CN1609752A - Computer host machine integral heat sink conception - Google Patents
Computer host machine integral heat sink conception Download PDFInfo
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- CN1609752A CN1609752A CN 200410064399 CN200410064399A CN1609752A CN 1609752 A CN1609752 A CN 1609752A CN 200410064399 CN200410064399 CN 200410064399 CN 200410064399 A CN200410064399 A CN 200410064399A CN 1609752 A CN1609752 A CN 1609752A
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- heat
- heating radiator
- mainboard
- heat sink
- video card
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Abstract
The integral computer heat sinking scheme is that all the main heat releasing devices in the computer including CPU, video card, mainboard chips, power supply, hard disc, CD drive, etc. are made to share one main heat sink. The present invention has obviously raised heat sinking performance, reduced noise, elimination of dust deposit inside computer and obviously reduced computer size. The present invention features that CPU is set in the back side of the mainboard, and relatively large main heat sink is used to dissipate the heat the main heat releasing devices release.
Description
Affiliated technical field the present invention relates to a kind of integral heat sink conception of main frame, especially with the main heat generating member of main frame: CPU (central processing unit), video card, power supply, chipset and hard disk carry out the scheme of integral heat dissipation, this scheme can significantly improve system heat dispersion, reduce even stop noise and prevent the inner laying dust of main frame.
Background technology is present, BTX (the Balanced Technology Extended: the standard balance expansion technique) that ATX standard that known existing main frame industrial standard had work out in 1996 and present Intel (Intel) company advocate.
When formulating the ATX architecture standard, industry does not give too many attention to the heat dissipation problem of CPU, CPU is positioned in the position near the cabinet backboard, use the fan of rising structure, cause in time to discharge at all, circulate but next turn back in the heating radiator again from the hot-air that cpu heat distributes.We can find that because there is the cumulative effect of hot-air, the air themperature of ATX cabinet inside always exceeds ten than environment temperature and spends.In order in time to distribute owing to CPU (central processing unit), GPU (graphic process unit, be used for video card) etc. performance and improving constantly of frequency and the huge thermal value brought, have to take to strengthen the measure of heat radiator, increase radiator fan quantity, raising rotation speed of the fan, increasing fan power, but these measures often make that sometimes the air-flow in the cabinet is chaotic more, both be unfavorable for heat radiation, brought more, bigger noise again.The ATX standard causes it can't be applicable to more high-power processor (for example Prescott of Intel) without any the structural defect of predetermined circulation of air route.
The BTX standard that Intel releases with respect to the ATX standard definition air channel clearly, though solved heat dissipation problem preferably, but still continued to use the mode that heat radiator adds radiator fan.Because the high-speed rotation of radiator fan flabellum can produce a large amount of static, cause very easily laying dust of gas channel, and laying dust can hinder heat radiation, the accumulation of heat can make the radiator fan flabellum rotate with higher speed again, increases the weight of the laying dust degree.Because radiator fan is the topmost noise source of host computer, this has also brought bigger noise simultaneously.Laying dust has then improved the failure rate of main frame.And, present BTX standard is bigger because of heating radiator, requires DIMM memory bank position away from processor, and AMD advanced person's Athlon 64 bit processors integrated Memory Controller Hub, require DIMM memory bank position to press close to processor, make the BTX standard implementation comparison difficulty of getting up.
Along with the further raising of following processor power, the radiating mode that the BTX standard adopts still can not strengthen heating radiator arbitrarily because of the restriction of installing space, can can't be competent at new more high-power processor.
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Summary of the invention is in order to overcome existing ATX, the BTX standard can not be installed the cpu heat of more volume, processor, video card, chipset, power supply, the heat radiation that heating radiators such as hard disk independently cause mutually is bad, the noise that radiator fan produces, the cooling draught dirt accumulation that cabinet inside causes of flowing through, BTX standard-required DIMM memory bank position is away from the deficiency of processor, the invention provides a kind of host computer integral heat sink conception, this scheme can provide enough big heating radiator for CPU, and DIMM memory bank position can be pressed close to processor arbitrarily, this heating radiator can be video card, chipset, power supply, heat generating components such as hard disk together provide heat radiation, under the enough big situation of this radiator surface area, need not to use radiator fan, can stop fan noise, again because this heating radiator is located at the cabinet outside, cooling draught is without cabinet inside, can significantly reduce the cabinet inside laying dust, reduce failure rate.
The technical solution adopted for the present invention to solve the technical problems is: CPU (central processing unit) and socket thereof are installed on the mainboard another side with respect to parts such as peripherals expansion slot, DIMM memory bank, electric capacity, therefore just there is not too high object to hinder around the CPU, thereby make CPU to dispel the heat with large-scale heating radiator (this paper is referred to as " main heating radiator ", down together); Main heating radiator generally is positioned at the surface of cabinet, and cooling draught directly rejects heat in the external environment condition without cabinet inside; The main heating radiator that can be fit to same specification for mainboard, processor, the chipset of different model, can use between they and the main heating radiator adaptive of heat conduction (" adaptive of heat conduction " as herein described be meant by specific mainboard or video card special, can well contact with main heat radiator and can well contact, be used to conduct the profile of heater on heat, adaptive specific mainboard or the video card and the object of position) with heater members on mainboard or the video card.On this basis, the video card slot can be located at the mainboard edge, the video card heater members directly or indirectly contacts with main heating radiator by adaptive of heat conduction, uses main heating radiator to dispel the heat; Board chip set, power module also can be installed on the same one side of CPU, use main heating radiator to dispel the heat; Power supply, hard disk, CD-ROM drive etc. can utilize Heat Conduction Material that heat is conducted to shell by the heater members that it is inner, and this shell contacts with main heating radiator, uses main heating radiator to dispel the heat.
The invention has the beneficial effects as follows: CPU (central processing unit) heat radiation is good, and the volume of main heating radiator is not subjected to space constraint, and the position of CPU and DIMM memory bank and distance are without limits; Main heating radiator can provide good heat radiation for heat generating components such as CPU, video card, board chip set, motherboard power supply module, power supply, hard disk, CD-ROM drives simultaneously; The inside of mainframe box, power supply is difficult for knot dirt, has significantly reduced failure rate; When main radiator surface area is enough big, need not to use radiator fan, significantly reduce the main frame noise; Help dwindling the main frame volume.
The present invention is further described below in conjunction with drawings and Examples for description of drawings.
Fig. 1 is mounted in euthermic chips such as CPU (processor) on the mainboard and north bridge by adaptive synoptic diagram that contacts with main heating radiator of heat conduction.
Fig. 2 is mounted in the synoptic diagram that the CPU euthermic chips such as (processors) on the mainboard directly contacts with main heating radiator.
Fig. 3 is located at the three-dimensional structure synoptic diagram that the video card on mainboard one side edge uses adaptive of heat conduction to contact with heating radiator.
Fig. 4 is the three-dimensional structure synoptic diagram of first full implementation example of this integral heat sink conception.
Fig. 5 is the front view of second full implementation example of this integral heat sink conception.
Fig. 6 is the three-dimensional structure synoptic diagram of second full implementation example of this integral heat sink conception.
Fig. 7 is the front view of the 3rd full implementation example of this integral heat sink conception.
Fig. 8 is the three-dimensional structure synoptic diagram of the 3rd full implementation example of this integral heat sink conception.
Among the figure: 1. main heating radiator, 2. mainboard, 3.CPU (processor), 4. heat conduction is adaptive, 5. euthermic chip such as north bridge, 6. expansion slot, 7. internal memory and slot thereof, 8. video card, 9. the heat conduction of video card is adaptive, 10. power supply, 11. hard disks, 12. CD-ROM drives, 13. floppy drives.
Embodiment in the embodiment shown in fig. 1, CPU (processor) (3) is installed on the last another side with respect to expansion slot (6) and internal memory and slot (7) thereof of mainboard (2), CPU (3) contacts with main heating radiator (1) by heat conduction adaptive (4), dispel the heat with main heating radiator (1): simultaneously, euthermic chips such as north bridge (5) also can be installed in the same side that mainboard (2) is gone up CPU (3), contact with main heating radiator (1) by heat conduction adaptive (4), dispel the heat with main heating radiator (1).
In embodiment illustrated in fig. 2, CPU (processor) (3) is installed on the last another side with respect to expansion slot (6) and internal memory and slot (7) thereof of mainboard (2), CPU (3) or other euthermic chip etc. directly contact with main heating radiator (1), dispel the heat with main heating radiator (1).
In the embodiment shown in fig. 3, the slot of video card (8) is located at mainboard (2) and goes up edge with respect to the opposite side of other expansion slot (6), make the video card (8) can be with being that the special heat conduction of video card (8) adaptive (9) links to each other with main heating radiator (1), video card (8) also uses main heating radiator (1) to dispel the heat.
In first full implementation example shown in Figure 4, power supply (10), hard disk (11), CD-ROM drive (12), floppy drive (13) be installed on mainboard around, euthermic chips such as CPU, north bridge, video card and power supply (10), hard disk (11), CD-ROM drive (12), floppy drive (13) all dispel the heat by main heating radiator (1).In order to allow power supply (10), hard disk (11), CD-ROM drive (12), floppy drive (13) etc. also can dispel the heat by main heating radiator (1) smoothly, can utilize Heat Conduction Material that heat is conducted to shell by the heater members that it is inner, this shell well contacts with main heating radiator (1) and gets final product.Especially after power supply (10) has used main heating radiator (1) to dispel the heat, no longer need radiator fan, inside also can be designed compactlyer, significantly dwindled the volume of power supply, help dwindling of main frame volume, simultaneously, power supply inside has not had flowing through of air-flow yet, do not have laying dust, significant prolongation the serviceable life of power supply.
In the front view of second full implementation example shown in Figure 5, main heating radiator (1) become " U " type be enclosed in mainboard (2) around; For the height (or thickness) that reduces main frame, video card (8) utilizes the switching groove laterally to be installed in the top of mainboard (2); CPU (3) is connected with main heating radiator (1) by heat conduction adaptive (4) with euthermic chips (5) such as north bridges; Power supply (10), hard disk (11), CD-ROM drive (12) are arranged at the next door of mainboard (2), hard disk (11) is positioned at the below of CD-ROM drive (12), and contact with main heating radiator (1), power supply (10) is positioned at the rear of CD-ROM drive (12) and hard disk (11), and contact with main heating radiator (1), use main heating radiator (1) to dispel the heat jointly.
In the three-dimensional structure synoptic diagram of second full implementation example shown in Figure 6, the video card (8) that laterally is installed in mainboard (2) top uses the heat conduction adaptive (9) of video card to link to each other with main heating radiator (1), uses main heating radiator (1) to dispel the heat; Power supply (10), hard disk (11), CD-ROM drive (12) are arranged at the next door of mainboard (2), hard disk (11) is positioned at the below of CD-ROM drive (12), and contact with main heating radiator (1), power supply (10) is positioned at the rear of CD-ROM drive (12) and hard disk (11), and contact with main heating radiator (1), use main heating radiator (1) to dispel the heat jointly.If the mainboard of this embodiment is the same with Micro BTX standard, is 10.4 * 10.5 square inches, be 26.4 * 26.5cm
2, then volume is about 11.5 liters, less than 12.9 liters of MicroBTX standard.
In the front view of the 3rd full implementation example shown in Figure 7, mainboard (2) has only kept an expansion slot (6), and CPU (3) directly contacts with main heating radiator (1), and euthermic chips such as north bridge (5) are connected with main heating radiator (1) by heat conduction adaptive (4).
In the three-dimensional structure synoptic diagram of the 3rd full implementation example shown in Figure 8, mainboard (2) is the same with the mainboard of Pico BTX standard, has only kept an expansion slot (6); The about 8.5cm of height of main heating radiator (1); CD-ROM drive (12) is slim CD-ROM drive, is positioned at the front upper place of mainboard (2); Hard disk (11) still can adopt common desktop computer hard disk, is positioned at the space between mainboard (2) and the CD-ROM drive (12); Power supply (10) is positioned at the back upper place of mainboard.If the mainboard of this embodiment is the same with Pico BTX standard, is 8.0 * 10.5 square inches, be 20 * 26.5cm
2, then volume is about 5.7 liters, significantly less than 6.9 liters of PicoBTX standard; If remove expansion slot, adopt the notebook hard disk, then volume can further narrow down in 4.5 liters.
Claims (6)
1. the integral heat sink conception of a main frame.Main heat generating components in the computing machine: the same heating radiators of use such as central processing unit, north bridge chips, video card, power supply, hard disk, CD-ROM drive dispel the heat.It is characterized in that: central processing unit is positioned at the back side of mainboard, be with respect to the another side of installed surfaces such as expansion slot on the mainboard, use bigger heating radiator to dispel the heat, become possibility thereby the same heating radiators of use such as north bridge chips, video card, power supply, hard disk, CD-ROM drive are dispelled the heat.
2. the integral heat sink conception of main frame according to claim 1, it is characterized in that: north bridge chips is positioned at the back side of mainboard, promptly on the mainboard with respect to the another side of installed surfaces such as expansion slot, with Heat Conduction Material heat is conducted to heating radiator and dispels the heat.
3. the integral heat sink conception of main frame according to claim 1, it is characterized in that: the video card slot is positioned at the edge of mainboard, and the heat generating components on the video card conducts to heating radiator with Heat Conduction Material with heat and dispels the heat.
4. the integral heat sink conception of main frame according to claim 1, it is characterized in that: the heat generating components in the power supply conducts to heating radiator with Heat Conduction Material with heat and dispels the heat.
5. the integral heat sink conception of main frame according to claim 1, it is characterized in that: the heat generating components in the hard disk conducts to heating radiator with Heat Conduction Material with heat and dispels the heat.
6. the integral heat sink conception of main frame according to claim 1, it is characterized in that: the heat generating components in the CD-ROM drive conducts to heating radiator with Heat Conduction Material with heat and dispels the heat.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410064399 CN1609752A (en) | 2004-08-23 | 2004-08-23 | Computer host machine integral heat sink conception |
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| CN 200410064399 CN1609752A (en) | 2004-08-23 | 2004-08-23 | Computer host machine integral heat sink conception |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102156514A (en) * | 2011-04-21 | 2011-08-17 | 高明成 | Mute cooling device for industrial personal computer |
| CN103744496A (en) * | 2014-01-23 | 2014-04-23 | 华为技术有限公司 | Hard disk component |
| WO2014187299A1 (en) * | 2013-05-21 | 2014-11-27 | 中兴通讯股份有限公司 | Mounting assembly |
| WO2017041672A1 (en) * | 2015-09-12 | 2017-03-16 | Qingyuan Li | Electronic device having quiet cooling |
-
2004
- 2004-08-23 CN CN 200410064399 patent/CN1609752A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102156514A (en) * | 2011-04-21 | 2011-08-17 | 高明成 | Mute cooling device for industrial personal computer |
| WO2014187299A1 (en) * | 2013-05-21 | 2014-11-27 | 中兴通讯股份有限公司 | Mounting assembly |
| CN103744496A (en) * | 2014-01-23 | 2014-04-23 | 华为技术有限公司 | Hard disk component |
| WO2017041672A1 (en) * | 2015-09-12 | 2017-03-16 | Qingyuan Li | Electronic device having quiet cooling |
| GB2542273B (en) * | 2015-09-12 | 2018-02-28 | Li Qingyuan | Silent computers having external heat sinks and portable RAID docks |
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