CN1651901A - Check plate - Google Patents
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- CN1651901A CN1651901A CN 200410004082 CN200410004082A CN1651901A CN 1651901 A CN1651901 A CN 1651901A CN 200410004082 CN200410004082 CN 200410004082 CN 200410004082 A CN200410004082 A CN 200410004082A CN 1651901 A CN1651901 A CN 1651901A
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- inspection panel
- face
- heat
- heating radiator
- coated
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- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
The present invention relates to an inspecting board for simulating bound condition of a first device and a second device, and utilizing said bound condition to judge that the pasty medium coated quantity and distribution range on interface between said first device and second device after which are bound are proper or not. Said inspecting board includes a simulation portion and sighting surface whose back is opposite to said simulation portion. After the inspecting board is combined with said second device, the simulation portion can be sighted by means of sighting surface, so that the diffusion condition of the pasty medium can be sighted so as to further obtain a standard coating quantity.
Description
Technical field
The relevant a kind of instruments of inspection of the present invention with analog capability, this refers to a kind of inspection panel especially, it can simulate one first device ground in conjunction with one second device, uses the standard amount of being coated with of knowing a paste medium by inference, for this first and second device actual in conjunction with the time utilize.
Background technology
In the assembling occasion of mechanism, often need a device is incorporated into another device, and for specific purpose, simulation part between this stream oriented device and coated paste medium with specific function.With the chip on the circuit board shown in Figure 87 70 is example, and this chip 70 is SIS651 chipsets, and its bottom has substrate 71, and the top has metal circular heat sink 72, and the encapsulation pattern is BGA structure dress.Because this chip 70 can produce high heat when running; therefore; must on this chip 70, supply heat transmission in conjunction with a heating radiator 8; and connect facial part temperature conductivity in order to increase; usually can be coated with the paste medium that one deck heat conduction is used on the simulation part between this chip 70 and this heating radiator 8, for example heat-conducting cream 9.
As Fig. 8 and shown in Figure 9, in the actual fabrication operation, this heat-conducting cream 9 is not really to use " being coated with ", but extrudes an amount of heat-conducting cream 9 to this chip 70.Then, utilize suitable facility that the plug 80 of this heating radiator 8 is headed in the perforation 73 on this circuit board 7, use firmly this heating radiator 8 is incorporated into this circuit board 7.At this moment because chip 70 just is close on the surface 81 of heating radiator 8, make heat-conducting cream 9 because of pressurized to external diffusion, and the amount of heat-conducting cream 7 the more the time scope of diffusion wider; Otherwise the scope of diffusion is littler.Therefore, just can judge that should bestow how many heat-conducting creams 9 originally is only an amount of according to the spread condition of this heat-conducting cream 9.For instance, the heat-conducting cream of supposing originally to be extruded 9 is an amount of, and so, after heating radiator 8 was incorporated into this circuit board 7, the range of scatter of this heat-conducting cream 9 should be same as the area of this circle heat sink 72 haply.
Because the chip 70 that carries on each circuit board 7 and the size of heating radiator 8 all are not quite similar, so the consumption of heat-conducting cream 9 also can some difference.That is to say, the standard amount of being coated with that chip 70 circuit boards that heat-conducting cream 9 correspondences are different and heating radiator 8 should be had nothing in common with each other, the beginning can obtain the thermal grease coating scope an of the best.If this heating radiator 8 is actual be bonded to this circuit board 7 before, just can correctly know each chip 70 circuit board and the heating radiator 8 pairing standard amounts of being coated with by inference, just can avoid heat-conducting cream 9 to be coated with the shortcoming that quantity not sufficient or excess are derived effectively.
Although it is considerable knowing the standard amount of being coated with of heat-conducting cream 9 in advance by inference, yet, because both all can't have an X-rayed chip 70 circuit boards and heating radiator 8, therefore, after this circuit board 7 and heating radiator 8 combine, can't observe the diffusion situation of this heat-conducting cream 7, so that can't know the standard amount of being coated with of heat-conducting cream 9 in advance by inference at all.
Existing judge the thermal grease amount of being coated with and coating scope (diffusion situation) whether suitable way be will chip 70 circuit boards, thermal grease and heating radiator 8 threes earlier in conjunction with after separated again, observe the diffusion situation of this heat-conducting cream 9 then.But, this way not only bothers bothersome, and the range of scatter of heat-conducting cream 9 is easy to be destroyed because separating the action of these chip 70 circuit boards and heating radiator 8, making observed is not actual diffusion situation to the diffusion situation, so that whether the heat-conducting cream 9 that is difficult to judge rightly out originally and is bestowed is an amount of.Moreover whether an amount of this separating chips 70 circuit boards and heating radiator 8 are easy to undermine the part on chip 70 circuit boards or the heating radiator 8 to inspect heat-conducting cream 9 mode in the operating process that separates, and for example plug 80, and this also can increase cost extraly.
Generally speaking, how before the actual chip 8 that is bonded to this circuit board 7 of this heating radiator 9, fast and judge rightly its both in conjunction with the standard amount of being coated with of required heat-conducting cream 9; Perhaps, more in a broad sense, how a device actual in conjunction with another device before, predict the standard amount of being coated with of needed paste medium between this stream oriented device fast and correctly, be problem quite important and that need to be resolved hurrily.
Summary of the invention
The purpose of this invention is to provide a kind ofOne device is actual in before another device, can be fast and correctly predict the inspection panel of the standard amount of being coated with of needed paste medium between this stream oriented device.
Inspection panel of the present invention, its outward appearance are the part surface profile (profile) of simulation one first device, for example thickness, length and width.Combine with second device by this inspection panel, whether the amount of being coated with that just can know the paste medium between this first device and this second device by inference is suitable, and then obtains a standard amount of being coated with.
Particularly, this inspection panel comprise a simulation part, one in conjunction with joint portion and of this second device back in the face of inspecting of this simulation part.Wherein, by this joint portion in conjunction with this second the device after, this simulation part will be close to the surface of this second device, and thereby make the diffusion of this paste medium pressurized ground, at this moment, just can inspect the face perspective by this and inspect the diffusion-condition of this paste medium to this simulation part, and then the standard amount of being coated with of knowing by inference is for all utilizations.In other words, in the actual assembling operation each time of this first device in conjunction with this second device, just can bestow the paste medium according to this standard amount of being coated with, use the assembling operation of guaranteeing each time, all be unlikely the paste medium and apply deficiency or apply excessive situation generation.
Inspection panel of the present invention has a simulation part especially.Particularly, this simulation part be this first device of simulation to should second the appearance profile (thickness, length with and width) of part of device, in other words, the form of simulation part at least will be similar in appearance to this first device to should second part of installing.Therefore, this inspection panel just can be simulated this first device by this simulation part and more realistically in conjunction with this second device, and then the standard amount of being coated with of more correctly knowing by inference is for all utilizations.
In addition, the present invention also provides a kind of observational technique, be to use an inspection panel with after simulating one first device and one second device combining, the coating condition of one paste medium between the surface between first device and second device, inspection panel comprises that a simulation part and inspects face, simulation part is the appearance profile of at least one part of simulation first device, and has a faying face, fit in itself and second surface of installing, the face of inspecting is then back in this faying face, and this analogy method comprises the following step at least: (1) provides between the faying face and the surface of second device of paste medium in inspection panel; (2) the pressing inspection panel and second device, and (3) inspect the diffusion-condition of this paste medium between faying face and surface via the face of inspecting.
Moreover aforesaid inventive method comprises that also one uses pattern to judge whether the diffusion-condition of this paste medium closes the step in standard.
For further specifying above-mentioned purpose of the present invention, design feature and effect, the present invention is described in detail below with reference to accompanying drawing.
Description of drawings
Fig. 1 is the stereo appearance figure that discloses first embodiment of the invention.
Fig. 2 is the sectional schematic diagram of first embodiment of the invention in conjunction with heating radiator.
Fig. 3 is the vertical view of first embodiment of the invention in conjunction with heating radiator.
Fig. 4 is the stereographic map of second embodiment of the invention.
Fig. 5 is the sectional schematic diagram of second embodiment of the invention in conjunction with heating radiator.
Fig. 6 is the vertical view of second embodiment of the invention in conjunction with heating radiator.
Fig. 7 is the sectional schematic diagram of third embodiment of the invention in conjunction with heating radiator.
Fig. 3 to Fig. 9 is the assembling process synoptic diagram that discloses a circuit board and a heating radiator.
Embodiment
In explanation subsequently, will continue to use Fig. 7,8 circuit boards that disclosed 7 and heating radiator 8, use explanation the present invention and how to simulate these circuit board 7 ground in conjunction with this heating radiator 8.Yet this only is a usefulness for convenience of description, and in fact, the present invention can also simulate other device, and combined device also is not limited only to heating radiator 8, and heat-conducting cream 9 also can be the paste medium with other specific function, for example conducting resinl.
The present invention is in order to simulating the apparent size (for example surface profile, area and thickness etc.) of at least one part of one first device, and simulation part of the present invention can have an X-rayed, and therefore can attempt obtaining the best amount of being coated with after the different thermal grease amounts of being coated with for several times.So, just this best amount of being coated with can be applied to first device and one second actual the combination in the production process of installing, so that at first device practically with before one second device combines, just can be fast and the standard amount of being coated with of the needed paste medium between this stream oriented device of judging rightly.Corresponding to embodiment subsequently, this first device includes but not limited to circuit board 7 (containing the chip 70 on it), and second device includes but not limited to heating radiator 8, and the paste medium includes but not limited to heat-conducting cream 9.
In first embodiment shown in Fig. 1,2, inspection panel 1 is the part (being the appearance profile of circuit board 7 sub-fractions and this chip 70) that 7 pairs of the circuit boards of simulation drawing 8 should heating radiator 8, and has coated some heat-conducting creams 9 on the surface 81 of this heating radiator 8.Wherein, this inspection panel 1 is made by transparent material, and it comprises:
One simulation part 10; And
One inspects face 11, is back in this simulation part 10.
This inspection panel 1 also can comprise several fixed orifices 120, and this fixed orifice 120 is to run through that thickness of slab ground is communicated with this simulation part 10 and this inspects face 11.
As shown in Figure 2, heating radiator 8 can utilize plug 80 eye-splices on it in fixed orifice 120, makes that inspection panel 1 not only can be firmly in conjunction with this heating radiator 8, and its simulation part 10 and thereby be close to the surface 81 of this heating radiator 8.At this moment, originally be coated in the heat-conducting cream 9 of surface on 81 because of the compressing on the surface 81 of the simulation part 10 that is subjected to this inspection panel 1 and this heating radiator 8 to external diffusion.In this first embodiment, because this inspection panel is by the made plate body of transparent material, therefore, can be as shown in Figure 3 inspect face 11 perspectives inspect heat-conducting cream 9 to this simulation part 10 diffusion-condition (this inspection panel can be inspected face perspective to the means of this simulation part by this and be not limited to use transparent material) by this.So, just, can use the diffusion-condition of judging this heat-conducting cream 9 and whether close conformance with standard.If below standard standard represents that promptly this heat-conducting cream 9 was coated with insufficiently originally, and represent that promptly this heat-conducting cream 9 was coated with too much originally if be above standard.
Judge that for convenience this is inspected and can establish one on the face 11 and inspect face 13, use and assist to judge whether the heat-conducting cream 9 that was coated with originally is an amount of, or say so and do not close the standard amount of being coated with in predetermined.Though do not limit the form that this inspects face 13 especially, in this first embodiment, inspect face 13 at this and propose a preferable example.That is, this inspects face 13 is to be a pattern, a ring-type scope for example, and it comprises one first circular pattern 131 and one second circular pattern 132, and this second circular pattern 132 is to be positioned at first circular pattern 131 with one heart, and second circular pattern 132 is positioned at inner ring.Wherein, the mode of first circular pattern 131 and second circular pattern 132 forms and indefinite, and the mode of available picture forms, and also can form with the mode of carving.In any case, inspect face 13 at this and comprise under one first circular pattern 131 and one second circular pattern, 132 situations, can obtain following three kinds of possible results that inspect:
Inspecting the result for first kind is: (range of scatter of this heat-conducting cream 9)＞(this first circular pattern), that is the range of scatter of this heat-conducting cream 9 exceeded the scope of this first circular pattern, this expression originally this heat-conducting cream 9 be coated with too much;
Inspecting the result for second kind is: (range of scatter of this heat-conducting cream 9)＜(this second circular pattern 132), that is the range of scatter of this heat-conducting cream 9 do not exceed the scope of this second circular pattern, this expression originally this heat-conducting cream 9 be coated with very little;
The third inspects the result: (this first circular pattern 131) 〉=(range of scatter of this heat-conducting cream 9) 〉=(this second circular pattern 132), that is the range of scatter of this heat-conducting cream 9 exceeds the scope of second circular pattern but does not exceed the scope of this first circular pattern, the heat-conducting cream 9 that this expression was coated with originally is an amount of, just for planting the standard amount of being coated with of circuit board 7 and heating radiator 8.
Therefore, after this inspection panel 1 is in conjunction with this heating radiator 8, if inspect the diffusion-condition of this heat-conducting cream 9 be accord with this third inspect the result, can judge that promptly the heat-conducting cream 9 that was coated at that time on this heating radiator 8 is an amount of, that is to say that the amount of being coated with of this heat-conducting cream 9 is the standard amounts of being coated with.By such mode, can know easily should circuit board 7 and the standard amount of being coated with of this heating radiator 8, and then, in the assembling operation each time on the actual chip 9 that is bonded to this circuit board 7 of this heating radiator 8, just can according to this standard amount of being coated with bestow heat-conducting cream 9, use in the assembling operation of guaranteeing each time, all be unlikely heat-conducting cream 9 and apply deficiency or apply excessive situation generation.The more important thing is that this standard amount of being coated with is by obtaining in the experience of this inspection panel 1 in conjunction with this heating radiator 8, therefore, the acquisition of this standard amount of being coated with need not used this circuit board 7 fully.
With respect to the direct mode of using this circuit board 7 to obtain the standard amount of being coated with of this heat-conducting cream 9 of past, this mode of utilizing these inspection panel 1 these circuit board 7 ground of simulation to obtain this standard amount of being coated with of the present invention obviously has following advantage:
One, owing in the acquisition process of this standard amount of being coated with, do not use this circuit board 7 fully, therefore, this circuit board 7 does not have impaired anxiety fully in this process.
Two, because this inspection panel 1 is to inspect face 11 perspectives are inspected this heat-conducting cream 9 to these simulation part 10 ground diffusion-condition by this, therefore, when inspecting the spread condition of this heat-conducting cream 9, do not need to unload this inspection panel 1, and then, can be rapidly and whether more correctly judge the coated weight of this heat-conducting cream 9 an amount of.Inspect especially and be provided with one on the face 11 and inspect face 13 and this and inspect face 13 and comprise that the speed of judgement is faster and accuracy is also higher under the situation of above-mentioned first circular pattern 131 and second circular pattern 132 at this.
Three, can correctly obtain owing to this standard amount of being coated with, therefore, in the process on the chip 70 that this heating radiator 8 is assembled to practically this circuit board 7, do not have heat-conducting cream 9 and apply the situation generation that too much causes living waste, the situation that does not also have the radiating efficiency that undermines this heating radiator 8 because of heat-conducting cream 9 usefulness quantity not sufficients takes place.
In addition, what particularly point out is, above-mentioned fixed orifice 120 has two groups four, make two plugs 80 of this heating radiator 8 can be easily to one group of fixed orifice 120 wherein, this will promote the efficient that this heating radiator 8 is assembled to this circuit board 7 effectively.
Although the inspection panel 1 that this first embodiment is disclosed has above-mentioned advantage.Yet because the form of this inspection panel 1 part of analog circuit board 7 and chip 70 thereof veritably not, therefore, the result who simulates out has some errors unavoidably.In order to remedy this error to improve the accuracy of analog result, therefore, in second embodiment shown in Figure 4, disclose another kind of inspection panel 2, this inspection panel 2 has a simulation part 21 especially for analog circuit board 7 and chip 70 part corresponding to heating radiator 8.More particularly, this simulation part 21 has one first and partly 211 and 1 second partly 212 supplies to simulate respectively this circuit board 7 and this chip 70 appearance profile corresponding to heating radiator 8, therefore, this first part 211 will be adjacent to the part of chip 70 at least similar in appearance to this circuit board 7, and second part 212 at least will be similar in appearance to chip 70.In this second embodiment, in order to simulate this circuit board 7 and this chip 70, the thickness of this first part 211 is made the thickness of slab that is same as this circuit board 7, this second partly 212 shape and thickness then be made to be close to and be same as this chip 70 (part that contains its substrate 71), and this second partly 212 and to have a simulation part 213 be that the surface of chip 70 is for the surface 81 that is incorporated into this heating radiator 8.
Reach as shown in Figure 6 as Fig. 5, identical with this first embodiment is also to have a joint portion 22 on this inspection panel 2 for being incorporated into this heating radiator 8.This joint portion 22 is first parts 211 of being located at this simulation part 21, and it comprises four fixed orifices 221 equally, and profit is in a like fashion in conjunction with this heating radiator 8.This make simulation part 21 second partly 212 simulation part 213 be close to the surface 81 of this heating radiator 8, and thereby oppress this heat-conducting cream 9 to external diffusion.
Still see also shown in Fig. 5,6, identical with first embodiment is that inspection panel 2 is to be made by transparent material, and has the face of inspecting 23.Inspect face 23 and be back in simulation part 213, and can have an X-rayed the diffusion-condition of inspecting heat-conducting cream 9 to simulation part 213 ground.Are provided with one on the face 23 equally and inspect face 24 owing to inspect, and to inspect face 24 are ring-type scopes, it comprise one first circular pattern 241 and together heart be positioned at second circular pattern 242 of this first circular pattern 241.Whether therefore, this inspection panel 2 can follow the mode of this first embodiment, an amount of for the coated weight of judging this heat-conducting cream 9 apace.
Compared to this first embodiment, this inspection panel 2 not only has all advantages of this first embodiment, and also because special this simulation part 21 that forms makes it can simulate this circuit board 7 more realistically, uses the more accurate heat-conducting cream standard amount of being coated with that obtains.
Can learn that by second embodiment the present invention is is to form a simulation part 21 and a joint portion 22 on this inspection panel 2, and this simulation part 21 is that the part that correspondence is simulated has comprised part plate body, the chip 70 of circuit board 7 and the substrate 71 that supplies to carry this chip 70.The part of joint portion 22 corresponding simulations has then comprised the perforation 73 on the corresponding analog circuit board 7.Therefore, in further deducing, the present invention can only comprise the part of this simulation part 21 in fact.In other words, the present invention is in the 3rd embodiment shown in Figure 7, and its inspection panel 3 includes only the part of the simulation part 21 that is entirely identical to this second embodiment, and the effect that it reaches and this second embodiment are identical.
Claims (8)
1. an inspection panel installs and one second bonding state that installs in order to simulate one first, and this inspection panel comprises at least:
One simulation part is the appearance profile of at least a portion of this first device of simulation, and has the surface applying of a faying face and this second device;
One inspects face, is back in this simulation part, and wherein this simulation part is with after this second device combines, and the diffusion-condition of the paste medium of clamping between this faying face and this surface can be inspected face via this and inspect.
2. inspection panel as claimed in claim 1 is characterized in that this inspects mask one pattern is arranged, to judge the diffusion-condition of this paste medium.
3. inspection panel as claimed in claim 2 is characterized in that this pattern is to be a circular pattern.
4. inspection panel as claimed in claim 2 is characterized in that this pattern is to be a concentric circles.
5. inspection panel as claimed in claim 1 is characterized in that this first device is the chip on the circuit board.
6. inspection panel as claimed in claim 1 is characterized in that this second device is a heating radiator.
7. observational technique, be to use an inspection panel with after simulating one first device and one second device combining, the coating condition of one paste medium between the surface between this first device and this second device, this inspection panel comprises that a simulation part and inspects face, this simulation part is the appearance profile of at least one part of this first device of simulation, and the surface with a faying face and this second device fits, and this inspects face then back in this faying face, and this observational technique comprises the following step at least:
Provide between the faying face and this second surface of installing of this paste medium in this inspection panel;
This inspection panel of pressing and this second device, and
Inspect face via this and inspect the diffusion-condition of this paste medium between this faying face and this surface.
8. observational technique as claimed in claim 7 is characterized in that also comprising that utilization is made in this pattern of inspecting on the face and judges whether the diffusion-condition of this paste medium closes in standard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100040823A CN100360926C (en) | 2004-02-05 | 2004-02-05 | Check plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100040823A CN100360926C (en) | 2004-02-05 | 2004-02-05 | Check plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1651901A true CN1651901A (en) | 2005-08-10 |
| CN100360926C CN100360926C (en) | 2008-01-09 |
Family
ID=34867616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100040823A Expired - Fee Related CN100360926C (en) | 2004-02-05 | 2004-02-05 | Check plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100360926C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105252768A (en) * | 2015-09-14 | 2016-01-20 | 沈阳飞机工业（集团）有限公司 | Verifying cover plate and verifying method used for formation of special-shaped composite material foam interlayer workpiece |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0738022A (en) * | 1993-07-20 | 1995-02-07 | Sumitomo Kinzoku Ceramics:Kk | Ceramic package for semiconductor device |
| US5969949A (en) * | 1998-03-31 | 1999-10-19 | Sun Microsystems, Inc. | Interfitting heat sink and heat spreader slug |
| CN2392209Y (en) * | 1999-08-12 | 2000-08-16 | 林世仁 | Improved radiating rib contact surface structure |
| CN2531602Y (en) * | 2001-11-28 | 2003-01-15 | 佑仲实业股份有限公司 | Cooling plate and photoelectric heating assembly combined structure |
-
2004
- 2004-02-05 CN CNB2004100040823A patent/CN100360926C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105252768A (en) * | 2015-09-14 | 2016-01-20 | 沈阳飞机工业（集团）有限公司 | Verifying cover plate and verifying method used for formation of special-shaped composite material foam interlayer workpiece |
| CN105252768B (en) * | 2015-09-14 | 2017-06-27 | 沈阳飞机工业（集团）有限公司 | A kind of verification cover plate and method of calibration for the shaping of special-shaped composite foam layer product |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100360926C (en) | 2008-01-09 |
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