CN1642384A - Noise-suppressed dielectric structure and its manufacturing method - Google Patents
Noise-suppressed dielectric structure and its manufacturing method Download PDFInfo
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- CN1642384A CN1642384A CN 200410015050 CN200410015050A CN1642384A CN 1642384 A CN1642384 A CN 1642384A CN 200410015050 CN200410015050 CN 200410015050 CN 200410015050 A CN200410015050 A CN 200410015050A CN 1642384 A CN1642384 A CN 1642384A
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Abstract
The invention is a noise inhibiting dielectric structure, applied to a printed circuit board (PCB). It dopes the metal particles generated by striking the surface of metal plate into dielectric material to increase dielectric constant of the dielectric material. Therefore, the decoupled capacitance value formed by the dielectric layer of the PCB can be relatively increased, thus achieving the effect of filtering the noise.
Description
Technical field
A kind of noise suppression arrangement and manufacture method thereof have been the present invention relates to, particularly the dielectric structure and the manufacture method thereof of the noise suppressed between a kind of two patterned line layer of printed circuit board (PCB).
Background technology
The internal layer of printed circuit board (PCB) (PCB) be by multi-layered patterned line layer (interconnect layer) and multilayer dielectric layer (dielectric layer) alternately coincide constitute.Wherein patterned line layer is for example formed through the development etching by copper foil layer (copperfoil), and dielectric layer is to be configured between the patterned line layer, in order to isolate patterned line layer.In addition, between the patterned line layer that changes mutually be by through hole (Planting Through Hole, PTH) or conductive hole (via) and being electrically connected to each other.
Generally speaking, the endothecium structure of traditional printing circuit board can be divided into Layer increasing method (build-up) and storehouse pressing method (laminated) dual mode haply.Wherein, Layer increasing method is to form a plurality of perforates among patterned line layer that two-phase changes and dielectric layer, and inserts conductive materials, in order to electrically connect line layers such as signals layer, bus plane and ground plane.In addition, storehouse pressing method is with after patterned line layer and the dielectric layer stack, mode with machine drilling runs through circuit board again, to form a plurality of perforations, then form an electrodeposited coating on the madial wall of perforation in the mode of electro-coppering again, or fill a conductive material in perforation, in order to electrically connect line layers such as signals layer, bus plane and ground plane.At last, be disposed at the various elements (active member, passive device) on the printed circuit board (PCB), can reach the purpose of electronic signal transmission (electrical signalpropagation) by the circuit design of interior connection.
Be illustrated in figure 1 as the generalized section of existing a kind of printed circuit board (PCB).Printed circuit board (PCB) 100 has an internal layer 110, and the outermost layer of internal layer 110 is a signals layer 112, in order to electrically connect a plurality of active members 10 or passive device 20.In addition, internal layer 110 also has a bus plane (power plane) 114, and bus plane 114 is to be electrically connected by conductive hole 102 and signals layer 112, and bus plane 114 is in order to provide the operating voltage/electric current of active member 10 or passive device 20.In addition; internal layer 110 also has a ground plane (ground plane) 116; ground plane 116 is to electrically connect with the active member 10 or the passive device 20 of signals layer 112 by plated-through-hole 104; and ground plane 116 provides the position accurate (being generally 0 volt) of operating voltage, but and the active member 10 of protective circuit or passive device 20 can under normal operating voltage/electric current, operate.Moreover, signals layer 112, usually separate mutually to avoid producing the phenomenon of short circuit (short circuit) with a dielectric layer 118 between bus plane 114 and the ground plane 116, and the material of dielectric layer 118 for example is glass epoxide base resin (FR-4, FR-5), two maleic acid vinegar imines (Bismaleimide-Triazine, BT) or epoxy resin dielectric materials such as (epoxy resin), wherein with glass epoxide base resin (FR-4, FR-5) the most common, its dielectric constant (dielectric constant) defines and dielectric constant is a dielectric constant 1.0 with respect to air between 4.1 ~ 5.3.
When electronic signal is transmitted between internal layer 110, between bus plane 114 and ground plane 116, be subjected to the effect of both voltage differences (V) and converge a certain electric weight (Q), its coincidence formula C=Q/V, wherein C is capacitance (capacity), and capacitance C=Q/V=ε * A/d, wherein ε represents the dielectric constant of dielectric layer 118, and A represents the relative area between bus plane 114 and the ground plane 116, and d represents the relative distance between bus plane 114 and the ground plane 116.When relative area A and relative distance d were constant, capacitance C was along with DIELECTRIC CONSTANT increases and increases.
It should be noted that, now with glass epoxide base resin (FR-4, FR-5) be the printed circuit board (PCB) of dielectric material, under low frequency (below the 10MHz) operation, its DIELECTRIC CONSTANT is about 4.5 ~ 4.7, and the noise that element produced of signals layer 112 can be by means of formed decoupling capacitance (decoupling capacity) between bus plane 114 and the ground plane 116, filter in bypass (bypass) mode, yet under high frequency (more than the 1GHz) operation, traditional electric capacity is because of stray inductance (parasitical inductance) effect of element itself, can't reach the effect of filtered noise, and the DIELECTRIC CONSTANT of glass epoxide base resin also is reduced to about 4.1, make decoupling capacitance value C reduce relatively, so can't be by means of formed decoupling capacitance C between bus plane 114 and the ground plane 116, reach the effect of filtering this high-frequency noise, cause the effect of noise suppressed not good.
Summary of the invention
Purpose of the present invention is exactly that a kind of dielectric structure of noise suppressed is being provided, and effectively improves formed decoupling capacitance between two patterned line layer of circuit board, reaches the purpose of filtering high-frequency noise.
Another purpose of the present invention is to provide a kind of method that improves the dielectric constant of dielectric material.
The dielectric structure of the noise suppressed that the present invention proposes, be applicable to a printed circuit board (PCB), and this printed circuit board (PCB) has at least two patterned line layer, the dielectric structure of this noise suppressed comprises: a dielectric layer, be configured between any two adjacent these patterned line layer, and this dielectric layer has at least one metallic, is doped among this dielectric layer.
A kind of method that improves the dielectric constant of above-mentioned dielectric layer that the present invention proposes may further comprise the steps: 1) dielectric material is provided earlier, its material is selected from one of group that is made up of glass epoxide base resin, two maleic acid vinegar imines and epoxy resin, 2) bombard the surface of a metallic plate with high speed charged particle, in order to hitting these metallics, and make these metallics mix in dielectric material.
The material of above-mentioned dielectric layer for example be glass epoxide base resin (FR-4, FR-5), two maleic acid vinegar imines (Bismaleimide-Triazine, BT) or epoxy resin dielectric materials such as (epoxy resin).In addition, high speed charged particle is formed with direct current slurry (DC plasma) generator, or magnetic control direct current slurry (Magnetron DC plasma) generator forms, also but radiofrequency plasma (RF plasma) generator form.In addition, the material of metallic plate for example is aluminium (Al) or titanium (Ti).
The present invention is because of the dielectric constant of doping metals particulate with the raising dielectric layer, therefore improve formed decoupling capacitance between circuit board two patterned line layer relatively, so that the high-frequency noise that electronic component produced can reach the effect of filtered noise by higher decoupling capacitance.
Description of drawings
Fig. 1 is the generalized section of existing a kind of printed circuit board (PCB).
Fig. 2 is the schematic diagram of dielectric structure of a kind of noise suppressed of a preferred embodiment of the present invention.
Fig. 3 utilizes the mode the splash schematic diagram of particle between dielectric material that mix.
Embodiment
Be illustrated in figure 2 as the schematic diagram of dielectric structure of a kind of noise suppressed of a preferred embodiment of the present invention, be applicable to a printed circuit board (PCB).Wherein, printed circuit board (PCB) 200 has an internal layer 210, and internal layer 210 comprises multi-layered patterned line layer at least, signals layer 212, bus plane 214 and ground plane 216 are arranged in the present embodiment, wherein the outermost layer of internal layer 210 is a signals layer 212, in order to electrically connect a plurality of active members 10 or passive device 20.In addition, internal layer 210 also has a bus plane 214, for example electrically connect by conductive hole 202 and signals layer 212, and bus plane 214 is in order to the operating voltage/electric current of active member 10 or passive device 20 to be provided.In addition, internal layer 210 also has a ground plane 216, for example electrically connects by the active member 10 or the passive device 20 of plated-through-hole 204 with signals layer 212.Moreover, separate mutually to avoid producing the phenomenon of short circuit (short circuit) with a dielectric layer 218 between signals layer 212, bus plane 214 and the ground plane 216.
It should be noted that on the function that suppresses noise, can be by formed decoupling capacitance C between bus plane 214 and the ground plane 216, the noise signal of coming filter element to produce.According to electric capacity computing formula (C=ε * A/d), when the DIELECTRIC CONSTANT of dielectric layer 218 is higher, then capacitance C also can increase relatively.Therefore, the present invention squeezes into metallic 220 in the material that forms dielectric layer 218 by the mode that splashes (sputtering), metallic 220 is doped in the DIELECTRIC CONSTANT that then improves dielectric layer 218 among the dielectric layer 218 relatively, to reach the purpose that suppresses noise.Wherein, the material of dielectric layer 218 for example is dielectric materials such as glass epoxide base resin (FR-4, FR-5), two maleic acid vinegar imines (BT) or epoxy resin, and the metallic 220 that mixes for example is an aluminium.
Be the schematic diagram that utilizes the mode doping particle between dielectric material that splashes as shown in Figure 3.Under preferable situation, the present invention can be by the surface of high speed charged particle 230 bombardments one metallic plate 250, in order to hit a plurality of metallics 220.Wherein, high speed charged particle 230 is for example formed with direct current slurry (DC plasma) generator, the principle of its formation is at two electrode of opposite plate 240a, apply voltage on the 240b, so that battery lead plate 240a surface produces secondary electron (secondary electrons) because of ion bombardment (Ionbombardment), and secondary electron and battery lead plate 240a, gas molecule between the 240b carries out so-called dissociating (dissociation) because of bump, ionization (ionization) and excite reactions such as (excitation), and produce ion, atom, charged particles such as atomic group.And these charged particles promptly can be described as when reaching a certain concentration (or quantity) " electricity slurry (plasma) ".Then, these charged particles 230 bombard the surface of metallic plate 250, and hit the particle 220 on metallic plate 250 surfaces, and these particles 220 are squeezed at last among dielectric material 260, form the doping particle 220 in the above-mentioned dielectric layer 218 after quickening through electric field.
Certainly, the mode that forms high speed charged particle is a lot, except direct current slurry generator, other for example is magnetic control direct current slurry (Magnetron DC plasma) generator or radiofrequency plasma (RF plasma) generator, all can produce required high speed charged particle.In addition, the material of metallic plate 250 for example is aluminium (Al) or other metal material (as titanium), and through bombarding aluminum particulate or other metallic that is produced, to be implanted in the dielectric material 260 in the mode of mixing, and the DIELECTRIC CONSTANT of dielectric material 260 is to improve relatively along with the concentration (or quantity) of metallic 220 doping.Following in high frequency (1GHz) operation is between the DIELECTRIC CONSTANT of dielectric layer 218 should be controlled at 4.5 ~ 4.7 or higher comparatively suitable, to obtain better noise suppression effect.
In sum, the dielectric structure of noise suppressed of the present invention has following advantage:
(1) the present invention utilizes to splash the metallic that metal sheet surface produces and be doped among the dielectric material, and metallic can improve the dielectric constant of dielectric material, and improves decoupling capacitance relatively, to reach the inhibition anti noise.
(2) the present invention utilizes present existing direct current slurry generator to splash metallic plate, and technology maturation and practicality that the electricity slurry generates, therefore can effectively control the concentration (or quantity) that metallic mixes, and cost of manufacture is low, can not increase the cost burden of product.
(3) the present invention can improve formed decoupling capacitance between circuit board two patterned line layer, so the high-frequency noise that element produced of signals layer, can pass through higher decoupling capacitance, reaches the effect of filtered noise.
Claims (10)
1. the dielectric structure of a noise suppressed is applicable to a printed circuit board (PCB), and this printed circuit board (PCB) has at least two patterned line layer, it is characterized in that: the dielectric structure of this noise suppressed comprises:
One dielectric layer is configured between any two adjacent these patterned line layer, and this dielectric layer has at least one metallic, is doped among this dielectric layer.
2. the dielectric structure of noise suppressed as claimed in claim 1, it is characterized in that: the material of described dielectric layer is to be glass epoxide base resin.
3. the dielectric structure of noise suppressed as claimed in claim 1 is characterized in that: the material of described dielectric layer is two maleic acid vinegar imines.
4. the dielectric structure of noise suppressed as claimed in claim 1, it is characterized in that: the material of described dielectric layer is an epoxy resin.
5. the dielectric structure of noise suppressed as claimed in claim 1 is characterized in that: the material of described metallic be aluminium or titanium one of them.
6. dielectric structure is characterized in that comprising:
One dielectric material, its material are selected from one of group that is made up of glass epoxide base resin, two maleic acid vinegar imines and epoxy resin; And
One metallic, it is selected from the group that is made up of aluminium and titanium, is doped in this dielectric material.
7. method that improves the dielectric constant of dielectric material is characterized in that this method may further comprise the steps:
1) provide a dielectric material, its material is selected from one of group that is made up of glass epoxide base resin, two maleic acid vinegar imines and epoxy resin; And
2) bombard the surface of a metallic plate with a high speed charged particle, in order to hitting at least one metallic, and make this metallic be doped in this dielectric material.
8. the method for the dielectric constant of raising dielectric material as claimed in claim 7 is characterized in that: described high speed charged particle is formed with direct current slurry generator.
9. the method for the dielectric constant of raising dielectric material as claimed in claim 7 is characterized in that: described high speed charged particle is formed with magnetic control direct current slurry generator.
10. the method for the dielectric constant of raising dielectric material as claimed in claim 7 is characterized in that: described high speed charged particle is formed with the radiofrequency plasma generator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410015050 CN1642384A (en) | 2004-01-09 | 2004-01-09 | Noise-suppressed dielectric structure and its manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410015050 CN1642384A (en) | 2004-01-09 | 2004-01-09 | Noise-suppressed dielectric structure and its manufacturing method |
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| CN1642384A true CN1642384A (en) | 2005-07-20 |
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| CN 200410015050 Pending CN1642384A (en) | 2004-01-09 | 2004-01-09 | Noise-suppressed dielectric structure and its manufacturing method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101682982B (en) * | 2006-10-10 | 2012-06-06 | 信越聚合物株式会社 | Wiring member and process for producing the same |
| CN102702724A (en) * | 2012-05-23 | 2012-10-03 | 北京信息科技大学 | Multiphase composite decoupling material and preparation method thereof |
| CN109803482A (en) * | 2017-11-17 | 2019-05-24 | 英业达科技有限公司 | Multilayer board and the method for making multilayer board |
-
2004
- 2004-01-09 CN CN 200410015050 patent/CN1642384A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101682982B (en) * | 2006-10-10 | 2012-06-06 | 信越聚合物株式会社 | Wiring member and process for producing the same |
| TWI426830B (en) * | 2006-10-10 | 2014-02-11 | Shinetsu Polymer Co | Noise-suppressing wiring-member and printed wiring board |
| CN102702724A (en) * | 2012-05-23 | 2012-10-03 | 北京信息科技大学 | Multiphase composite decoupling material and preparation method thereof |
| CN102702724B (en) * | 2012-05-23 | 2014-02-26 | 北京信息科技大学 | Multiphase composite decoupling material and preparation method thereof |
| CN109803482A (en) * | 2017-11-17 | 2019-05-24 | 英业达科技有限公司 | Multilayer board and the method for making multilayer board |
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