the glass sealing plate processing method, have pair glass blanket itself to carry out the pressure application of bending machining and remove the sandblast processing method of the middle body of glass blanket.Also has etching method in addition.According to this etching method, the flatness of the end face of peripheral projection portion increases, and also can not produce small crackle on the surface of central indentation, even thereby for adhesive base plate and sealing plate and exert pressure, also can carry out bonding equably in the portion of connecting airtight.
In addition, have resemble the EL element of making above-mentioned with sealing plate the top emission type EL element, can be used as the display element of device for display of message such as mobile phone and electronic notebook, not only can use, even also can use outdoor indoor.
But the display device of above-mentioned electronic equipment often is subjected to outside pressure, needs EL element to have the ability of the external pressure resisted with sealing plate.On the other hand, existing the 1st problem be usually as sealing plate the glass of material, fragile especially to tensile stress, thereby require glass to have the hardness that can fully resist the tensile stress that may under indoor service condition, apply.
Moreover, existing the 2nd problem is under service condition such as outdoor, during suffered external pressure is bigger under being subjected to than indoor service condition external pressure, sealing plate inwall, particularly sealing plate the suffered tensile stress in the corner of recess increase, cause easily sealing plate breakage.
Summary of the invention
The 1st purpose of the present invention provides EL element that a kind of durability that can make external portion pressure is improved with sealing plate and be used to produce basic pattern glass (mother glass) substrate of a plurality of sealing plates.
In addition, the 2nd purpose of the present invention provide a kind of can prevent damaged EL element with sealing plate and be used to produce this EL element usefulness sealing plate of polylith mother glass substrate.
For reaching the above-mentioned the 1st purpose, the EL element of the 1st scheme of the present invention is to be used for the glass EL element sealing plate that cover layer is stacked in the EL duplexer on the substrate with sealing plate, it is characterized in that: to sealing plate the surface implemented intensive treatment.
In the EL element of the 1st scheme was used sealing plate, preferably, described sealing plate constituted by alkali-containing glass, and described intensive treatment comprises chemical enhanced processing.
And then described chemical enhanced processing is preferably undertaken by ion-exchange.
In the EL element of the 1st scheme was used sealing plate, described chemical enhanced processing was preferably undertaken by air-cooled reinforcement.
For reaching the 1st above-mentioned purpose, being used to of the 1st scheme of the present invention produce the polylith EL element with sealing plate mother glass substrate, it is characterized in that: described EL element is formed roughly rectangular with sealing plate.
In the mother glass substrate of the 1st scheme, preferably between described sealing plate, cover and handle the described intensive treatment of back enforcement, be cut off between the described sealing plate after this intensive treatment.
For reaching the 2nd above-mentioned purpose, the EL element sealing plate of the 2nd scheme of the present invention, sealing plate middle body are restricted to concavity and are stacked in EL duplexer on the substrate with cover layer, and it is characterized in that: the corner at described recess has crooked position.
In the EL element of the 2nd scheme with in the sealing plate, the radius of curvature of described crooked position be preferably 50 μ m or more than.
In the EL element of the 2nd scheme was used sealing plate, described recess preferably formed by etching method.
And then described etching method is preferably wet etching.
And then the 2nd scheme be used to produce the polylith EL element with sealing plate mother glass substrate, it is characterized in that: described EL element is formed roughly rectangular with sealing plate.
Description of drawings
Fig. 1 be EL element with the 1st embodiment of the present invention with sealing plate the profile of organic EL.
Fig. 2 for the employed EL element of EL element of Fig. 1 with sealing plate 30 be processed into roughly rectangular being used to produce the polylith sealing plate the plane graph of mother glass substrate.
Fig. 3 for comparative example 1 have EL element with sealing plate the profile of organic EL.
Fig. 4 be EL element with the 2nd embodiment of the present invention with sealing plate the profile of EL element.
Fig. 5 for the EL element of embodiment and comparative example with sealing plate recess whether have the key diagram of the evaluation method of breakage.
Fig. 6 for comparative example 2 have EL element with sealing plate the profile of EL element.
Embodiment
The present inventor reaches the above-mentioned the 1st purpose to have carried out research with great concentration, found that: be used for cover layer and be stacked in the glass EL element of the EL duplexer on the substrate with in the sealing plate, if intensive treatment is implemented on the surface to the sealing plate, EL element is improved with the durability of sealing plate to external pressure, can obtains the enough intensity that to bear in actual applications.
In addition, the present inventor reaches the above-mentioned the 2nd purpose to have carried out research with great concentration, found that: be restricted to concavity at middle body and be stacked in the EL element of the EL duplexer on the substrate with cover layer with in the sealing plate, when the corner at recess have crooked position, when preferably having radius of curvature and be 50 μ m or above crooked position, can prevent EL element with sealing plate breakage.
And then the present inventor reaches the above-mentioned the 2nd purpose to have carried out research with great concentration, found that: if when recess forms by etching method, can make the radius of curvature of crooked position obtain desired value.
The present invention finishes based on the result of above-mentioned research.
EL element with regard to the 1st embodiment of the present invention describes with sealing plate with reference to the accompanying drawings.
Fig. 1 be EL element with the 1st embodiment of the present invention with sealing plate the profile of EL element.
In Fig. 1, bottom-emission type organic EL 100 adopts the passives structure, is that the tabular transparent alkali-free glass system substrate 10 of square, the thickness 1.0mm of 7.0cm, the organic EL layer that forms on substrate 10 are folded body 20 and folded the sealing plate 30 that body 20 forms and constituted by covering this organic EL layer by the length of side.
Can will be that the glass blanket of the square of 5.0cm, the tabular transparent alkali glass of thickness 0.70mm (for example NA-35: ェ ヌ ェ ッ チ テ Network ノ グ ラ ス Co., Ltd. makes) system forms the sealing plate 30 that its middle body is processed to concavity by the length of side for example by wet etching, so that limit the peripheral projection portion 31 of width 2.0mm at the peripheral part of recess 32, the bottom thickness of recess 32 is 0.4mm.In addition, sealing plate 30 has been carried out intensive treatment.Substrate 10 and peripheral projection portion 31 are undertaken bonding by adhesive linkage 40, wherein said adhesive linkage 40 is configured on the hermetic unit that forms between the top of substrate 10 and peripheral projection portion 31, and described adhesive linkage 40 for example is made of ultraviolet hardening epoxy resin system bonding agent.
Sealing plate 30 carries out by the following method with the bonding of substrate 10: at first, coating certain amount of bonding agent in peripheral projection portion 31, then sealing plate 30 is placed on the substrate 10, secondly, on one side sealing plate 30 is pressed on the substrate 10 on one side ultraviolet irradiation on bonding agent.
The formation of the recess 32 on the glass blanket is carried out by the following method: at first, the middle body of glass blanket is processed into concavity by wet etching described later, secondly, embodiment such as chemical enhanced processing on this glass blanket (, representing) with symbol 311 with reference to Fig. 1.
The thickness of recess 32 bottoms of sealing plate 30 is preferably 0.3～2.0mm.During thickness is not enough 0.3mm, the intensity of recess 32 bottoms of sealing plate 30 is too small, and during greater than 2.0mm, and the intensity of sealing plate 30 is very big and can not seek the slimming of EL element 100.
On the lower surface 33 of the recess 32 of sealing plate 30, be coated with molecular sieve 50 (manufacturing of ュ ニ オ Application カ one バ イ De company) for absorbing moisture.In addition, coating is the influence of eliminating moisture or oxygen during molecular sieve 50 and during sealing plate 30 and substrate 10 bonding, preferably in dry atmosphere or under reduced pressure carry out.
In addition, as hygroscopic agent, but the present invention is not limited to this to the present embodiment with only molecular sieve 50, for example silica gel (SiO
2), drier (desiccant, clay class drier), calcium chloride, calcium oxide, calcium silicates etc. also be fine.
The folded body 20 of organic EL layer is nesa coatings 21 of being made of the ITO film of thickness 300nm in containing of forming on the substrate 10, comprise luminescent layer described later and by the folded film 22 of the organic EL layer on the surface that is layered in this nesa coating 21, form on the surface of the folded film 22 of organic EL layer by the backplate 23 of the Mg-Ag alloy composition of thickness 300nm and be connected the extraction electrode 24 that the ITO film by thickness 300nm on this backplate 23 forms and constituted.
The folded film 22 of organic EL layer is according to the hole transporting layer of the earlier stacked thickness 70nm that is made up of triphenyldiamine, the such sequential cascade of luminescent layer of the stacked thickness 70nm that is made up of the oxyquinoline aluminium complex forms again from nesa coating 21 1 sides.And then overleaf between electrode 23 and the luminescent layer, also can dispose the transparent electron supplying layer of forming by triazole or oxadiazole.
In addition, the employed etching solution of described wet etching contains at least a kind of acid selecting the group of the inorganic acid of forming from sulfuric acid, hydrochloric acid, nitric acid and phosphoric acid preferably in the hydrofluoric acid of 5～50 quality % in right amount.Can increase etching power thus.In addition, the strong acid of selecting from the group of these inorganic acids can be a kind of, also can be 2 kinds or multiple mixture.
In addition, described etching solution preferably contains a kind, 2 kinds or multiple organic acid or the alkaline species material of selecting in right amount from the group that carboxylic acids, omega-dicarboxylic acids, amine and amino acid are formed.In addition, in described etching solution, also surfactant can be suitably added, also the surfactant that is added can be suitably changed.
The composition of above-mentioned etching solution and concentration thereof can be according to the different of the composition of etching solution temperature and etched glass and kind and in addition suitably change.In addition, when implementing etch processes, it also is effective shaking etched glass or applying low power ultrasonic wave.Can make etching solution become the solution of homogeneous thus.Moreover, when implementing etch processes, it also is effective taking out from etching solution and flooding slightly at least a kind of acid selecting the group of water or the inorganic acid formed from sulfuric acid, hydrochloric acid, nitric acid and phosphoric acid or a kind, 2 kinds of selecting from the group that carboxylic acids, omega-dicarboxylic acids, amine and amino acid are formed or multiple organic acid or the alkaline species material.Can implement etch processes equably thus.
In addition, sealing plate 30 is implemented intensive treatment again by enforcement concavity processing such as wet etchings.Can obtain aspect practical application, having the sealing plate 30 of sufficient intensity thus.As intensive treatment, can be by the air-cooled reinforcement of chemical enhanced method or enhancing sealing plate 30 intensity own, wherein said chemical enhanced method is replaced as the monovalent ion that comprises in the sealing plate 30 employed glass than monovalent ion has the more ion of heavy ion radius, thereby increase the compression stress on sealing plate 30 surfaces, strengthen the intensity of sealing plate 30 itself thus.
Chemical enhanced processing is that the sealing plate 30 of implementing concavity processing by wet etching is clean, dry fully, after this sealing plate 30 is rested on by at least a kind of ion that compares to the monovalent ion that is comprised in the sealing plate 30 and has in the fuse salt of nitrate, sulfate, chloride and their mixture that the ion of heavy ion radius more forms, thus with sealing plate 30 in monovalent ion carry out ion-exchange.The compression stress on sealing plate 30 surfaces is increased, thereby strengthened the intensity of sealing plate 30 itself.
In addition, air-cooled intensive treatment is that the sealing plate 30 of implementing concavity processing by wet etching is fully clean, dry, after this be heated near the softening temperature, carry out chilling and the compression stress on sealing plate 30 surfaces is increased, thereby can increase the intensity of sealing plate 30 itself.
According to the present embodiment, because implemented chemical enhanced processing or air-cooled intensive treatment, so can improve the durability of 30 pairs of external pressures of sealing plate on the surface.
According to the present embodiment, as the method that forms recess 32 on the glass blanket, though use wet etching, the dry-etching method also is fine, and also can use dry-etching method and wet etching simultaneously.Wet etching can carry out batch process by the selection of liquid etching composition and etch temperature, thereby can improve the production efficiency of sealing plate 30.In contrast,, can not carry out batch process, have no alternative but to carry out individual and handle, thereby the production efficiency of sealing plate 30 be lower though the dry-etching method can accurately be carried out etch processes.
In addition, though sealing plate 30 is made of the glass that contains alkali,, just can be used as the chemical enhanced base material of using so long as contain the glass of 5 quality % or above monovalent ion.And then sealing plate 30 also can be made of alkali-free glass, can not implement the base material of chemical enhanced processing like this by ion-exchange, and its surperficial intensive treatment can be undertaken by air-cooled reinforcement (chilling).
In the present embodiment, the folded film 22 of organic EL layer adopts passive configuration, has source structure also to be fine but adopt.In addition, in the present embodiment,, also can adopt the structure of top light emitting though organic EL 100 adopts the structure of bottom-emission.
In addition, the folded film 22 of organic EL layer adopts the structure of being made up of hole transporting layer and luminescent layer, but also can adopt by hole transporting layer, luminescent layer and the structure be made up of the electron supplying layer that triazole or oxadiazole are formed.
Moreover the EL stacked film also can replace the folded film 22 of organic EL layer with inorganic EL stacked film.At this moment, can adopt the structure of forming according to the order of insulating barrier, luminescent layer, insulating barrier from nesa coating one side, also can adopt the structure of forming according to the order of electronic barrier layer, luminescent layer, current-limiting layer from nesa coating one side.
The EL element 100 employed sealing plates 30 of Fig. 1, except that being narrated above resembling by individual handle make, can also from Fig. 2 down be used to produce the polylith sealing plate mother glass substrate cut off.
Fig. 2 for the employed sealing plates 30 of the EL element 100 of Fig. 1 form roughly rectangular being used to produce the polylith sealing plate the plane graph of mother glass substrate.
In Fig. 2, being used to of long 30cm, wide 40cm produce the polylith sealing plate mother glass substrate 200 have and be processed into 5 * 6 rectangular sealing plate 30.
As the rectangular method that sealing plate 30 is processed into 5 * 6 on the glass blanket, the with good grounds etching method that comprises wet etching is removed the method that becomes concavity with the predetermined portions of glass blanket.Employed glass blanket is considered from the operability aspect, its thickness be preferably in 0.5mm or more than, consider that from the slimming aspect of EL element 100 its thickness is preferably in 1.1mm or following.
This method can be described below: at first; on the glass blanket; by the wide banded protective layer of 2.5mm cover handle in case make exposed portions serve form 5 * 6 rectangular; the glass blanket that then this was carried out covering processing flooded in above-mentioned etching solution about 10～180 minutes; so just, by the residual lower convexity of glass blanket portion 101, the predetermined portions removal is become concavity and formed recess 102.This glass blanket is peeled off lower protective layer after fully cleaning with pure water.
Because be by wet etching the predetermined portions of glass blanket to be removed in this wise to become concavity, thus can make the lower surface of the recess 32 of sealing plate 30 become smooth reliably, and the intensity of sealing plate 30 is increased to resist external pressure.
Then will resemble above-mentioned recess 102 be processed to 5 * 6 rectangular being used to produce the polylith sealing plate mother glass substrate 200, cut off at the position of the lug boss 101 that limits recess 102.Can obtain for example individual sealing plate 30 in EL element 100 employed 30 (5 * 6) of aftermentioned Fig. 2 like this.
In described embodiment,,, perhaps also can use dry-etching method and wet etching simultaneously though, also can be the dry-etching method by wet etching as the method that on the glass blanket, forms recess 102.
Be used to produce the polylith sealing plate mother glass substrate 200, sealing plate 30 is arranged in rectangular, but so long as be suitable for that polylith cuts off, can be the arrangement beyond rectangular.
In addition, the width of protective layer is not limited to 2.5mm, so long as the width of the peripheral projection portion 31 of the sealing plate of obtaining 30 for guaranteeing the allowance of sealing plate 30, also can be about 1cm at the thickness of this peripheral projection portion 31 or just above.
According to Fig. 2 be used to produce the polylith sealing plate mother glass substrate 200, can obtain each sealing plate 30 by cutting off separation, a kind of sealing plate that the intensity of resisting the external pressure when cutting off is improved and the life-span is long that makes can be provided, and do not carry out individual and handle, the production efficiency of sealing plate 30 is improved.
The sealing plate 30 that is processed to concavity by etch processes can be implemented intensive treatment respectively after cutting off singly from the mother glass substrate 200.
Describe with sealing plate below with reference to the EL element of drawing with regard to the 2nd embodiment of the present invention.
The EL element of the present embodiment has the formation same with the EL element of the 1st embodiment basically.Therefore, mark same symbol, and explanation is saved for same formation.
Fig. 4 be EL element with the 2nd embodiment of the present invention with sealing plate the profile of EL element.
In Fig. 4, top emission type organic EL 104 adopts passive configuration, is the square of 7.0cm, the tabular transparent soda lime glass substrate 10a of thickness 1.0mm, the folded body 20 of organic EL layer that forms on substrate 10a and is constituted by covering the sealing plate 30a that the folded body 20 of this organic EL layer forms by the length of side.
It is the square of 5.0cm, the tabular transparent alkali-free glass manufacturing of thickness 0.7mm that sealing plate 30a adopts the length of side, the middle body of sealing plate 30a is processed to concavity, so that limit the 31a of peripheral projection portion of width 2.0mm at the peripheral part of recess 32a, the bottom thickness of recess 32a is 0.4mm.In addition, sealing plate 30a has crooked position 35 in the corner 34 of recess 32a, and its radius of curvature is 300 μ m.Substrate 10a and the 31a of peripheral projection portion are undertaken bonding by the adhesive linkage 40 of the hermetic unit that forms between the top that is configured in substrate 10a and the 31a of peripheral projection portion.
The bonding of sealing plate 30a and substrate 10a carried out by the following method: at first, coating certain amount of bonding agent on the 31a of peripheral projection portion, then sealing plate 30a is placed on the substrate 10a, secondly, sealing plate 30a be pressed in substrate 10a go up on one side ultraviolet irradiation on bonding agent on one side.
The formation of the recess 32a of sealing plate 30a is with the same method of the sealing plate 30 of the 1st embodiment the middle body of glass blanket to be processed into concavity and to carry out by adopting.
The bottom thickness of the recess 32a of sealing plate 30a is preferably 0.3～2.0mm.During thickness is not enough 0.3mm, the intensity of sealing plate 30a bottom is too small, and during greater than 2.0mm, and the intensity of sealing plate 30 is very big and can not seek the slimming of EL element 104.
The folded body 20 of organic EL layer is to constitute like this: at first, on substrate 10, form conducting film 21, the folded film 22 of organic EL layer that contains the aftermentioned luminescent layer then in these conducting film 21 upper strata stacked packages, stacked upper transparent electrode 23 on the folded film 22 of this organic EL layer is connected extraction electrode 24 on the upper transparent electrode 23 again.
The such arranged in order of luminescent layer that the folded film 22 of organic EL layer is hole transporting layers of the thickness 70nm that is made up of triphenyldiamine according to configuration earlier from conducting film 21 1 sides, dispose the thickness 70nm that is made up of the oxyquinoline aluminium complex again forms.And then between upper transparent electrode 23 and luminescent layer, also can dispose the transparent electron supplying layer of forming by triazole or oxadiazole again.
In described etching forms, with the mixed liquor of the neopelex of the hydrofluoric acid of 20 quality % and 1 quality % as etching solution.But etching solution is not limited to this, for increasing etching power, in the hydrofluoric acid of 5～50 quality %, contains at least a kind of acid selecting the group of the inorganic acid of forming from sulfuric acid, hydrochloric acid, nitric acid and phosphoric acid in right amount and also is fine.In addition, the strong acid of selecting from the group of inorganic acid can be a kind of, also can be 2 kinds or multiple mixture.
In addition, described etching solution preferably contains a kind, 2 kinds or multiple organic acid or the alkaline species material of selecting in right amount from the group that carboxylic acids, omega-dicarboxylic acids, amine and amino acid are formed.
In addition, in described etching solution, also surfactant can be suitably added, also the surfactant that is added can be suitably changed.
The composition of etching solution as described above and concentration thereof can be according to the different of the composition of the temperature of etching solution and etched glass and kind in addition suitably change.In addition, when implementing etch processes, it also is effective shaking etched glass or applying low power ultrasonic wave.Can make etching solution become the solution of homogeneous thus.Moreover, when implementing etch processes, it also is effective taking out from etching solution and flooding slightly at least a kind of acid selecting the group of water or the inorganic acid formed from sulfuric acid, hydrochloric acid, nitric acid and phosphoric acid or a kind, 2 kinds of selecting from the group that carboxylic acids, omega-dicarboxylic acids, amine and amino acid are formed or multiple organic acid or the alkaline species material.Can implement etch processes equably thus.
According to the present embodiment, because in the corner 34 of recess 32a crooked position 35 is arranged, its radius of curvature is 300 μ m, so it is damaged to prevent that sealing plate 30a from taking place.
In described embodiment, the radius of curvature that does not limit crooked position 35 is 300 μ m, preferably 50 μ m or more than.
In the present embodiment, the same with the 1st embodiment, as the method that forms recess 32a on the glass blanket, though use wet etching, the dry-etching method also is fine, and also can use dry-etching method and wet etching simultaneously.Wet etching can carry out batch process by the composition of etching solution and the selection of etch temperature, thereby can improve the production efficiency of sealing plate 30.In contrast,, can not carry out batch process, have no alternative but to carry out individual and handle, thereby the production efficiency of sealing plate 30 be lower though the dry-etching method can accurately be carried out etch processes.In addition, by using wet etching and dry-etching method simultaneously, it is possible that the anisotropic etching of isotropic etching of wet etching and dry-etching method is combined, and the radius of curvature of crooked position 35 can be adjusted to desired value at an easy rate thus.
The present embodiment as the glass blanket of sealing plate 30a, but according to the formation of organic EL 100,104, can adopt alkali-free glass and carry out soda lime glass or the quartz glass that the alkali prevention stripping has been handled after glass with lower alkali content or the etching.
In the present embodiment, the folded film 22 of organic EL layer adopts passive configuration, has source structure also to be fine but adopt.In addition, in the present embodiment,, also can adopt the bottom-emission structure though organic EL 100,104 adopts the top light emitting structure.In addition, the EL stacked film is the same with the 1st embodiment, also can replace the folded film 22 of organic EL layer with inorganic EL stacked film.At this moment, can adopt the structure of forming according to the order of insulating barrier, luminescent layer, insulating barrier from nesa coating one side, perhaps also can adopt the structure of forming according to the order of electronic barrier layer, luminescent layer, current-limiting layer from nesa coating one side.
The sealing plate 30a that Fig. 1,4 EL element 100,104 are adopted, except that being narrated above resembling by individual handle make, can also be the same with the 1st embodiment, from Fig. 2 down be used to produce the polylith sealing plate mother glass substrate 200 cut off.
Fig. 2 for the EL element 100 employed sealing plates 30 of Fig. 1 be processed into roughly rectangular being used to produce the polylith sealing plate the plane graph of mother glass substrate.
In Fig. 2, being used to of long 30cm, wide 40cm produce the polylith sealing plate mother glass substrate 200 have and form 5 * 6 rectangular sealing plate 30.
As the rectangular method that sealing plate 30 is processed into 5 * 6 on the glass blanket, with good grounds wet etching is removed the method that becomes concavity with the predetermined portions of glass blanket.Employed glass blanket is considered from the operability aspect, its thickness be preferably in 0.5mm or more than, consider that from the slimming aspect of EL element 100 its thickness is preferably in 1.1mm or following.
This method can be described below: at first; on the glass blanket; by the wide banded protective layer of 2.5mm cover handle in case make exposed portions serve form 5 * 6 rectangular; then this was carried out covering the glass blanket of processing in above-mentioned etching solution; flooded about 10～180 minutes; so just, by the residual lower convexity of glass blanket portion 101, the predetermined portions removal is become concavity and formed recess 102.This glass blanket is peeled off lower protective layer after fully cleaning with pure water.
Because be by wet etching the predetermined portions of glass blanket to be removed in this wise to become concavity, thus can make the lower surface of the recess 32 of sealing plate 30 become smooth reliably, and the intensity of sealing plate 30 is increased to resist external pressure.
Then will resemble above-mentioned recess 102 be processed to 5 * 6 rectangular being used to produce the polylith sealing plate mother glass substrate 200, cut off at the position of the lug boss 101 that limits recess 102.Can obtain the individual sealing plate 30 in 30 (5 * 6) like this.
Be used to produce the polylith sealing plate mother glass substrate 200 be sealing plate 30 to be arranged in rectangular, but so long as be suitable for that polylith cuts off, then also can be the arrangement beyond rectangular.
In addition, the width of protective layer is not limited to 2.5mm, so long as the width of the peripheral projection portion 31 of the sealing plate of obtaining 30 for guaranteeing the allowance of sealing plate 30, also can be about 1cm for the thickness of this peripheral projection portion 31 or just above.
In addition, be used to produce the polylith sealing plate the shape of mother glass substrate 200 after cutting off preferably with the identical shape of described sealing plate 30a.
According to Fig. 2 be used to produce the polylith sealing plate mother glass substrate 200, can obtain each sealing plate 30 by cutting off separation, the intensity of resisting the external pressure when cutting off is improved, and does not carry out individual and handle, the production efficiency of sealing plate 30 is improved.
The following describes the embodiment of the 1st embodiment of the present invention.
The present inventor is in order to limit peripheral projection portion at peripheral part, after middle body is processed into concavity by wet etching, carry out chemical enhanced processing by ion-exchange, the sealing plate experiment slice that obtains like this as embodiment 1, will not implemented 1 (sealing plate 301 of the organic EL 103 of Fig. 3) as a comparative example of chemical enhanced processing.In addition, in Fig. 3, the inscape identical with the organic EL 100 of the 1st embodiment put on identical symbol.
At first, the etching solution that preparation is made up of the mixed liquor of the neopelex of the hydrofluoric acid of 20 quality % and 1 quality %, cover processing then, promptly cover the outer surface of the glass blanket of embodiment 1 and comparative example 1 with the acid resistance adhesive tape, periphery surface and peripheral projection portion, again with these experiment slices in remaining on 25 ℃ described etching solution, flooded 60 minutes, from etching solution, take out afterwards, after fully cleaning with pure water, the recess of the degree of depth 300 μ m and the peripheral projection portion of width 2.0mm just on the sealing plate experiment slice, have been processed to form by peeling off the acid resistance adhesive tape.
Secondly, the glass plate that constitutes for the soda lime glass that by the length of side is square, the thickness 1.1mm of 5.0cm, with its needed position dipping in the surfactant solution of the HF of 20 quality % and 1 quality % fully clean after 1 hour, dry, dipping is fully clean after 8 hours in 420 ℃ potassium nitrate again, will implement the experiment slice of so chemical enhanced processing as embodiment 1.And will not implement as a comparative example 1 of chemical enhanced processing.
Then, peripheral projection portion at the sealing plate experiment slice of embodiment 1 and comparative example 1, be coated with an amount of ultraviolet hardening epoxy resin system bonding agent respectively, the hermetic unit that forms between substrate and peripheral projection portion from two side direction of substrate and sealing plate experiment slice applies 980N/m then
2(100kg/m
2) about power, simultaneously with ultraviolet irradiation on bonding agent, just the hermetic unit between substrate and peripheral projection portion has formed adhesive linkage thus, thereby has produced organic EL.
For the surface of the glass blanket of embodiment 1 that obtains in the said process and comparative example 1, measure and bending strength more separately by JIS R-1604 respectively.
In embodiment 1, bending strength is up to 392N/mm
2(40kg/mm
2), this experiment slice can fully bear the external stress of display part under common environment of electronic equipment.Its result show obtained having the very high sealing plate of breakdown strength EL element.
In comparative example 1, bending strength is little of 49N/mm
2(5kg/mm
2), though the display part of electronic equipment can not have problems under the environment usually, lack reliability for external stress.
By present embodiment as can be known: because implemented surface Hardening Treatment with sealing plate, so can improve EL element with the durability of sealing plate to external pressure to being used for the glass EL element that cover layer is stacked in the EL duplexer on the substrate.
The following describes the embodiment of the 2nd embodiment of the present invention.
The present inventor has been prepared middle body is defined as concavity so that form the experiment slice of the sealing plate 30 of peripheral projection portion at the peripheral part of central indentation by the glass blanket of alkali-free glass system by wet etching (embodiment 2～4, comparative example 3) or sand-blast (comparative example 2).
Specifically, the etching solution that preparation is made up of the mixed liquor of the neopelex of the hydrofluoric acid of 20 quality % and 1 quality %, cover processing then, cover the outer surface of the glass blanket of making by alkali-free glass with the acid resistance adhesive tape, periphery surface and peripheral projection portion, again with these experiment slices dipping after 60 minutes in remaining on 25 ℃ described etching solution, from etching solution, take out, after fully cleaning with pure water, just on the glass blanket, be processed to form corner 34 radius of curvature is arranged has been 300 μ m (embodiment 2) by peeling off the acid resistance adhesive tape, 100 μ m (embodiment 3), 50 μ m (embodiment 4), recess that the crooked position of 30 μ m (comparative example 3) and the degree of depth are 0.3mm and the peripheral projection portion of width 2.0mm, thus obtained sealing plate experiment slice.
In addition, in embodiment 3,4 and comparative example 3, employing has isotropic etched wet etching the radius of curvature of corner is processed as 100 μ m (embodiment 3), 50 μ m (embodiment 4), 30 μ m (comparative example 3) respectively, after this for adjusting concave depth, employing may be carried out anisotropic etched dry-etching method.As the dry-etching method, adopt at CHF
3Implement the reactive ion etching of etch processes in the gas.
Moreover, as shown in Figure 6, the sealing plate experiment slice (comparative example 2: the sealing plate 30b of organic EL 105), produce the distinctive fine crack 36 of many sand-blasts in the bottom surface of recess 32a that adopts described sand-blast to make.In addition, in Fig. 6, put on identical symbol for the inscape identical with the organic EL 104 of the 2nd embodiment.
Follow peripheral projection portion at the sealing plate experiment slice of embodiment 2～4 and comparative example 2,3, be coated with the bonding agent of an amount of ultraviolet hardening epoxy resin system respectively, the hermetic unit that forms between substrate and peripheral projection portion from two side direction of substrate and sealing plate experiment slice applies 980N/m then
2(100kg/m
2) about power, simultaneously with ultraviolet irradiation on bonding agent, just the hermetic unit between substrate and peripheral projection portion has formed adhesive linkage thus, thereby has produced organic EL.
On the organic EL that makes like this, for on the distance sealing plate corner angle 4 any point in length and breadth direction be respectively the point of 15mm, for example apart from corner angle A (Fig. 5) in length and breadth direction be respectively the some B of 15mm, in the scope of circle that with this point is the about 10mm of the determined diameter in center, apply 24.5N/cm
2(2.5kg/cm
2) or 49N/cm
2(5kg/cm
2) external pressure, investigation this moment sealing plate recess whether breakage is arranged.Its result is as shown in table 1.
Table 1
| Radius of curvature (μ m) | Damaged observed result | Manufacture method | ||
| External stress 24.5N/cm 2 | External stress 49N/cm 2 | |||
| Embodiment 2 | ?300 | Do not have damaged | Do not have damaged | Wet etching |
| Embodiment 3 | ?100 | Do not have damaged | Do not have damaged | Wet etching+dry-etching method |
| Embodiment 4 | ?50 | Do not have damaged | Do not have damaged | Wet etching+dry-etching method |
| Comparative example 2 | ?- | Damaged | Damaged | Sand-blast |
| Comparative example 3 | ?30 | Do not have damaged | Damaged | Wet etching+dry-etching method |
As can be seen from Table 1: when sealing plate on the corner has crooked position, can prevent sealing plate breakage.
In addition, it can also be seen that: when the radius of curvature of crooked position at 50 μ m or when above, can prevent really sealing plate breakage.
And then as can be seen:, can make the radius of curvature of crooked position obtain desired value when recess adds man-hour by etching method.
As above describe in detail, the EL element sealing plate of the 1st embodiment according to the present invention, it is a kind of glass EL element sealing plate that cover layer is stacked in the EL duplexer on the substrate that is used for, when intensive treatment has been implemented on sealing plate surface, can improve EL element with the durability of sealing plate to external pressure.
In addition, as above describe in detail, the EL element sealing plate of the 2nd embodiment according to the present invention because have crooked position in the recess corner, so can prevent EL element with sealing plate breakage.
According to the sealing plate of the 2nd embodiment because the radius of curvature of crooked position 50 μ m or more than, so can further bring into play reliably described sealing plate effect.
According to the sealing plate of the 2nd embodiment,, thereby can make the radius of curvature of crooked position obtain desired value because recess processes by etching method.
According to the EL element of the 2nd scheme be used to produce the polylith sealing plate mother glass substrate, because described sealing plate is processed to roughly rectangular, so can produce each sealing plate by cutting off to separate, long-life sealing plate that the intensity of resisting the external pressure when cutting off is improved, and do not carry out individual and handle, thereby can make sealing plate production efficiency be improved.
Claims (11)
1. one kind is used for the glass sealing plate for electroluminescent device that cover layer is stacked in the stacked body of electroluminescence on the substrate, and it is characterized in that: intensive treatment has been implemented on the surface at the sealing plate.
2. sealing plate for electroluminescent device according to claim 1 is characterized in that: described sealing plate constitutes by alkali-containing glass, and described intensive treatment comprises chemical enhanced processing.
3. sealing plate for electroluminescent device according to claim 2 is characterized in that: described chemical enhanced processing is undertaken by ion-exchange.
4. sealing plate for electroluminescent device according to claim 1 is characterized in that: described chemical enhanced processing is undertaken by air-cooled reinforcement.
One kind be used to produce the polylith sealing plate mother glass substrate, it is characterized in that: the described sealing plate for electroluminescent device of claim 1 is formed roughly rectangular.
6. according to claim 5 be used to produce the polylith sealing plate mother glass substrate, it is characterized in that: between described sealing plate, cover and handle the back and implement described intensive treatment, be cut off between the described sealing plate after this intensive treatment.
7. its middle body is restricted to concavity and is stacked in the sealing plate for electroluminescent device of the stacked body of electroluminescence on the substrate with cover layer, and it is characterized in that: the corner at described recess has crooked position.
8. sealing plate for electroluminescent device according to claim 7 is characterized in that: the radius of curvature of described crooked position be 50 μ m or more than.
9. sealing plate for electroluminescent device according to claim 7 is characterized in that: described recess forms by etching method.
10. sealing plate for electroluminescent device according to claim 9 is characterized in that: described etching method is a wet etching.
11. one kind be used to produce the polylith sealing plate mother glass substrate, it is characterized in that: the described sealing plate for electroluminescent device of claim 7 is formed roughly rectangular.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002223015A JP2004063395A (en) | 2002-07-31 | 2002-07-31 | Sealing plate for el element and mother glass substrate for multiple formation of sealing plate |
| JP223015/2002 | 2002-07-31 | ||
| JP2002241766A JP2004079467A (en) | 2002-08-22 | 2002-08-22 | Sealing plate for el element, and mother glass substrate for forming multiple sealing plate |
| JP241766/2002 | 2002-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1672468A true CN1672468A (en) | 2005-09-21 |
Family
ID=34395561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA038183331A Pending CN1672468A (en) | 2002-07-31 | 2003-07-11 | Sealing plate for electroluminecense element and mother glass substrate for taking a large number of sealing plates |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN1672468A (en) |
| TW (1) | TW200403948A (en) |
| WO (1) | WO2004014109A1 (en) |
Cited By (4)
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| CN106277812A (en) * | 2016-08-30 | 2017-01-04 | 凯盛科技股份有限公司 | A kind of curved surface cover-plate glass etching solution |
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|---|---|---|---|---|
| US8673163B2 (en) | 2008-06-27 | 2014-03-18 | Apple Inc. | Method for fabricating thin sheets of glass |
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| US9944554B2 (en) | 2011-09-15 | 2018-04-17 | Apple Inc. | Perforated mother sheet for partial edge chemical strengthening and method therefor |
| US8980115B2 (en) * | 2011-09-16 | 2015-03-17 | Amazon Technologies, Inc. | Cover glass for electronic devices |
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| US9946302B2 (en) | 2012-09-19 | 2018-04-17 | Apple Inc. | Exposed glass article with inner recessed area for portable electronic device housing |
| US9459661B2 (en) | 2013-06-19 | 2016-10-04 | Apple Inc. | Camouflaged openings in electronic device housings |
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Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61177395U (en) * | 1985-04-22 | 1986-11-05 | ||
| JP2002008853A (en) * | 2000-06-16 | 2002-01-11 | Nippon Seiki Co Ltd | Organic el panel |
| JP4433577B2 (en) * | 2000-06-20 | 2010-03-17 | 日本精機株式会社 | Organic EL panel |
| JP2002160932A (en) * | 2000-11-17 | 2002-06-04 | Sony Corp | Method of producing glass substrate, glass substrate, and electronic device having the glass plate |
| JP3553875B2 (en) * | 2000-12-26 | 2004-08-11 | 日本発条株式会社 | Display body sealing cover and manufacturing method thereof |
| JP3788313B2 (en) * | 2001-11-02 | 2006-06-21 | セイコーエプソン株式会社 | ORGANIC ELECTROLUMINESCENT DEVICE, ITS MANUFACTURING METHOD, AND ELECTRONIC DEVICE |
| JP2003217828A (en) * | 2002-01-22 | 2003-07-31 | Seiko Epson Corp | Sealing board, manufacturing method for it, display device and electronic device |
| JP2003217833A (en) * | 2002-01-28 | 2003-07-31 | Nippon Sheet Glass Co Ltd | Back sealing can for organic electroluminescence display and manufacturing method for the sealing can |
| JP2003260394A (en) * | 2002-03-07 | 2003-09-16 | Ricoh Co Ltd | Functional element substrate, image display device and apparatus for manufacturing the same |
-
2003
- 2003-07-11 WO PCT/JP2003/008819 patent/WO2004014109A1/en active Application Filing
- 2003-07-11 CN CNA038183331A patent/CN1672468A/en active Pending
- 2003-07-23 TW TW092120135A patent/TW200403948A/en unknown
Cited By (6)
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| CN106673458A (en) * | 2011-03-16 | 2017-05-17 | 苹果公司 | Controlled chemical strengthening of thin glass |
| CN106673458B (en) * | 2011-03-16 | 2019-07-02 | 苹果公司 | The controlled chemistry of thin glass is strengthened |
| US10781135B2 (en) | 2011-03-16 | 2020-09-22 | Apple Inc. | Strengthening variable thickness glass |
| CN103718230A (en) * | 2011-08-05 | 2014-04-09 | Hoya株式会社 | Cover glass for mobile device and production method therefor |
| CN103718230B (en) * | 2011-08-05 | 2016-05-18 | Hoya株式会社 | Cover-plate glass and manufacture method thereof for portable set |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW200403948A (en) | 2004-03-01 |
| WO2004014109A1 (en) | 2004-02-12 |
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