CN1652642A - Substrate assembly of display device and making method thereof - Google Patents
Substrate assembly of display device and making method thereof Download PDFInfo
- Publication number
- CN1652642A CN1652642A CN 200410003274 CN200410003274A CN1652642A CN 1652642 A CN1652642 A CN 1652642A CN 200410003274 CN200410003274 CN 200410003274 CN 200410003274 A CN200410003274 A CN 200410003274A CN 1652642 A CN1652642 A CN 1652642A
- Authority
- CN
- China
- Prior art keywords
- board unit
- layer
- cover layer
- inorganic
- display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
The base plate module of display includes following parts: a transparent base plate, an optical wavelength conversion layer positioned above the said base plate, an inorganic cover layer of covering on the optical wavelength conversion layer, the base plate module can carry a organic luminescence module to constitute a display device. An inorganic cover layer is setup between the transparent base plate including an optical wavelength conversion layer and the organic luminescence module. Thus, in followed heating up procedure (100-260 deg.C), the inorganic cover layer reduces release quantity of moisture and impurity gas from optical wavelength conversion layer, and protects organic luminescence module effectively. The said inorganic cover layer can be formed through SOG method, chemical vapor deposition method or physical vapor deposition method at operation temperature 20-300 deg.C and 0.0005Torr- 1ATM.
Description
Technical field
The present invention relates to board unit of a kind of display and preparation method thereof, refer in particular to a kind of in the display processing procedure 100-260 ℃ add and prevent that moisture and gas from disengaging man-hour, and organic luminescent assembly is produced board unit of the full-color organic electroluminescence display that destroys and preparation method thereof.
Background technology
Along with popularizing of portable electronic product such as mobile phone, digital camera or personal digital assistant, the performance of flat-panel screens (FPD) also becomes more and more important.Flat-panel screens mainly comprises LCD (LCD), plasma scope and organic electroluminescent display device etc., the LCD of comparatively popularizing can be not luminous because of liquid crystal itself at present, need install backlight additional, and on bulking value and the cost adverse influence being arranged.
Kodak at first delivered Organic Light Emitting Diode (OLED) in 1987, injected organic small molecule material between two plate electrodes; Thereafter univ cambridge uk delivers polymer LED (PLED) nineteen ninety, and in recent ten years, because the positive research and development of each manufacturer, so the material of organic luminescent assembly, characteristic and correlation technique all have significantly and break through.Because organic electroluminescent display device has the advantage of self-luminous, big operating temperature range and wide viewing angle, therefore be expected to become the flat-panel screens of main flow.
In order to realize the effect of full-color demonstration, for organic electroluminescent display device, can take following three kinds of modes:
(1) luminous by the red-blue-green method organic luminescent assembly respectively, by allotment different blended light ratio example, can realize full-color demonstration, but for the making of organic luminescent assembly, how reaching high-fineness is the research and development bottlenecks.
(2) luminous by white light organic luminous assembly, (Colorfilter CF) produces red bluish-green three primary colors, by allotment different blended light ratio example, can reach full-color demonstration by the colored filter of red bluish-green three primary colors again.This kind mode can be utilized the colorized optical filtering sheet material of available liquid crystal display, and its technology focuses on the color purity and the colour temperature thereof of white light organic luminous assembly.
(3) luminous by the blue light organic luminescent assembly, (Colorchange media CCM) produces red green, cooperates original blue light can produce red bluish-green three primary colors via the color conversion material of red green again.This kind mode must critically not form the organic luminescent assembly pattern yet, and only the efficient of color conversion material is the research and development bottlenecks.
Referring to Fig. 1, be the cutaway view of an existing full-color organic electroluminescence display.This full-color organic electroluminescence display 10 mainly comprises a glass plate substrate 100, be positioned on the glass plate substrate 100 an optical wavelength converting layer (wavelength conversion layer) 110 and with its staggered black matrix" 108, be positioned at a organic coating layer (over coat) 112 on the optical wavelength converting layer 110, be positioned at the inorganic barrier layer (barrier layer) 114 on the organic coating layer 112 and be positioned at organic luminescent assembly 120 on the inorganic barrier layer 114.
Wherein this optical wavelength converting layer 110 can be colored filter (CF), color conversion material (CCM) or both combinations; And corresponding organic luminescent assembly 120 also beard and hair white light or blue light.
The material of this organic coating layer 112 can be made alkali vinegar, polyethylene, polypropylene or its organic synthesis material for organically polyimide, propylene class, isobutylene type, polyester, polyethylene, and can rotate coating methods such as (Spin coating) and cover on the optical wavelength converting layer 110.
This inorganic barrier layer 114 is to deposit on organic coating layer 112 with physical vaporous deposition (PVD method) or chemical vapour deposition technique (CVD method), and is used for protecting this organic luminescent assembly 120 can not be subjected to that aqueous vapor (moisture) or the foreign gas (outgas) when heating up heating influences from optical wavelength converting layer 110 and/or organic coating layer 112.
More specifically, organic coating layer 112 need carry out cleaning procedure after formation, and moisture or impurity when cleaning are easy to be adsorbed in the hole of organic material cover layer 112, therefore in successive process, moisture and impurity just can flash to gas, and then influence organic luminescent assembly 120.Therefore moreover in full-color organic electroluminescence display 10 commonly used, cover layer 112 also is an organic material, also has aqueous vapor or foreign gas influences organic luminescent assembly 120, and the qualification rate of substrate can't be promoted.
The present inventor is because the shortcoming of said structure and the inconvenience on the production process, be actively to set about studying, in the hope of a kind of board unit and processing procedure thereof that can solve the full-color organic electroluminescence display of above-mentioned shortcoming commonly used can be provided, through constantly test and effort, develop the present invention finally.
Summary of the invention
Main purpose of the present invention is to provide a kind of the intensification at display to add man-hour, can reduce the board unit and the processing procedure thereof of moisture and gas emission.
In order to reach the foregoing invention purpose, the invention provides a kind of board unit of display, comprise: a transparency carrier; One optical wavelength converting layer is positioned on this substrate; One inorganic cover layer is coated on this optical wavelength converting layer; Wherein this board unit can be in order to carry an organic luminescent assembly, to constitute a display.The board unit of display of the present invention is that an inorganic cover layer with high light transmittance is set between transparency carrier and organic luminescent assembly, and the material of this inorganic cover layer can be silica, silicon nitride, nitrogen oxide silicon, carborundum, titanium oxide, titanium nitride, zirconia, zirconium nitride, aluminium oxide, aluminium nitride, tin oxide, indium oxide, lead oxide, boron oxide, calcium oxide, SiO
XC
iH
j, SiN
yC
iH
jOr SiO
XN
yC
iH
j
Manufacture method of the present invention is on the substrate that is provided with colored filter (Color filter), color conversion material (CCM) or its both combination, with SOG method, chemical vapour deposition technique or physical vaporous deposition deposition inorganic cover layer, be provided with dynamo-electric exciting light assembly in inorganic cover layer again, wherein the SOG method can be method of spin coating, chemical vapour deposition technique can be PECVD, optical cvd, Cat-CVD, ICP-CVD or SWP-CVD, and physical vaporous deposition can be vapour deposition method, sputtering method, electron beam evaporation plating method or ion beam vapour deposition method.The operating temperature of making this inorganic cover layer in addition is 20～300 ℃, and pressure is 0.0005Torr～1ATM.
The present invention is provided with inorganic cover layer on substrate; and the compact structure of inorganic cover layer; be difficult for absorbing moisture and impurity; therefore both make up moisture and the gas that is discharged can to block colored filter on the substrate, color conversion material or its, reach the effect of protection organic EL component.
Description of drawings
Fig. 1 is the cutaway view of a full-color organic electroluminescence display of using always;
Fig. 2 is the cutaway view according to the full-color organic electroluminescence display of a preferred embodiments of the present invention;
Fig. 3 is the cutaway view according to the full-color organic electroluminescence display of another preferred embodiments of the present invention;
Fig. 4 is the cutaway view according to the full-color organic electroluminescence display of a preferred embodiments more of the present invention;
Fig. 5 is the profile according to the making flow process of display of the present invention.
Wherein, description of reference numerals is as follows:
10 organic electro-luminescent displays
100 substrates, 108 black matrix"s
110 optical wavelength converting layers, 112 cover layers
114 barrier layers, 120 organic luminescent assemblies
20,30,40 organic electro-luminescent displays
200,300,400 substrates
208,308,408 black matrix"s
210,310,410 optical wavelength converting layers
315,415,419 inorganic barrier layers
217,317,417 inorganic cover layers
220,320,420 organic luminescent assemblies
Embodiment
Please, be cutaway view according to full-color organic electroluminescence display 20 of the present invention referring to shown in Figure 2.This full-color organic electroluminescence display 20 mainly comprises a glass plate substrate 200, be positioned at the optical wavelength converting layer (wavelength conversion layer) 210 on the glass plate substrate 200, be positioned at the inorganic cover layer 217 on the optical wavelength converting layer 210, be positioned at the organic luminescent assembly 220 on the inorganic cover layer 217, wherein the material of this transparency carrier 200 can be glass (glass), quartzy (quartz), or plastics (plastic), or has active array (AM), thin-film transistor (TFT) array for example, or the glass of passive array (PM) or plastic base 200.This organic luminescent assembly 220 can by Organic Light Emitting Diode (OLED) or polymer LED (PLED) be constituted.
Wherein these inorganic cover layer 217 materials can be silica, silicon nitride, nitrogen oxide silicon, carborundum, titanium oxide, titanium nitride, zirconia, zirconium nitride, aluminium oxide, aluminium nitride, tin oxide, indium oxide, lead oxide, boron oxide, calcium oxide, SiO
XC
iH
j, SiN
yC
iH
jOr SiO
XN
yC
iH
jThe thickness of this inorganic cover layer 217 is preferably 1～50 μ m, escapes in heating processing to organic luminescent assembly 220 with the aqueous vapor that prevents optical wavelength converting layer 210, and wherein this inorganic cover layer also can be sandwich construction.Moreover, this inorganic cover layer 217 also can make resulting structures have smooth go up table and, in order to follow-up organic luminescent assembly 220 assembling process.This optical wavelength converting layer 210 can be colored filter (CF), color conversion material (CCM) or both combinations; And corresponding organic luminescent assembly 220 also must be white or blue.Moreover for guaranteeing display effect, the light transmittance of this inorganic cover layer 217 must be greater than 80%.
Referring to Fig. 3, be another preferred embodiments of the present invention, can prevent the destruction of the aqueous vapor or the foreign gas of optical wavelength converting layer 310 really in order to ensure organic luminescent assembly 320, and prevent to make the destruction of the preceding cleaning procedure of inorganic cover layer for optical wavelength converting layer 310, can on optical wavelength converting layer 310, be provided with and deposit an inorganic barrier layer 315 with PVD mode or CVD mode.Referring to Fig. 4, be a preferred embodiments more of the present invention in addition, except an inorganic barrier layer 415 is set on optical wavelength converting layer 410, also can the PVD mode or the CVD mode deposits an inorganic barrier layer 419 on inorganic cover layer 417.Except guaranteeing can not destroy the organic luminescent assembly 420 from the aqueous vapor and the foreign gas of optical wavelength converting layer 410; In the time of also can preventing to make assembly pattern (pattern), etching solution is for the destruction of transparency electrode.Only this inorganic barrier layer 315 (or inorganic barrier layer 415,419) must only not need 500 * 10 just like the thickness of barrier layer commonly used
-10M～5000 * 10
-10M can reach required fruit really.Moreover inorganic barrier layer 315 (or inorganic barrier layer 415,419) is also thought sandwich construction.
Referring to Fig. 5, be making flow process profile according to display 20 of the present invention, it comprises the following step:
S100: prepare a glass plate substrate or contain the glass plate substrate 200 of tft array, and on this glass plate substrate 200, form an optical wavelength converting layer 210, and the pattern of optical wavelength converting layer 210 is separated with a black matrix" 208;
S102: on optical wavelength converting layer 210, form an inorganic cover layer 217; These inorganic cover layer 217 materials can be silica, silicon nitride, nitrogen oxide silicon, carborundum, titanium oxide, titanium nitride, zirconia, zirconium nitride, aluminium oxide, aluminium nitride, tin oxide, indium oxide, lead oxide, boron oxide, calcium oxide, SiO
XC
iH
j, SiN
yC
iH
jOr SiO
XN
yC
iH
jThis inorganic cover layer 217 can utilize modes such as SOG method, chemical vapour deposition technique or physical vaporous deposition to form, and this inorganic cover layer 217 can be sandwich construction;
S104: assembling one organic luminescent assembly 220 on inorganic cover layer 217, this organic luminescent assembly 220 mainly comprises transparency electrode/electric hole implanted layer/electric hole transport layer/organic luminous layer/electron transfer layer/electron injecting layer/negative electrode; Organic luminescent assembly 220 is a common technology, so its structure is not at this detailed description.
In step S102, form silica (SiO with chemical vapour deposition technique
X) inorganic cover layer 217 is example, it can be 20～300 ℃ in temperature, and pressure is under the condition of 0.0005Torr～1ATM, and utilizing TEOS or silane reacting gass such as (silane) to form thickness is the silica inorganic cover layer 217 of 1～50 μ m.
After forming inorganic cover layer, can also carry out a planarization processing procedure.In addition, can prevent the destruction of aqueous vapor or foreign gas really in order to ensure organic EL component, also can add and impose inorganic barrier layer or first after inorganic barrier layer is set on the optical wavelength converting layer on the inorganic cover layer, the step (be the inorganic barrier layer 315 of Fig. 3, reach the inorganic barrier layer 415,419 of Fig. 4) of inorganic cover layer is set on this inorganic barrier layer again.This protective layer thickness is 500 * 10
-10M～5000 * 10
-10M can reach required effect really.
In sum; the present invention utilizes the characteristic of inorganic matter to make inorganic cover layer on the glass substrate to replace the organic coating layer and the protective layer of common structure; and the effect of inorganic cover layer blocks moisture and foreign matter gas organic coating layer commonly used is good; therefore can effectively avoid Organic Light-Emitting Device and cause damaging because of moisture or foreign matter gas; really have the progressive on the industry, and structure of the present invention does not see the board structure of existing full-color organic electroluminescence display.
Claims (40)
1, a kind of board unit of display is characterized in that, comprises:
One transparency carrier;
One optical wavelength converting layer is positioned on this substrate;
One inorganic cover layer is coated on this optical wavelength converting layer;
Wherein this board unit can be in order to carry an organic luminescent assembly, to constitute a display.
2, the board unit of display as claimed in claim 1 is characterized in that, the thickness of this inorganic cover layer is 1～50 μ m.
3, the board unit of display as claimed in claim 1 is characterized in that, also comprises an inorganic barrier layer that places on the optical wavelength converting layer.
4, the board unit of display as claimed in claim 1 is characterized in that, also comprises an inorganic barrier layer that places on the inorganic cover layer.
As the board unit of claim 3 or 4 described displays, it is characterized in that 5, the thickness of this inorganic barrier layer is 500 * 10
-10M～5000 * 10
-10M.
6, the board unit of display as claimed in claim 1, it is characterized in that the optional free oxidation silicon of the material of this inorganic cover layer, silicon nitride, nitrogen oxide silicon, carborundum, titanium oxide, titanium nitride, zirconia, zirconium nitride, aluminium oxide, aluminium nitride, tin oxide, indium oxide, lead oxide, boron oxide, calcium oxide, SiO
XC
iH
j, SiN
yC
iH
jAnd SiO
XN
yC
iH
jThe set that is constituted.
7, the board unit of display as claimed in claim 1 is characterized in that, this optical wavelength converting layer is a color filter layers, a color transition material layer or its combination.
8, the board unit of display as claimed in claim 1 is characterized in that, this inorganic cover layer can be sandwich construction.
As the board unit of claim 3 or 4 described displays, it is characterized in that 9, this inorganic barrier layer can be sandwich construction.
10, the board unit of display as claimed in claim 1 is characterized in that, this substrate material can be glass, quartz or plastics.
11, the board unit of display as claimed in claim 1 is characterized in that, this transparency carrier is to have as the active array of tft array or the substrate of passive array.
12, a kind of display is characterized in that, comprises:
One transparency carrier;
One optical wavelength converting layer is positioned on this substrate;
One inorganic cover layer is coated on this optical wavelength converting layer; And
One organic luminescent assembly is positioned on this inorganic cover layer.
13, display as claimed in claim 12 is characterized in that, the thickness of this inorganic cover layer is 1～50 μ m.
14, display as claimed in claim 12 is characterized in that, also comprises an inorganic barrier layer that places on the optical wavelength converting layer.
15, display as claimed in claim 12 is characterized in that, also comprises an inorganic barrier layer that places on the inorganic cover layer.
As the display of claim 14 or 15, it is characterized in that 16, the thickness of this inorganic barrier layer is 500 * 10
-10M～5000 * 10
-10M.
17, display as claimed in claim 12, it is characterized in that the optional free oxidation silicon of the material of this inorganic cover layer, silicon nitride, nitrogen oxide silicon, carborundum, titanium oxide, titanium nitride, zirconia, zirconium nitride, aluminium oxide, aluminium nitride, tin oxide, indium oxide, lead oxide, boron oxide, calcium oxide, SiO
XC
iH
j, SiN
yC
iH
jAnd SiO
XN
yC
iH
jThe set that is constituted.
18, display as claimed in claim 12 is characterized in that, this optical wavelength converting layer is a color filter layers, a color transition material layer or its combination.
19, display as claimed in claim 12 is characterized in that, this inorganic cover layer can be sandwich construction.
As claim 14 or 15 described displays, it is characterized in that 20, this inorganic barrier layer can be sandwich construction.
21, display as claimed in claim 12 is characterized in that, this organic luminescent assembly can by Organic Light Emitting Diode or polymer LED be constituted.
22, display as claimed in claim 12 is characterized in that, this substrate material can be glass, quartz or plastics.
23, display as claimed in claim 12 is characterized in that, this transparency carrier is the active array that has as tft array, or the substrate of passive array.
24, a kind of board unit manufacture method of display is characterized in that, comprises the following step:
Prepare a transparency carrier;
On this substrate, form an optical wavelength converting layer; And
On this optical wavelength converting layer, form an inorganic cover layer.
25, board unit manufacture method as claimed in claim 24 is characterized in that, this forms the inorganic cover layer step can use chemical vapour deposition technique, and the thickness of inorganic cover layer is 1～50 μ m.
26, board unit manufacture method as claimed in claim 24 is characterized in that, this forms inorganic cover layer step available physical vapour deposition process and forms, and the thickness of inorganic cover layer is 1～50 μ m.
27, board unit manufacture method as claimed in claim 24 is characterized in that, this forms the inorganic cover layer step and can form with the SOG method, and the thickness of inorganic cover layer is 1～50 μ m.
28, board unit manufacture method as claimed in claim 24 is characterized in that, this formation inorganic cover layer step is to be 20～300 ℃ in temperature, and pressure is to carry out under the environment of 0.0005Torr～1ATM.
29, board unit manufacture method as claimed in claim 24, it is characterized in that the optional free oxidation silicon of this inorganic cover layer, silicon nitride, nitrogen oxide silicon, carborundum, titanium oxide, titanium nitride, zirconia, zirconium nitride, aluminium oxide, aluminium nitride, tin oxide, indium oxide, lead oxide, boron oxide, calcium oxide, SiO
XC
iH
j, SiN
yC
iH
jAnd SiO
XN
yC
iH
jThe set that is constituted.
30, board unit manufacture method as claimed in claim 24 is characterized in that, also comprises a step that forms inorganic barrier layer on optical wavelength converting layer.
31, board unit manufacture method as claimed in claim 24 is characterized in that, also comprises a step that forms inorganic barrier layer on inorganic cover layer.
32, as claim 30 or 31 described board unit manufacture methods, it is characterized in that the thickness of this inorganic barrier layer is 500 * 10
-10M～5000 * 10
-10M.
33, board unit manufacture method as claimed in claim 24 is characterized in that, this optical wavelength converting layer is a color filter layers, a color transition material layer or its combination.
34, board unit manufacture method as claimed in claim 24 is characterized in that, this inorganic cover layer can be sandwich construction.
35, as claim 30 or 31 described board unit manufacture methods, it is characterized in that this inorganic barrier layer can be sandwich construction.
36, board unit manufacture method as claimed in claim 24 is characterized in that, after forming inorganic cover layer, can also carry out a planarization processing procedure.
37, board unit manufacture method as claimed in claim 24 is characterized in that, this transparency carrier material can be glass, quartz or plastics.
38, board unit manufacture method as claimed in claim 24 is characterized in that, this transparency carrier is to have as the active array of tft array or the substrate of passive array.
39, board unit manufacture method as claimed in claim 25 is characterized in that, the step that forms this inorganic cover layer can be used PECVD, optical cvd, Cat-CVD, ICP-CVD or SWP-CVD.
40, board unit manufacture method as claimed in claim 26 is characterized in that, the step that forms this inorganic cover layer can be used vapour deposition method, sputtering method, electron beam evaporation plating method or ion beam vapour deposition method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410003274 CN1652642A (en) | 2004-02-03 | 2004-02-03 | Substrate assembly of display device and making method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410003274 CN1652642A (en) | 2004-02-03 | 2004-02-03 | Substrate assembly of display device and making method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1652642A true CN1652642A (en) | 2005-08-10 |
Family
ID=34867559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410003274 Pending CN1652642A (en) | 2004-02-03 | 2004-02-03 | Substrate assembly of display device and making method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1652642A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101346818B (en) * | 2005-09-29 | 2010-10-06 | 发光装置公司 | Wavelength-converting light-emitting devices |
| US8987708B2 (en) | 2007-09-26 | 2015-03-24 | Osram Opto Semiconductors Gmbh | Optoelectronic component |
| KR20170062595A (en) * | 2015-11-27 | 2017-06-08 | 삼성디스플레이 주식회사 | Color conversion panel, manufacturing method of the same and display device including the same |
| CN114822265A (en) * | 2019-05-30 | 2022-07-29 | 群创光电股份有限公司 | Optical device |
-
2004
- 2004-02-03 CN CN 200410003274 patent/CN1652642A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101346818B (en) * | 2005-09-29 | 2010-10-06 | 发光装置公司 | Wavelength-converting light-emitting devices |
| US8987708B2 (en) | 2007-09-26 | 2015-03-24 | Osram Opto Semiconductors Gmbh | Optoelectronic component |
| KR20170062595A (en) * | 2015-11-27 | 2017-06-08 | 삼성디스플레이 주식회사 | Color conversion panel, manufacturing method of the same and display device including the same |
| CN106814495A (en) * | 2015-11-27 | 2017-06-09 | 三星显示有限公司 | Color conversion panel, its manufacture method and the display device including color conversion panel |
| US11048029B2 (en) | 2015-11-27 | 2021-06-29 | Samsung Display Co., Ltd. | Color conversion panel, manufacturing method of the same, and display device including the same |
| KR102461106B1 (en) | 2015-11-27 | 2022-10-31 | 삼성디스플레이 주식회사 | Color conversion panel, manufacturing method of the same and display device including the same |
| CN114822265A (en) * | 2019-05-30 | 2022-07-29 | 群创光电股份有限公司 | Optical device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2115798B1 (en) | Process for forming moisture barrier coatings for organic light emitting diode devices | |
| US6781148B2 (en) | Light emitting device | |
| JP4040850B2 (en) | Light emitting element | |
| US7696683B2 (en) | Organic electroluminescent element and the manufacturing method | |
| JP6465389B2 (en) | Transparent substrate for optical element, polarizing plate for liquid crystal display device using the same, and organic electroluminescence element | |
| US20070132375A1 (en) | Electronic device comprising a protective barrier layer stack | |
| CN1815748A (en) | Double-side displaying apparatus | |
| US20080105370A1 (en) | Composite articles having diffusion barriers and devices incorporating the same | |
| CN1656626A (en) | Mechanically flexible organic electroluminescent device with directional light emission | |
| CN1399502A (en) | Plate display and its protecting layer forming process | |
| TWI823257B (en) | Organic light-emitting diode (oled) display devices with uv-cured filler and manufacturing method thereof | |
| CN1901246A (en) | Self-emission panel and method of manufacturing same | |
| US10483489B2 (en) | Integrated circular polarizer and permeation barrier for flexible OLEDs | |
| CN101051674A (en) | System for displaying images including electroluminescent device and method for fabricating the same | |
| CN100444699C (en) | Two-side display apparatus | |
| US11038142B2 (en) | Lighting device and display apparatus | |
| CN1541031A (en) | Organic electroluminessence panel and mfg. method thereof | |
| US20070164673A1 (en) | Organic electro-luminescent display device and method for making same | |
| CN1652642A (en) | Substrate assembly of display device and making method thereof | |
| US20030207050A1 (en) | Polymeric substrate for display and light emitting devices | |
| JP2003059643A (en) | Electroluminescence element | |
| KR20060099743A (en) | Organic electroluminescence display | |
| KR102407539B1 (en) | Hard-coating layer, Method of fabricating the same and Display device including the same | |
| CN1882208A (en) | Organic electroluminescence display with top lighting structure | |
| CN100380704C (en) | Organic light-emitting display panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |