CN1647885A - Laser circular cutting punching method and its device - Google Patents
Laser circular cutting punching method and its device Download PDFInfo
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- CN1647885A CN1647885A CN 200410012697 CN200410012697A CN1647885A CN 1647885 A CN1647885 A CN 1647885A CN 200410012697 CN200410012697 CN 200410012697 CN 200410012697 A CN200410012697 A CN 200410012697A CN 1647885 A CN1647885 A CN 1647885A
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Abstract
The present invention discloses laser circular cutting punching method and device. The method includes converting circular laser beam into ring laser beam, focusing the ring laser beam, regulating the processed sheet to the focus and forming ring laser spot on the sheet to be processed so as to melt and gasify the sheet material forming hole through circular cutting. The device includes mainly laser, image lens, and laser ring generator set between the laser and the image lens. The laser ring generator consists of one pair of separated negative conic light wedge and positive conic light wedge, and is used to perform the said conversion. The present invention has the features of wide processing hole aperture range, easy regulation of processing hole aperture, high processing efficiency, low cost, etc.
Description
Technical field
The present invention relates to laser drilling, refer to a kind of laser ring cutting drilling method and device thereof particularly, be used for the capillary processing of thin plate.
Background technology
Laser drilling is applied to the capillary processing of thin plate, existing long history.But the development of this technology is comparatively slow in recent years, and wherein processing the aperture wayward is one of its major technology difficult point.This be because: the transmission of laser is to be cylindric in the space of containing in its angle of divergence to carry out, on perpendicular to the cross section of the laser beam direction of propagation is the solid circles hot spot, its Energy distribution is in the area of this filled circles, be coniform after this laser beam focuses on by imaging len and converge, form focus point in intersection.If do not consider the blasting effect of focus point, the size of its penetration hole diameter and focal beam spot matches.After yet the version of laser and optical system thereof is determined, the size of its focal beam spot has also just been determined, can cause the focal beam spot diameter variation though change the focal length of imaging len, change also big or small influential to focal beam spot of power output, but do not have quantitative standards with this variation of controlling the micro-pore diameter of being processed.Simultaneously, for larger aperture such as aperture for the capillary processing in φ 0.4～1.0mm scope, because it is big that required focal beam spot diameter becomes, the laser of equal-wattage formed power density on focal beam spot will be geometric progression and descend, and causes finishing perforation processing.So present laser does not have any good method basically for the micropore of processing aperture in φ 0.4～1.0mm scope.And for the macropore of processing aperture more than φ 1.0mm, many at present employing laser carry out along the mode of its edge cuts.But it is existing laser cutting machine technical sophistication, apparatus expensive, inefficiency, and almost powerless to the capillary processing of smaller aperture due.The deficiency of above-mentioned several respects has hindered further developing of laser micropore process technology.
Summary of the invention
Purpose of the present invention will provide a kind of processing aperture wide accommodation, processing aperture size quantitatively to adjust exactly, and working (machining) efficiency height, laser ring cutting drilling method and device thereof that required cost is low.
For achieving the above object, the laser ring cutting drilling method that the present invention is designed, be to convert the rounded laser beam of cross section that laser generator is exported to laser beam that cross section is annular by ring of light maker, by imaging len the laser beam that cross section is annular is focused on again, simultaneously the pore size that obtains is as required adjusted processed thin plate is the laser beam of annular apart from cross section the position of focus point, the laser beam that makes cross section be annular forms the ring-shaped light spot of respective aperture size on processed thin plate, this ring-shaped light spot can be vaporized the light sheet material fusion that is projected, thereby realizes the ring cutting punching of processed thin plate.
In the said method, also can be by the preposition rounded laser beam of bundle device compression cross section that contracts, or/and be the laser beam of annular, with the volume of the laser ring cutting perforating device that dwindles this method of enforcement by the postposition bundle device compression cross section that contracts.
For implementing the custom-designed laser ring cutting of said method perforating device, comprise laser generator and imaging len, be provided with between said laser generator and the imaging len and make the rounded laser beam of cross section of laser generator output convert the ring of light maker that cross section is the laser beam of annular to, said ring of light maker is combined by the negative cone wedge and the normal cone body wedge of a pair of relative separation spatially, and this negative cone wedge and normal cone body wedge are center symmetric arrangement successively with the direction of propagation of laser beam.After the rounded laser beam of cross section is dispersed by negative cone wedge refraction earlier, converge by the refraction of normal cone body wedge again, convert the laser beam that cross section is annular to.
Further, between said laser generator and ring of light maker, also be provided with the preposition bundle device that contracts, or/and between said ring of light maker and imaging len, also be provided with the postposition bundle device that contracts.Restraint the compression of device by contracting, can correspondingly dwindle the size of ring of light maker and imaging len, thereby make the structure of whole device be tending towards light small and exquisite laser beam.
The invention has the advantages that: designed laser boring method will spatially be the laser beam of cylindric propagation, convert the laser beam of cylindrical propagation spatially to by ring of light maker, the cross section hot spot that makes laser beam becomes afterwards hollow ring by original filled circles.Like this, very big variation has taken place in the Energy distribution of laser beam, and its most concentration of energy are on annulus, rather than in the filled circles plane.So the laser beam of the equal-wattage of same laser generator output will form the very ring of light of high power density on annulus.After this annular hot spot focused on by imaging len, its size was adjusted the distance between processed thin plate and this focus point along with its different and different with the focus point distance, can make things convenient for to obtain different big or small annular hot spots exactly throw on processed thin plate.Because the energy that laser beam is propagated all concentrates on this annular hot spot, its higher power density has guaranteed to be undertaken by the annular spot size success of ring cutting punching.For the same same aperture of laser generator processing, because the required energy of annulus hot spot ring cutting is far below the required energy of solid hot spot perforation, so adopt the present invention to process the wider of aperture, can be suitable for metal or the punching of nonmetal thin plate of 0.1～2mm, and the size in processing aperture can be according to the position accurate quantification between processed thin plate and the focus point, and the ring cutting perforating efficiency is higher.Apparatus structure of the present invention is simple and reliable simultaneously, and cost is very cheap.
Description of drawings
Fig. 1 is the light path principle schematic diagram of laser ring cutting drilling method of the present invention;
Fig. 2 is a kind of structural representation of combined laser ring cutting perforating device;
Fig. 3 is a kind of structural representation of separate type laser ring cutting perforating device.
The specific embodiment
From laser ring cutting punching light path principle shown in Figure 1 as can be known: the laser beam 1 that cross section is rounded, after preposition bundle device 3 compressions of contracting, incide ring of light maker 4.Ring of light maker 4 adopts the negative cone wedge 4a and the normal cone body wedge 4b of a pair of relative separation spatially to combine, the center of the laser beam 1 that the installation axle center of negative cone wedge 4a and normal cone body wedge 4b and cross section are rounded overlaps, and bears the coning angle of cone wedge 4a and normal cone body wedge 4b and should avoid taking place total reflection.This circle laser beam 1 is dispersed, is converged through normal cone body wedge 4b refraction through negative cone wedge 4a refraction in ring of light maker 4, the cross section of output collimation is the laser beam 2 of annular, this annular laser beam 2 is reduced into thinner annular laser beam through postposition bundle device 5 compression of contracting again, focuses on the processed thin plate 7 by imaging len 6 at last.The energy of laser beam is not loss basically in this process, just all shifts having focused on the annulus from original filled circles zone.Regulate the imaging size of annular laser beam 2 on processed thin plate 7, can form the hot spot annulus of different sizes, and then be processed into the through hole of different-diameter.
Combined laser ring cutting perforating device as shown in Figure 2, has an optical bench 10 that installs and fixes various parts, be furnished with laser generator 8, preposition contract bundle device 3, ring of light maker 4, postposition contract bundle device 5 and 45 ° of laser reflection framves 11 on the level table of this optical bench 10 from left to right successively, be furnished with imaging len 6 on the right vertical sidewall of this optical bench 10, various parts all can be adjusted position and fixing by mounting bracket 9.Processed thin plate 7 is placed near the focus point of imaging len 6 belows, and the aperture size that can process is as required carried out the position adjustment.The negative cone wedge 4a of its ring of light maker 4 and normal cone body wedge 4b are fixed in the sleeve, its compact conformation, and the adjusting in light path is easy, but can not finely tune, and indexs such as its axiality are guaranteed by the crudy of itself.
Separate type laser ring cutting perforating device as shown in Figure 3, its structure and combinations thereof formula laser ring cutting perforating device are basic identical, just the negative cone wedge 4a of its ring of light maker 4 is fixed on respectively in the different sleeves with normal cone body wedge 4b, it can be adjusted at interval as required, the big more formed ring of light is also big more at interval, and the width of the ring of light is also thin more with respect to ring diameter.Though its Installation and Debugging are comparatively complicated, indexs such as its axiality can realize by accurate the adjustment, can revise the error that itself crudy is brought.
When above-mentioned two kinds of laser ring cutting perforating devices are worked, the rounded laser beam 1 of cross section from laser generator 8 outputs, after preposition bundle device 3 compressions of contracting, enter ring of light maker 4, in ring of light maker 4 after negative cone wedge 4a refraction tapered dispersing, converge after normal cone body wedge 4b refraction, the cross section of output level collimation is the laser beam 2 of annular again; This annular laser beam 2 is injected the postposition bundle device 5 that contracts then, is compressed and is reduced into thinner annular laser beams, and turn back into vertical annular laser beams by 45 ° of laser reflection framves 11, focuses on by imaging len 6 at last to project on the processed thin plate 7.Regulate the imaging size of annular laser beams on processed thin plate 7, can form the hot spot annulus of different sizes, be processed into the through hole of different-diameter.
Claims (6)
1. laser ring cutting drilling method, it is characterized in that: this method is to convert the rounded laser beam (1) of cross section that laser generator (8) is exported to laser beam (2) that cross section is annular by ring of light maker (4), by imaging len (6) laser beam (2) that cross section is annular is focused on again, simultaneously the pore size that obtains is as required adjusted processed thin plate (7) is the laser beam (2) of annular apart from cross section the position of focus point, the laser beam (2) that makes cross section be annular is gone up the ring-shaped light spot that forms the respective aperture size at processed thin plate (7), this ring-shaped light spot can be vaporized the light sheet material fusion that is projected, thereby realizes the ring cutting punching of processed thin plate (7).
2. laser ring cutting drilling method according to claim 1, it is characterized in that: this method is after the laser beam (1) that said cross section is rounded compresses by the preposition bundle device (3) that contracts, to convert thereof into the laser beam (2) that said cross section is annular by ring of light maker (4) again.
3. laser ring cutting drilling method according to claim 1 and 2 is characterized in that: to be laser beam (2) that said cross section is annular contract after bundle device (5) compression by postposition this method, by imaging len (6) it focused on again.
4. laser ring cutting perforating device of implementing the described method of claim 1, comprise laser generator (8) and imaging len (6), it is characterized in that: be provided with the ring of light maker (4) that the rounded laser beam (1) of cross section that makes laser generator (8) output converts the laser beam (2) that cross section is annular between said laser generator (8) and the imaging len (6), said ring of light maker (4) is combined by the negative cone wedge (4a) and the normal cone body wedge (4b) of a pair of relative separation spatially, and this negative cone wedge (4a) and normal cone body wedge (4b) are center symmetric arrangement successively with the direction of propagation of laser beam.
5. laser ring cutting perforating device according to claim 4 is characterized in that: the preposition bundle device (3) that contracts that also is provided with the rounded laser beam (1) of compression cross section between said laser generator (8) and the ring of light maker (4).
6. according to claim 4 or 5 described laser ring cutting perforating devices, it is characterized in that: also be provided with postposition that the compression cross section is the laser beam (2) of the annular bundle device (5) that contracts between said ring of light maker (4) and the imaging len (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100126970A CN100457362C (en) | 2004-01-30 | 2004-01-30 | Laser circular cutting punching method and its device |
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2004100126970A CN100457362C (en) | 2004-01-30 | 2004-01-30 | Laser circular cutting punching method and its device |
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| CN1647885A true CN1647885A (en) | 2005-08-03 |
| CN100457362C CN100457362C (en) | 2009-02-04 |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101966623A (en) * | 2010-11-05 | 2011-02-09 | 山东理工大学 | Device for cutting circle and arc by laser |
| CN102436066A (en) * | 2011-12-29 | 2012-05-02 | 江苏大学 | Method and device for adjusting internal/external diameters of hollow beams |
| CN104955605A (en) * | 2013-02-05 | 2015-09-30 | 株式会社V技术 | Laser processing apparatus and laser processing method |
| CN105458508A (en) * | 2013-11-07 | 2016-04-06 | 国核电站运行服务技术有限公司 | Laser overlaying method for inner wall of small-caliber tube |
| CN106624355A (en) * | 2017-02-23 | 2017-05-10 | 常州特尔玛枪嘴有限公司 | Laser cutting head capable of regulating pot energy density distribution |
| CN106970471A (en) * | 2017-05-26 | 2017-07-21 | 北京华岸科技有限公司 | Optical beam transformation device and laser aid |
| CN107775187A (en) * | 2016-08-31 | 2018-03-09 | 上海微电子装备（集团）股份有限公司 | A kind of laser package apparatus and method |
| CN109676269A (en) * | 2019-01-31 | 2019-04-26 | 大族激光科技产业集团股份有限公司 | A kind of the laser pre-segmentation method and device of LED wafer |
| CN112935593A (en) * | 2021-02-09 | 2021-06-11 | 北京工业大学 | Process method for ultraviolet picosecond laser focus-variable circular cutting in-vitro bone drill carbonization-free deep hole |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101745740B (en) * | 2009-12-23 | 2013-07-10 | 江苏大学 | Metal plate material ring-shaped light spot laser impact forming method and device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS5827118A (en) * | 1981-08-11 | 1983-02-17 | Toshiba Corp | Irradiating method for laser light |
| US4623776A (en) * | 1985-01-03 | 1986-11-18 | Dow Corning Corporation | Ring of light laser optics system |
| JPS61186187A (en) * | 1985-02-13 | 1986-08-19 | Mitsubishi Electric Corp | Laser beam processing device |
| IE912667A1 (en) * | 1991-07-29 | 1993-02-10 | Trinity College Dublin | Laser Profiling of Lens Edge |
| JPH05287362A (en) * | 1992-04-15 | 1993-11-02 | Brother Ind Ltd | Heat treatment method of circuilar surface |
| CN2690098Y (en) * | 2004-01-30 | 2005-04-06 | 武汉天宇激光数控技术有限责任公司 | Laser circular cutting and perforating device |
-
2004
- 2004-01-30 CN CNB2004100126970A patent/CN100457362C/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101966623A (en) * | 2010-11-05 | 2011-02-09 | 山东理工大学 | Device for cutting circle and arc by laser |
| CN102436066A (en) * | 2011-12-29 | 2012-05-02 | 江苏大学 | Method and device for adjusting internal/external diameters of hollow beams |
| CN104955605A (en) * | 2013-02-05 | 2015-09-30 | 株式会社V技术 | Laser processing apparatus and laser processing method |
| TWI627009B (en) * | 2013-02-05 | 2018-06-21 | V科技股份有限公司 | Laser processing device and laser processing method |
| CN104955605B (en) * | 2013-02-05 | 2019-07-19 | 株式会社V技术 | Laser processing device, laser processing |
| CN105458508A (en) * | 2013-11-07 | 2016-04-06 | 国核电站运行服务技术有限公司 | Laser overlaying method for inner wall of small-caliber tube |
| CN105458508B (en) * | 2013-11-07 | 2017-08-25 | 国核电站运行服务技术有限公司 | Small-bore pipe inner wall laser overlaying method |
| CN107775187A (en) * | 2016-08-31 | 2018-03-09 | 上海微电子装备（集团）股份有限公司 | A kind of laser package apparatus and method |
| CN106624355A (en) * | 2017-02-23 | 2017-05-10 | 常州特尔玛枪嘴有限公司 | Laser cutting head capable of regulating pot energy density distribution |
| CN106970471A (en) * | 2017-05-26 | 2017-07-21 | 北京华岸科技有限公司 | Optical beam transformation device and laser aid |
| CN109676269A (en) * | 2019-01-31 | 2019-04-26 | 大族激光科技产业集团股份有限公司 | A kind of the laser pre-segmentation method and device of LED wafer |
| CN112935593A (en) * | 2021-02-09 | 2021-06-11 | 北京工业大学 | Process method for ultraviolet picosecond laser focus-variable circular cutting in-vitro bone drill carbonization-free deep hole |
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| CN100457362C (en) | 2009-02-04 |
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Owner name: WUHAN GONGYAN OPTICAL SCIENCE AND TECHNOLOGY CO., Free format text: FORMER OWNER: WUHAN TIANYU LASER CNC TECHNOLOGY CO., LTD. Effective date: 20090918 |
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Effective date of registration: 20090918 Address after: No. 30, Jiang Da Road, Jiang'an District, Hubei, Wuhan Patentee after: Wuhan Gongyan Optical Technology Liability Co., Ltd. Address before: No. 30, Jiang Da Road, Jiang'an District, Hubei, Wuhan Patentee before: Tianyu Laser Digital Control Technology Co., Ltd., Wuhan |
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