CN1664433A - Compact high power LED array - Google Patents
Compact high power LED array Download PDFInfo
- Publication number
- CN1664433A CN1664433A CN2005100114516A CN200510011451A CN1664433A CN 1664433 A CN1664433 A CN 1664433A CN 2005100114516 A CN2005100114516 A CN 2005100114516A CN 200510011451 A CN200510011451 A CN 200510011451A CN 1664433 A CN1664433 A CN 1664433A
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- Prior art keywords
- led array
- base plate
- heat pipe
- led
- power led
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000009833 condensation Methods 0.000 claims abstract description 5
- 230000005494 condensation Effects 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims abstract description 4
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims description 2
- 238000001816 cooling Methods 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 abstract description 2
- 230000005484 gravity Effects 0.000 description 9
- 239000007788 liquid Substances 0.000 description 8
- 230000005855 radiation Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000005213 imbibition Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000353097 Molva molva Species 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000035755 proliferation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention relates to a compact high power LED array that belongs to light emitting diode application technology field. Several LED array units assemble the light plat, and every LED array unit has base board that the thickness reaching several centimeters and is made up of high thermal conductivity material. It is the positive clan type LED fixed on baseboard. And the clan type heat pipe is inserted into the back or side surface of the baseboard and fixed on the cooling plate of the hot pipe condensation end. The baseboard temperature of the invention is equal, and the system thermal resistance is low. It can sustain over one hundred LED working steadily.
Description
Technical field
The present invention relates to a kind of close-coupled light emitting diode matrix, belong to the applied technical field of light emitting diode, the present invention is applicable to that household room lighting, outdoor Landscape Lighting and city bid farewell illumination etc.
Background technology
The present invention is by great power LED and heat pipe heat radiation technical development.
Up to the present, the luminous efficiency of LED is also lower, and institute catabiotic about 90% has all changed into heat.The ratio that low-power LED efficient can be done is higher, can reach 70lm/W, but because power is little, total light flux can not satisfy the lighting requirement of most of occasions about 1lm.The appearance of power-type LED makes this situation obtain change to a certain degree, but its caloric value is bigger.And great power LED single brightness at present also only reaches 160lm (lumileds Luxeon V star, Technical DataDS30), still can not meet the demands in a lot of single uses of occasion.In this case, led array is exactly the most direct a kind of solution.Yet the gross calorific power of power-type LED array is very big, and thermal source is concentrated, therefore has difficulties in heat radiation.The application of power-type LED at present also rests on single or several uses in groups, and heat radiation also mainly relies on the fin at the heat sink and back side of LED.
What at present more large-scale led array used mainly is air-cooled.For example LuminLeds company shows the LED-backlit LCD TV of releasing in the research annual meeting (The 6th Annual Display Search) at the 5th, and the use led array is done back light, employing be exactly air-cooled design.
The air-cooled certain situation that is applicable to, but a lot of problems are arranged.At first, the life-span of fan is limited, and on shockproof properties and job stability, all exist great gap, therefore used the inevitable serious performance bottleneck, advantages such as the life-span length of LED itself, working stability of on fan, existing of LED illuminating device of fan refrigeration to be difficult to performance with LED.In addition, the noise of fan is difficult to remove, to criteria of noise control than higher environment in, indoor such as household, just can not be applied.At last, the air-cooled relevant device that must need causes air to flow, and will make whole illuminating device volume become big, redundant like this and can't bear, and has limited its application in some portable lighting products.
Hot pipe technique proposes early than nineteen forty-four, and the development and perfection through decades now have been widely used in industrial circles such as power electronics, is one of known the most effective heat transfer element.Typical heat pipe is made up of the vacuum envelope of sealing (in an amount of liquid working substance is arranged) and the imbibition core of inwall thereof.During work and the liquid working substance heat absorption in the end (evaporator section) of heat source near and carburation by evaporation, steam flows to the other end (condensation segment) under small pressure reduction, and be condensed into liquid, the heat that discharges in the condensation process is outwards emitted through tube wall and is finished the heat transfer task, condensed liquid working substance arrives evaporator section through the suction strength or the gravity reflux of imbibition core, enters next working cycles.Mainly contain two kinds of gravity type and gravity assist types in the present practice of heat pipe, gravity type utilizes gravity that liquid is refluxed, and the gravity assist type utilizes capillary pressure etc. that liquid is refluxed, and relies on less to gravity.
In view of above situation, we have proposed a kind of led array of compactness, use the heat pipe heat radiation mode, can keep dozens of and even up to a hundred the collaborative stable work of LED, form power and reach hundreds of watts, and brightness reaches the light source of thousands of and even lumens up to ten thousand.
Summary of the invention
An object of the present invention is, a kind of led array of close-coupled is provided.
The invention is characterized in that it is assembled by a plurality of led array unit horizontal at the in-plane of bright dipping, each led array unit contains:
Base plate, thickness reach several centimetres, are made by high thermal conductivity material;
Concentrating type LED, each in them is all positive fixing at base plate;
Concentrating type heat pipe, each in them all insert in the hole that backplate surface opens, and closely contact with hole wall;
Fin, they link to each other by the base plate of heat pipe with concentrating type LED.
The invention is characterized in: described heat pipe is vertically to insert in the hole at the base plate back side, and insertion depth is half of base plate thickness.
The invention is characterized in that described heat pipe is after being bent certain angle, the laterally inserted again transverse holes that is arranged in the base plate side.
The invention is characterized in, described heat pipe with open the hole that on base plate, is used to insert heat pipe and closely contact and fix.
The invention is characterized in, be fixed with fin at the condensation end of each heat pipe.
Experiment showed, that the present invention can keep dozens of and even hundreds of LED are collaborative stably works, and forms power and reaches hundreds of watts, and brightness reaches several thousand and even the light source of lumens up to ten thousand, and compact conformation, is not afraid of vibrations.
The present invention compares with common backplane+fin mode, and following advantage: base plate is thick, and laterally thermal resistance is little, is beneficial to heat horizontal proliferation on the base plate, thus uniformity of temperature profile; Base plate by high heat conductance between LED and the heat pipe contacts, and can guarantee that the whole system thermal resistance is very little, thereby guarantees under the condition of cooling naturally, and LEDs up to a hundred can also remain on operating temperature on being closely packed in base plate the time, reach the light energy of kilolumen; With respect to using air-cooled led array, its structure is succinct relatively, more is applicable to portable lighting equipment.
Description of drawings
Fig. 1 is the schematic diagram of first kind of embodiment of the present invention.
Fig. 2 is a upward view of the present invention.
Fig. 3 is the design sketch of the light source cell that gets up of assembly unit.
Fig. 4 is the schematic diagram of second kind of embodiment of the present invention.
The specific embodiment
This purpose of the present invention is to realize that by following structure this structure comprises: great power LED (more than every chip 20lm), thick several centimetres base plate, heat pipe, fin.The positive fixed L ED of base plate, the part that contacts with LED is coated with silica gel.Back side punching, the degree of depth is controlled at about half of base plate thickness, and diameter is identical with the heat pipe diameter.Heat pipe one end connects fin, and the other end stretches in the hole on the base plate and be fixing, with soldering together.Structure chart is seen Fig. 1, and Fig. 2 is seen in the led array unit, and led array is seen Fig. 3, and Fig. 2,3 is a design sketch.
Wherein, base plate is made by the material of high heat conductance such as aluminium, copper or pottery, and thickness is decided on the intensive situation of LED.Heat pipe is distributed in the intensive place of LED as far as possible, can be suitably crooked as required.Needed efficiently radiates heat area got final product when the area of fin reached the employing common radiator.
Among the present invention, base plate is a heated portion, and heat pipe is heated in the part of base plate content, and the liquid boiling of the inside, steam flow in heat pipe.Fin is exposed in the air, and area is bigger, easily heat is distributed, so temperature is lower.Steam here cools off becomes liquid, release heat.Because the base plate place is got back in the effect of capillary pressure and gravity, form the loop, reach the effect of heat being moved fin from LED.
Fig. 1 is the side view of first kind of embodiment of the present invention.
Embodiment one adopts gravity type heat pipe.As can be seen from Figure 1, system is made up of four parts.For the present invention, the ductility of fin and base plate helps contacting with the tight of heat pipe, so use aluminium to make this device.
At first with base plate, heat sink alignment, punch on the relevant position of base plate 2, heat sink 3, the hole is not got through on the base plate, and hole depth is about half of base plate thickness.In base plate lower surface screw hole and tapping.Heat pipe is inserted fin, and the contact position with soldering together.At base plate lower surface fixed L ED 1.Also welded together in the hole with the gelled heat pipe insertion of end LED plate upper surface.
Fig. 4 is the side view of second kind of embodiment of the present invention
Heat pipe is different with attitude in the mode one in the embodiment two.At first curved extremely about certain angle heat pipe.Laterally punching on base plate.Punch on the fin, with identical in the mode one.Assembling process also with mode one in identical, as figure.Compare with mode one, mode two radiating effects are better, because base plate is more abundant with contacting of heat pipe.But the shortcoming of mode two is that the two dimension splicing is not too convenient, is more suitable in band light source.
The number of fin is identical in two kinds of schemes, and for the LED about 100W, the effective area of fin is 3000cm2, naturally can operate as normal under Leng Que the situation, and whole lamp provides the luminous flux about 2000lm.
Except that Fig. 1 and Fig. 4, heat pipe and base plate can also have other combining form among the present invention, can also adopt the heat pipe of other form and do not depart from the scope of the present invention.
Claims (5)
1. a compact high power LED array is characterized in that, it is assembled by a plurality of led array unit horizontal at the in-plane of bright dipping, and each led array unit contains:
Base plate, thickness reach several centimetres, are made by high thermal conductivity material;
Concentrating type LED, each in them is all positive fixing at base plate;
Concentrating type heat pipe, each in them all insert in the hole that backplate surface opens, and closely contact with hole wall;
Fin, they link to each other by the base plate of heat pipe with concentrating type LED.
2. the high-power LED array of a kind of close-coupled according to claim 1 is characterized in that: described heat pipe is vertically to insert in the hole at the base plate back side, and insertion depth is half of base plate thickness.
3. a kind of compact high power LED array according to claim 1 is characterized in that, described heat pipe is after being bent certain angle, the laterally inserted again transverse holes that is arranged in the base plate side.
4. according to claim 1, or 2, or a kind of compact high power LED array described in 3 any one, it is characterized in that, described heat pipe with open the hole that on base plate, is used to insert heat pipe and closely contact and fix.
5. according to claim 1, or 2, or a kind of high-power LED array described in 3 any one, it is characterized in that, be fixed with fin at the condensation end of each heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100114516A CN100483010C (en) | 2005-03-21 | 2005-03-21 | Compact high power LED array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100114516A CN100483010C (en) | 2005-03-21 | 2005-03-21 | Compact high power LED array |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1664433A true CN1664433A (en) | 2005-09-07 |
| CN100483010C CN100483010C (en) | 2009-04-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100114516A Expired - Fee Related CN100483010C (en) | 2005-03-21 | 2005-03-21 | Compact high power LED array |
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| Country | Link |
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| CN (1) | CN100483010C (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008043206A1 (en) * | 2006-10-10 | 2008-04-17 | Jen-Shyan Chen | A semiconductor light-emitting module |
| CN100549515C (en) * | 2007-11-13 | 2009-10-14 | 深圳市桑达实业股份有限公司 | The LED lighting device of this monoblock type cooling system of monoblock type cooling system and tool |
| US7762689B2 (en) | 2007-08-31 | 2010-07-27 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | LED lamp |
| CN102032475A (en) * | 2009-08-23 | 2011-04-27 | 彭云滔 | Combined type high-power LED lamp |
| CN101082414B (en) * | 2006-05-30 | 2011-08-17 | 新灯源科技有限公司 | Luminous diode lighting apparatus with high power and high heat sinking efficiency |
| CN102159874A (en) * | 2008-09-19 | 2011-08-17 | 奥斯兰姆有限公司 | Illumination apparatus with heat sink |
| CN102287688A (en) * | 2011-07-20 | 2011-12-21 | 复旦大学 | Streetlamp device with integrated structure of heat pipe lamp post and light emitting diode (LED) light source |
| CN102410469A (en) * | 2010-09-26 | 2012-04-11 | 佛山市国星光电股份有限公司 | Street lamp holder and manufacturing method |
| CN102486304A (en) * | 2010-12-02 | 2012-06-06 | 西安大昱光电科技有限公司 | Cooling device of LED (light-emitting diode) light source |
| CN106439519A (en) * | 2016-10-26 | 2017-02-22 | 广东合新材料研究院有限公司 | Radiator and cooling method based on heat pipe-cellular aluminum structure |
| CN108980795A (en) * | 2018-07-06 | 2018-12-11 | 中国航空规划设计研究总院有限公司 | A kind of heat pipe-type lamps and lanterns cooling device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106969336A (en) * | 2017-05-25 | 2017-07-21 | 苏州灯龙光电科技有限公司 | A kind of LED/light source cooling system |
-
2005
- 2005-03-21 CN CNB2005100114516A patent/CN100483010C/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101082414B (en) * | 2006-05-30 | 2011-08-17 | 新灯源科技有限公司 | Luminous diode lighting apparatus with high power and high heat sinking efficiency |
| US8193553B2 (en) | 2006-10-10 | 2012-06-05 | Neobulb Technologies, Inc. | Semiconductor high-power light-emitting module with heat isolation |
| EA013884B1 (en) * | 2006-10-10 | 2010-08-30 | Необульб Текнолоджиз Инк. | A semiconductor light-emitting module with heat isolation |
| WO2008043206A1 (en) * | 2006-10-10 | 2008-04-17 | Jen-Shyan Chen | A semiconductor light-emitting module |
| US7762689B2 (en) | 2007-08-31 | 2010-07-27 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | LED lamp |
| CN100549515C (en) * | 2007-11-13 | 2009-10-14 | 深圳市桑达实业股份有限公司 | The LED lighting device of this monoblock type cooling system of monoblock type cooling system and tool |
| CN102159874A (en) * | 2008-09-19 | 2011-08-17 | 奥斯兰姆有限公司 | Illumination apparatus with heat sink |
| CN102032475A (en) * | 2009-08-23 | 2011-04-27 | 彭云滔 | Combined type high-power LED lamp |
| CN102410469A (en) * | 2010-09-26 | 2012-04-11 | 佛山市国星光电股份有限公司 | Street lamp holder and manufacturing method |
| CN102486304A (en) * | 2010-12-02 | 2012-06-06 | 西安大昱光电科技有限公司 | Cooling device of LED (light-emitting diode) light source |
| CN102287688A (en) * | 2011-07-20 | 2011-12-21 | 复旦大学 | Streetlamp device with integrated structure of heat pipe lamp post and light emitting diode (LED) light source |
| CN106439519A (en) * | 2016-10-26 | 2017-02-22 | 广东合新材料研究院有限公司 | Radiator and cooling method based on heat pipe-cellular aluminum structure |
| CN108980795A (en) * | 2018-07-06 | 2018-12-11 | 中国航空规划设计研究总院有限公司 | A kind of heat pipe-type lamps and lanterns cooling device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100483010C (en) | 2009-04-29 |
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